Broadcom AFEM-8200 PAMiD in the Apple iPhone 12 Series ...

©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Broadcom AFEM-8200 PAMiD in the Apple iPhone 12 SeriesDeep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.SPR21606 - RF report by Stéphane ELISABETH

Laboratory analysis by Peggy LE GALLOIS & Nicolas RADUFEFebruary 2021 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/


Table of ContentsOverview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Broadcom

o Filter technologies

o Apple iPhone 12 Pro Max Teardown

Market Analysis 24

o RF Components Market Forecast

o Supply Chain

Physical Analysis 29

o Summary of the Physical Analysis 30

o Module 32

✓ Package Views & Dimensions

✓ Package Opening:

Power amplifier, Switch, RF IC, Filters

✓ Bloc Diagram Estimation

✓ Package Cross-Section:

Overview, CT Scan, Dimensions, Substrate, Internal & External Shielding

✓ Summary of physical data

o Power Amplifier, Switch, LNA 68

✓ Die Views & Dimensions

✓ Die Cross-Section

✓ Die Process Characteristics

o Filter Dies 108

✓ High/Mid band repartition

✓ Dies Views, Dimensions & Opening

✓ Dies Overview: Cap, Substrate, Cells

✓ Die Cross-Section:

Sealing Frame, Anchor, TSV, Holes, FBAR Structure

✓ Die Physical Data Summary

Comparison with previous Mid/High band FEM from Broadcom 143

o Package Evolution with Technology Enabler

o Package Cross-Section

o Package Integration Evolution:

Die Number, Die Distribution, EMI Shielding, Die Area, Die Cost

o Supplier Evolution: Power Amplifier, Switches

Manufacturing Process 155

o Global Overview

o Switch & matching RFIC Die Front-End Process

o Filter Die Front-End Process & Fabrication Unit

o Filter Die Front-End Process Flow

o Packaging Process & Fabrication Unit

o Packaging Process Flow

Cost Analysis 185

o Summary of the cost analysis

o Yields Explanation & Hypotheses

o PA die

✓ Die Front-End Cost

✓ Die front Cost per process steps

✓ Die Wafer & Die Cost

o Switch & LNA Die



o Filter die


✓ Die front Cost per process steps


o Packaged Component

✓ Packaging Cost

✓ Packaging Cost per process steps

✓ Component Cost

Front-End Module Estimated Price 218

Feedbacks 222

Company services 224



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical & Cost Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

Related Analyses

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data,manufacturing cost and selling price of the Broadcom AFEM-8200.

In 2020, Broadcom remains the only supplier of the same module for several versions of the latestApple iPhone series: 12, 12 Mini, 12 Pro and 12 Pro Max. Like its predecessor, the AFEM-8100, theAFEM-8200 is a Mid- and High-Band (MB and HB) Long Term Evolution (LTE) and 5G FEM. Itfeatures several dies: Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film Bulk AcousticResonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-ScalePackaging (CSP) technology with Through-Silicon Vias (TSVs) enabling Electrical contacts andScandium Doped Aluminum Nitride (AlScN) as a piezoelectric material.

For this special version, Broadcom innovates on several points. Thanks to the dual side moldingBGA technology, the density of the packaging has growth and the critical dies (master switches,Power management IC (PMIC) and Low-Noise Amplifier (LNA)) has been completely isolated fromthe filtering part. On the EMI management, a novel compartmental shielding using silver wire bondhas allowed a huge reduction in the packaging cost. Finally, with the latest GaAs PA technologyusing Flip-Chip configuration, only two PA remains in the module. Thanks to all these innovations,Broadcom managed to deliver a miniaturized package despite the complexity added with 5G.

The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, theswitches, the LNA, the filtering dies, and the internal/external EMI shielding. The report alsofeatures a cost analysis and a price estimation of the component. Finally, it also integrates acomparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X, the AFEM-8092, MB/HBLTE FEM in the Apple iPhone Xs and the AFEM-8100, MB/HB LTE FEM in the Apple 11 series.



