1-04-2016 Curriculum Vitae

BAHGAT G. SAMMAKIA, PH.D. Binghamton University State University of New YorkResearch Division

PO Box 6000Binghamton, NY13902

Office: 607-777-4818 E-Mail: bahgat@binghamton.edu

________________________________________________________________________

EDUCATION:

University of Pennsylvania, Philadelphia, PA

Department of Mechanical Engineering and Applied Mechanics,

Post-Doctoral Fellow

1981-1982

University at Buffalo, SUNY, Buffalo, NY

Doctor of Philosophy (Ph.D.)

1982

Dissertation: “Transient Natural and Mixed Convection Flows and Transport Adjacent to

an Ice Surface Melting in Saline Water”

University at Buffalo, SUNY, Buffalo, NY

Master of Science (M.S.)

1980

Thesis: “A Study of Transient Natural Convection in Air”

Alexandria University, Alexandria, Egypt

Bachelor of Science (B.S.), Mechanical Engineering

1977

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PROFESSIONAL EXPERIENCE

IBM CORPORATION, Endicott, NY

January 1984-August 1998 Senior Technical Staff Member/Project Manager

Had the responsibility for all research and development for organic packaging in IBM IMD,

Endicott, NY. The organization included six departments, with over 120 scientists, engineers

and technicians and an annual budget totaling over 60 million dollars. The mission of the project

was to research and develop all new organic products (chip carriers, cards and boards, connectors

and new materials) for the IBM Microelectronics division.

ACADEMIC EXPERIENCE

Binghamton University, State University of New York, Binghamton, NY

1998-Present

Present

Vice President for Research

o Responsible for:

Creating a research culture and infrastructure to enable growth of trans-

disciplinary research and scholarly activity areas that are transformative

and of a high and positive impact on society

State and federal government relations

Research advancement

Technology transfer and commercialization

Economic development and entrepreneurship

Distinguished SUNY Professor of Mechanical and Materials Engineering, State

University of New York at Binghamton, 2010

Jointly appointed in the Systems Science and Industrial Engineering Department

Founding Director, Small Scale Systems Integration and Packaging Center (S3IP), a New

York state Center of Excellence (COE)

Founding Director of the NSF IUCRC on Energy Smart Electronic Systems, (ES2) 2011

in collaboration with Professor Kanad Ghose in Computer Science.

Co-Founding Director of the Center for Advanced Microelectronics Manufacturing

(CAMM) 2004 to 2010 in Collaboration with Professor Mark Poliks and Cornell

University.

Fellow of the ASME and the IEEE societies

Fellow of the National Academy of Inventors since 2015

August 2003-July 2004

Interim Vice President for Research, State University of New York at Binghamton

September 1998-August 2003

Professor of Mechanical Engineering, State University of New York at Binghamton

Director of the Integrated Electronics Engineering Center (IEEC), A New York State

Center of Advanced Technology

Board Memberships:

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Member, Board of Directors, The Research Foundation of State University of New York,

2005 to 2013

Founding Member, Board of Directors Southern Tier Opportunities Coalition (STOC),

2003 to 2010.

Member, Board of Directors, Sheltered Workshop Solutions (SWS), 2000 to 2011.

Member, Industrial Advisory Board, Cornell University NSF Center for Materials Research

(CCMR), 2007 to Present.

Member of the SUNY senior research council since 2012.

Chair of the board for the Southern Tier High Technology Incubator (STHTI)

Awards and Honors:

Appointed as a Fellow of the National Academy of Inventors (2016)

Winner of the Interpack Achievement Award (2015) which is bestowed once every two

years at the biannual ASME InterPACK Conference for demonstrated excellence and

international recognition in the area of research and development related to electronic

packaging, as well as service to the technical community at large.

Elevated to Institute of Electrical and Electronics Engineers (IEEE) Fellow in 2013

2012 Significant Contributor Award from Semi-Therm, For contributions furthering the

development and validation of thermal simulation and methodologies, advancing the

thermal analysis and control of electronic equipment and promoting an appreciation and

understanding of the importance of thermal management in electronic systems and

assemblies.

Promoted to Distinguished SUNY Professor in 2011.

Recognized by the ASME for services in advancing the engineering profession by

serving as Program Chair for Interpack 2011.

2010 Chancellor’s Award for Excellence in Scholarship and Creative Activities.

Member of Tau Beta Pi Engineering Honor Society.

2010 ITherm (Intersociety (ASME and IEEE) Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems) Achievement Award, June 2010.

This award is given once every two years to internationally recognized leaders in the area

of thermal management in electronic systems.

Best Paper of the Year Award; M. Rayasam, S. Chaparala, D. Farnam, B. G. Sammakia,

and G. Subbbarayan, “Thermal Solution Maps: A Strategy for Thermal Design of Three-

Dimensional Packages,” Journal of Electronic Packaging, March 2009, Volume 131,

Issue 1, 011015 (9 pages) DOI:10.1115/1.3077131.

FlexTech Alliance 2009 “Technology Leadership in Education” Awarded to Bahgat

Sammakia, James Sturm (Princeton University), Christopher Ober (Cornell University)

and Mark Poliks (Endicott Interconnect Technologies).

Outstanding Paper Award; Kanuparthi, S., Subbarayan, G., Sammakia, B., and

Siegmund, T. “Microstructural Characteristics Influencing the Effective Thermal

Conductivity of Particulate Thermal Interface Materials”, 11th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008),

Orlando, FL, May 28-31, 2008.

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Outstanding Researcher Scholar; awarded by the Research Foundation of State

University of New York, April 14th 2008.

Received the 2007 American Society of Mechanical Engineering Division award for the

Electronics Packaging and Photonics Division (EPPD) for Excellence in the Area of

Thermal Management of Electronic Systems.

“Best Paper Award”, EPPD Student Paper Session; Bhopte S., Sammakia B., and Murray

B., “Mixing Enhancement of Two-Component Microchannel Flow: Geometric and

Pulsed Flow Effects”, ASME IMECE 2007, Seattle, Washington.

Outstanding Lecturer, appointed by the IEEE CPMT Division as an outstanding lecturer,

2008.

Appointed as IEEE CPMT Society Board of Governors, member at large, 2006-07.

Received the ASME-K16 Committee on Heat Transfer of Electronics and the Electronic

and Photonic Packaging Division Clock Award for Outstanding and Continuing

Contributions to the Science and Engineering of Heat Transfer in Electronics, 2004.

State University of New York Partners in Excellence Award, recognized by the

Chancellor for work founding the NY High Technology Commercialization Center in the

area of Small Scale Systems Integration and Packaging, 2004.

State University of New York Chancellor’s Promising Inventor Award for novel

approaches in thermal management-using nano-structured materials and the invention of

thin bilayer coatings for electronics, 2003.

State University of New York Chancellor’s Award for Outstanding Contributions to

Research, 2002.

Motorola award, “Silver Quill Award,” for joint publication of the Mechanical

Engineering Handbook CRCnetBASE, 2001.

Received IBM stock options, 1997 and 1998 for outstanding management.

“IBM Blue Chip Award for Top Performers,” 1997.

Elected as an ASME Fellow, 1997.

Five IBM awards for publications excellence, 1987 to 1992.

Seven IBM awards for inventions filed, 1988 to 1996.

Four IBM awards for invention plateaus reached, 1988 to 1994.

Formal IBM division award for excellence in technical, people and business

management, 1992.

Two IBM informal awards for excellence in technology development, 1996.

Post-Doctoral fellowship, University of Pennsylvania; funded by the Samuel Landis

Gabel Endowment, 1982 to 1983.

An Overview of Professor Sammakia’ s Research Activities:

Establishment of the Energy Efficient Data Centers (NSF funded)

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This NSF IUCRC center is in its 5th year and Binghamton University is the lead institute. Professor

Sammakia is the Founding Director. The focus of the research is on establishing data centers that

are self-sensing and self-regulating and optimized to reduce energy consumption.

http://www.binghamton.edu/es2/

Establishment of the New York State Center of Excellence in Small Scale Systems

Integration and Packaging (S3IP):

Professor Sammakia led a team of faculty and technical staff that worked on establishing

a New York Center for High Technology Commercialization (2004) which was elevated to the

status of New York State’s sixth Center of Excellence (S3IP) in 2007 with Professor Sammakia

as its founding Director. The Center conducts research in electronics systems integration and

packaging and has four major research thrusts: Electronics packaging, flexible Roll to Roll

Electronics, Flexible thin film solar and energy efficient electronic systems. The center also has a

campus wide advanced diagnostics laboratory (ADL) which serves faculty research as well as

research collaborators from industry, other academic institutes and national labs. Professor

Sammakia is the founding director of the Center of Advanced Microelectronics Manufacturing

(CAMM) which was established in 2004 in collaboration with Cornell University and Endicott

Interconnect Technologies. Professor Sammakia founded the NSF IUCRC in Energy Smart

Electronic Systems in 2011, in collaboration with Professor Kanad Ghose from the Computer

Science Department and faculty from the Georgia Institute of Technology, the University of

Texas at Arlington, and Villanova. Professor Sammakia remains the NSF IUCRC PI and Center

Director.

Research Contracts and Grant Awards – over $45M in total sponsored funding for

research activities since August 1998.

Professor Sammakia’s current research covers several broad areas including Energy

optimization in data centers, Electronics Systems Integration and Packaging, flexible electronics,

thermal management of electronic devices and systems, optimization of three dimensional

electronics packaging, micro scale mixing, and biomedical applications incorporating flexible

electronic systems. His primary funding sources have been the National Science Foundation(NSF),

the National Institute of Standards and Technology (NIST) through the Advanced Technology

Program (ATP), the National Aeronautical and Space Administration (NASA), the Army Research

Laboratories (ARL), The Department of Defense (DOD), the Semiconductor Research

Corporation (SRC), The Defense Threat Reduction Agency (DTRA), the office of Naval Research

(ONR),the New York State Energy Research and Development Authority (NYSERDA), the New

York State Foundation for Science Technology and Innovation (NYSTAR), Empire State

Development (ESD), and industry.

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PUBLICATIONS

Refereed Journals

1. Gebhart, B., B. Sammakia. “Transient and Steady State Numerical Solutions in Natural

Convection,” Numerical Heat Transfer, Vol. 1, 1978, pages: 529-542.

2. Gebhart, B., Z. Qureshi, and B. Sammakia, “Measurements and Calculations of Transient

Natural Convection in Air,” International Journal of Heat and Mass Transfer, Vol. 23,

1979, pages: 571-576.

3. Gebhart, B., B. Sammakia, “Transient Natural Convection Adjacent to a Vertical Flat

Surface; The Thermal Capacity Effort,” Numerical Heat Transfer, Vol. 4, 1981, pages:

331-344.

4. Gebhart, B., Z. Qureshi, and B. Sammakia, “Measurements and Calculations of Transient

Natural Convection in Water,” Journal of Heat Transfer Transactions of the ASME, Vol.

104, 1982, pages: 644-648.

5. Carey, V.P., B. Gebhart, and B. Sammakia, “Transient Mixed Convection Adjacent to a

Vertical Flat Surface,” International Journal of Heat and Mass Transfer, Vol. 25.6, 1982,

pages: 834-845.

6. Gebhart, B., T. Audunson, and B. Sammakia, “Transport Near a Horizontal Ice Surface

Melting in Cold Saline Water,” J. Geophysical Research, Vol. 88.C5, 1983, pages: 2935-

2942.

7. Gebhart, B., B. Sammakia, “Transport Near a Vertical Ice Surface Melting in Water of

Various Salinity Levels,” International Journal of Heat and Mass Transfer, Vol. 26.10,

1983, pages: 1439-1452.

8. Gebhart, B., B. Sammakia, “Transport Adjacent to Ice Surfaces Melting in Saline Water:

Visualization Experiments,” Int. Communications Heat Mass Transfer, Vol.11, 1984,

pages: 25-34.

9. Carey, V.P., B. Gebhart and B. Sammakia, “Measurements and Calculations of Transient

Mixed Convection in Air,” International Journal of Heat and Mass Transfer, Vol. 28.10,

1985, pages: 1837-1846.

10. Khalilolahi, A., B. Sammakia, “Unsteady Natural Convection Generated by a Heated

Surface within an Enclosure,” Numerical Heat Transfer, Vol. 9, 1986, pages: 715-730.

11. Khalilolahi, A., B. Sammakia, “Transient Natural Convection near a Uniform Flux

Surface with Appreciable Thermal Capacity,” International Communications in Heat and

Mass Transfer, Vol.15.3, 1988, pages: 303-313.

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12. Homa, T., B. Sammakia, and P. Vadala.,“A Transient Technique to Measure the

Temperature Coefficient of Resistance for Thin Film Resistors,” Journal of Electronic

Packaging, Transactions of the ASME, Vol. 111, (1989), pages: 143-148.

13. Khalilolahi, A., B. Sammakia, “The Thermal Capacity Effect upon Transient Natural

Convection in a Rectangular Cavity,” Journal of Electronic Packaging, Transactions of

the ASME, Vol. 112.4, (1990), pages: 357-366.

14. Carden, T.F., S.D. Reynolds, and B. Sammakia, “Thermal Enhancements for a Thin Film

Chip Carrier,” IEEE Transactions on Components, Hybrids and Manufacturing

Technology, Vol. 15.5, (1992).

15. Ramakrishna, K., G. Subbarayan, and B.G. Sammakia, “Effect of Non-Uniformities and

Defects on PTH Strain during Assembly and Accelerated Thermal Cycling,” ASME

Journal of Electronic Packaging, 1997.

16. Sathe, S., B. Sammakia, “Interaction of the System and Module Level Thermal

Phenomena: A Flip Chip BGA Example,” Electronics Cooling, Vol. 4.2, (1998), pages:

14-22.

17. Questad, D., S.K. Tran, and B. Sammakia, “Adhesion Issues in Flip Chip on Organic

Modules,” IEEE Transactions on Components and Packaging Technology, Vol. 22.4,

(1999), pages: 519-524.

18. Questad, D., S.K. Tran, and B. Sammakia, “Void-Effect Modeling of Flip-Chip

Encapsulation on Ceramic Substrate,” IEEE Transactions on Components and Packaging

Technology, Vol. 22.4 (1999): 484-487.

19. Sathe, S., B. Sammakia, “A Numerical Study of the Thermal Performance of a Tape Ball

Grid Array (TBGA) Package,” Journal of Electronic Packaging, Vol. 122, (2000), pages:

107-114.

20. Sathe, S., B. Sammakia, “A Review of Recent Developments in Some Practical Aspects

of Air-Cooled Electronic Packages,” Journal of Heat Transfer, Transactions of the

ASME, Vol. 120, (1998), pages: 830-839.

