Industrial Internship Programme

8/3/2019 Industrial Internship Programme

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Name: SADEQ ALI QASEM MOHAMMEDMatrix No: DE080205Industrial Supervisor: Dr. Nafarizal NayanFaculty Supervisor: Dr. Khairun Nidzam Bin Ramli



HISTORY• Microelectronics& Nanotechnology - Shamsuddin

Research Centre or MiNT-SRC is one of the Center ofExcellence at University Tun Hussein Onn Malaysia(UTHM). It was established in November 27th, 2006.

Formerly it was known as Microelectronic andNanotechnology Centre (MiNTEC). In November25th, 2007, the name of Microelectronic &Nanotechnology - Shamsuddin Research Center waseffective as an acknowledgment to our university'sformer chairman Y. Bhg. Tan Sri Dato' Seri Ir

Shamsuddin bin Abdul Kadir for his contribution to theuniversity (2007-2009). He is currently appointed asfirst Pro-Chancellor of UTHM



Electrical and ElectronicEngineering dean

prof. HJ. AYOB BIN HJ. JOHARI

Deputy Dean Of Faculty

Electrical and ElectronicEngineering

MicroelectronicLaboratory

(En. Ahmad Nasrull

Mohamed)

Thin FilmTechnology

(Dr. nafarizalNayan)

BiomedicalEngineering

(En. AhmedAlabqari Ma'Radzi)

NanolithographyTechnology

(Dr. Mohd ArifAgam)

Digital System DesignLaboratory

(En. Hasnah Rahmad)

VLSI Design&Microelectronic

(En. Mohd SuhaimiSulong)



To relate the theory learnt in university tothe practical training in the program.

To provide the student an opportunity to getan early exposure in the industry.

To improve the communication skills of thestudent.

To boost up the confident level of thestudent.





magnetron sputtering this machine uses DC and RF sputtering to coat theglass in order to make a thin film the Method of depositing thin films bysputtering that is ejecting material from a "target" that is source, thendeposits onto a "substrate," such as a silicon wafer. Re-sputtering is re-emission of the deposited material during the deposition process by ion oratom bombardment.

http://en.wikipedia.org/wiki/Thin_film_deposition

http://en.wikipedia.org/wiki/Thin_film

http://en.wikipedia.org/wiki/Sputtering

http://en.wikipedia.org/wiki/Resputtering




http://en.wikipedia.org/wiki/Sputtering

http://en.wikipedia.org/wiki/Thin_film




The RF diode sputtering system requires an impedance-matchingnetwork between the power supply and the discharge chamber. In theRF discharge system the operating pressure is lowered to as low as1mTorr, since the RF electric field in the discharge chamber increasesthe collision probability between secondary electrons and gasmolecules



RIE system consists of a cylindricalvacuum chamber, with a wafer plattersituated in the bottom portion of the

chamber. The wafer platter is electricallyisolated from the rest of the chamber,which is usually grounded. Gas entersthrough small inlets in the top of thechamber, and exits to the vacuum pump system through the bottom. The types andamount of gas used vary depending uponthe etch process.

http://en.wikipedia.org/wiki/Wafer_(electronics)

http://en.wikipedia.org/wiki/Ground_(electricity)

http://en.wikipedia.org/wiki/Vacuum_pump

http://en.wikipedia.org/wiki/Vacuum_pump

http://en.wikipedia.org/wiki/Ground_(electricity)

http://en.wikipedia.org/wiki/Wafer_(electronics)



Evaporation is a common method of thin film deposition. The sourcematerial is evaporated in a vacuum. The vacuum allows vaporparticles to travel directly to the target object (substrate), where theycondense back to a solid state. Evaporation is usedin microfabrication, and to make macro-scale products such

as metallized plastic film.


http://en.wikipedia.org/wiki/Evaporation

http://en.wikipedia.org/wiki/Vacuum

http://en.wikipedia.org/wiki/Microfabrication

http://en.wikipedia.org/wiki/Metallize

http://en.wikipedia.org/wiki/Metallize

http://en.wikipedia.org/wiki/Microfabrication

http://en.wikipedia.org/wiki/Vacuum

http://en.wikipedia.org/wiki/Evaporation




It measure thin-film thickness by analyzing how light isreflected by the film. By analyzing wavelengths beyond thosevisible to the human eye it can measure nearly all non-metallicfilms greater than 100 atoms thick. And because there are nomoving parts, results are available in seconds: film thickness,refractive index, even roughness.



