1

DPR for KS-3-- Development

Wistron Corporation

Jeffrey FL Wang

08/07 2006

2

DPR for KS-3 – Development Eng. Status

1. Development Schedule2. Spec. Overview3. WW Agency Approval Plan 4. RoHS Compliant Plan5. New FRU/ CRU plan6. Supplier selection plan 7. EC Release Plan8. Quality Development Process

3

1. Development Schedule

4

Development Schedule

DV1 Activity 09/19- 10/20/2006

DV1 Exit 11/06/2006

FVT Activity 10/31- 12/01/2006

FVT Exit 12/04/2006

DV2 Activity 11/28- 12/29/2006

DV2 Exit 1/22/2007

SW DV2 Activity 12/05- 1/05/2007

SW DV2 Exit 1/15/2007

SIT Activity 1/23- 3/02/2007

SIT Exit 3/19/2007

SVT Activity 4/02- 4/23/2007

SVT Exit 4/27/2007

SOVP 5/09/2007

Ship Support 5/21/2007

ANN 5/22/2007

GA 5/22/2007

Notes: DV1/DV2/SIT/SVT planar assembly and box build at WKS. SOVP date depends on Merom for Santa Rosa processor launch date.

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2. Specification Overview

6

Kabuki / Sumo 3.0 Offering Definition

June 26, 2006

Time: SOVP: 4/09/07

Announce & GA: 4/24/07Ship Support: 4/23/07

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Sumo 3.0 – X61 Offering Definition (Concept Exit)System is...

Form Factor 12.1" XGA TFT (150 nit) – Standard (275g) only 3.15lbs; 10.5” x 8.3” x .96-1.36” 2.5” System SATA HDDs; Customer upgradeable 1 Spindle HDD ThinkLight (white ) 4 cell cylindrical or 8 cell cylindrical LiIon Battery NV, 2.5” HF, Standard Display Battery Life: 4.4 Hr (4cell cyl); 8.8 hr (8 cell cyl) 2nd LiIon Battery support (external battery pack on system or one bay battery option for UltraBase Dock)

ISO Standard full size keyboard (18.5mm pitch) Trackpoint IV push-to-select ; In-line scroll/mag 1 ThinkPad key + 3 audio keys; Mono Speaker in system (0.5 watt) Integrated Microphone Integrated dual band+ wireless antenna Kensington lock Fingerprint Reader (select models) Integrated WWAN and WWAN-ready (select models) 802.11 n(abg) MIMO wireless with 2x2(entry), 2x3 capability Optional K/S Ultrabase (Slice) (for optional 2nd spindle) 65w AC Adapter

Planar Intel Crestline GM / ICH8M & ICH8M Enhanced core chipset with Integrated Graphics

GEN4fx(DX10) graphics with up to 256MB memory Intel Merom with EMT64T processors (dual core 800 MHz FSB) DDR2-667 PC2 5300 memory 2 x SO-DIMM /4 GB max 2 x Mini-PCIe Slot (WLAN,WAN ) 1 x Cardbus/ ExpressCard Universal slot (with support for ExpressCard 34mm via USB interface adapter card)

Gigabit Ethernet LOM (all models) 3 x USB 2.0 IEEE 1394 1 x SD slot Serial ATA Soft audio / Microphone TCG Compliant Secure Chip Crypto-3 (all models) Wireless Upgradeable (all models) V92 designed Modem Bluetooth in display bezel (select models) Accelerometer / Shock Mounted Hard Drive

Open Bay Odyssey Building Blocks(Tested thru SIT)

HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB/7200 rpm Memory: 512MB, 1GB, 2GBMiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n, Intel Kedron n(abg)

and Kedron abg (with b/g sku’s for select countries only) Battery: 4 cell (cyl), 8 cell(cyl) Operating Systems: XP Pro, Vista

IBM Confidential

System is not...

