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Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved...

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TM Freescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. May 2009 Challenges and Technologies The Human Friendly Vehicle in 2030 and Beyond Steven P. Nelson Director, Global Automotive Marketing
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Page 1: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TM

Freescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

May 2009

Challenges and TechnologiesThe Human Friendly Vehicle in 2030 and Beyond

Steven P. NelsonDirector, Global Automotive Marketing

Page 2: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 2

• Growth of Automotive Electronics

• Advanced Vehicle Architecture

• Sustainable Mobility

• Managed Infrastructure

• Summary

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Agenda

Page 3: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Global leadership inEmbedded Processing and Connectivity Solutions

#1 in RF for Wireless Infrastructure

#1 Supplier of Automotive ICs

#1 in Communications Processors

1 of every 2 new carsworldwide are

powered by Freescale Technology

Have shipped more than185 million

communications processor units

Shipped 18 Microcontrollers

every second in 2008

Nearly 7 of every 10mobile phone calls are made

using Freescale Base Station Products #2 Supplier of

Microcontrollers

Shipped 9 Industrialmicrocontrollers

every second in 2008

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Page 4: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Technology That Changes the World

►$5.2B Revenues (2008)• 30% automotive• No.1 automotive

semiconductor supplier for more than 30 years

Anti-lock Braking

Camera-basedCollision

Avoidance

Infotainment Control

Transmission Control

Radar

Instrument Cluster

Airbag Control

FlexRay™

Stability System

Intelligent Distributed Control

Engine Control

Air Conditioning

Tire Pressure Monitor

No.1 in total auto ICsNo.1 in auto microcontrollersNo.2 in MEMS sensors

Page 5: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Human Friendly Vehicle

►Fun• Performance• Traffic• Driver assistance

►Safe• Accident avoidance• Occupant protection• Reliability

►Sustainable• Low impact on the environment• Production, use and recycle

Page 6: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

The Financial Crisis is Not Changing the Fundamental Issues

• Increasing world wide population

• Increasing energy usage and shortage of oil

• Increasing World Mobility

• Too much Greenhouse Gas emissions

1950 2000

3

6

9bn

~9 bn

Gb/y30

20

10

1950 2000

~13 Gb/y

1950 2000

2.5

1.5

0.5

~2.2 bnBn

1950 2000

3

6

9bn

~9 bn

Gb/y30

20

10

~13 Gb/y

2.5

1.5

0.5

~2.2 bnBn

vehicles

World Population

Limited Resources of Crude Oil

World Mobility

Wealth and Prosperity

2050

2050

2050

2050

This is Why We Are Here

Page 7: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

The Case for Electronics

Fuel consumption 10.31/100 km 8.4/100 km-20%

Power 102 kW 160 kW+57%

Acceleration 9.2 s 7.0 s-24%

Emission ECE R15-04 EU 4-95%

Weight 1080 kg 1490 kg+38%

Aerodynamic Resistance 0.40 x 1.85 m2 0.29 x 2.15 m2-16%

Engine torque 205 Nm 250 Nm+24%

1983BMW 323i

2006BMW 325i

Source: BWM Presentation, FTF Orlando, 2008, Dr. Michael Wurtenburger

Page 8: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Automotive Electronic Content Growth

Sources: Bosch, PSA, Freescale Strategy

Ele

ctro

nic

cost

as

% o

f tot

al c

ar c

ost

1950 1960 1970 1980 1990 2000 2005 20101950 1960 1970 1980 1990 2000 2005 2030?

35%

30%

22%

15%

10%

5%2.5%

Electronic Fuel Injection

AirbagABS / ESP

Body ElectronicsMultiplexing

Advanced Driver AssistanceActive-Passive Safety

Green PowertrainRadar / Vision

TelematicsInfotainment

“80% percent of innovation is electronic”

“Impossible to comply with regulation without electronic systems”

-Automotive OEM

The Road Ahead

• Electronics are imperative to balancing increasing individual transportation and reducing fuel cost, emissions and casualties

• Consumer awareness, legislation and competitive differentiation join forces driving electronic content

50%

?

Page 9: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Automotive Semiconductors in 2030

►Process node trails ‘industry leading’by ~7 years and ~ 5 nodes

• Volume production today mostly on 180nm• Ramping 90nm, development on 65nm• Analog further behind

►Trends / Issues• Redundant/Parallel architectures• Application specific vs. generic MPU• Dedicated hardware• Power consumption at smaller nodes

The industry has traditionally found a way around technical hurdles!

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Page 10: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 10

Advanced Vehicle Architecture

Page 11: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Vehicle Architecture:Today’s Global Basic Vehicle

CAN

Proprietary Communication

Engine Management

Engine Management

Anti-lockBraking

Anti-lockBrakingAirbagAirbag

= Optional

Body ControllerBody Controller Instrument Cluster

Instrument ClusterImmobilizerImmobilizer RadioRadio

TM

Page 12: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Vehicle Architecture:2009 Architectural Leader

TM

LIN

FlexRay

CAN

Diagnostic CAN

MOST

Engine Management

Body Controller / Gateway

MotorsMotors

Integrated Chassis Management

RKE and TPMS Rx

Anti-lockBraking

Instrument Cluster

Airbag

Immobilizer

DisplaySeat modules

Door module

VideoMotors

Motors

Sunroof

HVACFlaps

TransmissionPower Steering

Fuel Pump

GlowPlug

OccupantClassification

Radio

Pass. Seat Belt Pretent.Motors

FlapsFlaps

Flaps Blower

MotorsMotors

MotorsMotors

St. column

Alarm

Amplif.

