Final Documentation

PIR sensor based security system using 89C52 micro controller

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JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY KAKINADA

“PIR SENSOR BASED SECURITY SYSTEM USING 89C52 MICRO-

CONTROLLER”

Submitted to

Jawaharlal Nehru Technological University Kakinada

in partial fulfillment for the award of the degree of

Bachelor of Technology

In

ELECTRONICS AND COMMUNICATION ENGINEERING

Submitted by

G.NAGA SIRISHA (12H71A0487) K.MADHU BINDU (13H75A0406)

Y.ANIL KUMAR (12H71A0463) T.KATHIK (13H75A0422)

Under the Guidance of

Mrs. A.SARADA, ME

Associate Professor& ECE department

Of

ELECTRONICS AND COMMUNICATION ENGINEERING

Devineni Venkata Ramana & Dr. Hima Sekhar

MIC College of Technology

Kanchikacherla, Krishna Dist, PIN: 521180, A.P, India.

2015-2016


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Devineni Venkata Ramana & Dr. Hima Sekhar

MIC College of Technology Kanchikacherla, Krishna Dist, PIN: 521180, A.P, India.

CERTIFICATE

This is to certify that the Main Project entitled “PIR SENSOR BASED SECURITY

SYSTEM USING 89C52 MICRO CONTROLLER” is a bonafide work done by

G.NAGA SIRISHA (12H71A0487), K.MADHU BINDU (13H75A0406), Y.ANIL

KUMAR(12H71A0463) and T.KARTHIK (13H75A0422)in partial fulfillment for the award of

Bachelor of Technology in ELECTRONICS AND COMMUNICATION

ENGINEERING of Jawaharlal Nehru Technological University Kakinada during the

year 2015-2016.

(Mrs. A.SARADA ) (Dr. A. GURUVA REDDY)

Associate Professor Professor,Dept of ECE

Project Guide Head of the Department

(Dr.K.B.K.RAO)

Principal

Examiner 1 Examiner 2


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ACKNOWLEDGEMENT

I would like to take this opportunity to express our deep gratitude to the members who

assisted us directly and indirectly for the completion of this project work.

I would like to thank Mrs.A.SARADA, Associate Professor in the Department of

Electronics and Communication Engineering, department the project supervisor for her

esteemed guidance and support, especially the valuable ideas and thoughts provided during

this project work. She is expertise in the area of Communication systems, this makes us

very useful in solving the problems encountered during the project work.

I would like to express our immense pleasure in expressing immeasurable sense of

gratitude to, Dr.A.GURUVA REDDY, Professor& Head of the Department in

Electronics and Communication Engineering for his valuable suggestions in the

completion of the project.

I wholeheartedly acknowledge Dr. K. B. K. RAO, Principal, Prof. N. KRISHNA,

Director Academics and Prof. D. PANDURANGA RAO, CEO for giving opportunity to

make this project a successful one.

I also extend our thanks to all the faculty members of Electronics and Communication

Engineering Department for their valuable contributions in this project.

I would like to extend our warm appreciation to all my friends for sharing their

knowledge and valuable contributions in this project.

Finally I express our deep sense of gratitude to all our parents for their continuous

support throughout our academic carrier and their encouragement in completion of this

project work successfully.

G.NAGA SIRISHA

K.MADHUBINDU

Y.ANIL KUMAR

T.KARTHIK


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DECLARATION

I “G.NAGA SIRISHA(12H71A0487),K.MADHU BINDU(13H75A0406),YANIL

KUMAR(12H71A0463) and T.KARTHIK(12H71A0422) ”of the main project “PIR

SENSOR BASED SECURITY SYSTEM USING 89C52 MICRO CONTROLLER”,

hereby declare that the matter embodied in this project is genuine work done by me and has

not been submitted either to this university or to any other university/institute for the

fulfillment of the requirement of any course of study.

G.NAGA SIRISHA(12H71A0487)

K.MADHUBINDU(135A0406)

Y.ANIL KUMAR(12H71A0463)

T.KARTHIK(13H75A0422)


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ABSTRACT

The main aim of this project is to develop a low cost security system using small

Pyro-electric infrared (PIR) sensor built around a micro controller. The low-power PIR

detectors take advantage of pyro electricity to detect a human body that is constant source of

Passive Infrared and is usually not at thermal equilibrium with the surrounding environment.

Detecting the presence of any unauthorized person, the system sets up a voice message and

call to a predefined number. In addition to this the system also sets alarm when it detects

smoke particles.


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CHAPTER-1

1.1 INTRODUCTION TO EMBEDDED SYSTEMS:

An embedded system can be defined as a computing device that does a specific

focused job. Appliances such as air conditioner, VCD Player, DVD Player, Printer, FAX

Machine, Mobile phone etc are some of examples of embedded system. Each of these

appliances will have a processor and special hardware to meet the specific requirement of

application along with embedded software that is executed by the processor for meeting that

specific requirement. The embedded software is also called “FIRM WARE”. In contrast, the

software in embedded systems is always fixed listed below.

Embedded systems do a very specific task; they cannot be programmed to do different

things. Embedded systems have very limited resources, particularly memory. Generally, they

do not have secondary storage devices such as CDROM or FLOPPY DISK. Embedded

systems have to work against some dead line. A specific job has to be completed within a

specific time. In some embedded systems, called real time systems, the deadlines are

stringent. Missing a dead line cause a catastrophe-loss of life or damage to property.

Embedded systems are constrained for power. As many embedded systems operate through a

battery, power consumption has to be very low. Some embedded systems have to operate in

extreme environmental conditions such as very high temperatures and humidity.

1.2 APPLICATION AREAS

Nearly 99% of processors manufactured end up in embedded systems. The embedded

system market is one of the highest growth areas as these systems are used in every market

segment-consumer electronics, office automation, industrial automation, biomedical

engineering wireless communication, data communication, telecommunication, transportation

and so on.

Consumer Appliances:

At home we use a number of embedded systems which include digital camera, digital

diary, DVD player, electronic toys, microwave oven, remote controls etc. Today’s high-tech

car has embedded systems for transmission control, engine sparkcontrol, air conditioning,

navigation etc.


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Office Automation:

Products using embedded systems are copying machine, fax machine, key telephone,

modems etc.

Industrial Automation:

Today a lot of industries use embedded systems for process control. These include

pharmaceutical, cement, sugar, oil exploration, nuclear energy, electricity generation and

transmission. The embedded system for industrial use are designed to carry out specific tasks

such as monitoring temperature, pressure, humidity, voltage, current etc., and then take

appropriate action based on monitored levels to control other devices or to send information

to a centralized monitoring station. In hazardous industrial environment, where human

presence has to be avoided, robots are used, which are programmed to do specific jobs.

Medical electronics:

Almost all medical equipments in hospitals are embedded systems. These equipments

include diagnostic aids such as ECG, EEG, blood pressure measuring devices, X-ray

scanners, equipment used in blood analysis, radiation, colons copy, endoscopy etc.

Developments in medical electronics have paved way for more accurate diagnosis of

diseases.

Security:

Security of persons and information has always been a major issue. We need to

protect our homes and offices and also information we transmit and store. Developing

embedded systems for security applications is one of the most lucrative businesses nowadays.

Biometric systems using fingerprint and face recognition are now being extensively used for

user authentication in banking applications as well as for access control in high security

buildings.

Finance:

Financial dealing through cash and cheques are now slowly paving way for

transactions using smart cards and ATM machines. Smartcard, of the size of a credit card, has

a small microcontroller and memory and it interacts with smartcard reader! ATM machine

acts as an electronic wallet. Smartcard technology has capability of ushering in a cashless


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society. Well, the list goes on. It is no exaggeration to say that eyes where ever you go, you

can see, the work of an embedded system.

1.3 EMBEDDED SYSTEM ARCHITECTURE

Every embedded system consists of custom-built hardware built around a Central

Processing Unit (CPU). This hardware also contains memory chips onto which the software

is loaded. The software residing on the memory chip is also called the ‘firm’. The embedded

system architecture can be represented as a layered architecture as shown in Fig.

Fig 1.3 Layered Architecture

The operating system runs above the hardware, and the application software runs

above the operating system. The same architecture is applicable to any computer including a

desktop computer. However, there are significant differences. It is not compulsory to have an

operating system in every embedded system. For small appliances such as remote control

units, air conditioners, toys etc., there is no need for an operating system and you can write

only the software specific to that application. For applications involving complex processing,

it is advisable to have an operating system. In such a case, you need to integrate the

application software with the operating system and then transfer the entire software on to the

memory chip. Once the software is transferred to the memory chip, the software will continue

to run for a long time you don’t need to reload new software.

