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DEK Pro and DEK Pro XF - ASM Assembly...

Date post: 24-Feb-2018
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Process Support Products DEK Pro and DEK Pro XF ADVANCED UNDERSTENCIL CLEANING CHEMISTRIES Designed specifically for understencil cleaning, DEK Pro and DEK Pro XF improve process performance and reduce print defects. They are safer, cleaner and more environmentally friendly than IPA and traditional solvent cleaners and are compliant with all industry standards and environmental regulations. Health, Safety and the Environment n DEK Pro XF has no flash point n DEK Pro has a high flash point of 67ºC (IPA 12º C) n Safer to use, transport, store and dispose of n Manufactured using biodegradable materials n DEK Pro XF is low VOC Reduce Print Defects n No impact on thixotropic properties of the solder paste n Reduce risk of solder slump and solder balling n Residue-free after evaporation Compliant and Compatible n Compatible with all Solder Paste Materials n RoHs and Reach compliant
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Page 1: DEK Pro and DEK Pro XF - ASM Assembly Systemsinfo.dek.com/newsdek.nsf/A9E5B578DFD41E8280257BBA00451C17/$F… · Part number Description Volume Available for 431513 DEK Pro XF CleaningAgent

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DEK Pro and DEK Pro XF ADVANCED UNDERSTENCIL CLEANING CHEMISTRIES

Designed specifically for understencil cleaning, DEK Pro and DEK Pro XF improve process performance and reduce print defects.

They are safer, cleaner and more environmentally friendly than IPA and traditional solvent cleaners and are compliant with all industry standards and environmental regulations.

Health, Safety and the Environmentn DEKProXFhasnoflashpointn DEKProhasahighflashpointof67ºC (IPA12ºC)

n Safertouse,transport,storeanddisposeofn Manufacturedusingbiodegradablematerialsn DEKProXFislowVOC

Reduce Print Defectsn Noimpactonthixotropicpropertiesofthesolderpaste

n Reduceriskofsolderslumpandsolderballing

n Residue-freeafterevaporation

Compliant and Compatiblen CompatiblewithallSolderPasteMaterialsn RoHsandReachcompliant

Page 2: DEK Pro and DEK Pro XF - ASM Assembly Systemsinfo.dek.com/newsdek.nsf/A9E5B578DFD41E8280257BBA00451C17/$F… · Part number Description Volume Available for 431513 DEK Pro XF CleaningAgent

Part number Description Volume Available for431513 DEKProXFCleaningAgent 1litre VacuumPrinters431514 DEKProXFCleaningAgent 5litres VacuumPrinters

DEKPROXFPRODUCTRANGE

Property ValueFormulation SolventBasedApplication Pure(notdiluted)FlashPoint 67°CVapourPressure 3mbar@20°CBoilingRange 100–170°CpHValue NeutralHMISRatingHealth– 1–2-0Flammability–ReactivityWorkingTemperature WorkroomTemperatureStorageandTransport NoSpecialRequirements

DEKPROTECHNICALSPECIFICATIONS

Compatiblewithallsolderpastes–leaded

andlead-freeIndustryCompliantEffectiveandthoroughcleaningagentsthatcleanwithoutaffectingsolderpastefluxchemistry

DEK Pro and DEK Pro XF UNDERSTENCIL CLEANING AGENTS

DEKProXFislowVOC,makingitmore

environmentallyfriendly

Part number Description Volume Available for173483 DEKProCleaningAgent 1litre VacuumandNonVacuumPrintersandManualCleaning173485 DEKProCleaningAgent 5litres VacuumandNonVacuumPrintersandManualCleaning431093 DEKProCleaningAgent 20litres VacuumandNonVacuumPrintersandManualCleaning

DEKPROPRODUCTRANGE

Property ValueFormulation WaterBasedApplication Pure(notdiluted)FlashPoint NoneVapourPressure 20mbar@20°CBoilingRange 80–200°CpHValue NeutralHMISRatingHealth– 0–0-0Flammability–ReactivityWorkingTemperature WorkroomTemperatureStorageandTransport NoSpecialRequirements

DEKPROXFTECHNICALSPECIFICATIONS

UsingIPAinscreenprinterscancausedefects!Chemistryeffectonsolderpasteprintedoncoppersubstratewetwithcleaningagent

IPArelatedpastecollapse DEK Pro XF

Americas:ASM Assembly Systems USA Inc.Tel+8473681155Email:[email protected]

Europe:ASM Assembly Systems Northern EuropeTel+44(0)1305208328Email:[email protected]

Asia:ASM Assembly Systems Singapore PTE LTDTel+6564195867Email:[email protected]

www.dek.com


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