341

Index

aAbbe’s diffraction limit 85acoustic firing 28acoustic principle, droplet formation

29acoustic resonators 28acrylonitrile butadiene styrene (ABS)

59additive manufacturing (AM) see 3D

printing technologiesadditive RGB (red, green and blue) 320additives, organic and inorganic 56AFM, spin-coated and printed films

214AgNW, at high Ag+ concentration 267AgNW electrodes, coating method

269AgNW network bound, resin 266, 270AgNW transparent electrodesbar-coating and spray-coating 266formed from ultra-long 267ITO transparent electrodes 266low sheet resistance and high

transparency 266air conditioning and mechanical

ventilation (ACMV) 319Al2O3 layer 124aluminum oxide (Al2O3) nanoparticles

297American Chemical Society 192ammonium persulfate (APS) 253, 299amphiphilic polymers 31analyte detection 201anodized aluminum oxide (AAO) 253

apparent interlaminar shear strength(aILSS) 281, 288

Applied Nanotech 126Archimedes principle 239Argon 36Ar plasma sintering 130artificial vapor-sensitive colloidal PCs

201atmospheric plasma, jet technologies

37atomic force microscopy (AFM) 86AuNPsgrowth, parameters influencing 74high vacuum deposition techniques,

AuNPs 70self-assembled 70XRD and HRTE 73

autocatalytic electroless plating 55axisymmetric TCL retraction 199

bball milling 126Beer–Lambert law 84bioassays 303biomedical applications, microdevices

94biotinylated C-reactive protein (CRP)

antigen 295block copolymers 253bouncing 185Bragg diffraction 197breath ammonia monitoring system

299Bruggeman model 233

Nanomaterials for 2D and 3D Printing, First Edition.Edited by Shlomo Magdassi and Alexander Kamyshny.© 2017Wiley-VCH Verlag GmbH & Co. KGaA. Published 2017 byWiley-VCH Verlag GmbH & Co. KGaA.

342 Index

Building and Construction Authority(BCA) of Singapore 319

Building Envelope and Façade system(BEFS) 319

built-in sintering approach 132bulk diffusion mechanisms 33bulk transport mechanismsdensification 33dislocation flow 33

2-(2-butoxyethoxy)ethanol 126butoxy(ethylacetate) 126

ccadmium sulfide 198cadmium telluride (CdTe) nanocrystals

306CAD model 109camphorsulfonic acid (CSA) 248Canon 27cantileverbeam test apparatus 277capillary forces 184capping dodecylamine 36carbon fiber composites, functional

polymersinterlaminar fracture toughness 279mechanical testsDCB test 277SBS test 277

morphology, printed PMMA and PEGdroplets 284

patterns, PMMAmicrodroplets 278printing and sample preparationpressure cycle 278temperature cycle 278

carbon nanomaterialsCNTs 304graphene oxidecommercial inks and sensors 302CVD 303gas detectors, production 303vapor sensor 303

MWCNTs 302SWCNTs 302

carbon nanotubes (CNTs) 120DNA-hybridization 304fabrication 305Nafion-MWCNT sensor 306

SDS 305SWCNTs 304

carboxylic fatty acids 125cationic initiators 89cationic photoinitiators 89centrifugation 126cetyltrimethylammonium bromide

(CTAB) 253chalcogenide nanoparticles 215charge density, solid electrochromic

device 328chemical destabilization techniques 31chemical sintering, 35–36desorption, protective layer 132stabilizing molecules, dissolving 132

chemical vapor deposition (CVD) 94,303

chemiresistive hydrogen peroxidesensor 251

classical DLVO theory 123coffee-ring effect: evaporative flux

distribution 194inhomogeneous deposition 193nonuniform patterns 167ring-like morphology 167suppression 186unsymmetrical evaporation 193

coffee stain effect 6complex fabricating process 183composite material scaffolds 95computer-aided design (CAD) software