Now, let us see the details of the various building blocks of the hardware of an

embedded system.

Hardware

Operating system

Application software


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Fig1.3.1: The Building Blocks

Central Processing Unit (CPU)

Memory (Read-only Memory and Random Access Memory)

Input Devices

Central Processing Unit (CPU):

The Central Processing Unit (processor, in short) can be any of the following:

microcontroller, microprocessor or Digital Signal Processor (DSP). A micro-controller is a

low-cost processor. Its main attraction is that on the chip itself, there will be many other

components such as memory, serial communication interface, analog-to digital converter etc.,

so, for small applications, a micro-controller is the best choice as the number of external

components required will be very less. On the other hand, microprocessors are more

powerful, but you need to use many external components with them. DSP is used mainly for

applications in which signal processing is involved such as audio and video processing.

Memory:

The memory is categorized as Random Access Memory (RAM) and Read Only

Memory (ROM). The contents of the RAM will be erased if power is switched off to the

chip, whereas ROM retains the contents even if the power is switched off. So, the firmware is


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stored in the ROM. When power is switched on, the processor reads the ROM; the program is

executed.

Input devices:

Unlike the desktops, the input devices to an embedded system have very limited

capability. There will be no keyboard or a mouse, and hence interacting with the embedded

system is no easy task. Many embedded systems will have a small keypad-you press one key

to give a specific command. A keypad may be used to input only the digits. Many embedded

systems used in process control do not have any input device for user interaction; they take

inputs from sensors or transducers, produce electrical signals that are in turn fed to other

systems.

Output devices:

The output devices of the embedded systems also have very limited capability. Some

embedded systems will have a few Light Emitting Diodes (LEDs) to indicate the health status

of the system modules, for visual indication of alarms. A small Liquid Crystal Display (LCD)

may also be used to display some important parameters.

Communication interfaces:

The embedded systems may need to interact with other embedded systems at they

may have to transmit data to a desktop. To facilitate this, the embedded systems are provided

with one or few communication interfaces such as RS232, RS422, RS485, Universal Serial

Bus (USB), and IEEE 1394, Ethernet etc.

Application-specific circuitry:

Sensors, transducers, special processing and control circuitry may be required for an

embedded system, depending on its application. This circuitry interacts with the processor to

carry out the necessary work. The entire hardware has to be given to power supply either

through the 230 volts main supply or through a battery. The hardware has to design in such a

way that the power consumption is minimized.


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1.4 BLOCK DIAGRAM

Figure1.4:Block diagram

Nowadays life style has become very fast and busy and it is not possible to continuously track

the alarming events. Hence, the automation of capturing the events and communicating them

has become necessity. To achieve this we have developed the system named “PIR SENSOR

BASED SECURITY SYSTEM USINGMICRO CONTROLLER”.

If a sensor detectsany unauthorized situation then the system triggers an alarm and initiates

call to the configured mobile number. This system can be used in many applications such as offices,

companies and home. For this, a smoke sensor, a PIRsensoralong withGSM are used.

The Microcontroller interprets the received call from the SIM within GSM and

initiates the required action.The Microcontroller will continuously check the status of the

sensor. If any of the sensor’s condition breaks, then the Microcontroller detects that and sends

respective CALL through Mobile to the concerned person, so that the person can take further

action. Thus the system can secure the respective situation.


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CHAPTER-2

SYSTEM DESIGN

This chapter clearly explainsthe Block Diagram and its description, its Hardware details and

Software details.

2.1 BLOCK DIAGRAM

Fig: 2.1 Block Diagram of Project

2.1.1.PIR Sensor:

This sensor continuously checks entry to the room.

Sensing element :dual type

Element Size: 2 1 mm

Spacing: 1 mm

Operating Voltage: 12 V

Operating Temperature -10~400centigrade

Storage Temperature -40~800centigrade

MICRO CONTROLLER

89C52

PIR

POWER SUPPLY 5V

GSM module GSM mobile Comparator

Threshold

level

Buzzer

Smoke

Sensor

Reset

ALPHA NUMERIC LCD


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2.1.2. Micro Controller:(89C52)

The specifications for this are

-8051 Family – AT89C52

-Voltage - 5v

-Operating frequency - < 24 MHz

2.1.3 Smoke Sensor:

FEATURES:

Wide detecting scope

Fast response and High sensitivity

Stable and long life

Simple drive circuit

2.1.4. GSM Modem:(Model - SIM 900)

The specifications for this are

Voltage -+12 V

Current - 20mamp

Distance - Unlimited

2.1.5. Buzzer:

It is used to bring attention for any faulty operation detected.

2.1.6. LCD:

It is a 2*16 LCD which is mainly used for displaying any message. Data entering and

message acknowledgement can be displayed through this microcontroller.

2.2 Hardware Requirement:

1. Micro controller (8051)

2.GSM module

3.Buzzer

4.Alpha-numeric LCD display

5. Smoke sensor

6. PIR sensor


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2.3 Software Requirement:

Programming on AT89C52 MC

- AT Commands

- Knowledge on GSM Modem


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CHAPTER-3

Hardware Description

3.1 Introduction

This chapter clearly explains the details of Hardware components that are used in this project

i.e., circuit, Interfacings of various components

CIRCUIT DIAGRAM:

Figure:3.1.1 circuit diagram


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3.2PIR SENSOR:

General Description:

The PIR (Passive Infra-Red) Sensor is a pyroelectric device that detects motion by measuring

changes inthe infrared levels emitted by surrounding objects. This motion can be detected by

checking for a high signal on a single I/O pin.

Figure3.2.1: PIRSensor (side view) and (top view)

Features Single bit output

Small size

Compatible with all Parallax microcontrollers

3.2.1Theory of Operation

Pyroelectric devices, such as the PIR sensor, have elements made of a crystalline material

that generates an electric charge when exposed to infrared radiation. The changes in the

amount of infrared striking the element change the voltages generated, the devicecontains a

special filter called a Fresnel lens, which focuses the infraredsignals onto the element. As


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theambient infrared signals change rapidly, the on-board amplifier trips the output to indicate

motion.

Fig3.2.1.1:pir sensor

3.2.2Pin description and Ratings

Pin Name Function

- GND Connect To Ground Or Vss

+ V+ Connects To +VddOr VDC

Out OUTPUT Connects To I/O Pin Set To

INPUT Mode

3.2.3Principle of PIR sensor:

Every object that has a temperature above 0oC emits thermal energy (heat) in form of

radiation. Homo sapiens, radiate at wavelength of 9-10micrometers all time of the day. The

PIR sensors are tuned to detect this IR wavelength which only emanates when a human

being arrives in their proximity. The term “pyro electricity” means heat that generates

electricity (here, an electric signal of small amplitude). Since these sensors do not have an

infrared source of their own, they are also termed as passive.


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Fig3.2.3.1: schematic diagram of PIR sensor

3.3 MICROCONTROLLER 89C52:

INRODUCTION TO MICRO CONTROLLER:

Definition:

Like most computers, microcontrollers are simply general-purpose Instruction executors. The

real star of a computer system is a program of instructions that is provided by a human

programmer. This program Instructs the computer to perform long sequences of very simple

actions to accomplish useful tasks as intended by the programmer like most computers,

microcontrollers are simply general-purpose Instruction executors. The real star of a

computer system is a program of instructions that is provided by a human programmer. This

program instructs the computer to perform long sequences of very simple actions to

accomplish useful tasks as intended by the programmer


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3.3.1: FEATURES:

Compatible with MCS-51 Products.

8K Bytes of In-System Reprogrammable Flash Memory.

Endurance: 1,000 Write/Erase Cycles.

Fully Static Operation: 0 Hz to 24 MHz.

Three-level Program Memory Lock.

256 x 8-Bit Internal RAM.

32 Programmable I/O Lines.

Three 16-bit Timer/Counters.

Eight Interrupt Sources.

Programmable Serial Channel.

Low Power Idle and Power Down Mode

3.3.2: PIN DIAGRAM AND ITS DESCRIPTIONIPTION:

Fig 3.3.2: Pin Diagram


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. The on-chip Flash allows the program memory to be reprogrammed in-system or by a

conventional nonvolatile memory programmer. By combining a versatile 8-bit CPU with

Flash on a monolithic chip, the Atmel AT89C52 is a powerful microcomputer which

provides a highly flexible and cost effective solution to many embedded control

applications.

