CHALLENGING NEW TECHNOLOGIES

www.ko-ki.co.jp

Koki no-clean LEAD FREE solder paste

This product information contains product performance assessed based on our own test procedures. Product performance

may be different according to the handling at the end-users. Please conduct through investigation to determine optimal

process condition before mass production application

#52007

Revised on Nov.27, 2014

High Reliability Lead Free Solder Paste

S3X58-M500-4

Technical Information

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

0603R

0.5mmP QFP

O₂ Reflowed

CHALLENGING NEW TECHNOLOGIES

2

Alloy Composition: Sn 3.0Ag 0.5Cu

Superior meltability allows lower solder volume to melt

perfectly with thin stencil thickness (80μm)

Low voids and anti-Head-in-Pillow formulation

Complies with Halogen Free requirements

(Br+Cl: <1500ppm; test method BS EN14582)

Features

S3X58-M500-4

Contents

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Features

CHALLENGING NEW TECHNOLOGIES

3

Specifications

*1. Flux Type: per IPC J-STD-004A

*2. Viscosity: measured with PCU-205 (Malcom ), at 25ºC-10rpm

*3. Copper Plate Corrosion: per IPC-TM-650 2.6.15

Product for Printing

Product Name S3X58-M500-4

Alloy

Alloy Composition (%) Sn 3.0Ag 0.5Cu

Melt Point (ºC) 217~219

Powder Shape Sphere

Grain Size (um) 20 – 38

Flux

Halide Content (%) 0

Flux Type*1 ROL0

Solder

Paste

Flux Content (%) 11.5±1.0

Viscosity*2 (Pa.s) 220±30

Copper Plate Corrosion*3 Passed

Tack Time > 48 hours

Shelf Life (10ºC) 6 months

S3X58-M500-4

Contents

Features

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Specifications

CHALLENGING NEW TECHNOLOGIES

4

Continuous Printability

Test condition:

・ Stencil Thickness: 0.12mm (Laser)

・ Printer: Model YVP-Xg YAMAHA Motor

・ Squeegee: Metal Squeegee (Squeegee angle - 60º)

・ Print Speed: 40 mm/sec

・ Print Condition: 24~26ºC (50~60%RH)

・ Print Test Pattern: 0.25 mm dia. CSP, 0.4mmP QFP

Even after 200 strokes, it can be seen that the solder paste is holding the shape for both circular

and rectangular pads.

S3X58-M500-4

Original 10th Print 10th print after 200

strokes

0.25mm dia.

CSP

0.4mmP QFP

Contents

Features

Specifications

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Continuous Printability

CHALLENGING NEW TECHNOLOGIES

5

Intermittent Printability

Even after pausing for 30 minutes, the solder paste is printing as good as the first print without any

stencil clogging.

S3X58-M500-4

Stop printing for 30 minutes, then resume printing. Verify the printed solder shape of 1st resumed result.

Test condition:

・Stencil Thickness: 0.12mm ( Laser)

・Squeegee: Metal Squeegee (Squeegee angle - 60º)

・Print Speed: 40mm/sec.

・Print Condition: 24~26ºC, 40~60%RH

・Print Test Pattern: 0.25 mm dia. CSP, 0.4mmP QFP

Original 1st after 30 min. pause

0.25mm dia. CSP

0.4mm PQFP

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Intermittent Printability

CHALLENGING NEW TECHNOLOGIES

6

Viscosity Change

Measure the viscosity of the solder paste after continuously rolled on the masked metal stencil.

Test condition:

・ Squeegee: Metal squeegee (Squeegee angle - 60º)

・ Squeegee Speed: 30mm/sec.

・ Squeegee travel distance: 300mm

・ Test Condition: 24~26 ºC, 40~60%RH

By suppressing reaction between solder powder and flux, viscosity change due to

continual printing is prevented.