2conducting polymer nanomaterialspolythiophene (Pth) 258PEDOTchemical structure 258properties, synthesis of 258

polyaniline nanomaterialsapplications 250chemical structure 246

polypyrrole 251conductive inkjet ink 120conductive metallic nanoinks,

formulationhigh NPs 125printed electronics 125

conductive polymers

Index 343

conductor and semiconductors 298PEDOT 302polyanilineaqueous ammonia leaks 299high conductivity 299

polypyrrole 300prussian blue 301sensor technology 298

conductive wiring, mechanical flexibility265

contact angle (CA) 183contact line pinning 167contact printing technologiesadvantage and disadvantage 15anilox cylinder 14offset printing 14

continuous wave (cw) 130conventional silicon-based

semiconductors 215conventional sintering method 127conventional systems 17copper layer, inkjet-printed silver 61copper nitrate (Cu(NO3)2) 297C-reactive protein (CRP)-antigen 294CV see cyclic voltammetry (CV)cyclic voltammetry (CV) 247cyclopentadiene 286

dDCB test 279de-facto standard 27destabilization, polyacrylic acid 36dibenzylidene acetonates 121dicyclopentadiene 286dielectric permittivity 38dielectric structures and non-selective

metallization, MPL 93Diels-Alder chemistry 286differential scanning calorimetry (DSC)

110digital laser processing (DLP) method

135digital printing technologies and

flooring 2, 27dimatix materials printer DMP-2800

70

dimethylformamide (DMF) 74, 162,186, 278

dimethyl sulfoxide (DMSO) 71, 72“direct-writing” method 134, 245disk-like or cap-like ink drops 188dodecylbenzene sulfonic acid (DBSA)

299dodecyltrimethylammonium bromide

(DTAB) 253donor–acceptor-type electrochromic

polymers 323dopamine (DA) 253doping 247double printing process 133drop-on-demand (DoD) systems 27inkjet printing 119

droplet coalescence process 191droplet formationsdonor layer characteristics 11laser parameters 11

drying, wet sinteringagglomerates, formation 34Marangoni flows 34time limiting 34

dynamic droplet configurations, liquidphase fluid 236

dynamic release layer (DRL) 269dynamic wettability, substrates 190

eEC materialsanodic 317cathodic 317

ecoflex substrate 269electrical conductivity, polyanilinepolymer, oxidation state 247protonation level see doping

electrical properties, printed patterns120

electrical resistivity 127electrical sinteringAC field, mobile electrodes 132DC electrical current 131

electrochemical deposition 322electrochemical polymerization 322electrochemical properties, polyaniline

246

344 Index

electrochemical sensing 70electrochromic devices (ECD) 317electrochromics (EC) 317displays 320green buildings 318printing techniquesflexographic printing 329inkjet printing 326roll-to-roll printing 329screen printing 324

solution processing of 322transform, paper quality display

technology 320electrode array 64electro-explosion, metal wire 121electrohydrodynamic atomization inkjet

printing 297electroless copper 64electroless CuCo alloy, inkjet-printed

seed 63electroless deposition (ELD) 52, 55 see

also electroless platingelectroless metal 64electroless platingcombining, with printing 52highly selective 55MST 54NST 54on printed partselectroless metal integration 60methods 59printing catalysts 57

printing methodswith laser processing 53with nanoparticle activatedsurfaces 53

processes 119seed layer printing 57selectivity 54thermodynamics characteristics 56

electroluminescent (EL) devices 136electromagnetic (EM) radiation 37electromagnetic sintering approaches

37electromagnetic spectrum 39electroplating 51electrosteric stabilization 124

encapsulated liquid crystals (NCAP)319

energy dispersive X-ray spectroscopy(EDS) 73

ethanol cooling vs. air cooling printings239

ethylene glycol 187evaporation-condensation 33evaporation processes, inkjet-printed

graphene films 170exfoliation solvent 163experimental procedure, 3D structure

fabrication 87

ffabrication time, reduction 77face-centered cubic (fcc) structure, gold

73falling molten droplets 238ferrocene methanol (FeMeOH) 302filamentary printing method 119fluorescence and optical microscopy

image, PC12 cells 257free-radical photopolymerization

mechanisms 85Frenkel model predictions 113frustum, cone structure 237FujiFilm Dimatix Material Printer 166full-color reflective electrochromic

display 321

ggalvanic displacement 55Gentex Corporation 318Gibbs-Thomson equation 33GIc comparison, non-printed samples

and samples 281GIc(initiation) and GIc(propagation), printed

film samples 281glass reinforced epoxy 58glass transition temperatures 31glucose oxidase (GOx) 249gold nanoink sintering, glass substrates

130gold nanoparticles (Au NPs) 70, 294grain-boundary energies 33

Index 345

graphene and 2D material, thin filmprinting

performance and applications 172printing procedures 162

graphene monolayer transparentelectrodes 267

graphene nanosheets 176graphical applications 27

hHamaker constant 123Hansen solubility parameters 162height-diameter ratio (H/D) 197heterocoagulation 30Hewlett Packard 27high-aspect-ratio AgNW networks

