From Interconnect to Innovation in the DoD Keynote - From... · From Interconnect to Innovation- 2...

UNCLASSIFIED

Dr. Livia M. Racz

Chemical, Microsystems, and Nanoscale Technologies Group

[email protected]

www.ll.mit.edu/AdvancedTechnology/ChemMicroNano

2 May 2017

From Interconnect to Innovation in the DoD

This material is based upon work supported by the Assistant Secretary of Defense for Research and Engineering under Air Force Contract No. FA8721-05-C-0002 and/or FA8702-15-D-0001. Any opinions, findings, conclusions or

recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Assistant Secretary of Defense for Research and Engineering. © 2017 Massachusetts Institute of Technology.

Delivered to the U.S. Government with Unlimited Rights, as defined in DFARS Part 252.227-7013 or 7014 (Feb 2014). Notwithstanding any copyright notice, U.S. Government rights in this work are defined by DFARS 252.227-7013 or

DFARS 252.227-7014 as detailed above. Use of this work other than as specifically authorized by the U.S. Government may violate any copyrights that exist in this work.

mailto:[email protected]

http://www.ll.mit.edu/AdvancedTechnology/ChemMicroNano

From Interconnect to Innovation- 2

LMR 05/02/17 UNCLASSIFIED // Distribution Statement A. Approved for public release: distribution unlimited

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• The history of electronic packaging, and the unique needs and role of Defense

• What has changed?

• What can be done? In broad terms? In Electronic Packaging?

• Technology Highlights: Innovations in microsystems integration

• Summary

Outline



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• Electronic packaging used to be defined as a set of features designed to:

– Interconnect electronic components

– Protect from mechanical damage, electrostatic discharge, and RF emissions,

– Facilitate cooling,

– Enable handling

– Provide a convenient user interface

– Have reasonable cost

• “Emphasis has been placed on shaping instruments to do the job in situ.”

• “Electronic engineering has been overtaken by microelectronic engineering.”

• “Military applications… set the pace for new developments.”

The History of Electronic Packaging

-A.A. Zimmerman, APL Technical Digest, Nov.-Dec. 1967

“Welded cordwood – Last step in conventional circuits?”

APL Technical Digest 1, Sept.-Oct. 1961, 20.



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“Military Applications Set the Pace”

- Avionics

- RF communications

- Advanced sensors

- Platform stabilization

- Surveillance

- Weather

- Communications

- GPS

- Naval radar

- Communications

- Fire control

- Situational awareness

- Soldier communications

- Advanced data links

- Health monitoring

- Enhanced vision systems

- Energy harvesting and power

management

- Navigation



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“Military Applications Set the Pace” Technology Needs and Challenges

- Avionics

- Communications

- Advanced sensors

- Platform stabilization

- Shock

- Vibration

- Mechanical stresses

- High altitude

- Surveillance

- Weather

- Communications

- GPS

- Radiation hardness

- Extreme temperatures

- Naval radar

- Communications

- Fire control

- Salt spray

- Superior reliability

- Custom

enclosures

- Hermetically

sealed

- Situational awareness

- High power

- Thermal management

- Soldier communications

- Advanced data links

- Health monitoring

- Enhanced vision systems

- Energy harvesting and power

management

- Navigation

- Miniature, low power

- Superior user interface

- Desert dust



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• Summary

Outline



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• Startups are replacing corporate and federal labs as a source of innovation

• Fresh college graduates are more likely to go to startups than corporate or government labs*

• Universities are saturated with professors who have new ideas

– Some do not get tenure and start companies

– Many start companies while employed at the university**

What Has Changed? Macrotrends

Sources:

*Forbes.com report, 2013

**U.S. Dept. of Commerce report,

2013



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The Military: Post-WWII vs. Today

Today

• Facilities now aging. Defense spending at lowest % of GDP in modern history

• Asymmetric threats do not necessarily require an established scientific or industrial infrastructure

• Instant and widespread dissemination of technological information all over the world

• Global S&T investment rate has outpaced the U.S.

• Commercial technology advances now transitioning into defense

Post WWII

• Major specialized facility investments made to facilitate R&D for Defense

• Predictable, nation state threats based on large industrial infrastructure

• Inwardly-focused workforce engaged in major technology races characterized by Cold War era

• U.S. led the world in S&T investments, primarily focused on Defense and Space

• Defense technologies later transitioned to private sector

We are no longer optimally equipped to apply the best technologies

to National Security problems.

Sources: A 21st century science, technology, and innovation strategy for America’s

National Security, Committee on Homeland and National Secity of the National Science and

Technology Council, Office of the President, Wash. D.C. 20502, J.P. Holdren, et al., May 2016.

