R2R Printed Electro-Mechanical System
2019 R2R USA
2019. 10. 09
Seung-Hyun Lee, PhDSenior ResearcherDept. Printed ElectronicsKorea Institute of Machinery and Materials, 171 Jang-Dong, Yuseong-Gu, Daejeon, 305-343, KOREA Email: [email protected]
Development of Transparent ConductiveElectrode for Flexible Electronics Applications
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mailto:[email protected]
R2R Printed Electro-Mechanical System
1. Printed Electronics @ KIMM
2019 R2R USA
Introduction of KIMM1976 Established as Korea Test Institute of Machinery and Metals1992 Renamed as Korea Institute of Machinery and Materials (KIMM)2007 Established Korea Institute of Materials Science (KIMS) as an affiliated Institute2010 Established Daegu Research Center for Medical Devices and Green Energy2013 Established Busan Laser Application Support Center
History
Mission : Performing R&D on key technology in the area of mechanical engineering: Reliability tests, evaluates machine components materials: Commercializes through technology transfer and support
Personnel : Permanent 492 (2019)
352
Research Scientists
73 67
TechnicalStaff
AdministrationStaff
146
GovernmentFunding
57
Institute Revenue
89
Chart1
Institute Revenue
Government Funding
판매
Income (M$)
95
62
Sheet1
판매
Institute Revenue95
Government Funding62
차트 데이터 범위의 크기를 조정하려면 범위의 오른쪽 아래 모서리를 끄십시오.
2019 R2R USA
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Vice President
Energy SystemsResearch Division
Nano-Convergence Mechanical Systems Research Division
Environmental SystemResearch Division
Dept. of R&D Strategy
Dept. of Planning and Budget
Dept. of Human Resource Development
Dept. of General Affairs and Accounting
President Auditor
Dept. of Audit
Board of Trustees
Advanced Manufacturing Systems Research Division
Mechanical Systems Safety Research Division
Dept. of Small and Medium Enterprise Technology Support
Administration DivisionStrategy Planning Division
Dept. of Facility Operations and Procurement
Daegu Research Center for Medical Devices and Green Energy
Dept. of Knowledge Management & PR
Dept. of R&D Management
Korea Institute of Materials Science (KIMS)
Busan Machinery Research Center forLaser Technology & Nuclear Equipment
Introduction of KIMM
2019 R2R USA
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Introduction of KIMM
KRICT (R2R ASIA 2019)
KIMM
Daeduck Science Town in Daejeon : National Lab (KIMM, KRICT, KARI,
KAERI, KRISS, ETRI, KRISO, KIER …)
2019 R2R USA
Materials EquipmentProcessing& Analysis
Functional electronic devices
- Synthesis of NPs…
- E-ink (paste)
formulation
- Fine tuning for ink
printability
- Etc.
- Reverse (offset)
- (R2R) Gravure (offset)
- (R2R) Slot-die coating
- (R2R) Imprinting
- Spin / Bar coating
- Screen printing
- (R2R) IPL
- (R2R) UV/NIR/MIR
- (R2R) Plasma treatment
- Multi-measurement system
- UV-VIS spectroscopy
- Solar simulator
Development of largearea & low cost electronics OPV / OLED / TFT / RFID / Sensors / Supercapacitor / Etc.
Dept. Printed Electronics @ KIMM
Development of R2R based printing & coating system for mass production of various flexible electronics applicationsMission
2019 R2R USA
Common characteristics
Size Large -> Large area patterningDemand High -> Mass productionPrecision medium -> Several or tens of micronPrice cheap -> Cheap process Flexibility -> Plastic or paper substrate
Roll-to-roll printing/coating system
, Gravure printing, InkJet printing, screen printing, Slot-die coating, Spray coating
R2R printing/coating system for Flexible Electronics
2015–2020 : IoT, Wearable, Flexible era.
