10/5/2006 1 Introduction and Methodology Microchip Technology Incorporated’s (Microchip) semiconductor devices assembled at our facility outside Bangkok, Thailand, and by sub-contracted assembly sites throughout the world. Frequently, the Bill of Materials (BOM) will vary among assembly sites for a given package configuration. The majority of variation lies in the mold compound and/or copper-alloy lead frame. Of necessity, the semiconductor device material data presented (Material Content Declaration or MCD) is calculated using a mass balance methodology creates a composite average constituent list representing the BOM variability across multiple assembly sites. Where there is a material, environmentally significant, difference at a specific assembly site, the substance list and concentrations for that assembly site are presented on a separate tab and the assembly site is identified. Ozone Depleting Materials Microchip Technology Incorporated's semiconductor devices neither contain nor are manufactured with Class I or Class II Ozone Depleting Materials. Brominated Flame Retardant Polymers Many of the mold compounds used by Microchip or its sub-contract assembly houses contain one of two brominated phenolic/epoxy polymers: CAS # 68541- 56-0 or CAS # 40039-93-8. Neither of these brominated phenolic/epoxy polymers is regulated by European Union Directive 2003/11/EC (6 February 2003) or by European Union Directive 2002/95/EC (27 January 2003). Microchip’s semiconductor devices do not contain pentaBDE or octaBDE, two brominated flame retardants regulated by European Union Directive 2003/11/EC (6 February 2003). Microchip’s semiconductor devices do not contain DecaBDE Red Phosphorous The mold compounds used by Microchip and its sub-contract assembly houses to assemble Microchip’s semiconductor devices do not contain inorganic particulate red phosphorous. Diantimony trioxide is the primary inorganic flame retardant material in most mold compounds; one unique mold compound uses a trade secret “metal hydroxide” instead of diantimony trioxide. Certain mold compounds contain neither an inorganic flame retardant nor a brominated flame retardant. Organophosphorous Compound One mold compound used by one sub-contract assembly site to manufacture one version of Microchip’s 14 lead –SL (SOIC) semiconductor device contains a trade secret organophosphorous catalyst.
Transcript
10/5/2006 1
Introduction and Methodology Microchip Technology Incorporated’s (Microchip) semiconductor devices assembled at our facility outside Bangkok, Thailand, and by sub-contracted assembly sites throughout the world. Frequently, the Bill of Materials (BOM) will vary among assembly sites for a given package configuration. The majority of variation lies in the mold compound and/or copper-alloy lead frame. Of necessity, the semiconductor device material data presented (Material Content Declaration or MCD) is calculated using a mass balance methodology creates a composite average constituent list representing the BOM variability across multiple assembly sites. Where there is a material, environmentally significant, difference at a specific assembly site, the substance list and concentrations for that assembly site are presented on a separate tab and the assembly site is identified.
Ozone Depleting Materials Microchip Technology Incorporated's semiconductor devices neither contain nor are manufactured with Class I or Class II Ozone Depleting Materials.
Brominated Flame Retardant Polymers Many of the mold compounds used by Microchip or its sub-contract assembly houses contain one of two brominated phenolic/epoxy polymers: CAS # 68541-56-0 or CAS # 40039-93-8. Neither of these brominated phenolic/epoxy polymers is regulated by European Union Directive 2003/11/EC (6 February 2003) or by European Union Directive 2002/95/EC (27 January 2003). Microchip’s semiconductor devices do not contain pentaBDE or octaBDE, two brominated flame retardants regulated by European Union Directive 2003/11/EC (6 February 2003). Microchip’s semiconductor devices do not contain DecaBDE
Red Phosphorous The mold compounds used by Microchip and its sub-contract assembly houses to assemble Microchip’s semiconductor devices do not contain inorganic particulate red phosphorous. Diantimony trioxide is the primary inorganic flame retardant material in most mold compounds; one unique mold compound uses a trade secret “metal hydroxide” instead of diantimony trioxide. Certain mold compounds contain neither an inorganic flame retardant nor a brominated flame retardant.
Organophosphorous Compound One mold compound used by one sub-contract assembly site to manufacture one version of Microchip’s 14 lead –SL (SOIC) semiconductor device contains a trade secret organophosphorous catalyst.
10/5/2006 2
One mold compound used by one sub-contract assembly site to manufacture one version of Microchip’s 100 lead –PF (TQFP 14x14) semiconductor device contains a trade secret, aromatic organophosphorous flame retardant.
Absence of Chemical Substances If a chemical substance is, absent from the Material Content Declaration (MCD) reflecting its Bill of Materials (Material BOM) at a specific assembly site, its absence from the chemical substance list(s) means:
• The chemical substance is NOT an intentional ingredient in the semiconductor device or any of its homogenous materials.
• To the best of Microchip’s knowledge and belief, as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is not below the threshold of regulatory concern for any regulatory scheme worldwide.
DFARS 252.225-7014 and 225.872-1 "Specialty Metals" Microchip’s products may comply with the DFAR listed above. Microchip’s products are designed and manufactured for commercial applications and are not required to comply with any portion of the DFAR listed above. Our customers regulated by the above requirement, should seek a waiver of its application for Microchip’s commercial products, or indicate specific products of interest, so that Microchip, if practical, can research the specifics
Alloy 42 Lead Frame Microchip’s 4 lead SOT-143 semiconductor device, two versions of Microchip's 3 lead SOT-23 semiconductor device (SnPb and Pb-free), and two versions of Microchip's 3 lead TO-92 semiconductor device (SnPb and Pb-free) use an Alloy 42 lead frame, the primary constituents of which are iron (Fe) and nickel (Ni). In this respect, these five semiconductor devices differ from all other Microchip standard products that use a copper-alloy (Cu) lead frame. Nickel is homogenized into the alloy; therefore, no skin contact is possible.
Recyclate Information (IMDS Format) Amount of contained recyclate – as released? 0% Amount of contained recyclate – as measured? 0% Amount of contained recyclate – post industrial recyclate? 0 g / 0% Amount of contained recyclate – post consumer recyclate? 0 g / 0%
Joint Industry Guide JIG is an acronym for Joint Industry Guide. Specifically, it refers to the JIG-101 document titled, "Material Composition Declaration for Electronic Products (Electronics Industry Association, April 2005)." It is important to recognize that the JIG-101 guideline is NOT law – it is a guideline.
10/5/2006 3
Microchip's semiconductor devices do not contain Class I and Class II Ozone Depleting Materials and are not manufactured using JIG "Level A Materials and Substances." "JIG Level A Materials and Substances" are prohibited from intentional use, and many "JIG "Level A Materials and Substances" have maximum allowable impurity concentrations. Many, but not all, of Microchip's semiconductor devices contain two, JIG-101 "Level B Materials and Substances” above the reporting threshold: diantimony trioxide and/or brominated flame retardants other than PBB or PBDE, both are used as flame retardants in the mold compounds. Level B materials may be intentionally added but their presence must be reported (declared) if their individual maximum concentration exceeds a specified threshold concentration.
Microchip Technology Incorporated’s General Statement of Warranty The exclusive, limited product warranties Microchip Technology Incorporated and each of its selling subsidiaries offer are contained in Microchip Technology Incorporated’s standard terms and conditions of sale, which are provided to the customer in Microchip Technology Incorporated’s quotations, sales order confirmations, and invoices.