21. Constable, J., G. Kendall, C. Sahay, B. Van De Wal, and B. Sammakia, “Acoustic

Emission Analysis for Fatigue Prediction of Lap Solder Joints in Mode Two Shear,”

International Journal of Damage Mechanics, (2001), pages: 256-276.

22. Murray, B., S. Watson, and B. Sammakia, “Computational Parameter Study of Chip

Scale Package Array Cooling,” IEEE Transactions on Components and Packaging

Technology, Vol. 24.2, (2001), pages: 184-191.

23. Garimella, S.V., Joshi, Y.K., Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P.,

Baelmans, M., Lohan, J., Sammakia, B., Andros, F., “Thermal Challenges in next

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generation electronic systems,” IEEE Transactions on Components and Packaging

Technologies, Vol. 25, Issue 4, December 2002.

24. Ramakrishna, K., A.Shah, K. Srihari, and B. Sammakia, “A Numerical Study of the

Thermal Performance of an Impingement Heat Sink-Fin Shape Optimization,” IEEE

Transactions on Components and Packaging Technologies, Vol. 27.4, (2004), pages: 710-

717.

25. Sathe, S., B. Sammakia, “An Analytical Study of the Optimized Performance of an

Impingement Heat Sink,” Journal of Electronic Packaging, Transactions of the ASME,

(2004), pages: 528-534.

26. Chaparala, S., C., G. Griffin, J. Jackson, T. McHugh, J. Pitarresi, B. Roggeman, B.

Sammakia, “Effect of Geometry and Temperature Cycle on the Reliability of WLCSP

Solder Joints,” IEEE Transactions on Components and Packaging Technologies, Vol.

28.8, (2005), pages: 441-448.

27. Ackler, H. D., P. Arunasalam, and B. Sammakia, “Microfabrication of Ultra-High

Density Wafer-Level Thin Film Compliant Interconnects for Thru-Silicon-Via Based

Chip Stacks,” Journal of Vacuum Science and Technology-Part B, Vol. 24.4, (2006).

28. Desai, A., J. Geer and B. Sammakia, “Models of Steady Heat Conduction in Multiple

Cylindrical Domains,” Journal of Electronic Packaging, Vol. 128, (2006), pages: 10-17.

29. Desai, A., J. Geer, W. Jones, S. Mahajan, G. Subbarayan, and B. Sammakia, “A

Numerical Study of Transport in a Thermal Interface Material Enhanced with Carbon

Nanotubes,” Journal of Electronic Packaging, Vol. 128, (2006), pages: 92-97.

30. Tonapi, S., S. Sathe, and K. Srihari, B. Sammakia, “A Numerical Analysis of the

Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array

Packages,” ASME Journal of Electronic Packaging, Vol. 128, (2006), pages: 305-310.

31. Shah, A., K. Ramakrishna, K. Srihari, and B. Sammakia, “Optimization Study for a

Parallel Plate Impingement Heat Sink,” ASME Journal of Electronic Packaging, Vol.

128, (2006), pages: 311-318.

32. Bhopte, S., D. Agonafer, R. Schmidt, and B. Sammakia. “Optimization of Data Center

Room Layout to Minimize Rack Inlet Air Temperature,” ASME Journal of Electronic

Packaging, Vol. 128, (2006), pages: 380-387.

33. Park, SB., H.C. Lee and B. Sammakia, “Predictive Model for Optimized Parameters in

Flip-Chip Packages and Assemblies”, IEEE Transactions on Components and Packaging

Technologies, Vol. 30, No. 2, June 2007, pages: 294-301.

34. Shrivastava, S.K., and B. Sammakia, “Thermal Management of Biomaterials in a

Rectangular Cavity Surrounded by a Phase Change Material”, IEEE Transactions on

Advanced Packaging, Vol. 30, No. 4, November 2007, pages: 741-752 .

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35. Mahajan, S.S., G. Subbarayan, and B. Sammakia, "Estimating Thermal Conductivity of

Amorphous Silica Nanoparticles and Nanowires using Molecular Dynamics

Simulations,” Physical Review E 76, 056701, (2007).

36. Geer, J., A. Desai and B. Sammakia, “Heat Conduction in Multilayered Rectangular

Domains,” ASME Journal of Electronic Packaging, Vol. 129, (2007), pages: 440-451.

37. Kanuparthi, S., Ganesh Subbarayan, B. Sammakia, and Thomas Sigmund, “An Efficient

Network Model for Determining the Effective Thermal Conductivity of Particulate

Interface Materials,” IEEE Transactions on Components and Packaging Technologies,

Vol. 31, No. 3, (2008), pages: 611-621.

38. Garimella, S.V., A.S. Fleischer, J.Y. Murthi, A. Keshavarzi, R. Prasher, C. Patel, S. H.

Bhavnani, R. Venkatasubramanian, R. Mahajan, Y. Joshi, B. Sammakia, B.A. Myers, L.

Chorosinski, M. Baelmans, P. Sathyamurthyand P. E Raad, “Thermal Challenges in Next

Generation Electronic Systems,” IEEE Transactions on Components and Packaging

Technologies, Vol. 31, No.4, December (2008).

39. Bergman, T.L., A. Faghri, and R. Viskanta, “Frontiers in Transport Phenomena Research

and Education: Energy Systems, Biological Systems, Security, Information Technology

and Nanotechnology,” Summary article of NSF sponsored workshop, B. Sammakia

chaired the Information Technology session and co-wrote the summary, International

Journal of Heat and Mass Transfer (IJHMT), Vol. 51, (2008), pages: 4599–4613.

40. Kanuparthi, S., M. Rayasam, G. Subbarayan, B. Sammakia, A. Gowda, S. Tonapi,

“Hierarchical Field Compositions for Simulations of Near-percolation Thermal Transport

in Particulate Materials,” Comput. Methods Appl. Mech. Engrg. Vol. 198, (2009), pages:

657–668. journal homepage: www.elsevier.com/locate/cma

41. Farnam, D.S., Sammakia, B., Ackler, H., & Ghose, K., “Comparative Analysis of

Microchannel Heat Sink Configurations Subject to a Pressure Constraint,” Heat Transfer

Engineering, Vol. 30, No. 1-2, February 2009, pages: 43-53.

42. Rayasam, M., S. Chaparala, D. Farnam, B. Sammakia, and G. Subbbarayan, “Thermal

Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages,” Journal

of Electronic Packaging, March 2009, Vol. 131, Iss. 1, 011015 (9 pages)

DOI:10.1115/1.3077131.

43. Shrivastava, S., M. Iyengar, B. Sammakia, R. Schmidt and J. Van Gilder, “Experimental-

Numerical Comparison for a High Density Data Center: Hot Spot Heat Fluxes in Excess

of 500 W/ft2”, IEEE Transactions on Components and Packaging Technologies, Vol. 32,

No.1, March 2009.

44. Kanuparthi, S., G. Subbarayan, T, Siegmund and B. Sammakia, “The Effect Of

Polydispersivity On The Thermal Conductivity Of Particulate Thermal Interface

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Materials,” IEEE Transactions on Components and Packaging Technologies, Vol. 32,

No.2, June (2009).

45. Wang, L., Jin Luo , Jun Yin, Hao Zhang, Jinhui Wu , Xiajing Shi, Elizabeth Crew , Zhe

Xu, Qiang Rendeng , Susan Lu , Mark Poliks , Bahgat Sammakia and Chuan-Jian

Zhong,“Flexible Chemiresistor Sensors: Thin Film Assemblies of Nanoparticles on a

Polyethylene Terephthalate Substrate,” Article citation: Lingyan Wang, J. Mater. Chem.,

2010, DOI: 10.1039/b920957c, (2009).

46. Davidson, D., B. Sammakia, “Squeezing Flow of a Power Law Fluid Between Grooved

Plates,” Journal of Electronic Packaging, Transactions of the ASME, Vol. 131, Iss. 3,

DOI: 10.1115/1.3144158, March (2009).

47. Zhou, F., B. Murray, and B. Sammakia, “Modeling Heat Transport in Thermal Interface

Materials Enhanced with MEMS Based Microconnects”, IEEE Transactions on

Components and Packaging Technologies, Vol. 33, No. 1, March (2010).

48. Farnam, D., B. Sammakia, and K. Ghose, “Thermal Design Criteria for Extraordinary

Performance of Devices Cooled by Microchannel Heat Sink,” ASME Journal of Thermal

Science and Engineering Applications, Vol.2, Iss.4, (2011).

49. Alzoubi, K., S.Lu, and B.Sammakia, “Experimental and Analytical Studies on the High

Cycle Fatigue Of Thin Film Metal on PET Substrate for Flexible Electronics

Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 1,

No. 1, January (2011).

50. Alzoubi, K., S. Lu, B. Sammakia and M. Poliks, “Factor Effect Study For The High

Cycle Bending Fatigue On PET Substrate For Flexible Displays Applications,” IEEE

Journal of Display Technology, Vol. 7, No. 6, June (2011).

51. Pisipati, S., J. Geer, B. Sammakia, and B. Murray, “A Novel Alternate Approach For

Multiscale Thermal Transport Using Diffusion In The Boltzmann Transport Equation,”

International Journal for Heat and Mass Transfer, IJHMT, Received 7 October 2010;

revised 5 March 2011; accepted 5 March 2011. Available online 18 April (2011).

http://dx.doi.org/10.1016/j.ijheatmasstransfer.2011.03.046

52. Mahajan, S., G. Subbarayan, and B. Sammakia, “Estimating Kapitza Resistance Between

Si-Sio2 Interface Using Molecular Dynamics Simulations,” IEEE Transactions on

Components and Packaging Technologies, Vol. 1, No. 8, August (2011).

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53. Venkatadri, V., B. Sammakia, K. Srihari and D. Santos, “A Review of Recent Advances

in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems,”

Journal of Electronic Packaging, Transactions of the ASME, December (2011), Vol. 133

/ 041011-1.

54. Alzoubi, K., M. Hamasha, S. Lu, and B. Sammakia, “Bending Fatigue Study of Sputtered

ITO on Flexible Substrate,” IEEE Journal of Display Technology, Vol. 7, No. 11,

November (2011).

55. MA Omole, VA Okello, V Lee, L Zhou, OA Sadik, C Umbach, B Sammakia, “Catalytic

Reduction of Hexavalent Chromium Using Flexible Nanostructured Poly (amic acids)”,

ACS Catalysis, Volume 1, pages 139-146, (2011).

56. S Bhopte, B Sammakia, M Iyengar, R Schmidt, “Numerical and Experimental Study of

the Effect of Underfloor Blockages on Data Center Performance”, Journal of Electronic

Packaging, page 133, 011007, (2011).

57. S Pisipati, J Geer, B Sammakia, B. Murray, “A Novel Alternate Approach For Multiscale

Thermal Transport Using Diffusion In The Boltzmann Transport Equation”, International

Journal of Heat and Mass Transfer, (2011).

58. K Alzoubi, S Lu, B Sammakia, and M Poliks, “Factor Effect Study for the High Cyclic

Bending Fatigue of Thin Films on PET Substrate for Flexible Displays Applications”,

Journal of Display Technology, Volume 7 (6), pages 348-355, (2011).

59. H Zhang, MD Poliks, B Sammakia, S Garner, J Miller, and J Lyon, “Micron-Sized

Feature Overlay Alignment on Large Flexible Substrates for Electronic and Display

Systems”, Journal of Display Technology, Volume 7 (6), pages 330-338, (2011).

60. K Alzoubi, MM Hamasha, S Lu, B Sammakia, “Bending Fatigue Study of Sputtered ITO

on Flexible Substrate”, Display Technology, Journal of , Volume 7 (11), pages 593-600,

(2011).

61. V Venkatadri, B Sammakia, K Srihari, D Santos, “A Review of Recent Advances in

Thermal Management in Three Dimensional Chip Stacks in Electronic Systems”,

Journal of Electronic Packaging, Page 133, Volume 041011, (2011).

62. B Dan, JF Geer, BG Sammakia, “Heat Conduction in a Rectangular Tube With Eccentric

Hot Spots”, Journal of Thermal Science and Engineering Applications, Volume 3,

041002, (2011).

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63. M. Ibrahim, S. Bhopte, B. Sammakia, B. Murray, M. Iyengar and R. Schmidt, “Effect of

Transient Boundary Conditions and Detailed Thermal Modeling of Data Center Rooms,”

IEEE Transactions on Components and Packaging Technologies, Volume 2, No. 2,

February (2012).

64. S. Madduri, B.G. Sammakia, W. Infantolino, S.C. Chaparala, LC Hughes, JM Harris,

“Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture

Condensing Environment”, Journal Of Electronic Packaging, page 134 (1), (2012).

65. S. Madduri, W. Infantolino, and B.G. Sammakia, “An Experimental and Computational

Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages”,

Journal Of Electronic Packaging, page 134 (1), (2012).

66. L.Y. Zheng, D.S. Farnam, D. Homentcovschi, B.G. Sammakia, “A Porous Elastic Model

for Bacterial Biofilms: Application To The Simulation Of Deformation Of Bacterial

Biofilms Under Microfluidic Jet Impingement”, Journal Of Biomechanical Engineering,

page 134 (5), 051003, (2012).

67. A. Tambat, H.Y. Lin, G. Subbarayan, D.Y. Jung, and B. G. Sammakia, “Simulations of

Damage, Crack Initiation, and Propagation in Interlayer Dielectric Structures:

Understanding Assembly-Induced Fracture in Dies”, Device and Materials Reliability,

IEEE Transactions on Volume 12 (2), pages 241-254, (2012)

68. K. Alzoubi, M.M. Hamasha, L. Wang, H. Zhang, J. Yin, J. Luo, S. Lu, B. G. Sammakia,

“Stability of Interdigitated Microelectrodes of Flexible Chemiresistor Sensors”, Display

Technology, Journal of , IEEE Transactions Volume 8 (7), pages 377-384, (2012).

69. X. Xu, M. Meyers, B.G. Sammakia, B. Murray and C. Chen, “Performance And

Reliability Analysis Of Hybrid Concentrating Photovoltaic Thermal Collectors With Tree

Shaped Channel Nets Cooling System”, IEEE Transactions on Components and

Packaging Technologies, Volume 3, No. 6, June (2013).

70. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Airflow and temperature

distribution optimization in data centers using artificial neural networks." International

Journal of Heat and Mass Transfer 64 (2013): 80-90

71. Zheng, Leo Y., Robert B. Congdon, Omowunmi A. Sadik, Cláudia NH Marques, David

G. Davies, Bahgat G. Sammakia, Leann M. Lesperance, and James N. Turner.

"Electrochemical Measurements of Biofilm Development Using Polypyrrole Enhanced

Flexible Sensors." Sensors and Actuators B: Chemical (2013).

