2:00 – 6:00 Board Meeting Pecan Room Tuesday, October 6, 2009 12:00 – 4:00 Council Meeting and Luncheon Regency Room 6:30 – 7:30 President’s Special Reception Imperial East Ballroom 7:30 – 10:00 President’s Award Banquet Imperial Central West Ballroom
Sunday, October 4, 2009 Item Description Person
1.0 Welcome & Opening Remarks Nondahl 1.1 Adoption of the Agenda Nondahl 1.2 Attendance using roster
2009 Executive Board Roster.pdf
Members Present: M. Elbuluk, T. Baldwin, M. Halpin, A. Bagley, D. Mills, D. Dunn, S. Larson, N. Matsui, J.J. Dai, B. Lequesne, P. Magyar, M. Nelms, G. Parise, R. Simmons, B. Lloyd, D. Durocher, T. Nondahl Remote Access: J. McConnell IAS Administrator: L. Bernstein Guests Present: A. Rotz, O. Mohammed, L. Powell, G. Krolin-Taylor, C. Speck, D. Zinger, R. Harley
All
2.0 Motion and Action Item Review Nondahl 2.1 Motions balloted electronically since the previous meeting (included
here for the official record
2.1.1 Motion to approve a conference loan of $12,000 for the 2010 IAS Pulp and Paper Industry Committee (PPIC) conference to be held June 21-23, 2010 in San Antonio, TX USA. Background: The budget has been reviewed and approved at it meets the IEEE 20% surplus requirement. Region 5 will be providing a conference loan of $3,000 for a total loan of $15,000 for the conference. The attached MOU has been signed myself and a representative of Region 5.
Motion 071509 PPIC 2010 MOU signed.pdf
Nelms
2.1.2 2.13
2.2 Motions – Consent Agenda Motion to approve Consent Agenda
Seconded by Lequesne Approved unanimously
Bagley
2.2.1 Motion to accept the minutes of the June 2009 IAS Executive Board Meeting Seconded by: Bagley
Dunn
2.2.2 Motion to approve a conference loan of $5,000 for the 2010 IEEE Rural Electric Power Conference to be held May 16-18, 2010 in Orlando, Florida.
Nelms
Background: The budget has been reviewed and approved at it meets the IEEE 20% budget surplus requirement.
2.2.3 Motion to approve technical co-sponsorship of the 2010 International
Conference on Industrial Mechatronics and Automation (ICIMA 2010) to be held May 30-31, 2010, in Wuhan, China. Background: The IAS was a technical co-sponsor of the 2009 conference. The attached MOU for technical co-sponsorship has been signed by a conference representative and by the IEEE. It contains the standard IAS limit on the number of papers which may be submitted for transactions review. The IEEE will not pay an acquisition fee to include the proceedings in Xplore. In addition, the IAS has the opportunity to display membership materials at the conference.
16297_2010 ICIMA fully executed TCS_IA
Nelms
2.2.4 Motion to approve technical co-sponsorship of The 2nd International Conference on Industrial and Information Systems (IIS 2010) 1 to be held July 10-11, 2010, in Dalian, China. Background: This is the first time that the IAS will be a technical co-sponsor of this meeting. The attached MOU has been signed by a conference representative and by the IEEE. It contains the standard IAS limit on the number of papers which may be submitted for transactions review. The IEEE will not pay an acquisition fee to include the proceedings in Xplore. In addition, the IAS has the opportunity to display membership materials at the conference
16296_2010 IIS fully executed TCS_IAS.pd
Nelms
2.25 Motion to approve technical co-sponsorship of the 2010- XIX International Conference on Electrical Machines (ICEM 2010) to be held September 6 – 8, 2010 in Rome, Italy. Background: The IAS has been a technical co-sponsor of this meeting in the past. The attached MOU has been signed by a conference representative and representatives from PES, PELS, IES, and IAS. It contains the standard limit on the number of papers eligible for transactions reviews. Also, no acquisition fee will be paid for the conference proceedings.
ICEM 2010 MOU.doc
Nelms
2.26 Motion to approve a conference loan of $15,000 for the 2010 IEEE Energy Conversion Congress and Exposition (ECCE 10) to be held September 10-16, 2010 in Atlanta, GA USA.
Nelms
Background: The budget for this conference has been reviewed and approved as it satisfies the IEEE 20% surplus requirement. PELS is a financial co-sponsor of this conference with the IAS and will provide a $15,000 loan as well.
2.2.7 Motion to approve a conference loan of $6,000 for the 2010 Industrial and Commercial Power Systems Technical Conference to be held May 9-13, 2010 in Tallahassee, FL USA. Background: The budget has been reviewed and approved as it meets the IEEE 20% surplus requirement. The Tallahassee Area Section is also providing a loan of $3,000.
Nelms
2.2.8 Motion to approve technical co-sponsorship of the PCIC Europe conference for five years beginning with the 2010 conference. Background: The IAS has been a technical co-sponsor of this meeting since 2006. An MOU was developed for a five-year technical co-sponsorship. This MOU allows for the conference record to be included in Xplore. No acquisition fee will be paid for conference proceedings. The attached MOU has been signed by a representative from PCIC Europe and the IAS and has been forwarded to the IEEE for approval.
MOU between IEEE IAS and PCIC Europe
Nelms
2.3 Motion to accept slate of Distinguished Lecturer’s for 2010-2011 as shown in Chapter Membership Report. See item 5.2 for the names of
the 2010 Distinguished Lecturers. Seconded by Durocher Approved unanimously
M. Halpin abstained
Magyar
2.4 2.5 2.6
3.0 Officers’ Reports 3.1 Division II Director
-no report-
3.2 President
3-2_President_0910.doc
Nondahl
3.3 President-Elect
Pres Elect 2009 Q3 report revised 2009-1
Lequesne
3.4 Vice-President Lloyd
IAS Q3 Report Long Range Plan Vice Presi
3.5 Treasurer
IAS-Treas-Rpt Oct 09.pdf
Larson
4.0 Operating Department Reports 4.1 Process Industries
PID Report_October 2009.pdf
Durocher
4.2 Manufacturing Systems Development & Application
MSDAD 3rd Quarter Report (october, 200
Elbuluk
4.3 Industrial & Commercial Power Systems
I&CPS Report 2009 3rd Quarter.pptm
Baldwin
4.4 Industrial Power Conversion Systems No report
Toliyat
5.0 Staff Department Reports 5.1 Awards
Q3 Awards Dpt Rp.doc
Bagley
5.2 Chapters & Membership
2009 Q3 IAS EB _ CMD Report _ PMagy
Final list to Peter sept 2009.pdf
CMD DL Committee Report _ Ro Harley.p
Magyar
5.3 Education
IAS Education Dept Report_Oct 2009.doc
Dunn
5.4 Meetings Nelms
Meetings Dept Report October 2009
5.5 Publications
Pubs09Q3.pdf 2009 IAM Editor Report.ppt
Peterson
5.6 Standards
Standards Exec Board Report Houston
Mills
6.0 Committee Reports 6.1 Nominating
Halpin
6.2 Financial Planning See Treasurer’s Report
S. Larson
6.3 Long Range Planning See Vice-President’s Report
Lloyd
6.4 Constitution & Bylaws -no report-
Halpin
6.5 Intersociety Cooperation -no report-
Lukaszewski
6.6 Electronic Communication -no report-
Tallam
7.0 Old Business 8.0 New Business
8.1 Formed two Ad hoc committees : 1) ECCE Cooperation (See President’s Report for more details) 2) Zucker Design Contest Rejuvenation (Chair M. Halpin) Members: M. Nelms, D. Durocher, J. Sotile
Nondahl
8.2 Expansion of teleconferencing to committees – IAS will arrange and pay for IEEE teleconference services for Technical Committees upon request from a Technical Committee Officer
Nondahl
8.3 WIE Contribution – No action at this time
9.0 Closing Remarks Nondahl 10.0 Adjourn <Nelms>
Seconded <Halpin> Motion to adjourn – October 5, 2009 5:00 PM
Total respondents = 1576 or 15.3% of
IAS members
What is your current or most recent member status? (q1)I belong or belonged to both the IAS and IEEE 99.3 %
I belong or belonged to just the IAS as an affiliate member 0.2 %
I belong or belonged to just the IAS 0.1 %
I do not know 0.4 %
Total 100.0 %
Are you currently a full time student? (q2)Yes 3.5 %
No 96.5 %
Total 100.0 %
What is your IEEE Region? (q3)Regions 1 to 6 (United States) 60.7 %
Region 7 (Canada) 8.2 %
Region 8 (Europe, Middle East, Africa) 14.5 %
Region 9 (Latin America) 6.4 %
Region 10 (Asia and Pacific) 10.2 %
Total 100.0 %
(q4) - How familiar are you with the IEEE Industry Application
Society? (1)Very familiar 45.2 %
Somewhat familiar 50.3 %
Not familiar 4.4 %
No opinion 0.1 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Appliance Industry (2)Committee Member 2.3 %
Area of interest 30.6 %
Unknown 67.1 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Electrostatic Processes (3)Committee Member 2.9 %
Area of interest 13.9 %
Unknown 83.2 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Automation and Control (4)Committee Member 2.3 %
Area of interest 76.6 %
Unknown 21.1 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Lighting and Displays (Formerly
Production and Application of Light) (5)Committee Member 2.0 %
Area of interest 47.7 %
Unknown 50.3 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Electric Machines (7)Committee Member 4.7 %
Area of interest 84.8 %
Unknown 10.5 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Drives (8)Committee Member 6.6 %
Area of interest 82.6 %
Unknown 10.8 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Power Converter (9)Committee Member 4.9 %
Area of interest 80.0 %
Unknown 15.1 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Power Electronics Devices and
Components (10)Committee Member 2.8 %
Area of interest 77.3 %
Unknown 19.9 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Cement Industry (12)Committee Member 2.2 %
Area of interest 27.5 %
Unknown 70.3 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Metal Industry (13)Committee Member 2.5 %
Area of interest 36.2 %
Unknown 61.3 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Mining Industry (14)Committee Member 3.4 %
Area of interest 35.3 %
Unknown 61.3 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Petroleum and Chemical Industry (15)Committee Member 10.4 %
Area of interest 54.1 %
Unknown 35.4 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Pulp and Paper Industry (16)Committee Member 7.2 %
Area of interest 41.4 %
Unknown 51.4 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Codes and Standards (18)Committee Member 5.2 %
Area of interest 74.7 %
Unknown 20.1 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Energy Systems (19)Committee Member 2.1 %
Area of interest 82.8 %
Unknown 15.1 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Power Systems Engineering (20)Committee Member 4.7 %
Area of interest 84.9 %
Unknown 10.4 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Power Systems Protection (21)Committee Member 3.3 %
Area of interest 81.0 %
Unknown 15.7 %
Total 100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Rural Electric Power (22)Committee Member 2.4 %
Area of interest 57.1 %
Unknown 40.5 %
Total 100.0 %
In the past 2 years, in which of these ways (if any) have you been
involved with the Industry Application Society (NOTE THIS
TABLE WILL HAVE LINKS TO THE CURRENT IAS WEBSITE FOR
THE RELEVENT INFORMATION FOR THE CHECK BOX LINE) (q6)Attended a IAS sponsored technical conference 35.9 %
Eligible voters Number of votes received Percentage
2009 Executive Board 25 23 92.00%
Chapter Chairs 116 20 17.24%
Society Past Presidents 22 10 45.45%
Region Area Chairs 10 7 70.00%
Technical Committee Chairs 25 15 60.00%
198 75
IEEE INDUSTRY APPLICATIONS SOCIETY Bruno Lequesne President-Elect Date: September 28, 2009 To: IAS Board Members Subject: President-Elect Report to the IAS Executive Board Meeting to be held on October 5, 2009 What follows are preliminary statistics and comments concerning the 2009 Annual Meeting. Salient points are in bold. In overall summary, registration numbers are encouraging, especially given the difficult economic times, in terms of absolute numbers as well as diversity (industry and overseas participation in particular). Number of new attendees (41%) is particularly welcome. The tutorial program is strong, although actual attendance is difficult to know until the event. Financial outcome unknown pending negotiations with the hotel (room block will not be met). Attendance (numbers as of 9/28/2009):
221 registrants; We should meet our budgeted registration goal of 226. By type: Full conference, 126; Technical sessions only, 89; Tutorials, 5; Single tutorial, 1. It may be
interesting to see how many people actually attend the tutorials. By seniority of attendance: 10+ years, 47 (21%); 6-10 years, 32 (14%); 2-5 years. 50 (22%); First
time: 90 (41%); unknown, 2; Large number of new or recent attendees is good, and we need to pay attention to retention.
Region of attendance: USA+Canada, 130 (59%); Asia-Pacific, 45 (20%); Europe, 25 (11%); Latin America, 18 (8%); Africa + Middle East, 3 (1%). Registrants for Chapter workshop is 30. Good attendance from overseas is encouraging.
Industry / academia breakdown: Industry/government, 121 (55%); academia, 92 (42%). Number of authors: 95 (43%); Ratio of registrants to papers 1.69, at least as high as at previous IAS
annual Meetings. Good attendance from non-authors is healthy. Five authors registered more than 2 papers, providing an extra $875 in revenue; All 5 are from Asia or
Latin America; the additional fee for presenting more than 2 papers seems to disproportionally affect overseas individuals.
Hotel registrations: 162 attendees booked at the hotel when registering; Of the remaining, 23 are from Houston and 36 chose to stay elsewhere and pay the extra $300 in fee ($11k in revenue).
Registration timing: 93% have registered by September 1st (30% by June 1st). Budget: On the positive side, meeting the budgeted number of registrants is important from a budgetary point of view. However, the room block is far from being met (about 600 room nights compared with 1068 room block). Courtesy is negotiating a lower penalty, or even a waiving of the penalty based on our presence at the same hotel in 2010, and general economic conditions. Technical sessions:
24 sessions, plus a plenary session, for a total of 130 papers. These include 2 sessions from Electrostatic Processes Committees and a Special Session on Arc Flash from Metals Committee (with 1-hour presentations).
