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Corporate Overview
• Established: January 1, 1968
• Fed Tax ID: 77-0170595
• State Corp No: 1598731
• State Resale No: SRGH-26-791818
• SBA: P0088723
• DUNS: 050516962
• NAISC Code 541330: Engineering Services• NAISC Code 334412 Bare PC Board Manufacturing• NAISC Code 334412 Bare PC Board Manufacturing• NAISC Code 334418: Assembled PC Board Manufacturing
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Corporate Overview:National Design Coverageg g
Corporate HeadquartersSanta Clara, CA:
Santa Clara, CA:• Designers - 4• Electrical Engineers - 1
• 42,800 sq ft Manufacturing Facility• 120-Employees
★ ★
San Diego, CA:• Designers - 10• Electrical Engineers - 5• Software Engineers - 1
Crossville, TN:★
★★
★
★★
Crossville, TN:• Designers – 2
Denver, CO:• Designers - 3
Neptune NJ:
★
★ Neptune, NJ:• Designers – 14• Electrical Engineers – 3• RF Engineers – 1• Software Engineer – 1
★★ Corporate Headquarters
Design Center
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Design CenterSales Channel
Corporate Overview:Markets Served
Military & Aerospace
Test & Measurement Medical Device Semiconductor
Applications
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Corporate Overview:Core Competenciesp
Engineering & Design
&DFX
PCB Fabrication
Electronics Manufacturing
ServicesTest Fulfillment
DFX Services
Services
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Corporate Overview:ISO Certifications
*AS9100 Certification Scheduled July 2011*
ISO 9001 : 2000ISO 13485 : 2003
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ISO 9001 : 2000ISO 13485 : 2003
Corporate Overview:IPC CertificationsIPC Certifications
J-STD-001 IPC-A-600IPC-A-610 IPC-7711/7721
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Corporate Overview:Mil-Spec Certificationsp
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Corporate Overview:ITAR Registeredg
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Corporate Overview:Some of our CustomersSome of our Customers
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Design Layout ServicesDFM DFT DFXDFM DFT DFX
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• Designer 6• Summer 08• P-CAD 2004
• Concept HDL-XL• Allegro PCB XL• Spectra Router XL
• Design Architect• DxDesigner• PADs LogicP CAD 2004
• P-CAD 2006Spectra Router XL
• OrCAD• OrCAD-CIS• OrCAD PCB Designer
PADs Logic• Board Station• Expedition• PADs Layout
• Master PCB Designer• Master IC Test Designer
• Schematic Capture• PCB Design Suite• FPGA Design• PR Editor XR
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FABRICATION
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PCB Fabrication:Mechanical CapabilitiesMechanical Capabilities
Attribute Internal ExternalMax Panel Size 18" x 24" > 24" x 54"
Max Board Thickness 0.300" 0.480"Min Rigid Core Thickness < 0.002" < 0.002"
Min Prepreg Core Thickness < 0.002" < 0.001"Min Line Features (Trace/Space) – ¼ oz Cu 0.0025”/0.0025” 0.0025”/0.0025”
Max Layer Count > 40 > 60Max Layer Count > 40 > 60Aspect Ratio (0.006" Conventional PTH) > 22 : 1 > 32 : 1
Min Conventional Drill Size 0.008" 0.004"Min Plated Through Hole (PTH) 0.006" 0.002"
Min Land Pad (PTH) < 0.010" < 0.008"Min Laser Drill - 0.002"
Min Cu Filled Via (HDI) 0.006" 0.004"Min Land Pad (HDI) 0.010" 0.006"
HDI Aspect Ratio (0.004" Cu Filled Via) > 1 : 1 2 : 1Min Plane Relief 0 020" 0 010"Min Plane Relief 0.020 0.010
Minimum Routing Radius 0.012" < 0.012"Min Device Pitch 0.010" 0.010"
Plated Hole Tolerance +/- 0.002" < 0.002"Layer-to-Layer Registration +/- 0.003" < 0.002"
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Impedance Tolerance +/- 5% 3%
PCB Highlights:Plating FinishesPlating Finishes
Plating Finish Internal External
Electroless Cu ✔
Electroless Ni Immersion Au (ENIG) ✔
Electroplated Cu, Ni/Au, Sn/Pb ✔
Hot Air Solder Level (HASL) ✔
Pb-Free Hot Air Solder Level (HASL) ✔
Electroless Ni Electroless Pd Immersion Au ✔(ENEPIG) ✔
Immersion Au ✔
Immersion Ag ✔
Immersion Sn ✔
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PCB Highlights:Material OfferingsMaterial Offerings
45NK N4000
ArlonNelco
84N N5000
85N N7000
CLTE, -AT, -XT N8000
FR370 N9000
FR406 RO30xx
FR408 RO32xx
Isola RogersIS410 RO4xxxx
IS415 RT/duroid
IS620i TMM xxxIS620i TMM xxx
IS680
TaconicfastRise
Nan Ya NPG-170 RF
Panasonic M t 6 TLC TLX TLY
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Panasonic Megtron 6 TLC, TLX, TLY
PCB Highlights:CAM/DFM ToolsCAM/DFM Tools
Genesis 2000• Design Optimization:
Imaging
• Line Features• Signal Layers• Power/Ground Layers