267high resolution SEM (HRSEM) 72high-resolution X-ray diffraction (XRD)

73high speed sintering (HSS)case study 115high volume manufacturing 113inkjet benefits 116machine setup & parameter control

109materials & properties 112Nylon 12, 112

RAM 109high-vacuum technologies 1high-viscous inkjet system 11high volume manufacturing technology

116horse radish peroxidase (HRP) 249,

295HSS, high volume manufacturing 114hybrid materials 90hydrogen peroxide (H2O2) sensor 251hydrophilic substrate 189hydrophobic substrate 189

iimpulse light sintering 39industrial inkjetacoustic phenomenon 28jettable fluids, values 28Rayleigh type droplet formation 30

inertial force, dominates impact process184

injection molding, cost analysis 108injection needle array 240ink droplets, generation process 184ink formulationsbinder-containing inks 163binder-free inks 162colloidal particles, solvents 186monomer polymerization rate 188multiple components 186

inkjet inksnanoparticle inks 30precursor inks 30

inkjet printing (IJP)carbon fiber composites, functional

polymersmechanical tests 276printing and sample preparation277

patterns, PMMAmicrodroplets278

patterns, PMMA, PEGmicrodroplets 283

conducting polymer nanomaterials245

deposition technique 184drying process 8electrostatic 10fine controlled PC dots and linescoffee-ring effect, suppression193

substrate wettability 188industrial inkjet, 28–30metallic nanoinks, conductive 2D and

3D structures 119PCs 183piezoelectric IJP 7thermal IJP 7toward 3D printing 10

ink preparation method 164ink rheology 5ink stability 4Innovative Manufacturing and

Construction Research Centre(IMCRC) 115

346 Index

inorganic dielectrics, high dielectricconstant 221

inorganic–organic hybrid dielectrics220

inorganic semiconductors 215intense light processing 40interfacial jamming, particles 191interfacial transport mechanisms 33interlaminar fracture toughness 283interlaminar shear strength, composite

samples 277intrinsically conducting polymer 246intrinsic repair of composites, printed

polymers 286intrinsic roll-to-roll processes 14ion-gel dielectrics 220IR sintering 130N-isopropyl acrylamide are 188

jjetting and patterns 166Joule heating effect 235

kkinetic energy, deformation energy

conversion 185Kruss EasyDrop 71

llaser annealing process, films 172laser-array exposure 17laser-induced forward transfer (LIFT)

1, 265laser metal deposition (LMD) 229laser sintering (LS) 111laser beam focus 130

latex suspensions 197layer-by-layer manufacturing

technology see 3D printingtechnologies

leucoemeraldine 246Li-doped ZnO, transfer characteristics

217LIFT, droplet formation 11light-emitting diode (LED) 137, 270liquid crystal (LC) 318liquid metal printing ink

medical electronics 230, 232metal bone cement 231, 232other materials of 231, 233physical properties of 230, 231TEM image of 231

liquid phase 3D printingfabrication scheme 234future liquid phase printing 240liquid phase cooling fluid 234liquid phase cooling vs. gas phase

cooling 238metal objects, in cooling liquid 235,

236metal structures 236printing quality 237

lithographic techniques 93low-adhesive superhydrophobic

substrate 190low and high concentration, wet air

202low cost mass production, electronic

devices 121low evaporation temperature 195low melting point metal ink, liquid

metal printing ink 230low thermal-annealing temperatures

215

mMarangoni flow 186, 195materials for MPPhybrid materials 90organic photopolymers 89SU-8 90

mechanical stirring 126mechanical testsDCB test 277SBS test 277

metal ion printing 57metal-based inks, conductive

applicationschemical sintering, 35–36drying, wet sintering, 34–35microwave sintering 40nanoparticles or clusters 30sintering, electro-magnetic fields,

