China Market Outlook &
Samsung Memory Solution for QRD
HW KimPrinciple EngineerTechnical MarketingSamsung Electronics
China Makers’ Product Positioning Analysis in China
* Source : GFK 13.1H Sales DataShipment Rank
ASP
3 51 10 15 20
Chinese Brand is moving to Better Positioning from 2013
2 4
$200
$400
Previous Now
3Q 4Q 3Q 4Q
Number of Flagship Devices – using 8960 (‘12) & 8974(‘13)
China Flagship Chipset Revolution (8960 vs 8974)
Chinese S/Phone using MSM8974 is increasing fast
3GB3GB
* Source : Samsung
2011 2012 2013
China Flagship Display Size Revolution
2013
QVGA
WVGA
qHD
HD720
F.HD
WQXGA(QHD)
3.0 4.0 5.0 6.03.5 4.5 5.5
(>5.0”)
2012 (4.3~4.8”)China Flagship Trend
2014(>5.5”)
* Source : PDA DB
China Makers are Leading ‘The Big Display Revolution’
20%
40%
60%
80%
100%
2010
2011
2012
2013
2014
→ Smart F/PhoneF/Phone
Set Makers are targeting
Mid to High Segment
S/Phone Market is driven by Mid/Low segments
S/Phone Market Trend - Driven by China
No H/W differentiation
POP vs. eMCP Trend
eMCP Density Portion in ’2013 vs. ’2014 Smart Phone Solution Trend in China
�POP vs. eMCP Trend in China platform
• Over 60% of Smart phone in China will adopt eMCP solution
• LP3 eMCP will increase to 14% in 2014
ME44,
43%
ME48,
25%
MD44,
11%
ME1608,
8%
ME88, 5%
ME22, 3%
`2013
ME44,
26%
ME48,
20%
ME22,
12%
ME1608
, 8%
MV48, 7%
MV44, 7%
MD44, 5%
ME88, 4%
MV1608MD22
`2014
43%
25%13%
27%
9%
6%
23%
54%
51%
14%
6% 11% 16%
0%
50%
100%
`2012 `2013 `2014
POP
MV
ME
MD
ND/OD
Source: Samsung
MV : eMMC + LPDDR3
ME : eMMC + LPDDR2
MD : eMMC + LPDDR1
ND : NAND + LPDDR1
2013, Memory Trend - China S/P
� LPDDR2 based eMCP (ME) is main memory solution in 2013
: from ‘14, LPDDR3 based eMCP will be replaced to ME eMCP
[Memory Solution portion by I/F]
25%
9% 54%
11%
[with Qualcomm – 22%]
[with Others – 78%]
13%
33% 28%
26%
4%
42%
4%
50%
Source: Samsung
MV : eMMC + LPDDR3
ME : eMMC + LPDDR2
MD : eMMC + LPDDR1
ND : NAND + LPDDR1
Samsung Memory Solution for China
Entry
Level
Low-end
Mid-
Range
High-end
2.8/3.2 inch
3.5/4.0 inch
4.0/4.5 inch
4.3/5.0 inch
800Mhz, Single
0.8Ghz~1.2Ghz,
Single
1.0Ghz, Dual
1.7Ghz,
Dual/Quad
WXGA/HD
FWVGA/
WXGA
WVGA/
FWVGA
HVGA/WVGA
Upto 5MP
Upto 5MP
Upto 8MP
Upto 10MP
ND42
ME44
MD44
ME88 (1ch)
ME48/4 (1ch)
3.0/3.5 inch
4.0/4.5 inch
4.5/5 inch
5/5.7 inch
1.0Ghz, Single
1.2Ghz, Dual
1.4Ghz, Quad
1.7~2.3Ghz,
Quad/Octal
FHD/QHD
WXGA/FHD
HD/qHD
WVGA
Upto 5MP
Upto 8MP
Upto 12MP
Upto 13MP
ME42
ME22
ME(V)88
ME(V)44
ME(V)1608
16/32GB +
16Gb LP2 (2ch)
32GB +
2/3GB LP3 (2ch)
Samsung can support full mobile solution – eMCP/ eMMC & LPDDR2/3
MV3216 (1ch)
MV1616 (1ch)
~ 2013. 3Q 2013.4Q~
Available Discrete solution
MV solution from 2Q. ‘14
MCP Available Solution
MV : eMMC + LPDDR3
ME : eMMC + LPDDR2
MD : eMMC + LPDDR1
ND : NAND + LPDDR1� LPDDR3 based eMCP will have competitiveness in ‘14
2013 2014
eMCP Solution for Mass & ULCS Market
� LPDDR3 based MV MCP (MVP) will replace ND and ME MCP
• MV MCP will be ready for MP in late 13.Q4
eMMC Ver.
2012
eMMC 5.0eMMC 4.41 eMMC 4.5
Mass
market
MD44ME44/48
MV48/88
ME22
Smart
F/Phone
(ULCS)ND42
MV3216
MV1616ME1616
ME1608
Cost effective
High performance
MV : eMMC + LPDDR3
ME : eMMC + LPDDR2
MD : eMMC + LPDDR1
ND : NAND + LPDDR1
Summary
� MCP is still the main solution for China market
• Around 84% of China Set will use MCP in ‘14
� LPDDR3 based eMCP for Mid & High Segmentation
• “LPDDR3 based eMCP: Most Valuable Product” can maintain the same BOM
- 6 layer PCB up to 1600Mbps LPDDR3
� Samsung will provide full line-ups of eMCP
• eMMC & LPDDRx with the most advanced technology
• From “2GB eMMC + 2Gb LPDDR2” to “32GB eMMC + 16Gb LPDDR3”