January 2006

B. Gaucher IBM ResearchSlide 1

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

Submission Title: [Completely Integrated 60 GHz ISM Band Front End Chip Set and Test Results ]Date Submitted: [9 January, 2006]Source: [Brian Gaucher] Company [IBM Research]Address [1101 Kitchawan Ave Yorktown Heights, NY 10598]Voice:[914-945-2596], FAX: [914-945-4134], E-Mail: [bgaucher@us.ibm.com]

Re: []

Abstract: [Overview of Integrated 60 GHz Front End Chip Set and Test Results]

Purpose: [Contribution for millimeter-wave study group ]

Notice: This document has been prepared to assist the IEEE P802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein.Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P802.15.

January, 2006

January 2006

B. Gaucher IBM ResearchSlide 2

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Completely Integrated 60 GHz ISM Band Front End Chip Set and Test Results

IBM Research mmWave Design Team

January 2006

B. Gaucher IBM ResearchSlide 3

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Our Vision for Silicon mmWave ICs

SiGe-Chip

Alum

ina

I/Q

I/Q

PLL

QFN-Package

Standard plastic

package Mold

Package Pin

C4-Ball's

Tx/Rx Flip-Antenna

Wirebond Pad

Wirebond

Filter Structure

90PA

MIX

MIX

Q-signal

I-signal

VCO

90

MIX

MIX

LNA

I-signal

Q-signal

VCO

Signal Propagation

Discrete GaAs 60-GHz Radio

Integrated SiGe 60-GHz Radio

Bring “mmWave to the masses”

January 2006

B. Gaucher IBM ResearchSlide 4

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

High-Speed Wireless Need Driven by Multiple Markets

• Consumer electronics– Replacement for 1394 Fire Wire and other

cables • Potential for 150M consumer electronic devices, such as TVs, home

automation camera/camcorder, game consoles, music players etc. by 2009.

• Streaming High Definition Video• Computer & peripherals

– Replacement for USB, monitor cable, parallel ports and other cables – • Potential for 100M computers and peripherals by 2009.

• Other application needs outside home– Healthcare, SOHO, industrial control,

wireless sensor network, smartphones, last mile access, positioning & measurements (asset management), radar…

Consumer electronic applications

Computer applications

Low power, short range 100-500Mbps link

HD Video 1.5 Gbps

January 2006

B. Gaucher IBM ResearchSlide 5

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Redefining Home Networks with mmWaveBS/CS/Digital Terrestrial Analog Signal

Digitally Stored TV Program (Compressed)

Digitally Stored TV Program (Compressed)

HD Uncompressed Digital Stream

HDD Home Server / Router

HD-DVD Player

TV Monitor

TV Monitor

PC

Base Stationon the ceiling& Backbone

Multiple Data Streams

Ultra High-Speed Stream

No penetration through walls(High Security)

Freedom to locate anywhere

Digital Media Adaptor

Internet

PC

Internet Access

Camcorder

January 2006

B. Gaucher IBM ResearchSlide 6

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

60-GHz Receiver in SiGe BiCMOS 8HPIntegration Level

• 342 NPNs

• 1200 FETs

• 77 transmission lines

• 15 inductors

• 715 resistors

• 189 MIMs

• 53 pads

÷2

x3

PLL

PFD CP LPF

÷ 32

IF Amp

IF Mixer BB Amp

I(0 - 500MHz)

Q(0 - 500MHz)

Image-reject LNA

17.6G

Input59-64 GHz

Ref. CLK0.5-0.6 GHz

52.8G

9.2G8.8G

0.4G

62G

Size: 3.4 x 1.6 mm2

Highest integration level for millimeter-wave circuits

Complexity approaching that seen at 5 GHz.

January 2006

B. Gaucher IBM ResearchSlide 7

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Gain and Noise Figure of 60-GHz Receiver

1

6

11

16

21

26

31

36

41

46

59 60 61 62 63 64

Frequency (GHz)

Ga

in a

nd

No

ise

Fig

ure

(d

B)

RX

RX with PLL

RX with PLL

RX

Noise Figure ~ 6 dB

Gain ~ 35-40 dB

60-GHz Receiver: Measured Results

Target Meas.

Power Gain (dB) ~40 35-40

Noise Figure (dB) < 6 5-6.5

Image Rejection (dB)

> 20 > 30

Phase Noise (dBc/Hz)

-88, 1M

< -120 floor

-85, 1M

< -130 floor

iCP1dB (dBm) -31 -36

S11, RF (dB) < -15 -15

I/Q Balance (deg)

+/- 2 4.2

I/Q Amp Balance (dB)

< 1 < 1

Power Diss (mW) -- 525

Summary

First RF-to-baseband 60G silicon receiver built, to our knowledge.