Bahgat Sammakia Page 13 11/30/2016

72. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "A dynamic compact thermal

model for data center analysis and control using the zonal method and artificial neural

networks." Applied Thermal Engineering 62, no. 1 (2014): 48-57.

73. Pisipati, Subbalakshmi, Cheng Chen, James Geer, Bahgat Sammakia, and Bruce T.

Murray. "Multiscale thermal device modeling using diffusion in the Boltzmann Transport

Equation." International Journal of Heat and Mass Transfer 64 (2013): 286-303.

74. Xu, Xinqiang, Mark M. Meyers, Bahgat G. Sammakia, and Bruce T. Murray. "Thermal

Modeling and Life Prediction of Water-Cooled Hybrid Concentrating

Photovoltaic/Thermal Collectors." Journal of solar energy engineering 135, no. 1 (2013).

75. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Numerical investigation of

inter-zonal boundary conditions for data center thermal analysis." International Journal

of Heat and Mass Transfer 68 (2014): 649-658.

76. Zhou, Siyi, Bahgat G. Sammakia, Bruce White, and Peter Borgesen. "Multiscale

modeling of thermoelectric generators for the optimized conversion

performance." International Journal of Heat and Mass Transfer 62 (2013): 435-444.

77. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "A Compact Thermal Model

for Data Center Analysis using the Zonal Method." Numerical Heat Transfer, Part A:

Applications 64, no. 5 (2013): 361-377.

78. Alzoubi, Khalid, Gihoon Choi, Mohammad M. Hamasha, Atif S. Alkhazali, John

DeFranco, Susan Lu, Bahgat Sammakia, and Charles Westgate. "Comparisons of the

Mechanical Behaviors of Poly (3, 4-ethylenedioxythiophene)(PEDOT) and ITO on

Flexible Substrates." In MRS Proceedings, vol. 1493, pp. mrsf12-1493. Cambridge

University Press, 2013.

79. Batayneh, Wafa, Hala Khalaf, and Bahgat G. Sammakia. "Neural Network Modeling of

Parallel-Plain Fin Heat Sink." International Journal of Applied Science and Technology,

no. 3 (2013).

80. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Numerical investigation of

inter-zonal boundary conditions for data center thermal analysis." International Journal

of Heat and Mass Transfer 68 (2014): 649-658.

81. Congdon, Robert B., Alexander S. Feldberg, Natalie Ben-Yakar, Dennis McGee,

Christopher Ober, Bahgat Sammakia, and Omowunmi A. Sadik. "Early detection of

Candida albicans biofilms at porous electrodes." Analytical biochemistry 433, no. 2

(2013): 192-201.

82. Zheng, Leo Y., Robert B. Congdon, Omowunmi A. Sadik, Cláudia NH Marques, David

G. Davies, Bahgat G. Sammakia, Leann M. Lesperance, and James N. Turner.

"Electrochemical measurements of biofilm development using polypyrrole enhanced

flexible sensors." Sensors and Actuators B: Chemical182 (2013): 725-732.

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83. Gao, Tianyi, James Geer, and Bahgat Sammakia. "Nonuniform temperature boundary

condition effects on data center cross flow heat exchanger dynamic

performance." International Journal of Heat and Mass Transfer 79 (2014): 1048-1058.

84. Chen, Cheng, James Geer, and Bahgat Sammakia. "Sub-continuum thermal transport

modeling using diffusion in the Lattice Boltzmann Transport Equation."International

Journal of Heat and Mass Transfer 79 (2014): 666-675.

85. Gao, Tianyi, Bruce Murray, and Bahgat Sammakia. "Analysis of Transient and

Hysteresis Behavior of Cross-flow Heat Exchangers under Variable Fluid Mass Flow

Rate for Data Center Cooling Applications." Applied Thermal Engineering(2015).

86. Gao, Tianyi, Milnes David, James Geer, Roger Schmidt, and Bahgat Sammakia.

"Experimental and numerical dynamic investigation of an energy efficient liquid cooled

chiller-less data center test facility." Energy and Buildings91 (2015): 83-96.

87. Gao, Tianyi, Bahgat Sammakia, and James Geer. "Dynamic response and control analysis

of cross flow heat exchangers under variable temperature and flow rate

conditions." International Journal of Heat and Mass Transfer 81 (2015): 542-553.

88. Zhou, S., Sammakia, B. G., White, B., Borgesen, P., & Chen, C. (2015). Multiscale modeling of Thermoelectric Generators for conversion performance enhancement. International Journal of Heat and Mass Transfer,81, 639-645.

89. Gao, T., Geer, J., & Sammakia, B. (2015). Development and verification of compact transient heat exchanger models using transient effectiveness methodologies. International Journal of Heat and Mass Transfer, 87, 265-278.

90. Gao, T., Sammakia, B., Samadiani, E., & Schmidt, R. (2015). Steady State and

Transient Experimentally Validated Analysis of Hybrid Data Centers.Journal of Electronic Packaging, 137(2), 021007.

91. Ranade, A. P., Jung, D. Y., Sammakia, B. G., Eilertsen, T., & Davis, T. (2016). Optimization study of Supercapacitor electrode material composition and thickness for enhanced performance of the Supercapacitor. une, 13, 15.

92. Gao, T., Geer, J., & Sammakia, B. (2015). Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations. Journal of Thermal Science and Engineering Applications, 7(4), 041017.

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93. Alkharabsheh, S. A., Sammakia, B. G., & Shrivastava, S. K. (2015). Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment. Journal of Electronic Packaging,137(2), 021010.

94. Alkharabsheh, S., Fernandes, J., Gebrehiwot, B., Agonafer, D., Ghose, K., Ortega, A., ... & Sammakia, B. (2015). A Brief Overview of Recent Developments in Thermal Management in Data Centers. Journal of Electronic Packaging, 137(4), 040801.

95. Alissa, Husam A., Kourosh Nemati, Udaya LN Puvvadi, Bahgat G. Sammakia, Ken Schneebeli, Mark Seymour, and Tom Gregory. "Analysis of airflow imbalances in an open compute high density storage data center."Applied Thermal Engineering 108 (2016): 937-950

96. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Ken Schneebeli, Roger R. Schmidt, and Mark J. Seymour. "Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 1 (2016): 67-78.

97. Upreti, Kritika, Hung-Yun Lin, Ganesh Subbarayan, Dae Young Jung, and Bahgat G.

Sammakia. "An Assessment of Risk of Fracture During Wirebond Over Active Circuits

on ULK Dies." IEEE Transactions on Components, Packaging and Manufacturing

Technology 6, no. 2 (2016): 314-325.

98. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Mark J. Seymour, Russell Tipton, David Mendo, Dustin W. Demetriou, and Ken Schneebeli. "Chip to Chiller Experimental Cooling Failure Analysis of Data Centers: The Interaction Between IT and Facility." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 9 (2016): 1361-1378.

Books

1. Gebhart, B., Y. Jaluria, R. Mahajan and B. Sammakia, Buoyancy Induced Flows and

Transport. Washington, DC: Hemisphere Pub. Corporation, 1988 (Translated to Russian

in 1991.) Print.

2. Joshi, Yogendra, Pramod Kumar, B. Sammakia, and M. Patterson. Energy Efficient

Thermal Management of Data Centers. New York: Springer, 2012.

3. Iyengar, M., Geisler, K.J.L., and Sammakia, B., “Cooling of Microelectronic and

Nanoelectronic Equipment, Advances and Emerging Research”, World Scientific,

WSPCSeries in Advanced Integration and Packaging, Vol. 3, 2014

Book Chapters and edited books

Bahgat Sammakia Page 16 11/30/2016

1. Seraphim, D., R. Lasky, Li, C., “Thermal Enhancement,” Principles of Electronic

Packaging, New York: McGraw-Hill, 1989, (Co-authored chapter on thermal

management.)

2. Sammakia, B., K. Ramakrishna, “Thermal Management in Electronic Packaging and

Systems.” Mechanical Engineering Handbook CRCnetBASE. Boca Raton, FL: CRC

Press, 2001. Frank Kreith (Editor) <http://www.engnetbase.com>.

3. Puttlitz, K. and Paul Totta, eds., “Thermal Management,” Area Array Interconnection

Handbook, Boston: Kluwer Academic Publishers, 2001. <www.wkap.nl> , (Co-

authored chapter on thermal management.)

4. Andros, F.E., B. Sammakia, “Integrated Circuit Packaging,” Encyclopedia of Physical

Science and Technology, 3rd ed. Vol. 7, San Diego, CA: Academic Press, 2001. Print.

5. B Sammakia, S Bhopte, M Ibrahim, “Numerical Modeling of Data Center Clusters”,

Energy Efficient Thermal Management of Data Centers, page 335, (2012)

6. Sammakia, B. (Ed.). (2015). Encyclopedia of Thermal Packaging: Thermal Packaging Tools/Ed.-in-chief Avram Bar-Cohen. Energy Optimization and Thermal Management of Data Centers. World Scientific.

7. Sammakia, B., Joshi, Y., Agonafer, D., Samadiani, E., & Bar-Cohen, A. (2015). Containment. In ENCYCLOPEDIA OF THERMAL PACKAGING: Thermal Packaging Tools (pp. 155-196).

Refereed Conference Proceedings

1. Gebhart, B., B.G. Sammakia, and T. Audunson, eds., “Transport Near a Horizontal Ice

Surface Melting in Cold Saline Water”, International Journal of Heat and Mass

Transfer, 26 (10), pp. 1439-1452. Hamburg, Germany: Federal Republic of Germany,

1983.

2. Sammakia, B.G., “Unsteady Mixed Convection in Air, a Numerical and Experimental

Study,” Proceedings of the ASME Winter Annual Meeting, New Orleans, LA, 1984,

pages: 43-45.

3. Sammakia, B.G., “Modeling of Arctic Sea Ice Formation and Dissipation,” Proceedings

at an ASME Conference, Arctic and Offshore Mechanics Symposium, New Orleans, LA,

1984.

4. Khalilolahi, A., M. H. Hamza, and B.G. Sammakia, eds. ”Transient Natural Convection

Generated by a Hot Vertical Surface within an Enclosure,” Proceedings IASTED

International Conference, Applied identification modeling and simulation, AIMS 84,

ISBN0-88986-070-X, 1984, pages: 141-145.

Bahgat Sammakia Page 17 11/30/2016

5. Biber, C. and B.G. Sammakia, eds. “Transport from Discretely Heated Components in a

Turbulent Channel Flow,” Proceedings at the ASME Winter Annual Meeting; Anaheim,

CA, 86-WA/HT-68, 1986.

6. Homa, T., B. G. Sammakia, and P. Vadala, eds. “A Transient Technique to Measure the

Thermal Coefficient of Resistance for Thin Films,” ASME Winter Annual Meeting;

Boston, MA. 87-WA/EEP-4, 1987.

7. Coleman, M., B. G. Sammakia, and D. Agonafer, “Unsteady Buoyancy Induced Flow in

an Enclosure,” ASME Winter Annual Meeting; Boston, MA, 87-WA/EEP-10, 1987.

8. Khalilolahi, A. and B. G. Sammakia, eds. “Transient Mixed Convection In Air Adjacent

To Discrete Uniform Flux Heat Sources,” Proceedings of the ASME Symposium on

Numerical Simulation of Convection in Electronic Equipment Cooling; HTD-Vol. 121,

San Francisco, CA, 1989.

9. Khalilolahi, A., and B. G. Sammakia, eds. “Transient Convection Adjacent to Discrete

Components in the Presence of a Weak Opposing Pressure Field,” Proceedings of the

ASME Winter Annual Meeting; Dallas, TX, 1990.

10. Subbarayan, G., K. Ramakrishna, B. G. Sammakia and P.C. Chen, eds. “Mechanical

Integrity of VIAS in a Thin-Film Package during Manufacturing, Assembly and Stress

Test,” Proceedings of IEEE Electronic Components and Technology Conference

(ECTC); Orlando, FL, 1993.

11. Subbarayan, G., K. Ramakrishna and B.G. Sammakia, “The Impact of Interfacial

Adhesion on PTH and VIA Reliability,” Application of Fracture Mechanics in Electronic

Packaging and Materials, ASME, 1995; EEP-vol. 11/MD-vol. 64

12. Ramakrishna K., and B.G. Sammakia, “Analysis of Strains in Plated Through Holes

During Current Induced Thermal Cycling of a Printed Wiring Board,” ASME

International Mechanical Engineering Congress and Exposition, San Francisco, CA,

1995; 95-WA/EEP-5.

13. Sathe S., and B.G. Sammakia, “Natural Convection in an Open Ended Horizontally

Heated Cavity: A Numerical Study with Applications to Laptop Computers,” National

Heat Transfer Conference, Vol. 1, HTD-Vol. 303, 1995, pages: 81-93.

14. Sathe, S., B.G. Sammakia, A.C. Wong, and V. H. Mahaney, “A Numerical Study of a

High Performance Air-cooled Impingement Heat Sink,” National Heat Transfer

Conference-Vol. 1, HTD-Vol. 303, 1995, pages: 43-53.

15. Sathe S. and B. G. Sammakia, “A Numerical Study of the Thermal Performance of a

Tape Ball Grid Array (TBGA) package,” National Heat Transfer Conference, Austin,

TX, August 1996, page 83.

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16. Stutzman, R., S. Sathe, and B. G. Sammakia, “Macro and Micro Thermal Model of an

Elevated Temperature Dielectric Breakdown in Printed Circuit Boards,” ASM 22nd

International Symposium for Test and Failure Analysis (ISTFA 96), Los Angeles CA,

1996, pages 313-316.

17. Chen, W.T., D. Questad, D. Read, and B.G. Sammakia, “Opportunities and Needs for

Interfacial Fracture Mechanics in Microelectronic Packaging Industry,” ASME WAM,

1997.

18. Niu, T.M., B.G. Sammakia, and S. Sathe, “Void Modeling in Encapsulated Multilayer

Ceramic and Multilayer Polyimide Ceramic Flip Chip Packages,” Itherm 98, Seattle,

WA, May 1998.

19. Tran, S.K., D. Questad, and B.G. Sammakia, “Adhesion Issues in Flip Chip on Organic

Modules,” Itherm 98 Seattle, WA, May 1998.

20. Sathe, S. and B.G. Sammakia, “Some Thermal Issues that Arise in the Development,

Qualification, and Manufacturing of Electronic Packages,” presentation at the

NSF/ASME Workshop in conjunction with the 1998 ASME International Mechanical

Engineering Congress and Exposition, November 18-19, 1998, pages: 8-11.