37–39

Index 347

sintering, mechanisms, 32–34thermal sintering 35

metal/electrolyte couple 55metallic inkjet nanoinks, printed

electronicsRFID tag 136TFT 136

metallic inksconductivity nanoparticle materials

294copper, nickel, alumina 296goldHRP 294nanoparticle arrays 295

metal oxide 298polymer, surfactant coatings 294silverfabricate devices and electronics296

highly conductive 296humidity sensors 296

metallic nanoinks, conductive 2D and3D structures

requirements, challenges 120stabilization, metal NPs 122synthesis, metal NPs 121

metallic nanoparticles 294metallization–dipping 61metal NPsstabilizationagainst aggregation 122against oxidation 124

synthesisbottom-up approach, formed fromprecursor ions 121

bulk metal, breaking of 121high energy radiations 122organometallic compounds 121

metal oxide nanoparticles 298metamaterials 93metal 3D printingelectronic manufacturing of 229LED circuit 229, 230

micelles 253microcolloidal crystals, controllable 3D

morphology 199, 200microcontact printing 14

MicroFab Inc. 278microfluidic, biomedical structures 90micro-scaffold 95micro system technology (MST) 54micro-supercapacitors (mSCs)Kapton, graphene electrodes 175planar 173

microwave flash method 298microwave sintering 40, 131mixed cellulose ester membrane 296modified ink with additives 57molten metal ink, inject 240monodispersed particles 186monolayer graphene sheet 269monomer/oligomer 89monomer, polymer conversion 88monomer polymerization rate 188MoS2 device 175MPP materials, photoinitiators 88multi-functional EC device 321multi-layered electrochromic display

321multi-material stack 41multi-photon absorption (MPA) 84multiphoton lithography (MPL) 83multiphoton polymerization, 3D

printingapplications 91diffraction limit 85experimental set-up 86MEMS 83microfluidics 83MPA 84MPP materials 88photosensitive materials 83

multi-walled CNTs (MWCNTs) 302MWCNT-NP’s inkjet-printed sensor

307

nNanoChromicsTM technology 320nano liquid metal fluid 232different nano particles 233, 234thermal conductivity 233

nanomaterials and nanocomposites,sensor fabrication

carbon nanomaterials 302

348 Index

nanomaterials and nanocomposites,sensor fabrication (contd.)

conductive polymers 298metallic inks, gold 294metal oxide, silver 296, 297

nanometer-scale WO3 nanoparticles298

nanoparticles (NPs) 120nanosystem technology (NST) 54nanowires (NWs) 120National Climate Change Secretariat of

Singapore (NCCS) 319near-field scanning optical microscopy

(NSOM) 86neck growth 31negative refractive index 93nicotinamide adenine dinucleotide

(NADH) 302N-methyl-2-pyrrolidone (NMP) 162,

250, 296noncontact printing 1nonionic amphiphiles 298non-light patterning techniques 86normalized conductance current versus

electrochemical potential 248NovaCentrix (USA) 126novel techniques 34nozzle-based printing 213nucleotides 253numerical aperture (N.A.) 86

ooptical microscopy images 267optical parametric oscillator (OPO) 86organic solar cells (OSC) 119metallic electrode 139photovoltaic devices 138

ppalladium (Pd) ions 572015 Paris Climate Conference 317PC microchip, hydrophilic PC dots

203PC patterning methods 183PC patternsfiltration 196fluorescent PC 198

H/D ratio 198PC dots or lines 196

photo-annealed IGZO TFT 219photodetectors 175photoinitiatorshigh two-photon cross-section 89laser wavelength 88

photolithography 119photoluminescent GO nanosheets 304photonic and microwave flash

treatments 131photonic crystals (PCs)applications, printing 196IJP, fine controlled PC dots and linesink formation 186substrate wettability 188

light manipulation properties 183patterned 183process, inkjet printing 184

photonic flash sinteringintense light pulse 129R2R processing 129

photonic metamaterials 93photonic sintering 41excitation wavelengths 129selective light absorption 129

photopolymerization 84optical manufacturing technology

17photocurable materials 18vat photopolymerization 17

photopolymer ORMOCER 91photosensitive polymer 87physical, vacuum deposition (PVD) 57piezo-actuation frequencies 29piezo-based inkjet technologies 27plasma ashing 71plasma sintering printed patterns, to

low-pressure 130Plateau-Rayleigh instability 10, 28PMMA see poly(methyl methacrylate)

(PMMA)pneumatic-typed fused deposition

modeling 238polarized piezo-ceramics 28poly(3,4-ethylenedioxythiophene)