Plenary session: Its goal was to bring IAS’ diverse committees together and foster better knowledge of each other, by presenting papers of general interest. Some committees (ILDC and Mining in particular) responded very well and seemed to take advantage of the opportunity, sometimes preparing a special presentation for the occasion (no written paper). Other committees participated less well (I&CPS came on board at the last minute). Preparation presented various minor difficulties,
Center for Advanced Vehicle Technologies The University of Alabama Tuscaloosa, AL 35487
AGENDA ITEM 3.3
including scheduling of committee meetings, and making for more overlap of technical sessions with tutorials than initially anticipated.
Good management by most committees except Appliance Industries (numerous complaints, only one session with 3 papers (versus 3 sessions in 2008). I&CPS delayed response until their Spring meeting was also of some inconvenience.
Program posted on website as an Excel spreadsheet for authors’ convenience (per 2008 experience). Paper template prepared in Word and posted in late May, and shared with ECCE. Could be made
available to other conferences as well.
Paper submission process: Hybrid process with I&CPS Dept. and Mining Committee using ScholarOne, the rest using Conference
Express. The Conference Express system worked very well (after all it is the legacy system). ScholarOne needed attention and worked very well thanks to Louie Powell’s presence and experience. ScholarOne is a good system for those committees which review papers prior to the conference, but needs a presence. The Conference Express system is more tolerant in case of an unresponsive committee than ScholarOne would be.
Having two systems caused relatively little confusion. Maintaining a hybrid system (ScholarOne + Conference Xpress) is recommended for future
years. There is no reason to impose ScholarOne on those committees that don’t want it and don’t need it, however, it is a good system for others.
Tutorial program:
Nine tutorials in two parallel tracks. Technical material printed in a single book. Registration is in a single package, or for a single tutorial. The impact of the latter cannot be
determined yet as this is expected to attract mostly local and last minute attendees. Presenters country of origin: USA, 8; Canada, 1. Origin of tutorial: Houston section, 6; self-nominated, 3. Help of Houston Section has been
outstanding. Number of actual attendees unclear before the conference. Posting of program done June 10; earlier posting would help publicity. Publicity: Relied almost exclusively on email blasts to members of IAS, PELS, PES, and local Section,
and the IAS website. An attempt was made to link with a company called “pdhengineers.com”, which advertises all kind of seminars and typically takes a cut on the registration (business model apparently similar to Expedia for air travel). They posted our program for free as a trial balloon, effect not know yet.
Questions for the longer term: 1) expand publicity reach; 2) Need to develop self-sustaining program; and 3) North America versus internationalization.
Hotel/ Courtesy/Badge Guys/Technical Program Coordinator/IEEE staff/Local committee/Website: Very smooth operation with our volunteers and partners. Other:
Sponsorship: 3 sponsors, all thanks to Sunita Kulkarni of the Houston Section Guest tours: Nothing could be done for guests aside from setting up a room for them at the hotel,
because of a lack of a volunteer to organize beyond this. 18 companions have registered. Respectfully submitted, Bruno Lequesne 2009-2010 IAS President-Elect
ECCE Overview 2009 IAS Annual Meeting, Houston, TX
T. Nondahl 2009-2010 IAS President 04-October-2009
Energy Conversion Congress & Exposition – San Jose, CA
Thur. Noon Awards Luncheon (Expected 350, served 475)
Thur. pm Oral Sessions
Plenary Session Topics
TOPIC #1 Science and Planning for
Low Carbon Electricity System
Daniel M. Kammen – Daniel M. Kammen holds
appointments in the Energy and Resources Group, the Goldman School of Public Policy, and the department of Nuclear Engineering. Kammen is the founding Director of the Renewable and Appropriate Energy Laboratory (RAEL) …
TOPIC #2 How Electric Vehicles Must
Change the Way the Auto Industry Thinks
Martin Eberhard – Founder of TESLA
Motors
Plenary Session Schedule 8:00 AM No lights, then strategic lights and possible screen show; theme
music (logo at crescendo) 8:03 AM Voice of God (VOG) – Ladies and gentleman please welcome
and give a round of applause to Deepak Divan, President of IEEE Power Electronics Society and Tom Nondahl, President of IEEE Industry Applications Society
8:03 AM Music cued as Deepak and Tom walk onto stage 8:04 AM Deepak introduction 8:06 AM Tom introduction 8:08 AM VOG – Introduce Tomy Sebastian, ECCE General Chair 8:09 AM Tomy gives overview of conference 8:15 AM Deepak and Tom declare the conference open 8:16 AM VOG introduces Phil Krein as the co-chair of the Plenary Session
Committee 8:17 AM Introduction of Daniel Kammen, plenary speaker by Phil Krein 8:20 AM Daniel Kammen’s speech and Q&A (?) 9:15 AM VOG introduces Seth Sanders as the co-chair of the Plenary
Session Committee 9:15 AM Introduction of Martin Eberhard, plenary speaker by Seth
Sanders 9:18 AM Martin Eberhard’s speech and Q&A (?) 10:13 AM VOG welcomes Tomy to the stage to provide closing remarks. 10:14 AM Tomy’s remarks 10:15 AM Session concludes
ECCE Student Programs
PELS Grants IAS Zucker Grants Free Registration on Tuesday Student Volunteers
– Microphone runners in sessions – Guides for participants during
ceremonies
Call for Student Volunteers
Session Assistant – Session Assistants will be required to act as room monitors, audiovisual assistants, and runners for their respective sessions. Please plan to arrive 30 minutes before prior to the session and stay 15 minutes after the session.
Room Monitor: – Check that each attendee possesses a badge before they enter the room. There is no need to
check names, but if you see an attendee without a badge, stop them, and ask that they show you their conference badge, or request that they register prior to attending the sessions.
– Provide the Session Chair assistance when needed. Audiovisual Assistant:
– Double check that all presentations are saved on the session computer. – Provide audiovisual assistance to presenters and Session Chairs when needed (i.e. turn on
microphones, start the PowerPoint presentation, troubleshoot). – If a problem arises with which you cannot immediately assist, contact the roaming AV Tech, or
Conference Managers. Runner:
– Provide assistance to conference managers where needed, this may include, but is not limited to the following:
Please note that you may be asked to act as Session Assistant for more than one session if necessary.
All volunteers will receive complimentary ECCE T-Shirt.
Award Presentations
IEEE William E. Newell Power Electronics Award IEEE Richard Harold Kaufmann Award (Ron Harley) IEEE Nikola Tesla Award (Donald Novotny) Fellows (3 PELS, 6 IAS) IEEE Power Electronics Distinguished Service Award Richard M. Bass Outstanding Young Power Electronics
Engineer Award (Ranga Tallam) Gerald Kliman Innovator Award (John Miller) Power Electronics Society Best Chapter Award International Future Energy Challenge Award Power Electronics Society Transactions Prize Paper
Award Power Electronics Society Prize Letter Award
Slide show with pictures from meeting and information about the Societies
IAS Fellows
Committee Concerns
Paper Submission System Barely Worked – All abstracts submitted to the same
place – some papers not directed to the proper committee.
– Pete Wung in charge of fixing it for 2010 Too Few Oral Sessions
– 2010 Hotel is much larger 2010 Schedule conflict with EU Electric
Machines meeting.
Background
Sunday evening – Reorg. of IDC & IPCC Monday am – Special issue of PELS Tran. Monday eve. – IDC votes Tuesday pm – IPCC proposal Tues. eve. – IPCC votes Wed. noon – IAS proposal Wed eve. – Joint transactions
– No IAS membership booth
Zucker Design Contest
Ray Sepe said interest in the Design Contest is waning. – Submissions have gone from 40 to 3 – Had to solicit former winners to get any
contestants Ray also concerned that fewer students
and professors will be interested in attending the Annual Meeting.
Women in Engineering
Slide 1 / Flores / 10.04.2009
2009 IAS Annual Meeting - Women in Engineering Committee Update
Janet Flores Industry Applications Society
WIE Liaison
Women in Engineering
Slide 2 / Flores / 10.04.2009
2009 IAS Annual Meeting - Women in Engineering Committee Update IEEE Bylaws Section I-305. Functions and Membership of the
Standing Committees 20. Women in Engineering Committee. The IEEE Women in
Engineering Committee (WIEC) shall be appointed by and shall report to the IEEE Board of Directors.
The WIEC shall be responsible for facilitating the development of
programs and activities that promote the entry into and the retention of women in engineering programs, enhance the career advancement of
women in the profession, and which promote IEEE membership and retention of IEEE women
Women in Engineering
Slide 3 / Flores / 10.04.2009
Who makes up the committee?
WIEC consists of ten voting members, appointed by the IEEE Board of Directors
• Six members serve three-year staggered terms; one member is an
IEEE Student Member
• Regions and Societies appoint coordinators to assist in the development of related programs and activities.
• IEEE organizational units appoint liaisons.
Women in Engineering
Slide 4 / Flores / 10.04.2009
Current Committee Members
WIE Committee Members • Karen Panetta, WIEC Chair Joan Carletta Jane Lehr Ramalatha Marimuthu Susan Murphy Mary Ellen Randall Jacqueline Speck Irena Atov Evangelia Micheli-Tzanakou Sule Ozev
Women in Engineering
Slide 5 / Flores / 10.04.2009
WIE Liaisons & Coordinators
Nazanin Bassiri-Gharb, IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society Daniece Carpenter, Product Safety Engineering Society Holly Cyrus, Region 2 Coordinator Christine Di Lapi, Broadcast Technology Society Lisa Edge, Reliability Society Janet Flores, Industry Applications Society Allan Johnston, Nuclear and Plasma Sciences Society Carolyn McGregor, Engineering in Medical and Biology Society Bozenna Pasik-Duncan, Control Systems Society Susan H. Perkins, Region 7 Coordinator Darlene Rivera, Region 1 Coordinator Usha Varshney, Electron Devices Society
Women in Engineering
Slide 6 / Flores / 10.04.2009
Mission and Vision of WIE
The WIE Mission: Inspire, engage, encourage, and empower IEEE women worldwide.
The WIE Vision: A vibrant community of IEEE women and men innovating the world of
tomorrow.
Women in Engineering
Slide 7 / Flores / 10.04.2009
WIE Tangibles
WIE has two tangible products 1. IEEE WIE Magazine
1. WIE newsletter
Women in Engineering
Slide 8 / Flores / 10.04.2009
IEEE WIE Magazine
Our first Issue of WIE Magazine
Received 2008 APEX Award for Publication Excellence The WIEC approved the new schedule of the magazine as follow: June 2010- Women reinventing themselves/Entrepreneurship December 2010- Renewable Energy
Women in Engineering
Slide 9 / Flores / 10.04.2009
IEEE WIE Magazine
All WIE Committee Members, WIE Liaisons, and WIE Coordinators are requested to submit the following information to the WIE Magazine:
• Biography • Picture
• Explain why you became an Engineer
• What information or advice you would like to pass on to a young girl • interested in engineering
Women in Engineering
Slide 10 / Flores / 10.04.2009
WIE Membership by Region
Region Count
US 3,485 Canada 431 Europe, Middle East & Africa 2,276 Latin America 2,250 Asia & Pacific 2,434 Total 10,876
Women in Engineering
Slide 11 / Flores / 10.04.2009
WIE Membership Data March 2009
Grade Mar-08 Mar-09 Fellow 41 46 Life Members 119 117 Associates 113 102 Member 1513 1613 Senior Member 286 311 Student 5107 5829 Total 7189 8018
Women in Engineering
Slide 12 / Flores / 10.04.2009
WIE Membership Data March 2009
Gender Mar-08 Mar-09 Female 4721 4952 Male 1927 2360 Not Provided 541 706 Total 7189 8018
Women in Engineering
Slide 13 / Flores / 10.04.2009
PROMOTES member grade advancement for women to the grades of Senior Member and Fellow
Year Elevated Total Fellow Nominations Received
Women Nominations Received
Number of Women Elevated
% Success
2006 785 44 7 15.9%
2007 765 48 18 37.5%
2008 773 47 27 57.4%
2009 757 46 19 41.3%
Women in Engineering
Slide 14 / Flores / 10.04.2009
WIEC Activities and FUN stuff
Meet Monthly via Conference Call. Truly Global Group of People – Affinity groups in schools all over the world. Meet every 1 to 2 Years LIVE: This year was 25 – 26 April 2009 in Orlando,
Florida STAR Program – Inspire future generations of engineers, partner with teachers of
grades K – 12. Promotional give – a – ways Interact with world famous engineers and scientists - During Women In
Engineering forums
Women in Engineering
Slide 15 / Flores / 10.04.2009
WIE 2008 Affinity Group Award (Awarded in June 2009) for Technical & Community Contributions
Approved the IEEE WIE Japan Affinity Group as the recipient to the award. The award provides a certificate and $250US
IEEE WIE Madras Affinity Group received honorable mention. This group received a certificate and $100US
Women in Engineering
Slide 16 / Flores / 10.04.2009
What Can We Do to Help?
FROM LAST MONTH’S CONFERENCE CALL Bassiri-Gharb reported on the IEEE Ultrasonics,
Ferroelectrics, and Frequency Control Society (UFFC). UFFC has agreed to provide $5000 US annually to support WIE activities. Bassiri-Gharb will follow up with WIE Staff to discuss advertising and purchasing magazines.
Women in Engineering
Slide 17 / Flores / 10.04.2009
A GOOD PARTNERSHIP – IEEE
MEMORANDUM OF UNDERSTANDING
THIS MEMORANDUM OF UNDERSTANDING ("MOU") is made this _15_ day of June, 2009__, by and between The Institute of Electrical and Electronics Engineers, Incorporated, a New York not-for-profit corporation (“IEEE”), acting through Industry Applications Society (IEEE-IAS), • Industrial Electronics Society (IEEE-IES), • Power Electronics Society (IEEE-PELS), and • Power and Energy Society (IEEE-PES) • Industry Applications Society ( IEEE – IAS)
and ___Associazione Conferenza ICEM 2010___and sets forth the relationship and obligations relating to the 2010- XIX International Conference on Electrical Machines ICEM 2010 to be held [__September 6 – 8 , 2010_Date___], in Rome, Italy.