*120 strokes/hour

S3X58-M500-4

100.0

150.0

200.0

250.0

300.0

350.0

400.0

0 500 1000 1500 2000 2500

Vis

cosity

(Pa.s

)

# of strokes

S3X58-M500-4

Contents

Features

Specifications

Continuous Printability

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Viscosity Change

CHALLENGING NEW TECHNOLOGIES

Test condition:

・ PCB: Glass epoxy FR-4

・ Surface Finish: OSP, Ni-Au, Sn

・ Stencil Thickness: 0.12mm (Laser)

・ Evaluation Pads: 0.25mm dia. CSP, 0.5mmP QFP (Sn plated)

0603R (Sn plating)

・ Aperture: 100%

・ Reflow Oven: Hot Air Reflow

・ Reflow Atmosphere: Air Atmosphere

・ Reflow Profile: See the chart below・

Solder Meltability

7

0

50

100

150

200

250

300

0 50 100 150 200

Tem

p. (º

C)

Time(sec.)

S3X58-M500-4

0603R.

0.5 mmP QFP

0.25mm dia.

CSP

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Solder Meltability

Test condition:

・ PCB: Glass epoxy FR-4

・ Surface Finish: OSP

・ Stencil Thickness: 0.12mm ,0.10mm, 0.08mm (Laser)

・ Evaluation Pads: 0.25mm dia. CSP, 0603R (Sn plated)

・ Aperture: 100%

・ Reflow oven: Hot Air Reflow

・ Reflow Atmosphere: Air Atmosphere

・ Reflow Profile: See the chart to the left

Evaluation-1: Surface Finish Evaluation-2: Stencil Thickness

CHALLENGING NEW TECHNOLOGIES

Meltability Evaluation-1: Surface Finish

8

The paste shows good wetting on different under bump metallurgies (UBM) with different components

S3X58-M500-4

Surface Finish 0.25mm dia. CSP 0603R 0.5mmP QFP

OSP

Ni-Au

Sn

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Solder Meltability

CHALLENGING NEW TECHNOLOGIES

Meltability Evaluation-2: Stencil Thickness

9

Even with low solder volumes, perfect solder joints are formed owing to newer flux formula used as compared with the

conventional Type-4 SAC305 paste.

S3X58-M500-4

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Solder Meltability

Stencil Thickness

S3X58-M500-4 Conventional Product

0.25mm dia. CSP 0603R 0.25mm dia. CSP 0603R

0.12mm

0.10mm

0.08mm

CHALLENGING NEW TECHNOLOGIES

Void Property

Test condition:

・ PCB: Glass epoxy FR-4

・ Surface Finish: OSP・Ni-Au・Sn

・ Stencil Thickness: 0.12mm (Laser)

・ Evaluation Pads: Pwtr, 6330R (Sn plating)

BGA ball - SAC305

10

Regardless of the surface finish, S3X58-M500-4 shows consistently low voids on various component

types.

S3X58-M500-4

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Void Property

Surface

finish PwTr. 6330R BGA

OSP

Ni-Au

Sn

PwTr.

6330R

BGA

・ Aperture: 100%

・ Reflow Oven: Hot air oven

・ Reflow Atmosphere: Air Atmosphere

・ Reflow Profile: Same as Solder meltability test condition・

CHALLENGING NEW TECHNOLOGIES

M500-4 behaves longer flux activation at higher temperatures maintaining high head-in-pillow resistance compared to conventional product.

Head-in-Pillow Resistance

Test method

• Test PCB: FR-4

• Surface Finish: OSP

• Metal Stencil Thickness: 0.12mm (Laser)

• Test Pad Size: 0.8 x 0.8mm

• Loaded Balls: 0.76mm ball of SAC305

• Heating Method: Solder bath at 275ºC

• Loading : 10sec.

good

NG

Drop solder ball on molten solder every 10 seconds. Ball will not

merge with solder paste when flux activation runs out.