Receiver hits nearly all performance targets.

Achieves the highest integration level for mmWave.

January 2006

B. Gaucher IBM ResearchSlide 8

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

60-GHz Transmitter in SiGe BiCMOS 8HP

Integration Level• 359 NPNs• 1040 FETs • 157 transmission

lines• 13 inductors• 521 resistors• 270 MIMs• 60 pads

Size: 4 x 1.5 mm2

÷2

x3

PLL

PFD CP LPF

÷ 32

IF Amp

IF Mixer

I(0 - 500MHz)

Q(0 - 500MHz)

Image-rejectDriver

17.6G

Output59-64 GHz

Ref. CLK0.5-0.6 GHz

52.8G

9.2G8.8G

0.4GPA

62G

High integration level is unique for millimeter-wave.

Complexity approaching that seen in early commercial implementation at 5 GHz.

January 2006

B. Gaucher IBM ResearchSlide 9

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

60-GHz Transmitter Measured Results

Target Meas.

1-dB Compression (dBm)

10 10-12

Saturated Pwr. (dBm)

15 16-18

Conversion Gain (dB)

45 34-37

3XLO Spur (dBm)(50-55 GHz)

< -25 < -25

Carrier Suppr. (dB) 25-30 >21-25

Image Suppr. (dB) >20~25

(from cascaded driver-PA)

Power Consumption (at low power

levels)-- 800 mW

Efficiency of PA 10% 10%

Summary

First 60-GHz baseband-to-RF 60G silicon transmitter built, to our knowledge.

Transmitter hits nearly all performance targets.

Again, highest integration level for mmWave.

oCP1dB = +12 dBm

Psat = 16 dBm

Gain = 33 dB

January 2006

B. Gaucher IBM ResearchSlide 10

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Measured Performance of SiGe Chip Set

60-GHz Receiver Measurements 60-GHz Transmitter Measurements

Gain 35-40 dB Gain 34-37 dB

Noise Figure 5-6.7 dB P1dB (out) 10-12 dBm

S11, RF in -15 dB Psat 16-17 dBm

Image Rejection > 30 dB Image Rejection 20-30 dB

P1dB (in) -36 dBm PAE of PA 6-10%

IIP3 -30 dBm Carrier Suppression 21-25 dB

3xLO leakage, RF in

< -77 dBm at 52-55 GHz 3xLO Spur -25 to -20 dBm

Phase Noise (1MHz), tripled

-85 to -90 dBc/Hz< -130 dBc/Hz floor

Phase Noise, (1MHz) tripled

-85 to -90 dBc/Hz< -130 dBc/Hz

floor

I/Q Balance0-4 degrees

<1dBI/Q Balance

±2 deg ±0.5 dB

Power Dissipation

195 mA, 2.7 V Power Dissipation190 mA, 2.7 V72 mA, 4.0 V

January 2006

B. Gaucher IBM ResearchSlide 11

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Chip-on-Board Package for TX/RX Chips

• *World’s First Functional 60GHz “Chip-on-board” Package!

• All wire bonds• Standard FR4 board

Tx or Rx Chip

Folded Dipole

Antenna

~ 8 mm

ReflectorFlip-ChipWire-Bond

Tx or Rx Board

encapsulate

*More detail available under CDA

January 2006

B. Gaucher IBM ResearchSlide 12

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

60GHz Radio Test System using Software Baseband

VGA

TxIC

÷2

x3

IF Amp

IF Mixer BB Amp

I

Q

Image-rejectLNA

Input59-64 GHz

Gen1 Receiver IC*

÷2

x3

IF Amp

IF Mixer

Image-rejectDriver

Output59-64 GHz

PA

Gen1 Transmitter IC*

PFDCPLPF

÷ 32

PLL18G

54G

9G 9G

0G

63G

BB Amp

I

Q

8b A/D

8b A/D

Modulation :

DQPSK for 1Gb/s Directional Antennas

OFDM for 1Gb/s Omni Antennas

TxIC PFDCPLPF

÷ 32

PLL18G

Signal

Generator

12b D/A

12b D/A

1Gs/s

1Gs/s

PCI A/D Card

PC

Memory

Buffer

PC captures

sample buffer

and demodulates

in non real-time

ARB loops

Real-time

Modulation frame

To radio

~500MHz

Data/Modulation Source

Demodulation/Data Recovery

*More detail available under CDA

January 2006

B. Gaucher IBM ResearchSlide 13

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

OFDM Link Demonstration using 60G Rx/Tx with Antennas

• Rx/Tx modules used with software radio with 700Ms/s ADC. QPSK-OFDM modulation used.