Driving a next-generation business model in defense

electronics, M. Aslett, G. Haines II, Mercury Systems, Inc.,

Jan. 2015



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• Budget sequestration and continuing resolutions have hindered new R&D starts

• Bias for short-term defense policies at the expense of investments in longer-term, higher-risk activities

• Bureaucracy and lack of agility has shifted entrepreneurial culture away from defense spin-offs to consumer market spin-offs

• Erosion of competitive inter-service pressures

• Getting used to relying on foreign manufacturers

• Innovation not always welcomed; destabilizes large incumbents

• Competing national priorities; e.g. servicing the national debt, aging population, domestic concerns

Cultural and Political Challenges

Source: The challenges for America’s defense innovation, D. Steinbeck, ITIF, Nov. 2014



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Lay of the Land: Today’s Top Unmet Needs

Space &

Counterspace • Access, resilience,

low CSWaP

Contested

Environments • Timely and

unambiguous detection

• Low-SWaP, agile

systems

• Increasing reliance on

autonomy

Cybersecurity • Hardware

• Software

Counter-

Proliferation • Advanced detection

methods and

form factors

Integrated Air &

Missile Defense • Emphasis on low

CSWaP

• Advanced

detection

Counter-

Terrorism • Technological

surprise

• Agility

Survivability &

Life Extension • Increasing use of

autonomous

systems

Power & Energy • Micro- and macroscale

• Renewable energy

production

• Harvesting

Health • Infectious diseases

• Atrocities and instability

• Global displacement

• Personalized

medicine

• Aging and mobility

Environment • Climate change

• Renewable energy

Manufacturing

Competitiveness • New manufacturing

paradigms

• Trusted electronics in

untrusted environment

• Mitigating globalization

Broad themes, highly reliant on innovation:

Access Agility Autonomy Affordability Security

Blue = Electronic packaging relevant



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• Summary

Outline



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• Increase speed and timeliness of the acquisition process

• Increase investment in rapid reaction units and create more connections between them

• Promote culture of risk taking

• Invest greater % of profits into R&D: 15-20%

• Find creative ways to facilitate information flow without compromising national security:

− New ways to collaborate with academic institutions,

− New ways to collaborate with small- and large private sector firms

− Define attractive, flexible career paths in defense research that allow easy transition between government, academia, and industry

What can be done? The Broad View

www.arl.army.mil/

Source: Defense Innovation Board recommendations to SecDef Ash Carter, October, 2016

Members included Eric Schmidt (Google Alphabet), Jeff Bezos (Amazon), Reid Hoffman (LinkedIn),

Neil deGrasse Tyson (astrophysicist), Adm. William McRaven (former commander of USSOCOM).

Promote a more inclusive view of the national security enterprise

Driving a next-generation business model in defense

electronics, M. Aslett, G. Haines II, Mercury Systems, Inc.,

Jan. 2015



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“We continuously iterate on how best to identify, contract, and

prototype novel innovations through sources traditionally not

available to the Department of Defense…”

www.diux.mil/



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Army Research Laboratory (ARL)

“…to pursue leading-edge…research in a truly collaborative fashion by enabling the continuous

flow of people and ideas between government, academia, and the private sector…viewed as a

critical element of national security.”

ARL Open Campus Strategic Plan, Approved for public release; distribution unlimited, May 2016.



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“The facility is open to all MIT students, faculty, and collaborators, and

provides a nexus for innovation, collaboration, and hands-on development.”

beaverworks.ll.mit.edu/CMS/bw/



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• Continue to miniaturize

– There continues to be demand for “integrated everything.”

• Focus on new form factors that enable agility, adaptability, reconfigurability, and affordability

• Understand and engage in technology “at the seams”

– Co-locate and cross-fertilize

– Engage more materials scientists. Interfaces become increasingly important as systems shrink.

– Be rigorous where your peers are empirical.

• Go after big problems

– But understand that game changers may not be obvious or profit-motivated

What Can Electronics Packaging Researchers Do?

• Reconfigure/reinvent yourself and your workforce.

– “Today’s answer is tomorrow’s idiocy.”

• Become generalists in addition to experts

– Understand the system and get a seat at the table early

• Keep regulatory processes in perspective

– Beware of well-intentioned regulation becoming an end in itself

• Capture a diverse workforce;

– Diverse background, skill set, cultural background, expertise

– Create a work environment friendly to multiple work styles and generations

“Survival goes neither to the strongest nor the swiftest, but the fastest to adapt to change.” --Frequently attributed to, but probably not said by Charles Darwin.