1. DURATION OF MOU: This MOU addresses the rights and obligations with respect to the Conference. Although the parties may presently be considering the possibility of future conferences similar in theme or subject matter, no party shall be under any obligation to renew this MOU.
2. SPONSORSHIP: Technical co-sponsorship indicates direct and substantial involvement by the Technical Co-Sponsor solely in the organization of the technical program portion of the Conference. The Parties agree that the financial liability of the Conference is the sole right and responsibility of the Conference. 3. OWNERSHIP OF THE CONFERENCE NAME: The Sponsoring Parties agree and acknowledge that International Conference on Electrical Machines 2010 is the exclusive owner of all rights, title and interest throughout the world to the names 2010- XIX International Conference on Electrical Machines ICEM 2010 and ICEM 2010, including, and without being limited to, all rights in the trademarks, service marks, certification marks, and association marks (“Conference Marks). During the term of this MOU, the Technical Co-Sponsor shall have a non-exclusive, non-transferable, royalty-free license to use the Conference Marks in connection with the Conference. 4. OWNERSHIP OF INTELLECTUAL PROPERTY: The Conference Proceedings are the intellectual property of IEEE The Institute of Electrical and Electronics Engineers 5. INCLUSION IN IEEE CONFERENCE PUBLICATIONS PROGRAM (CPP): The ICEM´10- XIX International Conference on Electrical Machines ICEM 2010 understands that the IEEE co-sponsoring unit has sole discretion to designate which papers accepted for presentation at the Conference shall be eligible for inclusion in the IEEE Conference Publications Program (CPP). ICEM’10 XIX International Conference on Electrical Machines, shall be responsible for all costs of the publishing and distribution by the CPP of such papers in the form of Conference Proceedings. The Technical Co-Sponsors will not pay any acquisition fees related to Conference Proceedings. Furthermore, Parties shall: (a) Ensure such papers accepted for inclusion in the CPP are prepared in IEEE-compatible format according to the procedures available at http://www.ieee.org/portal/pages/pubs/confpubcenter/instructions.html; and (b) Submit such content to IEEE within one (1) week after the Conference end 6. RESPONSIBILITIES OF THE SPONSORING PARTIES: • One copy of the Conference Proceedings will be provided to each Technical Sponsor
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and distributed as follows: one copy to the IES VP for Conference Activities, one to the PELS VP of Meetings, IAS VP of Meetings and one copy to PES’ Executive Director.
• Technical input from a representative from each Technical Sponsor. • Link to the conference and advertisement on the websites of the Technical Sponsors. • IEEE Xplore upload of conference papers: (please note this must be done within 30 days after
the last day of the conference: it is a very strict deadline) Special Notation for IAS Submission to Transactions or Magazine: The Host shall submit conference papers to the IEEE within one (1) month after the Conference ends. If the IEEE does not retain copyright to the papers and proceedings, then IEEE shall have the right to sell copies of the papers and proceedings in the paper, CD, DVD, online or other such media, after the Conference. IEEE shall retain all proceeds from its own sales.
Papers presented at this Conference may be eligible for review for inclusion in the IEEE Transactions on Industry Applications or the Industry Applications Magazine provided they meet certain requirements:
a. The subject of the paper must be within the technical scope of the IEEE Industry
Application Society
b. The author of the paper must request that it be submitted for review.
c. A paper submitted to the conference, but not actually presented, will not be eligible for review. It is the responsibility of the Host to verify the presentation of all papers submitted for review.
It shall be the responsibility of the Host, with the guidance of the IAS Meetings Dept., to create a committee to screen papers meeting the requirements given above. This screening committee should, if possible, be made up of IEEE-IAS members familiar with the requirements of IAS periodicals. Papers selected by the screening committee shall be judged to have a “reasonable chance” of being accepted for one of the IAS periodicals. Further, the selected papers within the scope of any one IAS Technical Committee (TC) shall not number more than 20% of the total number of papers presented at the conference. No paper submitted but not actually presented shall be included in the papers selected for review. The screening committee shall prepare a list of selected papers, including the paper’s title and the name and address of the corresponding author. This list shall be forwarded to the Chair of the IAS Meetings Department promptly after the conference.
Authors shall be advised of this procedure and shall not submit their papers for review prior to the issuing of the list of selected papers. Papers on the list may then be sent to the Editor-in-Chief of the IEEE Transactions on Industry Applications. The Host shall instruct authors to submit their own papers. The Host shall forward two (2) copies of the conference proceedings on CD-ROM to the Chair of the IAS Meetings Department. 7. IEEE MASTER BRAND: Guidelines for use of the IEEE Master Brand and Logotype “IEEE” can be found on the IEEE Web site at www.ieee.org/web/publications/rights/idstandards.html 8. INDEMNITY: Each Sponsoring Party shall indemnify and hold harmless the other Sponsoring Party from and against any and all claims, demands, liabilities, settlements, damages, costs, and expenses, including reasonable attorneys’ fees and expenses, arising out of, or in any way connected with, any default, breach or
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negligent non-performance of this MOU or any negligent act or omission on the part of itself, its agents and employees arising out of this MOU. 9. PROPRIETARY OR CONFIDENTIAL INFORMATION: Neither party shall disclose to a third party Proprietary or Confidential Information of the other party. Each party further agrees to act as trustee for any Confidential Information jointly created or acquired through the parties’ participation in this MOU. 10. GENERAL TERMS AND CONDITIONS: Binding Effect: This MOU shall inure to the benefit of, and be binding upon, the Sponsoring Parties, their successors in interest, legal representatives, and assigns. Assignment: None of the Sponsoring Parties may assign or transfer neither its interest in this MOU, nor any interest herein or claim hereunder without the express written consent of the other Sponsoring Parties. Complete MOU: This MOU constitutes the entire agreement among the parties and supersedes all other prior MOUs of the parties for the period to which it applies and may not be modified except in writing signed by the parties. Notices: Any notice given under this MOU to any of the Sponsoring Parties may be effected by: (i) email or, (ii) facsimile, receipt of which is confirmed by facsimile confirmation. Counterparts: This MOU may be executed simultaneously in two or more counterparts, each of which shall be deemed an original, but all of which together shall constitute one and the same instrument. If either party uses a scanned or facsimile transmittal, that copy shall be deemed to be an original. IN WITNESS WHEREOF, this MOU is executed by the parties hereto by their respective undersigned and authorized officers as of the date first written above. The Institute of Electrical and Electronics Engineers, Incorporated acting through Its Industry Applications Society (IEEE-IAS) Industrial Electronics Society (IEEE-IES)
Authorized Signature
Authorized Signature
R. Mark Nelms Print Name
John Y. Hung Print Name
Title IAS Meetings Department Chair Title Vice-President for Conference Activities
ECE Department, 200 Broun Hall Auburn University, AL 36849-5201 USA Mailing Address
200 Broun Hall Auburn University, AL 369849-5201 U.S.A. Mailing Address
The Institute of Electrical and Electronics Engineers, Incorporated _____________________________ IEEE Authorized Signature _____________________________ Print Name _____________________________ Title
The Institute of Electrical and Electronics Engineers, Incorporated (IEEE)
IEEE Authorized Signature
Print Name
Title
Mailing Address
Phone
Email
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Instructions for completing a Technical Co-Sponsor MOU
Opening Paragraph
Fill in the date, name of the Sponsoring Parties and the name and date of the event (If this is a multi-year MOU, just fill in the Name of the event)
IEEE OU can be a Society, Region, Section, Chapter or Council
Non- IEEE Co-sponsoring parties CAN NOT be a “For profit:” organization
If there are more than two sponsoring parties, please edit the first paragraph to allow for the names of the other parties
Section 1 – Duration of MOU: If this is a multi-year MOU, please edit this section to reflect the duration of the MOU.
Section 3 – Ownership of the Conference Name: - Fill in the name of the sponsoring party that is the exclusive owner of the Conference name
Section 4 – Ownership of Intellectual Property: Fill in the name of the sponsoring party that owns the Intellectual Property (only one party can own the intellectual property)
Section 5 – Inclusion in IEEE Confernce Publications Program (CPP): Fill in the name of the non IEEE sponsor
Section 6 – Responsibilities of the Sponsoring Parties: To be completed by the sponsoring parties
At a minimum, describe the provisions for dissolving the relationship
For example:
This MOU may not be terminated except by written consent of all parties. Upon termination or non-renewal of this MOU, no Sponsoring Party may use, license, create derivative works, or exploit in any way the jointly owned works without the written consent of the other parties.
Or
Multiyear MOUs: This relationship may be dissolved by either party after giving the other notice in writing no later than nine (9) months prior to the next conference date. Upon termination or non-renewal of this MOU, no Sponsoring Party may use, license, create derivative works, or exploit in any way the jointly owned works without the written consent of the other parties.
Signatures:
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The signing parties should be the appropriate individuals from each sponsoring party that has the authority to make the commitment for the MOU
Technical Co-Sponsor MOU – September 2009 IEEE IAS and PCIC Europe
1
TECHNICAL CO-SPONSORSHIP
MEMORANDUM OF UNDERSTANDING
Between the
IEEE Industry Applications Society
and
Petroleum and Chemical Industry Committee Europe
THIS MEMORANDUM OF UNDERSTANDING (“MOU”) is made this 15 day of September, 2009, by and between The Institute of Electrical and Electronics Engineers, Incorporated, a New York not-for-profit corporation (“IEEE”), on behalf of the Industry Applications Society (“IEEE Unit”) and Petroleum and Chemical Industry Committee (PCIC) Europe (“Host” and together with the IEEE Unit collectively referred to as “Sponsoring Parties”) and sets forth the relationship and obligations relating to the annual PCIC Europe conference 1 (the “Conference”). The PCIC Europe is an Association registered under Swiss Law in Wichtrach Switzerland, and whose purpose is the organization of an annual Petroleum and Chemical Industry Conference in Europe.
1. TERMS OF MOU
1.1 Purpose. The purpose of the annual PCIC Europe conference is the exchange of experience in the practical application of electricity and instrumentation in the petroleum, chemical and pharmaceutical industries.
1.2 Duration of MOU. This MOU addresses the rights and obligations with respect to the annual Conference for a period of five years beginning with the 2010 conference. Although the parties may presently be considering the possibility of future conferences similar in theme or subject matter, no party shall be under any obligation to renew this MOU.
2. SPONSORSHIP
2.1 The IEEE Industry Applications Society (IAS) shall be a technical co-sponsor of the Conference. Technical co-sponsorship indicates direct and substantial involvement by the IAS solely in the organization of the technical program portion of the Conference. This level of sponsorship allows for use of the IEEE, IAS, and PCIC logos, but not use of the IEEE name in conjunction with the Conference Name. The Parties agree that the revenues and expenses of the Conference are the sole right and responsibility of the Host.
2.2 The Sponsoring Parties shall encourage each party's members to submit papers and attend the Conference. The IEEE-IAS approves inclusion of the proceedings for the Conference in the IEEE Conference Publications Program (CPP), which includes distribution
1 Technical co-sponsorship conferences cannot use the IEEE name in the title (Policy 10.1.16).
Technical Co-Sponsor MOU – September 2009 IEEE IAS and PCIC Europe
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via IEEE Xplore. The Host shall assure compliance with IEEE Policy regarding format for inclusion of papers and/or proceedings in IEEE Xplore and shall bear complete financial responsibility for all expenses associated with the implementation of the papers and/or proceedings in IEEE Xplore. The Industry Applications Society shall be responsible for all costs of distribution by the CPP of such papers. The IEEE will not pay any acquisition fees related to the conference proceedings.
The paper review process for this conference begins with the selection of abstracts. All PCIC Europe Committee members review the abstracts and submit a written ballot. Criteria considered in the abstract review process are interest to attendees and past experience with the author. In addition, preference is given to abstracts written by individuals who are an end-users of technical equipment. A draft technical paper is prepared for each selected abstract, which is reviewed by at least two persons, mainly members of the PCIC Europe Committee but other engineers may be utilized in the review process. Papers are reviewed for technical accuracy as well as overt commercialism. Reviewer comments are returned to the authors. The final version of the paper is reviewed again to ensure that the authors addressed reviewer comments.
2.3 The Host shall submit conference papers to the IEEE within one (1) month after the annual Conference ends. PCIC Europe will retain copyright of the papers presented at the annual Conference. The IEEE shall have the right to sell copies of the papers and proceedings in paper, CD, DVD, online or other such media, after the annual Conference. IEEE shall retain all proceeds from its own sales.
Papers presented at this Conference may be eligible for review for inclusion in the IEEE Transactions on Industry Applications or the Industry Applications Magazine provided they meet certain requirements:
a. The subject of the paper must be within the technical scope of the IEEE Industry Application Society.
b. The author of the paper must request that it be submitted for review.
c. A paper submitted to the conference, but not actually presented, will not be eligible for review. It is the responsibility of the Host to verify the presentation of all papers submitted for review.
It shall be the responsibility of the Host, with the guidance of the IAS Meetings Dept., to create a committee to screen papers meeting the requirements given above. This screening committee should, if possible, be made up of IEEE-IAS members familiar with the requirements of IAS periodicals. Papers selected by the screening committee shall be judged to have a “reasonable chance” of being accepted for one of the IAS periodicals. Further, the selected papers within the scope of any one IAS Technical Committee (TC) shall not number more than 20% of the total number of papers presented at the conference. No paper submitted but not actually presented shall be included in the papers selected for review. The screening committee shall prepare a list of selected papers, including the paper’s title and the name and address of the corresponding author. This
Technical Co-Sponsor MOU – September 2009 IEEE IAS and PCIC Europe
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list shall be forwarded to the Chair of the IAS Meetings Department promptly after the conference.
Authors shall be advised of this procedure and shall not submit their papers for review prior to the issuing of the list of selected papers. Papers on the list may then be sent to the Editor-in-Chief of the IEEE Transactions on Industry Applications. The Host shall instruct authors to submit their own papers.
The Host shall forward two (2) copies of the conference proceedings on CD-ROM to the Chair of the IAS Meetings Department.
2.4 Each Sponsoring Party will appoint members from its respective society who will represent the Sponsoring Party on the Technical Program Committee of the Conference.
