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August 2015VOLUME 13
embedded-computing.com
#5
RESOURCEGUIDE
Critical LinkMitySOM-5CSx Cyclone
V SoC-based SOMpg. 31
Tag-ConnectTC2030-IDC family
www.tag-connect.com
Siborg Systems Inc.LCR-Reader digital LCR/
ESR-meterwww.lcr-reader.com
Top Innovative ProductsPG. 22
Research ReviewStretchable batteries for flexible wearablesPG. 8
2015
PLUS
Annapolis Micro SystemsWILDSTAR 7 for PCIepg. 54 PG. 23
Silicon
9 Using multicore and virtualization for efficient and flexible developmentQ&A with Robert Oshana, Freescale Semiconductor
13 Evolutionary vs. revolutionary design needs
By Ranjith K R, Mirabilis Design Inc.
Software
16 IoT mobile application platform brings agile techniques and available libraries to IoT
developmentBy Curt Schwaderer, Editorial Director
Strategies
18 Intelligent transportation systems, sensors, and IoT:
Overcoming the challenge of integrating connected vehicles and intelligent transportation systems By Ron Felice, IBM
Related Publications
IoT E-mag
url.opensystemsmedia.com/IoT-06-2015
Special Features
22 Top Innovative Products
APP EXTRASDownload the Embedded Computing Design app:iTunes: itun.es/iS67MQKindle Fire: opsy.st/kindlefireamaz
What mobile can teach embedded about concurrency for the IoTQ&A with Rich Chen, Hang w/
The ins and outs of embedded databases for IoTBy Brandon Lewis, Assistant Managing Editor
Departments
5 Tracking Trends
Rory Dear, Technical Contributor
IoT and the elderly
7 IoT Insider
Brandon Lewis, Assistant Managing Editor
MEMS microphones add reliability for symphony of IoT apps
8 Research Review
Monique DeVoe, Managing Editor
Stretchable batteries for flexible wearables
8 Community Outreach
Monique DeVoe, Managing Editor
Purdue supports pre-college STEM education with focused school
62 Editor's Choice
23 2015 Resource Guide
RESOURCEGUIDE
2015
August 2015VOLUME 13
embedded-computing.com |@embedded_comp | opsy.st/ECDLinkedIn
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4 Embedded Computing Design | August 2015
23
IoT and the elderlyBy Rory Dear, Technical Contributor [email protected]
Are those least familiar with technology those that can benefit the most?
As with any new technology solution, one naturally first pon-ders, “How can this benefit me and my life?” The reality is often that those most outside of the technological loop, thus never pondering this for themselves, can be the group that most benefit – in the case of the Internet of Things (IoT), perhaps it’s the elderly. In the UK alone the latest census tallies more than 10 million people over the age of 65; this number is predicted to rise by 50 percent in the next two decades, and globally it’s a similar story.
The medicinal and health technology improve-ments we’re currently overseeing increase life-expectancy, thus in themselves bear responsibility for these census figures. Recent studies also show that, on average, parents and children tend have greater distances between them geographically than ever before – translating naturally to fewer visits of elderly parents to ensure their wellbeing. Local health authorities try desperately to bridge that gap with home care services, though with budgets bursting at the seams more than ever before, acceptable levels of care can only be stretched so far when numbers are rising and budgets are falling.
One could argue the medical advances we’ve seen owe gratitude to the significant contribution our own embedded computing industry has had. I believe we are the very same industry that can provide the solution to how we maintain those standards of care in the future when traditional methods edge toward untenable.
With the similar advancements in motion detection technology within cameras, one could be forgiven for briefly considering therein lies the solution. If we temporarily forget that the elderly we wish to monitor are humans, with emotions, then one could argue it is ideal – a remote carer could see exactly what is going on live and react to any untoward scenario. Perfect, right? If you answered yes, take a moment to consider how you would feel being under constant surveillance, whether it’s for your benefit or not; none of us are comfortable with having our pri-vacy taken away, especially in the sanctity of our own homes. So immediately any monitoring technology involving video recording in the home becomes out of the question.
Perhaps we need to take a step back and ask ourselves what type of events we actually want to monitor. What would first spring to mind is likely to be those most terminal, such as receiving the information that someone has had a fall, stopped breathing, or worse. Such events can be tracked directly – in fact using the very same XeThru (www.xethru.com) tech-
nology I recently reviewed to monitor baby’s breathing movements (opsy.st/XeThruMonitoring) – via
embedded sensors dotted around the home; detecting both irregular movements or the complete lack of, such sensors can also be uti-
lised to monitor internal environmental statistics throughout the home to flag any that jeopardise
their level of comfort.
The second approach is less direct. Companies such as Eurosoft Systems (www.eurosoft-systems.com)
are pioneering the injection of IoT gateway tech-nologies into every day equipment the elderly use to aid their mobility, such as stair lifts. With embedded intelligence, that stair lift can make judgements on abnormal behaviour based on gathered information of normality – for instance alerting when someone is upstairs for an irreg-ular period of time.
Monitoring beyond the “tier 1” of potentially life-threatening incidents, what we’d describe in our industry as “maintenance tasks” and in this circumstance a task such as the taking of medicine at specific time frames, is arguably
equally important as any failure to adhere prop-erly to a doctor’s advice of what and when medication should be taken can cause a tier 1 scenario in itself. The SMARTpack looks to address just that. It’s a smart, Internet-enabled pill dispenser that can be flexibly programmed to alert the patient, or their relatives, should the time-specific compart-ment not be opened within a specified time frame.
With so many possibilities emerging in this rapidly expanding application area, it’s true that no one solution on its own can provide the desired level of care – they must be used in combina-tion. Combining such technologies relies on the manufacturers implementing open infrastructures, which it’s refreshing to see they are from the very start of this elderly care revolution.
TRACKING TRENDS August 2015
VOLUME 13
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Corporate opensystemsmedia.com
10 ACCES I/O Products, Inc. – USB embedded I/O solutions – rugged, industrial strength USB
63 American Portwell Technology – Portwell empowers intelligent solutions
2 Annapolis Micro Systems, Inc – WILDSTAR OpenVPX ecosystem
14 Axiomtek – Axiomtek’s high performance 5th/4th generation Intel-based embedded computer solutions
17 COMMELL Systems Corporation – 5th gen Intel Core ULT SBC
20 Digital Voice Systems, Inc. – AMBE+2 Vocoder chip delivers high quality voice at low cost
12 Elma Electronic – Elma has the broadest selection of storage solutions in the embedded computing industry
44 Infineon Technologies Corporation – The right security for the Internet of Things
42 Isola Group S.a.r.l. – Designing safe, reliable automotive PCBs
19 Micro Digital, Inc. – Want more from your RTOS?
21 Sealevel Systems, Inc. – Innovative electronics for medical OEMs
61 Technologic Systems – Superior embedded solutions
57 Toradex – Engineering resources at your finger tips
3 Vector Electronics & Technology, Inc. – VME/VXS/CPCI chassis, backplanes, and accessories
11 WDL Systems – SocketModem gets your IoT design to market faster; Industrial grade flash storage
64 WinSystems, Inc. – Thinking beyond the board
6 Embedded Computing Design | August 2015
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IoT INSIDER
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MEMS microphones add reliability for symphony of IoT appsBy Brandon Lewis, Assistant Managing Editor [email protected]
Acoustics is one of those sciences most of us take for granted on a regular basis, not because we overlook the importance of sound in our daily lives, but because we underestimate its pos-sibilities beyond speech, music, and as an environmental indicator. Ultrasound, sonar, and noise cancellation are just a few applications that leverage sound waves in capacities that transcend the lay perception of audio.
A prime example of how many of us undervalue sound is probably in your pocket right now. Today, smartphones include arrays of MEMS microphones that are used not only to capture and amplify voice during calls, but also to eliminate ambient noise and enable far-field audio zoom using beamforming techniques. Delivering these features requires high-quality microphones with a signal-to-noise ratio (SNR) that typically meets or exceeds 64 dB, as even the most sophisticated audio pro-cessing algorithms are restricted by the capabilities of the microphones that are capturing sound. Combined with the large quantities of the smartphone space (billions of MEMS microphones are shipped annually), the demand for quality microphones has resulted in a curious phenomenon in the MEMS market in which the majority of growth and production is occurring at the high end. While the correlation between the smartphone mic market and embedded
may not be immediately clear, I urge you to keep reading.
Why mics matterAt this point you may be asking, “Brandon, why are you talking about smartphone mics in your IoT column?” The reason is that, although speech rec-ognition technology still leaves a lot to be desired, voice will continue to grow as one of the preferred user interfaces for the Internet of Things. Despite the frustratingly low success rate of Siri, “Ok Google,” and Dragon (trust me, I’ve tried almost everything to transcribe interviews), verbal interaction is simply the most effortless form of communi-cation in many scenarios, particularly as everyday objects become Internet-enabled. Think of the possibilities in a smart home that allows you to verbally command your TV, thermostat, and lights (see Amazon Echo), and then think further into the future where micro-phones could be leveraged in a vehicle to record and transmit engine noises known to be associated with problems or failures, or in a variety of other sce-narios for identity management.
Fortunately, that curious fact about the smartphone market driving better quality microphones should catalyze the performance gains needed for some of the advanced applications mentioned previously, but there is also room for growth in other areas of
MEMS microphones, notably reliability. As many of us have expe-rienced over the day-to-day grind with our smartphone sidekicks, the microphones they equip are highly sus-ceptible to water, dust, and other environ-mental particulates,
and once they’ve been damaged there’s little to no hope of them ever again operating at an acceptable level. In part, this has to do with the fact that most MEMS microphones today are based on capacitive, two plate architec-tures that include a diaphragm and backplate (Figure 1a). What often hap-pens when these microphones lose quality is that debris gets caught between these two plates, preventing air/sound waves from passing through the diaphragm freely, or, in some cases, puncturing the diaphragm itself.
Recently however, Vesper (www.vespermems.com), a startup out of the University of Michigan introduced a piezoelectric MEMS microphone that relies on four triangular cantilevers (Figure 1b). The advantages of this are twofold. First, the piezoelectric material used converts sound energy directly to electrical voltage, which helps provide a higher quality signal (68 dB typical SNR). Furthermore, because the use of cantilevers eliminates the air gap where particles or residue can get trapped. According to Vesper CEO Matt Crowley, the result is a waterproof, shockproof, and dust- and particle-resistant design. Their latest part, the VM101, is also pin compatible with capacitive MEMS prod-ucts, helping ease technology transitions and reduce design cycles.
In the wild of the IoT, reliability and cost are precursors for most any hardware. Given the long life cycles, designers must be able to depend on system components for years or decades, and in order to reach projected numbers of connected devices, price points for advanced silicon must be in line with those of a high-volume market. These are the precursors for an IoT app enabler. Piezoelectric MEMS mics are on the right track.
diaphragm backplate
moving plates
1a
1b
Stretchable batteries for flexible wearablesBy Monique DeVoe, Managing Editor [email protected]
Feature-packed wearable devices have a bit of a bulk problem – non-“smart” clothing is thin and oftentimes a bit
stretchy. The latter may not be a property that comes to mind when you think of electronics, batteries in particular. However, an Arizona State University research team has created a “stretch-able” battery, which may disruptively impact wearable designs.
Associate Professor in the School for Engineering Matter, Transport and Energy Hanqing Jiang and his team drew inspira-tion from kirigami, a variation of origami that involves cutting as well as folding, adding an extra step for flexibility that other ori-gami-inspired batteries haven’t. The kirigami-inspired lithium ion battery involves three special patterns that are especially suited for stretchability and bending (See the patterns in the team’s Scientific Reports article: opsy.st/KirigamiPaper). The batteries can stretch to more than 150 percent without losing functionality, and a “plastic rolling” technique is used in the design’s creases to reduce fracturing in the battery due to cutting and folding.
In a demonstration, a prototype was sewn into an elastic wristband attached to a Samsung Gear 2 smartwatch, which retained all functionality when stretched (See a video of the demo: opsy.st/KirigamiVideo).
The Samsung Gear 2’s original battery has a 300 mAh energy capacity, whereas the team’s 51.3 mm long x 27 mm wide x 2.6 mm thick (size when compacted) kirigami battery is 80 mAh. If scaled up to cover the full band size (250 mm long x 30 mm wide x 3 mm thick), its capacity increases to about 700 mAh, exceeding the Samsung Gear 2’s original lith-ium-ion battery, and has an energy density at 160 Wh/Kg, which is comparable to smartphone batteries.
Another advantage besides flexibility and thickness appears to be temperature; where the original Samsung Gear 2 bat-tery’s temperature increases during a discharge test, the kirigami battery’s temperature stayed consistent with the ambient air temperature.
Purdue supports pre-college STEM education with focused schoolBy Monique DeVoe, Managing Editor [email protected]
Many STEM outreach programs across the country are working to get students introduced to and interested in science, tech-nology, engineering, and math from a young age, opening up these fields as potential career paths they might not have con-sidered. With the interest these programs generate hopefully comes the desire to learn more and gain necessary skills to pursue a technical career. The U.S. Department of Education reports that only 16 percent of American students are proficient in mathematics and consider a STEM career, and of those only half end up going on to work in a STEM-related career. While the Department of Education aims to fill a nationwide goal of recruiting young minds to these important fields, Purdue University has unveiled a targeted approach to getting stu-dents in its home state of Indiana to succeed in STEM.
In August 2017 in Indianapolis, Ind., Purdue plans to open Purdue Polytechnic High School, a STEM-focused charter school designed to get students to be successful high school students with the opportunity to be directly admitted to Purdue University.
Purdue’s engineering program has been ranked among the best in the country by U.S. News & World Report. The cur-riculum and teaching methods will be designed to mirror the Purdue Polytechnic Institute’s program, combine K-12 and postsecondary education, and prepare students for success in the 21st century workplace.
Problem- and project-based learning with a connection to real-world challenges make up the first two years of the program. Eleventh graders will choose a specific pathway and begin earning college credit and industry credentials. And in their last year stu-dents will complete an internship in their particular chosen field. In addition to focused and hands-on STEM learning, programs helping students transition from high school to college will also be provided to ensure students succeed in their education.
Read more about the announcement: opsy.st/PurdueHighSchool
RESEARCH REVIEW
COMMUNITY OUTREACH
8 Embedded Computing Design | August 2015
Multicore, Virtualization
Using multicore and virtualization for efficient
and flexible development
Use of multicore processors in embedded systems has dramatically
increased over the past several years, and virtualization is an important
component to for developers to get the most out of multicore. Rich Nass
interviewed Robert Oshana, Director, Global Software R&D and
Enablement, Digital Networking at Freescale Semiconductor about the
usefulness of virtualization when developing with multicore processors,
strategies to make these technologies most effective, and the future
of multicore. Edited excerpts follow.
Q Multicore has gone from a buzzword about seven years ago to something that’s mainstream. What will we be saying about multicore seven years from now?
Not much. It’s going to be so mainstream that people will stop talking about it at conferences. It’s like how the RTOS in embedded was the talk of the town a couple decades ago. Things got ubiqui-tous and it’s not a big discussion topic anymore; its just assumed that people use them, just like multicore in seven years.
Q Different people have different definitions of virtualization. What’s yours?
Efficiency of resource management and utilization. Virtualization spans many areas, like “server” or core-based virtual-ization with things like KVM, containers, and hypervisors. But now, virtualizing entire “networks” using technology like network function virtualization (NFV) is
common. In either case, you’re making it easier for developers to consolidate applications and/or control onto a single multicore device without having to go through expensive porting to get the consolidation. If I can easily move multiple applications using multiple operating systems (OSs) onto a single multicore processor without having to port to a single OS, that’s a time to market advantage.
Q What’s the connection between multicore and virtualization?
This enables me to take two or more applications running on disparate pro-cessors and OSs and move them to a single multicore device where the OS talks to the virtual machine (VM) instead of the HW. So I can have multiple OSs running on the same device (or even the same core on the device) without having to port from one OS to another. This pro-vides me increased flexibility, increased utilization of multicore resources, and faster time to market. Multicore and vir-tualization fit hand in hand.
Q How much of the burden of virtualization should fall on the OS vendors verses the processor vendors, and why?
It needs to be both. Ultimately, the OS vendors will produce a product, but the processor vendors need to design for this technology. For example, there are optimizations that can be made to make virtual I/O faster and more effi-cient, to enable more efficient com-munication between VMs, etc. There’s an added overhead to using virtualiza-tion so HW/SW co-design should be brought to bear to make this “system” more efficient and optimized.
Q We’ve seen of few examples of multicore processors with hundreds of cores, but the majority are eight or less. Will that change going forward? What determines the point of diminishing returns?
The economics say that there will be more cores added; they’re so cheap these days, so why not? The utilization
Robert Oshana Director, Global Software R&D
and Enablement, Digital Networking
Freescale Semiconductor
www.embedded-computing.com 9
SILICOn Multicore, Virtualization
of these many cheap cores will be appli-cation dependent. For “embarrassingly parallel” applications and applications that fit more into Gustafson’s Law as opposed to Amdahl’s Law, the more cores the better. For more “bound” applications, it will depend on how effec-tive the developer can achieve the right algorithmic transformation and how well the tools guys can spread the load!
Q How much of the “usefulness” of multicore is determined by the application, what applications are best suited for lots of cores, and why?
There are two interesting lemmas in the multicore industry that allow applications to scale faster than Amdahl’s Law would predict. One says, “There exists work-loads that are gaseous in nature: When provided with more compute power, they expand to consume the newly provided power.” An example of this is graphics. If I get more compute power, I will just run my frames at a higher resolution or with more details, for example. Another example is weather prediction. If I get more compute power, I’ll just run my software longer to get more accurate predictions.
The other lemma is, “When the problem size is increased, the parallel portion expands faster than the serial portion.” Martix-Matrix-Multiply (MMM) is an example of this. In the setup of MMM, i.e., initializing the matrices increases linearly with the size of the matrix. However, the actual compute is O(n^3). For a system where the problem size is not fixed, performance increases can continue to grow by adding more pro-cessors. But both of these lemmas have to be true for this to work.
Q Using virtualization (VMs) in conjunction with multicore processors is a technology that helps designers get the most out of limited resources. Especially as we seek to push more and more resources to the edge of the Internet of Things (IoT), when does it make sense to leverage virtualization technology?
" A virtualized interface can scale much better than a traditional one."
10 Embedded Computing Design | August 2015
There are a few key use cases for virtu-alization, many of which apply to the IoT space. They are:
1. Consolidation2. Utilization3. Dynamic resource management4. Security and sandboxing5. Failover
Virtualization offers a new level of flexi-bility that was not present before. Besides better usage of limited resources, a virtualized infrastructure can scale much better than a traditional one. With the constant increase of IoT devices, the infrastructure needs to be more elastic to use the resources present in customer location and cloud. One example is vCPE where the network functions can be processed either on the CPE, in cloud, partially in CPE, and par-tially in cloud.
Q Given the benefits of virtualization, what types of virtualization technology are available to embedded developers now, what are their pros and cons, and how would you prescribe investigating the right solution for a particular application and/or target processor?
There are type 1 and type 2 virtual-ization approaches. This mainly just has to do with whether an underlying OS is present. Type 1 hypervisors run directly on the hardware and offer advantages of efficiency and low over-head but many of these are vendor-centric, which may or may not be an issue to the developer. KVM (Kernel Virtual Machine) is a type 2 hyper-visor, integrated into Linux. This is an open-source technology, which has benefits but is generally slower than a type 1 given its integration into Linux. We invest in both types.
Also, containers (LXC) are a “light-weight” form of partitioning that offers the advantages of isolation and excel-lent performance without a full para-virtualized system underneath. All three of these technologies are used in the embedded space. Again, the choice comes down to what type of application and use case is being developed.
Current processing virtualization tech-nologies are:
Hypervisor based, offering Virtual Machines booting various OSs (Guests). The user will see an OS and resources like a physical machine but it will not know on what HW the resources are running. There are open-source hyper-visors (KVM/QEMU, XEN, etc.) and proprietary hypervisors. For acceler-ating the Guest OSs and offering the required isolation between Guests, var-ious HW extensions were added by the core (PPC, ARM, x86) providers.