21. Sammakia, B.G. and S. Sathe, “Thermal Issues that Arise due to Manufacturing

Processes; Evaluation and Measurement Techniques,” Electronics Manufacturing Issues,

DE-Vol. 104, ASME 1999, November 14-19, 1999, pages: 121-138.

22. Sathe, S. and B.G. Sammakia, “Some Aspects of the Thermal Performance of a Tape Ball

Grid Array (TBGA) Package,” Proceedings of ASME 1998, Manufacturing Science and

Engineering Division, MED-Vol. 8, 1998, pages: 747-756.

23. Watson, S., B. Murray, and B. G. Sammakia, “Computational Parameter Study of Chip

Scale Package Array Cooling,” Proc. 2000 InterSociety Conference on Thermal

Phenomena Itherm 2000, Las Vegas, NV, May 23-26, 2000, pages: 37-43.

24. Tonapi, S., K. Srihari, S. Sathe, and B G. Sammakia, “Parametric Studies of the Thermal

Performance of a Tape Ball Grid Array (TBGA) Package,” Proceedings of the ASME

Manufacturing in Engineering Division - 2000, Orlando, FL, November 5-10, 2000,

MED-Vol. 11, pages: 425-431.

25. Morris, J. and B. G. Sammakia, “Current and Future Research in Electronics Packaging

at Binghamton University,” 2000 Government Microcircuit Applications Conference,

Anaheim, CA, March 20-23, 2000, pages: 396-399.

26. Chouta, P., D. Santos, K. Srihari, and B.G. Sammakia, F. Andros, and M. DiPietro, “A

Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different

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Pad Finishes,” 2001 Proceedings Pan Pacific Microelectronics Symposium, Kauai, HI,

February 13-16, 2001, pages: 11-28.

27. Sathe S. and B. G. Sammakia, “Thermal Model of Buried Resistors and Design

Guidelines for Buried Components,” EEP-Vol. 26-1, Advances in Electronic Packaging –

1999, Volume 1, ASME, 1999.

28. Awasthi, A., S. McKeown, C. Sahay, and B.G. Sammakia, “Selection of Method for

Fatigue Life Prediction Under Random Loading,” IMECE 2001, session EEP-12,

November, 2001, New York, N.Y.

29. Santos, D., K. Srihari, and B. G. Sammakia, “Industry University Research in Electronics

Manufacturing: The Binghamton University Model,” proceedings of the SMTA-Chicago,

October, 2001, pages 672-675.

30. Tonapi, S., S. Sathe, B. G. Sammakia, and K. Srihari, “Parametric Studies of the

Thermal Performance of Back-to-Back Tape Ball Grid Array (TBGA) Packages,” 51st

ECTC, Orlando, FL, May 2001, pages: 738-743.

31. Greenfield, P., J. Andresakis and B.G. Sammakia, “An FEA Study of Image Transfer in

Printed Wiring Boards,” IPC 2002, pages: S03-2-1 – S03-2-8.

32. Greenfield, P., J. Pitarresi, G. Lehmann, D. Skinner, J. Lee, and B. G. Sammakia, “A

Lamination Study of a Composite LCD Flat Panel Display,’ proceedings InterSociety

Conference on Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages:

1001 - 1006.

33. Shah, A., B. G. Sammakia, K. Srihari, and K. Ramakrishna, “A numerical analysis of the

performance of a parallel plate heat sink,” proceedings InterSociety Conference on

Thermal Phenomena (Itherm2002), San Diego CA, May, 2002, pages 710-717.

34. Guttikonda S. and B. G. Sammakia, "Comparative Analysis of two heat spreader designs

for a Wire Bond TBGA Package,” proceedings InterSociety Conference on Thermal

Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 559-571.

35. Watson S. and B. G. Sammakia, “A parametric study of the thermal performance of chip

scale packages with flat plate heat sinks,” proceedings InterSociety Conference on

Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 276-284

36. Chaparala, S., J. Pitarresi, B. G. Sammakia, L. Nguyen, V. Patwardhan, L. Zhang, and N.

Kelkar, “A Parametric Predictive Solder Joint Reliability Model for Wafer Level Chip

Scale Package,” Proceedings ECTC 2002, , May 31, 2002, San Diego, CA, pages: 1323 –

1328.

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37. Srihari K. and B. G. Sammakia, “Industry - University Partnership in Graduate Research

and Education,” Proceedings ECTC 2002. , May 31, 2002, San Diego, CA, pages: 768 –

771.

38. Tonapi, S., R. Fillion, B. G. Sammakia, F.J. Schattenmann, H.S. Cole, and J. D. Evans,

"An Overview of Thermal Management of Next Generation Microelectronic Devices,”

Proceedings of the 13th Advanced Semiconductor Manufacturing Conference 2003.

39. Mahajan, S., G. Subbarayan, B. G. Sammakia, and W. Jones, “Molecular Dynamics

Simulation of Nanotube-Polymer Composites for use as Thermal Interface Material,”

Proceedings of 2003 ASME, International Mechanical Engineering Congress and

Exposition, Washington, D.C., November 15-21, 2003.

40. Sathe, S. and B. G. Sammakia, “An Analytical Study of the Optimized Performance of

An Impingement Heat Sink,” Proceedings of 2003 ASME, International Mechanical

Engineering Congress and Exposition, Washington, DC, November 15-21, 2003.

41. Desai, A., S. Mahajan, G. Subbarayan, W. Jones, J.Geer, and B.G. Sammakia, “An

Analytical Study of Transport in a Thermal Interface Material Enhanced with Carbon

Nanotubes,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June

1-4, 2004, pages: 403-409.

42. Chaparala,S.C., B.D. Roggeman, J.M. Pitarresi, B.G. Sammakia, J. Jackson, G. Griffin,

and T. McHugh, “Effects of Geometry and Temperature Cycle on the Reliability of

WLCSP Solder Joints,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las

Vegas, NV, June 1-4, 2004, pages: 287-295.

43. Cuddalorepatta, G., J.M. Pitarresi, and B.G. Sammakia, “Mechanical Modeling of Tiled

Liquid Crystal on Silicon (LcoS) Microdisplay,” Proceedings of Itherm 2004 (CD), The

Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems, pp. 383-390, Las Vegas, NV, June 1-4, 2004.

44. Agonafer, D., J.Markell, B.G. Sammakia, and G.Lehman, “Numerical Investigation of

Enclosure Effects on Spot Cooling Devices,” Proceedings of Itherm 2004 (CD), The

Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 339-343.

45. Park, S.B., B.G. Sammakia, and K. Raghunathan, “Predictive Model for Optimized

Design Parameters in Flip-Chip Packages,” Proceedings of Itherm 2004 (CD), The Ninth

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems, Las Vegas, NV, June 1-4, 2004, pages: 458-464.

46. Choubey, A., F. Andros, and B.G. Sammakia, “Study of Assembly Processes for Liquid

Crystal on Silicon (LcoS) Microdisplays,” Proceedings of Itherm 2004 (CD), The Ninth

Bahgat Sammakia Page 21 11/30/2016

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems, Las Vegas, NV, June 1-4, 2004, pages: 77-84.

47. Bahadur, R., B.G. Sammakia, and F. Andros, “Thermal Management of a Microdisplay

Engine Assembly,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference

on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV,

June 1-4, 2004, pages: 381-388.

48. Shrivastava, S., B. G. Sammakia, “Thermal Management of Biomaterials in a

Rectangular Cavity Surrounded by a Phase Change Material,” Proceedings of Itherm

2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 108-120.

49. Arunasalam, P., H.D. Ackler, and B.G. Sammakia, “Smart Three Axis Compliant

(STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-

Level Ultra-Thin Die Stacking Technology,” ECTC 2005, Lake Buena Vista, FL,

5/31/2005-6/3/2005.

50. Arunasalam, P., H.D. Ackler, S.Makhar, and B.G. Sammakia, “A Novel MEMS Based

Ultra-High Density Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,”

IMAPS 2005, Philadelphia, PA, September 25-29, 2005.

51. Park, S.B., R. Joshi, and B. G. Sammakia, “Thermomechanical behavior of organic and

ceramic flip chip ball grid array packages under power cycling,” Semi-Therm 2005, San

Jose, CA, March 15-17/2005.

52. Zhang, X., S. Kanuparthi, G. Subbarayan, B. Sammakia, and S. Tonapi, “Hierarchical

Modeling and Trade-off Studies in Design of Thermal Interface Materials,” Proceedings

ASME InterPACK '05, IPACK2005-73259, San Francisco, CA, July 17-22, 2005.

53. Bhopte, S., D. Agonafer, R.Schmidt, and B. G., Sammakia, “Optimization of Data Center

Room Layout to Minimize Rack Inlet Air Temperature,” Proceedings ASME InterPACK

'05, IPACK2005-73027, San Francisco, CA, July 17-22, 2005.

54. Shrivastava, S., B.G., Sammakia, R.Schmidt, and M. Iyengar, “Comparative Analysis of

Different Data Center Airflow Management Configurations,” Proceedings ASME

InterPACK '05, IPACK2005-73235, San Francisco, CA, July 17-22, 2005.

55. Shrivastava, S., B. G., Sammakia, “Transient Mixed-Convection with Applications to

Cooling of Biomaterials,” Proceedings ASME InterPACK '05, IPACK2005-73235, San

Francisco, CA, July 17-22, 2005.

56. Iyengar, M., R. Schmidt, A. Sharma, G. McVicker, S. Shrivastava, S. S. Yasuo

Amemiya, H. Dang, T. Chainer, and B.G. Sammakia, “Thermal Characterization of Non-

raised Floor Air Cooled Data Centers Using Numerical Modeling,” Proceedings ASME

InterPACK '05, IPACK2005-73387, San Francisco, CA, July 17-22, 2005.

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57. Chaparala, S.C. F.E. Andros, W. Infantolino, B.G. Sammakia, S.C. Guttikonda, J. Zhao,

and D. Sengupta, “Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP),”

Proceedings ASME InterPACK '05, IPACK2005-73085, San Francisco, CA, July 17-22,

2005.

58. Xiao, Q., W.D. Armstrong, J.M. Pitarresi, S.C. Chaparala, B.D. Roggeman, B. G.

Sammakia, and L. Nguyen, “Constitutive Relationship Development, Modeling and

Measurement of Heat Stressing of Micro-SMD Assembly with Sn3.9Ag0.6Cu SAC

Alloy,” Proceedings ASME InterPACK '05, IPACK2005-73239, San Francisco, CA, July

17-22, 2005.

59. Shrivastava S. and B.G. Sammakia, “Inclined Cavity Effects with Applications to

Cooling of Biomaterials,” Proceedings of IMECE2005, Paper IMECE2005-81633,

Orlando, FL, November 5-11, 2005.

60. Shrivastava, S., B.G. Sammakia, M. Iyengar, and R. Schmidt, “Significance Levels of

Factors for Different Airflow Management Configurations of Data Centers,” Proceedings

of IMECE2005, Paper IMECE2005-81607, Orlando, FL, November 5-11, 2005.

61. Desai, A., J. Geer, and B.G. Sammakia, “Analytical Model of Heat Conduction in a

Tubular Geometry with Application to a Nano-Structured Thermal Interface,”

Proceedings of IMECE2005, Paper IMECE2005-79732, Orlando, FL, November 5-11,

2005.

62. Desai, A., J. Geer, and B.G. Sammakia, “Heat Conduction in Three Dimensional Stacked

Packages,” Proceedings of IMECE2005, Paper IMECE2005-79771, Orlando, FL,

November 5-11, 2005.

63. Kanuparthi, S., X. Zhang, G. Subbarayan, B. G. Sammakia, A. Gowda, and S. Tonapi.,

“Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects

of Random Distribution from Interfacial Resistance,” 10th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San

Diego, CA, May 30-June 2, 2006.

64. Mahajan, S., G. Subbarayan, and B.G. Sammakia, “Thermal Conductivity of Amorphous

Silica Using Non-Equilibrium Molecular Dynamics Simulations,” 10th Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm 2006), San Diego, CA, May 30-June2, 2006.

65. Kanuparthi, S., X. Zhang, G. Subbarayan, B.G. Sammakia, T. Siegmund, A. Gowda, and

S. Tonapi, “Random Network Percolation Models for Particulate Thermal Interface

Materials,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena

in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.

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66. Shrivastava, S.K., M. Iyengar, B.G. Sammakia, R. Schmidt, and J.W. VanGilder,

“Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Fluxes

in Excess of 500 W/FT2,” 10th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA,

May 30-June2, 2006.

67. Shrivastava, S.K., J.W. VanGilder, and B.G. Sammakia, “A Statistical Prediction of Cold

Aisle End Airflow Boundary Conditions,” 10th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA,

May 30-June2, 2006.

68. Bhopte, S., B.G. Sammakia, R.Schmidt, M.K. Iyengar, and D. Agonafer, “Effect of

Under Floor Blockages on Data Center Performance,” 10th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San

Diego, CA, May 30-June2, 2006.

69. Desai, A., J. Geer, and B. G. Sammakia, “A Statistical Analysis of Thermal Interface

Materials Enhanced by Vertically Aligned Carbon Nanotubes,” 10th Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm 2006), San Diego, CA, May 30-June2, 2006.

70. Arunasalam, P., H.D. Ackler, and B.G. Sammakia, “Design, Fabrication and

Implementation of Smart Three Axis Compliant Interconnects for Ultra-Thin Chip

Stacking Technology,” 56th Electronic Components and Technology Conference

Proceedings, San Diego, CA, May 30-June 2, 2006, pages: 1147-1153.

71. Desai, A., J. Geer and B.G. Sammakia, “A Technical Review of Studies on Temperature

Distribution in Three Dimensional Stacked Packages”, Thermes 2007: Thermal

Challenges in Next Generation Electronic Systems, Suresh V. Garimella and Amy, S.

Fleischer (editors), 2007, Millpress, Rotterdam, ISBN 978-90-5966-051-9.

72. Desai, A., J. Geer and B.G. Sammakia, “Experimental Measurements of Temperature

Distribution in Three Dimensional Stacked Package,” Proceedings of IPACK 2007,

IPACK2007-33045, Vancouver, BC, Canada, July 8-12, 2007.

73. Shrivastava, S.K., J.W. Van Gilder, and B.G. Sammakia, “Data Center Cooling

Prediction using Artificial Neural Network,” Proceedings of IPACK 2007, IPACK2007-

33432, Vancouver, BC, Canada, July 8-12, 2007.