Form Factor Two spindle 1.8” HDD’s Integrated touchpad Slice dock to Port Replicator or Docking

Planar 10/100 Ethernet Mini PCI slot DVI on System/Slice Discrete Graphics 128MB memory TV Out (S-Video) LV/ULV processors Infrared No TAA Offering

OS Support•See SW Support OD

PortsPS/2 Port (System)FDD port connector SPDIF (AC3 audio)Ultrabay2000NEST

CommunicationsCalexico bCalexico 2 b/g, a/b/gClymer b/gBartlett a/b/gMDC I, IIBMDC II, IIIUWB

Ports on System/ Slice 7 x USB 2.0 ports (3 system, 4 slice) 1 x T2 PCMCIA CardBus/ USB Based ExpressCard (System) IEEE 1394 (system) RJ11, RJ45 Parallel, Serial (Slice) VGA (Both) Headphone-out, Mic-in (Both) Slice connector (System) Warm/Hot swap bay (Slice) Keylock/cable lock slot (Slice) PATA bay support (Slice) ComplianceTCG Compliant Secure Chip Crypto-3 (Intel compliance)EnergyStar RoHS

Red – Work ItemsBlue – New

System Building Blocks (Tested thru SIT)

CPU: Intel Merom T7300, T7000, and T5500P NV CPU’s Panel: 12.1” XGA TFT Standard (275g) HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB /7200 rpmMemory: 256MB, 512MB, 1GB, 2GBMiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel Kedron

n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg, MiniPCIe: Verizon(EV-DOrevA), Vodafone(HSDPA 3.6), Cingular, T-Mobile, TelusCDC: Modem, BluetoothBattery: 4 cell(c), 8 cell (c)Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate 64)

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Kabuki 3.0 – X61s Offering Definition (Concept Exit)System is...

Form Factor 12.1" XGA TFT (150 nit) – Standard (275g) & TMD (205g) select models, or LED backlit display (185 g)

2.6lbs; 10.5” x 8.3” x .083 - 1.1” 2.5” SATA HDDs; (SATA are Customer upgradeable) 1 Spindle (HDD) ThinkLight (white ) 4 cell prismatic, 4 cell cylindrical, 8 cell cylindrical LiIon Battery. Battery life with ULV CPU, TMD or LED Display: 3.3 Hr (4cell pris); 4.4 hr (4cell cyl); 8.8 hr (8 cell cylindrical) 2nd LiIon Battery support (external battery pack on system or one bay battery option for UltraBase Dock)

ISO Standard full size keyboard (18.5mm pitch) Trackpoint IV push-to-select ; In-line scroll/mag 1 ThinkPad key + 3 audio keys; Mono Speaker in system (0.5watt) Integrated Microphone Integrated dual band+ wireless antenna Kensington lock Fingerprint Reader (select models) 802.11 n(abg) MIMO wireless with 2x2, 2x3 capability Integrated wireless WAN and WAN-ready (select models) Optional K/S Ultrabase (Slice) (for optional 2nd spindle) 65w AC Adapter

Planar Intel Crestline GM / ICH8M & ICH8M Enhanced core chipset with Integrated Graphics for LV

Intel Calistoga GM/ ICH7 core chipset with Integrated Graphics f/ULV GEN4fx(DX10) graphics Intel Merom with EMT64T processors (dual core LV(800\ MHz FSB, 15W) and single core ULV (533 MHz FSB )

DDR2-667 PC2 5300 2 x SO-DIMM /4 GB max 2 x Mini-PCIe Slot (WLAN,WAN)1 x Cardbus/ ExpressCard Universal slot (with support for ExpressCard 34mm via USB interface adapter card)

Gigabit Ethernet LOM (all models) 3 x USB 2.0 IEEE 1394 1 x SD slot Soft audio / Microphone TCG Compliant Secure Chip Crypto-3 (all models) Wireless Upgradeable (all models) V92 designed Modem Bluetooth in display bezel (select models) Accelerometer / Shock Mounted Hard Drive

System Building Blocks (Tested thru SIT)

CPU: Intel Merom L7500 and L7300, Yonah U1400 ULV Panel: 12.1” XGA TFT – Standard & TMDHDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2.5” SATA) 60, 100 GB 7200 (2.5” SATA) WWMemory: 256MB, 512MB, 1GB, 2GBMiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel

Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only) , Golan abg

MiniPCIe: Verizon(EV-DO revA), Vodafone(HSDPA 3.6), Cingular, T-Mobile, Telus

CDC: Modem, BluetoothBattery: 4 cell(prismatic), 4 cell (cyl),8 cell (cyl)Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate

64)

Open Bay Odyssey Building Blocks(Tested thru SIT)

HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2.5” SATA)Memory: 512MB, 1GB, 2GBMiniPCIe:ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel

Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg

Battery: 4 cell(pris), 4 cell (cyl),8 cell (cyl)Operating Systems: XP Pro, VistaDock/Slice: X6 UltraBase (slice)

System is not...