Container-based containers share the same kernel and only one OS (kernel version) is supported. The user will have an experience similar with a VM but the isolation is at the process level, and the control on resources is done in the kernel at SW level. Containers don’t use extensions, as they are intended to be lightweight hypervisors (rapid and flexible), but with a trade-off on iso-lation. There are many open-source solutions targeting different use cases, like LXC and libvirt_lxc. Their goal is mainly to deliver an application that’s self-contained.
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SILICOn Multicore, Virtualization
Choosing the best virtualization solution depends a lot on the use case, isolation required, performance, flexibility, legacy SW, and of course the virtualization sup-port in HW. The processing virtualization is the foundation for NFV, where the net-work functions are run in VMs.
From a network virtualization perspective, the focus is similar. VMs are decoupled by HW and are managed (created, migrated, and/or destroyed) programmatically in the network side as the networks are
decoupled by the HW infrastructure (switches and routers) programmati-cally creating the network slices (virtual networks). The networks are created, reconfigured, and destroyed in a flex-ible manner following the VM migration. This trend is called software defined net-working (SDN).
Q From a silicon perspective, are there certain strategies you put to use when architecting multicore processors that help
facilitate or ease virtualized system design? Further, as chip vendors are increasingly being asked to provide development tools and software stacks to embedded engineers, what are you offering or partnering on in terms of hypervisor/container solutions that can help designers make the right decisions when starting virtualization projects?
Yes, we invest a lot in architecting SoCs with virtualization in mind. We design our I/O subsystems to support virtual-ized I/O for example. We design mech-anisms that allow VMs to more easily communicate with each other, to help route interrupts to the right VM, and so forth. Even though we use a com-munity-based virtualization technology (KVM), we can differentiate at the SoC level. We focus on optimizing our SoCs for the use cases we are interested in, e.g., networking, wireless access, etc. Then we build optimized enablement software and SoC software drivers to allow the developer to take advantage of these SoC features.
The strategy is to offer HW isolation between VMs at all levels, such as core, I/O subsystem, and accelerators, and to accelerate using HW assistance all the SW parts that add overhead, like hyper-visors and virtual switches.
From a SW perspective, Freescale offers its SDK that contains plenty of technologies optimized for Freescale platforms (KVM, proprietary hyper-visor, LXC, libvirt_lxc, Docker, Libvirt, and OpenVSwitch) with many reference applications. There are build cloud refer-ence applications on top of these tech-nologies using the orchestration support offered by OpenStack to manage VMs, networks, storage, and so on.
Freescale Semiconductor www.freescale.com @Freescale www.linkedin.com/company/ freescale-semiconductor plus.google.com/+freescale www.youtube.com/user/freescale
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12 Embedded Computing Design | August 2015
Evolutionary vs. revolutionary design needsBy Ranjith K R
New system designs that become market-leading products are the result of innovation that’s not only evolutionary and revolutionary, but also elegant, easy-to-use, and high-quality system design. Market surveys, statistics, and customer panels have a track record of pin-pointing evolutionary design concepts; however, revolutionary concepts are more elusive, as evolutionary customers tend to think in a linear fashion based on what exists. Revolutionary concepts often come from
entrepreneurs who can see further ahead or a small group of customers who can envision a better way forward.
Based on practical experience working hundreds of design worldwide, I’ve come to the conclusion that both revolu-tionary and evolutionary products need a strong systems engineering effort. Unlike product development and manu-facturing that have a well-defined and rigid design workflow, systems design
of electronics and embedded real-time software is still in the infancy.
A number of unanswered questions have created a multitude of methodolo-gies and tools to go with the method-ologies. Should system designers use a top-down or bottom-up design style? Is a centralized or distributed approach to processing the best method? Is a sym-metrical or asymmetrical topology war-ranted? Is power or speed the driving
Dual-Core Processor Model ComparisonSingle Core vs. Dual Core
for a 1000 line Thread
Parameters
Thread_Generatorevery 20.0 usec
Generate ExecutionBinaries: {Mnemonics}
Sim_Time: 100.0E-06Single_Core: falseLine_Count: 1000 /* Lines of Code */Number_Loops: 10 /* Each loop has Line_Count */INT_Mnemonic: {”add”,”sub”,”mul”,”div”}FP_Mnemonic: {”f_add”,”f_sub”,”f_mul”,”f_div”}
Digital Architecture_Setup2
Display
Instant_Avg
Battery
Power_Manager
Cache
DRAMLinear_Port2
Linear_Port
Linear_ControllerInstructor_Set
Processor
Processor2
Display2
Display3
Trans_Src
Trans_Src2
State_Plot_Block State_Plot_Block2
Gen_Exec_Binary2
Gen_Exec_Binary
InstructionsCompleted.
InstructionsCompleted.
“Gen Exec Bi/*Generate...
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“Instr.
“Myl...
“Pro...
“Pro...
“Bus_1”“Manager_1”
“Architectu...
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“Port_2”
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Dual-core vs. single-core model.Figure 1
Multicore, Virtualization
www.embedded-computing.com 13
criteria? The answer to these questions, and more, can lead to a conceptual block diagram that starts the design pro-cess, leading to a design specification.
Many computer scientists contend that memory bandwidth is one of the main issues limiting today’s processor per-formance, especially with the evolution of multiple-core processor chips, and multiple execution-unit CPUs. Processor cores and instruction pipelines are often stalled waiting for instruction or data-cache accesses. Programmers contend that minimizing program variables will reduce memory accesses and increase performance, while chip designers keep improving memory band-width by adding more memory channels to pro-cessor cores using I1, D1, L2, L3, SDRAM, and disk memory structures. In
many ways, this is linear thinking, based on the original Von Neumann computer architecture.
One might consider running a single thread program code on both pro-cessor cores, and utilize registers on each core. This reduces the number of variables to read/write from cache down to 16 variables, or a 66.6 percent reduction in cache accesses, which consume more power, and takes more
cycles. Each core would need access to the other processor core set of regis-ters, for example. In addition, many programs have tight loops to process application critical information, and if a single-thread program is run on both cores, then could each core pro-cess even/odd flows of this applica-tion critical loop simultaneously? And sequential single cycle instructions outside of loops could be executed on separate cores simultaneously? While
Architecture_BlockArchitecture_1_Processor_1Architecture_1_Processor_2Architecture_1_Bus_1Architecture_1_Cache_1Architecture_1_SDRAM_1
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100.0
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Idle100.0100.00.00.00.0
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;;;;;;
---------------Name--------------- ------------------Power by State------------------ ---Transition---
Power manager configuration.Figure 2
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14 Embedded Computing Design | August 2015
there might be many dual-core related issues with this approach, what might be the theoretical performance/power improvement of this approach?
One solution is a system-level dual vs. single-core model that assumes 80 percent integer instructions and 20 percent floating point instructions per 1,010 instructions, including ten loops with 1,000 instructions each (Figure 1). To simplify the analysis, assume that there were no prior instruction dependencies; however, this could be added with an additional day of effort.
This model was used to determine the effectiveness of having the com-piler issue instructions to a dual-core configuration and utilize the extra registers on each core in terms of performance and power consump-tion (Figure 2). First, two blocks were added to generate executable binaries in the form of mnemonic instruction arrays, according to the order of execu-tion. Next, two standard library blocks with four-stage pipelines were added, including the common Instruction_Set block, which sets the cycles per instruc-tion. The Power_Manager was added
with estimated power consumption in mil-liwatts, based on the standby, active, wait, and idle power states (Figures 3 and 4).
The dual- versus single-core model provides answers to many ques-tions including, what might be the theo-retical performance/power improvement of this approach? Looking at the results, the per-formance is better than expected, namely the dual-core configuration requires 6,370 cycles to complete a thread, whereas the single-core configuration requires 17,160 cycles to complete the same thread. The dual-core configuration com-pleted the thread 63 per-cent faster, whereas common sense would suggest it might com-plete 50 percent faster. In terms of power con-sumption, it’s about the same for both configurations. Thus, system-level modeling was able to generate results that show a dual-core, instruction-synchronized execu-tion for a single thread was 63 percent faster than a single core at the same power level.
Ranjith K R is an EDA applications engineer, specializing in VisualSim system-level products at Mirabilis Design Inc.
Mirabilis Design Inc. www.mirabilisdesign.com @VisualSim www.linkedin.com/company/ mirabilis-design-inc.
Dual-core model plots.Figure 4
Single-core model plots.Figure 3
www.embedded-computing.com 15
IoT mobile application platform brings agile techniques and available libraries to IoT developmentBy Curt Schwaderer, Editorial Director [email protected]
Mobile applications can be challenging and time consuming to develop. The complexity doesn’t stop with look and feel or communication with the cloud. Security and human factors play a critical role in their success or failure. An agile mobile application platform promises to bring a full-featured mobile applica-tion platform with service libraries that address key Internet of Things (IoT) fea-tures and capabilities.
Evolution of the smart deviceIt wasn’t too long ago we were sarcas-tically mocking the “Internet-enabled coffee pot” or “smart light bulb.” Yet here we are – it’s the summer of 2015 and many of these seemingly mundane devices have now found use-fulness within the Internet of Things (IoT) paradigm. The evolution of these smart devices may not be proceeding like we joked about many years ago – we’re not going to be putting a 64-bit multi-core processor into a light bulb anytime soon. However, the IoT world leverages Internet devices like smartphones and home gateways that can communicate in simple ways to smart light bulbs, out-lets, and temperature control “sensor”
devices, and provide a simple, intuitive program and graphical interface for con-trolling these devices and getting statis-tical information from them.
IoT encompasses sensors, gateways, and the cloud. Gateway devices like smart-phones must provide interconnectivity with a variety of sensors, an easy, intui-tive graphical interface for users, and high security that can prevent hacking or unauthorized control.
Mobile application platformsAyla Networks (www.aylanetworks.com) focuses on mobile application plat-forms that work at making “dumb things smart.” Things you’d want to control using your smartphone. Rod McLane, Senior Director of Marketing at Ayla Networks mentioned Ayla got its start by looking at a variety of connectivity chips and trying to figure out what the next wave in connectivity for low-end devices would be. Ayla has a number of connec-tivity chip manufacturers like Qualcomm, Broadcom, and NXP who embed their software into their chips. From there, extensions to the smartphone and appli-cation development were a natural fit.
“Most companies doing these things aren’t experienced,” McLane says. “They set out to create a platform to enable people to bring dumb devices to the IoT realm quickly and securely.”
In response to this trend, Ayla began investigating the components needed for smart home connectivity. From the smartphone control perspec-tive, Android and iOS are the primary operating systems. Providing mobile libraries as freeware for connectivity and security makes development easier by having to write and test less code. On top of these mobile libraries, Ayla has source code for building out the entire primary mobile application fea-ture set for iOS and Android. Things like secure sign-in and registration, device set-up and configuration, cre-ating schedules for the device, and push notification support are included.
Secure sign-in and configurationIt’s important for an IoT mobile applica-tion to provide enterprise level security. Ayla has designed that into the mobile platform sign-in and authentication libraries. The environment provides for
Embedded Databases
16 Embedded Computing Design | August 2015
mobile apps and connected devices to be authenticated separately.
In some cases, end-to-end data encryp-tion can add an additional level of security for the IoT application. Access and authorization control provides for different types of users having dif-ferent privileges. Activity auditing was also touched on in order to identify potential issues in the system prior to the problem arising. It’s this big-picture security architecture within the IoT application that can provide a measure of security and reliability.
Control layersThe control layers involve what are the devices you are controlling and what’s the best way to allow the user to control them through the mobile application. The Ayla platform pro-vides overlays that can adapt designs to show a variety of information about the device. For example, different zones of the household may display different information about tempera-ture, the devices in that zone, cameras, or power consumption.
Creating a customer experienceCoupled with these control layers is the customer experience. Navigating through the control options is a critical design and layout decision. The mobile application platform has a number of starting points that can be customized depending on the application requirements. Often for less technical users you want large icons that clearly state what the control ele-ment is. Then through touching on that item an expandable section is displayed relating to everything you can control for that device. One of the examples McLane showed was an overall home control application that had a kitchen area you could select, then a number of items in the kitchen. Selecting the coffee pot item opened up to a control slider to turn the coffee pot on or off, set a timer for the coffee pot, show the weekly/monthly schedule, and even statistics on the his-torical usage of the coffee pot.
The mobile application platform comes with a number of sample scheduler pages and pages that manage use of general things that can be customized for the application.
Perhaps the actual look and feel of an application seems simple – but as McLane pointed out it may be the hardest thing to get right.
“Perhaps the biggest advantage of the platform is the ability to mock-up the application and get a feel for how easy or hard it is for the target audience to use,” McLane says. “Even things as simple as color scheme and gesture control can be critical human factor decisions.”
The mobile application environment comes with a number of gesture con-trol capabilities as well as the ability to change color schemes quickly and easily. Combining layouts, color schemes, quick timers, usage graphs, and schedules are all things that are typically needed for sensor control. The platform has a variety of capabili-ties in these areas to start with an out-of-the-box experience, then customize as requirements are identified.
Ayla has their own cloud that has been tested on AWS in multiple regions. Their cloud environment coupled with connectivity firmware in silicon and the Ayla mobile application platform pro-vides a flexible end-to-end solution for IoT applications and connecting dumb devices to the Internet.
Oliver Cockcroft, Senior Product Manager Mobile at Ayla Networks also stressed the importance of supporting, adding, and enhancing the platform to support the latest advances in IoT devices.
“It’s important for an IoT platform to keep up with the latest trends, products, and applications since this market moves so quickly” Cockcroft says. “We’re cur-rently adding support for Apple Watch applications scheduled for release [in August]. New features and capabilities enable platform users to grow capabili-ties and market share.”
Mobile development for the IoTIoT is a unique mix of sensor, gateway, and cloud. Flexibility with the ability to leverage common components is key to an effective deployment. Mobile appli-cation platforms like Ayla’s are showing the way to providing fast-time-to-market application for IoT.
www.embedded-computing.com 17
Embedded feeds Big Data
Intelligent transportation systems, sensors, and IoT: Overcoming the challenge of integrating connected vehicles and intelligent transportation systemsBy Ron Felice
What is an intelligent transportation system (ITS)? The best definition comes from the European Telecommunication Standards Institute: “Intelligent trans-port systems (ITS) include telematics and all types of communications in vehicles, between vehicles (e.g., car-to-car), and between vehicles and fixed locations (e.g., car-to-infrastructure). However, ITS are not restricted to road transport – they also include the use of information and communication technologies (ICT) for rail, water, and air transport, including navigation systems.” How do we realize this complex vision of an ITS? A few issues must be addressed, including achieving the communication specified above and having an effective means of accommo-dating multimodal transportation. The system needs to be capable of consuming a nearly incomprehensible amount of data and producing information useful to the traveler. This information needs to guide travelers to their destinations in the most efficient way possible, and interact with infrastructure to facilitate relief of traffic congestion. And it needs to do all these things in real time.
Data, data, every where, / And thus the world did shrink[1]We hear frequently that the world is shrinking. What we mean by this is that because of accessibility to modes of high
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speed transportation and a significantly increased capability for sharing informa-tion, the people of the world are more closely connected than ever. It is fair to say then that building an Intelligent Transportation System (ITS) is a key to shrinking our world.
The information we share is a fusion of data. This data derives from mul-tiple sources. Each of us consumes a significant amount of data every day, yet it is a tiny fraction of the data that is produced every day. In fact, some estimates place the amount of data created each day around 5 exabytes. To put that number into perspective, there is an estimated 5 to 20 petabytes of data in the Library of Congress in various formats. Every day we produce from 250 to 1,000 times that amount of data and this will continue to grow.
According to a 2011 study by the McKinsey Global Institute[2], the auto-motive industry will be the second largest producer of data by 2015; if we combine automotive with travel and logistics the amount of data grows by an additional 30 percent. Much of this data comes from sensors inside the vehicle. As vehicles incorporate more safety and convenience features this number will grow significantly. Granted not all this data has a role in an ITS, and certainly not the raw sensor data.
Automotive sensor fusionAn individual sensor gives a piece of data, which by itself may serve some lim-ited purpose, but when we consider it in the context of other sensor data, we are able to gain some insights into perfor-mance or behavior and with the proper controls in place can improve the system performance. This is called sensor fusion.
In today’s vehicles, an example of sensor fusion in action would be the traction control system. This system detects when a wheel on the vehicle is slipping and adjusts engine power and, when neces-sary, applies the brakes. But how does the traction control system know when the wheel is slipping? If it depended on the wheel speed sensor of a single wheel for detection, this may be difficult. Instead of one sensor, however, there are multiple sensors, and in the case of most passenger vehicles there is one on each
wheel. By looking at differences in the measurements reported by these sen-sors, the traction control system is able to make the determination of when and by how much the engine power to the wheel needs to be reduced and whether or not braking is necessary.
Sensor fusion provides us with some important analytics capabilities within the vehicle. If we stop there, however, we are missing some other potential, particularly when we start working with off-board systems.
Adding intelligence to sensor systemsThis is where information fusion comes in to play. Information fusion can be viewed as a combinatorial approach to reducing uncertainty. Information from a variety of sources is gathered and analyzed within a shared context to gain further insight and reduce uncertainty about a situation.
This is a non-trivial undertaking, but given the significance of what this can enable it is worth the effort. In their paper “Issues and Challenges in
situation Assessment”[3] the authors indicate that information fusion pro-vides for situation assessment and that situation assessment involves deriving relations among entities, for example the aggregation of object states (i.e., classification and location).
Now consider an example of situation assessment. Given the behavior of the traction control system, if this informa-tion were combined in some way with information about the ambient air tem-perature or rain sensing systems, it would then be possible to make some assessment of the situation in which the wheel slip occurred.
If the ambient air temperature sensor reports that the temperature is below freezing and the ABS wheel speed sensor reports slippage, the situational assessment might be that there is ice in the area. If the one doing the situational assessment is not the driver, but instead it is a cloud-based analytics system receiving real-time telemetry from the vehicle, then there is an improved capa-bility for assessment.
www.embedded-computing.com 19
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Instead of just one car reporting wheel slip, now there could be multiple vehicles in a geo-fenced area reporting wheel slip. Given a statistically significant number of occurrences reported, the analytics engine could with high confidence conclude that there is ice in the area. This cloud-based system could now push this information out to subscribers in the form of an alert, warning drivers entering the area of the presence of ice.
Broadening the scope, the cloud-based system could now report this information to the operations center as well. The operations center could broadcast this information to digital signs on the roadways in the surrounding areas, warning drivers outside of the geo-fenced area that ice had been detected, giving them the opportunity to re-route if possible.
This is just one example of how connected vehicles could inte-grate with and support an ITS.
Connecting the vehicleThe next critical piece that needs to happen to support and extend the capabilities of the ITS is connectivity. Connectivity is present in a number of vehicles today, but this is typically done for navigation and concierge services. The vehicle data needs to be made available off-board, to the infrastructure. Once this is done a number of things can be achieved.
In the event a crash is detected (airbag deployment signal received by intelligent transportation system along with other contextual telemetry), the ITS would be able dispatch first responders and begin rerouting traffic automatically. In the event of unanticipated traffic congestion, the ITS could automatically adjust traffic light intervals to adjust the flow of vehicles through the congested area as well as send alternate routing information directly to connected vehicles.
These are just a couple of examples of what could be real-ized if vehicles were more connected and vehicle data were made available.
Designing in securityThere are challenges with this sort of connectivity, however. The most serious of these is security. There has been much publicity around vehicles being hacked. Initially, all intrusions required physical access to the vehicle. There are now many wireless access points into the vehicle increasing the attack vectors for hackers. But to what end?
There is little value to a hacker in controlling a vehicle remotely. Where the true value lies is using an insecure connection point, like a connected vehicle, as a point of entry into the infrastruc-ture and backend systems. Accessing a single vehicle provides little benefit to a hacker, but being able to effect hundreds or thousands of vehicles, or gaining control of the ITS, could result in significant gains or significant pains. These far-reaching impli-cations mean that security must be considered from inception, not patched or considered as an afterthought. Managing secu-rity impacts many facets of the system, including architecture and interfaces. Adopting best practices in security analysis and applying them throughout the entire engineering life cycle is critical to maintaining the integrity of both vehicle and off-board systems.
