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Filtek™ LS Low Shrink Posterior Restorative System.

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Filtek™ LS Low Shrink Posterior Restorative System
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Page 1: Filtek™ LS Low Shrink Posterior Restorative System.

Filtek™ LS Low Shrink Posterior Restorative System

Page 2: Filtek™ LS Low Shrink Posterior Restorative System.

Filtek™ LS Low Shrink Posterior Restorative System

Less than 1% shrinkage1

Reduced stress and improved marginal integrity Extended operatory light stability

A remarkable 9 minutes of working time Ideal handling

Non-sticky, easier manipulation during placement, and ideal sculptability

Silorane technology Low shrinkage is achieved by using a novel ring-opening chemistry, called silorane.

Used with dedicated 3M™ ESPE™ LS System Adhesive Available in 4 shades (A2, A3, B2, C2) with excellent chameleon effect

1 <1% volumetric shrinkage tested by bonded-disc method

Page 3: Filtek™ LS Low Shrink Posterior Restorative System.

Polymerization Stress vs. Shrinkage

0

5

10

15

20

0.5 % 1.0% 1.5% 2.0% 2.5% 3.0%

Shrinkage (Vol. %)

Poly

mer

izat

ion

Stre

ss (

MPa

)

Filtek™ LS Watts et

al.

Charisma™

Spectrum® TPH®

Herculite™ XRV

CeramX™

Grandio®

QuiXX™

Premise™

Tetric EvoCeram®

P60

AdvantagesReduced polymerization shrinkage and stress can lower the risk of marginal staining, post-operative sensitivity, secondary caries, microleakage and debonding.

AdvantagesReduced polymerization shrinkage and stress can lower the risk of marginal staining, post-operative sensitivity, secondary caries, microleakage and debonding.

Stress method: Bloman; shrinkage method: bonded-disc. Source: University of Manchester

Page 4: Filtek™ LS Low Shrink Posterior Restorative System.

Polymerization Stress

Methacrylate ChemistrySilorane Chemistry

Filtek™ LS

Finite element analysis of polymerization stress. Source: University of Minnesota.

HighStress

LowStress

50

QuiXX™

Page 5: Filtek™ LS Low Shrink Posterior Restorative System.

Operatory Light Stability

Advantages Increased working time Ability to use operatory light directly Improved visibility in the posterior can

lead to better marginal adaptation Flexibility and easy placement

Method: ISO 4049, Source: 3M ESPE, internal data

Page 6: Filtek™ LS Low Shrink Posterior Restorative System.

Placement of Filtek™ LS Posterior Restorative

3M™ ESPE™ Filtek LS Self-Etch Primer Apply with agitation for 15 sec Air dry Light cure for 10 seconds

3M™ ESPE™ LS System Adhesive Bond Apply Air thin if desired Light cure for 10 seconds

Filtek™ LS Restorative Incremental placement is indicated; depth of

cure is 2.5 mm Excellent operatory light stability allows

additional time for manipulation Light-cure each increment as indicated (20

seconds for LED over 1000 mw/cm2)

Page 7: Filtek™ LS Low Shrink Posterior Restorative System.

Photos courtesy of Dr. Gabriel Krastl

Clinical Results of Filtek™ LS Posterior Restorative

Page 8: Filtek™ LS Low Shrink Posterior Restorative System.

Filtek™ LS Low Shrink Posterior Restorative System

Filtek™ LS Posterior Restorative could help increase patient satisfaction, improve restorative success, and increase practice productivity

Two ways to try Filtek™ LS Posterior Restorative SystemTrial Kit (4901TK & 4902TK)Risk Free Try & Buy (4901TB & 4902TB)- Available 6/2008


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