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Cascading CMOS gates
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Goal
Designing for minimum propagation delay:
•Fixed number of stages•Optimum number of stages
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Example 1:Two cascaded inverters
S=W/L
CL/Ci=
Ip: Cp= Cin(Inv2)
Inv2Inv1
Cp= u Ci
S uS
uSCp
CLVi Vp Vo
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Transistor sizing
•two cascading stages:
• minimize propagation delay:
u
tutttt po
po2p1pp
u
po2p1p ttt
i puC Ci LC C
CiClt2t2t popop
Vi Vp(u)
Vo
Ci Cp CL
I B
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Example
Two stages are faster than one if:
CiClt2t popo
CiClt2t pop
4CiCl
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Sizing Logic Paths for Speed
Frequently, input capacitance of a logic path is constrained Logic also has to drive some capacitance Example: ALU load in an Intel’s microprocessor is 0.5pF How do we size the ALU datapath to achieve maximum speed? We have already solved this for the inverter chain – can we
generalize it for any type of logic?
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Delay in a Logic Gate
Gate delay:
d = h + p
effort delay intrinsic delay
Effort delay:
h = g f
logical effort
effective fanout = Cout/Cin
Logical effort is a function of topology, independent of sizingEffective fanout (electrical effort) is a function of load/gate size
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Optimum number of stages: buffer
Why a buffer
- long interconnection wires
- chip interfaces
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Chip interface: an example
Pentium (7 buffer)L = (10.2-19.9) nH
Cp = (2.6 - 9.7) pF
Co = (4.8 -17.1) pF
PAD PIN
Co Cp
L
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Long interconnection wires
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Single interconnection capacitance
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Total interconnection capacitance
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Example: 2 inverter stages
fCi 20 F pFCC iL 201000
ns26tns4.0t
t641000t2t
ppo
popop
Too large !
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Multiple stage Buffer
in2
2
in1
CuC
CuC
N
i
L
in1N
1N
uC
C
CuC
u
tututtt po
2
po2p1pp
pop tuNt
VG
C1 C2 CN-1 CL
Vi V1 V2 Vo1 2 3 N
u u2 uN-1
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Cascading CMOS inverters
iN
L
pop
CuC
tuNt
Minimizing tp:
)C
Cln(ett
72.2eu
)C
Cln(N
i
Lpop
opt
i
Lopt
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Propagation delay vs sizing factor u
X Inv 2 Inv N Inv
10 10 6.3 6.3
100 100 20 12.5
1000 1000 63 18.8
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Example
CMOS 1m; Ci=10fF; tp 0.2ns
CL=20pF X=2000
7 stages tp 4ns
Stage 1 2 3 4 5 6 7 Wn(m) 1.8 5.3 15.8 47.7 138.2 409.9 1210.7Wp(m) 2.8 8.4 24.9 73.8 218.3 646.21912.8
Elettronica T A.A. 2010-2011 Digital Integrated Circuits © Prentice Hall 2003Cascading CMOSCascading CMOS
Tri-State CMOS Buffer