Additional Web based Resources
Microchip’s Corporate Certificate of RoHS Compliance (CoC) for Exempt Applications-SnPb-Plated Semiconductor Devices (5 of 6) is published on Microchip’s website:
www.microchip.com > Corporate > Environmental Health and Safety > RoHS Certificate of Compliance Exempt SnPb Applications
FAQ’s a general overview of Microchip’s Pb-Free transition & strategy
www.microchip.com/pbfree
A “Gateway" to Microchip’s Pb-Free products which includes more links and is a perfect starting point to understanding Microchip’s Pb-Free Products
Microchip’s RoHS Device Search:
www.microchip.com > Corporate > Environmental Health and Safety > Resources (box) – RoHS Device Search
Microchip’s corporate Certificate of RoHS Compliance (CoC) for all of its Pb-free semiconductor devices is published on Microchip’s website:
www.microchip.com > Corporate > Environmental Health and Safety > Certificate of Compliance with EU Directive 2002/95/EC (RoHS Directive) for Pb-free Semiconductor Devices
Trace metals analytical reports by package type for Pb-free semiconductor devices are available on Microchip's website:
www.microchip.com > Corporate > Environmental Health and Safety > Pb-free Laboratory Analytical Reports
How to use this document: This document is bookmarked and arranged numerically/alphabetically by pin/package family, i.e. 03 (number of pins/leads) DDPAK (Double Deca-watt Package) to 20 (number of pins/leads) TSSOP (Thin Shrink Small Outline Package). This document is cross-referenced by "Style Designator” an alpha alpha coding found in Microchip’s semiconductor catalog /part numbers. For all Microchip Analog Products beginning with "MCP":MCP112-240E/TOG
MCP 112 "Blank" - 240 N/A E / TO GMCP XXXXXX X - XXX X / XX(G)
Product Prefix
Product Part/ID number
Tape and Reel
Reset Voltage Thresholds or Performance
Options
Supervisor Bond
Options
Operation Temperature
Range
Package Type
Matte-Tin pin/lead Plating
TO-92 (Transistor Outline) with 3 Pins and Matte-Tin pin/lead plating
For all Microchip Picmicro®, KeeLoq®, RFID, RfHCS and Memory ProductsPIC16C64A-04E/PQ014
PIC 16C64 A - 04 E / PQ 014MCP XXXXXX X - XXX X / XX XXX
Product Prefix
Device Type
Option Speed or Crystal Freq.
Process Temp.
Package Type
Special Requirements
MQFP (Metric Plastic Quad Flat pack Package) with 44 pins
TC1017R-4.0VLTTRGTC 1017 R - 4.0 V LT TR G
MCP XXXXXX X - X.X X XX XXXProduct Prefix
Product Part Number (2>6)
Electrical Performance Grade Option
Output or Detect
Voltage
Operating Temp Range
Package Type and number of
Taping Direction
Matte-Tin pin/lead finish
For all Microchip Analog Products beginning with "TC" (formerly TelCom Semiconductor Products:
SC70 (Small Outline Transistor Plastic Packages) with 5 pin/leads
Tin 7440-31-5 Solder surface finish 0.986 13.994 9,855
Silver 7440-22-4 Lead frame, Die attach 0.819 11.634 8,193
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 0.814 11.554 8,137
Iron 7439-89-6 Lead frame 0.646 9.177 6,463
Lead 7439-92-1 Solder surface finish 0.475 6.738 4,745
Gold 7440-57-5 Wire Bond 0.200 2.840 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 2.796 1,969
Carbon Black 1333-86-4 Mold compound 0.188 2.666 1,878
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.651 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.449 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.559 394
Zinc 7440-66-6 Lead frame 0.034 0.488 344
Phosphorus 7723-14-0 Lead frame 0.023 0.322 227TOTALS 100.000 1,420.000 1000000
Assembly Site: CARSEM 1.4200 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
8 2:20 PM : 10/5/2006EB 3 (DDPAK) CARSEM
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ET 5 (Lead) DDPAK Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.986 14.413 9,855
Silver 7440-22-4 Lead frame, Die attach 0.819 11.982 8,193
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 0.814 11.900 8,137
Iron 7439-89-6 Lead frame 0.646 9.451 6,463
Lead 7439-92-1 Solder surface finish 0.475 6.940 4,745
Gold 7440-57-5 Wire Bond 0.200 2.925 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 2.880 1,969
Carbon Black 1333-86-4 Mold compound 0.188 2.746 1,878
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.700 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.492 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.576 394
Zinc 7440-66-6 Lead frame 0.034 0.503 344
Phosphorus 7723-14-0 Lead frame 0.023 0.332 227TOTALS 100.000 1,462.500 1000000
Assembly Site: CARSEM 1.4625 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.019 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.011 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.009 4,063
Iron 7439-89-6 Lead frame 0.247 0.005 2,468
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.005 2,394
Gold 7440-57-5 Wire Bond 0.200 0.004 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.004 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.003 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.002 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.001 394
Zinc 7440-66-6 Lead frame 0.013 0.000 131
Phosphorus 7723-14-0 Lead frame 0.009 0.000 87TOTALS 100.000 2.200 1,000,000
Assembly Site: ANAP 0.0022 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Carbon Black 1333-86-4 Mold compound 0.239 0.005 2,394
Gold 7440-57-5 Wire Bond 0.200 0.004 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.004 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.003 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.002 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.001 394
Zinc 7440-66-6 Lead frame 0.013 0.000 131
Phosphorous 7723-14-0 Lead frame 0.009 0.000 87TOTALS 100.000 2.200 1,000,000
Assembly Site: CARSEM 0.0022 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.019 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.018 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.009 4,063
Iron 7439-89-6 Lead frame 0.247 0.005 2,468
Carbon Black 1333-86-4 Mold compound [EME-G770] 0.239 0.005 2,394
Gold 7440-57-5 Wire Bond 0.200 0.004 2,000
Diester Resin Trade Secret Die attach 0.064 0.001 638
Functionalized Urethane Resin Trade Secret Die attach 0.038 0.001 375
Epoxy Resin Trade Secret Die attach 0.034 0.001 338
Zinc 7440-66-6 Lead frame 0.013 0.000 131
Phosphorus 7723-14-0 Lead frame 0.009 0.000 87TOTALS 100.000 2.200 1,000,000
Various Assembly Sites / Material compilation 0.0022 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.599 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.352 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.288 4,063
Iron 7439-89-6 Lead frame 0.247 0.175 2,468
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.170 2,394
Gold 7440-57-5 Wire Bond 0.200 0.142 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.140 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.083 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.072 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.028 394
Zinc 7440-66-6 Lead frame 0.013 0.009 131
Phosphorus 7723-14-0 Lead frame 0.009 0.006 87TOTALS 100.000 71.000 1,000,000
Assembly Site: ANAP 0.0710 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.599 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.352 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.288 4,063
Iron 7439-89-6 Lead frame 0.247 0.175 2,468
Carbon Black 1333-86-4 Mold compound [EME-G770] 0.239 0.170 2,394
Gold 7440-57-5 Wire Bond 0.200 0.142 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.140 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.083 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.072 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.028 394
Zinc 7440-66-6 Lead frame 0.013 0.009 131
Phosphorus 7723-14-0 Lead frame 0.009 0.006 87TOTALS 100.000 71.000 1,000,000
Assembly Site: ASAT 0.0710 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.599 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.579 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.288 4,063
Iron 7439-89-6 Lead frame 0.247 0.175 2,468
Carbon Black 1333-86-4 Mold compound [EME-G770] 0.239 0.170 2,394
Gold 7440-57-5 Wire Bond 0.200 0.142 2,000
Diester Resin Trade Secret Die attach 0.064 0.045 638
Functionalized Urethane Resin Trade Secret Die attach 0.038 0.027 375
Epoxy Resin Trade Secret Die attach 0.034 0.024 338
Zinc 7440-66-6 Lead frame 0.013 0.009 131
Phosphorus 7723-14-0 Lead frame 0.009 0.006 87TOTALS 100.000 71.000 1,000,000
Assembly Site: NSEB 0.0710 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.209 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.123 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.101 4,063
Iron 7439-89-6 Lead frame 0.247 0.061 2,468
Carbon Black 1333-86-4 Mold compound [EME-G770] 0.239 0.059 2,394
Gold 7440-57-5 Wire Bond 0.200 0.050 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.049 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.029 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.025 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.010 394
Zinc 7440-66-6 Lead frame 0.013 0.003 131
Phosphorus 7723-14-0 Lead frame 0.009 0.002 87TOTALS 100.000 24.800 1,000,000
Assembly Site: CARSEM 0.0248 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 4.065 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.387 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.957 4,063
Nickel 7440-02-0 Lead frame 0.336 1.619 3,360
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 1.153 2,394
Gold 7440-57-5 Wire Bond 0.200 0.964 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.949 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.560 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.492 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.190 394
Magnesium 7439-95-4 Lead frame 0.018 0.089 184TOTALS 100.000 481.800 1,000,000
Assembly Site: ALPHA 0.4818 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 4.065 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.387 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.957 4,063