74. Bhopte, S., B.G. Sammakia, M.K. Iyengar, and R. Schmidt, “Experimental Investigation

of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell,”

Proceedings of IPACK 2007, IPACK2007-33540, Vancouver, BC, Canada, July 8-12,

2007.

75. Bhopte, S., B.G. Sammakia, and B. Murray, “Mixing Enhancement In Two Component

Microchannel Flow-Geometric And Pulsed Flow Effects,” Proceedings of

Bahgat Sammakia Page 24 11/30/2016

IMECE2007, ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, USA, November 11-15, 2007.

76. Machiraju H., W. Infantolino, B. G. Sammakia, and M. Deeds, “Thermal Analysis Of

MEMS Actuator Performance”, Proceedings of IMECE2007, ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, USA, November 11-15, 2007.

77. Farnam, D., B.G. Sammakia, H. Ackler, and K. Ghose, (2007), “Comparative Analysis of

Microchannel Cooling Schemes Subject to a Pressure Constraint,” Proceedings of the 5th

International Conference on Nanochannels, Microchannels and Minichannels,

ICNMM2007.

78. Bhopte, S., B. G., Sammakia, and B. Murray, “Geometric Modifications to Simple

Microchannel Design for Enhanced Mixing,” 11th Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL,

May 28-31, 2008.

79. Farnam, D., B. G. Sammakia, and K. Ghose, “Development of a Complete Transient

Microchannel Heat Sink Model,” 11th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May

28-31, 2008.

80. Chaparala, S., F. Andros, W. Infantolino, and B.G. Sammakia, “A New Technique for

Calibrating Piezoresistive Stress Sensor Chips,” 11th Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl,

May 28-31, 2008.

81. Farnam D. and B.G. Sammakia, “Assessment of the Performance of Dielectric Fluids in

Microchannel Heat Sinks,” 11th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May

28-31, 2008.

82. Kanuparthi, S., G. Subbarayan, B.G. Sammakia, and T. Siegmund, “Microstructural

Characteristics Influencing the Effective Thermal Conductivity of Particulate Thermal

Interface Materials,” 11th Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008.

83. Bhopte, S., B.G. Sammakia, and V. Calmidi, “A Study of the Thermal Characterization

of a High Performance Flip Chip Package,” 11th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May

28-31, 2008.

84. Shrivastava, S., J. W. VanGilder, and B.G. Sammakia, “Optimization of Cluster Cooling

Performance for Data Centers,” 11th Intersociety Conference on Thermal and

Bahgat Sammakia Page 25 11/30/2016

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May

28-31, 2008.

85. Gondipalli, S., S. Bhopte, B.G. Sammakia, M.Iyengar, and R.Schmidt, “Effects of

Isolating Cold Aisles on Rack Inlet Temperature,” 11th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008),

Orlando, Fl, May 28-31, 2008.

86. Mahajan, S., G. Subbarayan, and B.G. Sammakia, “Estimating Kapitza Resistance

Between Si-SiO2 Interrface Using Molecular Dynamics Simulations,” 11th Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm 2008), Orlando, Fl, May 28-31, 2008.

87. Zhou, F., B. Murray, and B.G. Sammakia, “Modeling Heat Transport in Thermal

Interface Materials Enhanced with MEMS Based Microconnects,” 11th Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm 2008), Orlando, FL, May 28-31, 2008.

88. Madduri, S. W. Infantolino, and B.G. Sammakia, “A Review of Non-Hermetic

Optoelectronic Packaging”, 11th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May

28-31, 2008.

89. Poranki, S., N. Nagarur, and B.G. Sammakia, “Emerging Technology Evaluation – A

Case of Flexible Electronics,” Center for Advanced Microelectronics Manufacturing

(CAMM), State University of New York at Binghamton, 2009 Flexible Electronics and

Displays Conference, Phoenix, Arizona, February 2009.

90. Zhang, H., M.D. Poliks, and B.G. Sammakia, “Precision overlay registration of micron

sized features on unsupported flexible films,” Center for Advanced Microelectronics

Manufacturing (CAMM), 2009 Flexible Electronics and Displays Conference, Phoenix,

Arizona, February 2009.

91. Gondipalli, S., B.G. Sammakia, and G.R.,Ahmed, “Improving the Performance of an

Impingement Heat Sink by Modifying the Fin Shapes,” Proceedings of the ASME 2009

InterPACK Conference, IPACK2009-89076, San Francisco, California, USA, July 19-23,

2009.

92. Karajgikar, S., D. Agonafer, K. Ghose, B.G. Sammakia, C. Amon, and G. R. Ahmed

“Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both

Thermal and Device Clock Performance,” Proceedings of the ASME 2009 InterPACK

Conference, IPACK2009-89188, San Francisco, CA, USA, July 19-23, 2009.

93. Gondipalli, S., B. G. Sammakia, S.Bhopte, R. Schmidt, M.K. Iyengar, and B.Murray

“Optimization of Cold Aisle Isolation Designs for a Data Center with Roofs and Doors

using Slits,”, Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-

Bahgat Sammakia Page 26 11/30/2016

89203, San Francisco, CA, USA, July 19-23, 2009.

94. Alzoubi, K., S. Lu, B.G. Sammakia, and M.Poliks, “Experimental Study of the High

Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics

Applications,” Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-

89247, San Francisco, California, USA, July 19-23, 2009.

95. Madduri, S., B. G. Sammakia, W. Infantolino, S.C. Chaparala, L.C. Hughes, and J. M.

Harris, “Performance Study of a GaAs based Laser Diode Chip in a Condensing

Environment”, Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-

89115, San Francisco, California, USA, July 19-23, 2009.

96. Dan, B., S. Kanuparthi, G. Subbarayan, and B.G. Sammakia, “An Improved Network

Model for Determining the Effective Thermal Conductivity of Particulate Thermal

Interface Materials,” Proceedings of the ASME 2009 InterPACK Conference.

IPACK2009-89116, San Francisco, CA, USA, July 19-23, 2009.

97. Ta-Hsuan L., F. Andros, S. Lu, and B.G. Sammakia, “Process and Reliability of Copper

Column Flexible Flip Chip Connection (F2C2),” Electronics Packaging Technology

Conference, 2008, EPTC 2008, 10th, Publication Date: 9-12 Dec. 2008, page(s): 1316-

1320, Singapore, ISBN: 978-1-4244-2117-6, INSPEC Accession Number: 10445057,

Digital Object Identifier: 10.1109/EPTC.2008.4763613, Current Version Published:

2009-01-27.

98. Kalkundri, K. F. Andros, and B.G. Sammakia, “An Experimental Setup and Procedure

for Thermal Resistance Measurements of a Thermal Interface Material,” 2010 TMS (The

Minerals, Metals and Minerals Society) Annual Meeting, Electronic, Magnetic and

Photonic Materials Division, Seattle WA, February, 2010.

99. An overview of thermal management of electronic systems research at the Small Scale

Systems Integration and Packaging Center, (S3IP), 12th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las

Vegas Nevada, June 2-5, 2010. (Invited paper for Achievement award).

100. Chauhan, A., B.G. Sammakia, K. Ghose, G.R.Ahmed, and D. Agonafer , “Hot

Spot Mitigation using Single-Phase Microchannel cooling for Microprocessors,” 12th

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems (ITherm 2010), Las Vegas Nevada, June 2-5 2010.

101. Chakravorty, S., B.G. Sammakia, K. Srihari, and G. R.Ahmed, “Impingement

Heat Sink Optimization for Microprocessors with Significant Hot Spots,” 12th

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010.

Bahgat Sammakia Page 27 11/30/2016

102. Gondipalli, S., S. Bhopte, B.G. Sammakia and V. Calmidi, “Numerical and

Experimental study of the Effect of Thermocouple Wire Attachment on Thermal

Characterization of a High Performance Flipchip Package,” 12th Intersociety Conference

on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010),

Las Vegas Nevada, June 2-5, 2010.

103. Ibrahim, M., S. Gondipalli, S. Bhopte, and B.G. Sammakia, “Numerical Modeling

Approach to Dynamic Data Center Cooling,” 12th Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas

Nevada, June 2-5, 2010.

104. Gondipalli, S., M. Ibrahim, S. Bhopte, B. G., Sammakia, B. Murray, K. Ghose,

M.K. Iyengar and R. Schmidt, “Numerical Modeling of Data Center with Transient

Boundary Conditions 12th Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010.

105. Bhopte, S, B.G. Sammakia, and B.Murray, “Numerical Study of a Novel Passive

Micromixer Design,” 12th Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010.

106. B. Dan, B.G. Sammakia, and G. Subbarayan, “On Refining the Parameters of a

Random Network Model for Determining the Effective Thermal Conductivity of

Particulate Thermal Interface Materials,” 12th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas

Nevada, June 2-5, 2010.

107. Bhopte, S., S. Desu, and B.G. Sammakia, “An Integrated Nano-Structured Heat

Spreader for High Heat Flux Electronic Systems”, Proceedings of International Heat

Transfer Conference, IHTC 14, August 8-13, 2010, Washington, DC, USA.

108. Alzoubi, K., A.Qasaimeh, S. Lu, B.G. Sammakia, and M. Poliks, “Resistance

Change Modeling of Sputtered Thin Films on Flexible Substrates under Fatigue Test”,

Institute of Industrial Engineers Annual Conference, May 2010,

http://www.iienet2.org/annual2/details.aspx?id=10042 .

109. Zhou, S., and B.G., Sammakia, “Modeling Of Two-Phase Micro-Channel Flow

For Thermal Management Of Electronic Systems”, Proceedings of the ASME 2010

International Mechanical Engineering Congress & Exposition, IMECE2010, November

12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-37219.

110. Dan, B., J.F. Geer, and B.G. Sammakia, “Heat Conduction In A Rectangular Tube

With Eccentric Hot Spots”, Proceedings of the ASME 2010 International Mechanical

Engineering Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver,

Bahgat Sammakia Page 28 11/30/2016

British Columbia, Canada, IMECE2010-37554.

111. Raghu, A., S. Karajgikar, D.Agonafer, B.G. Sammakia and G.R. Ahmed,

“Thermal-Aware Power Migration In Many-Core Processors”, Proceedings of the ASME

2010 International Mechanical Engineering Congress & Exposition, IMECE2010,

November 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-40232.

112. Ibrahim, M., S.Bhopte, B.G. Sammakia, B.Murray, M. Iyengar and R. Schmidt,

“Effect Of Thermal Characteristics Of Electronic Enclosures On Dynamic Data Center

Performance”, Proceedings of the ASME 2010 International Mechanical Engineering

Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver, British

Columbia, Canada, IMECE2010-40914.

113. Xu, X., B.G. Sammakia, D.Y. Jung, and T. Eilertsen, “Multiphysics Approach To

Modeling Supercapacitors For Improving Performance”, Proceedings of the ASME 2011

Pacific Rim Technical Conference & Exposition on Packaging and Integration of

Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon,

USA. IPACK2011-52081.

114. Chakravorty, S., B.G. Sammakia, and V. Calmidi, “Thermal Characterization Of

Non-Isolated Dc To Dc Convertor”, Proceedings of the ASME 2011 Pacific Rim

Technical Conference & Exposition on Packaging and Integration of Electronic and

Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-

52121

115. Chauhan, A., B.G. Sammakia, K. Ghose, G.R. Ahmed, and D. Agonafer,

“Single-Phase Microchannel Cooling For Stacked Single Core Chip And Dram”,

Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on

Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8,

2011, Portland, Oregon, USA. IPACK2011-52137

116. Chauhan, C., B.G. Sammakia, F. Afram, K. Ghose, G.R.. Ahmed, and D.

Agonafer, “Single-Phase Liquid Cooling Of A Quad-Core Processor”, Proceedings of the

ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and

Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland,

Oregon, USA. IPACK2011-52139

117. Ibrahim, M., F. Afram, B.G. Sammakia, K. Ghose, B. Murray, M. Iyengar, and R.

Schmidt, “Characterization Of A Server Thermal Mass Using Experimental

Measurements”, Proceedings of the ASME 2011 Pacific Rim Technical Conference &

Exposition on Packaging and Integration of Electronic and Photonic Systems

InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52165

118. Ibrahim, M., F. Afram, K. Ghose, B.G. Sammakia, S. Bhopte, B. Murray, M.

Iyengar, and R. Schmidt, “Numerical Study On The Reduction Of Recirculation Using

Bahgat Sammakia Page 29 11/30/2016

Sealed Cold Aisles And Its Effects On The Efficiency Of The Cooling Infrastructure”,

Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on

Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8,

2011, Portland, Oregon, USA. IPACK2011-52166

119. Song, Z., B. Murray, and B.G. Sammakia, “Multivariate Prediction Of Airflow

And Temperature Distributions Using Artificial Neural Networks”, Proceedings of the

ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and

Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland,

Oregon, USA. IPACK2011-52167

120. Tambat, A., H.Y. Lin, I. Claydon, G. Subbarayan, D.Y. Jung and B.G. Sammakia,

“Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of

Dielectric Material Selection”, Proceedings of the ASME 2011 Pacific Rim Technical

Conference & Exposition on Packaging and Integration of Electronic and Photonic

Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52237

121. Tambat, A., H.Y. Lin, I. Claydon, G. Subbarayan, D.Y. Jung and B.G. Sammakia,

“Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric

Stacks”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition

on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July

6-8, 2011, Portland, Oregon, USA. IPACK2011-52258

122. Chen, C., E. Samadiani and B.G. Sammakia “Compact Modeling Of Fractal Tree-

Shaped Microchannel Liquid Cooling System” Proceedings of the ASME 2011

International Mechanical Engineering Congress & Exposition, IMECE2011, November

11-17, 2011, Denver, Colorado, US [IMECE2011‑65220]

123. Chauhan, A., B.G. Sammakia, F. Afram, K. Ghose, G. Refai-Ahmed and D.

Agonafer “Liquid Cooling Of A Stacked Quad-Core Processor And Dram Using

Laminar Flow In Microchannel” Proceedings of the ASME 2011 International

Mechanical Engineering Congress & Exposition, IMECE2011, November 11-17, 2011,

Denver, Colorado, US [IMECE2011-65866]

124. Xu, X., B. G. Sammakia, B. Murray, D.Y Jung, and T.Eilerston, “ Thermal

Modeling And Heat Management Of Supercapacitor Modules By High Velocity

Impinging Fan Flow” Proceedings of the ASME 2011 International Mechanical

Engineering Congress & Exposition, IMECE2011, November 11-17, 2011, Denver,

Colorado, US [IMECE2011-65676]

125. Alzoubi, K., M.M. Hamasha, M. Schadt, S Lu, B.G. Sammakia, and M. Poliks,

“Effect Of Lamination On The Bending Fatigue Life Of Copper Coated PET Substrate”

Proceedings of SPIE 7956, 79560X, 2011.

