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plated held by the holding jig while a clearance is left between the cylindrical body and the sur- face to be plated and an axial line of the cylindrical body is substan- tially perpendicular to the surface to be plated; an anode plate ar- ranged in the cylindrical body be- ing opposed to the surface of the object to be plated; and a nozzle arranged in the cylindrical body while it penetrates the anode plate and the plating solution is jetted onto the surface to be plated from the nozzle end section located in the cylindrical body. SPUTTERING TARGET ASSEMBLY U.S. Patent 6,030,514. Feb. 29, 2000 J.A. Dunlop et all., assignors to Sony Corp., Tokyo, and Materials Research Corp., Orangeburg, N.Y. A method of reducing sputtering burn-in time, minimizing spur- tered particulate, and target as- sembly therefor. FABRICATING METAL MICROPATIrERNS U.S. Patent 6,030,515. Feb. 29, 2000 K. Heyers and B. Elsner, assignors to Robert Bosch GmbH, Stuttgart, Germany A method for creating a metal mi- cropattern comprising creating a plurality of trenches in a polymer layer; producing an insulating layer only on each of the side walls of the plurality of trenches; after the producing step, filling each of the plurality of trenches with the metal micropattern us- ing an electroplating process; and after the filling step, removing the polymer layer without removing the insulating layer on the respec- tive side walls of each of the plu- rality of trenches. TIN PLATING ELECTROLYTE COMPOSITION U.S. Patent 6,030,516. Feb. 29, 2000 C.H. O'Driscoll, Selby, North Yorkshire, U.K. A composition suitable for use in a INDUS TRIES, INC. 115 East Main Street, Belding MI 48809 • 616-794-0410 or 616-691-8195 Fax: 616-794-3424 • E-mail: [email protected] • www.belcoind.com Circle 016 on reader information card process for electroplating surfaces with tin comprising an unsubsti- tuted or substituted para alkyl benzene sulfonic acid; sulfuric acid or sulfamic acid or both; one or more additional agents; a tin source; and water. DEBONDING PAINT FROM A METAL U.S. Patent 6,030,519. Feb. 29, 2000 R. Keller et al., Export, Pa. In an improved method for elec- trolytically debonding a paint coating from a metal member wherein the paint coating is bonded to a surface of the metal member, the improvement com- prising providing an electrode blanket on said paint coating; ap- plying an aqueous-based electro- tyte solution to the electrode blan- ket; and passing an electric current for a time sufficient to cause the paint coating to debond from the surface without substan- tially chemically altering the paint coatings. UV-CURED COATING U.S. Patent 6,030,703. Feb. 29, 2000 M. Fan et al., assignors to Sartomer Co. Inc., Exton, Pa. A radiation-curable polyester. HOT-DIP COATED STEEL U.S. Patent 6,030,714. Feb. 29, 2000 N. Fujibayashi et al., assignors to Kawasaki Steel Corp., Hgoyo, Japan A zinc and zinc-alloy hot-dip- coated steel sheet having de- creased bare spots and excellent coating adhesion. GOLD PLATING PROCESS U.S. Patent 6,030,877. Feb. 29, 2000 C.Y. Lee and T.H. Huang, assignors to Industrial Technology Research Institute, Hsin-Chu, Taiwan An electroless gold plating method for forming inductor structures. CATIONIC ELECTRODEPOSlTION COATING COMPOSITION U.S. Patent 6,031,028. Feb. 29, 2000 Y. Iino et al., assignors to Kansai April 2001 95