Nickel 7440-02-0 Lead frame 0.336 1.619 3,360
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 1.153 2,394
Gold 7440-57-5 Wire Bond 0.200 0.964 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.949 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.560 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.492 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.190 394
Magnesium 7439-95-4 Lead frame 0.018 0.089 184TOTALS 100.000 481.800 1,000,000
Assembly Site: ANAP 0.4818 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 4.998 10,374
Tin 7440-31-5 Solder surface finish 0.844 4.065 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 3.927 8,150
Lead 7439-92-1 Solder surface finish 0.406 1.957 4,063
Nickel 7440-02-0 Lead frame 0.336 1.619 3,360
Carbon Black 1333-86-4 Mold compound 0.239 1.153 2,394
Gold 7440-57-5 Wire Bond 0.200 0.964 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.361 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.199 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.090 188
Magnesium 7439-95-4 Lead frame 0.018 0.089 184TOTALS 100.000 481.800 1,000,000
Assembly Site: CARSEM 0.4818 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 9.789 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 5.748 4,954
Lead 7439-92-1 Solder surface finish 0.406 4.713 4,063
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 2.778 2,394
Gold 7440-57-5 Wire Bond 0.200 2.320 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 2.285 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.349 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.184 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.457 394
Zirconium 7440-67-7 Lead frame 0.011 0.122 105
Manganese 7439-86-5 Lead frame 0.001 0.006 5TOTALS 100.000 1,160.200 1,000,000
Assembly Site: ANAP 1.1602 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
20 2:20 PM : 10/5/2006PQ 64 (MQFP) ANAP
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: MS and UA 8 (Lead) MSOP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.266 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.216 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.209 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.104 4,063
Nickel 7440-02-0 Lead frame 0.336 0.086 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.061 2,394
Gold 7440-57-5 Wire Bond 0.200 0.051 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.019 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.011 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.005 188
Magnesium 7439-95-4 Lead frame 0.018 0.005 184TOTALS 100.000 25.600 1,000,000
Assembly Site: ANAP 0.0256 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
21 2:20 PM : 10/5/2006MS or UA 8 (MSOP) ANAP
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: MS and UA 8 (Lead) MSOP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 0.511 19,950
Tin 7440-31-5 Solder surface finish 0.844 0.216 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.127 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.104 4,063
Nickel 7440-02-0 Lead frame 0.336 0.086 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.061 2,394
Gold 7440-57-5 Wire Bond 0.200 0.051 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.050 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.030 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.026 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.010 394
Magnesium 7439-95-4 Lead frame 0.018 0.005 184TOTALS 100.000 25.600 1,000,000
Assembly Site: UNISEM 0.0256 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
22 2:20 PM : 10/5/2006MS or UA 8 (MSOP) UNISEM
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: MS and UA 8 (Lead) MSOP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.266 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.216 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.209 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.104 4,063
Iron 7439-89-6 Lead frame 0.247 0.063 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.061 2,394
Gold 7440-57-5 Wire Bond 0.200 0.051 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.019 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.011 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.005 188
Zinc 7440-66-6 Lead frame 0.013 0.003 131
Phosphorus 7723-14-0 Lead frame 0.009 0.002 87TOTALS 100.000 25.600 1,000,000
Various Assembly Sites / Material compilation 0.0256 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
23 2:20 PM : 10/5/2006MS or UA 8 (MSOP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: MS and UA 10 (Lead) MSOP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.268 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.218 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.128 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.105 4,063
Iron 7439-89-6 Lead frame 0.247 0.064 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.062 2,394
Gold 7440-57-5 Wire Bond 0.200 0.052 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.051 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.030 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.026 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.010 394
Zinc 7440-66-6 Lead frame 0.013 0.003 131
Phosphorus 7723-14-0 Lead frame 0.009 0.002 87TOTALS 100.000 25.800 1,000,000
Assembly Site: ANAP 0.0258 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
24 2:20 PM : 10/5/2006UN 10 (MSOP) ANAP
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: MS and UA 10 (Lead) MSOP Sn67.5/Pb32.5 Copper
Tin 7440-31-5 100% Matte tin surface finish 1.250 0.323 12,500
Silver 7440-22-4 Lead frame, Die attach 0.495 0.128 4,954
Iron 7439-89-6 Lead frame 0.247 0.064 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.062 2,394
Gold 7440-57-5 Wire Bond 0.200 0.052 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.051 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.030 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.026 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.010 394
Zinc 7440-66-6 Lead frame 0.013 0.003 131
Phosphorous 7723-14-0 Lead frame 0.009 0.002 87TOTALS 100.000 25.800 1,000,000
Assembly Site: NSEB 0.0258 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
25 2:20 PM : 10/5/2006UN 10 (MSOP) NSEB
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PA 8 (Lead) PDIP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 7.768 15,960
Tin 7440-31-5 Solder surface finish 0.844 4.107 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.411 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.977 4,063
Iron 7439-89-6 Lead frame 0.247 1.201 2,468
Carbon Black 1333-86-4 Mold compound 0.239 1.165 2,394
Gold 7440-57-5 Wire Bond 0.200 0.973 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.958 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.566 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.497 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.192 394
Zinc 7440-66-6 Lead frame 0.013 0.064 131
Phosphorus 7723-14-0 Lead frame 0.009 0.042 87TOTALS 100.000 486.700 1,000,000
Various Assembly Sites / Material compilation 0.4867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
26 2:20 PM : 10/5/2006P or PA 8 (PDIP) Various ( 11 )
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PA 8 (Lead) PDIP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 9.710 19,950
Tin 7440-31-5 Solder surface finish 0.844 4.107 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.411 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.977 4,063
Iron 7439-89-6 Lead frame 0.247 1.201 2,468
Carbon Black 1333-86-4 Mold compound 0.239 1.165 2,394
Gold 7440-57-5 Wire Bond 0.200 0.973 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.958 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.566 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.497 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.192 394
Zinc 7440-66-6 Lead frame 0.013 0.064 131
Phosphorus 7723-14-0 Lead frame 0.009 0.042 87TOTALS 100.000 486.700 1,000,000
Various Assembly Sites / Material compilation 0.4867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
27 2:20 PM : 10/5/2006P or PA 8 (PDIP) Various ( 14 )
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PA 14 (Lead) PDIP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 19.018 19,950
Tin 7440-31-5 Solder surface finish 0.844 8.043 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 7.769 8,150
Lead 7439-92-1 Solder surface finish 0.406 3.873 4,063
Iron 7439-89-6 Lead frame 0.247 2.352 2,468
Carbon Black 1333-86-4 Mold compound 0.239 2.282 2,394
Gold 7440-57-5 Wire Bond 0.200 1.907 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.715 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.393 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.179 188
Zinc 7440-66-6 Lead frame 0.013 0.125 131Phosphorus 7723-14-0 Lead frame 0.009 0.083 87
TOTALS 100.000 953.300 1,000,000
Various Assembly Sites / Material compilation 0.9533 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
28 2:20 PM : 10/5/2006P or PD 14 (PDIP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PE 16 (Lead) PDIP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 19.685 19,950
Tin 7440-31-5 Solder surface finish 0.844 8.325 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 8.042 8,150
Lead 7439-92-1 Solder surface finish 0.406 4.008 4,063
Iron 7439-89-6 Lead frame 0.247 2.435 2,468
Carbon Black 1333-86-4 Mold compound 0.239 2.362 2,394
Gold 7440-57-5 Wire Bond 0.200 1.973 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.740 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.407 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.185 188
Zinc 7440-66-6 Lead frame 0.013 0.130 131
Phosphorus 7723-14-0 Lead frame 0.009 0.085 87TOTALS 100.000 986.700 1,000,000
Assembly Site: ALPHA 0.9867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
29 2:20 PM : 10/5/2006P or PE 16 (PDIP) ALPHA
