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Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi.

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Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi
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Bruno Murari

STMicroelectronics

Universita’ di Pavia24 Marzo, 2004

Microelettronica e MEMS Oggi

Outline

The Electronic System Building Blocks

System Oriented and Smart Power Technologies

MEMS: Inertial Sensors and Microactuators

Microfluidics: Lab on Chip and Photonics Switches

Packaging and Interconnections

Conclusions

The Electronic System

Building Blocks

Concentrated System in a Single Box

Bipolar, BCD, CMOSBiCMOS, VIP,µ-Machining

Power Management

InformationProcessing(Super Integration)

MultifunctionPeripheral (System

Oriented Tech.)

Data Acquisitionand Conversion

Bipolar, CMOS,RF-BiCMOS,µ-Machining

Central Processing(µP, DSP)

Digital CMOS

PowerActuators

Bipolar, BCD,CMOS, HVCMOS,VIP, µ-Machining

Memories

CMOS, Flash,DRAM, µ-Machining

Line, Batteries,Alternators, Solar Cells, Fuel Cells

Sensors

Antennas

Keyboards

LineInterfaces

Switches

Clock Clock

Clock

Lamps

Motors

Displays

Solenoids

Speakers

CRTs

Inkjets

Antennas

Typical Aggregation of Different Technologies for System Optimization

System Oriented and Smart

Power Technologies

BCD History and Evolution

Engine Control Unit Architecture

Typical SoC for IntelligentMirror in Modern Cars

Example of Intelligent

Mirror in Modern Cars

Typical Power Management Chipfor Mobile Phones

Example of Portable SetsExample of Portable Sets

that require Sophisticatedthat require Sophisticated

Power Management ChipsPower Management Chips

N/P-LDMOS in H-bridgeN/P-LDMOS in H-bridge

Optical Data Storage Disk Drive

• Integrated motor driver device with capability to control the spindle, tracking, focus and tray motors.

• This device operates on a single 3.3V supply and provides integrated power FETs for all engine motors.

N/P-LDMOSin H-bridgeN/P-LDMOSin H-bridge

N/P-LDMOS in H-bridgeN/P-LDMOS in H-bridgeN/P-LDMOS in H-bridgeN/P-LDMOS in H-bridge

Logic CMOSLogic CMOS

Power Combo for DataStorage Hard Disk Drive

Head Driver for Printer

Logic CMOSLogic CMOS

N/P

-LD

MO

SN

/P-L

DM

OS

N/P

-LD

MO

SN

/P-L

DM

OS

Efficiencies for Different Classes of Operation for Audio Output Amplifiers

System Structure of High Efficiency PA

+

+ -

-

Front

High Impedance

Rear

Buffer

Control Logic

Vin F Vin R

FP

FM

RM

RP

I_F I_R

I_RP

Final Amplifier Front Final Amplifier Rear

Example of 2x75 WattHigh Efficiency PA

Thick (6 m) Copper Metallization

DDX ® - Direct Digital Amplification

MEMS: Inertial Sensors

and Microactuators

Silicon as Structural Material

MEMS

MEMS:

Micro Electro Mechanical System– three dimensional device

embedded in silicon– multifunction system consisting

of sensors, actuators, electronics.

Different Typeof Accelerometer

Rotational Accelerometer

Silicon Microstructures in Future HDD

Typical Assembly of an HDDSuspension with Microactuator

Microactuator Chip

Microactuator Concept

Microactuator without Cap Movie

Microactuator with Cap Movie

Atomic Resolution Storage from HPAtomic Resolution Storage(ARS) technologyUses focused electron beams and a

phase change media to read and write data

Micromachined movers provide high resolution access of media by fixed emitter tips

Technology developed at HP Labs

ARS products

Perfect for mobile applicationsSmall, high density storageMemory cards and embedded storage

applicationsCost effective … enabling appliances

and applications

Scientific American – January 2003

Millepede from IBM

Scientific American – January 2003

High DopedSilicon Cantilever

Heater

Millipede Movie (from IBM web Site)

Microfluidics: Lab on Chip

and Photonics Switches

Ink Jet Cartridge

Lab on Chip

“Sample to Answer” Flow

Lab on Chip Movie

Bubble Switch for Optical Network ST/AGILENT Partnership

Photonic Switching Concept

ST/AGILENT Bubble Switch Movie

Packaging and

Interconnections

High Voltage Interconnection

High VoltageThrough Silicon Vias

Multichip and Stacked Dice

Conclusions

The VLSI evolution has been and will a be major driving force, but does not cover the whole picture

Interfacing the real world requires for different approaches, skills and education

Analog electronics is the bridge between the laws of nature (physics) and computing (software): multidisciplinary by nature, impossible to be constrained in one scheme

Lateral thinking is a key process for quantum leaps in innovation

Thank You


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