The AT89C52 provides the following standard features: 4 Kbytes of Flash, 256 bytes of

RAM, 32 I/O lines, two 16-bit timer/counters, a five vector two-level interrupt

architecture, a full duplex serial port, on-chip oscillator and clock circuitry. In addition,

the AT89C52 is designed with static logic for operation down to zero frequency and

supports two software selectable power saving modes. The Idle Mode stops the CPU

while allowing the RAM, timer/counters, serial port and interrupt system to continue

functioning. The Power Down Mode saves the RAM contents but freezes the oscillator

disabling all other chip functions until the next hardware reset.

3.3.3: ARCHITECTURE OF 89C52


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Fig 3.3.3:Architecture of 89C52

Port 0:

Port 0 is an 8-bit open drain bidirectional I/O port. As an output port each pin can sink

eight TTL inputs. When 1s are written to port 0 pins, the pins can be used as high-impedance

inputs. Port 0 may also be configured to be the multiplexed low order address/data bus during

accesses to external program and data memory. In this mode P0 has internal pull-ups. Port 0

also receives the code bytes during Flash programming, and outputs the code bytes during

program verification. External pull-ups are required during program verification

Port 1:

Port 1 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 1 output

buffers can sink/source four TTL inputs. When 1s are written to Port 1 pins they are pulled

high by the internal pull-ups and can be used as inputs. As inputs, Port 1 pins that are

externally being pulled low will source current (IIL) because of the internal pull-ups. Port 1


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also receives the low-order address bytes during Flash programming and program

verification.

Alternate functions of port 1

PORT PIN ALTERNATE FUNCTIONS

P1.0 T2(external count input to timer/counter2),clock-out

P1.1 T2EX(Timer /counter 2 capture/reload trigger and direction control)

P1.5 MOSI(used for In-System programming)

P1.6 MISO(used for In- System programming)

P1.7 SCK(used for In-System programming)

Table: 3.3.3.1

Port 2:

Port 2 is an 8-bit bidirectional I/O port with internal pullups. The Port 2 output buffers

can sink/source four TTL inputs. When 1s are written to Port 2 pins they are pulled high by

the internal pull-ups and can be used as inputs. As inputs, Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pullups.Port 2 emits the high-

order address byte during fetches from external program memory and during accesses to

external data memory that use 16-bit addresses (MOVX A,@DPTR). In this application it

uses strong internal pull-ups when emitting 1s. During accesses to external data memory that

uses 8-bit addresses (MOVX A,@RI), Port 2 emits the contents of the P2 Special Function

Register. Port 2 also receives the high-order address bits and some control signals during

Flash programming and verification.

Port 3:

Port 3 is an 8-bit bidirectional I/O port with internal pullups. The Port 3 output buffers

can sink/source four TTL inputs. When 1s are written to Port 3 pins they are pulled high by

the internal pullups and can be used as inputs. As inputs, Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups. Port 3 also serves the functions of

various special features of the AT89C52 as listed below:


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Alternate functions of port 3

PORT PIN ALTERNATE FUNCTIONS

P3.0 RXD (serial input port)

P3.1 TXD(serial output port)

P3.2 INT0(low external interrupt 0)

P3.3 INT1(low external interrupt 1)

P3.4 T0(timer 0 external input)

P3.5 T1(timer 1 external input)

P3.6 WR(low external data memory write

strobe)

P3.7 RD(low external data memory read strobe)

Table: 3.3.3.2

RST:

RST means RESET; 89C52 uses an active high reset pin. It must go high for two

machine cycles. The simple RC circuit used here will supply voltage (Vcc) to reset pin until

capacitance begins to charge. At a threshold of about 2.5V, reset input reaches a low level

and system begin to run.

Fig: 3.3.3.3: Reset Connection


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ALE/PROG:

Address Latch Enable output pulse for latching the low byte of the address during

accesses to external memory. This pin is also the program pulse input (PROG) during Flash

programming. In normal operation ALE is emitted at a constant rate of 1/6 the oscillator

frequency, and may be used for external timing or clocking purposes. Note, however, that one

ALE pulse is skipped during each access to external Data Memory. If desired, ALE operation

can be disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is active only

during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled high. Setting the

ALE-disable bit has no effect if the microcontroller is in external execution mode.

PSEN:

Program Store Enable is the read strobe to external program memory. When the

AT89C52 is executing code from external program memory, PSEN is activated twice each

machine cycle, except that two PSEN activations are skipped during each access to external

data memory.

EA/VPP:

External Access Enable. EA must be strapped to GND in order to enable the device to

fetch code from external program memory locations starting at OOOOH up to FFFFH. Note,

however, that if lock bit 1 is programmed, EA will be internally latched on reset. EA should

be strapped to Vcc for internal program executions. This pin also receives the 12-volt

programming enable voltage (Vpp) during Flash programming, for parts that require 12-volt

Vpp.

XTAL1: Input to the inverting oscillator amplifier and input to the internal clock operating

circuit

XTAL2: Output from the inverting oscillator amplifier.

T2: External count input to Timer/Counter 2, Clock out.


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T2EX: Counter 2 capture/reload trigger & direction control.

3.3.4: THE ON-CHIP OSCILLATORS

Pins XTAL1 and XTAL2 are provided for connecting a resonant network to form an

oscillator. The crystal frequency is basic internal clock frequency. The maximum and

minimum frequencies are specified from 1to 24MHZ.

Program instructions may require one, two or four machine cycles to be executed

depending on type of instructions. To calculate the time any particular instructions will take

to be executed, the number of cycles ‘C’,

T = C*12d / Crystal frequency

Here, we chose frequency as 11.0592MHZ. This is because,

baud= 2*clock frequency/(32d. 12d[256d-TH1]).The oscillator is chosen to help generate

both standard and nonstandard baud rates. If standard baud rates are desired, an 11.0592MHZ

crystal should be selected. From our desired standard rate, TH1 can be calculated. The

internally implemented value of capacitance is 33 pf.

Fig 3.3.4: On-Chip Oscillators

Program Memory Lock Bits:

On the chip there are three lock bits which can be left unprogrammed (U) or can be

programmed (P) to obtain the additional features .When lock bit 1 is programmed, the logic


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level at the EA pin is sampled and latched during reset. If the device is powered up without a

reset, the latch initializes to a random value, and holds that value until reset is activated. It is

necessary that the latched value of EA be in agreement with the current logic level at that pin

in order for the device to function properly.

Program Counter and Data Pointer:

The 89C52 contains two 16-bit registers: the program counter (PC) and the data

pointer (DPTR), Each is used to hold the address of a byte in memory. The PC is the only

register that does not have an internal address. The DPTR is under the control of program

instructions and can be specified by its 16-bit name, DPTR, or by each individual byte name,

DPH and DPL. DPTR does not have a single internal address, DPH and DPL are each

assigned an address.

A & B Registers:

The 89C52 contains 34 general-purpose, working, registers. Two of these, registers A

and B, hold results of many instructions, particularly math and logical operations, of the

89C52 CPU. The other 32 are arranged as part of internal RAM in four banks, B0-B3, of

eight registers. The A register is also used for all data transfers between the 89C52 and any

external memory. The B register is used for with the A register for multiplication and division

operations.

Flags and the Program Status Word (PSW):

Flags may be conveniently addressed, they are grouped inside the program status

word (PSW) and the power control (PCON) registers.

The 89C52 has four math flags that respond automatically to the outcomes of math

operations and three general-purpose user flags that can be set to 1 or cleared to 0 by the

programmer as desired. The math flags include Carry (C), Auxiliary Carry (AC), Overflow

(OV), and Parity (P). User flags are named F0,GF0 and GF1, they are general-purpose flags

that may be used by the programmer to record some event in the program.

3.3.5: MEMORY ORGANISATION


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Internal Memory:

The 89C52 has internal RAM and ROM memory for the functions. Additional

memory can be added externally using suitable circuits. This has a Hardware architecture,

which uses the same address, in different memories, for code and data.

Internal RAM:

The 256-byte internal RAM. The upper 128 bytes occupy a parallel address space to

the Special Function Registers. Instructions that use indirect addressing access the upper 128

bytes of RAM. Stack operations are examples of indirect addressing.

Internal Data Memory addresses are always one byte wide, which implies an address

space of only 256 bytes. However, the addressing modes for internal RAM can in fact

accommodate 384 bytes, using a simple trick. Direct addresses higher than 7FH access one

memory space, and indirect addresses higher than 7FH access a different memory space.

Thus Figure shows the Upper 128 and SFR space occupying the same block of addresses,

80H through FFH, although they are physically separate entities.