Atomic force microscopy (AFM) or scanning force microscopy (SFM)is a very high-resolution type of scanning probe microscopy, withdemonstrated resolution on the order of fractions of a nanometer,more than 1000 times better than the optical diffraction limit. Thisdevice have many image mode as 3D image mode, gain imagemode and some more.

http://en.wikipedia.org/wiki/Scanning_probe_microscopy

http://en.wikipedia.org/wiki/Nanometer

http://en.wikipedia.org/wiki/Diffraction_limited

http://en.wikipedia.org/wiki/Diffraction_limited

http://en.wikipedia.org/wiki/Nanometer

http://en.wikipedia.org/wiki/Scanning_probe_microscopy



Surface Profiler is a measuring instrument used to measure surface's profile,in order to quantify its roughness. A diamond stylus is moved vertically incontact with a sample and then moved laterally across the sample for aspecified distance and specified contact force. A Surface Profiler can measuresmall surface variations in vertical stylus displacement as a function ofposition. A typical Surface Profiler can measure small vertical features ranging

in height from 10 nanometers to 1 millimeter.

http://en.wikipedia.org/wiki/Measuring_instrument

http://en.wikipedia.org/wiki/Surface

http://en.wikipedia.org/wiki/Quantify

http://en.wikipedia.org/wiki/Surface_roughness

http://en.wikipedia.org/wiki/Surface_roughness

http://en.wikipedia.org/wiki/Quantify

http://en.wikipedia.org/wiki/Surface

http://en.wikipedia.org/wiki/Measuring_instrument



A field-emission cathode in the electron gun of a scanning electron

microscope provides narrower probing beams at low as well as highelectron energy, resulting in both improved spatial resolution andminimized sample charging and damage. For applications which demandthe highest magnification possible.



Plasma is partially ionized gases consisting of ions,electrons, free radicals and neutral species. Thisionized gas mixture is conductive and highly reactive,which provides the basis for the plasma process.

In circuit board applications the panels are suspendedbetween electrodes. process gas is introduced and theelectrodes are energized with RF energy. This initiatesthe plasma.



The Atmospheric pressure plasma (APP) will be generated by usingdielectric-barrier discharge which is the easiest way to generate theAPP, got many planner design of dielectric-barrier discharge.

at least one dielectric barrier these discharges require alternating voltagesfor their operation. The dielectric, being an insulator, cannot pass a dc

current. Its dielectric constant and thickness, in combination with the timederivative of the applied voltage, dU/dt, determine the amount ofdisplacement current that can be passed through the dielectric( s). Totransport current (other than capacitive) in the discharge gap the electricfield has to be high enough to cause breakdown in the gas.



A clean room is a specially constructed enclosed area environmentally controlled

with respect to airborne particulate, air temperature, humidity, air pressure, airflow

pattern, air motion electromagnetic signals and lighting. It’s typically use in

manufacturing or scientific research that has a low level of environmental pollutants

such as dust, airborne microbes, aerosol particles and chemical vapors. More

accurately, a clean room has a controlled level of contamination that is specified bythe number of particles per cubic meter and by maximum particle size.



Clean room consist of one partition or room which surrounded by a return air

chamber. RAC (Return Air Chamber) is needed to allow the air flow belowthe raised floor return to FFU (Fan Filter Unit). The sizes of return airchamber is very important, because the rate of fresh air volume needed tosupply back to the clean room must be less than the volume of the RAC. Inother words, the RAC must be able to supply the volume of air needed backto the clean room. Air flow in the RAC is at different direction as inside the

clean room which is facing up; this is due to the suction of the FFU at the topof the clean room. The schematic of clean room at Media of M1 and M2plants are shown



Time Management

CommunicationSkills

Teamwork

Safety Training&

Awareness

Reporting

Problem Solving Skill



For MiNT-SRC~ Training should be well planned

For University~ Organize an industrial talk



All objectives were successfully achieved.Various lessons learned and experience

gained.Learn the work cultureA success Industrial internship program



THANKYOU

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Industrial Internship Programme

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