IoT
Solar cell
Flexible diaply
Smartpackage market
Display market
Solar cell market
Dept. Printed Electronics @ KIMM
2019 R2R USA
활용분야
Touch ScreenPrinted Solar Cell
Printed RFID Tag
Printed Battery and Display
Applications
Printed Transistor
Printed Antenna
Printed Memory
Dept. Printed Electronics @ KIMM
R2R Printed Electro-Mechanical System
2. Flexible Transparent ConductiveElectrode
2019 R2R USA
Trend in TCE in Various Electronics
2019 R2R USA
Trend in TCE in Various Electronics
2019 R2R USA
Trend in TCE in Various Electronics
2019 R2R USA
Trend in TCE in Various Electronics
2019 R2R USA
14
Trend in TCE in Various Electronics
2019 R2R USA
Trend in TCE in Various Electronics
2019 R2R USA
DisplayOLED Solar cellAs is
To-be Deformable displaysDeformable lightings Flexible, large area solar cells
Based on glass (rigid) substrate / expensive material & process /
• Wearable electronics• Deformable battery+ Multi-function (Integration)
Trend in TCE in Various Electronics
http://www.solarenergybase.com/how-do-solar-panels-work/
2019 R2R USA
Trend in TCE in Various Electronics
Problem of ITO
• High Resistance (>150 Ω/sq)• Low Transparency ($80/㎡)
• Brittle, Low Flexibility
Market Needs
• Low Resistance : 89%
• Low Cost : R2R Wet Process
• High Flexibility
Need for New Flexible Transparent Conductive Electrode
: High Performance AgNW or Metal Mesh TCE by R2R Coating & Printing
Ref: Cambrios WebsiteClearOhmTM Silver Nanowire 23’’ LG V325 All-in-One PC
R2R Printed Electro-Mechanical System
3. Printed Metal Mesh TransparentConductive Electrode
2019 R2R USA
Development of R2R Gravure/Gravure-offset Printing System
96bit RFID antenna pattern with Ag nano ink
Multi R2R Printing System (Gravure, Gravure-offset, Flexo Printing)
Development of R2R Printing System
[HF Printed Antenna] [UHF Printed Antenna]
Registration control for multi-layer printing
2019 R2R USA
Plastic film
Patterned metal grid
Coated transparent electrode
Only PET film Transparent Conductive Film
Ag metal grid mesh + Conductive polymer
Line width: 7.11 um Height: 501 nm
Sheet resistance: 9.65 Ω/□Transparency: 83.69 % (550nm)
Development of R2R Printing System
2019 R2R USA
Knowledge, Innovation, Motivation, Marketability
Flexo
InkJet
Gravure-offset
GravureTFTTSP
Minimum feature size (㎛)
Thro
ughp
ut (m
2 /s)
1 10 500
10-4
10-2
1
100
100
Flat screen
Rotary screen
3um
Reverseoffset
Development of Reverse-offset Printing System
2019 R2R USA
Coating Process Roll Off Process Cliché Patterning Set Process
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Patterning area : 50mm*50mm Patterning area : 8 inch wafer
Development of Reverse-offset Printing System
2019 R2R USA
Ink Separation Interface Separation
23
Easy to control the amount of transferred ink Good surface roughness in area printing8
Development of Reverse-offset Printing System
2019 R2R USA
24
Development of Reverse-offset Printing System
2019 R2R USA
100x Microscope image
Line width ~ 1.0 ± 0.2 ㎛
Thickness : 0.2 ±0.05 ㎛
Transparency ~ 96%
Line width ~ 4.7 ㎛
Thickness ~ 0.2 ㎛
Transparency ~ 88.5% (including substrate)
Haze ~ 1.9% (including substrate)
Sheet resistance ~ 28.4 ohm/sq.
Development of Reverse-offset Printing System
2019 R2R USA
7” Printed Metal Mesh Touch Screen SensorChoi. et. al., Journal of Information Display, 16(1), 37-41 (2015)
Development of Reverse-offset Printing System
Roughnessof electrodeRa=6 nm
2019 R2R USA
27
ITO TCE : PCE ~2.76%Ag mesh TCE: PCE ~ 2.82%
Transparency : 85~86% (including substrate)
Sheet resistance : 20 ohm/sq.
Development of Reverse-offset Printing System
2019 R2R USA
• Imprinted disposable cliché using UV imprinting
- Cliché : PET - Printed Sample (LW= 3.6 ~ 3.9 ㎛)
Glass TCE
Printed Metal mesh
Technology Transferred to PNT Co.