FFH

EDH

BOH

AOH

Figure:3.3.5.1:internal RAM memory

ACC

PORT 3

PORT2

PORT1

PORT0


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The Lower 128 bytes of RAM are present in all 89C52 devices as mapped in Figure.

The lowest 32 bytes are grouped into 4 banks of 8 registers. Program instructions call out

these registers as R0 through R7.

Two bits in the Program Status Word (PSW) select which register bank is in use. This

allows more efficient use of code space, since register instructions are shorter than

instructions that use direct addressing. The next 16 bytes above the register banks form a

block of bit addressable memory space. The 89C52 instruction set includes a wide selection

of single-bit instructions, and the 128 bits in this area can be directly addressed by these

instructions. The bit addresses in this area are 00H through 7FH. All of the bytes in the

Lower 128 can be accessed by either direct or indirect addressing.

The Upper 128 can only be accessed by indirect addressing. SFRs include the Port

latches, timers, peripheral controls, etc. These registers can only be accessed by direct

addressing. Sixteen addresses in SFR space are both byte- and bit-addressable. The bit-

addressable SFRs are those whose address ends in OH or 80H.

Figure:3.3.5.2 UPPER 128 BYTES OF INTERNAL RAM

No bit –addressable

space

Su00465

Su00465 Su00465

FFH

80H


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The Stack and Stack Pointer:

The stack refers to an area of internal RAM that is used in conjunction with certain

opcodes to store and retrieve data quickly. The 8-bit stack pointer register is used by the

89C52 to hold an internal RAM address that is called the top of the stack. The address held in

the SP register is the location in internal RAM where the last byte of data was stored by a

stack operation. When data is to be placed on the stack, the SP increments before storing data

on the stack so that the stack grows up as data is stored. As data is retrieved from the stack,

the byte is read from the stack, then the SP decrements to point to the next available byte of

stored data.

3.3.6: SPECIAL FUNCTION REGISTERS

The 89C52 operations that do not use the internal 128-byte RAM addresses from 00h

to 7Fh are done by a group of specific internal registers, each called a Special Function

register, which may be addressed much like internal RAM, using addresses from 80h to FFh.

PC is not part of the SFR and has no internal RAM address

T2CON Address=0C8H

Bit addressable Reset value=0000 000B

Bit

Table: 3.3.6.1

T2MOD Address=0C9H

Not bit addressable Reset value=XXXX XX00B

Bit

Table: 3.3.6.2

TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2(LOW) CP/RL2(LOW)

7 6 5 4 3 2 1 0

- - - - - - T20E DCEN

7 6 5 4 3 2 1 0


30

Name Function

A

B

DPH

DPL

IE

IP

P0

P1

P2

P3

PCON

PSW

SCON

SBUF

SP

TMOD

TCON

TL0

TH0

TL1

TH1

Accumulator

Arithmetic

Addressing external memory

Addressing external memory

Interrupt enable control

Interrupt priority

Input/output port latch




Power control

Program status word

Serial port control

Serial port data buffer

Stack pointer

Timer/counter mode control

Timer/counter control

Timer 0 low byte

Timer 0 high byte

Timer 1 low byte

Timer 1 highbyte

Figure:3.3.6.3 Special function registers

3.4 SMOKE SENSOR:

This alarm device that automatically detects the presence of smoke. It is also called

as smoke alarm.

3.4.1Features

Wide detecting scope

Fast response and High sensitivity

Stable and long life

Simple drive circuit


31

Fig: 3.4.1.1 Smoke Sensor

3.4.2 Photoelectric Smoke Detector Operation

Smoke produced by a fire affects the intensity of a light beam passing through air. The smoke

can block or obscure the beam. It can also cause the light to scatter due to reflectionfrom the

smoke particles. Photoelectric smoke detectors are designed to sense smoke by utilizing these

effects of smoke on light.

3.5 POWER SUPPLY

The supply given is the +5V D.C. The input a.c. supply is stepped down from 230V to

9-0-9V. The rectifier consists of diodes D1 and D2 makes the supply D.C. that is,

unidirectional waveform. The output from rectifier is a URDC, whose value is 12.726V peak

to peak. The voltage regulator makes this URDC to RDC of +5V. The capacitor C1 is used to

maintain constant voltage between two consecutive positive cycles where as C2 is used to

remove the fluctuations caused by regulator.


32

Figure 3.5. Block Diagram Of R.P.S

A regulated power supply maintains the output voltage constant irrespective of A.C.

mains fluctuations or load variations. The output voltage remains constant whether the load

current changes or there are fluctuations in the input A.C voltage.

The rectifier converts the transformer secondary A.C voltage into pulsating voltage. The

pulsating D.C. voltage is applied to the capacitor filter. This filter reduces the pulsationsin the

rectifier D.C. output voltage. Finally, it reduces the variations in the filtered output voltage.

3.5.1 Circuit diagram of R.P.S

Fig:3.5.1 Circuit diagram of power supply

1. There are considerable variations in A.C line voltage caused by outside factors

beyond our control. This changes the D.C. output voltage. Most of the electronic


33

circuits will refuse to work satisfactorily on such output voltage fluctuations. This

necessities to use regulated D.C. power supply.

2. The internal resistance of ordinary power supply in relatively large. Therefore, output

voltage is markedly affected by the amount of load current drawn from the supply.

3. These variations in D.C. voltage may cause erratic operation of electronic circuits.

4. Therefore, regulated D.C. power supply is the only solution in such situations.

3.6 BUZZER

A buzzer or beeper is a signaling device, usually electronic, typically used in

automobiles, household appliances such as a microwave oven, or game shows. It most

commonly consists of a number of switches or sensors connected to a control unit that

determines if and which button was pushed or a preset time has lapsed, and

usuallyIlluminates a light on the appropriate button or control panel, and sounds a warningin

the form of a continuous or intermittent buzzing or beeping sound. Initially this device was

based on an electromechanical system which was identical to an electric bell without the

metal gong (which makes the ringing noise). Often these units were anchored to a wall or

ceiling and used the ceiling or wall as a sounding board. Another implementation with some

AC-connected devices was to implement a circuit to make the AC current into a noise loud

enough to drive a loudspeaker and hook this circuit up to a cheap 8-ohm speaker. Now-a-

days, it is more popular to use a ceramic-based piezo-electric sounder like a Sonalert which

makes a high-pitched tone. Usually these were hooked up to driver” circuits which varied the

pitch of the sound or pulsed the sound on and off.

3.6.1 Buzzer Driver:

FIG: 3.6 .1CIRCUIT DIAGRAM

The circuit is designed to control the buzzer. The buzzer ON and OFF is controlled by the

pair of switching transistors (BC 547). The buzzer is connected in the Q2 transistor collector

VCC

Q?BC547

D?4007

+

12 V

-

Buz

µC PORT


34

terminal. When high pulse signal is given to base of the Q1 transistors, the transistor is

conducting and close the collector and emitter terminal so zero signals is given to base of the

Q2 transistor. Hence Q2 transistor and buzzer is turned OFF state.

When low pulse is given to base of transistor Q1, the transistor is turned OFF. Now 12V is

given to base of Q2 transistor so the transistor is conducting and buzzer is energized and

produces the sound signal.

Figure 3.6.2 Buzzer

3.7 MAX 232C

The TTL signals output by a USART are not suitable for transmission over long distances,

so these signals are converted to some other form to be transmitted. With a jumper between

the points numbered 7 and 8, a high on the TxD output of the 8251A produces a high on the

base of the transistor, which turns it off. With points numbered 9 and 10 jumped, the CR TX

line will then be pulled to -12V, which is a legal high or marking condition for RS-232C. A

low on the TxD output of the 8251A will turn on the transistor and pull the CR TX line to

+5V, which is legal low or space condition for RS- 232C.


35

TI IN 11 14 T1 OUT

T2 IN 10 7 T2 OUT

R1 OUT 12 13 R1 IN

R2 OUT 9 8 R2 IN

Figure: 3.7.1 Logic Diagram of MAX232

3.8 GSM MODEM

GSM (Global System for Mobile communications) is the technology that underpins

most of the world's mobile phone networks. The GSM platform is a hugely successful

wireless technology and an unprecedented story of global achievement and cooperation.

GSM has become the world's fastest growing communications technology of all time and the

leading global mobile standard, spanning 218 countries. GSM is an open, digital cellular

technology used for transmitting mobile voice and data services. GSM operates in the

900MHz and 1.8GHz bands GSM supports data transfer speeds of up to 9.6 kbps, allowing

the transmission of basic data services such as SMS.