Form FactorTwo spindle 1.8” HDD’sIntegrated touchpad Slice dock to Port Replicator or Docking

Planar 10/100 Ethernet Mini PCI slot DVI on System/Slice Discrete Graphics 128MB memory TV Out (S-Video) NV processors Infrared No TAA offering

OS Support•See SW Support OD

PortsPS/2 Port (System)FDD port connector SPDIF (AC3 audio)Ultrabay2000NEST

CommunicationsCalexico bCalexico-2 b/g, a/b/gClymer b/gBartlett a/b/gMDC I, IIBMDC II, IIIUWB

Ports on System/ Slice 7 x USB 2.0 ports (3 system, 4 slice) 1 x T2 PCMCIA CardBus/USB based ExpressCard (System) IEEE 1394 (system/) RJ11, RJ45 Parallel, Serial (Slice) VGA (Both) Headphone, Mic (Both) Slice connector (System) Warm/Hot swap bay (Slice) Keylock/cable lock slot (Slice) PATA bay support (Slice) ComplianceTCG Compliant Secure Chip Crypto-3 (all models)EnergyStar RoHS

Red – Work Items

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Miscellaneous Options

+

Mandatory Select

Additional Features

Options (Easy Access Elements)

+

Expansion Memory(256, 512, 1024 or 2048MB

Base Memory)Plus(1 x SODIMM socket)

0 256 MB512 MB1024 MB2048 MB

4 GB Max Memory

System HDD (2.5”)40 GB/540060 GB/540080 GB/5400100 GB/5400120 GB/5400160 GB/5400100 GB/7200 60 GB/7200

OS + Drivers + UtilitiesWin XP Pro (SP2)Vista

Standard Feature Elements

12.1” XGA TFTGB EthernetUtraConnect Wireless

AntennaSecure Digital Slot3 x USB 2.0AC Adapter (65W)APS 1394

See options plan

BatteryLi-ion 4 cell CylindricalLi-Ion 8 cell Cylindrical

Customer Feature Choice(CFC’s)

Ethernet (GB)

Wireless•Wireless LAN Ready (Yes)•Wireless WAN (Yes/No)•Bluetooth (Yes/No)

SecurityESS Secure Chip (Yes)Fingerprint Reader (Yes/No)

CFC Memory Choices

Lenovo Confidential

Accelerometer on every systemModem on every systemSecure Chip on every system

SW Applications•See Software Plan

Sumo-3 X61 – MTs 7673/7674 -Easy Access Elements (At Announce)

+

Planar, Processor, 1394, SDMerom T5500P NV DC ($195)Merom T7000 NV ($225)Merom T7300 NV ($275)

Mandatory Select Filter Item

All with 12.1” TFTTBD see initial Shell Plan

Derived Shells

=

Optional Select

Mini PCIeWireless Upgradeable802.11 abg (Golan)802.11 a/b/g (Kedron)802.11 a/b/g (ThinkPad)Intel Kedron n (abg)ThinkPad n (abg)

Warranty / Service Offerings3 year depot (GAV/EZA)3 year on-site (GAV/EZA)4 year depot (MTM only)4 year on-site (MTM only)1yr Express (GAV only)3yr Express (GAV only)

Red – Work Items

Docking•X6 UltraBase •UB6 with DVD•UB6 with Combo•UB6 with Multi-Burner

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Miscellaneous Options

+

Mandatory Select

Additional Features

Options (Easy Access Elements)

+

OS + Drivers + UtilitiesWin XP Pro (SP2)Vista

Warranty / Service Offerings1702 - 3 yr depot (GAV/EZA)1703 - 3 yr on-site (GAV/EZA4 year depot (MTM only)4 year on-site (MTM only)1yr Express (GAV only)3yr Express (GAV only)

Standard Feature Elements

12.1” XGA TFTGB EthernetUtraConnect Wireless

Antenna (x3)Secure Digital Slot3 x USB 2.0AC Adapter (65W)APS1394

See options plan

Customer Feature Choice(CFC’s)

Ethernet (GB)