One such best practice is threat modeling. Threat modeling provides a structured approach to the classification of cyber-security threats. A threat model will:
õ Identify the potential threats and preconditions
õ Categorize and group threats
õ Identify impact of safeguards on the threat
õ Identify areas to apply mitigation
There are different types of threat models, but in its report on automotive security threat[4] NHTSA recommends a composite approach for automotive cyber-physical systems.
Another consideration is privacy. It is impossible to guarantee the complete security of the vehicle, since new threats will surface over the life of the vehicle. It is, therefore, necessary to take measures to ensure that even if access to the vehicle network is achieved, the information on the network is secure. This could be managed in one or a combination of ways. For example encryption of data or authentication of nodes within the vehicle and out to the infrastructure.
20 Embedded Computing Design | August 2015
Strategies Embedded feeds Big Data
Given the need for security and the challenge of integrating two highly complex systems, the connected vehicle and the ITS, “system of systems” engineering is required. System of systems engineering addresses the development and opera-tions of evolving programs. While traditional systems engi-neering seeks to optimize an individual system, system of systems engineering seeks to optimize the network of various interacting legacy and new systems brought together to satisfy multiple objectives. By taking a system of systems approach, it is possible to create an integrated architecture, providing for standardized interfaces and the necessary protocols to address concerns, such as security.
Requirements managementEngaging in systems thinking, engineers working in disparate domains can more readily identify and understand the interde-pendencies and interactions present in this system of systems. Applying modeling not just to security, but also to the capture and elaboration of these elements of the system in terms of their architectures, behaviors, and communication facilitates the cor-relation to requirements, both functional and regulatory. Further, the resultant model provides a comprehensive view at a higher level of abstraction, which enables a deeper understanding of the system. Through simulation of the model, it is possible to visualize the system behaviors to perform preliminary verification of the system specification and to avert potential conflicts and pitfalls prior to implementation.
Rigorous management of requirements is also critical to success. Tracking the continuous requirements changes, maintaining the history of the artifacts, and identifying suspect links will ensure requirement and design integ-rity. It is nearly impossible to achieve this capability with spreadsheets. Achievement of this is best served through the implementation of a proper requirements management solution.
Critical to success is that the work is performed collaboratively across the life cycle. From needs analysis, through translation into requirements, regulatory adherence, and an iterative analysis and design workflow, the engineers must have the ability to share information seamlessly. The growing complexity of the automobile itself has meant much closer collaboration between OEMs and suppliers. Now extend this need for col-laboration beyond the boundaries of the automotive ecosystem. The entities providing infrastructure and back-end systems must participate.
If the same approaches for collabora-tion are taken – document hand-off and tool export and import (often resulting in loss of fidelity of information) – not only will the parties be met with the
same challenges, the situation will be exacerbated by the growth in scale and complexity. The solutions employed in the development of these systems must enable close collaboration, extensive traceability, and must scale to meet the demands of developing complex, integrated systems. Further, those working on the systems must have immediate, real-time access to the information necessary to engineer them successfully.
References[1] Apologies to Samuel Taylor Coleridge’s The Rime of the Ancient Mariner.[2] http://www.mckinsey.com/insights/business_technology/big_data_the_next_frontier_for_innovation[3] Blasch, E., Kadar, I., Salerno, J., Kokar, M. M., Das, S., Powell, G. M., . . . Ruspini, E. H. (2006). Issues and Challenges. Journal of Advances in Information Fusion.[4] McCarthy, C. H. (2014). Characterization of Potential Security Threats in Modern Automobiles. Washington, DC: National Highway Traffic Safety Administration. doi:Report No. DOT HS 812 074
Ron is a Solution Architect for IBM and a Functional Safety Certified Automotive Engineer.
IBM www.ibm.com @IBM www.linkedin.com/company/ibm www.facebook.com/ibm www.youtube.com/ibm
www.embedded-computing.com 21
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22 Embedded Computing Design | August 2015
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RESOURCEGUIDE
HardwareAmtelco 31Annapolis Micro Systems, Inc. 30Critical Link 31Intermas, Inc. 32Pentek, Inc. 34Schroff Pentair 32-33VersaLogic Corp. 35
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Systems or Modular SystemsInnovative Integration 60-61
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FMC Family delivers a wide range of solutions: High Speed Digitizing Signal Genera-tion for Wireless Transceiver Pulse Generation, Medical Imaging, Precision Recording/Playback, RADAR, LTE WiMAX Physical Layer and more. The FMC-1000 is a high speed digitizing and signal generation FMC I/O module fea-turing two, 1250 MSPS A/Dchannels and two 1250 MSPS D/A channels supported by sample clock and triggering features. Analog I/O may be either AC or DC coupled. Receiver IF frequencies of up to 625 MHz are supported. Multiple cards can be synchronized for sampling.FMC-10GE provides two 10 Gb Ethernet ports on a standard FMC module. Two, stan-dard RJ45 connectors support connection to standard CAT6e networks providing high speed connectivity to PCs, servers embedded computers such as Innovative's ePC prod-ucts or custom, intelligent IO. Aggregated burst rates of up to 20 Gbps are achievableFMC-310 is a high speed digitizing and signal generation FMC IO module featuring four 310 MSPS A/D channels supported by sample clock and triggering features. Analog IO may be either AC or DC coupled. Receiver IF frequencies of up to 155 MHz are supported. The sample clock is from either an ultra-low-jitter PLL or external input.The FMC-SERVO module features eight simultaneously sampling A/D and DACs. Low latency SAR A/D and fast-settling DACs support real-time servo control applications. The programmable input range and high input interface directly to many sensors, while the output is capable of driving many transducers.
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24 Embedded Computing Design | August 2015
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The X6-RX module provides up to 24 configurable receiver channels.
X6-1000M – The tight coupling of the digitizing to the Virtex6 FPGA core realizes architectures for SDR, RADAR, and LIDAR front end sensor digitizing and processing.
X6-250M – Applications include software-defined radio, RADAR receivers, and multi-channel data recorders.
X6-GSPS – The tight coupling of the digitizing to the Virtex6 FPGA core realizes architectures for SDR, RADAR, and LIDAR front end sensor digitizing and processing.
Download data sheets and pricing now!
X6 XMC Family
Boards
embedded-computing.com/p372879
Innovative Integrationwww.innovative-dsp.com
[email protected] 805-383-8994
www.embedded-computing.com 25
technical FEATURES
ĄĄ Full Ada implementation (Ada 2012, Ada 2005, Ada 95, and Ada 83), including all Specialized Needs AnnexesĄĄ GPS (GNAT Programming Studio), a powerful, extensible and
tailorable Integrated Development EnvironmentĄĄ Visual debugging support, including a remote interface for debugging
an embedded targetĄĄ Stack usage analysis tool (GNATstack)ĄĄ Compiler switch to help traceability of source to object code, for
GNAT Pro Safety-Critical product (-fpreserve-control-flow)ĄĄ Coding standard verification tool (GNATcheck)ĄĄ Additional tools, including a heap usage monitor, a unit testing
framework, a pretty printer, a program browser, an HTML generator, and a program metrics generatorĄĄ Libraries and bindings supplementing the standard Ada API,
including packages for services such as operating system interfaces, text manipulation and pattern matching, data structures and algorithms, and I/O operationsĄĄ Detailed and understandable documentation, including the GNAT Pro
User’s Guide and GNAT Pro Reference Manual
Other GNAT Pro advantages:ĄĄ Source code inclusion, allowing developers to understand important
implementation decisions.ĄĄ Quality assurance, based on a rigorous configuration management
process and extensive test suites.ĄĄ Dependable support is intrinsic to all AdaCore products and is
supplied by the GNAT Pro developers themselves. In essence, AdaCore serves as online consultants to customers’ projects. Questions on all aspects of Ada and GNAT Pro are answered promptly, comprehen-sively, and accurately. Blocking issues receive immediate attention; if appropriate, a wavefront release with the relevant repair can be provided.ĄĄ AdaCore can also provide specialized engineering and/or training
services based on specific customer requirements.
GNAT Pro is a robust and flexible Ada development environment based on the GNU GCC compiler technology. It provides:• a full Ada compiler that implements Ada 83, Ada 95, Ada 2005, and Ada 2012;• the GPS (GNAT Programming Studio) and GNATbench (Ada plugin for Eclipse)
Integrated Development Environments;• a comprehensive toolset including a visual debugger; and• a set of libraries and bindings.With GNAT Pro, users can develop pure Ada applications as well as Ada compo-nents in multi-language systems. GNAT Pro is distributed with complete source code, and is backed by frontline support service supplied by the product develop-ers themselves – the world’s largest and most experienced team of Ada experts.GNAT Pro has been used by industry and government customers worldwide in professional, mission-critical software products ranging from small-footprint real-time embedded applications to large-scale information management systems. It is available on more platforms, both native and embedded, than any other Ada technology.
BenefitsGGNAT Pro meets the real requirements of the professional user:Ada 2012 support: GNAT Pro is the first Ada environment to implement the latest versions of the language standard. With GNAT Pro, developers can exploit Ada 2005’s features such as enhanced object-oriented programming support, additional APIs, and the Ravenscar Profile. GNAT Pro users can likewise take advantage of Ada 2012’s many innovations including contract-based programming (pre/postconditions and type invariants), subtype predicates, conditional/case/parameterized/quantified expressions, and improved support for multiprocessors/multicores.Multi-language development: Thanks to the open standards used by GCC, GNAT Pro eases the job of developing applications comprising Ada and other languages such as C, Fortran, and C++. The Ada interfacing facilities are fully implemented.Support for safety-critical and high-security applications: Specialized GNAT Pro editions – GNAT Pro Safety-Critical and GNAT Pro High-Security – are respectively oriented towards applications that require certification against software safety standards such as DO-178B / DO-178C, and security standards such as the Common Criteria. These versions of GNAT Pro include several language pro-files (including the Ravenscar tasking subset) whose run-time support libraries simplify the certification effort. For safety-critical applications a source-to-object code traceability analysis is available, which directly supports one of the Level A verification objectives in the DO-178 standards. Excellent code quality: Efficient object code is achieved through a combination of Ada-specific and GCC back end optimizations; a supplemental tool reduces code size by removing unused subprograms from an executable. The run-time libraries have been tuned to provide high performance, with a special focus on efficient exception handling and tasking.Ease of transitioning from other Ada compiler systems: GNAT Pro implements several attributes and pragmas that ease the porting of existing Ada 83 or Ada 95 code bases to GNAT, and the Project Manager facility allows developers to adopt the same file naming conventions and directory structure as were used in the previous system.
For more information, please visit: http://www.adacore.com/products
GNAT Pro
AdaCorewww.adacore.com/products | www.adacore.com/customers [email protected] @AdaCoreCompany
Dev Tools and OSs
embedded-computing.com/p372870
FEATURES
ĄĄ Build Designs for FPGAs on WILD™ BoardsĄĄ Works from High Level, Data Flow Concept of the ApplicationĄĄ Combines GUI Design Entry and Debug Tools with Tested, Optimized
CoreFire Next™ IP CoresĄĄ Drag and Drop High and Low Level ModulesĄĄ CoreFire Next™ Modules Incorporate Years of Application Development
Experience – Highly Optimized and TestedĄĄ CoreFire Next™ Tools and Modules are IntelligentĄĄ Modules Automatically Handle SynchronizationĄĄ Manage Clocks and Other Low Level Hardware SignalsĄĄ Guarantee Correct Control by Design Modules “Know How” to Interact
with Each OtherĄĄ Board Support Packages Incorporate Hardware Details of the
Boards – Invisible to UsersĄĄ Single Precision Floating Point, Integer and Floating Point Complex
Data Types and Array Types. Provides Java FileĄĄ Supports Conversion Between Data Types – Bit, Signed and Unsigned
Integers Single Precision Floating Point, Integer and Floating Point Complex Data Types and Array TypesĄĄ Integrates with Matlab™ Simulation FlowĄĄ Works with all Annapolis Virtex™ 7 and Altera Stratix® V FPGA
processor and I/O boards BenefitsĄĄ Save Time to MarketĄĄ Save Development DollarsĄĄ Easy to Learn, Easy to UseĄĄ Works with Proven COTS BoardsĄĄ Concentrate on Solving Your ProblemĄĄ Reuse Your DesignĄĄ Training Classes, Application Support
The CoreFire Next Design Suite (compatible with all Annapolis Virtex™ 7 and Altera Stratix® V FPGA processor and I/O boards) is a dataflow-based development system that brings new levels of ease and speed to FPGA programming on Annapolis Micro Systems, Inc. high-performance motherboards, I/O cards, and mezzanine cards.
The CoreFire Next environment supplies user-made connec-tions between ready-made programming modules, or cores, and manages multiple domain requirements automatically. CoreFire Next eliminates the need for hardware design languages: the user simply creates dataflow diagrams by dragging and dropping cores, or building blocks, from the libraries, and connecting their ports. Cores automatically work together to handle synchroniza-tion, manage clocks and other low level hardware signals, and guarantee correct control by design. CoreFire Next allows stan-dard data types (see Data Types and Values) and supports data type propagation, where modifying a data type will automatically propagate through the rest of the CoreFire Next design. As a result, CoreFire Next allows the user to program and debug complex FPGA designs at a high level of proficiency.
CoreFire Next’s drag-and-drop method of building designs allows for ease of use, which helps make the tool easy to learn. CoreFire Next presents the user with a simple way of visualizing designs, rather than extensive and confusing code. Because of this, the user does not have to be a skilled or experienced digital hardware designer. Designers of many different disciplines can use CoreFire Next to create applications.
CoreFire Next Design Suite
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Dev Tools and OSs
embedded-computing.com/p372787
26 Embedded Computing Design | August 2015
Annapolis Micro Systems employs a select team of experi-enced FPGA designers dedicated to helping you solve your real-world processing challenges while minimizing your Time to Market. Our patented CoreFire and Corefire Next Design Suites provide high-speed solutions that get the application developed in record time, drastically reducing program cost and risk.
Annapolis Application Engineers are here to help you in the following ways:
Architect A Custom System Using Our Powerful COTS Products
Annapolis Application Engineers will help you create cus-tomized system architectures and determine appropriate hardware configurations using our COTS products. This service is provided for free in order to accelerate your program’s progress and guarantee the best and most efficient system architecture available.
Our process begins with a discussion of feasibility with a member of our sales team, and then moves to a roundtable con-versation with our lead engineers. We can collaborate with your staff to determine your project’s ideal system architecture and establish its hardware requirements.
Some customers choose to task their own in-house engineers on the design phase. If that option is selected, we can provide training for both our CoreFire and VHDL Application Development paths.
Learn more about our training classes.
FPGA Application Development Team
Annapolis Micro Systems, Inc.www.annapmicro.com/services-support/application-development-team/
[email protected] 410-841-2514
Dev Tools and OSs
embedded-computing.com/p372789
Develop FPGA Application and Integrate into a Turn-Key system
Annapolis can also help you with your FPGA Applica-tion Development. In these instances, we will work with your team to document the project’s specifica-tions, including its functional needs, schedule, and First Article Test (FAT) requirements.
Depending on the customer’s desire the application may involve passing data around the key data paths
and the customer will implement the processing IP later, while in other cases Annapolis will im- plement the whole application includ-ing the processing and GUI as a Turn-Key system.
The effort required to develop the application is then estimated and you are provided with a quote. If agree-able, we contract the project and our Applications Engineers develop the application with the CoreFire (Next) Design Suite, perform the FAT, and deliver the application. In addition we can provide integration support at the customer site when needed.
www.embedded-computing.com 27
FEATURES
LynxSecureĄĄ LynxSecure runs fully virtualized guest OSs such as Windows®,
Solaris, Linux®, Android, and Chromium OS, requiring no changes to the guest OSĄĄ LynxSecure offers the ability to run guest OSs that have
Symmetric Multi-processing (SMP) capabilitiesĄĄ Designed to maintain the highest levels of military security
offering a MILS architectural approach
LynxOS 7.0ĄĄ LynxOS 7.0 provides the ability for developers to embed
military-grade security directly into their devicesĄĄ LynxOS contains networking support for long haul networks
with TCP/IPV4, IPV6, 2G/3G/4G cellular and WiMax communication stacks. It also supports the short-haul networks common with M2M applications such as 802.11 WiFi, ZigBee wireless mesh and BluetoothĄĄ LynxOS is a true fully preemptive hard real-time OS with a
POSIX application interface
LynxOS-178ĄĄ LynxOS-178 provides full POSIX conformance, enabling
developers to take advantage of the time-to-market and investment-protection benefits of open standards-based developmentĄĄ Supported standards include ARINC 653 as well as support for
the Future Airborne Capability Environment (FACE) standard currently under developmentĄĄ LynxOS-178 is the only time- and space-partitioned RTOS that
has been awarded the FAA Reusable Software Component (RSC) for DO-178B certifications
RTOS andSecure Virtualization Software from
Lynx Software Technologies
LynxSecureLynxSecure provides one of the most flexible secure virtualiza-tion solutions for use in Intel® architecture based embedded and computer systems, including the new 4th generation Intel® Core™ i7 and Core™ i5 processors. LynxSecure is based on separation kernel technology and was designed from the ground up with security as a key design goal. Adding virtualization to the sepa-ration kernel allows for multiple different guest Operating Systems (OSs), both real-time and general purpose, to run in secure domains on a single embedded system. LynxSecure 5.2 is the latest version of this established product and adds a new feature that offers real-time detection of stealthy advanced persistent threats such as rootkits.
LynxOS 7.0LynxOS 7.0 is a deterministic, hard real-time operating system that provides POSIX-conformant APIs in a small-footprint embed-ded kernel. LynxOS provides symmetric multi-processing support to fully take advantage of multi-core/multi-threaded proces-sors. LynxOS 7.0 contains new security functionality designed for M2M devices. LynxOS 7.0 supports the most popular reference targets in the ARM and Intel PowerPC architectures, including the new 4th generation Intel® Core™ i7 and Core™ i5 processors.
LynxOS-178LynxOS-178 is a safety-critical COTS RTOS that fully satisfies the objectives of the FAA DO-178B level A specification and meets requirements for Integrated Modular Avionics developers. LynxOS-178 delivers the security and real-time responsiveness needed for safety-critical systems and provides a low-risk path to DO-178B certification for developers to meet the technical requirements in the production of software for airborne systems.
LynxSecure • LynxOS 7.0 • LynxOS-178
www.lynx.com [email protected] 800-255-5969 linkedin.com/company/lynxsoftwaretechnologies @LynxSoftware www.facebook.com/lynxsoftwaretechnologies
Dev Tools and OSs
embedded-computing.com/p372827
28 Embedded Computing Design | August 2015
GIZMO 2 specifications
ĄĄ Processor/performance: AMD Embedded G-Series SoC – GX210HA – 1GHz Dual-Core/85 GFLOPS
ĄĄ Board size: 4"x 4" form factor
ĄĄ Processor TDP: 9W
ĄĄ USB: 8 total with 4 onboard, 2 USB 2.0/additional USB 2.0 header, 2 USB 3.0 others can be brought out
ĄĄ Audio: HD audio in/out
ĄĄ Ethernet: RJ45 Gigabit Ethernet port
ĄĄ HDMI/DisplayPort/LVDS: HDMI video/audio output
ĄĄ Memory: 1GB DDR3-1600 SDRAM
ĄĄ SD: microSD card slot
ĄĄ PCIE: 4x1 links of PCIe Gen2 for GPP and 1x4 links of PCIe for GPU
ĄĄ SATA: 2x Gen3 – mSATA/mini PCIe connector
ĄĄ Embedded I/O: USB, GPIO, SPI programming port on board DAC, ADC
ĄĄ Tools: JTAG header
ĄĄ Operating systems: TimeSys Embedded Linux and Qt UI loaded on uSD and Linux, Minoca, RTOS, Windows Embedded 7 and 8
ĄĄ Kit contents: Gizmo 2 board;12V 2A universal power supply, international plug; adapter, uSD and coin cell
ĄĄ Price: $199
GizmoSphere is an x86 open source initiative. A community of developers. An embedded design environment. GizmoSphere is all that, accessed through one convenient portal. Launched in 2012 by semiconductor giant Advanced Micro Devices and open source firmware solutions provider Sage Electronic Engineering to support embedded developers everywhere, GizmoSphere provides resources that spark design innovation. GizmoSphere.org is free for visitors and members. Members enjoy extras including entering contests and participating in online discussions.