3. SPONSORING PARTIES SUPPORT OF PROMOTIONAL ACTIVITIES
Each Sponsoring Party shall contribute their services toward the publicity for this Conference. The Host will forward to the Chair of the IAS Meetings Department a URL for the conference website as soon as it is available. A link to the Conference will be placed on the IAS website as soon as the information is received.
The Host grants permission to the IAS to have a booth at the PCIC Europe conference for the purpose of selling IEEE standards and promoting IAS membership. The Host will provide space for the IAS to set up their booth if requested by the IAS to do so. If requested, the IAS PCIC will provide space for a booth at its annual conferences for PCIC Europe to advertise for its conference. In addition, the Sponsoring Parties will also provide time, if requested, in their Chairmen's' address to the conference attendees for advertising the conference of the other party.
4. INTELLECTUAL PROPERTY
4.1 The Sponsoring Parties agree and acknowledge that Host is the exclusive owner of all rights, title and interest throughout the world to the name “PCIC Europe Conference”, including, without being limited, to all rights in the trademarks, service marks, certification marks, and association marks (“Conference Marks”). During the term of this MOU, IEEE shall have a non-exclusive, non-transferable, royalty-free license to use the Conference Marks in connection with the Conference. IEEE agrees to cooperate with Host in obtaining registration of the Conference Marks and to execute any documents and take any actions that may be necessary to enable Host to secure registration of and enforce rights in the Conference Marks.
4.2 All advertising materials, advance programs, final programs, and calls for participation shall feature the names and/or logos of the Sponsoring Parties equally so as not to suggest any priority or preemption as between the Sponsoring Parties. During the term of this MOU, each Sponsoring Party grants a non-exclusive, royalty-free, worldwide license to the other Sponsoring Party to use its name and logo in connection with the advertising and promotion of the Conference. The graphic design in common use by each of the Sponsoring Parties shall be used in an equal fashion on printed material in connection with the Conference
Technical Co-Sponsor MOU – September 2009 IEEE IAS and PCIC Europe
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as well. Guidelines for use of the IEEE Master Brand Image and Logotype “IEEE” can be found on the IEEE Web site at www.ieee.org/web/publications/rights/idstandards.html.
5. INDEMNITY
Each Sponsoring Party shall indemnify and hold harmless the other Sponsoring Party from and against any and all claims, demands, liabilities, settlements, damages, costs, and expenses, including reasonable attorneys’ fees and expenses, arising out of, or in any way connected with, any default, breach or negligent non-performance of this MOU or any willful or negligent act or omission on the part of itself, its agents and employees arising out of this MOU.
6. PROPRIETARY OR CONFIDENTIAL INFORMATION
“Confidential Information” as used herein means information identified by either party as “Confidential” and/or “Proprietary,” or information that, under the circumstances, ought reasonably be treated as confidential and/or proprietary. “Confidential Information” shall include, but not be limited to, this MOU its Attachments, exhibitor lists, key contacts lists, technical information, market research, membership data, analyses, studies, developments, processes, present and/or future product information, pricing information, business plans or other documents, information and materials that contain or reflect such information. Neither party shall disclose to a third party Confidential Information of the other party. The receiving party shall use the same degree of care as it uses to protect the confidentiality of its own confidential information of like nature, but no less than a reasonable degree of care, to maintain in confidence the Confidential Information of the disclosing party. Each party further agrees to act as trustee for any Confidential Information jointly created or acquired through the parties’ participation in this MOU. The foregoing obligations shall not apply to any Confidential Information that: (a) can be demonstrated to have been publicly known at the time of the disclosing party’s disclosure of such Confidential Information to the receiving party; (b) becomes part of the public domain or publicly known, by publication or otherwise, not due to any unauthorized act or omission by the receiving party; (c) can be demonstrated to have been independently developed or acquired by the receiving party without reference to or reliance upon such Confidential Information; (d) is provided to the receiving party by a third party who is under no obligation to the disclosing party to keep the information confidential; or (e) is required to be disclosed by law, provided that the receiving party takes reasonable and lawful actions to avoid and/or minimize such disclosure and promptly notifies the disclosing party so that the disclosing party may take lawful actions to avoid and/or minimize such disclosure.
7. TERMINATION
This MOU may not be terminated except by written consent of all parties. Upon termination or non-renewal of this MOU, no Sponsoring Party may use, license, create derivative works, or exploit in any way the jointly owned works without the written consent of the other parties.
8. MISCELLANEOUS
8.1 Binding Effect. This MOU shall inure to the benefit of, and be binding upon the Sponsoring Parties, their successors in interest, legal representatives, and assigns.
Technical Co-Sponsor MOU – September 2009 IEEE IAS and PCIC Europe
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8.2 Assignment. None of the Sponsoring Parties may assign or transfer its interest in this MOU, nor any interest herein or claim hereunder without the express written consent of the other Sponsoring Parties.
8.3 Waiver. Any waiver of a breach of any provision of this MOU shall not operate or be construed as a waiver of any subsequent breach.
8.4 Governing Law. This MOU shall be interpreted under and governed by the laws of the State of New York, without reference to its conflicts of laws principles.
8.5 Dispute Resolution. Any controversy or claim arising out of or relating to this MOU shall be settled by arbitration in accordance with the rules of the American Arbitration Association. Such arbitration shall occur in New York City and be conducted by one arbitrator, jointly chosen by the Sponsoring Parties. Any such decision of the arbitrator shall be binding upon the parties.
8.6 Survival. All rights and obligations provided in this MOU which do not expressly terminate pursuant to this MOU, shall survive the expiration or termination of this MOU and shall remain in full force and effect after termination or expiration.
8.7 Headings. Headings used in this MOU are for reference purposes only and shall not be deemed a part of this MOU.
8.8 Severability. If any provisions or portions of this MOU are invalid under any applicable statute or rule of law, they are to that extent to be deemed omitted from this MOU and replaced by provisions or portions thereof which are as close to the original provisions as possible while being legally permissible. The other provisions or portions(s) of provisions of this MOU shall remain enforceable and unaffected.
8.9 Complete MOU. This MOU constitutes the entire agreement among the parties and supersedes all other prior MOUs of the parties for the period to which it applies and may not be modified except in writing signed by the parties.
8.10 Notices. Any notice given under this MOU to any of the Sponsoring Parties may be effected by : (i) personal delivery in writing, (ii) facsimile, receipt of which is confirmed by facsimile confirmation, or (iii) registered or certified mail, postage prepaid, return receipt requested, and shall be deemed communicated as of actual receipt. Mailed notices and any other communications among the Sponsoring Parties shall be addressed as set forth below, but any of the parties may change its address by giving written notice of such to the other parties:
To IEEE Unit: NAME: R. Mark Nelms ADDRESS: ECE Department, 200 Broun Hall CITY, STATE, POSTAL CODE: Auburn University, AL 36849-5201 USA ATTENTION: PHONE: 334-844-1830 FACSIMILE: 334-844-1809 E-MAIL: [email protected]
Technical Co-Sponsor MOU – September 2009 IEEE IAS and PCIC Europe
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With a copy to: IEEE Conference Contracts 445 Hoes Lane Piscataway, NJ 08855 Attention: Facsimile: +1 732 465 6447 Email: [email protected]
IEEE INDUSTRY APPLICATIONS SOCIETY Bruno Lequesne President-Elect Date: September 28, 2009 Revised Oct. 15, 2009, with final statistics from IAS 09 meeting To: IAS Board Members Subject: President-Elect Report to the IAS Executive Board Meeting to be held on October 5, 2009 What follows are preliminary statistics and comments concerning the 2009 Annual Meeting. Salient points are in bold. In overall summary, registration numbers are encouraging, especially given the difficult economic times, in terms of absolute numbers as well as diversity (industry and overseas participation in particular). Number of new attendees (41%) is particularly welcome. The tutorial program is strong, although actual attendance is difficult to know until the event. Financial outcome unknown pending negotiations with the hotel (room block will not be met). Attendance (numbers as of 10/02/2009):
• 258 registrants; We met our budgeted registration goal of 226. • By type: Full conference, 149; Technical sessions only, 96; Tutorials, 11; Single tutorial, 2. It may
be interesting to see how many people actually attend the tutorials. • By seniority of attendance: 10+ years, 50 (22%); 6-10 years, 33 (14%); 2-5 years. 55 (23%); First
time: 95 (37%); unknown, 25. There were 120 first-time attendees at the larger 2008 meeting. Large number of new or recent attendees is good, and we need to pay attention to retention.
• Region of attendance: USA+Canada, 149 (58%); Asia-Pacific, 51 (20%); Europe, 30 (12%); Latin America, 21 (8%); Africa + Middle East, 7 (3%). Registrants for Chapter workshop is 30. Good attendance from overseas is encouraging.
• Industry / academia breakdown: Industry/government, 135 (52%); academia, 114 (44%). • Number of authors: 97 (42%); Ratio of registrants to papers 1.69, at least as high as at previous IAS
annual Meetings. Good attendance from non-authors is healthy. • Five authors registered more than 2 papers, providing an extra $875 in revenue; All 5 are from Asia or
Latin America; the additional fee for presenting more than 2 papers seems to disproportionally affect overseas individuals.
• Membership: 152 registrants are members of IAS or of a sister society (59%), 47 (18%) members of IEEE, 12 (5%) life members. 24 (9%) are registered as students. Only 19 (7%) are non-members.
• Hotel registrations: 176 attendees booked at the hotel when registering; Of the remaining, 27 are from Houston and 47 chose to stay elsewhere and pay the extra $300 in fee ($11k in revenue).
• Registration timing: 78% have registered by September 1st (15% by June 1st). Budget: On the positive side, meeting the budgeted number of registrants is important from a budgetary point of view. However, the room block is far from being met (about 700 room nights compared with 1068 minimum roo-nights). Courtesy is negotiating a lower penalty, or even a waiving of the penalty based on our presence at the same hotel in 2010, and general economic conditions. Technical sessions:
• 24 sessions, plus a plenary session, for a total of 130 papers. These include 2 sessions from Electrostatic Processes Committees and a Special Session on Arc Flash from Metals Committee (with 1-hour presentations).
Center for Advanced Vehicle Technologies The University of Alabama Tuscaloosa, AL 35487
AGENDA ITEM 3.3
• Plenary session: Its goal was to bring IAS’ diverse committees together and foster better knowledge of each other, by presenting papers of general interest. Some committees (ILDC and Mining in particular) responded very well and seemed to take advantage of the opportunity, sometimes preparing a special presentation for the occasion (no written paper). Other committees participated less well (I&CPS came on board at the last minute). Preparation presented various minor difficulties, including scheduling of committee meetings, and making for more overlap of technical sessions with tutorials than initially anticipated.
• Good management by most committees except Appliance Industries (numerous complaints, only one session with 3 papers (versus 3 sessions in 2008). I&CPS delayed response until their Spring meeting was also of some inconvenience.
• Program posted on website as an Excel spreadsheet for authors’ convenience (per 2008 experience). • Paper template prepared in Word and posted in late May, and shared with ECCE. Could be made
available to other conferences as well.
Paper submission process: • Hybrid process with I&CPS Dept. and Mining Committee using ScholarOne, the rest using Conference
Express. The Conference Express system worked very well (after all it is the legacy system). ScholarOne needed attention and worked very well thanks to Louie Powell’s presence and experience. ScholarOne is a good system for those committees which review papers prior to the conference, but needs a presence. The Conference Express system is more tolerant in case of an unresponsive committee than ScholarOne would be.
• Having two systems caused relatively little confusion. • Maintaining a hybrid system (ScholarOne + Conference Xpress) is recommended for future
years. There is no reason to impose ScholarOne on those committees that don’t want it and don’t need it, however, it is a good system for others.
Tutorial program:
• Nine tutorials in two parallel tracks. • Technical material printed in a single book (courtesy of Aramco). • Registration is in a single package, or for a single tutorial. The impact of the latter cannot be
determined yet as this is expected to attract mostly local and last minute attendees. • Presenters country of origin: USA, 6; Canada, 2; Europe: 1. • Origin of tutorial: Houston section, 6; self-nominated, 3. Help of Houston Section has been
outstanding. • Number of actual attendees unclear before the conference. • Posting of program done June 10; earlier posting would help publicity. • Publicity: Relied almost exclusively on email blasts to members of IAS, PELS, PES, and local Section,
and the IAS website. An attempt was made to link with a company called “pdhengineers.com”, which advertises all kind of seminars and typically takes a cut on the registration (business model apparently similar to Expedia for air travel). They posted our program for free as a trial balloon, effect not know yet.
• Questions for the longer term: 1) expand publicity reach; 2) Need to develop self-sustaining program; and 3) North America versus internationalization.
Hotel/ Courtesy/Badge Guys/Technical Program Coordinator/IEEE staff/Local committee/Website: Very smooth operation with our volunteers and partners. Other:
• Sponsorship: 3 sponsors, all thanks to Sunita Kulkarni of the Houston Section • Guest tours: Nothing could be done for guests aside from setting up a room for them at the hotel,
because of a lack of a volunteer to organize beyond this. 18 companions have registered.
Respectfully submitted, Bruno Lequesne 2009-2010 IAS President-Elect
THE INSTITUTE OF ELECTRICAL AND ELECTRONIC ENGINEERS, INC.
Attention: IAS Executive Board Members Subject: Report to Executive Board Location: Remote
• Web site support and Electronic Communications have been completely handed off to Ranga – have not done anything on the web site in months.
• As a corresponding member of the TAB Strategic Planning Committee I will be attending my first web-conference meeting on Sunday October 18. The goal of this committee is to develop long-range plans in conjunction with the IEEE Strategic Planning Committee and to monitor the performance of TAB in achieving the goals set in the Operational Plan. I will report on the results of the meeting next quarter.
• Following input from the Q2 meeting, and working with IEEE staff involved in the member survey process, a final survey was created and posted on the web. We advertised the survey thru the web site as well a several email blasts. We had 1536 respondents which is a pretty solid turn out. The survey had one major flaw in that it indicated in the opening comments that users could input their own general comments at the end however there was no place to do this. A few members sent email with comments. Also due to the technology used (and my general inability to spell without a spell checker), there were several spelling mistakes in the survey which many took glee in pointing out. The raw results have been organized and tabulated in a more readable form in the attached Excel sheet along with some of my personal observations.