Wireless•Wireless LAN Ready (Yes)•Wireless WAN (Yes/No))•Bluetooth (Yes/No)

SecurityESS Secure Chip (Yes)Fingerprint Reader(Yes/No))

CFC Memory Choices

Lenovo Confidential

Accelerometer on every systemModem on every systemSecure Chip on every system

SW Applications•See Software Plan

Kabuki-3 X61s -MTs 7666/7667 - Easy Access Elements (At Announce)

+

Planar, Processor, 1394, SDYonah U1400 ULV SC ($225)Merom L7300 ,DC, GB ($265)Merom L7500 DC, GB ($295)

Mandatory Select Filter Item

All with 12.1” TFTTBD see initial Shell Plan

Derived Shells

=

Optional Select

Docking•X6 UltraBase •UB6 with DVD•UB6 with Combo•UB6 with Multi-Burner

System HDD (1.8” PATA) (Japan only Now removed)

30 GB/420040 GB/420060 GB/4200

System HDD (2.5” SATA)40 GB/540060 GB/540080 GB/5400100 GB/5400120 GB/5400160 GB/5400100 GB/7200 60 GB/7200

BatteryLi-Ion 4 cell PrismaticLi-ion 4 cell CylindricalLi-Ion 8 cell Cylindrical

Mini PCIeWireless Upgradeable802.11 a/b/g (Kedron)802.11 a/b/g (ThinkPad)Intel Kedron nThinkPad n

Expansion Memory(256, 512, 1024 or 2048MB

Base Memory)Plus(1 x SODIMM socket)

0 256 MB512 MB1024 MB2048 MB

4 GB Max Memory

Red – Work Items

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SPEC Overview ( CPU/ Intel chipset comparison)

Seqment

ProcessorNumber

ProcessorGeneration

ClockSpeed(GHz)

FrontSideBus(MHz)

L2Cache

IntelChipset(NB)

IntelChipset(SB)

T7700 2.4 800 4MT7500 2.2 800 4MT7300 (*) 2 800 4MT7000 (*) 1.8 800 2MT5500P (*) 1.66 667 2ML7500 (*) 1.6 800 4ML7300 (*) 1.4 800 4MT7600 2.33 667 4MT7400 2.16 667 4MT7200 (*) 2 667 4MT5600 (*) 1.83 667 2MT5500 1.66 667 2ML7400 1.5 667 4ML7200 1.33 667 4M

Ultra LowVpltage

U7500 1.06 533 2M

ICH8MMerom 65nm(Santa Rosa)

Merom 65nm(Napa Refresh)

StandardVoltage

LowVoltage

ICH7M

StandardVoltage

LowVoltage

KS2

KS3

CalistogaIntel945PM/GM

CrestlineIntel

•Remark which “ ” is defined in KS2/ KS3 notes.

•KS2 support Yonah & Merom Processor.

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SPEC Overview 1 (Basic function) KS2 KS3

Processor Yonah-2M NV/LV/ULV

Merom NV/LV, 4MB / 2MB cache

667/533 MHz FSB

Merom for Santa Rosa

SV/LV, 4MB / 2MB cache

800 / 667 MHz FSB

Chipset Calistoga- GM/ ICH7M Crestline/ ICH8M

Memory 2 DIMM Slot (Max: 4GB currently validated at 533MHz only ))

PC2-5300 (DDR2-677)

2 DIMM Slot (Max: 4GB)

PC2-5300 (DDR2-677)

GRAPHIC Calistoga Integrated Graphics Crestline Integrated Graphics

Audio AD1981HD AD1984

On Board Ethernet Intel 82573L Intel 82566 MM/MC

IR One Port No

USB USB2.0x 3ports,4portsin Slice

PC Card Controller Ricoh R5C843 Ricoh R5C847 or better

PC Card Slot T2 x1 with PCI Express Card USB signal capability

Express Card Slot USB/ PCI, Slim (34) Express Card x1 w/ adapter

TCPA Atmel AT97SC3203 (TPM 1.2)

Standard on planar

Accelerometer G-Sensor ADI

Finger Print Reader YES, by Model (UPEK)

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SPEC Overview 2 (Subsystems) KS2 KS3

LCD 12.1”XGA 12.1”XGA/ SXGA+

Integrated Dual-Band Antenna Customized

Bluetooth Antenna YES by Model on BDC card in LCD Asm

WAN Antenna YES by Model

FDD USB FDD support (option)