36

Fig:3.8.1 GSM Module

3.8.1GSM SIM300/900

GSM/GPRS RS232 Modem is built with SIMCOM Make SIM900 Quad-band

GSM/GPRS engine, works on frequencies 850 MHz, 900 MHz, 1800MHz and 1900 MHz .It

is very compact in size and easy to use as plug in GSM Modem. The Modem is designed with

RS232 Level converter circuitry, which allows you to directly interface PC Serial port .

3.8.2 Features:

• High Quality Product (Not hobby grade)

• Quad-Band GSM/GPRS

• 850/ 900/ 1800/ 1900 MHz

• Built in RS232 Level Converter (MAX3232)

• Configurable baud rate

• SMA connector with GSM L Type Antenna.

• Built in SIM Card holder.

• Built in Network Status LED

• Inbuilt Powerful TCP/IP protocol stack for internet data transfer over GPRS

• Audio interface Connector

• Most Status & Controlling Pins are available at Connector

• Normal operation temperature: -20 °C to +55 °C

• Input Voltage: 5V-12V DC


37

3.8.3 Specifications:

• Quad-Band 850/ 900/ 1800/ 1900 MHz

• GPRS multi-slot class 10/8

• GPRS mobile station class B

• Compliant to GSM phase 2/2+

Class 4 (2 W @850/ 900 MHz)

Class 1 (1 W @ 1800/1900MHz)

• Dimensions: 24*24*3mm

• Weight: 3.4g

• Control via AT commands (GSM 07.07,07.05 and SIMCOM enhanced AT Commands)

• Low power consumption: 1.0mA(sleep mode)

• Operation temperature: -40°C to +85 °C\

3.8.4Special firmware

• MMS

• Java (cooperate with isolation)

• Embedded AT

Figure 3.8.4.1 SIM900


38

3.9 LIQUID CRYSTAL DISPLAY

To understand the operation of an LCD, it is easiest to trace the path of a light

ray from the backlight to the user. The light source is usually located directly behind the

LCD, and can use either LED or conventional fluorescent technology. From this source, the

light ray will pass through a light polarizer to uniformly polarize the light so it can be acted

upon by the liquid crystal (LC) matrix. The light beam will then pass through the LC matrix,

which will determine whether this pixel should be “on” or “off”. If the pixel is “on”, the

liquid crystal cell is electrically activated, and the molecules in the liquid will align in a

single direction. This will allow the light to pass through unchanged. If the pixel is “off”, the

electric field is removed from the liquid, and the molecules with in scatter. This dramatically

reduces the light that will pass through the display at that pixel.

INTERFACING LCD TO THE MICROCONTROLLER:

This is the first interfacing example for the parallel port. We will star with

something simple. This example does not use the Bi-directional feature found on newer ports,

thus it should work with most, ifnot all Parallel Ports. It however does not show the use of the

status port as an input. So what are we interfacing? A 16 Character X 2 Line LCD Module to

the Parallel Port. These LCD Modules are very common these days, and are quite simple to

work with, as all the logic required running them is on board.

3.9.1 Features:

Interface with either 4-bit or 8-bit microprocessor.

Display data RAM

Character generator ROM

-matrix character patterns.

Character generator RAM

-matrix patterns.

Display data RAM and character generator RAM may be

Accessed by the microprocessor.


39

Numerous instructions

Clear Display, Cursor Home, Display ON/OFF, Cursor

ON/OFF, Blink Character, Cursor Shift, Display Shift.

Built-in reset circuit is triggered at power ON.

Figure3.9.2A general purpose alphanumeric LCD with two lines of 16 characters.

Pin diagram:

Figure: 3.9.3 pin diagram

Pin symbol Function

1 Vss Power Supply (Gnd)

2 Vdd Power Supply (+5v)


40

3 V0 Contrast Adjust

4 Rs Instruction /Data Register

Select

5 R/W Data Bus Line

6 E Enable Signal

7-14 Db0-Db7 Data Bus Line

15 A Power Supply For Led B/L

(+)

16 K Power Supply For Led B/L(-)

Figure:3.9.4 pin description


41

CHAPTER-4

4.FLOWCHART AND SOFTWARES

Serial port initialization

LCD Initialization

PIR Sensor SMOKE sensor

IF motion detected

If smoke Detected

Initialize GSM

Default Message transfers to GSM

GSM transfer Voice message to owner

Buzzer activated

stop

Buzzer on

start


42

4.1Soft wares Used:

1. Assembly language for 8052

2. 8052 Cross compiler

3. Universal Programmer soft ware

4. ORCAD for PCB designing and layout.

Universal Programmer soft ware


43

4.2Programming language for 8052

Programming languages share properties with natural languages related to their purpose as

vehicles for communication, having a syntactic form separate from its semantics, and

showing languages families of related languages branching one form another. But as artificial

constructs they also differ in fundamental ways from languages that have evolved through

usage.

A significant difference is that programming language can be fully described and studied in

its entirety, since it has a precise and finite definition. By contrast, natural languages have

changing meanings given by their users in different communities.

While constructed languages are also artificial languages designed from the ground up with a

specific purpose, they lack the precise and complete semantic definition that a programming

language has.

Many programming languages have been designed from scratch, altered to meet new needs

and combined with other languages. Many have eventually fallen into disuse. Although there


44

have been attempts to design one “universal” programming language that servers all

purposes all of them have failed to be generally accepted as filling this role. The need for

reverse programming languages arises from the diversity of contest in which language are

used.

Programs range from tiny scripts written by individual hobbyists to huge systems written by

hundreds of programmers.

Programmers ranging expertise from novices who need simplicity above all else, to experts

who may be comfortable with considerable complexity.

Programs must balance speed, size, and simplicity on systems ranging from microcontroller

to super computers.

Programs may be written once and not change for generations, or they may undergo continual

modification.

Programmers may simply differ in their tastes: they may be accustomed to discussing

problems and expressing them in a particular language

One common trend in the development of programming languages has been to add more

ability to solve problems using a higher level abstraction. The abstraction. The earliest

programming languages were tied very closely to the underlying hardware of the computer.

As new programming languages have developed, features have been added that let

programmers express ideas that are more remote from simple translation into underlying

hardware instructions. Because programmers are less tied to the complexity of the computer,

their programmers can do more computing with less effort from the programmer. This lets

them write more functionality per time unit.

4.3 8052 Cross compiler

A cross compiler is a compiler capable of creating executable code for a platform other than

the one on which the compiler is running. For example, a compiler that runs on a Windows 7

PC but generates code that runs on Android smartphone is a cross compiler.


45

A cross compiler is necessary to compile for multiple platforms from one machine. A

platform could be infeasible for a compiler to run on, such as for the microcontroller of an

embedded system because those systems contain no operating system. In par virtualization

one machine runs many operating systems, and a cross compiler could generate an executable

for each of them from one main source.

Cross compilers are not to be confused with source to source compilers. A cross compiler is

for cross platform software development of binary code, while a source to source "compiler"

just translates from one programming language to another in text code. Both are programming

tools.

4.4 ORCAD for PCB designing and layout

Steps to PCB design using Orcad.

1. Design circuit using schematic entry package (Capture).

2. Generate net list for PCB package.

3. Import net list into PCB package (Layout Plus).

4. Place components, route signals.

5. Generate machining (Gerber) files for PCB plant.

This document is a 'quick start', describing some of the most commonly used operations for

PCB design using Orcad. For more details see on-line help and also the pdf manuals which

are usually in Program Files\Orcad\Document. These pdf files seem generally much more

comprehensive than the on-line help.

Schematic Design

• Use Capture to enter your design. Multiple schematic pages for same design can be used.

• Tip: label nets you may want to locate at the PCB stage – net names are carried through to

the PCB design process.

• Select project in project window (as opposed to schematic window), select

Design Rule Check for Tools menu. Correct any errors in design.

• Select project in project window, select Create Net list from Tools menu.

Choose Layout tab (to generate Layout compatible net list), generate net list.

Choose units (English or metric) compatible with what you will use in your


46

PCB design.

PCB Layout

• Run Layout Plus. Choose File/New.

• Select a “technology file” appropriate for your design. These are in Program

Files\Orcad\Layout Plus\data and set defaults for things like track spacing, hole sizes etc.

Some examples:

1BET_ANY.TCH – allows single track between pins on standard DIP;

2BET_SMT.TCH – for surface mount and mixed smt/through hole designs, 2 tracks

between pins of standard DIP;

3BET_THR.TCH – through hole boards, up to 3 tracks between pins.

You're best using 1bet_any.tch if at all possible, since this is the least demanding pcb

technology.