MISSIONOpen source isn’t just a nice idea anymore. It’s what’s expected. And that’s exactly how it should be. GizmoSphere is leading the way in open source x86 embedded development. We supply open source software, open source hardware, and even open source firmware.
VALUESTogether with our partners, we foster a worldwide community of developers who are passionate about creating better designs – and eager to share their technical savvy. Because when ideas are exchanged freely, everybody wins.
GIZMO 2 – POWERFUL. EXPANDABLE. PRACTICALLY UNBELIEVABLE.The Gizmo 2 platform is the second-generation x86-based DIY single-board-computer (SBC) from Gizmosphere. Expanding on the community’s first platform, Gizmo 2 merges a performance increase coupled with a power-consumption decrease and direct access to a wide range of interfaces − GPIO, ADC/DAC, PWM, SPI, USB, SATA and PCIe – plus an updated selection of peripheral interfaces, includ-ing the much-requested HDMI dedicated port, an mSATA port for connecting SSDs, and a microSD card slot.Built upon the CPU and GPU technology behind today’s leading video game consoles, data centers and PCs, and coupled with a complete open-source development ecosystem, the limitations of Gizmo 2 are only bound by your imagination.
Power your ideaswith the Gizmo Board.
GizmoSphere: Development Unleashed
GizmoSpherewww.gizmosphere.org
[email protected] www.facebook.com/GizmoSphere @GizmoSphere
DIY
embedded-computing.com/p372845
www.embedded-computing.com 29
FEATURES
ĄĄ 10U High with Front Mounted OpenVPX Card Cage
ĄĄ Primary 12 Slot OpenVPX High Speed Switched Backplane with RTM Support
ĄĄ Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane for Power Only Payload Cards
ĄĄ Up to 3200 Watt Power Supply
ĄĄ Backplane Profile: BKP6-CEN12-11.2.X
ĄĄ Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1
ĄĄ Switch Profile: SLT6-SWH-16U20F-10.4.2
11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX switched topology backplane capable of 10Gbps+ signalling com-promising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane.
The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″VITA 48.1.
The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expan-sion Plane. The Data Plane of the backplane is arranged in a dual-star configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent Payload Slots.
In addition to the Primary Backplane there is also an option for a Sec-ondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors. These slots are ideally suited for Clock Distribution boards, Tuners or other non-IO intensive FPMs.
The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.
The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.
Wild40 12-Slot OpenVPX 6U Chassis
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Hardware
embedded-computing.com/p372673
Annapolis is famous for the high quality of our products and for our unparalleled
dedication to ensuring that the customer’s applications succeed.
We offer training and exceptional special application development support, as well as
more conventional support.
30 Embedded Computing Design | August 2015
FEATURES
ĄĄ If you have an application requiring connections to a transceiver inter-face, with manual push-to-talk signaling control, echo suppression, and VOX resources, the AMTELCO E&M interface boards are a great solution!ĄĄ Standard Type I, Type IV, and Type V E&M protocols are also supported.
Audio interfaces support both 2-wire and 4-wire modes and can be configured on a per-port basis.ĄĄ AMTELCO E&M interface boards are available as 4-port (x1) half-height
boards for HMP environments, as well as 8-port (x1) full-length boards for H.100 TDM switching environments.ĄĄ Software drivers are available for most common operating systems,
including channel drivers for use in Asterisk® environments.ĄĄ AMTELCO boards are also available for alternate line interface types, in
both HMP and H.100 form factors. Interfaces include Station interface (FXS), Loop Start interface (FXO), and T1/E1/ISDN digital interfaces.
AMTELCO E&M interface boards accommodate connections to a transceiver interface, with manual push-to-talk signaling control, echo suppression, and VOX resources. Standard Type I, Type IV, and Type V E&M protocols are also supported. Audio interfaces support both 2-wire and 4-wire modes and can be configured on a per-port basis. AMTELCO E&M interface boards are available as 4-port (x1) half-height boards for HMP environments, as well as 8-port (x1) full-length boards for H.100 TDM switching environments. Software drivers are available for most common operating systems, including channel drivers for use in Asterisk® environments.
AMTELCO boards are also available for alternate line interface types, in both HMP and H.100 form factors. Interfaces include Station interface (FXS), Loop Start interface (FXO), and T1/E1/ISDN digital interfaces.
AMTELCO PCI and PCI Express E&M Interface Boards
Hardware
embedded-computing.com/p372824
Amtelcoxds.amtelco.com
[email protected] 800-356-9224 www.linkedin.com/company/amtelco twitter.com/AmtelcoXDS
The MitySOM-5CSx combines the Altera Cyclone V SoC, memory sub-systems and onboard power supplies into a highly-configurable, small form-factor System on Module (SOM). All products in the MitySOM-5CSx family are pin-for-pin compatible, allowing development teams room to grow and the flexibility to quickly and cost-effectively meet customers’ ever-changing needs.
The MitySOM-5CSx family offers a wide range of processing densities, speed grades, and temperature options at competitive costs. Critical Link designed the SOM family with rigorous industrial, medical, and defense applications in mind, ensuring long-term production and professional support for our customers.
Standard SOMs and development kits are available today from numerous major distributors. If a standard variant does not meet your specification, contact Critical Link to discuss developing a custom solution.
MitySOM-5CSx: Altera Cyclone V SoC-based SOM
Hardware
embedded-computing.com/p372770
Critical Linkwww.criticallink.com/product/mitysom-5csx/
[email protected] 315-425-4045 www.linkedin.com/company/critical-link-llc twitter.com/Critical_Link
MitySOM-5CSx features a Hard Processor System (HPS) providing up to 4,000 MIPS at speeds of up to 925MHz per core and is com-bined with a NEON coprocessor with double-precision FPU. The MitySOM-5CSx combines a Cyclone V with up to 2GB of DDR3 CPU/FPGA RAM with ECC, 512MB of dedicated DDR3 FPGA RAM (optional) and up to 48MB of QSPI NOR Flash creating a high- bandwidth system for embedded applications. The ARM architecture supports several high level operating systems, including Embedded Linux, Micrium uC/OS, Android, QNX, and Windows Embedded Compact.
By combining six 3.125Gbps transceivers, one PCIe hard core, up to 133 user I/O, and dual Gigabit Ethernet interfaces, the system can simultaneously acquire and efficiently process large amounts of data.
www.embedded-computing.com 31
FEATURES
ĄĄ InterShell is a new aluminum housing enclosure composed of a top and bottom, two front panels, and four screws.ĄĄ The simple housing design offers an uncomplicated solution for small
form factors for easy and quick assembly.ĄĄ Color options are unlimited and customer-specific print is possible.ĄĄ InterShell is used for the packaging of small electronic units such as
Eurocard formats with 100x160 mm, universal formats, or as mITX formats for example.ĄĄ Excellent EMC compliancy.ĄĄ InterShell is available in the following standard dimensions (h/w/d)
as well as customized formats: • 40x106.6x168.6 mm • 60x150x120 mm • 50x190x190 mm
Intermas develops electronic enclosure systems:Cabinets, housings, subracks, and an extensive range of accesso ries for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.
Intermas has an extensive product range of more than 10,000 sepa rate components and more than 30 years’ experience.
Go towww.Intermas-US.com
for our new catalog.
InterShell Enclosures
Hardware
embedded-computing.com/p372684
Intermas US LLCwww.Intermas-US.com
[email protected] 800-811-0236
FEATURES
• 2, 6 and 14 slot backplanes• 40 Gbps (10GBASE-KR) transmission rate• Up to 450 watts/slot cooling• AC & DC power entry modules• Various cooling configurations available• Designed to meet NEBS, PICMG 3.0• Proven performance, test reports available
450/40 and 300/40 ATCA chassis are designed to support the next gen-eration of ATCA board requirements, minimizing the time to market for critical, high-availability applications where high performance is crucial.With superior physical construction, optimal cooling, reliable power supplies, efficient data distribution and secure system management, Pentair’s Schroff ATCA solutions are your choice for a dependable solution.The 450/40 series ATCA systems offer generous head room for power and cooling capabilities. Both product families feature Pentair’s leading edge 40 Gbps backplane design, shelf management and proven hardware quality.Deploying these chassis ensure your integrated solutions will continue to perform at the highest level as network requirements grow and higher performing ATCA boards become available.
450/40 and 300/40 Series ATCA Systems
Hardware
embedded-computing.com/p372873
Pentair/Schroffwww.pentairprotect.com [email protected] 800-525-4682
32 Embedded Computing Design | August 2015
FEATURES
• Conform to PICMG specifications• ATCA, uTCA, CompactPCI standards• Standard and customized solutions available• Local and global design and product support• Drawings and models available• Part and quantity restrictions may apply
Express Programs: When product is needed fastNeed systems, subracks, cases or front panels quickly for prototyping or small projects? Express service provides rapid delivery turn-arounds for solutions engineered to meet your design requirements – in a matter of days.Systems Express• ATCA, MicroTCA, CompactPCI, and CompactPCI Serial models available• Shipped in as few as 15 daysSubrack & Cases Express• EuropacPRO subrack kits, parts and accessories• RatiopacPRO case kits, parts and accessories• Delivered in as few as 15 daysFront Panel Express• 5 to 50 front panels• Custom cut-outs, handles and silk screen• Delivered in as few as 5 days
Express Programs
Hardware
embedded-computing.com/p372874
Pentair/Schroffwww.pentairprotect.com/en/na/schroff-express [email protected] 800-525-4682
FEATURES
• Available with three levels of service options: off-the-shelf, modified or customized
• Off-the-shelf configurations are available in 1, 2 or 3U and various widths and depths
• 21 different case sizes with solid side panels and 19 case sizes with perforated side panels for forced air cooling
• Removable front and rear panels for easy modification• Easy assembly and disassembly with only two screws for simple
integration of PCB• Integral EMC protection with interlocking case walls• Additional modifications include case color, cut-outs and printing on
front and rear panels
Flexible Enclosure Platform for Small Form Factor PCBs
A market leader in modular 19-in. systems, Schroff® has expanded its electronics protection capabilities with the new Interscale M. This new, versatile enclosure platform for PCBs offers a solution for 19-in. and smaller form factor applications. Designed to meet changing market trends toward miniaturization and individualization, Interscale M minimizes integration time with quick assembly and easy access to PCBs.
Interscale M protects valuable electronics with EMC shielding, and is available in a variety of designs and finishes tailored to unique specifications and corporate identities. It offers simplicity, flexibility and innovation in one unique package.
Interscale M
Hardware
embedded-computing.com/p372875
Pentair/Schroffwww.schroff.biz/interscalem [email protected] 800-525-4682
www.embedded-computing.com 33
FEATURES
ĄĄ Complete Serial FPDP record and playback system
ĄĄ Lowest-cost entry into serial FPDP
ĄĄ Quick delivery: Model RTV 2602 ships from stock
ĄĄ 4U 19-inch industrial rackmount PC server chassis
ĄĄ Windows® 7 Professional workstation with high-performance Intel® CoreTM i3 processor
ĄĄ Real-time aggregate recording rates up to 400 MB/sec
ĄĄ 4 TB of data storage to NTFS RAID disk array
ĄĄ SystemFlow® recording software
ĄĄ C-callable API for integration of recorder into application
ĄĄ File headers include time stamping and recording parameters
ĄĄ Optional GPS time and position stamping
The RTV 2602 supports up to four independently clocked Serial FPDP links using copper or optical cables with single-mode or multimode fibre with flexible baud rate selection to support virtually all popular Serial FPDP interfaces. It is capable of both receiving and transmitting data over these links and supports real-time data storage to disk and playback from disk. Up to four channels can be recorded or played back simultaneously with an aggregate rate of up to 400 MB/sec. Providing 4 TB of data storage, the six enterprise-class, hot-swap-pable front-panel disk drives can be easily replaced by empty drives when full.
Ease of OperationAll Talon recorders are built on a Windows 7 Professional workstation and include Pentek's SystemFlow® software, featuring a GUI (graphi-cal user interface), signal viewer, and API (Application Programming Interface). The GUI provides intuitive controls for out-of-the-box turn-key operation using point-and-click configuration management. Configurations are easily stored and recalled for single-click setup. User settings to configure data format for the signal viewer provide a virtual oscilloscope and spectrum analyzer to monitor signals before, during and after data collection. The C-callable API allows users to integrate the recorder control into larger application systems.
Free DemoPentek provides a Talon Recording System Simulator for evaluation of the SystemFlow software package. This free trial package is available for download.
Talon Family SummaryRTV Value Series: Low Cost Rackmount Systems laboratory environmentsRTS Commercial Series: Rackmount Systems for laboratory environmentsRTR Portable Series: Rugged Portable Systems for field useRTR Rackmount Series: Rugged Rackmount Systems for field useRTX Extreme Series: Rugged Rackmount Systems for extreme environments
RTV 2602 Talon Serial FPDP Value Rackmount Recorder
Pentekhttp://www.pentek.com/go/rtv2602
[email protected] 201-818-5900 www.linkedin.com/company/pentek www.twitter.com/pentekinc
Hardware
embedded-computing.com/p372836
34 Embedded Computing Design | August 2015
FEATURES
High Reliability • -40° to +85°C Operating Temperature • No moving parts • Latching connectors • High shock and vibeProduct Highlights • One, two, and four-core models • 4th Generation Intel® Atom™ processor • Trusted Platform Module (TPM) • VGA and dual DisplayPort • Mini PCIe/mSATA socket • Two gigabit Ethernet ports • USB 3.0 and five USB 2.0 ports • Windows, Linux, VxWorks, etc.
Bengal is a rugged new PCIe/104 Single Board Computer (SBC) based on Intel’s highly acclaimed “Bay Trail” processor. It combines high performance, low power consumption, enhanced security, and small size.
Available in three performance levels; single, dual, and quad core. The quad core model delivers 2x the performance of a “Montevina” Core 2 Duo pro-cessor, with a 38% reduction in power consumption!
Bengal includes an extensive set of features including PCIe/104 expansion and a Trusted Platform Module (TPM) security chip. The Bengal’s powerful feature set, combined with a low-power draw and compact PC/104 footprint, enables the next generation of intelligent medical, military, and industrial systems to be smaller, lighter, and more energy efficient.
With its high performance and low power consumption, Bengal is a natural fit for new product designs, and for migration or upgrade from older PC/104 products. It is an excellent upgrade for systems currently using Atom or Core 2 Duo processors.
The Bengal is backed by VersaLogic’s 5-year warranty and product life extension programs that can continue delivery well past the year 2025.
PC/104 “Bay Trail” Single Board Computer
Hardware
embedded-computing.com/p372876
VersaLogic Corporationwww.VersaLogic.com/Bengal
[email protected] 503-747-2261 www.linkedin.com/company/versalogic-corporation
VERSALOGICC O R P O R A T I O N
FEATURES
SWaP • Small size: 55 x 84 x 22 mm • Low weight: 102 grams (< 4 oz.) • Low power: Single core < 6W • Low power: Quad core < 7WProduct Highlights • Quad-, dual-, and single-core models • 4th Generation Intel® Atom™ processor • -40°C to +85°C operation; Wide input voltage (8V – 17V) • Soldered-on RAM (up to 4 GB); Soldered-on eMMC Flash (up to 8 GB) • Mini PCIe/mSATA expansion socket • microSD flash socket • Gigabit Ethernet • Two serial/COM ports; Four USB 2.0 ports • MIL-STD-202G Shock and Vibration; LVDS video output
This next generation of VersaLogic Embedded Processing Unit (EPU) format combines processor, memory, video, and system I/O into an extremely compact full function embedded computer with a footprint the size of a credit card!The Hawk was engineered to meet the military, avionic, and medical industries’ evolving requirements for smaller, lighter, and more powerful embedded systems. Roughly the size of a credit card and less than one inch thick, it combines the new 4th generation Intel® Atom™ “Bay Trail” processor, with system interfaces, in a highly integrated format designed to withstand extreme temperature, impact, and vibration.Hawk is available in single-, dual-, and quad-core models. The quad-core model delivers more than 5X the performance of previous generation products with an 18% reduction in power consumption! The single-core version provides over 2X the performance of the previous generation product, with a 25% reduction in power. The quad-core is ideal for UAV video applica-tions where higher performance and light weight are importantThe Hawk is backed by VersaLogic’s 5-year warranty and product life extension programs that can continue delivery well past the year 2025.
Ultra Small “Bay Trail” Embedded Computer
Hardware
embedded-computing.com/p372877
VersaLogic Corporationwww.VersaLogic.com/Hawk
[email protected] 503-747-2261 www.linkedin.com/company/versalogic-corporation
VERSALOGICC O R P O R A T I O N
www.embedded-computing.com 35
ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale sys-tems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource.Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits.The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.
mPCIe-COM Family PCI Express Mini Cards
Industrial
embedded-computing.com/p372691
ACCES I/O Products, Inc.www.accesio.com
[email protected] 1-858-550-9559 linkedin.com/company/acces-i-o-products-inc. twitter.com/accesio
FEATURES
ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O con-nectorsĄĄ 4 or 2-port serial communication cards with optional DB9M connectivityĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port
stored in EEPROMĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX
and RXĄĄ Port-by-port field selectable termination for RS-422/485 applicationsĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232
up to 921.6 kbps)ĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supportedĄĄ RS-232 only and RS-422/485 versions available
The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communica-tions. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming.The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly dam-age to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out.The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.
mPCIe-ICM Family PCI Express Mini Cards
Industrial
embedded-computing.com/p372557
ACCES I/O Products, Inc.www.accesio.com
[email protected] 1-858-550-9559 linkedin.com/company/acces-i-o-products-inc. twitter.com/accesio
FEATURES
ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectorsĄĄ 4 or 2-port mPCIe RS232 serial communication cardsĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation
port-to-port on ALL signalsĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each
TX and RXĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication speeds up to 1 Mbps simultaneouslyĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ 9-bit data mode fully supportedĄĄ Supports CTS and RTS handshaking
36 Embedded Computing Design | August 2015
FEATURES
ĄĄ 4th Generation Intel® Core™ i7/i5/i3 Desktop Processor with Intel Q87/H81 Chipset ĄĄ Dual SODIMM DDR3L-1600 memory sockets supportingup to 16 GB ĄĄ PCIe x16, PCIe x1 and Mini PCIe expansion slotsĄĄ DisplayPort outputs on rear IOĄĄ High Definition Audio with 7.1 channelsĄĄ 12V DC-in and ATX power supply unit support, 12V DC-in support
with 14 pin ATX power connectorĄĄ ATX PSU minimum load issueĄĄ Vertical onboard USB 2.0 for a security dongle, designed for
Infotainment applications
The AmITX-HL-G is a Mini-ITX embedded board supporting the Desktop 4th Gen-eration Intel® Core™ i7/i5/i3 and Pentium®/Celeron® Processor with Intel® Q87/H81 Chipset. The AmITX-HL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.
The AmITX-HL-G features three DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Expansion is provided by one PCIe x16, one PCIe x1, and two mini-PCIe slots. The onboard feature connector provides GPIO, SMBus, and I2C support. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.
The ADLINK AmITX-HL-G with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-HL-G is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
AmITX-HL-G Mini-ITX Embedded Board
Industrial
embedded-computing.com/p372682
ADLINKhttp://www.adlinktech.com/Industrial-Motherboards-SBC/Mini-ITX.php
[email protected] +1-408-360-0200
BENEFITSĄĄ Remote Management – Reduce administration and maintenance costs and power
consumption through service alerts, remote diagnostics, and the ability to remotely schedule the turn on or off of stations.ĄĄ I/O Support – Ongoing support of legacy I/O such as fieldbus, and discrete I/O inter-
faces. Migration path to the latest in high-speed I/O through support of PCI Express, USB 3.0 and SATA.ĄĄ Ruggedization – Platform designs that operate reliably in high-shock and vibration
environments through small footprint BGA package options.ĄĄ Compatibility – PC-compatible x86 architecture provides native support for Microsoft
Windows®, Linux®, and a variety of popular real-time and safety certified operating systems.ĄĄ Integration – Support for AMD-V™ hardware virtualization enables a graphics centric
non-deterministic operating system to run alongside a deterministic hard real-time operating system.ĄĄ Scalability – Footprint compatible options within processor families help enable a
single design to serve the needs of multiple performance, power and price solutions.