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PE 16 (Lead) PDIP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 15.748 15,960
Tin 7440-31-5 Solder surface finish 0.844 8.325 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 4.888 4,954
Lead 7439-92-1 Solder surface finish 0.406 4.008 4,063
Iron 7439-89-6 Lead frame 0.247 2.435 2,468
Carbon Black 1333-86-4 Mold compound 0.239 2.362 2,394
Gold 7440-57-5 Wire Bond 0.200 1.973 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 1.943 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.147 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.007 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.389 394
Zinc 7440-66-6 Lead frame 0.013 0.130 131
Phosphorus 7723-14-0 Lead frame 0.009 0.085 87TOTALS 100.000 986.700 1,000,000
Various Assembly Sites / Material compilation 0.9867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
30 2:20 PM : 10/5/2006P or PE 16 (PDIP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P 18 (Lead) PDIP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 19.918 15,960
Tin 7440-31-5 Solder surface finish 0.844 10.530 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 6.182 4,954
Lead 7439-92-1 Solder surface finish 0.406 5.070 4,063
Iron 7439-89-6 Lead frame 0.247 3.079 2,468
Carbon Black 1333-86-4 Mold compound 0.239 2.988 2,394
Gold 7440-57-5 Wire Bond 0.200 2.496 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 2.458 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.451 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.273 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.492 394
Zinc 7440-66-6 Lead frame 0.013 0.164 131
Phosphorus 7723-14-0 Lead frame 0.009 0.108 87TOTALS 100.000 1,248.000 1,000,000
Assembly Site: ANAP 1.2480 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
31 2:20 PM : 10/5/2006P 18 (PDIP) ANAP
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P 18 (Lead) PDIP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 24.898 19,950
Tin 7440-31-5 Solder surface finish 0.844 10.530 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 10.171 8,150
Lead 7439-92-1 Solder surface finish 0.406 5.070 4,063
Iron 7439-89-6 Lead frame 0.247 3.079 2,468
Carbon Black 1333-86-4 Mold compound 0.239 2.988 2,394
Gold 7440-57-5 Wire Bond 0.200 2.496 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.936 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.515 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.234 188
Zinc 7440-66-6 Lead frame 0.013 0.164 131
Phosphorus 7723-14-0 Lead frame 0.009 0.108 87TOTALS 100.000 1,248.000 1,000,000
Various Assembly Sites / Material compilation 1.2480 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
32 2:20 PM : 10/5/2006P 18 (PDIP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P 20 (Lead) PDIP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 21.691 15,960
Tin 7440-31-5 Solder surface finish 0.844 11.467 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 6.733 4,954
Lead 7439-92-1 Solder surface finish 0.406 5.521 4,063
Iron 7439-89-6 Lead frame 0.247 3.354 2,468
Carbon Black 1333-86-4 Mold compound 0.239 3.254 2,394
Gold 7440-57-5 Wire Bond 0.200 2.718 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 2.676 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.580 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.387 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.535 394
Zinc 7440-66-6 Lead frame 0.013 0.178 131Phosphorus 7723-14-0 Lead frame 0.009 0.118 87
TOTALS 100.000 1,359.100 1,000,000
Various Assembly Sites / Material compilation 1.3591 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
33 2:20 PM : 10/5/2006P 20 (PDIP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PI 28 (Lead) PDIP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 81.131 19,950
Tin 7440-31-5 Solder surface finish 0.844 34.313 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 33.144 8,150
Lead 7439-92-1 Solder surface finish 0.406 16.521 4,063
Iron 7439-89-6 Lead frame 0.247 10.035 2,468
Carbon Black 1333-86-4 Mold compound 0.239 9.736 2,394
Gold 7440-57-5 Wire Bond 0.200 8.133 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 3.050 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 1.678 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.763 188
Zinc 7440-66-6 Lead frame 0.013 0.534 131
Phosphorus 7723-14-0 Lead frame 0.009 0.352 87TOTALS 100.000 4,066.699 1,000,000
Various Assembly Sites / Material compilation 4.0667 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
34 2:20 PM : 10/5/2006P or PI 28 (PDIP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: P and PL 40 (Lead) PDIP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 129.675 19,950
Tin 7440-31-5 Solder surface finish 0.844 54.844 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 52.975 8,150
Lead 7439-92-1 Solder surface finish 0.406 26.406 4,063
Iron 7439-89-6 Lead frame 0.247 16.039 2,468
Carbon Black 1333-86-4 Mold compound 0.239 15.561 2,394
Gold 7440-57-5 Wire Bond 0.200 13.000 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 4.875 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 2.681 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 1.219 188
Zinc 7440-66-6 Lead frame 0.013 0.853 131
Phosphorus 7723-14-0 Lead frame 0.009 0.563 87TOTALS 100.000 6,499.999 1,000,000
Various Assembly Sites / Material compilation 6.5000 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 41.646 19,950
Tin 7440-31-5 Solder surface finish 0.844 17.613 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 10.341 4,954
Lead 7439-92-1 Solder surface finish 0.406 8.480 4,063
Iron 7439-89-6 Lead frame 0.247 5.151 2,468
Carbon Black 1333-86-4 Mold compound 0.239 4.997 2,394
Gold 7440-57-5 Wire Bond 0.200 4.175 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 4.111 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 2.427 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 2.130 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.822 394
Zinc 7440-66-6 Lead frame 0.013 0.274 131Phosphorus 7723-14-0 Lead frame 0.009 0.181 87
TOTALS 100.000 2,087.500 1,000,000
Various Assembly Sites / Material compilation 2.0875 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
36 2:20 PM : 10/5/2006SP 28 (SPDIP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 28 (Lead) PLCC Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 12.316 10,374
Tin 7440-31-5 Solder surface finish 0.844 10.017 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 9.676 8,150
Lead 7439-92-1 Solder surface finish 0.406 4.823 4,063
Carbon Black 1333-86-4 Mold compound 0.239 2.842 2,394
Gold 7440-57-5 Wire Bond 0.200 2.374 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.890 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.490 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.223 188
Zirconium 7440-67-7 Lead frame 0.011 0.125 105
Manganese 7439-96-5 Lead frame 0.001 0.006 5TOTALS 100.000 1,187.200 1,000,000
Various Assembly Sites / Material compilation 1.1872 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
37 2:20 PM : 10/5/2006L 28 (PLCC) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 32 (Lead) PLCC Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 17.556 15,960
Tin 7440-31-5 Solder surface finish 0.844 9.281 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 5.449 4,954
Lead 7439-92-1 Solder surface finish 0.406 4.469 4,063
Carbon Black 1333-86-4 Mold compound 0.239 2.633 2,394
Gold 7440-57-5 Wire Bond 0.200 2.200 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 2.166 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.279 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.122 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.433 394
Zirconium 7440-67-7 Lead frame 0.011 0.116 105
Manganese 7439-96-5 Lead frame 0.001 0.006 5TOTALS 100.000 1,100.000 1,000,000
Assembly Site: NSEB 1.1000 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
38 2:20 PM : 10/5/2006L 32 (PLCC) NSEB
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 32 (Lead) PLCC Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 11.411 10,374
Tin 7440-31-5 Solder surface finish 0.844 9.281 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 5.449 4,954
Lead 7439-92-1 Solder surface finish 0.406 4.469 4,063
Carbon Black 1333-86-4 Mold compound 0.239 2.633 2,394
Gold 7440-57-5 Wire Bond 0.200 2.200 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 2.166 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 1.279 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.122 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.433 394
Zirconium 7440-67-7 Lead frame 0.011 0.116 105
Manganese 7439-96-5 Lead frame 0.001 0.006 5TOTALS 100.000 1,100.000 1,000,000
Various Assembly Sites / Material compilation 1.1000 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
39 2:20 PM : 10/5/2006L 32 (PLCC) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 44 (Lead) PLCC Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 25.590 10,374
Tin 7440-31-5 Solder surface finish 0.844 20.813 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 12.220 4,954
Lead 7439-92-1 Solder surface finish 0.406 10.021 4,063
Carbon Black 1333-86-4 Mold compound 0.239 5.905 2,394
Gold 7440-57-5 Wire Bond 0.200 4.933 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 4.858 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 2.868 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 2.517 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.972 394
Zirconium 7440-67-7 Lead frame 0.011 0.259 105Manganese 7439-96-5 Lead frame 0.001 0.013 5
TOTALS 100.000 2,466.699 1,000,000
Various Assembly Sites / Material compilation 2.4667 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
40 2:20 PM : 10/5/2006L 44 (PLCC) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 68 (Lead) PLCC Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 50.341 10,374