• Choose your net list file (.mnl extension). If the units (English/metric) are not the same you

won't be able to load it. Just go back to Capture and generate the net list again with the right

units.

• If some of your components chosen from the Orcad Capture libraries did not

School of Engineering Orcad PCB Quick Start have PCB footprints associated with them you

will get “Cannot find footprint for...” messages. If this happens, choose “link existing

footprint to component”. Browse footprint libraries to find the required footprint

(Preview of footprint shown on screen). You can often guess footprints from names.

Examples:

TM = through hole mounted (as opposed to surface mount)

BCON100T = block connector, 0.1” pitch, through hole

BLKCON.100/VH/TM1SQ/W.100/3 = block connector, 0.1” pitch, vertical (as opposed to

right angle), through hole, pin 1 square pad, width 0.1”, 3 pins.

Library DIP100T = dual in line packages, through hole, 0.1” between pins.

If you can't find the right footprint then you'll need to make your own. See

“Creating a new Footprint” at the end of this document.

Draw Board Outline

• Click obstacle toolbar button.


47

• Somewhere in design, right click, select new.

• Right click again, select properties.

• Select: board outline, width = 50 (or as required), layer = global layer, OK.

• Left click to place one corner of board, then right click on successive corners. Draw a board

the required size. Right click, select finish when done

(Only need to do 3 corners, finish will complete the outline). Notice that the dimensions are

shown on status bar at bottom of screen as you draw the board – can be helpful for creating

particular board size. (You can do all this later, after you've placed and routed everything if

you prefer.)

Choose Layers

• Use spreadsheet toolbar button to see the Layers spreadsheet.

• Enable only the layers you want for routing, set other layers to unused

(Double click on the spreadsheet entry, select unused routing). For a single sided board you

probably want only the “bottom” layer, for double sided you

Probably want “top” and “bottom”, for a 4 layer board you probably want these plus power

and ground plane layers. Tip: you can select multiple layers using click with ctrl key, then

right click, select properties, then set/clear unused routing to simultaneously enable or disable

several layers.

Place Components

• Select “component” tool from toolbar, click on required component and drag it where you

want. Right click to see some options, including rotate.

• Auto/place board will attempt to place components automatically for you within board

outline. You may want to move components manually as well.

School of Engineering Orcad PCB Quick Start

Track Thickness


48

• To change, select “nets” spreadsheet, double click on required net to set its properties. Net

names are inherited from your schematic diagram – explicitly naming nets helps you identify

them in the PCB design. For a simple through hole board you probably want about 20mil

tracks. For surface mount boards you probably want 10 or 12 mil tracks. Our PCB plant will

make 5 mil tracks if you really need them, but there's an increased risk of part of the track

being lost in the etching process. 10 or 12 mil can be reliably made. You may want to make

power and ground tracks thicker.

Routing

• Automatic routing is ok, but you can manually route as well (use toolbar buttons).

• Make sure you've set the track thicknesses as you want before routing (see above).

• You may want to route power and ground first, especially if it's a 1 or 2 layer board. Use the

nets spreadsheet to enable/disable those nets you want to route at any one time. Tip: select

Routing Enabled column, right click, disable to disable all nets, then enable the ones you

want.

• You may want to give priority to critical nets (those that need shortest paths), to optimally

route those. Priority can be selected from the “nets” spreadsheet for each net.

• To automatically route, select Tools, auto, route board. To put everything back to the rat's

nest net, tools/auto/unroute board.

• You can auto route just one component by selecting auto route/component then click on a

pin on that component.

• After an auto route/board is completed, orcad thinks it's finished, and if you run it again

(e.g. to route some more signals that were disabled the first time) it says all sweeps done or

disabled and won't run again. To run auto route again you have to remove "done" from all

auto route passes. Click the spreadsheet toolbar button and select strategy/route pass. Select

the whole "enable" column, right click, and select properties. Remove the "done" tick and

click OK. Close the spreadsheet and you can now run the auto router again.


49

Copper Pour

• Copper pour fills selected unused board area with copper. This allows creation of large

ground (and/or power) areas which improves noise properties. Also reduces amount of

copper that needs to be etched off the board by manufacturing process.

• Tip: don't do this until you've finished placement and routing.

• Select required layer (e.g. TOP or BOTTOM).

• Select obstacle tool (toolbar button), right click in design, select new.

School of Engineering Orcad PCB Quick Start

• Right click again, select properties

• Select copper pour, net = GND (or as required), OK. (This example would connect copper

pour to the GND net.)

• Draw (by left click and drag) the outline for the copper fill.

• Repeat as required for other copper pour areas and/or layers.

• If you want to delete it, select it by using obstacle tool then ctrl left click on the pour. Then

press the delete key.

Set Datum (origin)

• From Tool menu select dimension/move datum.

• Left click at the bottom LH corner of your board to set the origin. (Exact placing doesn't

matter.)

Generate Machining Files (Gerber files)

• The machining files required to manufacture the PCB are generated by the “post processor”.

From options menu choose “Post Processing”. In the Spreadsheet, select the layers you need

to manufacture. You need at least the routing layers you have used (eg top, bottom) and the

drill information.

• Choose Auto/Post Process to generate the files. The files generated by the post processor

are the only ones needed for the PCB plant to make the board.

Tips


50

Use the color toolbar button, click on a colour box and press the – key to toggle its visibility.

With copper pour in place it can be hard to see what you've got.

Silk Screen - to see it, you need to add it to the colours table. Use Colours tool, right click,

new. Select layer SST (silk screen top), rule = default, OK.

Use manual place (auto place doesn't optimize placement for noise considerations).

When placing, set critical nets (e.g. op amp inputs) to a distinctive colour (via nets

spreadsheet) so you can easily see them to optimize placement. Place connectors first – they

need to be in a convenient place (e.g. near the edge).

Some components have multiple parts within one package. Place an additional part in the

schematic, choosing, for example, the B part. The “annotate design” tool will combine them

into one package (same component identifier). Don't forget to connect unused inputs to

appropriate places (e.g. power, ground) in the schematic, particularly for digital circuits.

You can go back and change your schematic. Then, when you generate the net list again, be

sure to select the box “Run ECO to Layout” (Engineering

Change Order). The PCB will be appropriately changed (you may need to then tidy things

up).

To select an obstacle (e.g. board outline or copper pour) select the obstacle tool

(Toolbar button). Hold ctrl key down and left click on obstacle to select it

(Becomes highlighted – usually white). Or, click on corner of obstacle and drag as required.

Or, select obstacle by drawing a box (with obstacle tool selected) which includes some part of

the object.

Make sure you do a save fairly often. You can save to a different file name if you want, then

you have a partial PCB design you can go back to if you change your mind how to do things.

Do a save before trying anything daring. Then if it doesn't work out you can just exit without

saving and start again with your previously saved design. Beware: the "undo" option is only

occasionally helpful.

The on-line manuals are ok, but more detailed information is in the pdf files contained in the

Orcad Family folder (eg information on technology files, strategy files and many more

complex operations than those mentioned here).

Creating a New Footprint

An easy way to create a new footprint is to find an existing one that's similar, edit it and save

it with a new name.


51

• Start Layout+ and choose tools/library manager.

• The list of libraries is displayed in the top part of the window. Click on one you think may

be useful.

• The list of footprints in that library is now shown in the bottom window. If you click on a

footprint it is displayed in the window on the right.

• Browse to a footprint that's close to what you want. (eg Right number of pins but wrong

width, or vice versa.)

• To move a pin, choose pin tool, click on pin, and move cursor to where you want it. (You

can also use the arrow keys.) The coordinates and distance moved are shown in the status bar

at the bottom.

• Another, possibly easier way to move a pin to the right place is to edit its properties in the

footprints spreadsheet. You can just type in the required

x,y coordinate of the pin here. You can also take a copy of a pin (ctrl C) if you need to add

pins.

• To move text use the text tool, click on the text and drag it to where you want.

• To change the place outline and detail, select them using the obstacle tool and either delete

(delete key) or drag to where you want. If you delete and redraw, make sure it's the right

obstacle type (right click, properties). The place outline shows the board space taken – other

footprints can't be placed within this outline.

• When you want to save, do a “save as” (don't overwrite the original library

School of Engineering Orcad PCB Quick Start object). Then you have the option to create a

new library. I'd recommend this – make a library in your own design folder and keep this

with the rest of your design files.

Software Dumping Procedure

1. The assembly language Instructions typed in dos editor or notepad with an

extension of .ASM.

2. Compile the above .asm file with 8052 cross assembler.

3. The assembler converts the .ASM file into .HEX file (Contains all op codes).

4. Copy the converted Hex file into internal flash Rom of Micro Controller with the

help of Universal Programmer or Micro Controller Programmer.