With factory-floor and other industrial applications becoming increasingly sophis-ticated and complex, AMD’s embedded solutions for Industrial Control and Auto- mation address the evolving demands of these markets with very low power, scalable, x86 performance-based solutions. AMD Industrial Control and Auto- mation solutions serve diverse applications ranging from headless sensor and control systems to complex display systems with easy-to-use human-machine interfaces (HMIs) and highly integrated controllers.
AMD INDUSTRIAL CONTROL AND AUTOMATION SOLUTIONSFor low power and cost sensitive applications, the processors in the AMD Embedded G-Series family are built around an optimized power efficient core that delivers CPU and graphics performance in a compact ball grid array (BGA) package, providing a good fit for low-power and low-cost designs. For high performance applications that require the integration of functions or high performance, the AMD Embedded R-Series APUs (Accelerated Processing Units) deliver exceptional CPU, graphics and compute performance in a solution that is still power efficient.While traditional benefits of these solutions include longevity and low power con-sumption, applications built around the AMD G-Series APUs and SOCs and R-Series APUs also offer graphics and compute capabilities not typically found in solutions targeting Industrial Control and Automation.
Power and Performance Scalability with the Key Features for Industrial Control and Automation Solutions
Industrial
embedded-computing.com/p372846
AMD Embedded Solutionswww.amd.com/industrial
[email protected] 408-749-4000 www.linkedin.com/company/amd @AMDembedded
www.embedded-computing.com 37
38 Embedded Computing Design | August 2015
FEATURES
ĄĄ AMD Embedded G-Series APUĄĄ IP65-protected housingĄĄ Ethernet, USB 2.0, CAN, Serial I/O at frontĄĄ WLAN, GSM (2G), UMTS (3G), LTE (4G) via 2 PCI Express Mini Card slotsĄĄ GPS or GLONASS onboardĄĄ 24 VDC and 36 VDC nom. (10 to 50.4 V) class S2 power supply, incl. ignitionĄĄ -40 to +85°C operating temperature, fanlessĄĄ Compliant to EN 50155 (railways)ĄĄ Compliant to ISO 7637-2 (E-mark for automotive)ĄĄ Compliant to EN 60945 (ship)
The new IP65-rated, maintenance-free box computer is ideal for data acquisition in extreme environments throughout a number of in-vehicle applications, such as trains, commercial vehicles, mobile machines and ships.All external interfaces, including USB, digital I/O, Gigabit Ethernet, CAN bus and legacy serial I/O, are implemented on rugged M12 connectors for reliable data transmission. Offering a protection class of IP65, certifiable to EN 50155 (railway) or EN 60945 (shipping) and conforms to ISO 7637-2 (E-mark for auto-motive).The BC50R starts with a powerful, energy-efficient T48N AMD Embedded G-Series APU running at 1.4 GHz. Inside the system, two PCI Express Mini card slots with two SIM card slots offer WLAN, GPS, other GNSS or 3G/4G functional-ity. The BC50R is equipped with 2 GB of DDR3 SDRAM and offers SD card and mSATA slots. Additional memory resources include 64 KB of L1 cache and 512 KB of L2 cache. An extremely robust aluminum housing protects the internal electronics, and the system’s fanless design operates at temperatures from -40°C to +70°C (+85°C for up to 10 minutes).The new box PC supports either a 24 VDC and 36 VDC nom. (10 V to 50.4 V) class S2 power supply in compliance with EN 50155 or power supplies with a nominal input voltage of 24 V that either comply with ISO 7637-2 or EN 60945.
BC50R
Industrial
embedded-computing.com/p372851
MEN Micro Inc.www.menmicro.com
[email protected] 215-542-9575 www.linkedin.com/company/men-micro-inc- http://twitter.com/MENMicro
FEATURES
ĄĄ Variety of Processors and Form FactorsĄĄ Application Specific I/OĄĄ Rugged, Solid State OperationĄĄ Vibration ResistanceĄĄ Extended Operating TemperatureĄĄ Long-term AvailabilityĄĄ Superior Life Cycle Management
COM Express is a widely supported implementation of Computer on Module (COM) design. The COM Express architecture reduces the complexity, cost and time required for custom computer system design by combining the processing, memory, video, Ethernet and USB functionality in a small, highly-integrated module.
COM Express modules install on a carrier board that provides the application specific I/O and external connectors best suited for the system requirements.
COM Express
Industrial
embedded-computing.com/p372880
Sealevel Systems Incwww.sealevel.com/store/computing-hmi/com-express.html [email protected] 864-843-4343
www.embedded-computing.com 39
FEATURES
ĄĄ Made in the USA
ĄĄ Most rack accessories ship from stock
ĄĄ Modified ‘standards’ and customization are our specialty
ĄĄ Card sizes from 3U x 160mm to 9U x 400mm
ĄĄ System monitoring option (CMM)
ĄĄ AC or DC power input
ĄĄ Power options up to 1,200 watts
VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.
Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.
Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.
Series 790 is MIL-STD-461D/E compliant and certified, economi-cal, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.
All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.
For more detailed product information,
please visit www.vectorelect.com
or call
1-800-423-5659 and discuss your application
with a Vector representative.
cPCI, PXI, VME, Custom Packaging Solutions
Vector Electronics & Technology, Inc.www.vectorelect.com
[email protected] 800-423-5659
Industrial
embedded-computing.com/p371649
40 Embedded Computing Design | August 2015
FEATURES
ĄĄ Multi-Core Intel® Atom™ E3800 Processors ĄĄ Up to 2 GB Soldered Down DDR3 RAMĄĄ Two Fully Independent Displays (VGA, DisplayPort & LVDS)ĄĄ 1 Gb Ethernet ControllerĄĄ Fanless -40° to +85°C operational temperatureĄĄ 4 Serial Ports and 4 USB 2.0 portsĄĄ 24 Bidirectional GPIO with event senseĄĄ Bus Expansion: MiniPCIe, PC/104 & PC/104-PlusĄĄ Bootable SATA, CFAST, and mSATA
The PPM-C407 from WinSystems utilizes the E3800 family of Atom™ processors from Intel® to provide low power and performance in the versatile PC/104 form factor. Designed for harsh environments and reliability, it includes soldered RAM for added shock and vibra-tion resistance with an operating temperature range from -40°C up to +85°C.
WinSystems is offering the PPM-C407 in multi-core options depend-ing on the application requirements. The scalable performance allows you to choose between low power single-core and higher perfor-mance dual or quad-core solutions.
Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options.
PPM-C407 – Low Power PC/104 SBC with Long Term Availability
Industrial
embedded-computing.com/p372685
WinSystemswww.winsystems.com
[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc
FEATURES
ĄĄ Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 ProcessorsĄĄ Fanless -40° to +85°C operational temperatureĄĄ Powered by PoE or +10-50VDC InputĄĄ 10/100/1000 Ethernet with IEEE-1588™
ĄĄ USB 2.0 and USB On-The-Go PortsĄĄ FlexCAN and RS-232/422/485 Serial PortsĄĄ 24 GPIO tolerant up to 30VDCĄĄ Mini-PCIe and IO60 (I2C, SPI, TTL, and PWM) expansion
Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® proces-sor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability.
Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.
SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux
Industrial
embedded-computing.com/p372204
WinSystemswww.winsystems.com
[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc
www.embedded-computing.com 41
FEATURES
ĄĄ Multi-Core Intel® Atom™ E3800 ProcessorsĄĄ Up to two independent displays (VGA, LVDS and DisplayPort)ĄĄ Two Ethernet Controllers with IEEE 1588 time stampingĄĄ Two RS-232/422/485 Serial portsĄĄ Bus Expansion (Two MiniPCIe and IO60)ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)ĄĄ Bootable SATA, CFAST, and mSATAĄĄ Wide range 10 to 50V DC inputĄĄ Fanless -40° to +85°C operational temperature
The SBC35-CC405 series of small form factor computers utilizes the Intel® Atom™ E3800 family of processors in a standard 3.5-inch SBC format. The COM Express based solution includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels, USB 3.0, and +10 to +50V DC input.
Engineered for rugged applications, the low-profile thermal solu-tion creates a sturdy base that protects the PCB assembly, provides convenient mounting, and enables fanless extended temperature operation.
Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.
SBC35-CC405 – Industrial Small Form Factor Computers
Industrial
embedded-computing.com/p372206
WinSystemswww.winsystems.com
[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc
FEATURES
ĄĄ Freescale® i.MX 6Q™ Industrial Processor @ 800MHzĄĄ Fanless -40° to +85°C operational temperatureĄĄ Powered by PoE or +10-50VDC InputĄĄ High Performance Video and GraphicsĄĄ Gigabit Ethernet (GbE) with IEEE-1588ĄĄ Six USB 2.0 Ports and One USB On-The-Go PortĄĄ Two CAN PortsĄĄ Five (RS-232/422/485) Serial Ports up to 1MbpsĄĄ 24 Lines GPIO Tolerant up to 30V DCĄĄ CFAST, SD, and MicroSD Sockets
WinSystems’ SYS-398Q quad-core industrial computer combines high-performance multimedia graphics with a rich mixture of Industrial I/O. The Freescale® i.MX 6Q™ processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphics applications in security, transportation, medical, and digital signage.
The low power, high-performance of ARM® cores coupled with readily available software tools make them an excellent choice for embedded systems. Leveraging Freescale’s proven track record in long term product support with the operating system and application development driven by consumer ARM® devices, the SYS-398Q is ideal for off-the-shelf industrial designs.
WinSystems OS starter image now ships with real time patches applied to the Linux kernel for improved determinism in process control applications.
SYS-398Q – Enclosed Industrial ARM with Real-Time Linux
Industrial
embedded-computing.com/p372687
WinSystemswww.winsystems.com
[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc
FEATURES
ĄĄ Multi-Core Intel® Atom™ E3800 ProcessorsĄĄ Up to two independent displays (VGA and DisplayPort)ĄĄ Two Ethernet Controllers with IEEE 1588 time stampingĄĄ Two RS-232/422/485 Serial portsĄĄ Internal Bus Expansion (Two MiniPCIe and IO60)ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)ĄĄ Bootable SATA, CFAST, and mSATAĄĄ Wide range 10 to 50V DC inputĄĄ Fanless -40° to +85°C operational temperature
The SYS-405 series of industrial computers utilizes the Intel® Atom™ E3800 family of processors in a tough aluminum enclosure. The solutions include two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels (RS-232/485/422), four USB, audio, and +10 to +50V DC input.
The rigid enclosure base is engineered for rugged applications and provides the thermal solution for the processor. The 5052 aluminum alloy enclosure protects the PCB assembly and includes access to the CFAST connector.
Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.
SYS-405 – Rugged Industrial Computers
Industrial
embedded-computing.com/p372202
WinSystemswww.winsystems.com
[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc
Designing safe, reliable automotive PCBsBy Isola Group
Today’s automobiles contain in excess
of 100 electronic control units, managing virtually all aspects of their operation. Electronic control units and sensors are used to improve engine performance and efficiency, provide stability and traction control including braking, deploy active safety systems such as airbags and increasingly provide driver safety systems.
Reliability is a key driver for PCB designers in the automotive market. Isola has developed products to provide superior thermal endurance, both with respect to operating temperature and thermal cycling perfor-mance, achieved with patented filler technology, meeting or exceeding the most demanding automotive customer requirements.
The need for advanced automotive safety and driver assistance systems such as collision avoidance and emergency braking, blind spot detection and lane departure warning are increasing with both regulatory man-dates and consumer demand for improved safety. Isola have been suc-cessful in developing extremely cost-effective alternatives to PTFE and other commercial microwave laminate materials in order to engage with the mass-market deployment of these systems.
Astra® MT laminate materials have been successfully evaluated with Freescale® Semiconductor radar ICs in automotive advanced driver assistance systems (ADAS). Astra MT laminates are a breakthrough, very low-loss dielectric constant (Dk) product for millimeter wave fre-quencies and beyond.
Astra MT laminate materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range. Astra MT is suitable for many of today’s commercial RF/microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C at up to 20 GHz. In addition, Astra MT offers a lower dissipation factor (Df) of 0.0017, making it a cost-effective alternative to PTFE and other commercial microwave lami-nate materials.
Key applications include long antennas and radar applications for auto-mobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.
www.isola-group.com/product-category/automotive
Automotive Executive Speakout
42 Embedded Computing Design | August 2015
FEATURES
ATP Industrial Grade DRAM ProductsĄĄ JEDEC compliantĄĄ Extensive support on DDR4,DDR3, DDR2, DDR1, and PC133
SDRAM generation memory modulesĄĄ Industrial Grade temperature range (-40°C to 85°C)ĄĄ Conformal coating for environmentally rugged applicationsĄĄ Long-term supply chain commitment upon module
qualificationĄĄ ATP patented TDBI System – the next generation test during
burn-inĄĄ Extra 30μ" thickness golden finger
ATP Industrial Grade Flash ProductsĄĄ SLC NAND Flash ComponentsĄĄ ATP patented PowerProtector Technology – Data integrity
during a sudden power downĄĄ SMART Life Monitor Technology – Flash health status
feedback to hostĄĄ Integrated Secure Erase TechnologyĄĄ Industrial Grade temperature range (-40°C to 85°C)ĄĄ Supply chain road maps by BOM upon product qualificationĄĄ Onboard AES Encryption (SSD Products)
New SATA III Products • 2.5" SSD SII Pro • CFast • 2.5" SSD MV • mSATA • M.2 2260/2242 • SlimSATA
ATP Industrial Grade DRAM ProductsATP DRAM Modules are designed for high-performance, mission-critical applications such as Industrial PC and Networking/Telecom, where high levels of technical support, operating consistency, and wide operating temperature ranges are required. Built with high quality IC components and 100% tested, the ATP DRAM module family includes a full spectrum of form factors including VLP, ULP, UDIMM, RDIMM, SODIMM, and MINI-DIMM, as well as multiple generations of DRAM technologies.
ATP has a long history of providing long-term support and addressing specific requirements of OEM customers. The new ATP Manufacturing, Testing and Validation facility offers enhanced manufacturing quality and TDBI/ATE testing capabilities on all DRAM product lines.
ATP Industrial Grade NAND Flash ProductsFlash Product Line Summary: Memory Cards (microSD/SD), Embedded Modules (SATA, USB, eUSB), and HDD Replacement SSD (2.5" SATAII/III).
ATP Industrial Grade NAND Flash Products are designed for high-performance, mission-critical applications such as Automotive, Healthcare, Networking/Telecom, Military, etc, where high levels of durability, operating consistency, and wide operating tempera-ture ranges are required. All ATP Industrial Grade NAND Flash products implement ECC and wear-leveling algorithms to maxi-mize NAND Flash component utilization and long-term data integ-rity. The product line is also built using SLC (Single Level Cell)-type NAND Flash components, which are specified to at least 20 times greater the rating for program/erase cycles (lifetime) compared to commercial and consumer level MLC-type NAND Flash.
ATP is a true manufacturer with over twenty years of experience in the production of NAND Flash memory solutions and DRAM memory modules. ATP offers in-house design, testing and product tuning, as well as extensive supply chain support with controlled/fixed BOMs and long product life cycles.
ATP DRAM and NAND Flash Products
ATP Electronicswww.atpinc.com
[email protected] 408-732-5000
Industrial Storage
embedded-computing.com/p372826
www.atpinc.com
www.embedded-computing.com 43
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. SMARC form factor module, the LEC-BT, is certified by Intel for Intel® Gateway Solutions for the Internet of Things (IoT) using Windriver and McAfee software integration. Paired with ADLINK's device-to-cloud platform SEMA Cloud (Smart Embedded Management Agent) that enables remote monitoring control and management, the LEC-BT is an ideal building block for developing IoT devices with a secure interconnection to the cloud.The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
SMARC Full Size Module System-on Chip
IoT
embedded-computing.com/p372404
ADLINKhttp://opsy.st/SMARC-LEC-BT
[email protected] +1-408-360-0200
FEATURES
ĄĄ Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-ChipĄĄ Up to 8 GB DDR3L at 1066/1333 MHz (ECC)ĄĄ HDMI and LVDS, onboard eMMCĄĄ GbE, camera interfaceĄĄ 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIOĄĄ Extreme Rugged™ operating temperature: -40°C to 85°C
The right security for the Internet of ThingsBy Steve Hanna, Senior Principal Technical Marketing, Chip Card & Security Division, Infineon Technologies
The Internet of Things (IoT) is creating a world where physical objects are seamlessly integrated into the infor-mation network. The IoT will change the
way we live, work and communicate. No business will be unaffected in the long term. With such huge potential to connect billions of objects, new services and opportunities are continually arising through Machine-to-Machine (M2M) communications and applications such as Smart Home, Connected Car, Industrial Automation as well as Information and Communication Technologies. However, even though these markets and applications are built on diverse technologies and requirements, they all share a common set of security threats: confidential data can be revealed, devices can be manipulated to inject fake measurements and control/network components may be manipulated to send incorrect commands.
Furthermore, IoT users demand remote access to their devices from anywhere, but still need ease of use and strong security. Username and password authentication often fails to meet these requirements since passwords are painful to enter and can easily be stolen. Therefore, when designing IoT systems and other systems that link cyberspace and the physical world, strong identity implemented with secure hardware is
an essential requirement. Fortunately, standards and technologies for strong identity (e.g., FIDO, JavaCard, and TPM) are available without sac-rificing ease of use. Hardware security is required to limit the impact of software vulnerabilities, which are ever present.
As numerous headline-grabbing recent attacks have shown, IoT sys-tems cannot be adequately protected with software alone. Security software may easily be bypassed by clever attackers, who can then remotely control physical systems. The combination of software and hardware offers an optimal balance between security and flexibility as security chips provide protection even if software is compromised.
As a leading provider of security solutions with a proven track record span-ning 30 years, and with more than 20 billion security controllers already shipped to the market, Infineon offers complete product-to-system solu-tions for IoT and embedded applications that are easy to implement and increase security without detriment to the end-user experience.
For more information go to www.infineon.com/iot-security.
Internet of Things Executive Speakout
44 Embedded Computing Design | August 2015
FEATURES
ĄĄ Contains all the code needed to connect an IoT product to the LAN and to the Ayla cloud, via a specific vendor’s Wi-Fi module.
ĄĄ Works transparently; no new SDKs to learn, embedded designers get a library to use with their current host so that it works like a serial port.
ĄĄ Cloud “programming” becomes a configuration step instead of platform development.
ĄĄ Adds nothing to the component cost; it’s available as an optional extension to wireless vendors’ existing Wi-Fi modules.
Ayla Networks’ wireless connectivity modules act as vendor-specific serial drivers to IoT cloud devices to provide highly secure wireless cloud connectivity for essentially any Internet of Things (IoT) products. The Ayla Cloud Connectivity Module extends a wireless provider’s serial-to-Wi-Fi connectivity module, transparently establishing wireless connectivity from a connected product to the Ayla cloud – without customers writing any module software programming work.
For instance, until now, a manufacturer wanting to make a connected home air conditioner used a cloud vendor’s agent and a wireless module provider’s SDK to provide Wi-Fi cloud connectivity between the air conditioner, the homeowner’s LAN and the cloud to enable control and data collection. Providing connectivity to the cloud – so that the homeowner could control the air conditioner from anywhere using a smart phone app – required that manufacturers’ embedded designers program the cloud networking connections themselves.
The Ayla wireless connectivity module bypasses the SDK step, taking care of everything needed to seamlessly and securely connect a product via a particular wireless vendor’s Wi-Fi module first to the end user’s wireless LAN, and then to the Ayla cloud. This means that embedded design ers do not need to become networking or cloud experts to add cloud connectivity to an IoT product.
The result is that Ayla compresses design cycles for manu-facturers of IoT products, while reducing risk, development friction and time to market. An example is the Murata LBE-WB1ZZYDZ-683 available from Mouser, or the USI BM-14A module. Both these modules convert the Broadcom WICED BCM43362 module from serial-to-Wi-Fi programmable devices to fixed serial-to-cloud devices.