• Coupon Generator
AOITest
• Coupon Generator• Etch Compensation• Copper Balancing• HDI Tool Suite• Via Analysis• Neck Down Repair• Auto Drill Manager• Auto Rout Manager
DrillingRouting
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Auto Rout Manager
PCB Highlights:CAM/DFM ToolsCAM/DFM Tools
Si900e• Impedance magnitude• Skin depth• Insertion loss S21• Conductor loss dB• Dielectric loss dBDielectric loss dB• Propagation velocity• Propagation delay• Differential propagation velocity
Diff ti l d l• Differential delay• Odd mode Z magnitude• Even mode Z magnitude• SPICE RLGC
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• 2 & 4-Port S-Parameters
PCB Highlights:Fab Tools
Paragon 6600I LDI System
Fab Tools
• DoF: +/- 300μm• Registration Accuracy: 24μm• Annular Ring Accuracy: > 12μm• Line Features: 0.001”
Discovery 8000 AOI System• 100% Inspection On All Panels
0 001” Li F t• 0.001” Line Features• SIP Technology
VeriSmart Verification & Repair StationVeriSmart Verification & Repair Station• 18x-78x Zoom/Magnification Range• 0.0001” Measurements• 0 002” Line Features
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0.002 Line Features
PCB Highlights:Fab Tools
I t XR E ll 689
Fab Tools
Inspectra XR•X-Ray of scaling factors affecting hole-size & interlayer registration, & tool metrology
Excellon 689•Spindle Speed: 180,000 rpm•Infeed / Retract Rate: 1,500 ipm (38 / i )tool metrology
•Depth Control: +/- 0.0002” (38 m/min)• Drill Accuracy: +/- 0.001”• Positional: +/- 0.0002”• Repeatability: +/- 0.0001”epeatab ty / 0 000
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EMS Highlights:Capabilities & ServicesCapabilities & Services
J-STD-001 / IPC-610-A / IPC-7711 / IPC-7721
Surface Mount, Through-Hole, & Mechanical Assembly
Box & System Build
Repair & Rework
Design for Manufacturing (DFM)
Continuity, In-Circuit, & Electronic Bench Testing
Automated Optical Inspection (AOI)
Automated X-Ray Inspection (AXI)
Conformal Coatingg
Supply-Chain Management
Fulfillment & Deployment
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EMS Highlights:Design for ManufacturingDesign for Manufacturing
• Automated Interface to AOI, AXI, ATE, & ERP Tools, ,
• Process Engineering• Production Planning• Lean Materials Planning
E i t M it i &• Equipment Monitoring & Management
• Real-Time Quality Control• Valor Parts Library with >35-y
Million OEM Part-Numbers• Auto-Generated SMT Libraries
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EMS Highlights:SMT LinesSMT Lines
UP2000 HiE•Fiducial Alignment
KE-750E• 0402 – 20mm sq
KE-2020•0201 50mm sq
1800EXL•Fiducial Alignment•Alignment Accuracy:+/-0.001”•Alignment Repeatability: +/- 0.001”
t 6 Si
0402 20mm sq Component Placement
• Up to 12,000 CPH• X/Y Resolution –
0 005”
•0201 – 50mm sq Component Placement•Up to 20,000 CPH•Leaded, BGA, & Odd Shaped Component
•Eight Heating Zones•Two Cooling Zones•Five Profiling Thermal Couples•Conveyer Speeds up toat 6-Sigma
•11-Second Cycle Times 0.005
• X/Y Repeatability - +/-0.001”
(Two / SMT Line)
Shaped Component Compatibility
Conveyer Speeds up to 40” / minute.•Steady State Control with <2 C Gradients
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( )
EMS Highlights:Automated InspectionAutomated Inspection
Structural DefectsStructural DefectsStructural Defects• Solder Bridging• Solder Voids/Opens• Missing/Damaged
Components
Structural Defects• Solder Bridging• Solder Voids/Opens• Missing/Damaged
ComponentsTRI TR-7550 AOI Agilent 5DX AXIComponents• Billboards• Tombstones• Lifted Leads• Solder Ball Defects
Components• Billboards• Tombstones• Lifted Leads• Solder Ball Defects
TRI TR 7550 AOI•High-Speed In-Line Dynamic Imaging•Digital 3 CCD Full-Color Camera
Agilent 5DX AXI•3D X-Ray Laminography•80-140 Solder Joints/Second•0.2mm Device Pitch• Solder Ball Defects
• BGA Reflow Defects• Insufficient Solder• Excessive Solder• Misalignment
• Solder Ball Defects• BGA Reflow Defects• Insufficient Solder• Excessive Solder• Misalignment
Camera•1001005 Case Sizes•Optical Character Recognition & Verification
0 e ce tc•Image Acquisition Time of 5-Images/Second•Surface Map Time of 5-Points/Sec
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• Misalignment• Misalignment
EMS Highlights:Test Equipmentq p
86100C86100C E3631AE3631A E5810AE5810A N9020AN9020AHMC T2100HMC T2100
E8364CE8364CE4438CE4438C 8400CJ8400CJi3070i3070
34401A34401A 34970A34970A8595E8595E SR5500SR5500 TDS 784CTDS 784C
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Jason S LevyJason S LevyStrategic Alliance Director
[email protected](408) 328-9775 Direct
www.hunterpcb.com