HDD SATA I/F:2.5” SATA & 1.8”PATA

5400rpm: 40GB/ 60GB/ 80GB/ 100GB/120GB

7200rpm: 80GB/ 100GB

SATA I/F:2.5” SATA

5400rpm: 40GB/ 60GB/ 80GB/ 100GB/120GB/160GB

7200rpm: 80GB/ 100GB

Bay ODD PATA I/F:

8x DVD-ROM (de-functioned Combo drive)

24x24x24x8x DVD/CD-RW Combo

Rambo 4 DVD-RW/CDRW Combo

WLAN Intel 802.11 a /b/g (Golan)

Foxconn 802.11 a/b/g (Gwinett)

Foxconn 802.11 a/b/g/draft n (Nelson)

Support 2X3 MIMO, exclusive WWAN.

Intel 802.11 a/b/g (Golan)

Intel 802.11 a/b/g (Kedron)

Intel 802.11 a/b/g/ draft n (Kedron)

Foxconn 802.11 a/b/g (Gwinett)

Foxconn 802.11 a/b/g/draft n (Nelson)

WWAN Verizon / Vodaphone / Cingular

Modem/ Bluetooth 2 slots

MDC1.5 MDC (Adonis) for all models

BDC (Callisto) in LCD Asm w/ Bluetooth Antenna by Model

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SPEC Overview 2 (Subsystems)

KS2 KS3Keyboard NMB/ Chicony

Touchpad No

Think Light Yes (White)

Battery Li- lon Battery 4C, 4P, 8C

2nd Battery (Bay Battery) Yes

Long Life Battery (Extend) Yes

Docking No Docking Support. Slice support

AC Brick 65w

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SPEC Overview (X6 Slice)

Battery Support Bay BatteryUltrabay Ultrabay SlimModem Port YesLan Port YesParallel, Serial, VGA,RJ11, RJ45

Yes

DV1 NoPS/2 NoSecurity Keylock and Cable lock slotAudio Mic in / Headphone outCard slots NoPCIe card slot No

Kabuki-Sumo Slice

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3. WW Agency Approval plan

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WW Agencies Plan (KS-3)

Notes: 1. CB report and Simplified Chinese Manual are requested for CCC submission 2. Traditional Chinese Manual is requested for BSMI submission

Responsibility NotesPlan Actual Plan Actual

FCC part 15 USA 3/02/2007 3/19/2007 Wistron EMI Self DocVCCI Class-B Japan 3/02/2007 3/19/2007 Wistron EMIMPR-II Sweden 3/02/2007 3/19/2007 Wistron EMICE Mark EMEA 3/02/2007 Lenovo/ IBM Self DocUL-60950-1 USA/ Canada 2/12/2007 3/12/2007 Wistron SafetySMA AS/NZS 3548 Australia Lenovo/ IBMAS/NZS 60950 Australia 3/12/2007 3/26/2006 Wistron SafetyCB Report EMEA 2/12/2007 3/12/2007 Wistron SafetyNOM Mexico Lenovo/ IBMMIC Korea Lenovo/ IBMCCC China 3/12/2007 4/23/2007 Wistron SafetyBSMI Taiwan 3/12/2007 4/23/2007 Wistron EMI/ SafetySASO Saudi Arabia 3/19/2007 4/16/2007 Wistron EMI/ SafetySingapore Doc Singapore Lenovo/ IBMCER Eastern Europe Lenovo/ IBMEnergy Star USA Lenovo/ IBMJapan Energy Star Japan Lenovo/ IBM

Agency CountrySubmit Certificate

SIT Exit: 3/19/2007

SVT Exit: 4/27/2007

SOVP: 5/09/2007

Ann/ GA: 5/22/2007

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4. RoHS Compliant Plan

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RoHS Compliant plan

Planar Subsystems ME parts

DV1 RoHS Compliant RoHS Compliant RoHS Compliant

DV2 RoHS Compliant RoHS Compliant RoHS Compliant

SIT RoHS Compliant RoHS Compliant RoHS Compliant

SVT RoHS Compliant RoHS Compliant RoHS Compliant

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5. New FRU/ CRU Plan

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FRU/ CRU Plan

Common parts similar with KS2, FRU is able to follow.Such as:LCD, HDD, KB, Adapter, P/C, MDC,B/T, WLAN,WWAN, Memory module, ODD, Battery.