Development of Reverse-offset Printing System
2019 R2R USA
Development of Roll-to-roll Imprinting Process & System
R2R UV Micro/Nano Imprinting System for Optical Film
R2R Thermal Imprinting System for TCE(Technology Transferred to Duckin Co.)
Development of R2R Printing System & Applications
R2R Nanoimprinting System
(Technology Transferred to Goldmax Co., IPEN Co.)
2019 R2R USA
Comparison between Positive & Negative TCE
(Technology Transferred to DCN Co.)
Development of R2R Imprinting System
2019 R2R USA
ITO-free TCF by Thermal Imprinting for OPV
Development of R2R Printing System & Applications
J.-S. Yu et al. Solar Energy Materials & Solar Cells, Vol. 109, 142-147, 2013(Collaborative research with Dr. Krebin RISO-DTU)
R2R Printed Electro-Mechanical System
4. Metal Nanowire TransparentConductive Electrode
2019 R2R USA
Development of AgNW Slot-die Coating Process
Development of R2R Coating System & Applications
Schematic of Slot-die Coating Process
2019 R2R USA
Development of AgNW Slot-die Coating Process
Development of R2R Coating System & Applications
Conductivity is not constatnt with film thickness: Transition (Network => Bulk)
S. De et al. ACS Nano, 2009
2019 R2R USA
Development of AgNW Slot-die Coating System
Development of R2R Coating System & Applications
Sheet Resistance UniformityAverage : 25.69Ω/□Standard Deviation : 0.72Ω/□, ±2.8%
Technology Transferred to IPEN Co.
2019 R2R USA
Photonic sintering
Ref. 1 Chem. Mater. 2015, 27, 7788Ref. 2 Adv. Mater. 2014, 26, 5808Ref. 3 Nanoscale, 2014, 6, 5980
- Rs and T% could be controlled by adjusting NW ink concentration
- Higher performance compared to other previous reports
Ref. 4 Nano Lett., 2014, 14, 6298Ref. 5 Adv. Energy Mater. 2014, 4, 1300737Ref. 6 J. Am. Chem. Soc. 2012, 134, 14283
Development of Photonic Sintering Process
Novacentrix PulseForge 1300
Development of CuNW TCE by Intense Pulsed Light
Woo K., Small, 14, 1800676, (2018), Front cover
2019 R2R USA
Selective Light Induced Patterning (SLIP) process
NWs on non-irradiated area was
clearly removed out by wiping
Development of Photonic Sintering Process
2019 R2R USA
Surface roughness Adhesion property
Oxidation stability Mechanical stability
Better oxidation stability due the reduction of surface area exposed to air
1.08 fold increase
Nanoscale, 2016, 8, 8995
Development of Photonic Sintering Process
2019 R2R USA
Collaboration with DGIST (Prof. Lee Y. G.)
Flexible TCE for OLED Flexible Transparent Heater
Development of Photonic Sintering Process
2019 R2R USA
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Kwangyoung Kim (Ph.D. )Printing System Design &
Manufacturing [email protected]
Jeongdai Jo (Ph.D.)Printing/ Coating/ Patterning Process
Taikmin Lee (Ph.D.)Printing System Design &
Manufacturing
Inyoung Kim (Ph.D.)Printing Materials & Device Fabrication
Sin Kwon (Ph.D.) Printing System Design &
Manufacturing [email protected]
Dongwoo Kang (Ph.D.)Printing System Design &
Manufacturing [email protected]
Yunseok Jang (Ph.D.)Printing Materials & Device Fabrication
Seunghyun Lee (Ph.D.)R2R Printing & Coating System
Kyoohee Woo (Ph.D.)Printing Materials & Device Fabrication
Hyunchang Kim (Ph.D.)Printing system design & integration
Jaeyoung Seok (Ph.D.)Printing Processes & Device
Fabrication
Pyoungwon Park
(Senior technologist)Printing Equipment & Part Design
Hyuntae Kim (Technologist)Printing System Control &
Manufacturing
Jaeyoung Kim (Ph.D.)R2R Printing Control Design & Data
Signal Processing
Key Memebers
2019 R2R USA
Seung-Hyun Lee, PhDSenior Researcher
Korea Institute of Machinery and Materials, 171 Jang-Dong, Yuseong-Gu, Daejeon, KOREA 305-343
Email: [email protected]
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