Corporate Overview &

Electrostatic Substrate Handling

Technology

Eryn Smith

Chip Maschal

8/17/2016

Beam Services, Inc. International

Distribution Products &

Engineering

Global

Support

Beam Services is a capital equipment solution

provider for the semiconductor, nanotechnology and

research instrumentation markets.

International

Distribution

Products &

Engineering Global Support

Beam Services, Inc. International

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The team at Beam Services has over >80 man years combined

experience in semiconductor service and engineering

Eryn Smith. PhD

President & CEO • Founder TransPacific / Metron

• Founder Beam Services, Inc

Dan Buntman VP Service & Support

Chip Maschal VP Global Sales &

Business Development

Bret Jacoby Sr. Director Engineering and

Manufacturing

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Silicon Valley

3 Exec. Management

1 CFO

1 Controller

1 Office managers

2 Service Engineers

2 Product Engineer

1 software Engineer

1 Electrical Engineer

Austin TX

1 Service Engineers

Malta NY

1 Applications

Specialist

Minnesota

1 Engineer

• 16 Full time employees

Manassas VA

1 Service

Engineer

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BSI Engineering is an engineering and manufacturing

company specializing in the development of innovative

temporary bond technology enabling our customers to

handle new challenging substrates!

“We are the next generation of temporary bond….”

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Electrostatic substrate handling systems

for thin wafers & cingulated devices

Full hardware suite based on

proprietary electrostatic handling

technology

Easily integrated into process

development and scalable to

production environment

Custom solutions for cingulated

device handling

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Charging & Discharging Hardware

Quartz and Si MESC Carriers

JEDEC Tray Integrated MEC

Battery Powered MEC

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Why thin wafers? • Consumer electronics driver for smaller

packages, higher performing, lower cost applications such as memory and mobile devices

• <100 um thick down to ultra thin (below 40 um thick) semiconductor wafers

• Benefits: • Reduced package thickness < 1 mm

for smart-phones

• Heat dissipation for thermal management

• 3D Integration for high thru-silicon via density

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• Thin substrates are difficult to handle in

manufacturing environment causing

damage and yield loss during the de-

bond process!

• With emergence of 3DIC, through

• Si-vias, MEMS technologies large IDMs

and Foundries are struggling with

handling

• Electrostatic temporary bond carriers

gently releases thin substrates and

does not require extra clean steps!

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UV Bond Adhesive Thermal Bond Adhesive

Rigid Ring Carrier Tape/Tapeframe

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Thin wafers

Rigid carrier capable of reliable,

repeatable bond & de-bond

Transparent substrates

Opaque substrate for direct

integration into existing tool flow

Small / non-standard substrates on large carriers III-V materials, Sapphire, Diamond

2” – 8” substrates directly integrated into tool flow

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Semiconductor wafer handling

Semiconductor back end packaging

Semiconductor solar cells

Metal masks

Glass substrates

Substrate pieces/Coupons

MEMS

Non-conductive substrates w/

conductive layer

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• Lithography

• ASML, Nikon, and Cannon

• Dry Etch

• PTS, Oxford, and Plasmatics

• Deposition (PECVD)

• PTS, AMAT Producer

• Ion Implant

• Axcelis

• Transport Handling

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Bi-Polar Carrier Types:

• Standard HT (high temperature 400c) silicon SEMI Specified thickness

• Thin silicon ultra low TTV (total thickness variance edge to edge < 1 um)

• Ruggedized carrier for thinning and wet full emersion applications

Sizes Available:

• 100mm, 150mm, 200mm, & 300mm

Thickness:

• 300um to full SEMI Specified thickness

• Can produce custom thickness

Base Material:

• Silicon, BSG glass, quartz glass, ceramic

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HT Standard Carrier

• Metallization

• CVD / PeCVD

• PVD

• Ion-Implant

• Plasma-clean

• Electro-plating

• Handling

UT (thin) Carrier

• Lithography

• CD SEM

• SEM

• FIB

• Metrology

Ruggedized Carrier

• Wafer thinning

• Full emersion

• Wet etch

• Wet clean

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Thin substrates:

• Tested down to < 10 um Silicon

Transparent substrates:

• BSG Glass

• Quartz

Non conductive substrates:

• Sapphire

• Paper

• Polyimide

• Diamond

III/V Materials:

• GaN

• GaAs

• SiC

• InP

Packaging:

• Bumped surfaces

• Compound substrates

• Solder masks

Coupons & cingulated devices:

• 2 mm x 2 mm square cingulated devices

• Small GaN samples

Large format:

• Glass

• Thin stainless steel

• Roll to roll

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Automated Bond & De-Bond

Charging System

High-throughput, production ready tool

50 WPH

Class 100 & Class 10 fan assembly

Multiple process modules

Mature robotics and software platform

Automated alignment , accurate and repeatable

location placement for bonding small substrate on

large format ES Carrier

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MESC

• Surface mount capacitors for extended bond cycles

• Active MESC w/ pockets

• Wafer thinning carriers

• Organic passivation materials

• Backside alignment litho carrier

MEC

• Re-flow (high temperature >270c)

• 0 – 4000v

• Full emersion wet processes

• Row bar handler

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Gel-Pac JEDEC Matrix Tray

Wafer Level Poly Bond Tape/Tapeframe

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Device Package

Handling/Shipping

JEDEC Tray integrated MEC

Multiple form factors

Higher density loading

No backside contamination

High Temperature Re-Flow

270c for 15 mins.

No backside contamination

Reusable

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Semiconductor device handling

Semiconductor back end packaging

Semiconductor device shipping

Thermo voltaic wafer level handling

Si coupon handling

CD/SEM sample handling

MEMS

Wafer dicing

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JEDEC tray form factor

• Integrated into custom frame

• 5 mm total thickness

On board battery charging/monitoring

• No need for external charger

• Charges in stacked condition (15V DC)

Lithium Ion batteries

• 0.8mm thick

• Stable current delivery

Low profile static generator

• 1.1 mm thick

Built in capacitance for extended run requirements

• Power failure safety

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High density loading

• Can handle virtually any size device form factor

• Devices can be loaded in closer proximity to one another

Reduced backside contamination

• No contamination from gels or boning agents

• No device edge damage

Long life time

• >5000 charge cycles

• 12 hr. run time in constant voltage mode

• >30 days in storage mode (option)

Low COO

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Non contact charging

• Inductive coil built in to carrier and charging base

Auto ID

• Charge cycle tracking

• WIP tracking

• Active non-contact MEC control and feedback

Standby mode

• Recharges MEC capacitor power delivery system every 10 hrs.

Status monitoring

• Non-contact carrier status (Auto ID required)

• Visual LED status output

TEG (Thermo electric generator)

• Reflow or high temp. applications

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Improves tool utilization by enabling a diverse application set

Reduced process steps (no clean)

Reusable – thousands of cycles

Improved yield

Mobile electrostatic temporary bond technology

provides a rigid contamination free handling solution

for fragile non standard substrates and small devices

www.beamservices.com

Corporate Office

6960 Koll Center Parkway, Suite 305

Pleasanton, California 94566 USA

Phone: 925-462-8800

Fax: 925-462-1818