Ayla Cloud Connectivity Modules
Ayla Networkswww.aylanetworks.com
[email protected] 408-830-9844 Ayla Networks @aylanetworks
IoT
embedded-computing.com/p372878
www.embedded-computing.com 45
FEATURESĄĄ The AMD R-Series APU can deliver high image transformation performance in a low-power
and highly integrated solution through Heterogeneous System Architecture and heteroge-neous Unified Memory Architecture. These can help balance the performance between the CPU and GPU and can help reduce latencies and maximize memory access to both the CPU and GPU for data-intensive imaging applications.ĄĄ The exceptional computation capabilities of the AMD R-Series APU and AMD Embedded
Radeon™ discrete graphics processors can reconstruct images from sparse data. This helps to make low-dose X-ray imaging feasible.ĄĄ To increase efficiency and reduce fatigue of surgical staff, imaging-assisted surgical systems
based on the AMD R-Series APU and AMD Embedded Radeon discrete graphics can help to enable real-time procedure visualization from multiple angles on multiple independent displays.ĄĄ To help reduce the size, weight, power, and cost for full-featured imaging applications, the
highly integrated AMD R-Series APU offers high-performance image processing and support for up to four independent display outputs, which can help to eliminate the need for a discrete graphics card in some applications.ĄĄ The AMD G-Series SoC for low-power and small form factor applications can help to enable
mobile emergency medical response teams with advanced medical imaging capabilities.
Medical imaging applications – including mobile, portable, or cart-based ultrasound systems, endoscopes, X-ray, and high-end MRI and CT scanners – all have unique data throughput, image transformation, and post-processing requirements. AMD embedded solutions offer the capabilities necessary to meet these requirements through scalable offerings that can help to reduce development and system costs while delivering a versatile and high-performance software-defined solution to sup-port next-generation features.To help OEMs who have been tied into just one vendor’s solution from generation to generation, OpenCL™ – the royalty-free open standard for parallel processing soft-ware development – can help to reduce system costs through compatibility with CPUs, GPUs, and some DSPs and FPGAs from a variety of vendors. And OpenCL compatibility across the AMD G-Series SoC, AMD R-Series APU, and AMD Embedded Radeon™ discrete graphics platforms enables software-defined solutions that can leverage a single code base to scale across a portfolio of products, which can help reduce software development costs.For products that target cost sensitive emerging markets or where healthcare reform is applying cost pressure on medical imaging applications, the AMD G-Series SoC and AMD R-Series APU offer up to 10 years of product availability. This can reduce fre-quent system redesign and certification, helping to make products more competitive.
Medical Imaging: AMD Meets the Demands for Performance, Scalability, and Longevity
Medical
embedded-computing.com/p372847
AMD Embedded Solutionswww.amd.com/medicalimaging
[email protected] 408-749-4000 www.linkedin.com/company/amd @AMDembedded
FEATURES
ĄĄ AMD Embedded R-Series APUs are designed to meet the needs of customers with powerful graphics and computational requirements.
ĄĄ The AMD Embedded G-Series Family of processors – including APUs and SOCs – are especially suited for low-power, low-cost, low- maintenance networking and communications applications.
ĄĄ New AMD G-Series CPUs (no onboard GPU) provide a robust feature set including ECC and PSP, and deliver superior single threaded performance for cost-optimized storage controllers and Network Attached Storage systems.
Ubiquitous internet, pervasive content, social networking and mobile technologies are driving explosive data growth. By some recent estimates, internet data is doubling every three to four years. This is driving the transformation and on-going convergence of traditionally diverse Web, Enterprise, Telecom and Mobile businesses. End-to-end (network as well as server) virtualization, cloud computing and software-defined net-working (SDN) are some of the technologies addressing this transformation and they provide both opportunities and challenges as they help more people than ever connect for business and personal collaborative endeavors. AMD offers a winning Networking and Communications industry solutions roadmap, which includes offerings in embed-ded x86 and ARM® processors as well as powerful graphics processors to help custom-ers address this transformation.
SUPPORT FOR OPEN STANDARDSAMD provides extensive support for open standards, including OpenCL™, OpenGL and Heterogeneous System Architecture (HSA). AMD supports the OpenCL and OpenGL Appli-cation Programming Interfaces (APIs) within its hardware, and provides tools for graph-ics and computational programming that work with Windows®, Embedded Linux®, and Thread X. The Heterogeneous System Architecture (HSA) is easy to use and inexpensive for developers, and enables excellent performance and power efficiency in a variety of uses.
Enhancing Communication Infrastructure’s Security, Reliability, Scalability and Flexibility with Embedded x86 and ARM® Solutions
Networking
embedded-computing.com/p372848
AMD Embedded Solutionswww.amd.com/communications
[email protected] 408-749-4000 www.linkedin.com/company/amd @AMDembedded
46 Embedded Computing Design | August 2015
FEATURES
ĄĄ PCI Express® 3 compliant - 8.0 Gbps per lane
ĄĄ Link compliant with Gen1, Gen2, and Gen3 PCI Express
ĄĄ PCI Express iPass Connectors
ĄĄ One x8 PCI Express port
ĄĄ RDMA support through PIO and DMA
ĄĄ Copper connection up to 2 meters, Fiber-optic cable connection up to 100 meters
ĄĄ Clock isolation support, CFC or SSC on cable
ĄĄ Transparent host and target operations along with non-transparent bridging to cabled PCI Express systems
ĄĄ Low Profile PCI Express form factor
ĄĄ EEPROM for custom system configuration
ĄĄ Link status LEDs through face plate
The PXH810 Gen3 PCI Express Host Adapter is our high perfor-mance cabled interface for distributed processor subsystems and I/O expansion applications. The host adapter extends PCI Express over cables to external systems. Based on PLX Gen3 PCI Express switch architecture, the PXH810 host adapter includes advanced features for non-transparent bridging (NTB) and clock isolation. For high performance application developers, the PXH810 host adapter combines 64 Gbit/s performance with less than one micro-second latency, significantly improving overall inter-system com-munication. Inter-processor communication benefits from the high throughput and low latency. The PXH810 performs both Remote Direct Memory Access (RDMA) and Programmed IO (PIO) transfers, effectively supporting both large and small data packets. RDMA transfers result in efficient larger packet transfers and processor off-load. PIO transfers optimize small packet transfers at the lowest latency. The combination of RDMA and PIO creates a highly potent data transfer system. Dolphin’s software suite takes advantage of PCI Express’ RDMA and PIO data transfer scheme. Delivering a complete deployment environment for customized and standardized applications. The suite includes a Shared-Memory Cluster Interconnect (SISCI) API as well as a TCP/IP driver and SuperSockets software. The SISCI API is a robust and powerful shared memory programming environment. The opti-mized TCP/IP driver and SuperSockets™ software remove traditional networking bottlenecks, allowing standard IP and sockets applica-tions to take advantage of the high performance PCI Express inter-connect without modification. The overall framework is designed for rapid development of inter-processor communication systems. With the implementation of clock isolation, the PXH810’s signal quality is excellent. By isolating the system clock and transmitting an extremely low jitter high quality clock to downstream devices, the PXH810 offers users high signal quality and increased cable distances. The PXH810 supports PCI Express fiber optic cables up to 100 meters. These cables are x8 fiber optic cables. The improved signal quality and fiber optic support makes the PXH810 ideal for simulation systems. The PXH810 is also used in applications such as test and measurement equipment, medical equipment, and storage subsystem seeking high performance and data quality.
PCI Express Gen 3 Host adapter/PXH810
Dolphin Incwww.dolphinics.com [email protected] 214-960-9066
Networking
embedded-computing.com/p372871
www.embedded-computing.com 47
FEATURES
ĄĄ Dk: 3.68ĄĄ Df: 0.0038ĄĄ UL approved, 130°C MOTĄĄ Engineered to eliminate skew issues on differential pair on high data
rate designsĄĄ Eliminates the need to rotate circuitry on the laminates
Chronon™ is Isola’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs. It also delivers the necessary thermal robustness for lead-free applications and for electrical (low loss) applications that require tighter control of loss and skew. In addition, it delivers the necessary thermal robustness for lead-free applications and electrical bandwidth (low loss) for applications that require more stringent signal integrity. It also has PCB designer friendly advan-tages because the Dk and Df ratings are close enough in value that they can be considered constant for all of the specified cores and prepregs.Chronon is a proprietary high-performance, 192°C glass transition tempera-ture (Tg) system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. Chronon products use spread glass and reduced profile copper to mitigate skew in differential pair designs. The use of ultra-smooth cooper is enabled by very high adhesive bond between the resin and the metal.Chronon has a nominal dielectric constant (Dk) of 3.68 and a very low nominal dis-sipation factor (Df) of 0.0038. Both are stable between -55°C and +125°C up to 40 GHz. Chronon laminate materials are available in optimized laminate and pre-preg forms in typical thicknesses and standard panel sizes to provide a complete material solution for high-speed digital multilayer backplanes and daughter cards.
Chronon™ Ultra-low Loss Laminates and Prepreg
Networking
embedded-computing.com/p372872
Isolawww.isola-group.com/products/chronon/
[email protected] 800-537-7656 www.linkedin.com/company/isola-group twitter.com//IsolaGroup
FEATURES
ĄĄ Intel® I210 Ethernet ControllersĄĄ Two Fully Independent Ethernet ConnectionsĄĄ Small Form Factor Pluggable (SFP) InterfaceĄĄ Accepts the Wide Range of SFP Ethernet ModulesĄĄ Fanless -40° to +85°C operational temperatureĄĄ PC/104-Plus Form FactorĄĄ IEEE 1588 Precision Time Synchronization over EthernetĄĄ Robust Communication over Long DistancesĄĄ Supports Linux, Windows, and DOS Operating Systems
The PPM-N409-2 PC/104-Plus Dual Ethernet module features Small Form Factor Pluggable (SFP) transceivers, controlled by dual Intel® I210 Ethernet Controllers, bringing the latest in technology to your legacy design. Both module housings are compatible with the large variety of SFP trans-ceivers that range from optical single mode, optical dual mode, and GbE twisted pair copper. The small form factor and negligible heat signature of the PPM-N409-2 makes it ideal for installation in confined spaces. Combined with its excep-tional range of operational temperatures, low physical profile, and rugged design, the PPM-N409-2 can be deployed in even the most demanding environments. Give your systems the advantage of compact design, low power con-sumption, and high precision time synchronization of the PPM-N409-2 Ethernet controller from WinSystems. Custom design options are available upon request.
PPM-N409 – Dual PC/104-Plus Ethernet with SFP Interface
Networking
embedded-computing.com/p372686
WinSystemswww.winsystems.com
[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc
48 Embedded Computing Design | August 2015
FEATURES
ĄĄ Supporting ECC memory and providing a dedicated Platform Security Processor (PSP) compatible with ARM® TrustZone, AMD G-Series SOC platforms will help to penetrate markets previously inaccessible to x86 products in these power envelopes, at this price point. ĄĄ The AMD G-Series SOC helps achieve higher system quality, reliability, and
energy efficiency, which contribute to overall lower TCO. ĄĄ Multiple performance levels offer upgrade paths to protect software and
hardware ecosystem costs. ĄĄ AMD’s commitment to long-term availability and support (5-10 years)
maximizes ROI.7 ĄĄ The AMD G-Series SOC platform is well suited for low-power and high-
performance designs in a broad range of markets, including Industrial Control & Automation, Digital Signage, Thin Client, and Electronic Gaming Machines.ĄĄ New AMD G-Series CPUs (no onboard GPU) provide a robust feature set
including ECC and PSP, and deliver superior single threaded performance – 33% more performance per dollar than competing Intel solutions – for cost-optimized storage controllers and Network Attached Storage systems.8
The embedded evolution continues with x86 CPU, integrated discrete-class GPU and I/O controller on the same die.PRODUCT OVERVIEWThe AMD Embedded G-Series SOC platform is a high-performance, low-power System-on-Chip (SOC) design, featured with enterprise-class error-correction code (ECC) memory support, dual and quad-core variants, integrated discrete-class GPU, and I/O controller on the same die. The AMD G-Series SOC achieves superior performance per watt in the low-power x86 microprocessor class of products when running multiple industry-standard benchmarks.1 This helps enable the delivery of an exceptional HD multimedia experience and provides a heteroge-neous computing platform for parallel processing. The small-footprint, ECC- capable SOC sets the new foundation for a power-efficient platform for content-rich multimedia processing and workload processing that is well suited for a broad variety of embedded applications.SUPERIOR PERFORMANCE PER WATTThe AMD Embedded G-Series SOC platform delivers an exceptionally high- definition visual experience and the ability to take advantage of heterogeneous computing while maintaining a low-power design. • AMD G-Series SOC’s next-generation “Jaguar”-based CPU offers 113%
improved CPU performance vs. AMD G-Series APU and greater than a 2x (125%) advantage vs. Intel Atom when running multiple industry-standard compute-intensive benchmarks.2
• AMD G-Series SOC’s advanced GPU, supporting DirectX® 11.1, OpenGL 4.2, and OpenCL™ 1.23, enables parallel processing and high-performance graphics processing that provides up to 20% improvement vs. AMD G-Series APU and a 5x (430%) advantage vs. Intel Atom when running multiple industry-standard graphics-intensive benchmarks.4
• Excellent compute and graphics performance with enhanced hardware acceleration deliver up to 70% overall improvement vs. AMD G-Series APU and over 3x (218%) the overall performance advantage vs. Intel Atom in embedded applications when running multiple industry standard compute- and graphics-intensive benchmarks.5
ENABLING LOW-POWER, INNOVATIVE SMALL FORM FACTOR DESIGNSThe AMD G-Series SOC is a small-footprint and low-power solution that reduces overall system costs. • The SOC design offers 33% footprint reduction compared to AMD G-Series
APU two-chip platform6, simplifying design with fewer board layers and simplifed power supply.
• AMD G-Series SOC enables fan-less design that further helps drive down system cost and enhance system reliability by eliminating moving parts.
• With an array of performance options and universal pin compatibility across the AMD G-Series SOC portfolio, the AMD G-Series SOC platform allows OEMs to utilize a single board design to enable solutions from entry-level to high-end.
• The SOC design enables new levels of performance in small SBC (single board computer) and COMs (computer-on-modules) form factors.
• AMD G-Series SOCs support Thermal Design Profiles (TDPs) from 5W to 25W and offer dynamically configurable TDP capabilities.
AMD Embedded G-Series System-on-Chip (SOC)
AMD Embedded Solutionswww.amd.com/g-series
[email protected] 408-749-4000 www.linkedin.com/company/amd @AMDembedded
Processing
embedded-computing.com/p372821
1 The low-power x86 microprocessor class includes: GX-420CA @ 25W TDP (scored 19); GX-415GA @ 15W (25), GX-217GA @ 15W (17), GX-210HA @ 9W (20), G-T56N @ 18W (12), G-T52R @ 18W (7), G-T40N @ 9W (14), G-T16R @ 4.5W (19), Intel Atom N270 @ 2.5W (20), Intel Atom D525 @ 13W (9), Intel Atom D2700 @ 10W (12) & Intel Celeron G440 @ 35W (5). Performance score based on an average of scores from the following benchmarks: Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics Mark, and EEMBC CoreMark Multi-thread. All systems running Windows® 7 Ultimate for Sandra Engineering, 3DMark® 06 and PassMark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All configurations used DirectX 11.0. AMD G-Series APU system configurations used iBase MI958 motherboards with 4GB DDR3 and integrated graphics. All AMD G-Series SOC systems used AMD ”Larne“ Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D2700 was tested with Jetway NC9KDL-2700 motherboard, 4GB DDR3 and integrated graphics. Intel Celeron system configuration used MSI H61M-P23 motherboard with 4GB DDR3 and integrated graphics. Intel Atom N270 system configuration used MSI MS-9830 motherboard with maximum supported configuration of 1GB DDR2 (per http://download.intel.com/design/intarch/manuals/320436.pdf,) and Intel GM945 Intel Atom D525 used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics.2 AMD GX-415GA scored 209, AMD G-T56N scored 98, and Intel Atom D525 scored 93, based on an average of Sandra Engineering 2011 Dhyrstone, Sandra Engineering 2011 Whetstone and EEMBC CoreMark Multi-thread benchmark results. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD ”Larne“ Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows® 7 Ultimate for Sandra Engineering and Ubuntu version 11.10 for EEMBC CoreMark.3 OpenCL 1.2 currently supported in the following operating systems: Microsoft Windows 7; Microsoft Windows Embedded Standard 7; Microsoft Windows 8; Microsoft Windows Embedded Standard 8; Linux (Catalyst drivers). OpenGL 4.2 currently sup-ported in the following operating systems: Microsoft Windows 7; Microsoft Windows Embedded Standard 7; Microsoft Windows 8; Microsoft Windows Embedded Standard 8; Linux (Catalyst drivers). Ongoing support options TBA.4 AMD GX-415GA scored 864, AMD G-T56N scored 724, and Intel Atom D525 scored 162, based on an average of 3DMark® 06 1280x1024 and PassMark Performance Test 7.0 2D Graphics Suite benchmark results. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD ”Larne“ Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 mother-board with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows® 7 Ultimate with DirectX 11.0.5 AMD GX-415GA scored 369, AMD G-T56N scored 218, and Intel Atom D525 scored 116, based on an average of Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics Mark, and EEMBC CoreMark Multi-thread. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows® 7 Ultimate for Sandra Engineering, 3DMark® 06 and PassMark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All configurations used DirectX 11.0.6 AMD G-Series SOC FT3 BGA package dimension 24.5mm x 24.5mm = 600.25 mm2 SOC; AMD G-Series APU FT1 and Controller Hub two-chip platform: 19mm x 19mm + 23mm x 23mm = 890 mm2; 33% improvement.7 5-year, 7-year, and 10-year support offered, depending upon the AMD product. Please contact your AMD representative for more details.8 Performance comparison is based on the EEMBC CoreMark v1.0 benchmark. The kit price of GX-416RA is $25, and the kit price of Celeron 1037U is $25. The performance delta of 34% was calculated based on GX-416RA’s CoreMark score of 24699 and Celeron 1037U’s CoreMark score of 18461. The performance-per-$ delta of 34% was calculated based on the GX-416RA’s performance-per-$ ratio of 987.96 and 1037U’s performance-per-$ ratio of 738.44. The AMD Steppe Eagle GX-416RA used an AMD Larne devel-opment board with 4GB DDR3-1600 memory and 80GB Hitachi HDD. The Intel Celeron 1037U used a Toshiba Satellite C55-A5220 motherboard with 8GB DDR3-1600 memory and 256GB Sandisk HDD. Both systems ran Ubuntu Linux 11.1 (EMB-105).
www.embedded-computing.com 49
FEATURES
ĄĄ Available in dual-core and quad-core “Steamroller” CPU configurations with up to 4 MBytes of shared L2 cache. ĄĄ Includes support for DirectX® 11.1, OpenGL 4.2, and AMD’s
Mantle for the latest game development advancements.ĄĄ Offers dual-channel DDR3 support and error-correction code
(ECC) memory support for high integrity applications.ĄĄ Features a new audio coprocessor that enables low-latency
audio signal processing for crisper sound and audio effects. ĄĄ Enables hardware accelerated video encode and decode using
Unified Video Decode (UVD) 4.2 and Video Compression Engine (VCE) 2.0.
The 2nd Generation AMD Embedded R-Series APU (previously codenamed: “Bald Eagle”) boosts processing performance, power efficiency, and multi- media immersion by leveraging Heterogeneous System Architecture.
PRODUCT OVERVIEWThe 2nd Generation AMD Embedded R-Series accelerated processing unit (APU) delivers breakthrough graphics performance and power efficiency for a new generation of embedded systems designed to provide ultra-immersive HD multimedia experiences and parallel processing compute performance. Harnessing the processing power of AMD’s “Steamroller” CPU core and a new graphics core based on the AMD Radeon™ HD 9000 platform, the AMD R-Series APU offers next-generation performance-per-watt compute efficiency in the x86 product category by allowing system designers to take advantage of Heterogeneous System Architecture (HSA).The high-performance CPU and GPU cores within the 2nd Generation AMD Embedded R-Series APU can be allocated to the best suited compute tasks by utilizing HSA. As noted below, this enables outstanding system performance and multimedia interactivity, superior battery life, and small, sleek system form factors for a wide range of graphics and compute-intensive embedded applications including embedded gaming, digital signage, medical imaging, and more.