Tin 7440-31-5 Solder surface finish 0.844 40.944 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 24.039 4,954
Lead 7439-92-1 Solder surface finish 0.406 19.714 4,063
Carbon Black 1333-86-4 Mold compound 0.239 11.617 2,394
Gold 7440-57-5 Wire Bond 0.200 9.705 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 9.556 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 5.642 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 4.951 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 1.911 394
Zirconium 7440-67-7 Lead frame 0.011 0.510 105Manganese 7439-96-5 Lead frame 0.001 0.025 5
TOTALS 100.000 4,852.599 1,000,000
Various Assembly Sites / Material compilation 4.8526 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
41 2:20 PM : 10/5/2006L 68 (PLCC) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 84 (Lead) PLCC Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 73.526 10,374
Tin 7440-31-5 Solder surface finish 0.844 59.801 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 57.763 8,150
Lead 7439-92-1 Solder surface finish 0.406 28.793 4,063
Carbon Black 1333-86-4 Mold compound 0.239 16.967 2,394
Gold 7440-57-5 Wire Bond 0.200 14.175 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 5.316 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 2.924 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 1.329 188
Zirconium 7440-67-7 Lead frame 0.011 0.744 105
Manganese 7439-96-5 Lead frame 0.001 0.037 5TOTALS 100.000 7,087.498 1,000,000
Assembly Site: ALPHA 7.0875 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
42 2:20 PM : 10/5/2006L 84 (PLCC) ALPHA
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: L 84 (Lead) PLCC Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 59.801 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 35.111 4,954
Lead 7439-92-1 Solder surface finish 0.406 28.793 4,063
Iron 7439-89-6 Lead frame 0.247 17.488 2,468
Carbon Black 1333-86-4 Mold compound 0.239 16.967 2,394
Gold 7440-57-5 Wire Bond 0.200 14.175 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 13.957 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 8.241 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 7.231 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 2.792 394
Zinc 7440-66-6 Lead frame 0.013 0.930 131
Phosphorus 7723-14-0 Lead frame 0.009 0.614 87TOTALS 100.000 7,087.499 1,000,000
Assembly Site: ANAP 7.0875 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
43 2:20 PM : 10/5/2006L 84 (PLCC) ANAP
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ML 28 (Lead) QFN or QFN-S 6x6 mmSn67.5/Pb32.5 Copper
Carbon Black 1333-86-4 Mold compound 0.399 0.344 3,990
Iron 7439-89-6 Lead frame 0.247 0.213 2,468
Gold 7440-57-5 Wire Bond 0.200 0.172 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.170 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.100 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.088 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.034 394
Zinc 7440-66-6 Lead frame 0.013 0.011 131
Phosphorus 7723-14-0 Lead frame 0.009 0.007 87TOTALS 100.000 86.200 1,000,000
Assembly Site: ASAT 0.0862 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Carbon Black 1333-86-4 Mold compound 0.239 0.206 2,394
Gold 7440-57-5 Wire Bond 0.200 0.172 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.170 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.100 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.088 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.034 394
Zinc 7440-66-6 Lead frame 0.013 0.011 131
Phosphorus 7723-14-0 Lead frame 0.009 0.007 87TOTALS 100.000 86.200 1,000,000
Assembly Site: UNISEM 0.0862 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 1.574 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.924 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.758 4,063
Iron 7439-89-6 Lead frame 0.247 0.460 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.446 2,394
Gold 7440-57-5 Wire Bond 0.200 0.373 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.367 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.217 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.190 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.073 394
Zinc 7440-66-6 Lead frame 0.013 0.024 131
Phosphorous 7723-14-0 Lead frame 0.009 0.016 87TOTALS 100.000 186.500 1,000,000
Assembly Site: ASAT 0.1865 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Carbon Black 1333-86-4 Mold compound 0.239 0.446 2,394
Gold 7440-57-5 Wire Bond 0.200 0.373 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.367 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.217 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.190 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.073 394
Zinc 7440-66-6 Lead frame 0.013 0.024 131
Phosphorous 7723-14-0 Lead frame 0.009 0.016 87TOTALS 100.000 186.500 1,000,000
Assembly Site: UNISEM 0.1865 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.662 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.389 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.319 4,063
Iron 7439-89-6 Lead frame 0.247 0.194 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.188 2,394
Gold 7440-57-5 Wire Bond 0.200 0.157 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.155 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.091 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.080 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.031 394
Zinc 7440-66-6 Lead frame 0.013 0.010 131
Phosphorus 7723-14-0 Lead frame 0.009 0.007 87TOTALS 100.000 78.500 1,000,000
Assembly Site: HANA 0.0785 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
48 2:20 PM : 10/5/2006QR 16 (QSOP) HANA
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: QR 16 (Lead) QSOP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 1.253 15,960
Tin 7440-31-5 Solder surface finish 0.844 0.662 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.389 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.319 4,063
Iron 7439-89-6 Lead frame 0.247 0.194 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.188 2,394
Gold 7440-57-5 Wire Bond 0.200 0.157 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.155 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.091 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.080 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.031 394
Zinc 7440-66-6 Lead frame 0.013 0.010 131
Phosphorus 7723-14-0 Lead frame 0.009 0.007 87TOTALS 100.000 78.500 1,000,000
Assembly Site: UNISEM 0.0785 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.046 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.027 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.022 4,063
Iron 7439-89-6 Lead frame 0.247 0.014 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.013 2,394
Gold 7440-57-5 Wire Bond 0.200 0.011 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.011 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.006 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.006 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.002 394
Zinc 7440-66-6 Lead frame 0.013 0.001 131
Phosphorus 7723-14-0 Lead frame 0.009 0.000 87TOTALS 100.000 5.500 1,000,000
Assembly Site: UNISEM 0.0055 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.057 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.046 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.027 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.022 4,063
Iron 7439-89-6 Lead frame 0.247 0.014 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.013 2,394
Gold 7440-57-5 Wire Bond 0.200 0.011 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.011 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.006 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.006 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.002 394
Zinc 7440-66-6 Lead frame 0.013 0.001 131
Phosphorus 7723-14-0 Lead frame 0.009 0.000 87TOTALS 100.000 5.500 1,000,000
Various Assembly Sites / Material compilation 0.0055 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.052 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.031 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.025 4,063
Iron 7439-89-6 Lead frame 0.247 0.015 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.015 2,394
Gold 7440-57-5 Wire Bond 0.200 0.012 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.012 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.007 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.006 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.002 394
Zinc 7440-66-6 Lead frame 0.013 0.001 131
Phosphorus 7723-14-0 Lead frame 0.009 0.001 87TOTALS 100.000 6.200 1,000,000
Assembly Site: UNISEM 0.0062 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.064 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.052 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.031 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.025 4,063
Iron 7439-89-6 Lead frame 0.247 0.015 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.015 2,394
Gold 7440-57-5 Wire Bond 0.200 0.012 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.012 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.007 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.006 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.002 394
Zinc 7440-66-6 Lead frame 0.013 0.001 131
Phosphorus 7723-14-0 Lead frame 0.009 0.001 87TOTALS 100.000 6.200 1,000,000
Various Assembly Sites / Material compilation 0.0062 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
53 2:20 PM : 10/5/2006LT 5 (SC70) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: OA and SN 8 (Lead) SOIC-N (Small Outline -150mil)Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.809 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.658 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.636 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.317 4,063
Iron 7439-89-6 Lead frame 0.247 0.192 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.187 2,394
