Hitachi High-Tech Science Corporation’s

FT-150 XRF for Ultra Thin Measurements (Eastern Applied Research, Inc. is responsible for the contents of this presentation.

Certain material is used with the permission of Hitachi High-Tech Science Corporation.)

Authorized Distributor;

United States and Mexico

What is Ultra Thin?

Can be considered a layer of material ranging from fractions of a nanometer

(monolayer) to several micrometers in thickness.

Quality control of ultra thin coatings with XRF is commonly seen in the printed

circuit board industry but may also be utilized in semiconductor wafer fabrication

facilities for process control. Applications are not limited to these industries.

Benefits (may vary to application)

Flat surface

Through-put efficiencies

Uniform plating

Lead (Pb) free

Ideal soldering surfaces

Common Methods to create thin films

Electro-Plating

Immersion Coating

Vapor Deposition Methods

PVD, physical vapor deposition

CVD, chemical vapor deposition

Common Examples

Immersion Silver

5~16 micro-inches (0.12~0.40µm)

Typical: 8~12 micro-inches (0.2~0.3µm)

ENIG (Au/Eni):

Immersion Au: 5 micro-inches (0.127µm)

Electroless Ni: 150 micro-inches (3.8µm)

ENEPIG (Au/Pd/Ni):

Au: 2 micro-inches (0.05µm) Min. Immersion Gold

Pd: 3~8 micro-inches (0.076~0.2µm) Electroless Palladium

Ni: 120~240 micro-inches (3~6µm) Electroless Nickel

On Silicon Substrates:

SiO2, AlSi, Ti, TiN, Pt, Al, and BPSG

The Answer: FT-150

-Printed Circuit Boards (PCBs)

-Ultra Small Chips

-Wafer Bumps

-Metal Film Stacks

-Data Interconnects

-Lead Frames

The Hitachi FT-150 XRF analyzer combines industry leading detector

technology with poly-capillary optics to offer high performance and

repeatability of ultra thin film measurements.

The poly-capillary optics achieve a 30uM beam (FWHM: 17uM), allowing

for enhanced performance of ultra thin measurements in small regions.

Analyzer Evolution

Even greater performance

from Hitachi FT-150

High performance from

Seiko SFT-9500 series

Improved RSD%

FT9500X FT150

Avg SD RSD% Avg SD RSD%

Au (uM) 0.0129 0.00040 3.1% 0.0131 0.00016 1.3%

Pd (uM) 0.0118 0.00031 2.6% 0.0111 0.00019 1.7%

Ni (uM) 0.4940 0.00116 0.2% 0.4676 0.00047 0.1%

Standards:

Au (0.013 uM)

Pd (0.012 uM)

Ni (0.5 uM)

Cu substrate

Repeated 30 times

FT9500X FT150

Avg SD RSD% Avg SD RSD%

Au (uM) 0.0061 0.00018 2.9% 0.0062 0.00010 1.5%

Pd (uM) 0.0176 0.00058 3.3% 0.0180 0.00034 1.9%

Ni (uM) 0.9042 0.00164 0.2% 0.9045 0.00078 0.1%

Lead frames

Repeated 10 times

Note: RSD% is relative standard deviation; the absolute value of the coefficient of

variation…CV is defined as the ratio of the standard deviation to the mean.

It shows the extent of variability in relation to mean.

FT-150 Highlights

• High Precision Measurements at Micro-Spots

• Poly-Capillary Optics

• Enhanced Visibility of Sample and Measurement Spots

• Variation of Application Capabilities

• Ease of Use, New Graphical User Interface

• Redesigned Chamber/Door for Ease of Operation

Vortex Detector

High Performance Silicon Drift Detector (SDD): Vortex Detector

Benefits: Faster Measurement Times, Greater Resolution

Resolution compared to

predecessor (SFT9500’s)

Vortex is a registered trademark of Hitachi High-Tech Science Corporation

Registered trademark number 5184003

High Energy Resolution

High Count Rate Detector

Poly-Capillary Optics

Poly-capillary: an optical element that works like a convex lens to focus x-rays

onto a micro spot and is composed of several thousands of glass capillary tubes.

Benefit:

Greater performance at micro-spots

(under 100uM)

Example:

Au/Pd/Ni/Cu multi-layer coatings

in circuit boards or connectors

Important to Note:

Spot size lists at 30uM,

but FWHM is 17uM

Chamber Design

An innovative chamber door design

provides an enhanced opening

Benefits:

Enhanced sample visibility

Simple and efficient sample positioning

Easier access than competitive systems

The higher resolution camera

provides a clearer image of samples

FT150

SFT9500

Software Functions

Newly developed software results in greater ease of use

Register various measurement methods by creating “apps”

Benefits:

Streamlined…results and conditions are

automatically saved into the database.

Secure verification and data management

Increased operator efficiency and throughput

Three Variations

FT150 FT150H

Mo Target W Target

17 keV 30-40 keV

Max Sample:

15.7 x 11.8 x 3.9 inches (WxDxH)

Stage Travel:

15.7 x 11.8 inches (W-D)

Major Difference: Mo and W tube targets. Tungsten (W) is for when higher

excitation is required (ie Tin). Mo for when lower excitation is required (ie Gold).

FT150L

Mo Target

17keV

Max Sample:

23.6 x 23.6 x 0.78 inches (WxDxH)

Stage Travel:

11.8 x 11.8 inches (W-D)

Specifications

Element Range Aluminum (13) to Uranium (92)

X-ray Source 45kV, (varied targets, Mo and W)

Detector Silicon Drift Detector (SDD)

X-ray Focusing Optics Poly-Capillary

Sample Observation CCD Camera, 1 million pixels

Focus Adjustment Laser focus, Auto focus

Max Sample Size, base model Two Options (see variations)

Stage Travel Two Options (see variations)

Measurement Software

Thin Film FP (5 layers, 10 elements)

Thin Film Calibration Curve Method

Qualitative Analysis

Data Process Microsoft Excel and Word

Contact Info

FT-150 Info and Literature:

http://www.easternapplied.com/hitachi-FT150-xrf-analyzer

Contact Eastern Applied Research Inc

for literature, demonstrations, discussions:

http://www.easternapplied.com/

716-201-1115 ~ sales@easternapplied.com