--Martin Seifert, President, Nufern



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• Summary

Outline



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Microsystems Integration Innovation Framework

Established Device

New Device

Established Form Factor New Form Factor

Established integration

methods used to create

new devices

New devices, new form

factors, completely new

concept of operations

Status Quo New integration methods

for established / known /

existing devices



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• Technology Enablers

• Blue Sky

• Potential technology and/or

business disruptors

(if cost is low enough and

time is right)

Status quo

• “Integrated Everything”

• Cost reducers

• Ubiquitous devices

• Potential business disruptors


Established Device

New Device




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• The measured self

• 3D integrated microjets

• 3D integration enabled

quantum computing

• Multi-functional fiber devices

• MEMS picoprojector

• Paper electronics

• Tiled large-format imager

• Microplasma sputterer


Established Device

New Device




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• MEMS scanning mirror devices integrated within a Smartphone

– Operation in reflection mode maximizes efficiency

– Miniature, low-power electronics for ease of integration

– Sophisticated software and algorithms for image brightness and quality

MEMS Pico-Projector

Sources:

C. Lopez, “How to design an efficient MEMS-based pico-projector,”

EE Times Europe, Feb. 10, 2014

“Micromirror technology for smartphones,” Phys.org, July 16, 2013.

“Integrated Everything”



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• Solar cells on paper

• Loudspeakers on paper

• “Power paper”

Paper Electronics

Sources: A. Hubler, et al., Adv. Energy Mater. (2011)

MC. Barr, et al., J. Adv. Mater. (2011)

Source: A. Hubler, et al., Organic Electr. (2012)

Source: MIT Technology Review (2009)

Low Cost and Ubiquity



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Tiled Large-Format Digital-Pixel Readout Integrated Circuit

Example Concept: Imaging from Space

High-speed image capture enables transient event detection

• Fabrication costs prohibit large-format digital focal plane array devices fabricated at advanced nodes

– Maximum die size typically limited to 12 mm x 12 mm on a multi-project wafer

– Dedicated wafers are too costly

– Field stitching not available for most advanced nodes

– As die size increases, digital CMOS yield becomes more of a concern

• Leverage FOWLP◊ techniques at MEOL♦ to construct a large-format imager from smaller known-good die

Cost reduction enables the mission

◊ Fan-out Wafer Level Packaging ♦ Middle End of Line



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Low-Cost Fabrication of 3D Microsystems

What if you could build this? Or this? Or this?

Using a single fabrication process?

Cons:

• Planar

• Specialized expertise required

• Only cost effective at high

volumes

Cons:

• Limited materials

• Material quality

• Slow

Wafer Fab &

Packaging

Additive

Manufacturing

Pros:

• Established

• Material quality

• Performance

• High throughput

Pros:

• 3D

• Flexible/accessible

• Rapid design iterations



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Additive Manufacturing for Electronics

• Additive manufacturing is well suited to mass customization of mechanical

structures – Structural complexity and variety practically unlimited

– No assembly required

– Minimal lead time

– “Low-skill” manufacturing

– Minimal facilities investment

• Electronic materials lag behind – Technologies for printing conductors may get there in 5-10 years

– No path for printed semiconductors

Source: Prof. Hod Lipson, “The 10 Principles of 3D Printing” NSF

Workshop, Additive Manufacturing for Health, March, 2016.

Learn how to print microelectronics-quality conductors and semiconductors



UNCLASSIFIED

Source: Hirt, Reiser, Spolenak, Zambelli, Adv. Mater. 2017, 1604211

Adv. Mater., 27, 4322, 2015.

xx.

Appl. Phys. A, 122, 280, 2016.

PNAS vol. 113, no. 22, 6137, 2016. Scientific Reports 5:17265, 2015.

Optics Express 22(23) 2014.

Science 329, 315, 2010 . Adv. Mater., 28, 2311, 2016. Small, 5, 1144, 2009.

State of the Art in Printed Conductors



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A Different Approach: Microplasma Sputtering

Microplasma: A mm-to-mm-scale plasma that can be struck at atmospheric pressure & temperature.

Substrate

Gas

Electric field

Magnetic field

Cathode Magnet

Anode

Magnet

Anode

1-2 mm

Advantages: • No theoretical limit on “printable” materials

• No inks

• Maskless

• Capable of fine features

• Integrable with standard 3D printers

Challenges: • Material feed

• Plasma design

• Lifetime

• Modular ballasting, crosstalk

• Oxidation control

Potential business disruptor



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quantum computing







Established Device

New Device




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• Physiologic monitoring via the gastrointestinal tract

– Includes battery that can be sustained by acidic fluids in the stomach

• Self-powered electronic skin pressure sensor

• Wearable mobile network as integral part of assisted living technologies

The Measured Self

Source: Traverso, et al., PLoS (2015)

Source: Stanford University Office of Technology Licensing, 2014

Source: Kantoch & Augustyniak, Information Technologies in

Biomedicine (2012)

Very simple packaging yields very novel technologies



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3D Integrated Microjets for Thermal Management

GaN on Si GaN on SiC Diamond

Air cooled Baseline Baseline Baseline

Cold plate 3.8 dB 4.4 dB 5.1 dB

Microchannels 5.8 dB 7.0 dB 8.8 dB

Microjets 9.3 dB 11 dB 18 dB

Rcond

Rconv

Standard 3D processes used to integrate single-phase cooling jets.