Overview / Introduction

Company Profile & Supply Chain o Broadcomo In Smartphoneso Filter technologyo Apple iPhone 12 Pro Max

Teardown

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

Related Analyses

About System Plus

Apple Smartphone History and RF Front-End Major Players

Q1 2016 Q4 2016 Q4 2017 Q4 2018 Q4 2019 Q1 2020 Q4 2020

• Apple used to release a single high-end series of phone per year. This year, we have seen the release of the second generation oflow–end segment from Apple. This could become a rule. One high-end per year and one low-end every four years.

• For the supply chain, the company has relied on Broadcom(formerly Avago) and Skyworks since 2016. Since the iPhone 7, Qorvohas a role in the supply chain mainly for antenna tuner.

• Since the iPhone Xs, Murata integrate the supplier cercle mainly with diversity modules along with Skyworks.





Market Analysis

Physical Analysis o Summaryo Package Assembly

o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section

o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis



Cost Analysis


Feedbacks

Related Analyses

About System Plus

Package Views & Dimensions

Package Top View – Optical View©2020 by System Plus Consulting

Package Bottom View – Optical View©2020 by System Plus Consulting

Package Side View – Optical View©2020 by System Plus Consulting

• Package Type: xxx balls BGA

• Dimensions: xx mm² x xx mm(xxx x xxx x xxx mm)

• Pin Pitch: xxx mm

• Marking: <Logo Avago>

8200

KA031

NL091

xxx

mm

xxx

mm

xxx mm





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Module CT Scan

Apple iPhone 12 Pro Max – Main Board – CT Scan©2020 by System Plus Consulting





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Opening

Package Opened View – Optical View©2020 by System Plus Consulting

The opening reveals 24 dies in flipconfiguration, and 56 SMD components(Inductors, Resistors, Capacitors).

Additional wire bondings are placedaround the dies.

We assume that these wire bonding areplaced to avoid interferences.





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Overview – LNA Bank

Package Opened View – Optical View©2020 by System Plus Consulting

LNA Top View – Optical View©2020 by System Plus Consulting

• Die area: xxx mm²

(xxx x xxx mm)

• Die marking: 4HA8A 19 BRK0

• Die substrate: xxx





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Cross-Section – Dimensions

Package Cross-Section – SEM View©2020 by System Plus Consulting





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Power Amplifier – Die Overview

Power Amplifier Die View – Optical View©2020 by System Plus Consulting





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Power Amplifier – Die Cross-Section

Die Cross-Section – SEM View©2019 by System Plus Consulting






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Switch – Die Delayering





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Switch – Die Process

Die Process – SEM View©2020 by System Plus Consulting





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Switch – Die Cross-Section






Market Analysis






Cost Analysis


Feedbacks

Related Analyses

About System Plus

LNA – Die Views & Dimensions

LNA Die View – Optical View©2020 by System Plus Consulting

• Die Area: xxxmm²(xxx x xxx mm)

• Nb of PGDW per 12-inch wafer: xxx

• Pad number: xxxx





Market Analysis






Cost Analysis


Feedbacks

Related Analyses

About System Plus

LNA – Die Cross-Section






Market Analysis






Cost Analysis


Feedbacks

Related Analyses

About System Plus

Filter – Die Overview – Tx – Cap





Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Filters – Die Opening – Substrate

Die Opening – Optical View©2020 by System Plus Consulting





Market Analysis






Cost Analysis


Feedbacks

Related Analyses

About System Plus

Filter – Die Cross-Section






Market Analysis

Physical Analysis

Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply


Cost Analysis


Feedbacks

Related Analyses

About System Plus

Package Opening – Die Cost





Market Analysis

Physical Analysis


Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &

Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow

Cost Analysis


Feedbacks

Related Analyses

About System Plus

Power Amplifier Front-End Process

HEMT Wafer Process:

o The manufacturing of the HEMT begins with the epitaxy and patterned.

o Ohmic contact is formed on the cap layer.

o Then, Conductive Seed layer is deposited and patterned.

o Gold Au #1 is electroplated then Silicon Nitride SiN #1 is deposited and patterned.

o Oxide layer and Conductive Seed layer are deposited and patterned.


o Conductive Seed layer is deposited and patterned.


o PBO #1 layer is deposited and patterned.

o Seed layer are deposited and patterned.

o Next, PBO #2 layer is deposited and patterned. Gold Au #4 is electroplated.

drawing not to scale





Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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About System Plus

Power Amplifier – Process Flow (3/8)