• Respectfully submitted, Blake Lloyd IEEE/IAS Vice President
PART 1 - IAS Statement of Revenue and Expenses, January 1, 2008 to December 31, 2008
From TAB Summary Report Dated June 19, 2009
Revenue
Periodical Sales 976,000$
Non-Periodical Sales 8,800$
Meetings/Conferences 3,303,100$
Committee/Other 200$
Total Revenue 4,288,100$
Expenses
Investment Returns 2,320,100$
Periodical Related 556,200$
Non-Periodical Related 28,100$
Meetings/Conferences 2,091,400$
Administration 387,700$
Committee/Other 369,000$
Total Expenses 5,752,500$
Net Surplus (Deficit) (1,464,400)$
PART 2 - IAS Balance Sheet as of December 31, 2008
From TAB Summary Report Dated June 19, 2009
Assets
Accounts Receivable 472,000$
Loans/Advances Receivable 192,000$
Prepaid Expenses (5,000)$
Fixed Assets 1,000$
Pooled Assets 2,645,000$
Total Assets 3,305,000$
Liabilities
Accounts Payable -$
Deferred Income 180,000.00$
Total Liabilities 180,000$
Net Worth 3,125,000$
Treasurer's Report to the IAS Executive Board - October, 2009
Page 2 of 6
PART 3 - IAS Statement of Revenue and Expenses, January 1, 2009 to August 31, 2009
From TAB Summary Report Dated September 09, 2009
Revenue
Periodical Sales 772,500$
Non-Periodical Sales -$
Meetings/Conferences 184,500$
Committee/Other -$
Total Revenue 957,000$
Expenses
Investment Returns -$
Periodical Related 421,100$
Non-Periodical Related 21,600$
Meetings/Conferences 23,100$
Administration 309,000$
Committee/Other 81,000$
Total Expenses 855,800$
Net Surplus (Deficit) 101,200$
PART 4 - IAS Balance Sheet as of June 30, 2009
From TAB Summary Report Dated July 14, 2009
Assets
Accounts Receivable 472,000$
Loans/Advances Receivable 202,000$
Prepaid Expenses -$
Fixed Assets 1,000$
Pooled Assets 2,712,000$
Total Assets 3,387,000$
Liabilities
Accounts Payable -$
Deferred Income -$
Total Liabilities -$
Rounding Error 1,000$
Net Worth 3,388,000$
Treasurer's Report to the IAS Executive Board - October, 2009
Page 3 of 6
2004 Actual 2005 Actual 2006 Actual 2007 Actual 2008 Actual 2009 Budget
Treasurer's Report to the IAS Executive Board - October, 2009
Part 6 - Year 2009 Executive Board Budget/Expense Summary
As of August 31, 2009
Page 5 of 6
Fund 1316 Fund 1317
Beg Fund Balance 726,704$ 330,595$
Contributions - -
Dividends and Interest 20,969$ 9,644$
Net Unreal/Real Gain/(Loss) (232,634)$ (103,216)$
Total Income (211,666)$ (93,571)$
Awards, Medals / Certificates/ Mtg 14,843$ -
Admin and Other 3,404$ 1,550$
Special Projects and Grants - -
Total Expenses 18,247$ 1,550$
Ending Fund Balance 496,790$ 235,473$
Fund 1316 Fund 1317
Beg Fund Balance 496,790$ 235,473$
Contributions -$ -$
Dividends and Interest 6,799$ 3,123$
Net Unreal/Real Gain/(Loss) 14,040$ 6,256$
Total Income 20,838$ 9,379$
Awards, Medals / Certificates/ Mtg 1,766$ -$
Admin and Other 1,843$ 873$
Special Projects and Grants -$ -$
Total Expenses 3,609$ 873$
Ending Fund Balance 514,020$ 243,979$
Charges against 1317 are $873 in custodial fees.
Charges against 1316 include travel reimbursement for 3 students for $369.07, $369.00
and $600.00 in July 2009 and
$400.00 Cash Award (Feb 2009) for the recipient of the 2008 IEEE IAS Zucker Design
and $1,843 in custodial fees.
Treasurer's Report to the IAS Executive Board - October 2009
IEEE Foundation
Myron Zucker Student Fund & Student Faculty Grant Program Fund
For the Year ended 31-Dec-08.
IEEE Foundation
Myron Zucker Student Fund & Student Faculty Grant Program Fund
For the Eight Months ended 31-Aug-09.
Page 6 of 6
IEEE INDUSTRY APPLICATIONS SOCIETY Thomas A. Nondahl President Date: October 1, 2009 To: IAS Board Members: Subject: President’s Report to the IAS Executive Board Meeting to be held on October 5, 2009 Appointments and Nominations: − Nominated Mark Mirolli to the editorial board of the Transaction on Sustainable Energy (Aug. 2009). IAS is a
10% financial co-sponsor of the publication. − Approved a request on June 24, 2009 from Santo (Sandy) Mazzola, the chair of the Long Island Section to Split
the New York/Long Island Joint Sections Power & Energy, Industry Applications Joint Societies Chapter into: 1. New York Section Power & Energy, Industry Applications Joint Societies Chapter. This chapter will retain the current Account number, Geo Code, and Chapter Chair (Ajoy Das). 2. Long Island Section Power & Energy, Industry Applications Joint Societies Chapter. This chapter will be created as a new joint chapter. The Chapter Chair will be Steven Rubin
− Approved a request to form the Centro Occidente Section Industry Applications Society Chapter (June 2009). − Approved a New Geographic Unit Approval Request for the IEEE Honduras Section Industry Applications
Society Chapter (July 2009). − Approved a request from Hungary Section Chair Kadar Peter to add the Power Electronics Society to the
existing Hungary Section Industry Applications Society Chapter (Aug. 2009). − Approved formation of the IEEE Universidad Tecnologica de Panama Industry Applications Society Student
Branch Chapter (Aug 2009). − Approved a request to add the Industry Applications Society to the existing Bolivia Section Power & Energy
Society Chapter (Sep. 2009). − Nominated Bob Lorenz to replace Tim Haskew on the IEMDC steering committee (Sep. 2009).
Intersociety Cooperation Opportunities: − EMC Society Request – looking for areas such as joint sessions or seminars General Items: − Volunteer training videos are available at www.ieee.org/go/volunteertraining. − The bank account for the 2008 IEEE IAS Annual Meeting is closed. The surplus is nearly $100,000. − Added about 80 key words to the IEEE Technology Navigator system during July 2009. − The board held its first all-electronic meeting on June 29, 2009. − The IAS financial analyst and I reviewed the 2009 IAS budget to prepare for IEEE Board approval of
the final IAS donation to the James Rucks fund. The IEEE board will vote on it in November. − The final council vote for 2010 board members had a response rate of 44%. That is much better than
we have ever had in recent years but still below the 50% level set by IEEE. We will discuss how to increase participation at the October board meeting.
Trips Planned for the remainder of 2009 − IAS Annual Meeting in Houston, TX on Oct. 4-8. − ICEMS on Nov. 15-18 in Tokyo, Japan. − IEEE TAB meeting in New Brunswick, NJ on Nov. 19-21.
Rockwell Automation 1201 South Second Street Milwaukee, WI 53204 414-382-0237 [email protected]
Trips: − I gave two talks at the Region 8 Chapters Workshop on Sept. 6-8 in Sweden. The workshop
presented best practices on Sunday, had wind power talks on Monday, and took a tour to a wind power expo on Tuesday. There were about 30 attendees on Sunday and 50 on Monday.
− I attended ECCE 2009 the week of Sep. 20th. It was a very dynamic and superbly organized event. Tomy Sebastian, the general chair, anticipates the meeting will generate a surplus. There were almost 750 attendees, 500 papers, and 25 vendor booths. Several IAS members were honored: Donald Novotny received the Tesla Award, Ron Harley received the Kaufmann Award, John Miller received the Kliman Award, and six IAS members received Fellows certificates.
Several things happened at ECCE that will require attention from the IAS Board. Two of the IAS technical committees voted to merge with their counterparts in PELS. This action is not effective unless approved the IAS Executive Board. Since such actions could have a profound effect on those technical committees and IAS publications, I intend to ask the board to approve a special committee that will make recommendations to guide us as we explore further cooperation with PELS. The IAS committee with work with a sister committee from PELS to determine: 1. The structure of joint technical committees that could be shared between PELS and IAS. 2. The formation of a journal or other mechanism to jointly publish the papers reviewed by the joint committees. 3. Harmonization of IAS and PELS publication rules for the papers approved by the joint committees. 4. The society which will serve as the manuscript central host for each joint committee. 5. Rules for selection of technically sponsored conferences that will provide papers to the joint committees. 6. Any other items that may arise. In performing these tasks the IAS & PELS committees will provide 1. Updates on progress at each IAS Board Meeting and each PELS Adcom meeting. 2. Statistics on transactions publications by their respective technical committees in the recent past to serve as a guideline for the equitable distribution of income. 3. Estimates of the financial impact to IAS and PELS of all recommended actions. 4. A list of recommendations that will be presented to the IAS and PELS governing boards for approval. The IAS committee would have the following structure: Chair: Bruno Lequesne, IAS President-Elect Vice Chair: Giovanna Oriti, 2010 Industrial Power Conversion Committee Chair Members: Uday Despande, 2010 Industrial Drives Committee Chair Lixiang Wei, 2010 Industrial Power Converter Committee Chair Members receiving correspondence only: 2010 Electric Machines Committee Chair 2010 Power Electronic Devices and Components Committee Chair Respectfully Submitted, Thomas A. Nondahl
Process Industries Department
1
PID 3rd Quarter Report
IAS Board MeetingHouston, TX
October 4-5, 2009David B. Durocher, Senior Member IEEE
Process Industries Department ChairmanIEEE Industry Applications Society
• Significant/noteworthy achievements of the Committees, or members
• Updated IAS web site for all PID committees (need to finalize PCIC)• Lanny Floyd is our new PID Paper Review Chair• Very well run Technical Committees/Conferences
PPIC: Drop off of Industry Producers…Conference Year Location Industry Engineers
2005 Jacksonville, FL 472006 Appleton, WI 482007 Williamsburg, VA 492008 Seattle, WA 452009 Birmingham, AL 22
Process Industries Department
4
CIC: Driving for Electrical Relevance…Question 4: Which subject areas do you feel were the least important to
you?• Drives• I’m not electrical• Electrical stuff• Drives, cement strength discussions• Automation• Power Distribution• Electrical and Controls• Electrical Power and Cogen• Electrical – Not my expertise• Power• Probably the Drive/Electrical parts because I’m a process guy.• Poster Papers• Environmental, Alternate Fuels/Materials, PCA Economic Outlook • Power Generation, Distribution and Related Products• Automation• Drives• Automation• Power Distribution• Historical Overviews• Power Generation• Drives• Automation
Question 3: Which subject areas do you feel were the most important to you?• Environmental Workshop, General Practices• Waste Heat Power, Environmental (Hg), Alternative Fuels• Alternative Fuels• Environmental Session• Environmental and Operational Papers, Ed Sullivan, and Cooler Discussion• Improvement ideas for existing operations• Environmental, especially on Mercury topic and CO2, Grinding Technology
HPGR, Grinding Technology, Ball Mill Scanner• Actual operating experience with currently available OEM equipment• Environmental session helped explain things, tutorial was great too• Environmental, Plant operating items• Emissions and Climate• The area on General Practices and Environmental Workshop, Ed Sullivan
presentation• Environmental • General Practices and Cooler Roundtable• Environmental impacts on industry• The environmental work group gave the most useful and relevant information,
in light of the new changes• Material Handling Technology sessions (numerous)• General Practices, Environmental• Environmental• The environmental and cooler workshops were very applicable• Environmental workshop was outstanding. That addition added value to the
conference.• Power Distribution and Safety and Drives• Technical sessions to includeMACT, Environmental STDS (proposed), Hex
chrome• The Automation papers portion of the conference• Environmental – General Practices• General Practices• The NESHAP input was very timely
Process Industries Department
5
S1 UpdatePID
• ESW - Did not use S1in 2009• CIC - Proceedings via Conference Services, considering S1for awards• PPIC - Proceedings external, 2009: Used MSC for awards• PCIC – S1 used for 2009 conference• Mining – S1for 2009 Annual Meeting• Metal - Conference Services for 2009, S12010
Process Industries Department
6
Growth and Development InitiativesPID
• Activities/Plans for growth & development of– Active membership (separate by academic/industrial, region, etc. as appropriate)
• PID: Expand IAS Membership base via access to technical papers in IEEE Xplore• Zucker Write-up • Metal & Mining IC: Expand user involvement, Committee teleconference sessions
– Conferences (attendance, attendee/author ratio, # of papers, etc.)• CIC Formation of additional Working Group: Environmental, Energy and Sustainability• PPIC Formation of a new Subcommittee: Forest Products
– Continuing education:• How well are ongoing activities working?