(PEDOT) 302

Index 349

chemical structure 258properties, synthesis of 258

poly(acrylic acid) (PAA) shell 124, 196polyaniline 246polyaniline-copper chloride (CuCl2)

nanocomposites 300polyaniline nanomaterialschemical structure 246applications 250inkjet printed 249

polyaniline-poly(4-styrenesulfonate)(PANI-PSS) 250

polyaniline synthesischemical oxidative polymerization

248electrochemical polymerization 248

polyaniline with dodecylbenzenesulfonic acid (PANI–DBSA)323

polycarbonate (PC) 39polycarboxylate salts 322polycation

poly(diallyldimethylammoniumchloride) (PDAC) 132

polydimethylsiloxane (PDMS)electrodes 269

polyelectrolyte multilayers (PEMs) 60polyethylene glycol (PEG) 278poly(ethylene glycol) diacrylate

(PEGDA) matrix 134poly(ethylene naphthalate) (PEN) 39polyethylene terephthalate

(PET) 39, 301polymer-dispersed liquid crystals

(PDLC) 319polymeric electrochromes

𝜋-conjugated 322transmissive/reflective ECs and

displays 322poly(methyl methacrylate) (PMMA)

220, 278polyols 124polypyrrole (Ppy) 301cyclic voltammogram 252electroactive polymer 252inkjet printing and applications 254nanoformulations 253

properties and synthesis of 251SEM images 254

polystyrene (PS) 220polystyrene sulfonate (PSS) 250, 302polytetrafluoroethylene (PTFE) film

277polythiophene (Pth)chemical structure 258inkjet printing and applications 258properties, synthesis of 258

polyvinylpyrrolidone (PVP) 35, 123,267

porous aluminoscilicate 253positive photoresists, MPL 93powder bed fusion (PBF) 19powder bed technology 19presintering 40primary thermodynamic driving force

33printable dielectric materialsdielectrics, high capacitance 220inorganic–organic hybrid dielectrics

220ionic liquid and triblock copolymer

221passive materials, active device 219

printable semiconducting materialsbandgap 213cyclopentasilane 215electrical stability 215field-effect mobility 214organic semiconductors 213synthetic approaches 218

printed AgNW electrodesAgNWs printing, LIFT 269fabrication and properties, stretchable

electrodes 269printed array, heat treatment 78printed films, gellan gum 306printed graphene transparent

conductive films 173printed parts, electroless platingelectroless metal integration 60methodspreseed surface modification 60printed Ag ink 60printed Pd seed 59

350 Index

printed polyaniline films 301printed silver nanowires, laser-induced

forward transferAgNW transparent electrodes 266printed AgNW electrodesAgNWs printing, LIFT 269fabrication and properties,stretchable electrodes 269

printhead technologies, employ ink flow30

printing PCs, applications in chemicaldetection 201

microcolloidal crystals, controllable3D morphology 199

PCs patterns 196in vapor sensors 201

printing proceduresdrying 166ink formulations 162jetting and patterns 167posttreatmentsgraphene flakes 172insulating 171

printing techniques, ECfabricate electrochromic device 329flexographic printing 329inkjet printingdigital printing method 326electrochromic cell, silver gridelectrode 328

non-contact direct writetechnology 326

roll-to-roll printing 329screen printingadditive patterning method 324flat printing technique 324high viscosity, low volatility 324PEDOT, PSS based active-matrixdisplay 325

printing technologies, nanomaterialscontact printing technologies 13gravure printing 15ink formulation strategies 4inkjet printing 7LIFT 11photopolymerization 17powder bed technology 19

properties, 2D materials 1663,4-propylenedioxythiophene

(ProDOT), switches 322prussian blue 301p-type organic semiconductors 214PVP capping agent, sheet resistance

268

qquenching 86

rradiation absorbing material (RAM)

109radical photoinitiators 89RAM 110, 112Rayleigh instability 192reactive inkjet (RIJ)Au NPs growth, parameters

influencing 74chemical patterning

approach 69fabrication time, reduction 77printing scheme 71printing techniques 69self-assembled Au NPs 70single cartridge step 77

real-time optical microscope images202

recrystallisation 111reducing agent/electrolyte couple 55reductive (H2) atmospheres 128reversible electrochemical mirrors

(REMs) 321reversible electrodeposition 321rheological measurements 29rheology 119ribbon-and wire-like nanostructures

253ring-like deposition 186roll-to-roll (R2R)printing 213technique 120

Royal Society of Chemistry 203R2R printing, heat-sensitive flexible

substrates 121RT sintering 132

Index 351

Ruffo model 114ruthenium-based dye-sensitized solar

cells 176

ssaturated calomel electrode (SCE) 253scanning electron microscope (SEM)