Below Mechanical parts needs assign new FRU,- Planar- Rear Cover - LCD Bezel- Keyboard Cover- Base Cover)- LCD FPC- FPR Board- WWAN Antenna

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6. Supplier Selection Process

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Supplier Selection Process

Lenovo:

• Buy/ Sell parts following Lenovo rule.

Wistron determinable:

• Sourcer refer to Wistron QVL list

• Judge suppliers developing capability and production capacity to select candidates

• Release spec. requirement & RFQ to candidate suppliers

• Compare cost, experience and service

• Decide award suppliers

• Depends on demand to judge if need 2nd or 3rd source

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Supplier Selection Process

Part Remark1 2

Rear Cover Catcher FoxconnBase Cover Catcher FoxconnLCD Bezel HPI Multi toolingKeyboard Bezel HPI Multi toolingLCD FPC Flexium IIDAThermal Fan Toshiba (LV) Furukawa (LV)Hinge SZS JARLLY

Inverter FoxconnSingle source,patent and partperformance concern

2nd Fan ToshibaSingle source,patent and partperformance concern

Antenna(WLAN/WWAN/MIMO)

WNCSingle source,patent and partperformance concern

Mechnicals source

Supplier

Current mechanical parts vendor candidates :

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7. EC Release Plan

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EC Release Plan

Based on KS-3 Schedule as of Jul. 14, 2006

Plan Exit 08/18/2006Pre-DV 08/28/2006 - 09/11/2006DV1 09/12/2006 - 10/30/2006DV2 10/31/2006 - 12/18/2006SIT 12/26/2006 - 02/26/2007SVT 03/05/2007 - 03/30/2007SOVP 04/09/2007SS 04/23/2007ANN/GA 04/24/2007

EC No. EC Name Work Item・ Rel Date (Plan) Rel Date(Outlook/ Act) Remarks

Last Call PCR TPM T.Gitchell 11/ 18/ 06 11/ 18/ 06 (SIT-4wk)Template-1 & POR Chart TPM Y.Hirano 11/ 27/ 06 11/ 27/ 06 For Supply/ Demand (SOVP-19wk)MFG Sourcing Plan MFG P.McLamb 11/ 27/ 06 11/ 27/ 06 For Supply/ Demand (SOVP-19wk)Define L2 P/ N for Supply/ Demand (Major commodities) DevMgr S.Uno 12/ 11/ 06 12/ 11/ 06 For Supply/ Demand (SOVP-17wk)

TBD SBB/ CTO TPM M.Fujikado 12/ 18/ 06 12/ 18/ 06 For Supply/ Demand (SOVP-16wk)TBD MTM TPM M.Fujikado 12/ 18/ 06 12/ 18/ 06 For Supply/ Demand (SOVP-16wk)TBD L2 P/ N & FRU P/ N (Major commodities) GCM R.Sannohmaru 12/ 18/ 06 12/ 18/ 06 For Supply/ Demand (SOVP-16wk)

FRU Sourcing Plan MFG P.McLamb 12/ 18/ 06 12/ 18/ 06 For FRU (SS -18wk)Loadsheet TPM Y.Hirano 12/ 25/ 06 12/ 25/ 06 For Supply/ Demand (SOVP-15wk)

TBD Pickup L2 P/ N under L1 P/ N (Major commodities) Mech E.Shinohara 12/ 25/ 06 12/ 25/ 06 For Supply/ Demand (SOVP-15wk)Transmittal Mech E.Shinohara 12/ 25/ 06 12/ 25/ 06 For FRU (SS -17wk)Endorse L2 P/ N for SVT Entry (Major commodities) DevMgr S.Uno 01/ 09/ 07 01/ 09/ 07 For SVT Entry (SVT - 8wk)

TBD L2 P/ N (Major commodities if necessary) GCM R.Sannohmaru 01/ 15/ 07 01/ 15/ 07 For SVT Entry (SVT - 7wk)TBD Pickup L2 P/ N under L1 P/ N Mech E.Shinohara 01/ 22/ 07 01/ 22/ 07 For SVT Entry (SVT - 6wk)