126. Ibrahim, M., S. Shrivastava, B.G. Sammakia, and K. Ghose, “Thermal Mass

Characterization Of A Server At Different Fan Speeds”, Thermal and Thermomechanical

Bahgat Sammakia Page 30 11/30/2016

Phenomena in Electronic Systems (ITherm), 2012.

127. Song, Z., B. Murray, B.G. Sammakia, and S. Lu, “Multi-Objective Optimization

Of

Temperature Distributions Using Artificial Neural Networks”, Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.

128. Chauhan, A., B.G. Sammakia, F. Afram, K. Ghose, G. Refai-Ahmed, and D.

Agonafer, “Analysing Real Time Power Of The Microprocessor To Estimate Thermal

Time Constant Of The Hotspot”, Thermal and Thermomechanical Phenomena in

Electronic Systems (ITherm), 2012.

129. Dan, B., B.G. Sammakia, S. Kanuparthi, G. Subbarayan, and S. Mallampati, “The

Study Of The Polydispersivity Effect On The Thermal Conductivity Of Particulate

Thermal Interface Materials To Refine The Random Network Model”, Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.

130. Xu, X., M.M. Meyers, B.G. Sammakia, and B. Murray, “Thermal Modeling Of

Hybrid Concentrating PV/T Collectors With Tree-Shaped Channel Networks Cooling

System”,

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.

131. Zhou, S., B.G. Sammakia, B. White, and P. Borgesen, “A Multiscale Modeling Of

Thermoelectric Generators For Conversion Efficiency Optimization”, Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.

132. Sami Alkharabsheh and B. Sammakia, "Utilizing practical fan curves in CFD

modeling of a data center" Semiconductor, Thermal Measurement and Management

Symposium (SEMI-THERM), 2013 29th Annual IEEE

133. Zhihang Song, Bruce T. Murray and Bahgat Sammakia, “IMPROVED ZONAL

MODEL FOR DATA CENTER ANALYSIS”, Proceedings of the ASME 2013

International Technical Conference and Exhibition on Packaging and Integration of

Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame,

CA, USA IPACK2013-73048

134. Zhihang Song, Bruce T. Murray and Bahgat Sammakia, “PREDICTION OF HOT

AISLE PARTITION AIRFLOW BOUNDARY CONDITIONS”, Proceedings of the

ASME 2013 International Technical Conference and Exhibition on Packaging and

Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013,

Burlingame, CA, USA IPACK2013-73049

135. Tianyi Gao, Emad Samadiani, Bahgat Sammakia, and Roger Schmidt

“COMPARATIVE THERMAL AND ENERGY ANALYSIS OF A HYBRID COOLING

Bahgat Sammakia Page 31 11/30/2016

DATA CENTER WITH REAR DOOR HEAT EXCHANGERS”, Proceedings of the

ASME 2013 International Technical Conference and Exhibition on Packaging and

Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013,

Burlingame, CA, USA IPACK2013-73101

136. Cheng Chen, Emad Samadiani, Bahgat Sammakia, “COMPARATIVE

NUMERICAL ANALYSIS OF ANGLED BRANCHING MICROCHANNEL HEAT

SINK “

Proceedings of the ASME 2013 International Technical Conference and Exhibition on

Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013

July 16-18, 2013, Burlingame, CA, USA IPACK2013-73141

137. Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young

Jung and Bahgat Sammakia, , “SIMULATIONS OF DEFORMATION AND STRESS

DURING COPPER WIREBOND ON ULK CHIPS “ Proceedings of the ASME 2013

International Technical Conference and Exhibition on Packaging and Integration of

Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame,

CA, USA IPACK2013-73178

138. Tianyi Gao, Emad Samadiani, Roger Schmidt and Bahgat Sammakia, “Dynamic

analysis of hybrid cooling data centers subject to the failure of CRAC units “

proceedings of the ASME 2013 International Technical Conference and Exhibition on

Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013

July 16-18, 2013, Burlingame, CA, USA IPACK2013-73196

139. Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael

Ellsworth, Milnes David, and Roger Schmidt and “A numerical steady and dynamic

study in a data center using calibrated fan curves for CRACS and servers “ proceedings

of the ASME 2013 International Technical Conference and Exhibition on Packaging and

Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013,

Burlingame, CA, USA IPACK2013-73217

140. Sai Sudharsanan Paranjothy; Singh, Yuvraj; Tippman, Allen; Hung-Yun Lin;

Subbarayan, Ganesh; Dae Young Jung; Sammakia, Bahgat, "Characterization of cu free

air ball constitutive behavior using microscale compression test," Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety

Conference on , vol., no., pp.365,368, 27-30 May 2014

URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892303&isnumber=68

92251

141. Alkharabsheh, Sami; Sammakia, Bahgat; Murray, Bruce; Shrivastava, Saurabh; Schmidt, Roger, "Experimental characterization of pressure drop in a server rack," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.547,556, 27-30 May 2014 doi:

Bahgat Sammakia Page 32 11/30/2016

10.1109/ITHERM.2014.6892329 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892329&isnumber=6892251

142. Upreti, Kritika; Hung-Yun Lin; Subbarayan, Ganesh; Jung, Dae Young; Sammakia, Bahgat, "Simulations of damage and fracture in ULK under pad structures during Cu wirebond process," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.609,615, 27-30 May 2014 doi: 10.1109/ITHERM.2014.6892337 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892337&isnumber=6892251

143. Gao, Tianyi; Sammakia, Bahgat; Geer, James; Ortega, Alfonso; Schmidt, Roger, "Transient effectiveness characteristics of cross flow heat exchangers in data center cooling systems," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.688,697, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892348&isnumber=6892251

144. Nemati, Kourosh; Murray, Bruce T.; Sammakia, Bahgat, "Experimental characterization and modeling of a water-cooled server cabinet," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.723,728, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892352&isnumber=6892251

145. Song, Zhihang; Murray, Bruce T.; Sammakia, Bahgat, "Parametric analysis for thermal characterization of leakage flow in data centers," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.778,785, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892360&isnumber=6892251

146. Alkharabsheh, Sami; Sammakia, Bahgat; Shrivastava, Saurabh; Schmidt, Roger, "Dynamic models for server rack and CRAH in a room level CFD model of a data center," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety

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Conference on , vol., no., pp.1338,1345, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892435&isnumber=6892251

147. Gao, T., Geer, J., Tipton, R., Murray, B., Sammakia, B. G., Ortega, A., & Schmidt, R. (2015, July). Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A012-V001T09A012). American Society of Mechanical Engineers.

148. Poliks, B., Chen, C., White, B. E., & Sammakia, B. (2015, May). Molecular

Dynamics simulations of thermal conductivity in composites consisting of aluminum oxide nanoparticles surrounded by polyethylene oxide. InElectronic Components and Technology Conference (ECTC), 2015 IEEE 65th (pp. 1920-1925). IEEE.

149. Gao, T., David, M., Geer, J., Schmidt, R., & Sammakia, B. (2015, March). A dynamic model of failure scenarios of the dry cooler in a liquid cooled chiller-less data center. In Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 113-119). IEEE.

150. Kansara, N., Katti, R., Nemati, K., Bowling, A. P., & Sammakia, B. (2015, July). Neural Network Modeling in Model-Based Control of a Data Center. InASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A034-V001T09A034). American Society of Mechanical Engineers.

151. Alissa, H. A., Nemati, K., Sammakia, B., Seymour, M., Schneebeli, K., & Schmidt, R. (2015, July). Experimental and numerical characterization of a raised floor data center using rapid operational flow curves model. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A016-V001T09A016). American Society of Mechanical Engineers.

152. Gao, T., Sammakia, B. G., Geer, J., Murray, B., Tipton, R., & Schmidt, R. (2015,

July). Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels(pp. V001T09A011-V001T09A011). American Society of Mechanical Engineers.

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153. Alissa, H. A., Nemati, K., Sammakia, B., Ortega, A., King, D., Seymour, M., &

Tipton, R. (2015, July). Steady state and transient comparison of perimeter and row-based cooling employing controlled cooling curves. InASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A017-V001T09A017). American Society of Mechanical Engineers.

154. Gao, T., del Valle, M., Ortega, A., & Sammakia, B. G. (2015, July). Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems. InASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A043-V001T09A043). American Society of Mechanical Engineers.

155. Nemati, K., Gao, T., Murray, B. T., & Sammakia, B. (2015, March). Experimental characterization of the rear door fans and heat exchanger of a fully-enclosed, hybrid-cooled server cabinet. In Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 155-162). IEEE.

156. Alissa, H. A., Nemati, K., Sammakia, B., Ghose, K., Seymour, M., & Schmidt, R. (2015, March). Innovative approaches of experimentally guided CFD modeling for data centers. In Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 176-184). IEEE.

157. Nemati, K., Alissa, H. A., Murray, B. T., Sammakia, B., & Seymour, M. (2015, July). Experimentally validated numerical model of a fully-enclosed hybrid cooled server cabinet. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A041-V001T09A041). American Society of Mechanical Engineers.

158. Chauhan, A., Sammakia, B., & Ghose, K. (2015, March). Transient power analysis to estimate the thermal time lag of a microprocessor hot spot. InThermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 75-81). IEEE.

159. Paranjothy, S. S., Subbarayan, G., Jung, D. Y., & Sammakia, B. G. (2015, July). An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V002T01A009-V002T01A009).

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American Society of Mechanical Engineers.

160. Nemati, Kourosh, Husam A. Alissa, Tom Wu, Mark J. Seymour, Bruce T. Murray, and Bahgat Sammakia. "Cabinet level prediction of IT deployment in operational condition changes." In 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), pp. 185-191. IEEE, 2016.

161. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Tom Wu, and Mark J. Seymour. "Management and predictions of operational changes and growth in mission critical facilities." In 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), pp. 178-184. IEEE, 2016.

162. Alissa, Husam A., Kourosh Nemati, Udaya LN Puvvadi, Bahgat G. Sammakia, Kanad Ghose, Mark J. Seymour, Russell Tipton, and Ken Schneebeli. "Empirical analysis of blower cooling failure in containment: Effects on IT performance." In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 1426-1434. IEEE, 2016.

163. Nemati, Kourosh, Husam A. Alissa, Udaya Puvvadi, Bruce T. Murray, Bahgat Sammakia, and Kanad Ghose. "Experimental characterization of a Rear Door Heat exchanger with localized containment." In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 710-719. IEEE, 2016.

164. Nemati, Kourosh, Husam A. Alissa, Bruce T. Murray, and Bahgat Sammakia. "Steady-state and transient comparison of cold and hot aisle containment and chimney." In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 1435-1443. IEEE, 2016.

165. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Mark J. Seymour, Russell Tipton, Tom Wu, and Ken Schneebeli. "On reliability and uptime of IT in contained solution." In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 1415-1425. IEEE, 2016.

166. Song, Zhihang. "Parametric investigation for performance of the active tile in data centers." In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 426-432. IEEE, 2016.

Trade Journals:

1. “Flip-Chip Technology in Organic Chip Carriers,” Bahgat Sammakia, Frank Andros and

Ronald Gedney, Circuits Assembly, February 1999, pages: 31-40.

2. “Small (Scale) Research, Big Impact,” Electronic News online, January 21, 2002.

<http://www.e-insite.net/electronicnews/index.asp?layout=articlePrint&articleID=CA191936 >

Patents:

Bahgat Sammakia Page 36 11/30/2016

1. Funari, J., M. Green, S. Reynolds, and B. Sammakia. Electronic Package With Improved

Heat Sink. July 1989, US Patent #4,849,856.

2. Anschel, M., and B. Sammakia. Electronic Package With Heat Spreader Member. April

1990. US Patent #4,914,551.

3. Baker, D., J. Funari, W. Otto, B. Sammakia, and R. Stutzman. Electronic Assembly With

Enhanced Heat Sinking. March 1991. US Patent #5,003,429.

4. Ameen, J., J. Funari, B. Sammakia, D. Sissenstein, Jr., and S. Smey. Epoxy Composition

and Use Thereof. July 1991, US Patent #5,028,984.

5. Funari, J., T. Godown, S. Reynolds, and B. Sammakia. Pluggable Electronic Circuit

Package Assembly With Snap Together Heat Sink Housing. April 1992. US Patent

#5,109,318.

6. Anschel, M., A. Ingraham, C. Lamb, M. Lowell, V. Markovich, W. Mayr, R. Murphy, M.

Pierson, T. Powers, T. Reny, S. Reynolds, B. Sammakia, and W. Storr, Method And

Apparatus For Testing Of Integrated Circuit Chips. May 1995, US Patent. #5,420,520.

7. Mok, L., S. Purushothaman., B.Sammakia., J. Wilczynski., and T. Wu. Electronic

Package Having Active Means To Maintain Its Operating Temperature Constant.

February 1996, US Patent #5,491,610.

8. Kosteva, S. and B.Sammakia., Assembly Mounting Techniques For Heat Sinks In

Electronic Packaging. February 1999, US Patent #5,870,285.

9. Sammakia, B. and S. Sathe., Electronic Packages and Method to Enhance the Passive

Thermal Management of Electronic Packages. June 1999, US Patent #5,912,800.

10. Sammakia, B., and S. Sathe., Electronic Packages and a Method to Improve Thermal

Performance of Electronic Packages. October 1999, US Patent #5,966,290.

11. Sammakia, B. and S. Sathe. Electronic Packages and a Method to Improve Thermal

Performance of Electronic Packages. May 2000, US Patent #6,058,015.

12. Sammakia, B., and S.Sathe. Method for using Pulsating Flow to Improve Thermal

Transport in Systems. April 2001, US Patent #6,219,234.

13. Cho, J., S. Oliver, W. Jones, and B. Sammakia, Surface Coating for Electronic Systems,

October 2007, US Patent #7,282,254,B1.

14. Sammakia, B., W. Jones, and G. Subbarayan, Nano-Structure Enhancements for

Anisotropic Conductive Adhesive And Thermal Interposers, January 2010, US Patent

#7,645,512.

Bahgat Sammakia Page 37 11/30/2016

15. Sammakia, B., H. Wang, Y. Liu, and K. Yang, Nanomaterials Construction of Thermal

Interface Materials, March 2012, US Patent #8,129,001.

16. Sammakia, B., J. Cho, W. Jones, and S. Oliver, Method of Manufacturing Surface

Coatings for Electronic Systems, April 2012, US Patent #8,158, 201.

17. Sammakia, B., W. Jones, and G. Subbarayan, Nano-Structure Enhancements for

Anisotropic Conductive Adhesive and Thermal Interposers, May 2012, US Patent

#8,173,260.