GaAs Wafer

• Lithography #4

• Pattern & Etch

• Plasma Ashing

GaAs Wafer

•Ohmic ContactAu/Ti/Au Deposition

• Lithography #5

• Pattern & Etch

• Plasma Ashing

GaAs Wafer

• Ti Deposition

• Lithography #6

• Pattern & Etch

•Metal 1

•Au Deposition

• Plasma Ashing

• Ti Etching

drawing not to scale





Market Analysis

Physical Analysis




Cost Analysis


Feedbacks

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About System Plus

Filters – Process Flow (6/8)

Silicon Wafer #1 & #2

•Au-Au thermo-compression bonding

Silicon Wafer #1 & #2

•Cap thinning

drawing not to scaledrawing not to scale

drawing not to scaledrawing not to scale





Market Analysis

Physical Analysis



Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost


Feedbacks

Related Analyses

About System Plus

PA Front-End Cost

The front-end cost for the PA ranges from $xxxto $xxx according toyield variations.

The largest portion of the manufacturing cost is due to the xxx at xxx% and to the xxxx at xxxx%.





Market Analysis

Physical Analysis






Feedbacks

Related Analyses

About System Plus

PA Front-End Cost per process steps (2/2)

M4 Gold Electroplating stepsrepresent the largest part ofwafer step costs.





Market Analysis

Physical Analysis






Feedbacks

Related Analyses

About System Plus

LNA Wafer & Die Cost

By adding the probe test cost and the dicing, the LNA wafer cost ranges from $xxx to$xxx according to yield variations.

The number of good dies per wafer is estimated to ranges from xxx to xxxx accordingto yield variations, which results in a die cost ranging from $xxx to $xxx.





Market Analysis

Physical Analysis






Feedbacks

Related Analyses

About System Plus

Filter Front-End Cost

The front-end cost for the Filter ranges from $xxx to $xxx according toyield variations.

The largest portion of the manufacturing cost is due to the xxxx at xxxx%.





Market Analysis

Physical Analysis






Feedbacks

Related Analyses

About System Plus

Filter Front-End Cost per process steps (1/2)

Cleaning and the Gold contact steps represent the largest part of wafer step costs.





Market Analysis

Physical Analysis






Feedbacks

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About System Plus

Component Cost



R E L A T E DA N A L Y S E SR E L A T E DA N A L Y S E S




Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Pluso Company serviceso Contact

Related Analyses

RELATED TEARDOWN TRACKSRELATED REPORTS

By System Plus Consulting:• Broadcom AFEM-8100 System-

in-Package in the Apple iPhone 11 Series

• Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiDSKY78221

• RF Front-End Module Comparison 2020 – Volume 4

By Yole Développement:• 5G’s Impact on RF Front-End

and Connectivity for Cellphones 2020

• System-in-Package Technology and Market Trends 2020

By System Plus Consulting:• Consumer Track – Phone


https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8100-system-in-package-in-the-apple-iphone-11-series/

https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8100-system-in-package-in-the-apple-iphone-11-series/

https://www.systemplus.fr/reverse-costing-reports/skyworks-fbar-baw-filter-technology-in-2guhb-pamid-sky78221/

https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-4/

https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/

https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/

https://www.reverse-costing.com/teardowns/?q=&category=Phones&category=Accessory&show_only_full_teardowns=on


COMPANYSERVICES




Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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A Structure, Process and Cost Analysis

Reverse Costing® consists in disassembling a device or a system, in orderto identify its technology and determine its manufacturing processes andcost, using in-house models and tools.

Our Core Activity : The Reverse Costing®





Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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Fields Of Expertise





Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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Business Model

Teardown Track

205+ teardowns per

year

Monitor1 per year quarterly updated

Custom Analysis150 custom analyses per

year

Report60+ per year

Costing Tools

5 process-based and 3 parametric

costing tools

Cost MethodsTrainingOn demand





Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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Worldwide presence

100+ collaborators in 8 different countries

Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement

Boise

CorneliusRaleighPhoenix

Austin

Singapore

Hsinchu

TokyoShenzhen

Seoul

Frankfurt

Nantes

Lyon





Market Analysis

Physical Analysis



Cost Analysis


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Contact

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[email protected] - +33 2 40 18 09 16

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Broadcom AFEM-8200 PAMiD in the Apple iPhone 12 Series ...

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