Gold 7440-57-5 Wire Bond 0.200 0.156 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.059 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.032 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.015 188
Zinc 7440-66-6 Lead frame 0.013 0.010 131
Phosphorus 7723-14-0 Lead frame 0.009 0.007 87TOTALS 100.000 78.000 1,000,000
Various Assembly Sites / Material compilation 0.0780 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
54 2:20 PM : 10/5/2006OA or SN 8 (SOIC-N)Various (MP)
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 1.985 15,960
Tin 7440-31-5 Solder surface finish 0.844 1.050 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.616 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.505 4,063
Iron 7439-89-6 Lead frame 0.247 0.307 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.298 2,394
Gold 7440-57-5 Wire Bond 0.200 0.249 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.245 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.145 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.127 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.049 394
Zinc 7440-66-6 Lead frame 0.013 0.016 131Phosphorus 7723-14-0 Lead frame 0.009 0.011 87
TOTALS 100.000 124.400 1,000,000
Assembly Site: NSEB 0.1244 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 1.291 10,374
Tin 7440-31-5 Solder surface finish 0.844 1.050 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 1.014 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.505 4,063
Iron 7439-89-6 Lead frame 0.247 0.307 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.298 2,394
Gold 7440-57-5 Wire Bond 0.200 0.249 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.093 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.051 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.023 188
Zinc 7440-66-6 Lead frame 0.013 0.016 131
Phosphorus 7723-14-0 Lead frame 0.009 0.011 87TOTALS 100.000 124.400 1,000,000
Various Assembly Sites / Material compilation 0.1244 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Lead 7439-92-1 Solder surface finish 0.406 0.582 4,063
Iron 7439-89-6 Lead frame 0.247 0.353 2,468
Gold 7440-57-5 Wire Bond 0.200 0.286 2,000
Carbon Black 1333-86-4 Mold compound (KMC-3580P-8) 0.160 0.229 1,596
Diester Resin Trade Secret Die attach 0.064 0.091 638
Functionalized Urethane Resin Trade Secret Die attach 0.038 0.054 375
Epoxy Resin Trade Secret Die attach 0.034 0.048 338
Zinc 7440-66-6 Lead frame 0.013 0.019 131
Phosphorus 7723-14-0 Lead frame 0.009 0.012 87TOTALS 100.000 143.182 1,000,000
Assembly Site: HANA 0.1432 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 1.485 10,374
Tin 7440-31-5 Solder surface finish 0.844 1.208 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 1.167 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.582 4,063
Iron 7439-89-6 Lead frame 0.247 0.353 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.343 2,394
Gold 7440-57-5 Wire Bond 0.200 0.286 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.107 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.059 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.027 188
Zinc 7440-66-6 Lead frame 0.013 0.019 131
Phosphorus 7723-14-0 Lead frame 0.009 0.012 87TOTALS 100.000 143.182 1,000,000
Various Assembly Sites / Material compilation 0.1432 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 1.232 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.723 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.593 4,063
Iron 7439-89-6 Lead frame 0.247 0.360 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.350 2,394
Gold 7440-57-5 Wire Bond 0.200 0.292 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.288 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.170 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.149 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.058 394
Zinc 7440-66-6 Lead frame 0.013 0.019 131
Phosphorus 7723-14-0 Lead frame 0.009 0.013 87TOTALS 100.000 146.000 1,000,000
Various Assembly Sites / Material compilation 0.1460 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 3.499 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.054 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.685 4,063
Iron 7439-89-6 Lead frame 0.247 1.023 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.993 2,394
Gold 7440-57-5 Wire Bond 0.200 0.829 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.817 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.482 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.423 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.163 394
Zinc 7440-66-6 Lead frame 0.013 0.054 131
Phosphorus 7723-14-0 Lead frame 0.009 0.036 87TOTALS 100.000 414.700 1,000,000
Various Assembly Sites / Material compilation 0.4147 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 4.058 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.383 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.954 4,063
Iron 7439-89-6 Lead frame 0.247 1.187 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 1.152 2,394
Gold 7440-57-5 Wire Bond 0.200 0.962 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.947 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.559 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.491 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.189 394
Zinc 7440-66-6 Lead frame 0.013 0.063 131
Phosphorus 7723-14-0 Lead frame 0.009 0.042 87TOTALS 100.000 481.000 1,000,000
Various Assembly Sites / Material compilation 0.4810 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.596 8.441 15,960
Tin 7440-31-5 Solder surface finish 0.844 4.463 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 2.620 4,954
Lead 7439-92-1 Solder surface finish 0.406 2.149 4,063
Iron 7439-89-6 Lead frame 0.247 1.305 2,468
Carbon Black 1333-86-4 Mold compound 0.239 1.266 2,394
Gold 7440-57-5 Wire Bond 0.200 1.058 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 1.042 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.615 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.540 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.208 394
Zinc 7440-66-6 Lead frame 0.013 0.069 131Phosphorus 7723-14-0 Lead frame 0.009 0.046 87
TOTALS 100.000 528.900 1,000,000
Assembly Site: NSEB 0.5289 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 5.487 10,374
Tin 7440-31-5 Solder surface finish 0.844 4.463 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 4.311 8,150
Lead 7439-92-1 Solder surface finish 0.406 2.149 4,063
Iron 7439-89-6 Lead frame 0.247 1.305 2,468
Carbon Black 1333-86-4 Mold compound 0.239 1.266 2,394
Gold 7440-57-5 Wire Bond 0.200 1.058 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.397 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.218 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.099 188
Zinc 7440-66-6 Lead frame 0.013 0.069 131
Phosphorus 7723-14-0 Lead frame 0.009 0.046 87TOTALS 100.000 528.900 1,000,000
Various Assembly Sites / Material compilation 0.5289 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 6.500 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 3.816 4,954
Lead 7439-92-1 Solder surface finish 0.406 3.130 4,063
Iron 7439-89-6 Lead frame 0.247 1.901 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 1.844 2,394
Gold 7440-57-5 Wire Bond 0.200 1.541 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 1.517 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.896 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.786 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.303 394
Zinc 7440-66-6 Lead frame 0.013 0.101 131Phosphorus 7723-14-0 Lead frame 0.009 0.067 87
TOTALS 100.000 770.400 1,000,000
Various Assembly Sites / Material compilation 0.7704 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
64 2:20 PM : 10/5/2006SO 28 (SOIC) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: CB and NB and TT 3 (Lead) SOT-23 Sn67.5/Pb32.5 Alloy 42
Tin 7440-31-5 Solder surface finish 0.844 0.070 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.041 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.034 4,063
Carbon Black 1333-86-4 Mold compound (MP-8000) 0.239 0.020 2,394
Gold 7440-57-5 Wire Bond 0.200 0.017 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.016 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.010 1,163
Cobalt 7440-48-4 Lead frame (A42) 0.105 0.009 1,050
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.008 1,020
Manganese 7439-96-5 Lead frame (A42) 0.084 0.007 840
Carbon 7440-44-0 Lead frame (A42) 0.053 0.004 525
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.003 394Phosphorous 7723-14-0 Lead frame (A42) 0.003 0.000 26
TOTALS 100.000 8.300 1,000,000
Assembly Site: CARSEM 0.0083 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
65 2:20 PM : 10/5/2006CB NB TT 3 (SOT-23) CARSEM
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: CB and NB and TT 3 (Lead) SOT-23 Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 0.070 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.041 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.034 4,063
Iron 7439-89-6 Lead frame 0.247 0.020 2,468
Carbon Black 1333-86-4 Mold compound (MP-8000) 0.239 0.020 2,394
Gold 7440-57-5 Wire Bond 0.200 0.017 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.016 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.010 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.008 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.003 394
Zinc 7440-66-6 Lead frame 0.013 0.001 131
Phosphorus 7723-14-0 Lead frame 0.009 0.001 87TOTALS 100.000 8.300 1,000,000
Various Assembly Sites / Material compilation 0.0083 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
66 2:20 PM : 10/5/2006CB NB TT 3 (SOT-23) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: CT and OT 5 (Lead) SOT-23A Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 0.135 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.079 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.065 4,063
Iron 7439-89-6 Lead frame 0.247 0.039 2,468