18. Sammakia, B., W. Jones, and G. Subbarayan, Nano-Structure Enhancements for

Anisotropic Conductive Adhesive and Thermal Interposers, August 27, 2013, US Patent

# 8,518,304

19. Sammakia, B., Method and Pattern of Dispensing Thermal Interface Materials, July 2013,

US Patent #8,481,103.

20. Cho, J., S. Oliver, W. Jones, and B. Sammakia, Surface Coating for Electronic Systems,

April 1, 2014, US Patent # 8,685,529.

21. Cho; Junghyun, Sammakia; Bahgat, Poliks; Mark D., Magnuson; Roy; Biplab Kumar,

Embedded thin films, November 11 2014, US Patent # 8,882,983

22. Wang; Hao, Sammakia; Bahgat, Liu; Yayong, Yang; Kaikun, Composite thermal

interface material system and method using nano-scale components, April 29 2015, US

Patent # 9,017,808

IBM Published Invention Disclosures:

1. “A transient test of the temperature coefficient of resistance for CERMET resistors,”

EN885-0182, 1988.

2. “Substrate temperature measurement using integral surface resistors,” EN885-0158,

1988.

3. “Flexible heat sink,” EN887-0171, 1988.

4. “Thermally enhanced surface mount modular tape automated bonding package,” EN887-

0255, 1989

5. “Lead planarity compensator for inner lead bonders,” EN887-0551, 1990.

6. “Alignment technique by Cu etching for solder attaching chips to TAB,” EN887-0502,

1991.

7. “Improved high density area array contact design,” EN893-0269, 1994.

Bahgat Sammakia Page 38 11/30/2016

8. “Impingement heat sink,” AT893-1081, 1994.

9. “Densely populated, vertically stacked multi chip module,” EN893-0062, 1995.

10. “High conductivity fibrous heat sink,” AT894-0320, 1995.

Graduated Advisees:

PhD:

1. “Thermal Management of Small Scale Electronic Systems,” Anand Desai, PhD

Dissertation, Mechanical Engineering, 2006.

2. “Die stress analysis in plastic encapsulated electronic packages- an experimental and

numerical approach” Satish Chaparala, PhD Dissertation, Mechanical Engineering, 2006.

3. “Cooling analysis of data centers: CFD modeling and real time calculators”, Saurabh K.

Shrivastava, PhD Dissertation, Mechanical Engineering, 2008.

4. Assembly process development, reliability and numerical assessment of copper column

flexible flip chip technology”, TA-Hsuan Lin, PhD in Systems Science and Industrial

Engineering, 2008. (Co advisor with Professor Susan Lu (SSIE Department))

5. “Study of Transport Processes from Macroscale to Microscale”, Siddharth Bhopte, PhD

Mechanical Engineering, August 2009.

6. “Applications of Microfluidics : Electronics Cooling and Prevention of Infection”, Dylan

Farnam, PhD Dissertation Mechanical Engineering, May 2010

7. “Research Into the Process, Materials and Tool Interaction For Large Area Flexible

Electronics With Micron Sized Features”, Hao Zhang, PhD Dissertation, Mechanical

Engineering, May 2010.

8. “Experimental and Analytical Studies of the High Cyclic Bending Fatigue of Thin Films

on Flexible Substrates foe Flexible Electronics Applications”, Khalid Alzoubi, PhD in

Systems Science and Industrial Engineering, December 2010. (Co advisor with Professor

Susan Lu (SSIE Department)).

9. “A Systems Based Approach to Reliability Assessment of Lead Free Soldered Electronic

Packages Under Thermal Cycling Loading”, Emad Shehadeh Al-Momani, PhD in Systems

Science and Industrial Engineering, December 2010. (Co advisor with Professor

Mohammad Khasawneh (SSIE Department)).

10. “A study of Selected Failure Mechanisms in a Non-Hermetic Optoelectronic Module”,

Sushma Madduri, PhD Dissertation, Mechanical Engineering, 2011.

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11. “Dynamic Thermal Management Of Data Centers”, Mahmoud Ibrahim, PhD Dissertation,

Mechanical Engineering, 2012.

12. Analytical and experimental studies to determine the effective thermal conductivity of

particulate thermal interface materials. Dan, Bo, PhD Mechanical Engineering, STATE

UNIVERSITY OF NEW YORK AT BINGHAMTON, 2012.

13. “ Multi scale thermal transport in electronics”. Lakshmi Pisipati, PhD Mechanical

Engineering, STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2013.

14. Xu, Xinqiang. "An analytical and numerical study of emerging energy-storage/energy-

conversion devices to improve their overall performance." PhD diss., STATE

UNIVERSITY OF NEW YORK AT BINGHAMTON, 2013.

15. "Study of the growth conditions of carbon nanomaterials and their application to energy

storage devices." Gao, Yang. PhD diss., STATE UNIVERSITY OF NEW YORK AT

BINGHAMTON, 2013.

16. "Numerical modeling on biofilm deformation and removal under jet impingement and

electrochemical measurements monitoring biofilm development using flexible sensors."

Zheng, Leo Young. PhD diss., STATE UNIVERSITY OF NEW YORK AT

BINGHAMTON, 2013.

17. “Multiscale modeling of electronics cooling and energy conversion devices“, Siyi Zhou,

PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2014.

18. "Static and dynamic thermal management of high performance microprocessors."

Chauhan, Anjali. PhD diss., STATE UNIVERSITY OF NEW YORK AT

BINGHAMTON, 2014.

19. "Numerical investigation on the thermal issues of micro-scale electronic devices and

optimization of heat dissipating solutions." Chen, Cheng. PhD diss., STATE

UNIVERSITY OF NEW YORK AT BINGHAMTON, 2015.

20. EXPERIMENTAL AND ANALYTICAL STUDIES OF DATA CENTER THERMAL

MANAGEMENT UNDER DYNAMIC CONDITIONS, Sami Alkharabsheh, PhD diss.,

STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2015.

Master’s (MS)

1. “Computational Parameter Study of Chip Scale Package Array Cooling,” Sean Watson,

MS, Mechanical Engineering, 2000.

Bahgat Sammakia Page 40 11/30/2016

2. “Numerical Analysis Of A Tape Ball Grid Array (Tbga) Package,” Satish Gutikonda,

MS, Mechanical Engineering, 2001.

3. “Selection of Fatigue Life Prediction under Random Loading,” Amit Awasthi, MS,

Mechanical Engineering, 2001.

4. “Towards The Optimization of Air Cooled Heat Sinks For Microprocessors,” Amit Shah,

MS, Industrial Engineering, 2002.

5. “Modeling and Reliability Analysis Of Wafer-Level Chip Scale Packaging,” Satish

Chaparala, MS, Mechanical Engineering, 2002.

6. “Study of Assembly Processes For Liquid Crystal On Silicon (LCoS) Microdisplays,”

Anupam Choubey, MS, Mechanical Engineering, 2003.

7. “Selection Of Method For Fatigue Life Prediction Under Random Loading,” Amit

Awasthi, MS, Mechanical Engineering, 2003.

8. “Thin Film Measurement and Outgassing Study of Adhesives used in Optical MEMS

Devices,” Vijay Sundermurthy, MS, Mechanical Engineering, 2003.

9. “Numerical Modeling of Underfill Flow Process,” Yang Jiang, MS, Mechanical

Engineering, 2003.

10. “A Study of Nanostructure Enhanced Thermal Interface Material,” Anand H. Desai, MS,

Mechanical Engineering, 2003.

11. “Mechanical Modeling of Liquid Crystal on Silicon (LCoS) Microdisplay,” Gayatri

Cuddalorepatta, MS, Mechanical Engineering, 2003.

12. “Thermal Management Of Biomaterials In a Rectangular Cavity Surrounded By A Phase

Change Material,” Saurabh Shrivastava, MS, Mechanical Engineering, 2004.

13. “Experimental Measurement of Bond Line Thermal Resistance for a Commercial

Thermal Interface Material,” Suresh Vaddigiri, MS, Mechanical Engineering, 2004

14. “Thermomechanical Issues of A Ball Light Collimator In Liquid Crystal Displays,” Satej

Bidwe, MS, Mechanical Engineering, 2005.

15. “A Study Of Nanostructure Enhanced Thermal Interface Material,” Anand Desai, MS,

Mechanical Engineering, 2006.

16. “Thermal Analysis of Mems Actuator Performance”, Harita Machiraju, MS, Mechanical

Engineering, 2006.

Bahgat Sammakia Page 41 11/30/2016

17. “Development and Verification of An Apparatus For Thermal Resistance And Thermal

Conductivity Measurements,” Kaustubh Kalkundri, MS, Mechanical Engineering, 2006.

18. “Comparative Analysis of Microchannel Heat Sink Configurations Subject To A Pressure

Constraint,” Dylan Farnam, MS, Mechanical Engineering, 2007.

19. “Design and Modeling of High-Density Film Based Microinterconnects,” Fan Zhou, MS,

Mechanical Engineering, 2008.

20. “Mitigation of Hot Spots In Microprocessors By Application Of Microchannel Heat

Sinks And Microprocessor Floor Planning”, Anjali Chauhan MS, Mechanical

Engineering, 2009.

21. “Board Level Energy Comparison and Interconnect Reliability Modeling Under Drop

Impact,” Akash Agrawal, MS, Mechanical Engineering, 2009.

22. “Improving The Thermal Performance Of An Impingement Heat Sink By Modifying The

Fin Shapes”, Sravan Kumar Gondipalli, MS, Systems Science and Industrial Engineering,

December 2010.

23. “Numerical Modeling Of Data Center Clusters To Optimize Thermal Management”,

Srujan Kumar Gondipalli, MS, Systems Science and Industrial Engineering, December

2010.

24. “Analytical Study Of Web Inspection System Experimental Variables Using Reflective

Substrate”, Bhawana Bhopte, MS, Systems Science and Industrial Engineering,

December 2010.

25. “Optimization Study of Supercapacitor Electrode Material And Thickness For Its

Enhanced Performance”, Ajinkya P. Ranade, MS, Mechanical Engineering, 2011.

26. “Interfacial Adhesion Measurements of Low-K and Ultra-Low K Dielectric Thin Films”,

Ian Claydon, MS, Mechanical Engineering, 2011.

27. “Impingement Heat Sink Optimization And Thermal Characterization Of A Power

Module Using Commercially Available Cfd Code”, Shiladitya Chakravorty, MS,

Industrial and Systems Science Engineering, 2011.

28. “A Representative Finite Element Model For Determining The Effective Thermal

Conductivity Of Particulate Thermal Interface Materials”, Sandeep Mallampati, MS,

Mechanical Engineering, 2011.

29. Performance and Assembly Of Silver Nanoparticle Based Thermal Interface Materials

For Electronic Systems”, Evan Chenelly, MS, Mechanical Engineering, 2012.

Bahgat Sammakia Page 42 11/30/2016

TEACHING/CIRRICULUM DEVELOPMENT:

“Fundamentals of Electronics Packaging”” Watson 582, was developed in 1999. The

course was offered again in 2000. Student registration in the course increased from 36 in

1999 to 52 in 2000. The student breakdown was 47 graduates and 5 undergraduates.

Fourteen of the students were on Enginet, and several of them were at different industrial

settings around the country. The course was presented by six faculty members from the

Watson School, Chemistry and Physics. This course continues into 2005.

Organized and managed the senior design class for the department of mechanical

engineering. Twelve projects from industry were split amongst the students in typical

teams of 3-5 students. Many of the projects were electronics-packaging related and two

of them were in the area of biomedical devices.

PROFESSIONAL COURSES:

“Electrical and Thermal Co-Design of Microprocessors; Towards an Optimized Design”,

Co- taught this 4 hour professional class with Professor Kanad Ghose, Prof Dereje

Agonafer and Dr. Gamal Refai-Ahmed, 12th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada,

June 2-5 2010.

“Identifying the Challenges in the Next Generation of Microprocessors-Parts I and II,

Gamal, Refai-Ahmed, Dereje Agonafer and Bahgat Sammakia, held at Interpack 2009,

San Francisco, CA, July 2009.

“Thermal Design of Electronic Equipment: From Portables to Mainframes,” B.

Sammakia, Y. Joshi, S. Sathe and D. Agonafer, taught at: Semi-Therm Conference,

San Jose CA, February 1995

Itherm Conference Seattle, WA, June 1998, 2000, 02, 06, 08

InterPack Conference 1997, 99, 01,03, 07

Current students advised:

PhD:

1. Ian Claydon PhD student ME graduation expected 2015

2. Tianyi Gao PhD student ME graduation expected 2015

3. Husam A. Alissa PhD student ME graduation expected 2016

4. Bharath Ramakrishnan PhD student ME graduation expected 2017

5. Steve Gonya PhD student ME (Part time student, LM Owego)

Post-Doctoral Fellows:

Bahgat Sammakia Page 43 11/30/2016

Drew Davidson. Mechanical Engineering, 2008-2010

Siddharth Bhopte Mechanical Engineering, 2009-2010

Hao Zhang, 2009-2010

Sami Alkharabsheh 2015-current

Visiting Research Professors:

Emad Samadiani, 2009-2011

Thesis Committees Served:

1. “Computational Parameter Study of Chip Scale Package Array Cooling,” Masters Thesis,

Mechanical Engineering Dept., S.P. Watson, 2000.

2. “A Systems Based Predictive Approach For Optimizing The Lead Free Flip Chip

Assembly Process,” PhD, Industrial Engineering, Sandeep Tonapi, 2000.

3. “A Technique for Modeling the Warpage of an Area Array Component,” Masters Thesis,

Mechanical Engineering, R.H. Fenton, 2000.

4. “Thermal Fatigue Life Prediction of Ceramic Ball Grid Array Assemblies,” Masters

Thesis, Mechanical Engineering, M. Nagarajan, 2000

5. “Identification of Error Sources in Mechanical Measurements of Electronic Packages

using Moiré Interferometry,” Masters Thesis, Mechanical Engineering, J.R. Rayner,

2000.

6. “Modeling and Reliability Analysis of Chip Scale Packages,” Masters Thesis,

Mechanical Engineering, S. Sethuraman, 2000.

7. “Optical Measurement of Electronic Packages: Improvements to Existing Techniques,”

MS, Mechanical Engineering, M. Seus, 2000.

8. “Electrical Characteristics of an ACF Board,” MS, Electrical Engineering, J. Weidler,

2000.

9. “Kinetics, Mechanism and Detection of the Reactive Intermediates of Dimethylamine

Borane in Electroless Gold Baths,” Ph.D. Dissertation, Chemistry, A. Sargent, 2000.