30sec 40sec 60sec

S3X58-M500-4

Conventional

Product

Pillow defect

S3X58-M500-4

11

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

Halogen Content

Other Properties

HIP Resistance

CHALLENGING NEW TECHNOLOGIES

Halogen Content

12

M500-4 meets Halogen Free requirements (Br+Cl= below 1500ppm). Tested in accordance with BS EN14582.

Halogen Content (ppm)

Measured Element Result

F Not Detected

Cl Not Detected

Br Not Detected

Test method: BS EN14582

S3X58-M500-4

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Other Properties

Halogen Content

CHALLENGING NEW TECHNOLOGIES

13

S3X58-M500-4

Other Properties Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

Handling Guide

HIP Resistance

Halogen Content

Other Properties

Item Result Specification

Tack Time > 48 hours JIS Z 3284-3

Slump Property 0.3mm, pass JIS Z 3284-3

Solder Ball < Category 3 JIS Z 3284-4

Copper Mirror Corrosion Type L IPC-TM-650-2.3.32

Copper Plate Corrosion Pass IPC-TM-650-2.6.15

SIR Test >1E+9 IPC-TM-650-2.6.14.1

CHALLENGING NEW TECHNOLOGIES

1. Printing

1) Recommended Printing Condition

(1) Squeegee

1. Shape : Flat

2. Material : Polyurethane or metal blade

3. Angle : 60º

4. Print Pressure : Relatively low

5. Print Speed : 20~100mm/sec.

(2) Stencil

1. Thickness : 150~80m when pitch is 0.65~0.4mm

2. Manufacturing Method : Laser or Additive

3. Stencil release speed : 7.0~10.0mm/sec.

4. Clearance : 0mm

(3) Process Environment

1. Temperature : 23~27ºC

2. Humidity : 40~60%RH

3. Air Conditioning : Air draft in the printer dries up solder paste faster and deteriorates performance of

the solder paste. Control the air flow by using a shield or other method.

2. Shelf Life

0~10ºC : 6 months after production date

* How to interpret Lot Number

ex. Lot No. 4 11 27 2 Batch #: 2nd Batch

Production – Date: 27th

Production – Month: November

Production – Year: 2014

Handling Guide

14

S3X58-M500-4

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

HIP Resistance

Halogen Content

Other Properties

Handling Guide

CHALLENGING NEW TECHNOLOGIES

15

Handling Guide – Recommended Reflow Profile

S3X58-M500-4

Pre-heat Temperature/ Duration

150~190ºC/ 60~100sec.

Peak Temperature

230~250ºC

Ramp-up Speed

1.0~3.0ºC/sec.

180 240

(sec.)

Duration above 219ºC:

>30 sec.

120 60

250

100

150

50

0

Pre-heating Condition

Recommended: 150~180ºC 90sec

Upper Limit: 160~190ºC 100sec

Lower Limit: 150~175ºC 60sec

219

200

(ºC)

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

HIP Resistance

Halogen Content

Other Properties

Handling Guide

CHALLENGING NEW TECHNOLOGIES

(sec.) 180 240 120 60

200

250

100

150

50

0

(ºC)

Fast ramp-up speed may cause birding or solder balling

due to the heat slump. To improve bridging or solder

balling, alleviate the ramp-up speed.

Higher preheat temperature may

accelerate oxidation of the solder powder

and electrode, and degrade flux which

results in grainy solder fillet and dewetting.

In case of poor solder meltability, lower the

preheat temperature

Low peak temperature or short time above liquidus

temperature inhibits void release. In case of high

void ratio, raise peak temperature or extend time

above liquidus temperature (>45 seconds).

Slow temperature elevation between preheating to

melt point may accelerate oxidation of the solder

powder and electrode, and degrade flux which results

in grainy solder fillet and dewetting. In case of poor

solder meltability, increase the temperature elevation

speed.

16

(sec.)

S3X58-M500-4

Contents

Features

Specifications

Continuous Printability

Viscosity Change

Intermittent Printability

Solder Meltability

Void Property

HIP Resistance

Halogen Content

Other Properties

Handling Guide

Handling Guide – Supplement on Recommended Reflow Profile