Carbon Black 1333-86-4 Mold compound (MP-8000) 0.239 0.038 2,394
Gold 7440-57-5 Wire Bond 0.200 0.032 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.032 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.019 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.016 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.006 394
Zinc 7440-66-6 Lead frame 0.013 0.002 131
Phosphorus 7723-14-0 Lead frame 0.009 0.001 87TOTALS 100.000 16.000 1,000,000
Various Assembly Sites / Material compilation 0.0160 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications). y pCompliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com > Company Information > Environmental Information > Pb Free Laboratory Analytical Reports
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
67 2:20 PM : 10/5/2006CT OT 5 (SOT-23A) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: CH and OT 6 (Lead) SOT-23A Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 0.143 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.084 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.069 4,063
Iron 7439-89-6 Lead frame 0.247 0.042 2,468
Carbon Black 1333-86-4 Mold compound (MP-8000) 0.239 0.041 2,394
Gold 7440-57-5 Wire Bond 0.200 0.034 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 0.033 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.020 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.017 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.007 394
Zinc 7440-66-6 Lead frame 0.013 0.002 131
Phosphorus 7723-14-0 Lead frame 0.009 0.001 87TOTALS 100.000 17.000 1,000,000
Various Assembly Sites / Material compilation 0.0170 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 0.413 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.242 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.199 4,063
Iron 7439-89-6 Lead frame 0.247 0.121 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.117 2,394
Gold 7440-57-5 Wire Bond 0.200 0.098 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.096 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.057 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.050 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.019 394
Zinc 7440-66-6 Lead frame 0.013 0.006 131
Phosphorus 7723-14-0 Lead frame 0.009 0.004 87TOTALS 100.000 48.900 1,000,000
Assembly Site: CEI 0.0489 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.565 0.138 15,648
Tin 7440-31-5 Solder surface finish 0.986 0.087 9,855
Silver 7440-22-4 Lead frame (A42), Die attach 0.819 0.072 8,193
Lead 7439-92-1 Solder surface finish 0.475 0.042 4,745
Cobalt 7440-48-4 Lead frame (A42) 0.275 0.024 2,750
Manganese 7439-96-5 Lead frame (A42) 0.220 0.019 2,200
Gold 7440-57-5 Wire Bond 0.200 0.018 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.017 1,969
Carbon Black 1333-86-4 Mold compound 0.188 0.017 1,878
Carbon 7440-44-0 Lead frame (A42) 0.138 0.012 1,375
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.010 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.009 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.003 394Phosphorus 7723-14-0 Lead frame (A42) 0.007 0.001 69
TOTALS 100.000 8.800 1,000,000
Various Assembly Sites / Material compilation 0.0088 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications). y pCompliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com > Company Information > Environmental Information > Pb Free Laboratory Analytical Reports
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
70 2:20 PM : 10/5/2006RC 4 (SOT-143) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: DB 3 (Lead) SOT-223 Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 2.352 19,950
Tin 7440-31-5 Solder surface finish 0.844 0.995 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.584 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.479 4,063
Iron 7439-89-6 Lead frame 0.247 0.291 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.282 2,394
Gold 7440-57-5 Wire Bond 0.200 0.236 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.232 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.137 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.120 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.046 394
Zinc 7440-66-6 Lead frame 0.013 0.015 131Phosphorus 7723-14-0 Lead frame 0.009 0.010 87
TOTALS 100.000 117.900 1,000,000
Various Assembly Sites / Material compilation 0.1179 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
71 2:20 PM : 10/5/2006DB 3 (SOT-223) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: SS 20 (Lead) SSOP Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.995 3.276 19,950
Tin 7440-31-5 Solder surface finish 0.844 1.385 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.813 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.667 4,063
Iron 7439-89-6 Lead frame 0.247 0.405 2,468
Carbon Black 1333-86-4 Mold compound 0.239 0.393 2,394
Gold 7440-57-5 Wire Bond 0.200 0.328 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.323 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.191 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.168 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.065 394
Zinc 7440-66-6 Lead frame 0.013 0.022 131Phosphorus 7723-14-0 Lead frame 0.009 0.014 87
TOTALS 100.000 164.200 1,000,000
Assembly Site: NSEB 0.1642 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
72 2:20 PM : 10/5/2006SS 20 (SSOP) NSEB
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: SS 20 (Lead) SSOP Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 1.385 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 1.338 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.667 4,063
Iron 7439-89-6 Lead frame 0.247 0.405 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.393 2,394
Gold 7440-57-5 Wire Bond 0.200 0.328 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.123 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.068 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.031 188
Zinc 7440-66-6 Lead frame 0.013 0.022 131
Phosphorus 7723-14-0 Lead frame 0.009 0.014 87TOTALS 100.000 164.200 1,000,000
Various Assembly Sites / Material compilation 0.1642 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
73 2:20 PM : 10/5/2006SS 20 (SSOP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: SS and SI 28 (Lead) SSOP Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 1.934 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 1.868 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.931 4,063
Iron 7439-89-6 Lead frame 0.247 0.566 2,468
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.549 2,394
Gold 7440-57-5 Wire Bond 0.200 0.458 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.172 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.095 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.043 188
Zinc 7440-66-6 Lead frame 0.013 0.030 131
Phosphorus 7723-14-0 Lead frame 0.009 0.020 87TOTALS 100.000 229.200 1,000,000
Various Assembly Sites / Material compilation 0.2292 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii o7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
74 2:20 PM : 10/5/2006SS SI 28 (SSOP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: TO and ZB 3 (Lead) TO-92 Sn67.5/Pb32.5 Alloy 42
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.565 3.181 15,648
Tin 7440-31-5 Solder surface finish 0.986 2.004 9,855
Silver 7440-22-4 Lead frame, Die attach 0.819 1.666 8,193
Lead 7439-92-1 Solder surface finish 0.475 0.965 4,745
Cobalt 7440-48-4 Lead frame (A42) 0.275 0.559 2,750
Manganese 7439-96-5 Lead frame (A42) 0.220 0.447 2,200
Gold 7440-57-5 Wire Bond 0.200 0.407 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.400 1,969
Carbon Black 1333-86-4 Mold compound 0.188 0.382 1,878
Carbon 7440-44-0 Lead frame (A42) 0.138 0.280 1,375
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.236 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.207 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.080 394Phosphorus 7723-14-0 Lead frame (A42) 0.007 0.014 69
TOTALS 100.000 203.300 1000000
Assembly Site: CARSEM 0.2033 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
75 2:20 PM : 10/5/2006TO ZB 3 (TO-92) CARSEM
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: TO and ZB 3 (Lead) TO-92 Sn67.5/Pb32.5 Copper
Formaldehyde, polymer with bromophenol and (chloromethyl)oxirane 68541-56-0 Mold compound 1.565 3.181 15,648
Tin 7440-31-5 Solder surface finish 0.986 2.004 9,855
Silver 7440-22-4 Lead frame, Die attach 0.819 1.666 8,193
Iron 7439-89-6 Lead frame 0.646 1.314 6,463
Lead 7439-92-1 Solder surface finish 0.475 0.965 4,745
Gold 7440-57-5 Wire Bond 0.200 0.407 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.400 1,969
Carbon Black 1333-86-4 Mold compound 0.188 0.382 1,878
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.236 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.207 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.080 394
Zinc 7440-66-6 Lead frame 0.034 0.070 344
Phosphorus 7723-14-0 Lead frame 0.023 0.046 227TOTALS 100.000 203.300 1000000
Assembly Site: CARSEM and GTK 0.2033 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.986 18.527 9,855
Silver 7440-22-4 Lead frame, Die attach 0.819 15.402 8,193
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 0.814 15.297 8,137
Iron 7439-89-6 Lead frame 0.646 12.150 6,463
Lead 7439-92-1 Solder surface finish 0.475 8.921 4,745
Gold 7440-57-5 Wire Bond 0.200 3.760 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 3.702 1,969
Carbon Black 1333-86-4 Mold compound 0.188 3.530 1,878
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 2.186 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.918 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.740 394
Zinc 7440-66-6 Lead frame 0.034 0.646 344Phosphorus 7723-14-0 Lead frame 0.023 0.427 227
TOTALS 100.000 1,880.000 1000000
Assembly Site: CARSEM 1.8800 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
77 2:20 PM : 10/5/2006AB 3 (TO-220) CARSEM