52

CHAPTER-5

RESULTS

1.When power supply is given, the kit will be on and the LED will be displayed as above


53

2.After 5 seconds, LED will display as above indicating that, it is ready for the signal of

sensor.

3.PIR sensor has detected the presence of the object

5.First we will be intimated with a message, then LED will display like this.


54

6.We will get a message first.

7.After message sending, LED will show this message, which indicates getting phone call.


55

8.Like this we will get a call

9. Smoke detection is done and again a message is sent to the predefined numbers after

buzzer sound.


56

CHAPTER 6

FUTURE WORK AND CONCLUSION

In this security system PIR sensor has been used which is low power, and low cost, pretty

rugged, have a wide lens range, and are easy to interface with. This security system can be

implemented in places like home, office, shop etc. The sensitivity range for detecting motion

of the system is about 3 to 4 feet. It can be raised up to 20 feet through careful use of

concentrating optical lenses as future development. In addition to this, this system can be

equipped with glass break detectors to enhance the level of protection. Use of multi-sensor

data fusion and complex algorithm can be used to increase the effective FOV for larger

spaces. In order to enhance the location accuracy and to enhance the method of processing

the PIR sensor signal, use of more advanced techniques such as probabilistic theories and soft

computing is left open for the future.


57

REFERENCES

[I] Z. Zhi - hui, L. Hui, L. Yin, C. Jia - jia, "Design of the intelligent firep

roof and theft - proof alann system for home", JOURNAL OF HENAN

POLYTECHNIC UNIVERSITY, vol. 28,no. I, pp. 207-210, Feb. 2009.

[2] Q. Qu, Z. Guohao, W. Baohua, "Design of Home Safeguard System

Based on GSM Technique", Electronic Engineer, vol. 32, no. I I, pp. 76-

78, Nov. 2006.

[3] M. Shankar, 1. Burchett, Q. Hao, B. Guenther, "Human-tracking systems

using pyroelectric infrared detectors", Optical Engineering, vol. 10, no.

45, pp. 106401 (01-10), Oct. 2006.

[4] M. Moghavvemi and C.S. Lu, "Pyroelectric infrared sensor for intruder

detection," in Proc. TENCON 2004 Conf., pp. 656-659.

[5] Renewable Energy UK. (2010, Aug.). Find out how to integrate PIR

(passiveinfra red) sensors into renewable energy applications. [Online].

Available: http://www.reuk.co.uklPIR-Sensors.htm


58

ANNEXURE

;THIS IS ELECTRONIC SECURITY SYSTEM

;WITH FEED BACK.+ VOICE+SMS+DTMF

;P2.0 =BUZZER

;P2.1 =

;P2.3 =

;P2.4 =

;P1.0=DTMF0

;P1.1=DTMF1

;P1.2=DTMF2

;P1.3=DTMF3

;P1.4=DTMF4

;P0 = DISP DATA

;P2.7 = RS

;P2.6 = R/W

;P2.5 = EN

TXD MACRO

JNB TI,$

CLR TI

MOV SBUF,R6


59

MACEND

ORG 0

LJMP START

ORG 0050H

;--------------------

START: MOV P2,#00H

MOV P1,#FFH

LCALL SPINI

LCALL LCDINI

LCALL DEL

XX2:

MOV DPTR,#0900H

LCALL TLINE

MOV DPTR,#0910H

LCALL BLINE

LCALL SSEC

SETB P1.2

SETB P1.3


60

SETB P2.4

CLR P2.0

SETB P2.1

SETB P2.2

MOV DPTR,#0920H

LCALL TLINE

MOV DPTR,#0930H

LCALL BLINE

XX1: JB P1.0,YY1

LCALL DEL

JB P1.0,XX1

MOV 19H,#01H

LJMP CCVV

YY1: JNB P1.1,XX1

LCALL DEL

JNB P1.1,YY1

MOV 19H,#02H

LJMP CCVV


61

CCVV: MOV DPTR,#0940H

LCALL TLINE

MOV DPTR,#0950H

LCALL BLINE

SETB P2.0

CLR P2.1

LCALL SEC3

LCALL SEC3

LCALL SEC3

JNB P2.4,START

LJMP SMSX

RETSMTX:

;*****************************

DIAL1:

MOV DPTR,#09A0H

LCALL TLINE

MOV DPTR,#09B0H

LCALL BLINE


62

MOV DPTR,#AT_D ;DIAL MODE

MOV R2,#0EH

LCALL CMD1

LCALL ENTER

LCALL VSEL

LCALL SSEC

LCALL SSEC

LCALL SSEC

LCALL SSEC

LCALL SSEC

MOV DPTR,#AT_H ;DIAL MODE

MOV R2,#03H

LCALL CMD1

LCALL ENTER

LCALL SSEC

LCALL SEC

SETB P2.0

LCALL SEC

CLR P2.0


63

;-----------------

DIAL2: MOV DPTR,#AT_D2 ;DIAL MODE

MOV R2,#0EH

LCALL CMD1

LCALL ENTER

LCALL VSEL

LCALL SSEC

LCALL SSEC

LCALL SSEC

LCALL SSEC

LCALL SSEC


MOV R2,#03H

LCALL CMD1

LCALL ENTER

LCALL SSEC

LCALL SEC

SETB P2.0

LCALL SEC

CLR P2.0

;--------------

DIAL3: MOV DPTR,#AT_D3 ;DIAL MODE


64

MOV R2,#0EH

LCALL CMD1

LCALL ENTER

LCALL VSEL

LCALL SSEC

LCALL SSEC

LCALL SSEC

LCALL SSEC

LCALL SSEC


MOV R2,#03H

LCALL CMD1

LCALL ENTER

LCALL SSEC

LCALL SEC

SETB P2.0

LCALL SEC

CLR P2.0

LJMP START

VSEL: MOV A,19H

CJNE A,#01H,VOI2


65

CLR P1.2

LCALL SEC

;SETB P1.2

RET

VOI2: CJNE A,#02H,VOI3

CLR P1.3

LCALL SEC

;SETB P1.3

VOI3: RET

;*********** SMS TXD ********

SMSX: MOV DPTR,#0960H

LCALL TLINE

MOV DPTR,#0970H

LCALL BLINE

;-------------------

MOV 3EH,#03H

;------------------------

SMSXX: MOV DPTR,#AT_CMGF ;SMS MODE PDU=0/TEXT=1

MOV R2,#09H

LCALL CMD1

LCALL ENTER


66

LCALL SEC

MOV DPTR,#AT_ERS ;ERASE OF 1 ST LOCATION

MOV R2,#09H

LCALL CMD1

LCALL ENTER

LCALL SEC

LCALL SEC

MOV DPTR,#AT_CPMS ;SIMM MEMORY SELECTION

MOV R2,#0CH

LCALL CMD1

LCALL ENTER

LCALL SEC ;BETTER TO PUT ERASE

;---------3 NUMBERS -----------

MOV A,3EH

CJNE A,#03H,NP2

MOV DPTR,#AT_CMGW

LJMP NP4


67

NP2: CJNE A,#02H,NP3

MOV DPTR,#AT_CMGW2

LJMP NP4

NP3: CJNE A,#01H,NP4

MOV DPTR,#AT_CMGW3 ;WRITE MES.IN SIMM MEMORY

LOCATION

NP4: MOV R2,#14H

LCALL CMD1

LCALL ENTER

;-----------------------------------

LCALL SEC3

; MOV DPTR,#AT_CMD ;WRITE MES.IN SIMM MEMORY

LOCATION

; MOV R2,#0BH

; LCALL CMD1

LCALL CMDRAM

LCALL SEC3

MOV DPTR,#AT_CMSS ;SEND COMMAND TO MODEM

MOV R2,#09H

LCALL CMD1


68

LCALL ENTER

SETB P2.0

LCALL SEC

CLR P2.0

LCALL SEC3

DEC 3EH

MOV A,3EH

CJNE A,#00H,SMSXX

;LJMP XX1

LJMP RETSMTX

;*******************************************

SMSRX: SETB P2.0

MOV DPTR,#0980H

LCALL TLINE

MOV DPTR,#0990H

LCALL BLINE

LCALL SEC3

MOV DPTR,#AT_ERS ;ERASE OF 1 ST LOCATION

MOV R2,#09H


69

LCALL CMD1

LCALL ENTER

MOV DPTR,#AT_ERS2 ;ERASE OF 2 ST LOCATION

MOV R2,#09H

LCALL CMD1

LCALL ENTER


MOV R2,#09H

LCALL CMD1

LCALL ENTER


MOV R2,#09H

LCALL CMD1

LCALL ENTER


MOV R2,#09H

LCALL CMD1

LCALL ENTER

;---------------------


70

MOV DPTR,#AT_CMGF ;SMS MODE PDU=0/TEXT=1

MOV R2,#09H

LCALL CMD1

LCALL ENTER

LCALL SEC

MOV DPTR,#AT_CNMI ;REQ. FOR RECEIVE

MOV R2,#11H

LCALL CMD1

LCALL ENTER

LCALL SEC

MOV DPTR,#AT_CNMA ;READY TO RECEIVE

MOV R2,#07H

LCALL CMD1

LCALL ENTER

LCALL SEC3

LCALL SEC

CLR P2.0

;********************************

MAIN: MOV R0,#20H

NXTB: LCALL RXD


71

CJNE R4,#01H,NXTB

MOV A,R1

MOV @R0,A

INC R0

CJNE R0,#55H,NXTB

LCALL DISP

LCALL MOTON

LCALL MOTOF

LJMP MAIN

HHHH: LJMP HHHH

;************************************

MOTON:

