Corporate Overview &
Electrostatic Substrate Handling
Technology
Eryn Smith
Chip Maschal
8/17/2016
Beam Services, Inc. International
Distribution Products &
Engineering
Global
Support
Beam Services is a capital equipment solution
provider for the semiconductor, nanotechnology and
research instrumentation markets.
International
Distribution
Products &
Engineering Global Support
Beam Services, Inc. International
Distribution Products &
Engineering
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The team at Beam Services has over >80 man years combined
experience in semiconductor service and engineering
Eryn Smith. PhD
President & CEO • Founder TransPacific / Metron
• Founder Beam Services, Inc
Dan Buntman VP Service & Support
Chip Maschal VP Global Sales &
Business Development
Bret Jacoby Sr. Director Engineering and
Manufacturing
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Silicon Valley
3 Exec. Management
1 CFO
1 Controller
1 Office managers
2 Service Engineers
2 Product Engineer
1 software Engineer
1 Electrical Engineer
Austin TX
1 Service Engineers
Malta NY
1 Applications
Specialist
Minnesota
1 Engineer
• 16 Full time employees
Manassas VA
1 Service
Engineer
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BSI Engineering is an engineering and manufacturing
company specializing in the development of innovative
temporary bond technology enabling our customers to
handle new challenging substrates!
“We are the next generation of temporary bond….”
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Electrostatic substrate handling systems
for thin wafers & cingulated devices
Full hardware suite based on
proprietary electrostatic handling
technology
Easily integrated into process
development and scalable to
production environment
Custom solutions for cingulated
device handling
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Charging & Discharging Hardware
Quartz and Si MESC Carriers
JEDEC Tray Integrated MEC
Battery Powered MEC
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Why thin wafers? • Consumer electronics driver for smaller
packages, higher performing, lower cost applications such as memory and mobile devices
• <100 um thick down to ultra thin (below 40 um thick) semiconductor wafers
• Benefits: • Reduced package thickness < 1 mm
for smart-phones
• Heat dissipation for thermal management
• 3D Integration for high thru-silicon via density
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• Thin substrates are difficult to handle in
manufacturing environment causing
damage and yield loss during the de-
bond process!
• With emergence of 3DIC, through
• Si-vias, MEMS technologies large IDMs
and Foundries are struggling with
handling
• Electrostatic temporary bond carriers
gently releases thin substrates and
does not require extra clean steps!
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UV Bond Adhesive Thermal Bond Adhesive
Rigid Ring Carrier Tape/Tapeframe
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Thin wafers
Rigid carrier capable of reliable,
repeatable bond & de-bond
Transparent substrates
Opaque substrate for direct
integration into existing tool flow
Small / non-standard substrates on large carriers III-V materials, Sapphire, Diamond
2” – 8” substrates directly integrated into tool flow
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Semiconductor wafer handling
Semiconductor back end packaging
Semiconductor solar cells
Metal masks
Glass substrates
Substrate pieces/Coupons
MEMS
Non-conductive substrates w/
conductive layer
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• Lithography
• ASML, Nikon, and Cannon
• Dry Etch
• PTS, Oxford, and Plasmatics
• Deposition (PECVD)
• PTS, AMAT Producer
• Ion Implant
• Axcelis
• Transport Handling
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Bi-Polar Carrier Types:
• Standard HT (high temperature 400c) silicon SEMI Specified thickness
• Thin silicon ultra low TTV (total thickness variance edge to edge < 1 um)
• Ruggedized carrier for thinning and wet full emersion applications
Sizes Available:
• 100mm, 150mm, 200mm, & 300mm
Thickness:
• 300um to full SEMI Specified thickness
• Can produce custom thickness
Base Material:
• Silicon, BSG glass, quartz glass, ceramic
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HT Standard Carrier
• Metallization
• CVD / PeCVD
• PVD
• Ion-Implant
• Plasma-clean
• Electro-plating
• Handling
UT (thin) Carrier
• Lithography
• CD SEM
• SEM
• FIB
• Metrology
Ruggedized Carrier
• Wafer thinning
• Full emersion
• Wet etch
• Wet clean
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Thin substrates:
• Tested down to < 10 um Silicon
Transparent substrates:
• BSG Glass
• Quartz
Non conductive substrates:
• Sapphire
• Paper
• Polyimide
• Diamond
III/V Materials:
• GaN
• GaAs
• SiC
• InP
Packaging:
• Bumped surfaces
• Compound substrates
• Solder masks
Coupons & cingulated devices:
• 2 mm x 2 mm square cingulated devices
• Small GaN samples
Large format:
• Glass
• Thin stainless steel
• Roll to roll
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Automated Bond & De-Bond
Charging System
High-throughput, production ready tool
50 WPH
Class 100 & Class 10 fan assembly
Multiple process modules
Mature robotics and software platform
Automated alignment , accurate and repeatable
location placement for bonding small substrate on
large format ES Carrier
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MESC
• Surface mount capacitors for extended bond cycles
• Active MESC w/ pockets
• Wafer thinning carriers
• Organic passivation materials
• Backside alignment litho carrier
MEC
• Re-flow (high temperature >270c)
• 0 – 4000v
• Full emersion wet processes
• Row bar handler
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Gel-Pac JEDEC Matrix Tray
Wafer Level Poly Bond Tape/Tapeframe
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Device Package
Handling/Shipping
JEDEC Tray integrated MEC
Multiple form factors
Higher density loading
No backside contamination
High Temperature Re-Flow
270c for 15 mins.
No backside contamination
Reusable
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Semiconductor device handling
Semiconductor back end packaging
Semiconductor device shipping
Thermo voltaic wafer level handling
Si coupon handling
CD/SEM sample handling
MEMS
Wafer dicing
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JEDEC tray form factor
• Integrated into custom frame
• 5 mm total thickness
On board battery charging/monitoring
• No need for external charger
• Charges in stacked condition (15V DC)
Lithium Ion batteries
• 0.8mm thick
• Stable current delivery
Low profile static generator
• 1.1 mm thick
Built in capacitance for extended run requirements
• Power failure safety
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High density loading
• Can handle virtually any size device form factor
• Devices can be loaded in closer proximity to one another
Reduced backside contamination
• No contamination from gels or boning agents
• No device edge damage
Long life time
• >5000 charge cycles
• 12 hr. run time in constant voltage mode
• >30 days in storage mode (option)
Low COO
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Non contact charging
• Inductive coil built in to carrier and charging base
Auto ID
• Charge cycle tracking
• WIP tracking
• Active non-contact MEC control and feedback
Standby mode
• Recharges MEC capacitor power delivery system every 10 hrs.
Status monitoring
• Non-contact carrier status (Auto ID required)
• Visual LED status output
TEG (Thermo electric generator)
• Reflow or high temp. applications
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Improves tool utilization by enabling a diverse application set
Reduced process steps (no clean)
Reusable – thousands of cycles
Improved yield
Mobile electrostatic temporary bond technology
provides a rigid contamination free handling solution
for fragile non standard substrates and small devices
www.beamservices.com
Corporate Office
6960 Koll Center Parkway, Suite 305
Pleasanton, California 94566 USA
Phone: 925-462-8800
Fax: 925-462-1818