Endorse L2 P/ N for SOVP (Major commodities) DevMgr S.Uno 02/ 12/ 07 02/ 12/ 07 For SOVP (SOVP- 8wk)TBD L2 P/ N (Major commodities if necessary) GCM R.Sannohmaru 02/ 19/ 07 02/ 19/ 07 For SOVP (SOVP- 7wk)TBD FRU P/ N (Major commodities if necessary) GCM R.Sannohmaru 02/ 19/ 07 02/ 19/ 07 For FRU (SS - 9wk)TBD FRU P/ N (Except major commodities) Mech E.Shinohara 02/ 19/ 07 02/ 19/ 07 For FRU (SS - 9wk)TBD Pickup L2 P/ N under L1 P/ N Mech E.Shinohara 02/ 26/ 07 02/ 26/ 07 For SOVP (SOVP- 6wk)

Transmittal (Completed) Mech E.Shinohara 02/ 26/ 07 02/ 26/ 07 For FRU (SS - 8wk)

Resp. Eng.

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8. Quality Development Process

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Quality Dev. Processes

Quality improvement activities are planned as follows:

Maximize the common design for support new function- Follow the KS-1/2 design as much as possible, such as

HDD/ Battery/ Slice support/ Keyboard e.t.c. - Minimize the modification for supporting new function

- Improvement WWAN performance.- > LCD rear cover is common except MIMO support.

- Support MIMO 3rd antenna with WWAN.- > One new opening on LCD rear cover on top side.

Other portion is same as KS-1.- Improvement palmrest thermal performance.

- > New 2nd FAN solution without any height change of Keyboard/ Bezzel/ Bottom case.

29

How to set design or quality criteria/targets

Followed by KS-3 design target

Thermal design of Palmrest during communication<1> KS-1: No criteria during development phase during file transfer.

Define the test procedure and criteria after SIT.-> Deviation.

<2> KS-2: Improve the thermal performance of Palmrest.<3> KS-3: Support 2.5W MIMO without deviation.

- 2nd FAN solution for palmrest.WWAN performance

- KS-1/2 WWAN performance is not so good. And carrier will not allow this performance on KS-3.

- KS-3 will use new WWAN antenna concept, Rod Antenna. It will be met the carrier’s required performance.

MIMO + WWAN support- KS-1 does not support MIMO.- KS-2 supports MIMO without WWAN.- KS-3 will support MIMO with WWAN.

- 3rd antenna for support MIMO.

KS Note-3 DPRPlanar Design/Layout w/Lesson Learned

Jacky Chang2006/08/02

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Agenda

• System Block Diagram• Component Layout• Lesson Learned

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IntelCrestline(Int. GFX)

EmbeddedController

12.1"XGALCD

CRT

PSB 800/667MHz

Dual channel 667/533MHz

DMI X2/X4 SMBus

PCI Bus 33MHz

ATA/100

SATA

USB 2.0 x 10 Ports

LPC Bus 33MHz

CPU VR Intel

IMVP-VI

Azalia

USB Conn-1USB Conn-2

ATMELAT8356908

SMBus

TCPAChip

External Connector

Internal Connector

Li Battery

GbEIntel

RU82566MM

CRT I/F for Slice

Thermal Sensor

MAX6602

CB/USB SlotR5534V

SD Slot

Thermal SensorLM26

INVERTER

Clock Generator CK-

EX505(MLF64)

SMBus

IntelMerom NV/LV/ULV

Processor

uFCBGA

802.11a/b/g802.11n

Mini CardMDC

Bluetooth Antenna

802.11a/b/g Antenna

RJ11

RJ45Port

FAN

DDR-II SO-DIMM

OptionalSO DIMM (x1)

LPC BridgeWinbond WPCN385Super I/O

NSPC87392

Media Slice ConnectorUSB (x1), IDE, LPC, CRT, RJ11, RJ45, CD Audio In, Speaker Out,Mouse, Keyboard, 2nd Batt.