MOV A,52H

CJNE A,#4FH,MRET

MOV A,53H

CJNE A,#4EH,MRET

MOV A,54H

CJNE A,#4DH,MRET

SETB P2.1

SETB P1.3

CLR P1.4


72

LCALL SEC3

CLR P1.3

CLR P1.4

MRET: RET

MOTOF:

MOV A,52H

CJNE A,#4FH,NRET

MOV A,53H

CJNE A,#46H,NRET

MOV A,54H

CJNE A,#4DH,NRET

CLR P2.1

CLR P1.3

SETB P1.4

LCALL SEC3

CLR P1.3

CLR P1.4

NRET: RET

;************************************

RXD: MOV R4,#00H

MOV R7,#1FH


73

AE: MOV R6,#FFH

AD: MOV R5,#FFH

AB: JNB RI,AC

CLR RI

MOV R1,SBUF

MOV R4,#01H ;STATUS CHK #01 OK,#02 NOT OK

;MOV R6,SBUF

;TXD

RET

AC: DJNZ R5,AB

DJNZ R6,AD

DJNZ R7,AE

MOV R4,#02H

RET

;*************LOCATION SENSING***********

LSEN:

LDISP:

RET

;****************************************

DISP:


74

CLR p2.7

CLR p2.6

MOV P0,#C0H

LCALL WRI

MOV R1,#50H

XTKL:

CLR A

MOV A,@R1

MOV P0,A

LCALL WRD

INC R1

CJNE R1,#55H,XTKL

;-----------------------

RET

;********** LCD INI *************************

LCDINI:

CLR P2.5

CLR p2.7

CLR p2.6


75

MOV P0,#30H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#30H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#30H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#38H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#01H

LCALL WRI


76

CLR p2.7

CLR p2.6

MOV P0,#01H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#01H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#02H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#0CH

LCALL WRI

CLR p2.7

CLR p2.6


77

MOV P0,#1CH

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#38H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#06H

LCALL WRI

CLR p2.7

CLR p2.6

MOV P0,#01H

LCALL WRI

RET

;----------------------------

TLINE: CLR p2.7

CLR p2.6

MOV P0,#80H

LCALL WRI


78

MOV R7,#00H

TKL:

CLR A

MOVC A,@A+DPTR

MOV P0,A

LCALL WRD

INC DPTR

INC R7

CJNE R7,#10H,TKL

RET

BLINE: CLR p2.7

CLR p2.6

MOV P0,#C0H

LCALL WRI

MOV R7,#00H

BKL:

CLR A

MOVC A,@A+DPTR

MOV P0,A

LCALL WRD

INC DPTR

INC R7

CJNE R7,#10H,BKL


79

RET

;******** INSTRUCTION /DATA WRITE *********

WRI: SETB P2.5

MOV R0,#FFH

DJNZ R0,$

CLR P2.5

MOV R0,#FFH

DJNZ R0,$

RET

WRD: SETB p2.7 ; REGISTER

CLR p2.6 ;READ WRITE

SETB P2.5 ;ENABLE

MOV R0,#FFH

DJNZ R0,$

CLR P2.5

CLR p2.6

CLR p2.7

RET

;******************************


80

DEL: MOV R7,#FFH

DJNZ R7,$

RET

DEL1: MOV R7,#FFH

DJNZ R7,$

RET

SEC: MOV R5,#03H

M1: MOV R6,#FFH

M2: MOV R7,#FFH

M3: DJNZ R7,M3

DJNZ R6,M2

DJNZ R5,M1

RET

SEC3: MOV R5,#0FH

M13: MOV R6,#FFH

M23: MOV R7,#FFH

M33: DJNZ R7,M33

DJNZ R6,M23

DJNZ R5,M13

RET


81

SSEC: MOV R5,#3FH

SM1: MOV R6,#FFH

SM2: MOV R7,#FFH

SM3: DJNZ R7,SM3

DJNZ R6,SM2

DJNZ R5,SM1

RET

;********************************************

XDEL:

mov r4,#0FH

djnz r4,$

RET

XDEL1: mov r4,#0FH

djnz r4,$

RET

XDEL2: MOV R5,#5FH

GB: mov r4,#FFH

djnz r4,$

DJNZ R5,GB

RET


82

;*********** DISPLAY *************

;**********************************************

ENTER: MOV R6,#0DH

TXD

RET

CMD1: CLR A

MOVC A,@A+DPTR

MOV R6,A

TXD

INC DPTR

DJNZ R2,CMD1

RET

;----------SENDING MES.-----------

CMDRAM: MOV A,19H

CJNE A,#01H,MES2

LCALL SEC3

MOV DPTR,#AT_CMD ;WRITE MES.IN SIMM MEMORY

LOCATION

MOV R2,#32H

LCALL CMD1

RET

MES2: CJNE A,#02H,BBBM


83

LCALL SEC3

MOV DPTR,#AT_CMD1 ;WRITE MES.IN SIMM MEMORY

LOCATION

MOV R2,#32H

LCALL CMD1

BBBM: RET

;************** UART PORT INT *************

SPINI:

MOV A,#00H

MOV TCON,#40H

MOV TMOD,#20H

MOV SCON,#52H

MOV IE,#9AH

MOV TH1,#FDH

MOV TL1,#FDH

RET

;##############################

ORG 0900H

;************ 1 LINE


84

DB 'IVRS BASED ESEC '

DB ' '

DB 'WAITIN FOR '

DB 'SENSOR SIGNAL.. '

DB ' SENSOR '

DB ' ACTIVATED '

DB ' SMS SENDING.. '

DB ' '

DB 'SMS RECEIVING.. '

DB ' '

DB 'VOICE CALL... '

DB ' '

;*********************************

ORG 1B00H

AT_CMGF: DB "AT+CMGF=1"


85

ORG 1B20H

AT_CPMS: DB "AT+CPMS="

DB 22H

DB "SM"

DB 22H

ORG 1B40H

AT_CMGW: DB "AT+CMGS="

DB 22H

DB "8885463472"

DB 22H

ORG 1B60H

AT_CMD: DB "SOMEBODY ENTERED INTO YOUR HOUSE "

DB 1AH

ORG 1BA0H

AT_CMSS: DB "AT+CMSS=1"

ORG 1BC0H

AT_D: DB "ATD8885463472;"

ORG 1C00H


86

AT_ERS: DB "AT+CMGD=1"

ORG 1C10H

AT_ERS2: DB "AT+CMGD=2"

ORG 1C20H


ORG 1C30H


ORG 1C40H


ORG 1C50H

AT_CNMI: DB "AT+CNMI=2,2,0,0,0"

ORG 1C70H

AT_CNMA: DB "AT+CNMA"

ORG 1C80H ;2ND SMS

AT_CMGW2:DB "AT+CMGS="

DB 22H

DB "9177965408"

DB 22H


87

ORG 1CA0H ;3RD SMS

AT_CMGW3:DB "AT+CMGS="

DB 22H

DB "8187017099"

DB 22H

ORG 1CD0H

AT_D2: DB "ATD9177965408;"

ORG 1CF0H

AT_D3: DB "ATD8187017099;"

ORG 1E10H

AT_H: DB "ATH"

ORG 1E20H

AT_CMD1: DB "FIRE ACCIDENT IN YOUR HOUSE AT HOME "

DB 1AH

END;

;AAAAAAAAAAAAA#############################################

#####


88

Date post:	11-Jul-2016
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