• PCIC: Continues to set the bar, emerging standards (need participation outside PCIC)– P1566 Adjustable Speed Drives > 500Hp– P1458 Molded Case Circuit Breakers– P1673 High Pressure Seals for Conduit & Cable– P1716 Guide for managing Natural Disaster Impact– P1584 Guide to Arc Flash Hazard Calculations– P1683 Enhanced Safety Motor Control Centers
Process Industries Department
7
Best PracticesPID
– CIC: Exhibition is a Significant source of Revenue. Co-Sponsorship by PCA benefits research to develop new technology & involves leadership
– PCIC: Standards, Globalization, Web based post conference survey, Emeritus Program
– PPIC: New Product Presentations, adding adjacent industry segments, Student Interns, Senior Members
– Metal IC: Expanding global reach– Mining IC: Alignment with regulatory bodies - MSHA
Process Industries Department
8
PID UPDATE: James A. Rooks Memorial Student Intern Fund
PPIC: James A. Rooks, Life Fellow– Award presented posthumously by Dr. Mark Halpin at 2008
PPIC– Three student interns attended 2009 PPIC as a part of the
second annual JA Rooks Program– Many, many, many thanks to the Society for support of
the James A Rooks Memorial Student Intern Fund initiative
2007 Campaign$38,162 contributions from family & friends$30,000 IAS matching grant
2008 Campaign$21,490 contributions from family & friends ($4,035 conference) $20,000 IAS matching grant (no check yet!)
$59,652 + $50,000 = $109,652
IEEE Foundation Endowment
Process Industries Department
9
The following slides are mostly data that can be reviewed as presented and need not be discussed
unless there is some specific issue
THE SLIDES WILL BE KEPT FOR ARCHIVAL PURPOSE AND USED
AS A RESOURCE FOR IEEE AUDIT
Process Industries Department
10
See http://www.ieee.org/web/geo_activities/home/world_reg.html
# tutorials/seminars 4 4 IAS financial share 50% 50% 50% Income Expense Net Surplus Closed Yes No No
Process Industries Department
12
Name of Conference: Cement Industry Conference
Conferences - PID
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
IAS PUBLICATION Transactions on Industry Applications
Industry Applications Magazine
Row NUMBER OF PAPERS: 2006 2007 2008 2009 2010 2006 2007 2008 2009 2010 Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1 Papers submitted and approved for publication 0 0 3
2 Papers returned by committee for scope reasons, obvious poor quality, etc.
0 0 0
3 Papers peer reviewed (row 1 less row 2) 0 0 3 3a Papers from Row 3 eventually rejected 0 0 0 3b Papers from Row 3 in review process 0 0 0 3c Papers from Row 3 being revised by authors 0 0 0 3d Other papers from Row 3 (explain in comments below) 0 0 0 3e Papers from Row 3 queued for publication 0 0 0 3f Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where it is counted in Row 3)
0 0 3
4 Total: Rows 3a –3f, should equal Row 3 0 0 3 5 PERCENTAGE ACCEPTED via Peer Review
To compute this, divide “Row 3f” by “Row 3” 0 0 100%
6 Average number of months from Author Submission to Publication Date. Simply compute an average (from submission to issue where paper appears)
13
Region of author affiliation (# of papers) Regions 1 – 6 (U.S.A.) 2 Region 7 (Canada) Region 8 (Europe/Africa) Region 9 (Central/South America) Region 10 (Asia/Pacific) 1
# tutorials/seminars 5 4 IAS financial share 100% 100% 100% Income TBD Expense Net Surplus Closed
Name of Conference: Petroleum & Chemical Industry Conference
Process Industries Department
14
Conferences - PID
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
Name of Conference: Petroleum & Chemical Industry Conference
IAS PUBLICATION Transactions on Industry Applications
Industry Applications Magazine
Row NUMBER OF PAPERS: 2006 2007 2008 2009 2010 2006 2007 2008 2009 2010 Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1 Papers submitted and approved for publication 12 11 15
2 Papers returned by committee for scope reasons, obvious poor quality, etc.
0 0 0
3 Papers peer reviewed (row 1 less row 2) 12 11 15 3a Papers from Row 3 eventually rejected 0 1 0 3b Papers from Row 3 in review process 0 0 0 3c Papers from Row 3 being revised by authors 0 0 0 3d Other papers from Row 3 (explain in comments below) 0 0 0 3e Papers from Row 3 queued for publication 0 0 0 3f Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where it is counted in Row 3)
12 10 15
4 Total: Rows 3a –3f, should equal Row 3 12 10 15 5 PERCENTAGE ACCEPTED via Peer Review
To compute this, divide “Row 3f” by “Row 3” 100% 91% 100%
6 Average number of months from Author Submission to Publication Date. Simply compute an average (from submission to issue where paper appears)
29 19 22
Region of author affiliation (# of papers) Regions 1 – 6 (U.S.A.) 7 6 9 Region 7 (Canada) 3 3 4 Region 8 (Europe/Africa) 1 1 Region 9 (Central/South America) 1 Region 10 (Asia/Pacific) 1 0 1
# tutorials/seminars 5 7 6 IAS financial share 100% 100% 100% Income $167720 Expense $100619 Net Surplus $67101 Closed No
Name of Conference: Pulp & Paper Industry Conference
Process Industries Department
16
Name of Conference: Pulp & Paper Industry Conference
IAS PUBLICATION Transactions on Industry Applications
Industry Applications Magazine
Row NUMBER OF PAPERS: 2006 2007 2008 2009 2010 2006 2007 2008 2009 2010 Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1 Papers submitted and approved for publication 5 10 15 19
2 Papers returned by committee for scope reasons, obvious poor quality, etc.
0 0 0
3 Papers peer reviewed (row 1 less row 2) 5 10 15 3a Papers from Row 3 eventually rejected 0 0 0 3b Papers from Row 3 in review process 0 0 0 3c Papers from Row 3 being revised by authors 0 0 0 3d Other papers from Row 3 (explain in comments below) 0 0 0 3e Papers from Row 3 queued for publication 0 0 0 3f Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where it is counted in Row 3)
5 10 15
4 Total: Rows 3a –3f, should equal Row 3 5 10 15 5 PERCENTAGE ACCEPTED via Peer Review
To compute this, divide “Row 3f” by “Row 3” 100% 100% 100%
6 Average number of months from Author Submission to Publication Date. Simply compute an average (from submission to issue where paper appears)
16 13 8
Region of author affiliation (# of papers) Regions 1 – 6 (U.S.A.) 2 7 11 Region 7 (Canada) 2 2 2 Region 8 (Europe/Africa) 0 0 2 Region 9 (Central/South America) 1 1 0 Region 10 (Asia/Pacific) 0 0 0
Conferences - PID
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
# tutorials/seminars None IAS financial share 100% 100% Income Ref
IAS Ref IAS
Expense Net Surplus Closed
Name of Conference: IAS Annual Conference - Metals Industry Committee
Process Industries Department
18
Conferences - PID
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
Name of Conference: IAS Annual Conference - Metals Industry Committee
IAS PUBLICATION Transactions on Industry Applications
Industry Applications Magazine
Row NUMBER OF PAPERS: 2006 2007 2008 2009 2010 2006 2007 2008 2009 2010 Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1 Papers submitted and approved for publication 2 1 3
2 Papers returned by committee for scope reasons, obvious poor quality, etc.
0 0 0
3 Papers peer reviewed (row 1 less row 2) 2 1 3 3a Papers from Row 3 eventually rejected 0 0 0 3b Papers from Row 3 in review process 0 0 0 3c Papers from Row 3 being revised by authors 0 0 0 3d Other papers from Row 3 (explain in comments below) 0 0 0 3e Papers from Row 3 queued for publication 0 0 0 3f Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where it is counted in Row 3)
2 3
4 Total: Rows 3a –3f, should equal Row 3 2 1 3 5 PERCENTAGE ACCEPTED via Peer Review
To compute this, divide “Row 3f” by “Row 3” 100% 100% 100%
6 Average number of months from Author Submission to Publication Date. Simply compute an average (from submission to issue where paper appears)
27 15 17
Region of author affiliation (# of papers) Regions 1 – 6 (U.S.A.) 1 1 1 Region 7 (Canada) Region 8 (Europe/Africa) Region 9 (Central/South America) 1 2 Region 10 (Asia/Pacific)
# tutorials/seminars None IAS financial share 100% 100% Income Ref
IAS Ref IAS
Expense Net Surplus Closed
Name of Conference: IAS Annual Conference - Mining Industry Committee
Process Industries Department
20
Conferences - PID
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
Name of Conference: IAS Annual Conference - Mining Industry Committee
IAS PUBLICATION Transactions on Industry Applications
Industry Applications Magazine
Row NUMBER OF PAPERS: 2006 2007 2008 2009 2010 2006 2007 2008 2009 2010 Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1 Papers submitted and approved for publication 4 5 0
2 Papers returned by committee for scope reasons, obvious poor quality, etc.
0 0 0
3 Papers peer reviewed (row 1 less row 2) 4 5 0 3a Papers from Row 3 eventually rejected 0 0 0 3b Papers from Row 3 in review process 0 0 0 3c Papers from Row 3 being revised by authors 0 0 0 3d Other papers from Row 3 (explain in comments below) 0 0 0 3e Papers from Row 3 queued for publication 0 0 0 3f Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where it is counted in Row 3)
4 5 0
4 Total: Rows 3a –3f, should equal Row 3 4 5 0 5 PERCENTAGE ACCEPTED via Peer Review
To compute this, divide “Row 3f” by “Row 3” 100% 100% 0%
6 Average number of months from Author Submission to Publication Date. Simply compute an average (from submission to issue where paper appears)
18 13
Region of author affiliation (# of papers) Regions 1 – 6 (U.S.A.) 1 2 Region 7 (Canada) Region 8 (Europe/Africa) Region 9 (Central/South America) 2 2 Region 10 (Asia/Pacific) 1 1
- Industrial Automation and Control Committee (IACC)
- Industrial Lighting and Display Committee (ILDC)
• IAS 2009.
• Status of IAS Transaction & Magazine Papers.
• 2009-2010 Budget.
4/28/2014 3
IACC 1. Budget requested for 2009: $1,200 $1000 for prizes, paper awards $200: Materials and supplies. 2. Committee planning for IAS 2009 in Houston An increase of submitted papers for IAS 2009 from 2008. 57 digests, 6 sessions with a 75% acceptance rate. Control of Machines and Drives Intelligent Control of Systems Automation and Control in Renewable Energy Systems Control of Power Converters Advanced Sensing and Real Time Control Industrial Applications Control • 2 papers accepted for the plenary session • No tutorials have been submitted • New Award: Best Conference Paper Award
4/28/2014 4
IACC
IAS Transactions & Magazine
No Change since last quarter
4/28/2014 5
EPC
2010 New Board Member Chair: Prof. Norbert GRASS Vice-Chair: Prof. Akira MIZUNO Secretary: Dr. Rajesh SHARMA Adjunct Secretary: Angela Antoniu or Calle Carlos not yet fixed Technical Program: Prof. L. DASCALESCU Paper Review: Prof. Kaz ADAMIAK Technical Awards: Dr. Kelly ROBINSON Fellow Nomination: Prof. L. DASCALESCU
4/28/2014 6
EPC • EPC Plan in 2009-2010
• EPC will attend main conference of Electrostatic Society of America in
Boston with 3 other Societies in June, 2009. • IAS 2009 have two sessions including (9 papers)
Session 1: Applied Electrostatics • Session 2: Non-thermal Plasma Processes • EPC will join IAS Meeting in 2010 (total 94 presentations) • 28 papers from EPC published in IAS Transactions • No paper in IAS Magazine. • Out of 44 papers presented at IEEE/IAS 2008 meeting, 20 papers are
accepted and 13 are rejected for Transaction publication.
• Manuscript Central: • All authors of accepted papers in IAS 2008 received information on how
submit papers to the Transaction using Manuscript Central. (performance is not yet checked)
4/28/2014 7
EPC
Budget request for 2009-2010 * Paper Awards: $600 * Service Award(s): $200 * Postage and Misc: $200 * Invited Speakers: $1, 500 Total: $2,500
4/28/2014 8
EPC Transaction Papers: Since the last report: • 22 new papers have been submitted to the Transactions
after our Joint Meeting on Electrostatics in Boston • 7 papers have been scheduled for publication • 6 papers have been rejected • 2 papers have been accepted for publication in the IAS
Magazine • 9 papers have been accepted for publication in the IEEE
Transactions • 1 new Associate Editor (Masaaki Okubo) has been
2. IAS 2009 (4 Sessions) HID Lamps and Ballasts Fluorescent Lamps and Ballasts and Novel Applications LEDs and Drivers Displays • ILDC strongly interested in drives and devices, which are now part of ECCE. • Not planning to meet at IAS 2010 • Will meet at ECCE 2010. 3. IAS Transactions and Magazine. • No Magazine paper activity this Quarter. • A special issue on Displays is published in IAS Magazine for August 2008; 5
papers editorial from ILDC members. • IAS Transactions: 5 papers submitted, 2 are still in review process, 3 accepted. • One reviewed Transaction paper awaiting author updates. • Manuscript Central will be used by authors and all involved with the review process
starting with the 2008 Conference papers??? No response
4/28/2014 10
AIC
• No update received. • One Session organized for 2009 IAS Conference. • No Exhibitors or Tutorials • No plans to organize sessions for IAS 2009. • Future of AIC????
4/28/2014 11
2008 MSDAD Papers IAS Transactions
Issue Jan/Feb Mar/Apr May/Jun Jul/Aug Sep/Oct Nov/Dec Total Approved
AIC 1 1 0 0 0 0 2 1
EPC 9 6 2 7 7 1 32 23
IACC 1 2 0 2 5 3 13 8
ILDC 2 0 0 0 0 1 3 2
Total 13 9 2 9 12 5 50 34
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
1
Industrial & Commercial Power Systems Department (I&CPS-D) Report
2) Returned by AE for scope reasons, obvious poor quality, etc. 0 0 0
3) Peer reviewed (row 1 less row 2) 28 27 27
3a) Papers from Row 3 eventually rejected 15 8 tbd
3b) Papers from Row 3 in review process 0 0 4
3c) Papers from Row 3 with authors in revision 0 0 0
3d) Other papers from Row 3 (explain in comments below) 0 0 0
3e) Papers from Row 3 queued for publication 0 19 tbd
3f) Papers from Row 3 eventually published (if a paper is published in a subsequent year, list in year of submittal where it is counted in Row 3)
13 0 0
4) Total: Rows 3a-3f, should equal Row 3 28 27 0
PERCENTAGE ACCEPTED 46% 70% 0%
Average number of months from Author Submission to Publication Date (submission to issue where paper appears)
? ? ?
