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www.technavio.com enquiry@technavio .com IC Packaging Market in Taiwan 2015-2019
| Date post: | 07-Aug-2015 |
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Technology |
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Covered in this Report• This report covers the present and future scenarios of the
IC packaging market in Taiwan for the period 2015-2019.
• Technavio uses 2014 as the base year and provides data for the 12 trailing months.
• To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan.
• Technavio's report, IC Packaging Market in Taiwan 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.
• The report covers the landscape of the IC packaging market in Taiwan and its growth prospects in the coming years.
• The report includes a discussion on the key vendors operating in this market.
IC Packaging Market in Taiwan 2015-2019
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Market Overview
• ICs manufactured in the global semiconductor industry are delicate and vulnerable to contamination.
• To eliminate such eventualities, silicon chips or ICs are protected using packaging materials.
• Wafer-level packaging is one such packaging that involves the packaging of individual ICs using best-fit packaging processes during the semiconductor production process.
• Technavio's analysts forecast the IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019.
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Taiwan 2015-2019,please mail us at
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Key Vendors and Regions
• Advanced Semiconductor Engineering
• Powertech Technology
• Siliconware Precision Industries
• Amkor Technology
• ChipMOS Technologies
• Greatek Electronics
• King Yuan ELECTRONICS
View Our Report: IC Packaging Market in Taiwan 2015-2019
• Taiwan
Vendors Regions
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Key Findings
• Vendors are focusing on manufacturing miniaturized personal electronic products that consume less power.
• This has prompted foundries to focus on integrating features, reducing the size of semiconductor wafers, and lowering IC power consumption. Currently, electronic devices use semiconductors with circuit line widths in the 20 nm range.
• As a result of the increasing demand for semiconductor ICs worldwide, IC packaging service providers in Taiwan are willing to increase their production capacity to provide services for large orders.
• IC packaging service providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their packaging services to one IC packaging vendor rather than many.
• Hence, many IC packaging service providers are enhancing their capacity and the required skilled labor to meet the demand.
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Key Questions Answered in Our Report
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
Have a question of your own about this report?
Ask our Analysts
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• Decision makers and influencers in sales & marketing, strategy, product and R&D teams rely on research from Technavio. We have a large and growing base of happy customers worldwide. Our customers include technology suppliers, end users, consulting companies, investment firms and research institutes.
• Technavio was founded in 2003 in London. We have about 300 analysts globally. We cover more than 500 technologies across 80 countries. Traditional media such as Forbes Asia and New York Times, along with other web media portals, like to quote us.
About Technavio
Some of our clients include:ACT Global, Flextronics, Huawei Technologies Co, Infosys, Harris Corporation, Infosys, Intercad, Hidaka Precision Tools & Dies Company, Huawei Technologies Co, American Capital, Analysis Group, Netscout, NTT DoCoMo
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View Our Report
IC Packaging Market in Taiwan 2015-2019
63 Pages | SKU: IRTNTR6654
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