J.P.Nozières, G.Prenat, B.Dieny and G.Di PendinaSpintec, UMR-8191, CEA-INAC/CNRS/UJF-Grenoble1/Grenoble-INP, Grenoble, France
CMP annual meeting, January 23rd, 2014
J.P. Nozières CMP annual meeting, January 23rd, 2014
ReRAM
Vwr1~0.9V@5nsVwr0~-0.9V Vread~0.3VVwr1~0.9V@5nsVwr0~-0.9V Vread~0.3VVwr1~0.9V@5nsVwr0~-0.9V Vread~0.3V
J.P. Nozières CMP annual meeting, January 23rd, 2014
Power consumption is strongly increasing,with a large contribution of leakage
Existing Solutions:Technology level (SOI, HiK...)Circuits level (dynamic logic...)System level (Multiple Threshold CMOS, Variable Threshold CMOS, Power Gating, Clock Gating…)
T. Kawahara, in Design and Test of Computers, Volume 28, Issue 1, 2010
Qualities of MTJs in terms of non-volatility, speed, power consumptionand cyclability allows to ease these techniques « Normally-off electronics »
J.P. Nozières CMP annual meeting, January 23rd, 2014
- MTJ used as a variable resistance- Resistance compatible with CMOS (~ kΩ)
- « End-of-back-end » process- No trade-off with logic process
-Easy / cheap to embedd - 0 to 3 add-masks- No HV required
- Low-T BE process (T<350°C)
Magneticelement level
CMOS logic level
MRAM IS AN “ABOVE-IC” PROCESS
J.P. Nozières CMP annual meeting, January 23rd, 2014
Intrinsically non-volatileHigh writing/reading speed (≈ns)Endurance (>1013 )Writing voltage compatible with CMOSRadiation Hard
Ferro 1
Ferro 2
Insulator
↑↑
↑↑↑↓ −=R
RRTMR
H
R
J.P. Nozières CMP annual meeting, January 23rd, 2014
Bit line
Word line
Transistor ON Transistor OFF
0 100 200 300 400 500 600 700 800 900 100010
-6
10-5
10-4
10-3
10-2
10-1
100
Resistance
Nor
mal
ised
Cou
nt
0 100 200 300 400 500 600 700 800 900 100010
-6
10-5
10-4
10-3
10-2
10-1
100
10-1
100
Resistance
Nor
mal
ised
Cou
nt
Rmin Rmax
>25σ
J.P. Nozières CMP annual meeting, January 23rd, 2014
Replacement of DRAM or Cache 3 or 2 by STT MRAM without changing theoverall architecture of electronic circuits
Strong decrease in static power consumption (suppressed leakage inDRAM, power gating)No more need for DRAM refreshment
Hybrid cache proposed by toshiba for ultra-low power processors
HDD SSD
File Cache
DRAM
Cache 2
Cache 1
Registers
ALUCPUFF
100ns
ms
30ns
3ns
1ns
2GHz-500ps
HDD SSD
MRAM
Cache 1
Registers
ALUCPUFF
J.P. Nozières CMP annual meeting, January 23rd, 2014
Non-volatily can gates (Flip-flop, ALU…)
HDD SSD
File Cache
DRAM
Cache 2
Cache 1
Registers
ALUCPUFF
100ns
ms
30ns
3ns
1ns
2GHz-500ps
HDD SSD
MRAM
NV-ALUNV-CPUNV-FF
T.Kawahara, IEEE Design and test of computers, 52, Janv/Feb 2011)
introduction of Non-Volatility in the logic part / memory-in-logicFurther decrease in power consumptionIncreased resilience (roll-back mechanisms…)Ultra-fast “on-fly”reconfigurabilityNew functionalities
J.P. Nozières CMP annual meeting, January 23rd, 2014
Two logic differential data (magnetic and electronic parts)Latch/Flip-Flop can operate as a standard CMOS (nominal speed)Possibility to backup the electric content into the magnetic partRestoration of data in a few 100ps (during AZ phase, SRAM acts like a senseamplifier and copies the content of the MTJs in the latch)
A set of NV FF has been designed, characterized by simulation andintegrated as standard cells in a digital design flow
W. Zhao et al.,in International Solide-State and Integrated Circuit Technology,
Shanghai, China, 2006.
N.Sakimura et al., IEEE-CICC, 2008
S. Kang et al., IEEE-NVMW, 2010
W. C. Black Jr. and B. Das, Journal of Applied Physics,87(9) :6674, May 2000.
J.P. Nozières CMP annual meeting, January 23rd, 2014
Circuit whose functionality can be changed keeping the same hardware
Composed of elementary logic functions, called LUT (Look Up Tables)programmable by an operating code stored in a configuration memory
Radiation hardness in traditional SRAM-based FPGAs :
Duplicating circuits (Triple Modular Redundancy, TMR)
Refreshing the SRAM content (“scrubbing”) to avoid errors accumulation
J.P. Nozières CMP annual meeting, January 23rd, 2014
Configuration memory based on DRAMLocal MRAM (intrinsically immune toradiations) acts as a reference todetect/correct errorsPeriodic refresh of DRAM using MRAMcontent (scrubbing)
Advantages:High density (DRAM)No redundancyLow power (non-volatile, powergating)Shadowed reconfiguration
O.Gonçalves thesis
Same approach for interconnections : a full tile was designed
J.P. Nozières CMP annual meeting, January 23rd, 2014
A 2-inputs LUT manufactured using the hybrid TowerJazz/Crocus- process130 nm CMOSMagnetic materials in Back End above CMOSTested on a digital tester at Spintec
All possible 2-inputs functions successively programmed in the MRAMand transferred to the DRAMAll the combinations of inputs tested and the corresponding outputsuccessfully checked
J.P. Nozières CMP annual meeting, January 23rd, 2014
MRAM has a unique combined set of qualities, allowing to introduce Non-Volatility at any level of the memory hierarchy
Reduce power consumptionImprove reliability (endurance, rad-hard, …)Add new functionalities
A full Process Design Kit has been developed by CMP and Spintec for theCrocus/TowerJazz 130nm technology, allowing to offer MPW service
A silicon demonstrator of a radiation hardened LUT for space applications hasbeen designed and fabricated atCrocus/TowerJazz
The circuit has been tested and is fully functional, proving the viability of thistechnology for logic applications