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
7
Geographical distribution of Authors 2007 2008 2009
Regions 1 – 6 26 33 19
Region 7 6 4 8
Region 8 7 1 5
Region 9 0 0 4
Region 10 25 8 18
Conferences – I&CPS Technical
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
8
NUMBER OF PAPERS: IAS 2007 2008 2009
1) Submitted 37 36 28
2) Returned by AE for scope reasons, obvious poor quality, etc. 0 0 0
3) Peer reviewed (row 1 less row 2) 37 36 28
3a) Papers from Row 3 eventually rejected 17 0 0
3b) Papers from Row 3 in review process 0 36 28
3c) Papers from Row 3 with authors in revision 0 0 0
3d) Other papers from Row 3 (explain in comments below) 0 0 0
3e) Papers from Row 3 queued for publication 0 0 0
3f) Papers from Row 3 eventually published (if a paper is published in a subsequent year, , list in year of submittal where it is counted in Row 3)
20 tbd tbd
4) Total: Rows 3a-3f, should equal Row 3 37 36 28
PERCENTAGE ACCEPTED 54% 0% 0%
Average number of months from Author Submission to Publication Date (submission to issue where paper appears)
? tbd tbd
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
9
Geographical distribution of Authors 2007 2008 2009
Regions 1 – 6 37 21 29
Region 7 3 9 0
Region 8 31 27 5
Region 9 0 3 8
Region 10 27 24 42
Conferences – IAS Annual Mtg
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
10
Conferences – 2007 REPC
Attendance (tech sessions) 249
# Papers Submitted 38
Papers Accepted (presented) 16
No. Exhibitors 47
Attendance (tutorials/seminars) ?
# tutorials/seminars 2
IAS financial share 0
Income (Prelim) $ 123.7 k
Expense (Prelim) $ 97.8 k
Net Surplus $ 25.9 k
Dates: May 6-8, 2007 Location: Rapid City, SD Co-Sponsor(s): IAS Conference closed: Yes (Except for Audit) Chair: David Lankutis Tutorials/Seminars (CEUs?): YES
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
11
Conferences – 2008 REPC
Attendance (tech sessions) 345
# Papers Submitted 39
Papers Accepted (presented) 15
No. Exhibitors 53
Attendance (tutorials/seminars) 75
# tutorials/seminars 3
IAS financial share $0
Income (Prelim) $ 148 k
Expense (Prelim) $ 132 k
Net Surplus $ 16 k
Dates: April 27-30, 2008 Location: Charleston, SC Co-Sponsor(s): IAS Conference closed: No Chair: Russ Dantzler Tutorials/Seminars (CEUs?): YES • Power Capacitors on the Distribution
System • Designing Underground Distribution
Systems • Improving Feeder Reliability Using SEL
Product Applications and Technologies
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
12
Conferences – 2009 REPC
Attendance (tech sessions) 273
# Papers Submitted 38
Papers Accepted (presented) 15
No. Exhibitors 41
Attendance (tutorials/seminars) tbd
# tutorials/seminars 3
IAS financial share $0
Income (Prelim) tbd
Expense (Prelim) tbd
Net Surplus tbd
Dates: April 26-28, 2009 Location: Fort Collins, CO Co-Sponsor(s): IAS Conference closed: No Chair: Jerry Hager Tutorials/Seminars (CEUs?): YES • Critical Elements in the Operation,
Installation and Maintenance of Power Transformers
• Cooperative Sees Big Results from System Improvements
• Design Tools and Fundamentals of Rural Electric Power Distribution Systems: Design and Application Guidelines
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
13
Conferences – 2010 REPC
Attendance (tech sessions)
# Papers Submitted
Papers Accepted (presented)
No. Exhibitors
Attendance (tutorials/seminars)
# tutorials/seminars
IAS financial share
Income (Prelim)
Expense (Prelim)
Net Surplus
Dates: May 16-19, 2010 Location: Orlando, FL Co-Sponsor(s): IAS Conference closed: No Chair: Mike Williams Tutorials/Seminars (CEUs?): YES • TBD
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
14
NUMBER OF PAPERS: REPC 2007 2008 2009
1) Submitted 39 39 15
2) Returned by AE for scope reasons, obvious poor quality, etc. 0 0 0
3) Peer reviewed (row 1 less row 2) 39 39 15
3a) Papers from Row 3 eventually rejected 23 24 0
3b) Papers from Row 3 in review process 0 0 15
3c) Papers from Row 3 with authors in revision 0 0 0
3d) Other papers from Row 3 (explain in comments below) 0 0 0
3e) Papers from Row 3 queued for publication 0 0 0
3f) Papers from Row 3 eventually published (if a paper is published in a subsequent year, list in year of submittal where it is counted in Row 3)
16 15 0
4) Total: Rows 3a-3f, should equal Row 3 39 39 15
PERCENTAGE ACCEPTED 41% 38% 0%
Average number of months from Author Submission to Publication Date (submission to issue where paper appears)
3 4.5 TBD
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
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Geographical distribution of Authors 2007 2008 2009
Regions 1 – 6 16 14 20
Region 7 0 1 0
Region 8 0 0 0
Region 9 0 0 0
Region 10 0 0 0
Conferences – REPC
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IASIEEE INDUSTRY
APPLICATIONSSOCIETY
®
16
Department Progress
• TBCC – Progress made in converting Color Books to
the 300x.x.x standards • two PARS in ballot now • several going to balloting by end of year • most are a year away
– Base book making progress for fundamental materials
• needs about a year’s worth of work
Industry Applications Society 2009 Q3 EB Meeting, Houston, TX
Oct 4-5, 2009
2009 Q3 ACTIVITY REPORT TO THE EXECUTIVE BOARD Period of reporting: May – Sep 2009
IAS Chapters and Membership Development Department Peter Magyar, Chairman [email protected]
Established in 1990 Six to eight Distinguished Lecturers elected to two-year terms.
Must be IEEE Fellows $20,000 typical annual budget for DL and RS
How Program Works
Chapter makes arrangements with DL as well as DL Chair Plan well in advance since overseas travel takes many months to schedule. multiple chapters within a region could coordinate and arrange a “Lecture Tour”
Society reimburses DL for economy class air fare or mileage per lecture ($750 max) Chapter/Section cover local accommodation and transportation expenses
IEEE IAS Chapters & Membership Department Workshop 2009 3
Provides access to quality presentations by knowledgeable regional speakers Regional Speaker can be a past DL or an “expert”.
Expert does not have to be from any specific lists Chapter can propose an Expert Experts have to be approved by DL and Chapters Chair
How Program Works
Society reimburses RS for travel per lecture ($450) Chapter makes arrangements with RS
(multiple chapters within a region could coordinate and arrange a “Lecture Tour” )
Chapter/Section covers local expenses as for DL
Regional Speaker Program
IEEE IAS Chapters & Membership Department Workshop 2009 4
2006-2007 Distinguished Lecturers (became Regional Speakers from Jan
IEEE IAS Chapters & Membership Department Workshop 2009 6
DL Activities for 2008
Ian Boldea April 2, 2008 Brasil June 6, 2008 Italy
Tomy Sebastian Febr 2, 2008 Detroit, USA Dec 13, 2008 Hong Kong
June 19, 2008 Hungary Dec 15, 2008 China June 25, 2008 India Dec 17, 2008 China July 7, 2008 India Dec 20, 2008 Taiwan July 8, 2008 India
IEEE IAS Chapters & Membership Department Workshop 2009 7
RS Activities for 2008
Ajit Chattapadhyay March 5, 2008 Peru March 17, 2008 Brazil
March 10, 2008 Chile March 19, 2008 Brazil March 11, 2008 Chile Dec 2008 India
Gerardo Hiriart Le Bert
March 25, 2008 Chile March 28, 2008 Chile March 27, 2008 Chile March 29, 2008 Chile
Kaushuk Rajashekara
Oct 21, 2008 India July 2008 Russia
Mo El-Hawary July 17, 2008 Pittsburgh
IEEE IAS Chapters & Membership Department Workshop 2009 8
DL Activities for 2009
Ian Boldea March 2009 Italy May 2009 Spain
Tomy Sebastian
March 16, 2009 Brazil March 19, 2009 Brazil March 17, 2009 Brazil March 20, 2009 Brazil March 17, 2009 Brazil
Hiroaki Ikeda
Oct 2009 Singapore Oct2009 Malaysia
William Greason April 2009 Canada
IEEE IAS Chapters & Membership Department Workshop 2009 9
RS Activities for 2009
Freddy Villalta June 2009 Panama
IEEE IAS Chapters & Membership Department Workshop 2009 10
Chapters can access Distinguished Lecturers from IES, PELS & PES (Sister Societies with similar technical interests) How Program Works
DL expenses are covered by sponsoring Society according to rules of that Society Chapter makes arrangements with sponsoring Society DL Program Chair directly
CMD can assist
Inter-Society DL Program
IEEE IAS Chapters & Membership Department Workshop 2009 11
Intersociety Contacts
IEEE Power Electronics Society [email protected] http://www.pels.org/Comm/Chapters/lecture.html
Donald G. Dunn, IEEE Senior Member Aramco Services Company Education Department Technical Services Chairman Engineering Unit MS-1089 909 West Loop South Houston, TX 77096 Phone: 713-432-8588 Email: [email protected] April 17, 2009
IEEE INDUSTRY APPLICATIONS SOCIETY EDUCATION DEPARTMENT
To: Mr. Tom Nondahl IAS President Subj.: Education Department 3rd Quarter 2009 Report to the IAS Executive Board October 2009 Houston, Texas Action Item: 5.3
1. Expert Now Status of the Expert Now modules. Continue to work with Tara Gallus (IEEE EAB Staff) • Power Quality – Mark Halpin (Joint IAS/PES)
o Completed available 2009 • Distributed Generation – SME Identified (Joint IAS/PES)
o Tara working with Prof. Hatziargyriou and Prof. Papathanassiou. All information has been submitted and is in development.
• Recent Trends in Substation Automation and Enterprise Data Management (Joint IAS/PES)
o John McDonald has submitted materials for IAS comments. IAS has provided input. Should be available late 2009.
• Integrating an Effective Electrical Safety Program into Occupational Safety & Health Management (Joint IAS/PES)
o Lanny Floyd materials are in the process of submission. Module currently in development.
• Cable Insulation Basics (Joint IAS/PES) o Prof. Jayaram materials are in the process of submission. Module
currently in development.
2. IAS Tutorials • Revised Guidelines for the 2009 conference and those thereafter to be strictly
a $500 honorarium. • 2009 Tutorials are as follows:
Grounding Considerations for Industrial Power Systems – Wednesday 10-7-09 AM Matt McBurnett - V I Engineering Stu Gibbon - Post Glover Resistor APPLICATION OF ELECTROMAGNETIC TRANSIENT STUDIES IN INDUSTRIAL APPLICATIONS - Wednesday 10-7-09 AM Randy Wachal, P. Eng - Manitoba HVDC Research Centre Dharshana Muthumuni, Ph.D., P Eng. - Manitoba HVDC Research Centre NFPA 70E and Safety by Design – Wednesday 10-7-09 PM Jim Bowen – Powell Electric
Page 2 / 3 IAS Education Department 2nd Quarter 2008 Report to the IAS Executive Board
Modern Protective Device Coordination for Industrial Power Systems - Wednesday 10-7-09 PM Rasheek Rifaat, P. Eng, IEEE Sr. Member - Jacobs Engineering Field Assembly, Testing & Commissioning of HV Power Transformers – Thursday 10-8-09 AM Randy Slaybaugh – Substation Engineering Services Application Considerations for Industrial UPS & Dc Power Systems – Thursday 10-8-08 AM Matthias Dreier – Gutor Electronic Ltd Understanding IGBT Modules used in Industrial Motor Drives – Thursday 10-8-08 AM John F. Donlon – Powerex, Inc. Eric R. Motto - Powerex, Inc. IEC 61850 Basics and Substation Automation – Thursday 10-8-09 PM Mark Adamiak – GE Multilin Substation Equipment Application Considerations – Thursday 10-8-09 PM Dr. Kurt Ederhoff - VI Engineering Dominik Pieniazek - Dashiell Corp
3. 2009 Zucker Program.
The 2009 winners of the student design contest are listed below. The travel program had excellent response and applicants with eleven selected for this year. We have revised the key contacts on this program to coordinate with IAS staff and the conference coordinators to facilitate logistics at the conference.
First Place: "Partial Discharge and Oil Quality Monitoring Using an RF Antenna" Esam Al Murawwi AbdelRahim Huwair Kamal Al Mazam Second Place: "Quantitative Measure of Bone Healing Process Using Pulsed Ultrasound Technique” Anwar Mohammad Marzouq Al Zaabi Mohammad Khalil
Third Place: “High Precision Intelligent Speed Control of Brushless DC Motor” Thanh Dang Nicholas Feilner
2009 Zucker Travel Program:
2009 Zucker Travel Program Candidate lis
Page 3 / 3 IAS Education Department 2nd Quarter 2008 Report to the IAS Executive Board
4. Industrial Lecture Program (ILP) New Program within the Education Department. (Dunn)
• Working with committee to select and confirm individuals that are on a list of all senior members and above within the IAS. IAS staff provided the list earlier this year. The list of subject matter experts (SME’s) for this program will be in place by year’s end.
Respectfully submitted Donald G. Dunn
R. Mark Nelms ECE Department Chair 200 Broun Hall Meetings Department Auburn University, AL 36849-5201 USA Phone: 334-844-1830 FAX: 334-844-1809 Email: [email protected] October 5, 2009
IEEE INDUSTRY APPLICATIONS SOCIETY
Subj.: Agenda item 5.4 - Meetings Department Report 3rd Quarter Report 2009 to the IAS Executive Board Conference status report I received a conference status report from the IEEE in July 2009. Using this report and email correspondence, I have updated the status of IAS conferences.