Rear moduleCooling fan

SuspensionSuspension

SuspensionSuspension

VideoVideo

Adaptive Cruise Ctrl

Driver Seat Belt Pretent.

Battery management

Active Steering

SJBLighting L

Door moduleMotorsMotors

MotorsMotors

Nav

Lighting R

Rain sensor

MotorsMotors

Motors

4x4

Temp

Park Assist

Rear Lighting

Blind Spot Detection

Wipers

Flaps

Flaps

NOX

Sensor cluster

Page 13: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Why is This important?

►Networked systems increase in capability as the number of nodes increases

►New features are enabled

►Balance complexity for the average consumer

►Risk being too ‘clever’• System operates as designed but

incorrectly programmed or operated

• Remote system programming will be required

13

• Limit top speed• Prevents deactivation safety systems• Limits audio sound level• Set a speed alert chime• Mutes the audio system if the seat belts are not buckled • Warns of a low fuel sooner

Page 14: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Aging Population

►Improved Navigation• Intelligent / Safe routing• Out of Area notification

►Driver Capability and Skill• Alertness• Safety event reporting

Lane departureOver/Under speed limit

►Medical Condition Awareness• Automatic notification• Autonomous operation in

medical emergency• Integrated medical sensing

Diagnostic Steering Wheel

14

Page 15: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 15

Sustainable Mobility

Page 16: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Efficiency Requires Improvements in Many Areas

Powertrain• Hi Precision/Direct Injection• Single/Multiple Turbo• Improved Transmissions• Start/Stop• Mild/Full Hybrid• EV

Resistance• Rolling Resistance• Light Weight Materials• Cable harnesses• Reduced Hydraulics• Increased Electrification• Active Aerodynamics

Energy Sources• Bio Diesel• Gasoline• Natural Gas• Alternative Fuels• Hydrogen• Electric

Prediction• Driver behavior• Route topology• Weather• Managed Infrastructure

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Page 17: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Prediction is a Critical Component

►Energy Management with Prediction

• Topology• Traffic Conditions• Weather / Temperature• Traffic Signals / State• Hybrid Energy Usage

All constantly transmitted to the car’s

Energy Management System

TM

Page 18: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Personal Freedom vs. Efficiency

►Daily Commute Scenario• Submitted daily commute plan• Trip logistics transmitted to the car

from central auto management• Departure time• Routing and speed• Parking slot

►Issues• Ad-Hoc driving• Biology breaks• Essence of personal

transportation

Page 19: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Technology Adoption►Future Communications Scenarios

• Car to Car• Car to Infrastructure

►Capabilities• Advanced Safety• Accident avoidance / prediction• Dynamic re-routing• Surface conditions• Road maintenance

►Desired Benefits• Driver awareness / impairment / ability• Green Driving behavior

Automobiles with limited capability must be able to co-exist with advanced platforms

Source: Car2Car Consortium

TM

Page 20: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Active Safety and Driver Interaction

►Collision Detection• Radar• Car2Car• GPS• Car2Infrastructure

►Response• Wheel shake• Audible/Visible• Braking/Turning

Issue: driver reliance on automated systems

► Returning control to the driver• Determine that danger has

passed

TM

Cars safe enough to build using less sturdy materialsCars safe enough to build using less sturdy materials

Page 21: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 21

Managed Infrastructure

Page 22: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Western Hemisphere vs. BRIC

Criteria Unit USA EU27 Japan Total or Avg. Brazil Russia India China Total or

Avg. Ratio

Population Mio hab 307 491 127 925 198 140 1166 1338 2842 3.07

GDP per capita US$ $47,000 $33,400 $34,200 $38,024 $10,100 $15,800 $2,800 $6,000 $5456 0.14

Land area Mio sq km 9.1 4.3 0.374 13.774 8.4 16.9 2.9 9.3 37.5 2.72

Total road ‘000s of km 6465 5454 1196 13115 1751 933 3316 1930 7930 0.60

Car parc Mio of cars 240 250 61 551 24 38 13 37 111 0.20

Car density # cars per 1000 hab. 782 509 480 596 123 268 11 27 39 0.07

Car density # cars per km of road 37 46 51 42 14 40 4 19 14 0.33

Source: US Central Intelligence Agency – CIA, world fact book

Developed Infrastructure for Transportation Management will be Critical

Page 23: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Managed Infrastructure

►Managed Infrastructure

• Segregation of common platforms

• Smoothing of vehicle flow

• Active lane management

Autonomous Vehicles

Vehicles Semi-trucks Bus Motorcycles Bicycles

Embedded EnergyEmbedded Energy

Page 24: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Advanced Infrastructure and Telematics

►Extension of your ‘Virtual Self’

• Car Configuration

• Personal and Business Content

• Real time interaction with the outside world

• Personal Privacy?

Page 25: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 25

• Incremental progress on multiple fronts

• Critical mass of key technologies

• Ultimate reliability of hardware and software

• Changes in consumer behavior

• Roll of government regulation

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

Summary

The processing power will be available!

Page 26: Challenges and Technologies - NXP Semiconductors · • Single/Multiple Turbo • Improved Transmissions • Start/Stop • Mild/Full Hybrid • EV Resistance • Rolling Resistance

TMFreescale™ and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc in the U.S.A and other countries. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

TM


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