CH-0

CH-1

CH-3

CH-4

CH-5

Media Slice USB-HUB

USB HubSMSC

USB2504

IR

KBD I/F

Mouse I/F

Keyboard Light

DC-DCConverter

(G/A)

MAINBATTERY

DC-IN

Media Slice

Ultra SlimBay

CS-2 X Media Slice

Stereo Speaker

SecondBatteryDC-IN

Power Button

Thermal SensorLM75

G/A

USB

USB

USB

CRT

Parallel

Serial

RJ11 RJ45

MonoSpeaker(0.5W)

Audio AMPMAX9789A

Headphone

Microphone

AzaliaCodec

AD1984

InternalMic

Analog RGB Switch

Finger Print

ATA100

USB CH6

APSsensor

Kabuki/Sumo3 System Block Diagram ver 0.2

CH-7

CH-6

MiniCardRicoh R5C843

PCI Express 6Ports

Second Battery

OptionalSO DIMM (x1)

Bluetooth

CH-2

Wireless WANMini Card

Wireless WAN Antenna

(x1)

USB Conn-3

RJ45 Switch

RJ45 for SLICE

USB CH2

1394

USB

MAX3243

Headphone

Microphone

USB CH3

Card BusRicoh

R5C847

SATAHDD HDD

Subcard

IntelICH8-M

GLCI/LCI

CH-8

CH-9

Reserved

Reserved

SPI

SPI

(x1)

RobsonMini Card

New Device

33

Component Layout

• Component Layout on TOP side• Component Layout on BOTTOM

side

34

Component Layout on TOP side

WLANWWAN

Robson

MDC

Finger print

PCMCIA / CardBus

USB Express Card

Speaker

LCD CONN

KB CONNTrack PointRTC BAT

SIO

KBC

Robson

On boardINT MIC

IrDA

CPU VR

Intel IMVP-VI

DCDC area

2nd FAN

35

Component Layout on BOTTOM side

CPU

Merom

North Bridge

Crestline

ICH-8M

DDR2 SO-DIMM Socket

Slice Conn

BAT Conn CPU VR

Intel IMVP-VI

GFX VR

DCDC area

GbER5C847

SIM conn

PMH7RINKAN

HDD Card Conn

CLKGEN

AD1984

MAX9789A

R5534V

USB

CRT

RJ45

SD SocketUSB

USB

Audio

Jacks

1394Wireless Disable SW

SPI

Flash

36

Lesson Learned from KS Note-1

• Name: 77328f_1• Abstract: W2K:USB Rambo can't be recognized when hot-undock on

slice

[Problem Description] Self-powered Sony Rambo Drive can not be recognized if this ODD

has been attached before Hot-Dock action.

[Root Cause]• Some leakage current may come from external USB device via USB

data signals (USB_D+/D-) if the external USB device is self-powered. In this case, the measured voltage on USB_D+ is 1.2V.

• If Media Slice in power-off state and some leakage current on USB data signals, the leakage current will go through SMSC USB2504 to the VDD power rail. In this case, the measured voltage on VDD power rail is 0.95V.

• In KS-1 Media Slice, RC circuit is used to generate a RESET# signal for USB2504. And RC circuit is tied to VDD at 0.95V level. But RESET# must be less than 0.8V for 1us.

• Therefore, “USB2504 is not reset well!!”

37

Root Cause

SMSCUSB2504

VCC3_USB_HUB

RESET# USBDevice

USB_D+/D-

1.2V

0.95V

0.95V

USB2504 is not reset well!!

38

Long-term solution

SMSCUSB2504

VCC3_USB_HUBPWR

RESET# USBDevice

USB_D+/D-

1.2V

0.95V

0V

VCC3_USB_HUB

39

Preventive Action

• Leakage current on USB port has not been checked before. Afterwards, external self-powered USB device will be checked while the system is at Power-off state by the following table. (Sony USB Rambo: DRX-810UL)

• Follow the essence of DQC E12-3: Planar Overall – Legacy 2.04A Power-on printer CRT and/or EXT power supply Attached to IO Ports at Power-off

With Media Slice Without Media Slice

S4/5 S3 S4/5 S3

USB_D+

USB_D-

VBUS

VDD (Host Controller)

40

Cut-in Schedule

The new Slice cut-in date

Items Date RemarkNew PCB Gerber Out 07月14日 DoneSMT for test samples (40pcs) 07月25日 DoneBox Build (40pcs) 07月26日 DoneRisk PO of new PCB 07月28日R&D testing (WHQ/ YMT) 7/31-8/04FOT (WKS) 7/27-8/05SMT of new PCB for Volume production 08月16日Box build for volume production 08月17日