CB Destroy Check Form 2009 APEC Final, Surplus, Certificate of Accuracy,
Audit, CB Destroy Check Form, Proof of Bank Closure
$244,573.63
2007 IEEE-IAS/PCA Cement Industry Conference The IEEE has completed the audit for this conference. The surplus of $42,373.24, divided equally between the IAS and PCA, will be distributed soon. Lynda Bernstein has provided valuable assistance in closing this conference. Meeting with Portland Cement Association representatives A meeting was held on August 12, 2009 at IEEE Headquarters in Piscataway, NJ. Mary Ward Callan, Vita Feuerstein, and Lynda Bernstein attended from the IEEE. Five representatives from the PCA attended. Discussions focused on the status and future of the memorandum of understanding between the IAS and PCA and the annual cement conference. The PCA was to notify the IAS of its interest to continue the relationship between the two entities. If the decision is made to continue, a new memorandum of understanding will be developed. It is likely that a steering committee will be formed for the annual cement conference. Penalty fees The IAS was charged the following conference penalty fees in August 2009:
The IAS was charged penalty fees for the 2007 I&CPS and the 2007 APC. Site visit for the 2011 IEEE IAS Annual Meeting The New York Marriott at the Brooklyn Bridge was visited on August 13 as a potential site for the 2011 IAS Annual Meeting. The hotel facilities are a good match for the meeting requirements. However, the room rate quoted by the hotel is in excess of $200 per night without taxes. As such, other cities and venues will be investigated for this meeting. 2009 Panel of Conference Organizers Meeting Attendance at this meeting allows me to stay informed about changes in IEEE conference policies. MOUs for technical co-sponsorship must now include information about the paper review process for a conference. This change was made to ensure the quality of papers entered into Xplore. Respectfully submitted,
LJ Powell - October 2009 Magazine Committee
Editor’s Report
Louie J. Powell, PE Editor – in-Chief
October 2009
LJ Powell - October 2009 Magazine Committee
Looking back on 2009: • Critical statistics:
o Papers published – 46 one under plan o Editorial pages published – 506 19 under adjusted plan, 7 over minimum threshold o Timeliness – All issues on schedule
• Report on Initiatives: o Special Feature (July/August issue) – Automotive Motors/Sensors
• Pete Wung, Guest Editor • History article – Linos Jacovides • Five articles on aspects of automotive electrification
More advertisers; more advertising pages Shift toward higher-value advertising covers and wrappers
Some softness mid-year – economic recession Personal opinion: eclectic nature of IAS audience makes advertising a hard sell
Advertising Pages
0
1
2
3
4
5
6
7
8
9
10
Jan
May Se
p
Jan
May Se
p
Jan
May Se
p
Jan
May Se
p
0
10
20
30
40
50
60
2005 2006 2007 2008 2009
Insertions PagesCovers Wrappers
LJ Powell - October 2009 Magazine Committee
2009 Production Issues: • Paper length
o An ongoing battle
• Timeliness o One paper rejected: author failed to provide permissions to reprint copyrighted figures
No time to substitute a reserve paper o Timeliness of column submissions
• Zucker Award Paper • Authors declined invitation to publish their paper
A Relatively Drama-Free Year!
LJ Powell - October 2009 Magazine Committee
Impact Factor: What is it?
• Average rate of citations of articles in a journal • From Journal Citation Report published by Thomson ISI • Measures impact of the journal on current research • Proxy for relevance • Universities pushing for publication in high-IF journals
Concerns
• Invalid comparison between fundamentally dissimilar journals • Considers only publications listed in JCR • Biased toward current publications (2 year lookback) • Can be distorted by changes in publication volume • Attempts to manipulate IF raise ethical issues
IEEE view
• Valid comparison of journals within similar fields of activity IEEE periodicals should be in upper 50% in their competitive field
• Be very careful with attempts to manage IF • Its only one data point – not an ultimate metric
0
0.1
0.2
0.3
0.4
0.5
0.6
2002 2003 2004 2005 2008
LJ Powell - October 2009 Magazine Committee
2005 JCR 2008 JCR
Machine Vision and Applications Springer-Verlag 0.667 1.485
Industry Applications Magazine IEEE 0.469 0.529 Power Engineering Journal IET (was IEE) 0.064 0.435
European Transactions on Electrical Power Engineering
VDE 0.056 0.36
Transmission & Distribution World Intertec Not in JCR Not in JCR
Plant Engineering Cahners Not in JCR Not in JCR
Electric Construction and Maintenance Primedia Intertec Not in JCR Not in JCR
Power McGraw-Hill Not in JCR Not in JCR
Consulting-Specifying Engineer Cahners Not in JCR Not in JCR
Electrical World McGraw-Hill Not in JCR Not in JCR
Power Electronics Primedia Intertec Not in JCR Not in JCR
EPE Journal European Power Electronics Assn
Not in JCR Not in JCR
Power Pulse CD Darnell Group Not in JCR Not in JCR
Industry Applications Magazine Competition:
LJ Powell - October 2009 Magazine Committee
Concern for IAS Magazine: • Significance of changes relative to competitive journals?
Our Impact Factor has been essentially constant – others are increasing
• Does the list of competitive publications truly reflect the nature of IAS Magazine? Dominated by power & infrastructure journals – not in JCR Competitive journals in JCR have distinct research orientation Does not represent all IAS technologies equally
• Serious questions about the validity of the comparison
List of Competitive Publications Should Be Reviewed Before Next TAB Audit
LJ Powell - October 2009 Magazine Committee
2009 Call for Papers: 60 recommendations
Conclusions: PID continues to be the dominant source of papers Support from other departments up significantly this year
Source of 2010 Papers
PCIC
PPIC MetIC
PSEC
REPC
EPC
MIC
PSPC
IDC
IPCC
PEDCC CIC EMC
Transferred to Transactions
Scheduled
Rejected No Response
Disposition of 2010 Papers
LJ Powell - October 2009 Magazine Committee
Impact of ScholarOne Manuscripts: 1. Three submission processes in 2009
• Legacy process – conventional manual submissions • Reviews in S1M – manual submissions
Copyright transfer completed on-line Final file submission was manual
• Reviews in S1M – “Final Files” submissions (totally electronic process) Decision letter requests that author submit ‘final files’ to S1M within 30 days Files exported from S1M to IEEE Production by EiC as part of planning process
2. Process change – immediate submission for all papers • All authors asked to submit materials for publication by 9/1/09 • Eliminates uncertainty about individual issue content • Allows flexibility to change content of individual issues • Eliminates need for “reserve” articles
S1M Final Files
S1M Legacy review
LJ Powell - October 2009 Magazine Committee
2010 Plans: Technical content
o Initial page budget: 496 pages Agreed to set budget at 476 pages at 10/08 Magazine Meeting IEEE agreed to adjust their numbers
o Papers: 43 scheduled (7-8 articles per issue) May need to adjust budget mid-year Note average manuscript length – down from 8.0 in 2009
LJ Powell - October 2009 Magazine Committee
2010 Initiatives & Challenges: o Special Issue – Applied Electrostatics (July/August)
• EPC selected six papers from 2008 Annual Meeting Still waiting for one author
• Guest Editorial by Kaz Adamiak • Related history article by Peter Castle
o Maintain 10 page length on feature articles
o Expand coverage of Chapters activities
o Expand use of S1M Final Files export • Requires that all committees adopt S1M
o Initiate routine plagiarism screening on papers submitted via S1M
o Replenish “Lighter Side” archive
o Future Special Issue:
“How Low Can You Go” – Perspectives on high resistance grounding Joe Sottile, Guest Editor (July/August 2011)
LJ Powell - October 2009 Magazine Committee
Transition plan for new Editor • ExBoard appoints new EiC
• No later than February 2010 • Authorizes attendance at 2010 Panel of Editors Meeting, April 23-24, 2010, New Jersey
• Transition Meeting at 2010 Panel of Editors Meeting • Incoming EiC, Outgoing EiC, Managing Editor
• New EiC assumes responsibility effective with January/February 2011 issue • Issues 2011 Call for Papers (April 2010) • Develops 2011 publication plan (July/August 2010) • Works with Geri Krolin-Taylor on January 2011 issue • Supported by outgoing EiC • Utilize “Guidelines & Traditions” document
• Announce New EiC – November/December 2010 issue
• Outgoing EiC responsibilities end with November/December 2010 issue
LJ Powell - October 2009 Magazine Committee
Future Needs: • Revisit list of ‘competing’ publications
Before 2012 TAB review • “Rapid posting”
Papers posted to Xplore 3-4 weeks after manuscripts released for publication Can significantly reduce “sub-pub” metric on individual papers Transactions is adopting the practice Enabled by S1M “final files” function Issues for the Magazine
• No process exists for Magazines • Magazine cycle will take longer – potentially 6-8 weeks • Changes not possible after posting
• Review design/layout of the Magazine
Maximize marketing value of the Magazine for the Society Should be done on 10-12 year cycle; last done in 1999 Requires Staff support
LJ Powell - October 2009 Magazine Committee
Action Required:
Formal approval of 2010 plan
IEEE INDUSTRY APPLICATIONS SOCIETY Kevin L. Peterson P2S Engineering, Inc. Publications Department Chair 5000 East Spring Street, 8
th Floor
Long Beach, CA 90815 USA Tel +1 562 497 2999 Fax +1 562 497 2990 Email [email protected]
October 1, 2009
Subject: Publications Department Report to the IAS Executive Board, October 4th
in
Houston, TX
IAS Transactions
The November/December 2009 issue of the IAS Transactions has been filled with 35 papers, which
were forwarded to IEEE on August 26th. They arrived about two weeks ahead of the September 14
th
manuscript due date. Although we have received many more approved papers, given that the
September/October issue’s actual page count is not known as of this date, this was our best estimate
of the number of papers required to meet our approved page budget for the year. Attached is a table
showing the source by technical committee of the papers that will have been published or scheduled
for publication in 2009 as of September 14th. This table shows the number of papers approved by each
technical committee, either not yet processed or not yet received, for publication. Of these 152 papers,
we have already received 77 papers. 17 of these 77 papers have arrived via the new electronic
submission function of ScholarOne, Final Files, rather than our legacy mailed hardcopy procedure.
Our TAB-approved 2010 page budget allows for 40 papers for each issue of the year. This amounts
to 240 papers, an increase of 9 papers over the number that will have been published in 2009. If we
do not begin to see a further reduction in the backlog of received papers, we will revisit this in April
when Carl has the chance to further increase the number of papers published in the last three issues of the year.
IAS Magazine
Critical statistics for 2009:
o Papers published: 46 (one under plan)
o Editorial pages published: 506 (19 under adjusted plan, 7 over minimum threshold)
o Timeliness: All issues on schedule
Call for Papers Statistics:
IEEE IAS Publications Department Report – 2009 Q3 Page 2 of 3
Region Section Chapter Comment R-2 Dayton OH, USA PES/IAS/PELS
Technical Society (regular) Chapters
R-5 Central Texas TX, USA
IES/PES/PELS, Joined IAS
R-8 Algeria Sub-Section IES/IAS
R-4 Nebraska (NE, USA Univ. of Nebraska-Lincoln SB PES/PELS (joined IAS)
Student Branch Chapters
R-8
Algeria Sub-Section Mentouri University Constantine SB IAS Bosnia and
Herzegovina University of Sarajevo SB IAS (submitted to the Section)
Croatia University of Zagreb SB IAS Greece Democritos University of Thrace SB IAS
Hungary Òbuda University SB IAS Palestine Sub-Section Al-Najah National University SB IAS
Portugal Instituto Técnico Superior SB IAS South-Africa University of Cape-Town SB IAS South-Africa University of Pretoria SB IAS
R-9 Honduras Universidad Nacional Autonoma de Honduras SB IAS
Peru Universidad Nacional de Callao SB IAS
R-10
Gujarat (India)
Dhirubhani Ambani Inst. of Inf. & Comm. Technology SB IAS Marwadi Education Foundations Group of Institutions SB IAS
Kerala (India)
Saint Gits College of Engineering SB IAS
Nanjing (China)
Southeast University SB IAS
CMD Report for 2012 Q3 EB Meeting
Page 2 of 6
2. Membership Overview
IAS membership by Region IAS higher grade membership
global distribution trend
Change: R1-7: -76 / year
R8-10: +117 / year Difference: -193 / year
Membership Statistics July 31,
2012 Society Membership Student
total GSM Student grade members
IAS Div II IEEE min IEEE max
IAS Div II IEEE
Count 9714 661 334 327 740 16.077 Y-o-Y change
1.3% 0.3% -11.9 % 5.7% n.a. n.a. 28.2% Highest value in Div II and 2nd highest at IEEE
1.2% -1.1%
Student Membership by Regions
a) Undergraduate b) Graduate c) Total
CMD Report for 2012 Q3 EB Meeting
Page 3 of 6
Development history of IAS chapters
Development history of IAS Student Branch chapters
Asymetrical distribution of members and chapters by global regions
CMD Report for 2012 Q3 EB Meeting
Page 4 of 6
3. Committee Activity
3.1. Chapter Development and SB Chapter Development Committee IAS Outstanding Chapter Chair 2012
Megha Tak Region-10, Dhirumbani Ambani Institute of Information and
Communication Technology Student Branch IAS Chapter Chair IAS Outstanding Chapters Area Chair 2012
D. David Eng Region-6 Chapters Area Chair
IAS Outstanding Student Branch Chapters Area Chair 2012
Srikanth Vasudevan Pillai Region-10 Student Branch Chapters Area Chair
3.2. Chapter Award Committee IAS Outstanding Chapters 2012 Outstanding Large Joint Chapter:
Argentina Section Joint IES/CSS/RAS/IAS/PELS/VTS Chapter Germany Section Joint IAS/IES/PELS Chapter
Outstanding Large Chapter: Panama Section IAS Chapter
Outstanding Small Chapter: Morelos Section IAS Chapter
Outstanding Small Joint Chapter: Nanjing Section Joint PES/IAS Chapter
Outstanding Student Branch Chapter: Colombia Section Universidad Militar Nueva Granada Student Branch IAS Chapter
Outstanding New Chapter: Colombia Section Universidad de San Buenaventura Student Branch IAS Chapter
Continued Outstanding Performance Large Chapter: New York Section Joint PES/IAS Chapter
Continued Outstanding Performance Small Chapter: Calcutta Section IAS Chapter
Continued Outstanding Performance Student Branch Chapter: Hungary Section Budapest University of Technology and Economics Student Branch Joint PES/IAS Chapter
3.3. Chapter Web Contest Sub-Committee IAS Chapter Web Contest Winners 1st Prize: Hungary Section Budapest University of Technology and Economics Student Branch Joint PES/IAS Chapter (http://eszk.org/en ) 2nd Prize: Panama Section IAS Chapter (www.ieee.org/go/iaspanama ) 3rd Prize: Kerala Section Rajiv Gandhi Institute of Technology Govt. Eng. College