SKY HIGH PERFORMANCE AT LOW POWER2nd Generation AMD R-Series APUs deliver up to 66% more compute performance1 and up to 55% more 3D graphics performance than previous generation AMD Embedded R-Series APUs.2 Compared to Intel Haswell Core-i CPUs with 35W or lower thermal design power (TDP), the new AMD R-Series APUs provide up to 46% more compute performance3, and up to 44% more 3D graphics performance.4
Supporting TDPs ranging from 17W to 35W, 2nd Generation AMD Embedded R-Series APUs equip system designers to achieve aggressive performance and energy efficiency profiles while helping to minimize heat dissipation constraints. AMD’s Temperature Smart Turbo CORE technology complemented by the configurable TDP feature enables advanced power management capabilities that allow designers to optimize TDP for their target application by adjusting the clock speed of the underlying CPU and GPU, increasing overall performance-per-watt by up to 12%.5
BREATHTAKING GRAPHICS AND MULTIDISPLAY IMMERSION2nd Generation AMD Embedded R-Series APUs enable stunningly crisp 3D, 4K, and HD video content and offer support for up to four independent dis-plays (4096 x 2160 resolution per display output). The AMD Dual Graphics6 configuration allows you to combine the power of the 2nd Generation AMD R-Series APU with an AMD Embedded Radeon™ E8860 discrete GPU to provide up to 64% more 3D graphics performance than a standalone 2nd Generation AMD R-Series APU.7 AMD Eyefinity technology allows the AMD R-Series APUs to drive multiple displays simultaneously as a single large surface.8
2nd Generation AMD Embedded R-Series APU
AMD Embedded Solutionswww.amd.com/r-series
[email protected] 408-749-4000 www.linkedin.com/company/amd @AMDembedded
Processing
embedded-computing.com/p372822
1 The AMD RX-427BB scored 76.5 and AMD R-Series 464L scored 46.1, when running BasemarkCL 1.0 bench-mark. The performance delta of 66% was calculated based on RX-427BB’s performance score of 76 and R-464L’s performance score of 46. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The R-464L used an AMD DB-FS1r2 development board with 8GB DDR3 memory and 160GB Hitachi HDD. Both systems ran Windows® 7 Ultimate (EMB-95).2 The AMD RX-427BB scored 2051 and AMD R-Series 464L scored 1326, when running 3DMark® 11P benchmark. The performance delta of 55% was calculated based on RX-427BB’s performance score of 2051 and R-464L’s performance score of 1326. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The R-464L used an AMD DB-FS1r2 development board with 8GB DDR3 memory and 160GB Hitachi HDD. Both systems ran Windows® 7 Ultimate (EMB-91).3 The AMD RX-427BB scored 76 and Intel Haswell Core i7-4765T scored 52, when running BasemarkCL 1.0 benchmark. RX-427BB’s TDP is 35W and Core i7-4765T’s TDP is 35W. The performance delta of 46% was calcu-lated based on RX-427BB’s performance score of 76 and Core i7-4765T’s performance score of 52. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The Core i7-4765T used a Lenovo ThinkCentre M93p with 8GB DDR3 memory and 128GB Crucial M4 HDD. Both systems ran Windows® 7 Ultimate (EMB-94).4 The AMD RX-427BB scored 2051 and Intel Haswell Core i7-4765T scored 1424, when running 3DMark® 11P benchmark. RX-427BB’s TDP is 35W and Core i7-4765T’s TDP is 35W. The performance delta of 44% was calculated based on RX-427BB’s performance score of 2051 and Core i7-4765T’s performance score of 1424. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The Core i7-4765T used a Lenovo ThinkCentre M93p with 8GB DDR3 memory and 128GB Crucial M4 HDD. Both systems ran Windows® 7 Ultimate (EMB-93).5 The AMD RX-427BB (configured at 35W) scored 2,434 and RX-427BB (configured at 30W) scored 2,332 based on a geometric mean of various industry benchmarks, comprised of 3DMark®06, 3DMark®11P, Passmark v7, Pov-ray v3.7, EEMBC CoreMark MT 1.0, and BasemarkCL 1.0. The performance-per-watt delta was calculated by dividing the configured RX-427BB’s performance-per-watt score (2332/30) by the RX-427BB’s performance-per-watt score (2434/35). The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD (EMB-96).6 AMD Dual Graphics technology combines the 3D graphics rendering resources of the APU’s discrete-class graphics processor with the discrete graphics processor to accelerate the Microsoft® Direct3D function for software applications using Microsoft DirectX® 10 or DirectX 11 technology.7 The AMD RX-427BB scored 2,051, and the AMD Radeon™ E8860 paired with RX-427BB at dual-graphics mode scored 3,359 when running 3DMark®11P benchmark. The AMD Bald Eagle RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The AMD Radeon E8860 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and RX-427BB. The system ran Windows® 7 Ultimate (EMB-97).8 AMD Eyefinity technology works with applications that support non-standard aspect ratios, which is required for panning across multiple displays. AMD Eyefinity technology can support up to 4 displays using a single enabled AMD R-Series APU or up to 6 displays using a single enabled AMD graphics card with Windows Vista or Windows 7 operating systems – the number and type of displays may vary by board design. Some implementations may require DisplayPort 1.2 multi-streaming technologies with compatible monitors and/or hubs. SLS (“Single Large Surface”) functionality requires an identical display resolution on all configured displays.
50 Embedded Computing Design | August 2015
FEATURES
ĄĄ The underlying GCN architecture7 enables the AMD Radeon E8860 GPU to efficiently manage workloads and programming languages traditionally handled exclusively by the main processor, and provides image quality-enhancing benefits including partially resident textures, improved anisotropic filtering, and improved DirectX 11 tessellation.ĄĄ The AMD Radeon E8860 GPU is a multi-chip module (MCM) consisting of GPU
and GPU memory integrated on a single substrate, providing compatibility of GPU and memory for the lifetime of product supply. AMD is currently the only provider of such a solution on high-end embedded GPUs.ĄĄ The AMD Radeon E8860 GPU supports seven-year product longevity8, providing
long-lifetime availability and support.ĄĄ The AMD Radeon E8860 GPU features 2GB of GDDR5 frame buffer and delivers
up to 80% more memory bandwidth than NVIDIA’s sub-50W GeForce GPUs9.ĄĄ The AMD Radeon E8860 GPU is available in multiple form factors to support
a wide range of embedded applications. These include chip-down for custom platform designs and industry-standard MXM, PCIe®, and CompactPCIe.ĄĄ The AMD Radeon E8860 GPU supports AMD PowerPlay™ technology, AMD
ZeroCore power technology10, and AMD Enduro™ technology, which can enable the GPU to deliver full potential performance while conserving power.
The latest evolution in AMD Radeon™ embedded GPUs leverages advanced Graphics Core Next architecture, delivering breakthrough performance and power efficiency gains.PRODUCT OVERVIEWThe AMD Radeon™ E8860 Embedded discrete GPU – the first embedded GPU developed on the groundbreaking Graphics Core Next (GCN) architecture – pushes AMD Radeon graphics and parallel processing performance to unprecedented new heights while increasing power efficiency.Providing 2x higher 3D graphics performance1 and 33% higher single-precision floating point performance than the AMD Radeon E6760 GPU , the AMD Radeon E8860 GPU2 delivers industry-leading 3D video graphics performance, enabling stunning, multi-display visual experiences for a range of embedded applications spanning digital gaming, digital signage, medical imaging, and avionics.BREAKTHROUGH PERFORMANCE AND POWER EFFICIENCYThe AMD Radeon E8860 GPU supports DirectX® 11.1, OpenGL 4.2, and OpenCL™ 1.2, enabling high-performance graphics and massive parallel processing. The AMD Radeon E8860 GPU delivers 92% higher 3D graphics performance per watt than the AMD Radeon E6760 GPU3, and up to 22% higher 3D graphics performance and up to 61% higher performance per watt than power-comparable NVIDIA GeForce GPUs4. Supporting thermal design power of 37 watts, the AMD Radeon E8860 GPU provides the optimal performance-per-watt profile for embedded applications that require outstanding multi-display experiences, superior visual quality, and massive parallel compute but have exacting power efficiency and heat dissipation requirements. Low thermals help enable superior system cooling flexibility that helps developers conserve valuable board space and increase system ruggedization for harsh environments.SUPERIOR MULTIDISPLAY VERSATILITYThe AMD Radeon E8860 GPU provides multi-display flexibility, supporting up to five 3840x2160 @30Hz displays simultaneously in clone mode and extended desktop in static screen. Competitive NVIDIA GPUs can only support up to four independent displays.5 The AMD Radeon E8860 GPU supporting AMD Eyefinity technology6 can expand a high-resolution picture across multiple displays. In addition, one display of 4096x2160 @60Hz over one HDMI™ or DP1.2 interface can be supported, providing a superior viewing experience. This flexible, one-to-many system-to-display configuration capability enables ultra-immersive visual experiences via a single small form factor system.OPTIMIZED FOR GRAPHICS-INTENSIVE APPLICATIONSThe AMD Radeon E8860 GPU was designed to increase multimedia processing performance and power efficiency for a range of embedded applications, including:Digital gaming. Supporting rich 3D and 4K video graphics and advanced multi- display capabilities, the AMD Radeon E8860 GPU enables breathtaking gaming experiences and excellent display configuration flexibility for casino, arcade and pachinko/pachislot gaming.Digital signage. Ultra-high resolution multimedia playback across multiple displays helps capture and hold viewers’ attention like never before, with minimal strain on system power budget and form factor.Medical imaging. The AMD Radeon E8860 GPU helps facilitate crisp, 360-degree medical image visualization and other advanced graphics-driven capabilities, which can help doctors provide improved care for patients.Avionics. The high-performance graphics and parallel processing provided by the AMD Radeon E8860 GPU is an excellent choice for graphics-intensive avionics applications such as geographic information systems, 360-degree situational awareness, diminished vision enhancement, and more.
AMD Radeon™ E8860 Embedded GPU
AMD Embedded Solutionswww.amd.com/en-us/products/embedded/graphics
[email protected] 408-749-4000 www.linkedin.com/company/amd @AMDembedded
Processing
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1 AMD Radeon™ E8860 scored 2689 and AMD Radeon E6760 scored 1327 when running 3DMark® 11P benchmark paired with the AMD R-464L APU. AMD Radeon E8860 and AMD Radeon E6760 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and the AMD R-464L APU. The system ran Windows® 7 Ultimate (EMB-79). 2 The AMD Radeon E8860 GPU’s single-precision floating point is 768 GFLOPS; the AMD Radeon E6760 APU's single-precision floating point is 576 GFLOPS (EMB-80).3 AMD Radeon™ E8860 scored 2689 and AMD Radeon E6760 scored 1327 when running 3DMark® 11P benchmark paired with AMD R-464L APU. The performance-per-watt data was calculated by dividing the 3DMark 11P score by the GPU's thermal design power. The performance-per-watt delta was calculated based on the E8860 GPU’s performance-per-watt score of 72.7 and the E6760 APU’s performance-per-watt score of 37.9. The E8860 and E6760 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, a 64GB Crucial M4 hard disk drive, and AMD R-464L. The system ran Windows® 7 Ultimate (EMB-81).4 AMD Radeon™ E8860 scored 2689, AMD Radeon E6760 scored 1327, NVIDIA GeForce GT630 (Kepler) scored 1784, and NVIDIA GeForce GT640 (GDDR5) scored 2209 when running 3DMark® 11P benchmark paired with the AMD R-464L. The performance-per-watt data was calculated by dividing the 3DMark 11P score by the GPU’s thermal design power. The perfor-mance delta was calculated based on the E8860 GPU’s 3DMark11 score of 2689 and the GeForce GT640 (GDDR5)’s 3DMark11 score of 2209. The performance-per-watt delta was calculated based on the E8860 GPU’s performance-per-watt score of 72.7 and the GeForce GT640 (GDDR5)’s performance-per-watt score of 45.1. AMD Radeon E8860, AMD Radeon E6760, NVIDIA GeForce GT630 (Kepler), and NVIDIA GeForce GT640 (GDDR5) used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, a 64GB Crucial M4 hard disk drive, and AMD R-464L APU. The system ran Windows® 7 Ultimate (EMB-82).5 http://www.geforce.com/hardware/desktop-gpus/geforce-gtx-650/specifications 6 AMD Eyefinity technology supports up to six DisplayPort monitors on an enabled graphics card. Supported display quantity, type, and resolution vary by model and board design; confirm specifications with manufacturer before purchase. To enable more than two displays, or multiple displays from a single output, additional hardware such as DisplayPort-ready monitors or DisplayPort 1.2 MST-enabled hubs may be required. A maximum of two active adapters is supported. See www.amd.com/eyefinityfaq for full details.7 The GCN Architecture and its associated features (AMD Enduro™, AMD ZeroCore Power technology, DDM Audio, and 28nm production) are exclusive to the AMD Radeon™ HD 7700M, HD 7800M and HD 7900M Series Graphics and select AMD A-Series APUs. Not all technologies are supported in all system configurations – check with your system manufacturer for specific model capabilities.8 Planned seven-year availability. Additional availability possible under contract. Contact your AMD sales representative for further information.9 AMD Radeon™ E8860 scored 2689, AMD Radeon E6760 scored 1327, NVIDIA GeForce GT630 (Kepler) scored 1784, and NVIDIA GeForce GT640 (GDDR5) scored 2209 when running 3DMark® 11P benchmark paired with AMD R-464L. The performance-per-watt data was calculated by dividing the 3DMark 11P score by the GPU’s thermal design power. The perfor-mance delta was calculated based on the E8860’s 3DMark 11 score of 2689 and the GeForce GT640 (GDDR5)’s 3DMark 11 score of 2209. The performance-per-watt delta was calculated based on the E8860’s performance-per-watt score of 72.7 and the GeForce GT640 (GDDR5)’s performance-per-watt score of 45.1. AMD Radeon E8860, AMD Radeon E6760, NVIDIA GeForce GT630 (Kepler), and NVIDIA GeForce GT640 (GDDR5) used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, a 64GB Crucial M4 hard disk drive, and AMD R-464L. The system ran Windows® 7 Ultimate (EMB-83).10 AMD PowerTune, AMD ZeroCore Power and AMD PowerPlay™ are technologies offered by certain AMD Radeon™ products, which are designed to dynamically manage GPU power consumption and performance. Not all products feature all technologies – check with your component or system manufacturer for specific model capabilities.
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FEATURES
ĄĄ One or Two XILINX VIRTEX 7 FPGAS • VX690T or VX980T • Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth
• PCIe Gen3 8x from each FPGA to on-board PCIe switchĄĄ Backplane I/O
• 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth
• 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 24 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols
ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards
• Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth
• 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocolsĄĄ Dual Core Processor APM86290
• Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe SwitchĄĄ Application Development
• Full CoreFire Next™ Board Support Package for Fast and Easy Application Development
• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTMĄĄ System Management
• System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)ĄĄ Mechanical and Environmental
• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O
WILDSTAR 7 Conduction Cooled for OpenVPX 6U boards provide up to two Xilinx Virtex 7 FPGAs per board with VX690T or VX980T FPGAs, up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth. Up to 1.9 million logic cells and 3.3 million multiplier bits per board. Air or Conduction Cooled.These FPGA boards include two Xilinx Virtex 7 FPGAs with 64 High Speed Serial connections performing up to 13.1 Gbps. The IO Pro-cessing Element (IOPE) FPGA has a choice of QDRII+ SRAM or DDR3 DRAM. The DRAM option has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz while the SRAM option has two 72-bit QDRII+ SRAM interfaces clocked up to 500 MHz.With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up to 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depend-ing on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to four WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for six QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application require-ments. It is also used to query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE.There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps sig-nalling and supports multiple channels of 40GbE.
WILDSTAR 7 Conduction Cooled for OpenVPX 6U
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Processing
embedded-computing.com/p372742
52 Embedded Computing Design | August 2015
FEATURES
ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidthĄĄ Backplane I/O
• 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full Duplex Bandwidth
• Two PCIe Gen3 8x Connections to VPX Backplane (P1) • Eight LVDS lines to P2 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols
• External clock and IRIG-B Support via Backplane • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK
– Allows points-to-point, very high quality backplane connections to payload cards – Allows 10MHz clock and trigger from backplane to synchronize and clock compatible ADC/DAC mezzanine cards without front panel connections needed – Allows 1000s of analog channels across many backplanes/chassis to be synchronized via backplane
ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards
• Three optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth
• Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols
ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGAĄĄ Application Development
• Full CoreFire Next™ Board Support Package for Fast and Easy Application Development
• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTMĄĄ System Management
• System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)ĄĄ Mechanical and Environmental
• 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O
The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board.
These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There are two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz.
With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up to 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depend-ing on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).
If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for exam-ple the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).
WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.
Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be used by customers for application requirements. It is also used to query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE.
There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.
WILDSTAR 7 for OpenVPX 3U
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Processing
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FEATURES
ĄĄ One, Two or Three XILINX VIRTEX-7 FPGAS • VX690T or VX980T • Up to 4 GB of DDR3 DRAM for 25.6 GB/s of DRAM bandwidth • Up to 128 MB of QDRII+ SRAM for 64 GB/s of SRAM bandwidth • PCIe Gen3 8x Connections from each FPGA to on-board
PCIe switch
ĄĄ Mechanical and Environmental • Accepts Standard Annapolis WILDSTAR Mezzanine Cards,
including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards
• Integrated Air-Cooled Heat Sink available in Passive or Active configurations
• Heat Sink also serves as a Ruggedizing Board Stiffener • Available in Extended Temperature Grades • Auxiliary Power Connector
ĄĄ PCI Express Bus and Front Panel I/O • 8x or 16x PCIe Gen3 bus to Host • DMA support on PCIe Bus for 7 GB/s of bi-directional bandwidth • Three optional Front Panel QSFP+ Transceivers running at up
to 52.4 each Gbps for 19.5 GB/s of Full Duplex Bandwidth • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocolnand user- designed protocols
ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy
Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces
and Chipscope Access • Open VHDL IP Package for Communication Interfaces
ĄĄ System Management • Drivers and APIs for Host Systems running Windows and Linux
are included • Diagnostic monitoring and configuration • Current,Voltage and Temperature Monitoring Sensors
Supports up to three Xilinx Virtex 7 FPGAs per board with VX690T or VX980T FPGAs, up to 4 GB of DDR3 DRAM for 25.6 GB/s of DRAM bandwidth and up to 128 MB of QDRII+ SRAM for 64 GB/s of SRAM bandwidth. Up to 2.9 million logic cells and 4.9 million multiplier bits per board.
PCIe boards connect to the host system via a Gen 3 PCI Express switch which provides a x16 interface to the host (up to 16 GB/s) and x8 Gen3 interfaces to each FPGA (up to 8 GB/s). There is also plenty of on-board inter-FPGA HSS connections for data movement.
If IO is required, Annapolis offers extraordinary density, band-width and analog conversion choices. Each PCIe card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).
There is also an optional IRIG-B module, which occupies it’s own slot and provides a connector to access LVDS FPGA signals as well as an SMA for the IRIG-B input.
To ensure safe and reliable processing, WILDSTAR 7 for PCIe boards come equipped with a proactive thermal management system. Sensors across the board monitor power and tempera-ture, with automatic shutdown capability to prevent exces-sive heat buildup. WILDSTAR 7 for PCIe boards are built with a rugged, durable design.