249screen printingconductive films 119embodiments of 16

seed layer printingmetal ion printing 57printing nanoparticle ink 57

self-assembled monolayer (SAM) 60self-diffusion, surface atoms 127SEM imageAuNPs 74, 762D conductive structures 128

sensors, automotive safety 293sequential absorption 84sheet resistance, optical transmittance

127, 268sheet-to-sheet/roll-to-roll compatibility

39short beam shear (SBS) 276silver-based EC 321silver nanowires (AgNWs) 265simultaneous absorption 84single cartridge step 77single-walled carbon nanotubes

(SWCNT) 253, 302sintering, mechanismsArrhenius-type behavior 32bulk transport 33Gibbs-Thomson equation 33

smart windows technologyEC 318LC 318

sodium dodecyl benzene sulfonate(SDBS) 256

sodium dodecyl sulfate (SDS) 123, 305soft-template methods 253solar cells 177solar heat gain coefficient (SHGC) 318solution-casting polymerization 322solution-processable coating techniques

hydrothermal, solvothermal 322spray-coating, slot-die coating 322

solution processing, ECpolymeric electrochromes 322solution-processable coating

techniques 322spiral electrodes, jetted poly(3-hexyl-

thiophene) polymer 259splashing 185spreading 185stabilizationagainst aggregationagglomeration and sedimentation122

electrostatic 123against oxidationoxidation, Cu NPs 125silver NPs 124transmetallation 125

steric 123stereolithography 108stöbersynthesis 186substrate wettabilityhydrophilic or hydrophobic 188morphology 188

substrate-catalyzed electroless plating55

substrate, influence, 41–42subtractive CMY 320superhydrophobic substrate 190supply chain, opening 115supramolecular protein layers

streptavidin 295surface diffusion 33surface energy, kinetic energy

conversion 185surface topography 172surface-to-volume ratio 127surfactant sodium dodecylsulfate (SDS)

253suspended-particle

devices (SPD) 318synthesis route, monomers 287

ttemplate-free synthesis 253tension gradient 186

352 Index

terpineol 164thermal conductivity, volume fraction

234thermal equilibrium 41thermal evaporation/sputtering 70thermal sintering 35heating printed pattern 127necks formation 128

thin film transistors (TFT) 136, 2453D conductive patterns, formation and

sinteringadditive manufacturing 134UV-curable inks, monomers 134UV-curable liquids 134UV-polymerizable oil-in-water

emulsion 1353D metal printing 533D morphology, microcolloidal PC

pattern 2003D photonic crystal 923D polymer printing 533D printing technologiesCAD 2selective deposition techniquesfused deposition modeling 3viscous jetting 3

3D printed substrate 62three phase contact line (TCL) 185time-dependent model 41Ti, Sapphire femtosecond oscillator 86TNO 10top-contact/bottom-gate OFET device

220top-down patterning approaches 245Toppare group 323transition metal oxide (TMOs) 323transmittance spectra, solid

electrochromic device 328transparent and stretchable electrodes,

AgNWs 265transparent conductive electrodes

(TCE) 119, 317ITO 137ultrathin films formation 137

transparent conductors 173transparent electrodes, performance

266

Triton X-100 (poly(oxyethylene)octylphenyl ether) 123

tungsten trioxide (WO3) films 3172D metallic structure 1292D printed pattern, high electrical

conductivity 1272D printing technologies, functional

nanomaterialscontact (mask-based) printing

technologies 1noncontact (maskless) printing

technologies 1two-phase organic solvent-water system

124two-photon absorption (TPA)sequential 84simultaneous 84

uUK Technology Strategy Board 107ultra-long AgNWs 268ultrasonication 126ultraviolet (UV) 37under-the-bonnet applications 107

vvacuum-deposited oxide

semiconductors 215vacuum deposition 119van der Pauw resistivity 63van der Waals interactions 303VOC sensor array 259volatile organic compound (VOC) 258

wwaveform tuning 7wet chemical approach 121whilst laser sintering 113wide-to grand-format printing 27WO3 nanorods 323

xx–y galvanometric mirror scanner 86

yYoung’s modulus 200Y-shape PC microfluidic immune assay

202

Index 353

zzero-dimensional objects 4zero pressure boundary condition 28zero velocity boundary condition 28zirconium-doped aluminum oxide

(ZAO) 223

zirconium doping 223Zn-hydroxide precursor, ZnO

semiconductor 216ZnO TFTs, ion-gel gate insulator 222Zr-doped AlOx dielectrics 221