Local heat transfer coefficients unmatched by other technologies.

• High-power electronic systems have still mostly relied on

thermal conduction through multiple layers as their heat

rejection strategy

• Two-phase thermal ground planes and active systems are complex and costly



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Integrate via die-to-die, die-to-wafer, or wafer-to-wafer bonding

Microjet High Power HEMT Application

GaN on Si die Microjet layer

Exit port

Surface

features

Jet array

500 μm

32

mm

26 mm 26 mm

32

mm



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Microjet Heat Transfer Performance

Standard silicon 3D integration + microfluidics enables world-class performance



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3D Integration for Quantum Computing

SiliconMCM

Coplanar WaveguideTransition to MCM

Ribbon Bonds

RF Wiring Harness

QubitChip

Printed CircuitBoard

Metal Carrier

Microbumps

dc Wiring Harness

Wire Bonds

Spin qubit 1

~100 mm

High-Q metal

Parametric readout amplifiers

and qubit bias/control routing

Interposer

Readout/

interconnect

Standoff

Spin qubit

chip

Thick ground plane

Spin qubit 2

Qubit

bias

Few

mm

Inductive or capacitive

couplings

Coaxial shielded

through-silicon vias

Large, isolated qubit

mode volume

Interconnect



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• Superconductive TSV fill development:

Superconductive Through-Silicon Vias (TSV)

4 mm wide

TSV 163 mm

deep

TSV etch

200 nm scale



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Shielded TSVs

20 mm

21 mm core

10 mm

6 mm core

20 mm 20 mm 10 mm

Raceway core ~ 5 x 20

mm

6.6 mm shield Raceway core ~ 4 x 6

mm

20 mm

2.5 mm core-to-

shield



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3D Integration for Quantum Computing

SiliconMCM

Coplanar WaveguideTransition to MCM

Ribbon Bonds

RF Wiring Harness

QubitChip

Printed CircuitBoard

Metal Carrier

Microbumps

dc Wiring Harness

Wire Bonds

Spin qubit 1

~100 mm

High-Q metal

Interposer

Readout/

interconnect

Standoff

Spin qubit

chip

Thick ground plane

Spin qubit 2

Qubit

bias

Few

mm

Interconnect

Slight variations to standard silicon 3D integration processes enable

a completely new field



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quantum computing







Established Device

New Device




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Multifunctional Fibers

• Single Material

• No Architecture

• Single Functionality

• Multimaterial - Metals, Semiconductors,

Insulators

• Device Architecture

• Multifunctional

Materials processing and integration approaches that deliver semiconductor

device functionality within a fiber form factor.



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Spectrally Controlled Reflectivity Photonic Bandgap Fibers

• The two materials must co-

draw at the same

temperature

• Infrared transparent

• Must not delaminate when

quenched

• Fiber must have high

tenacity for weaving

Requirements Experimental Results

Photonic bandgap textile fibers that meet industrial weaving requirements yield spectrally-engineered fabric



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Microelectronic Textiles

New materials integration techniques and new form factors yield completely new devices and opportunities

Microelectronic devices embedded

within the preform

Preform processing

Active devices embedded within

textile fiber

Fiber drawing



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• Summary

Outline



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• After World War II, corporate and government research labs were the dominant source of innovation.

• Startups now lead the way and Defense lags behind.

• Vigorous efforts are under way to speed up the cycle of Defense-related innovation:

– Open campus and innovation centers

– Cross-fertilization with startups and industry

– Innovation practice programs

• Miniaturization has been the engine of electronics innovation for the last 40 years, and its importance continues unabated.

Summary

• Microsystems Integration Innovation Framework

– Four quadrants:

• Status Quo

• Established Device – New Form Factor

• New Device – Established Form Factor

• New Device – New Form Factor

• Examples of new ideas in electronics packaging, processing, and integration that enable different categories of innovation:

– “Integrated Everything”

– “Technology Enabler”

– “Blue Sky”

There is a need for new innovation models in order to solve problems of National significance.

Opportunities abound in Electronics Packaging and Microsystems Integration.

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