10. “Reliability Improvement of Area Array Solder Joints: Changing Attachment Pad

Geometry,” PhD, Mechanical Engineering, A. Primavera, 2000.

11. “Computational Parameter Study of Chip Scale Package Array Cooling,” MS,

Mechanical Engineering, S.P. Watson, 2000.

Bahgat Sammakia Page 44 11/30/2016

12. “Simulation of Slip Defect Generation on Gallium Arsenide Wafers during a Molecular

Beam Epitaxy Process using Finite Element Method,” MS, Industrial Engineering,

Vainateya, 2000.

13. “Thermal Performance of Liquid Solder Joint between Metal Faces,” MS, Mechanical

Engineering, D.A. Davidson, 2001.

14. “Thermal Analysis of a Commercially Available Underfill and Several Sn-based Solder

Intermetallics,” BS Research Thesis, Mechanical Engineering, Susan Pitely, 2001.

15. “Characterization of ACF Used as A Flex to Card Interconnect,” Ananth Prabhakumar,

MS, Electrical Engineering, 2001.

16. “Reliability testing of electrically conductive adhesives,” Santosh Anil Kudtarki, MS,

Electrical Engineering, December, 2001.

17. “Thermal Mechanical Testing of NiTi Memory Alloy,” Thirumalesh Bannuru, MS,

Mechanical Engineering, December, 2001.

18. “Yield Modeling and Optimization for an EMS Provider using a Hybrid System of

Neural Networks and Genetic Algorithms,” Swaminathan Vaithianathasamy, MS

Industrial Engineering, 2002.

19. “Assembly of Copper Column Interconnect Flip Chip Technology,” Sihong Ma, MS,

Industrial Engineering, April 2002.

20. “Flip Chip Assembly in Air from Manufacturing and Reliability Perspectives,” Ji Hyon

Mun, PhD, Industrial Engineering, April 2003.

21. “Experimental Investigation of Enclosure Geometry on Cooling Performance of an

Embedded Fin Heat Sink,“ Jason Markell, MS Mechanical Engineering, 3-2003.

22. “Numerical Modeling of Underfill Flow Process,” Yang Jiang, MS, Mechanical

Engineering, February 2003.

23. “Assembly, Reliability, and Rework of 0.4 mm Pitch Wafer Level Chip Scale Packages

(WLCSPs),” PhD, Systems Science, Muffadal Mukadam, July 2004.

24. “A Systems Approach to the Reduction of Thermal Resistance in Microelectronics

Packaging,” PhD, Systems Science, Arun Gowda, July 2004.

25. “Underfill Process Development for Lead Free Flip Chip Assembly,” Raghunandan

Chaware, PhD, Systems Science, August 2004.

26. “Eliminating Package Resonance Over Wide Frequency Band,” Vijay Madhukar Bapu,

MS, August 2004.

Bahgat Sammakia Page 45 11/30/2016

27. “Microscopic and Mesoscopic Characteristics of Granular Metal Films,” Fan Wu, PhD,

September 2004.

28. “Heat Conduction in Composite Solids using Finite Element Analysis of Unit Cells,”

Mukesh Kumar Selvaraj, MS, September 2004.

29. “Impact of Power Cycling on Organic and Ceramic - FC BGA,” Izhar Z. Ahmed, MS,

Mechanical Engineering, September 2004.

30. “System in Package: A System Level Investigation for Package Reliability,” Shafi

Saiyed, PhD, SSIE, 2004.

31. “System Based Material Design for Wafer Level Underfills,” PhD, SSIE, Ananth

Prabhakumar, November 2004.

32. “Thermo-Mechanical Behavior of Tin-Lead and Lead-Free Ceramic Column Grid Array

Packages,” M.S., Rahul V. Joshi, January 2005.

33. “Predictive Model for Optimized Design Parameters in Flip-Chip Packages,” MS,

Karthik Raghunathan, February 2005.

34. “Explicit Dynamic Analysis of Computer Motherboards,” MS, Priyank Jain, February

2005.

35. “Role of Intermetallics for Both Tin-Lead and Lead Free Solder Structures and Its Solder

Pad Combination,” MS, Ganesh Iyer, Mechanical Engineering, 2005.

36. “System-in-Package: A System Level Investigation for Package Reliability,” PhD,

Mohammed Shafi Saiyed, Systems Science, 2005.

37. “A Systems Approach to Ultra-Fine Pitch High-Density Flip Chip Interconnect

Packaging,” PhD, Kaustubh Ravindra Nagarkar, Systems Science, 2005.

38. “Effect of Bonding Pressure on Joint Reliability in a Chip-on-Flex (COF) Application,”

MS, Abilash Puthenparambil, Electrical Engineering, 2006.

39. “Development of Micro-Acoustic Devices with Applications of Viscous Effects,” PhD,

Lin Tan, Mechanical Engineering, 2006.

40. “Mechanical Properties of SU-8 and Carbon Nanotubes Reinforced SU-8 from Room

Temperature to High Temperatures,” MS, Sandeep Makhar, Mechanical Engineering,

2006.

Bahgat Sammakia Page 46 11/30/2016

41. “Fluid Dynamics and Heat Transfer Considerations for Gel Thermal Interface Material

(Part 1) and the Underfill Process (Part 2),” PhD, Drew Alan Davidson, Mechanical

Engineering, 2006.

42. “Study of Thermal and Chemical Factors which Influence Solidification of Sn in Near

Eutectic Sn-3.0Ag-Xcu Lead Free Solder,” MS, Yan Xing, Mechanical Engineering,

2006.

43. “Thermal Management of Small Scale Electronic Systems,” PhD, Anand Desai,

Mechanical Engineering, 2006.

44. “Development and Verification of an Apparatus for Thermal Resistance and Thermal

Conductivity Measurements,” MS, Kaustubh Kalkundri, Mechanical Engineering, 2006.

45. “Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure

Constraint,” MS, Dylan Farnam, 2007.

46. “Experimental Study of Electromigration in Flip Chip Packages,” PhD, Mukesh K.

Selvaraj, Industrial Engineering, 2007.

47. “Interfacial Reliability of Pb-Free Flip Chip BGA Package,” PhD, Zhenming Tang, 2008.

48. “Analysis of a Mechanical Hole-Punching Process to Create Registration on a

Continuous Roll-to-Roll Flexible Electronics Substrate using SPC Techniques,” MS,

Denisse E. Yepez, Industrial Engineering, 2008.

49. “Assembly Process Development Reliability and Numerical Assessment of Copper

Column Flexible Flip Chip Technology,” PhD, Ta-Hsuan Lin, 2008.

50. “Deposition of Ceramic Thin Films from Aqueous Solutions at Low Temperatures,”

PhD, Guangneng Zhang, 2008.

51. “Investigation of Solder Joint Reliability through Impact Fatigue Loading,” MS, Pradosh

Guruprasad, ME, 2008.

52. “Microstructure Based Experimental and Finite Element Analysis of Failure Mechanism

of Pb-Free BGA Interconnects,” PhD, Ramji Dhakal, 2008.

53. “A Prototype Multifunction Differential Pressure-Flow Sensor for Medical and Industrial

Applications,” MS, Ali Abdul Ali Shakir, Mechanical Engineering, 2008.

54. “Stress Relieving Technique for Plastic Packages in a High Volume Manufacturing

Environment,” PhD, Ashish Batra, Industrial Systems Engineering, 2009.

Bahgat Sammakia Page 47 11/30/2016

55. “Discrete Particle Swarm Optimization Algorithms for Orienteering and Team

Orienteering Problems,” PhD, Shanthi Muthuswamy, Industrial Systems Engineering,

2009.

56. “Indirect Collaborative Evolution for the Facilitation of Group Intelligence in Nursing

Care Plan Development,” PhD Dissertation, Daniel Lewis Sloat, SSIE, 2009.

57. “Drop Test Energy Relationship to Reliability,” MS Thesis, Timothy Levo, Mechanical

Engineering, 2009.

58. “Using the Forest to See the Trees: Correlation Pattern Recognition and Fractal Context

Classification in an Integrated Featureless Computer-Aided Diagnosis System for Non-

Palpable Breast Cancer,” PhD Dissertation, SSIE, Elizabeth Verheggen, 2009.

59. “Using the Forest to See the Trees: Correlation Pattern Recognition and Fractal Context

Classification in an Integrated Featureless Computer-Aided Diagnosis System for Non-

Palpable Breast Cancer,” PhD Dissertation, SSIE, Elizabeth Verheggen, 2009.

60. “Characterization of Thermal Interface Materials using Flash Diffusivity Tester and

Infrared Microscopy,” MS Thesis, Viral Chasatia, Mechanical Engineering, 2009.

61. “Investigation of Electromigration Behavior in Lead-Free Flip Chip Solder Bumps,” PhD,

Kaustubh Kalkundri, Industrial and Systems Engineering, 2010.

62. “Thermal Interface Material Bondless: Particulate Flows in Confined Geometries; Process

Dependent Microstructure and Thermal Performance,” David Rae, PhD Materials Science

and Engineering, 2012

63. “Characterization of Process and Reliability of Copper Wire Bonding on Aluminum Bond

Pads,” Ph.D., Pushkraj Satish Tumne, Industrial and Systems Engineering, 2012.

Service to the National and International technical community:

Co-Chair, Awards committee for Interpack 2009, held in San Francisco CA, July 2009.

Co-Chair, Academic Track, United States Displays Consortium Annual Flexible

Electronics and Displays Conference and Exhibit, Phoenix, AZ, February 2008.

Chief Editor of the ASME Transactions, Journal of Electronic Packaging- since January

2002.

Technical editor ASME Transactions, Journal of Electronic Packaging, 1989 to 1999.

Associate editor IEEE Transactions on Components and Packaging Technologies, since

2006.

Bahgat Sammakia Page 48 11/30/2016

Member ASME K-16 subcommittee on thermal management of electronic equipment

since 1985.

IBM STAB member for packaging at the Semiconductor Research Corporation (SRC)

1997/98. Reviewed and evaluated research activities related to packaging at the Univ. of

Arizona, Stanford, Cornell, Lehigh, Wayne State University, Univ. of Texas at Austin,

and University of Colorado at Boulder.

Served on the science committee for Thermes 2002, a workshop dedicated to future

challenges and needs in the thermal management of Electronics, Santa Fe, NM, 1/2002.

Organized and chaired a session on thermal issues in manufacturing of Electronics

Packaging, Thermes 2002, Santa Fe, NM, 1/2002.

Chaired and coordinated sessions on thermal management, structural mechanics and

reliability in electronic packaging at ASME sponsored conferences, including:

o Co-Chair, (with Prof. Ganesh Subbarayan, Purdue University), the Electronics

Packaging track at the 2002 ASME IMECE

o Track chair for the thermal track at Itherm 2002. Coordinated and organized 22

sessions at the conference all related to thermal management of Electronics

Packages and Systems.

o Organized and chaired a session on thermal management of electronics at the

IMECE 2001, N.Y.

o Organized and chaired 1 session at ASME/IMECE1999

o Organized and participated in two panel sessions at the Itherm ‘98 related to

coupling effects in organic flip chip packages, and thermal induced phenomena at

thermal interfaces.

o Organized and chaired two sessions at Itherm 98

o Organized and chaired one session at ASME/IMECE 1998

o Organized two sessions at the Inter-pack meeting in 1995, Maui.

o Organized a session at the Fourth Intersociety Conference on Thermal Phenomena

in Electronic Systems, Washington, DC, May 4-7 1994.

o ASME/JSME International conference on electronic packaging, Milpitas CA,

1993

o Chaired two sessions at the ASME International Packaging Conference,

Binghamton, NY 1993.

Newsletter editor for the ASME K-16 subcommittee on thermal management of

Electronic Packaging from 85-88.

NEMI member of the modeling and simulation group for 2000, 2002.

NEMI member of the thermal management group for 2000.

Recent National Panels and review teams:

Chaired NSF sponsored Panel (with Dr. Roger Schmidt, IBM Fellow), on Dynamic

Management of Data Centers’, at the 12th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada,

June 2-5 2010.

Chaired NSF Panel (with Professor Avi Bar-Cohen), on Grand Challenges in Thermal

Management of Electronics: From Device to Systems, Part II: Green Data Centers, Panel

was held at InterPack 2009, San Francisco, CA, July 2009.

Bahgat Sammakia Page 49 11/30/2016

Chaired NSF Panel (with Professor Dereje Agonafer and Dr. Gamal Refai-Ahmed), on

Grand Challenges in Thermal Management of Electronics: From Device to Systems, Part

I: Three Dimensional Chip Stacks with Through Silicon VIAs, Panel was held at

InterPack 2009, San Francisco, CA, July 2009.

Member of an NSF review panel for CAREER awards in the area of thermal sciences,

November 2008.

Chaired NSF Panel on Grand Challenges in Thermal Management of Electronics: From

Device to Systems, ASME IMECE, October 31, 2008, Boston Massachusetts

NSF Workshop on Frontiers in Transport Research and Education. Held at the University

of Connecticut in May 2007. Chaired a panel “Panel 2-IT Information Technology”. The

panel wrote a report summarizing challenges, barriers and gaps and recommendations for

future research.

Member of the NSF review team for the Engineering Research Center (ERC) at Princeton

University, Mid-Infrared Technologies for Health and Environment (MIRTHE), 2006,

2007, 2008, 2009, 2010.

Site Visit Reviewer, National Science Foundation, IGERT program 2004, University of

Utah, ‘Microscale/Nanoscale thermal fluid systems.’

Undergraduate Research Supervised:

PI and Director National Science Foundation: REU Site: Research Opportunities for

Undergraduates in the Field of Electronics Packaging, 01-Jun-2002 to 31-May-2005.

Development of an Internet Based course on Electronics Packaging utilizing a distributed

Database, an NSF-funded REU project, 2001/2002.

“High Power Collimated Backlight Cavity with Integrated Lamps and Optics,” Rainbow

Displays International, supervised this research effort as a senior design project, 1999-

2000.

“Handheld Cryo-Surgical Devices,” Cryo-surgical sciences, a senior design project,

1999-2000.

“A Handheld Device That Is Attached to an Electronic Box (Tethered System),” a senior

design project, 1999-2000.

“Fragility of a Back Light Assembly Subjected to Shock and Vibration Input,” a senior

design project, 1999-2000.

“Thermocouple Attach Design Methodology,” a senior design project, 1999-2000.

“Design and Build a Precision Manual Polishing Fixture to be Used in the Preparation of

IEEC Teardown Electronic Device Micro-Sections,” a senior design project, 1999-2000.