WILDSTAR 7 for PCIe
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Processing
embedded-computing.com/p372673
54 Embedded Computing Design | August 2015
FEATURES
ĄĄ Supports up to Three 56G FDR InfiniBand, Three 40Gb Ethernet, or Twelve 10Gb Ethernet Connections
ĄĄ Up to Three Altera Stratix V FPGA Processing Elements – GSD4, GSD5, GSD6, GSD8, GXA3, GXA4, GXA5, GXA7, GXA9, GXAB
ĄĄ Up to 4 GBytes DDR3 DRAM in 2 Memory Banks and Up to 192 MBytes QDRII + SRAM in 12 Memory Banks per WILDSTAR A5 for PCI Express Board
ĄĄ Programmable FLASH for each FPGA to Store FPGA Images
ĄĄ 16X PCI Express Bus Gen 1, Gen 2, or Gen 3 to Host PC through On Board PCIe Switch
ĄĄ Supports PCI Express Standard External Power Connector
ĄĄ Multi Channel High Speed DMA
ĄĄ Full CoreFire Board Support Package for fast, easy application development
ĄĄ VHDL model, including source code for hardware interfaces and ChipScope Access
ĄĄ Available in both commercial and industrial temperature grades
ĄĄ Proactive Thermal Management System – Board Level current measurement and FPGA temperature monitor, accessible through Host API
ĄĄ Includes one year hardware warranty, software updates, and customer support
ĄĄ Training available
Supports up to Three 56G FDR InfiniBand, Three 40Gb Ethernet, or Twelve 10Gb Ethernet Connections.
WILDSTAR A5 for PCI Express uses Altera’s newest Stratix V FPGAs for state-of-the-art performance. This is the first of a series of Altera Based FPGA Processing Boards from Annapolis.
Annapolis Micro Systems, Inc. is a world leader in high-performance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Defined Radio, encryption, image processing, prototyping, text processing, and other processing intensive applications. It accepts one or two I/O mezzanine cards, including Single 1.5 GHz 8 Bit ADC, Quad 250 MHz 12 Bit ADC, Single 2.5 GHz 8 Bit ADC, Quad 130 MHz 16 Bit ADC, Dual 2.3/1.5 GSps 12 Bit DAC, Quad 600 MSps 16 Bit DAC, Universal 3Gbit Serial I/O (RocketIO, 10 Gb Ethernet, InfiniBand), and Tri XFP (OC 192, 10G Fibre Channel, 10 Gb Ethernet). Our boards work on a number of operating systems, including Windows and Linux. We support our board products with a standardized set of drivers, APIs and VHDL simulation models.
Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development pro-cess, making it possible for theoreticians to easily build and test their algorithms on the real hardware that will be used in the field. CoreFire, based on dataflow, automatically generates distributed control fabric between cores.
Our extensive IP and board support libraries contain more than 1,000 cores, including floating point and the world’s fastest FFT. CoreFire uses a graphical user interface for design entry, supports hardware-in-the-loop debugging, and provides proven, reusable, high-performance IP modules. WILDSTAR A5 for PCI Express, with its associated I/O Cards, provides extremely high overall throughput and processing performance. The combination of our COTS hard-ware and CoreFire allows our customers to make massive improve-ments in processing speed, while achieving significant savings in size, weight, power, person-hours, dollars, and calendar time to deployment.
WILDSTAR A5 for PCI Express
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Processing
embedded-computing.com/p372673
Annapolis is famous for the high quality of our products and for our unparalleled dedication to
ensuring that the customer’s applications succeed.
We offer training and exceptional special application development support, as well as
more conventional support.
www.embedded-computing.com 55
FEATURES
V61x Series (Air Cooling)ĄĄ Dual XMC I/O Module SitesĄĄ Xilinx Virtex-6 SX475T-2 FPGAĄĄ Intel i7 Quad Core, 16GB RAM, SSD
K70x Series (Conduction Cooling)ĄĄ Dual FMC I/O Module SitesĄĄ Xilinx Kintex-7 XC7K410T-2 FPGAĄĄ Intel i7 Quad Core, 16GB RAM, SSD
The Digital Receiver is a turnkey solution providing an integrated data logger, digital down conversion (DDC), and a spectrum analyzer (FFT) in a compact system. The solution consists of three parts: An FPGA-based analog digitizer module and a PC-based host controller plus an optional firmware development kit to allow customization.
A development kit is available to support creation of advanced custom firmware by logic developers. Netlist versions of the IP cores used to build the Digital Receiver are provided, so developers can integrate with their own custom cores to create an enhanced receiver design.
Existing Innovative XMC module owners need only purchase the soft-ware/firmware to achieve full Digital Receiver functionality.
Download data sheets and pricing now!
Digital Receiver Instrumentation Series
Processing
embedded-computing.com/p372747
Innovative Integrationwww.innovative-dsp.com/products.php?product=DIG-RX-Overview
[email protected] 805-383-8994
FEATURES
ĄĄ Intel i7 Quad Core, 8 GB RAM, 240 GB SSD, Win 7 Pro 64-bitĄĄ Two, independent XMC module sites ĄĄ Sustained logging rate up-to 2,000 Mbyte/sĄĄ Per-Module FeaturesĄĄ Two 12-bit, 1000 MHz ADCs; analog bandwidth: 1000 MHz (AC Coupled)ĄĄ Two 16-bit, 1000 MHz DACs; analog bandwidth: 1000 MHz (AC Coupled)ĄĄ Xilinx Virtex-6 SX475T-2 FPGAĄĄ Embedded power meterĄĄ PCI Express Gen 2 (3,200 MByte/s)ĄĄ Digital Down-Converter (DDC)ĄĄ Four independent 16-bit DDC channelsĄĄ Digital Up-Converter (DUC)ĄĄ Two independent 16-bit DUC channelsĄĄ Spectrum AnalyzerĄĄ Single wide-band/narrow-band 32K points FFT
The Digital Transceiver is a turnkey solution providing a integrated data logger, digital down conversion (DDC), digital up conversion (DUC), and a spectrum analyzer (FFT) in a compact system.The V615 digital transceiver supports one or two plug-in modules, each featur-ing four independent channels of DDC, two DUC, and one spectrum analyzer embedded in the Xilinx Virtex-6 FPGA. It allows users to monitor the wide-band or narrow-band spectrum and record the data directly from the ADCs or down-convert the channels modulated on the IF band. The embedded PC can do con-tiguous recording at 2,000 MByte until running out of disk space. The transmitter can play the recorded baseband waveform of different bandwidth, up-convert and modulate it on the IF band on the DACs.The V616 digital transceiver supports one or two plug-in modules, each featuring four independent channels of DDC, two DUC, and one spectrum analyzer embed-ded in the Xilinx Virtex-6 FPGA. It allows users to monitor the wide-band or nar-row band spectrum and record the data directly from the ADCs or down-convert the channels modulated on the IF band. The embedded PC can do contiguous recording at 2,000 MByte until running out of disk space. The transmitter can play the recorded baseband waveform of different bandwidth, up-convert and modulate it on the IF band on the DACs.
Download data sheets and pricing now!
Digital Transceiver Systems
Processing
embedded-computing.com/p372705
Innovative Integrationwww.innovative-dsp.com
[email protected] 805-383-8994
56 Embedded Computing Design | August 2015
The ADLMES-8200 is a highly innovative embedded enclosure design. Its highly configurable modularity makes it possible to expand or reduce a system without replacing the entire enclosure. Side wall modules may be added or removed as system requirements evolve. Three stan-dard profiles provide quick turn inventory availability. A broad portfolio of PC/104 SBC Options Ranging from low-power Intel® Atom™ to high performance 4th Generation Intel Core i7 Processors are available.
Potential aPPlications include: • Rugged Industrial Applications • Communications Applications • Mobile Routers and Other Network Appliances • Military and Defense – Rugged SFF • Railway Train Control • Transportation • Imaging Applications
ADLMES-8200 – Rugged Modular Enclosure Systems
Rugged Systems
embedded-computing.com/p372181
ADL Embedded Solutions Inc.www.adl-usa.com
[email protected] 858-490-0597
FEATURES
ĄĄ Modular Sidewall Design Supports Variable PC/104 Stack Heights (2 - 6 Cards) or Expanded 3.5" SBC Intelligent Systems ĄĄ High and Low IP (Ingress Protection) Systems Possible via High IP,
Modular Chassis Design Coupled with Full Custom, Quick-Turn I/O PanelsĄĄ Broad Portfolio of PC/104 SBC Options Ranging from Low Power
Intel® E3800 Atom™ to High Performance 4th Generation Intel Core i7 ProcessorsĄĄ Fully Supported by ADL Embedded Solutions’ Team of Solidworks
Engineers for Model and or Design SupportĄĄ Options for MIL-STD 810, MIL-STD 461, and MIL-STD 704/1275
www.embedded-computing.com 57
FEATURES
ĄĄ General Features • 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write
bandwidth determined by system environmentals) • Scalable Depth and Bandwidth • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot
Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Backplane I/O • Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of
20GB/s on P1 • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM • 1Gb Ethernet Connection on P4
ĄĄ System Management • Client/Server Interface for WILDSTAR FPGA Boards and Linux and
Windows-based CPU systems • Extensive System and Drive Diagnostic Monitoring and
Configuration over 1 Gb Ethernet via P1 and P4 Ethernet • Standard Intelligent Platform Management Interface (IPMI) to
Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control
and Data Plane Connections
ĄĄ Physical Features • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile:
MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling
When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write band-width. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).
The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister.
The Storage Carrier/Canister is specifically designed to sup-port 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates).
To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system. Sensors across the board monitor power and temperature, with auto-matic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design. Sensors can be accessed with a chassis manager (ChMC).
New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier.
WILD Data Storage Solution
Annapolis Micro Systems, Inc.www.annapmicro.com
[email protected] 410-841-2514
Storage
embedded-computing.com/p372456
58 Embedded Computing Design | August 2015
FEATURES
ĄĄ Tiny size with outstanding performanceĄĄ Compliant with MO-276 standard (16x20x1.4mm)ĄĄ SoC (System on chip)/SiP (System in chip) TechnologyĄĄ Built-in S.M.A.R.T. functionsĄĄ TRIM command supportĄĄ DEVSLP Support
Micro SATA Disk Chip/μSDC – Apacer’s ultra-small 16x20mm SSD – complies with the JEDEC MO-276 specification. It performs at a maximum sequen tial read/write speed of 515/165 MB/sec. Breaking the traditional size restrictions, it integrates key components such as a controller, flash and DRAM in a single chip with the ball grid array (BGA) technol-ogy. In addition, its features such as wide temperature (-40°C ~ +85°C) and surface-mount technology (SMT) provide a stable storage installation even at the highest altitude.
Micro SATA Disk Chip/μSDC
Storage
embedded-computing.com/p372849
APACERwww.apacer.com [email protected]
FEATURES
ĄĄ 7-pin SATA connectorĄĄ Unique Hook DesignĄĄ TRIM Command SupportĄĄ Product Housing Selection (Optional)ĄĄ Built-in ATA Secure Erase and S.M.A.R.T. FunctionsĄĄ Global Wear-Leveling and Block Management
Apacer SATA Disk Module adopts a 7-pin SATA connector. Its innova-tive hook design can effectively protect the inner parts of the system from possible loosening during any movement, ensuring operational stability. It comes in various angles (90°, 180°, 270°), heights, and widths, so users can flexibly install the storage device in accordance with their own mechanical designs. Moreover, selected designs of the product facilitate airflow within a unit’s body for better heat dissipation. Boot Protect Technology can be supported as well.
With the built-in power pins on the 7-pin SATA connector, the module can operate without an external power cable. In addition, its unique locking mechanism provides secure connectivity to a motherboard during shock. The optional Write Protect switch can also disable the host from performing any write to the device.
SATA Disk Module
Storage
embedded-computing.com/p372850
APACERwww.apacer.com [email protected]
www.embedded-computing.com 59
FEATURES
ĄĄ Combines an industry-standard COM Express CPU module with dual XMC I/O modules in a compact, stand alone designĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" DĄĄ Stand-alone operation: Able to operate diskless and headlessĄĄ Windows, Linux and RTOS supportĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to
industrial control modules.ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory**ĄĄ Integrated timing and triggering support for I/O includes optional GPS,
IEEE-1588 or IRIG-disciplined clockĄĄ Supports Innovative X3, X5, and X6 I/O module features for private data
channels, triggering and timing featuresĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, HD audioĄĄ System expansion supported with dual 10 GbE ethernet linksĄĄ FPGA for custom I/O and interfaces
**Data rate dependent on the COM Express module capabilities.
The ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance XMC modules. With its modular I/O, scalable perfor-mance, and easy to use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need.Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Limitless expansion via multiple nodes. Up to 4 HDD for data logging.Uniquely customizable – Dual XMC sites for I/O, user-programmable FPGA for I/O interfaces, triggering and timing control, USB ports.Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad local SSDs or dual 10 GbE LAN). Optional, stand-alone, autonomous operation with GPS or network-synchronized sampling.Rugged – SSD boot drive support in a compact, rugged 250x195mm footprint that is ready for embedded operation.8-36V DC-Only Operation – Perfect for portable or automotive data loggers or waveform generators.
Download data sheets and pricing now!
ePC-Duo
Systems or Modular Systems
embedded-computing.com/p372450
Innovative Integrationwww.innovative-dsp.com/products.php?product=ePC-Duo
[email protected] 805-383-8994
FEATURES
ĄĄ Combines an industry-standard COM Express CPU module with dual FMC I/O modules in a compact, stand alone designĄĄ Programmable Kintex 7 325/410 and Spartan 6 FPGAsĄĄ Small form factor: 5" H x 8" W x 11" DĄĄ Conduction cooled design: Fins or cold-plateĄĄ Stand-alone operation: Able to operate headless, booting from SSDĄĄ Windows, Linux OS supportĄĄ Dual VITA 57 FMC I/O module sites. Add anything from RF receivers to
industrial control modules.ĄĄ I/O sites (VITA 42.3) deliver >3000MB/s to CPU memoryĄĄ Integrated timing and triggering support for IO includes GPS, IEEE1588 or
IRIG-disciplined clockĄĄ Supports Innovative and third-party FMC modules for private data channels,
triggering and timing featuresĄĄ USB3.0 x6, Gb Ethernet x2, SATA x4, DisplayPort, Touch ScreenĄĄ Up to 4 SSD or HDD (2.5 in) AC or DC operation
The ePC-K7 is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ulti-mate-performance FMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-K7 reduces time-to-market while providing the performance you need.Distributed Data Acquisition – Put the ePC-K7 at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Limitless expansion via multiple nodes. Up to 4 HDD for data logging.Uniquely customizable – Dual FMC I/O module sites – add anything from RF receivers to industrial control modules. User-programmable FPGA for I/O interfaces, triggering and timing control, USB ports.Remote or Local Operation – Continuous data streaming up to 1000MB/s or 2 x Gb/s Ethernet. Optional, stand-alone, autonomous operation with GPS-synchronized sampling.Rugged – SSD boot drive support in a compact, rugged 8x11" footprint that is ready for embedded operation.8-36V DC-Only Operation – Perfect for portable or automotive data loggers or wave-form generators.
Download data sheets and pricing now!
ePC-K7
Systems or Modular Systems
embedded-computing.com/p371726
Innovative Integrationwww.innovative-dsp.com/products.php?product=ePC-K7
[email protected] 805-383-8994
60 Embedded Computing Design | August 2015
FEATURES
ĄĄ Combines an industry-standard COM Express CPU module with a single FMC I/O module in an extremely compact, stand alone designĄĄ Programmable Kintex 7 325/410 and Spartan 6 FPGAsĄĄ Small form factor: 4" H x 7" W x 10" DĄĄ Conduction cooled design: Fins or cold-plateĄĄ Stand-alone operation: Able to operate headless, booting from SSDĄĄ Windows, Linux OS support; RTOS availabilityĄĄ Single VITA 57 FMC I/O module site. Add anything from RF receivers to
industrial control modules.ĄĄ Integrated timing and triggering support for I/O includes GPS or
IEEE1588-disciplined clockĄĄ Supports Innovative and third-party FMC modules for private data channels,
triggering and timing featuresĄĄ 4 USB ports, 1Gb Ethernet, SATA (up to 4), DisplayPort Touch ScreenĄĄ Up to 2 SSD (1.8 in); AC or DC operation
The mini-K7 is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance FMC modules. With its modular I/O, scalable perfor-mance, and easy to use PC architecture, the mini-K7 reduces time-to-market while providing the performance you need.Distributed Data Acquisition – Put the mini-K7 at the data source and reduce system errors and complexity. Optional GPS or IEEE1588-synchronized timing, triggering and sample control is available for remote I/O. Limitless expansion via multiple nodes. Up to 4 SSD for data logging.Uniquely customizable – Dual FMC sites for I/O, user-programmable FPGA for I/O interfaces, triggering and timing control, USB ports.Remote or Local Operation – Continuous data streaming up to 3200 MB/s to SSD or Gb/s Ethernet. Optional, stand-alone, autonomous operation with GPS-synchronized sampling.Rugged – SSD boot drive support in a compact, rugged footprint that is ready for embedded operation.9-18V DC-Only Operation – Perfect for portable or automotive data loggers or waveform generators.
Download data sheets and pricing now!
mini-K7
Systems or Modular Systems
embedded-computing.com/p372228
Innovative Integrationwww.innovative-dsp.com/products.php?product=Mini-K7
[email protected] 805-383-8994
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TS-7970Single Board ComputerIndustrial High Performancei.MX6 SBC with Wireless Connectivity and Dual GbEth
$169Starting at
$214Qty 100
Qty 1
1 GHz Solo or Quad Core Freescale i.MX6 ARM CPU
Linux, Android, QNX, WindowsHDMI, LVDS, & Audio In/Out2x Gigabit Ethernet, 4x USBWiFi and Bluetooth Module2 GB RAM, 4 GB eMMC Flash
Module Starting At$89 (Qty 100)
TS-TPC-7990Touch Panel PC7” High End i.MX6 MountablePanel PC with Dev Tools Such as Debian GNU and QTCreator
$299Starting at
$342Qty 100
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Yocto, Debian, Ubuntu Distro SupportQTCreator, GTK, DirectFB, and MoreLinux, Android, QNX, & Windows10 Inch Screen AvailableResistive and Capacitive Screens Enclosed TPCs
Also Available
www.embedded-computing.com 61
Security capabilities for embedded and IoT appsFloodgate Security Framework (FSF) provides engineers developing embedded devices with a comprehensive security solution allowing them to build secure, authenticated, trusted devices. IT security practices require endpoints to be authenticated, trusted, secured, and managed before they are allowed to operate on the corporate network. IT/OT convergence and the emergence of security standards in various industries require embedded devices provide the same security capabilities as IT devices. The Floodgate Security Framework provides the building blocks for achieving compliance with security standards including EDSA, ISA/IEC 62443, and NIST Cybersecurity guidelines.
MIPS opens architecture for universitiesImagination Technologies has announced that the MIPS CPU will be releasing a fully open MIPS CPU to academic institutions worldwide at no cost. Academic institutions will have access to the RTL for study and research that Imagination Technologies believes will lead to a new wave of innovations in both processor technologies and advancements in applications like IoT, mobile, and automotive. The MIPS architecture features a Reduced Instruction Set Computer (RISC) architecture with memory management, caching, and debug interfaces well suited to running full-featured operating systems like Linux as well as a variety of embedded real-time operating systems (RTOSs). Among those signed up for the program include Harvey Mudd College, Imperial College London, University College London, Keio University, Tsinghua University, and Shanghai Jiao Tong University. Universities interested in joining the program can do so by registering at community.imgtec.com/university/university-registration.
Imagination Technologies | www.imgtec.com embedded-computing.com/p372818
Icon Labs | www.iconlabs.com embedded-computing.com/p372719
Virtex-7 FPGA carriersVadaTech announced the introduction of new Virtex-7 FPGA carriers that utilize the 690T device, which provides more than 693K logic cells and 3,600 DSP slices. The carrier includes banks of 64-bit and 16-bit DDR3 memory and onboard P2040 PowerPC. The AMC527 carrier is similar, but includes 144 Mb QDR-II memory and no onboard PowerPC. Both carriers include a slot for an FPGA Mezzanine card (FMC) per VITA 57 standards. VadaTech also offers a variety of FPGAs, processors, graphics, digitizers, and chassis platforms in many form factors to complement these new Virtex-7 FPGA carriers.
VadaTech | www.vadatech.com www.embedded-computing.com/p372819
Editor’s Choiceembedded-computing.com/editors-choice
Network Security Appliance
PICMG SBC
1-877-278-8899
Mini-ITX Small Form Factor System
COM Express Module
Untitled-1 1 9/15/14 8:58 AM
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