• Error-free operation demonstrated at 630Mbps at 10m.

• Link budget corroborated, with 7dB NF, 10dBm output power, 2dB package loss in Rx/Tx, 7dBi antenna gain and 88dB path loss for 10m.

PCA/D

ARB

630MbpsQPSK-OFDM

7dBi pk.gain

10m reference separation

630Mbps Receivedconstellation

60GHz Tx Module 60GHz Rx Module

Tx Pkgloss

(-2dB)

AntennaGain(7dBi)

ChannelLoss 10m(-88dB)

kTBF = -80dBm (500MHz BW)C/N = 11dB

I

Q

IQ Level-15dBm

+9

dB

m

+7

dB

m

+1

4d

Bm

-74

dB

m

-67

dB

m

-69

dB

m

AntennaGain(7dBi)

Pkgloss

(-2dB)

630Mbps 60-GHz OFDM Link

Rx-Gain +35dBNF = 7dB

r = 20

January 2006

B. Gaucher IBM ResearchSlide 14

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

ASK Link Demonstration using 60G Rx/Tx with Antennas

• On-off keying (OOK) used to enable a simple modulation to be used without A/D converters.

• Same 60G Rx/Tx modules used, demonstrating good data eyes to 1Gbps. • Rough setup with ARB and scope. Moving towards PRBS generator to drive bipolar

encoder on Tx side, then will add clock and data recovery on the Rx side. This will allow true BER measurements to be made. ,

• This scheme addresses Multi Gb/s point to point links. • 8dBi antennas suitable for proto-typing, but >10m coverage will require waveguide-

launch modules with directional antennas.

60 GHzRx with Antenna

I+

I-

Q+

Q-

Detector

Detector

Σ

Am

pA

mp

Measured eye-diagram of rectified I and Q at 1Gbps, across 1m wireless link

60 GHzTx with

Antenna

I+

I-

Q+

Q-

diff bipolar data

ARBGen.

1m reference sep.

1Gbps 60-GHz ASK Link

January 2006

B. Gaucher IBM ResearchSlide 15

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

60-GHz Chipset Road MapEval Boards

Inte

gra

tio

n F

un

ctio

nal

ity

2004 2005

First Gen

Aug, 2005

Bare Die

Transmitter

Receiver

Second Gen

2006

Sept 2005

Eval Board

Third Gen

Bare Die

Transmitter

Receiver

Aug, 2006

Building Blocks

Feb. 2004

Individual Comp’ts

LNA

PA

Eval Boards

Packaged Die

Transceiver

Mar, 2006

2007

CMOS Building Blocks

2006-2008

Individual Comp’ts

LNA

PA

Addresses:AM-OOK, FM-FSKMod and Demod

January 2006

B. Gaucher IBM ResearchSlide 16

doc.: IEEE 802.15-15-06-0003-00-003c

Submission

Summary

• Fully integrated, “baseband-to-millimeter wave” Gbps SiGe radio chip sets are a reality

• SiGe integration also makes possible the use of standard IC package solutions

• Our Gen1 chipset consists of a complete I/Q receiver and transmitter – Baseband to/from 60GHz VCO/PLL, Filters, Mixers… – Capable of analog Up/Dn conversion or high-speed I/Q modulation

• Gen1 chips are currently:– Packaged on a PCB eval board and includes an integral 7 dBi antenna,

capable of Gbps rates over 10M, when drive by appropriate baseband.– For directional links, we also have a waveguide interface for the chips to

be available in 2Q06.• Gen2 chips are in test with eval boards expected in 2Q06. They

will have both a PCB with integral antenna and waveguide interface.

SiGe-Chip

Alum

ina

I/Q

I/Q

PLL

QFN-Package

Standard plastic

package Mold

Package Pin

C4-Ball's

Tx/Rx Flip-Antenna

Wirebond Pad

Wirebond

Filter Structure

90PA

MIX

MIX

Q-signal

I-signal

VCO

90

MIX

MIX

LNA

I-signal

Q-signal

VCO

Signal Propagation

Low cost package2Q06

Chip on board-Today

WaveguideInterface 2Q06

We gratefully acknowledge partial funding for this effort under DARPA contract N66001-05-C-8013