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: AT 5 (Lead) TO-220 Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.986 19.276 9,855
Silver 7440-22-4 Lead frame, Die attach 0.819 16.025 8,193
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 0.814 15.915 8,137
Iron 7439-89-6 Lead frame 0.646 12.641 6,463
Lead 7439-92-1 Solder surface finish 0.475 9.281 4,745
Gold 7440-57-5 Wire Bond 0.200 3.912 2,000
Quartz (SiO2) 14808-60-7 Die Attach 0.197 3.852 1,969
Carbon Black 1333-86-4 Mold compound 0.188 3.673 1,878
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 2.274 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 1.996 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.770 394
Zinc 7440-66-6 Lead frame 0.034 0.672 344
Phosphorus 7723-14-0 Lead frame 0.023 0.444 227TOTALS 100.000 1,956.000 1000000
Assembly Site: CARSEM 1.9560 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish, Lead frame 0.870 2.378 8,700
Silver 7440-22-4 Lead frame, Die attach 0.495 1.354 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.110 4,063
Carbon Black 1333-86-4 Mold compound 0.239 0.654 2,394
Gold 7440-57-5 Wire Bond 0.200 0.547 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.538 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.318 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.279 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.108 394
Chromium 7440-47-3 Lead frame 0.026 0.072 263
Zinc 7440-66-6 Lead frame 0.019 0.052 189TOTALS 100.000 273.300 1,000,000
Assembly Site: ANAK 0.2733 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish, Lead frame 0.870 2.378 8,700
Silver 7440-22-4 Lead frame, Die attach 0.495 1.354 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.110 4,063
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.654 2,394
Gold 7440-57-5 Wire Bond 0.200 0.547 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.538 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.318 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.279 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.108 394
Chromium 7440-47-3 Lead frame 0.026 0.072 263Zinc 7440-66-6 Lead frame 0.019 0.052 189
TOTALS 100.000 273.300 1,000,000
Assembly Site: ANAP 0.2733 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 2.835 10,374
Tin 7440-31-5 Solder surface finish 0.844 2.306 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 2.227 8,150
Lead 7439-92-1 Solder surface finish 0.406 1.110 4,063
Nickel 7440-02-0 Lead frame 0.336 0.918 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.654 2,394
Gold 7440-57-5 Wire Bond 0.200 0.547 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.205 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.113 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.051 188Magnesium 7439-95-4 Lead frame 0.018 0.050 184
TOTALS 100.000 273.300 1,000,000
Assembly Site: CARSEM 0.2733 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 2.306 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 1.354 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.110 4,063
Nickel 7440-02-0 Lead frame 0.336 0.918 3,360
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.654 2,394
Gold 7440-57-5 Wire Bond 0.200 0.547 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.538 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.318 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.279 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.108 394Magnesium 7439-95-4 Lead frame 0.018 0.050 184
TOTALS 100.000 273.300 1,000,000
Various Assembly Sites / Material compilation 0.2733 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish, Lead frame 0.870 2.494 8,700
Silver 7440-22-4 Lead frame, Die attach 0.495 1.420 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.165 4,063
Carbon Black 1333-86-4 Mold compound 0.239 0.686 2,394
Gold 7440-57-5 Wire Bond 0.200 0.573 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.565 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.333 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.293 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.113 394
Chromium 7440-47-3 Lead frame 0.026 0.075 263
Zinc 7440-66-6 Lead frame 0.019 0.054 189TOTALS 100.000 286.700 1,000,000
Assembly Site: ANAK 0.2867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish, Lead frame 0.870 2.494 8,700
Silver 7440-22-4 Lead frame, Die attach 0.495 1.420 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.165 4,063
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.686 2,394
Gold 7440-57-5 Wire Bond 0.200 0.573 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.565 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.333 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.293 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.113 394
Chromium 7440-47-3 Lead frame 0.026 0.075 263Zinc 7440-66-6 Lead frame 0.019 0.054 189
TOTALS 100.000 286.700 1,000,000
Assembly Site: ANAP 0.2867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 2.974 10,374
Tin 7440-31-5 Solder surface finish 0.844 2.419 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 2.337 8,150
Lead 7439-92-1 Solder surface finish 0.406 1.165 4,063
Nickel 7440-02-0 Lead frame 0.336 0.963 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.686 2,394
Gold 7440-57-5 Wire Bond 0.200 0.573 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.215 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.118 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.054 188Magnesium 7439-95-4 Lead frame 0.018 0.053 184
TOTALS 100.000 286.700 1,000,000
Assembly Site: CARSEM 0.2867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 2.419 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 1.420 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.165 4,063
Nickel 7440-02-0 Lead frame 0.336 0.963 3,360
Carbon Black 1333-86-4 Mold compound (EME-G600) 0.239 0.686 2,394
Gold 7440-57-5 Wire Bond 0.200 0.573 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.565 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.333 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.293 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.113 394Magnesium 7439-95-4 Lead frame 0.018 0.053 184
TOTALS 100.000 286.700 1,000,000
Assembly Site: MTAI 0.2867 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish, Lead frame 0.870 3.190 8,700
Silver 7440-22-4 Lead frame, Die attach 0.495 1.817 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.490 4,063
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.878 2,394
Gold 7440-57-5 Wire Bond 0.200 0.733 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.722 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.426 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.374 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.144 394
Chromium 7440-47-3 Lead frame 0.026 0.096 263Zinc 7440-66-6 Lead frame 0.019 0.069 189
TOTALS 100.000 366.700 1,000,000
Assembly Site: ANAK 0.3667 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 3.094 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 1.817 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.490 4,063
Iron 7439-89-6 Lead Frame 0.247 0.905 2,468
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.878 2,394
Gold 7440-57-5 Wire Bond 0.200 0.733 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.722 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.426 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.374 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.144 394
Zinc 7440-66-6 Lead frame 0.013 0.048 131Phosphorous 7723-14-0 Lead frame 0.009 0.032 87
TOTALS 100.000 366.700 1,000,000
Assembly Site: ANAP 0.3667 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish 0.844 3.094 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 1.817 4,954
Lead 7439-92-1 Solder surface finish 0.406 1.490 4,063
Nickel 7440-02-0 Lead frame 0.336 1.232 3,360
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 0.878 2,394
Gold 7440-57-5 Wire Bond 0.200 0.733 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.722 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.426 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.374 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.144 394Magnesium 7439-95-4 Lead frame 0.018 0.067 184
TOTALS 100.000 366.700 1,000,000
Assembly Site: CARSEM 0.3667 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
Tin 7440-31-5 Solder surface finish, Lead frame 0.870 4.585 8,700
Silver 7440-22-4 Lead frame, Die attach 0.495 2.611 4,954
Lead 7439-92-1 Solder surface finish 0.406 2.141 4,063
Carbon Black 1333-86-4 Mold compound (EME-G700 Series) 0.239 1.262 2,394
Gold 7440-57-5 Wire Bond 0.200 1.054 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 1.038 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.613 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.538 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.208 394
Chromium 7440-47-3 Lead frame 0.026 0.138 263
Zinc 7440-66-6 Lead frame 0.019 0.100 189TOTALS 100.000 527.000 1,000,000
Assembly Site: ANAP 0.5270 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
90 2:20 PM : 10/5/2006PF 80 (TQFP) 14x14 ANAP
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ST 8 (Lead) TSSOP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.350 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.284 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.167 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.137 4,063
Nickel 7440-02-0 Lead frame 0.336 0.113 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.081 2,394
Gold 7440-57-5 Wire Bond 0.200 0.067 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.066 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.039 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.034 1,021
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.013 394
Magnesium 7439-95-4 Lead frame 0.018 0.006 184TOTALS 100.000 33.700 1,000,000
Assembly Site: ATES 0.0337 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
91 2:20 PM : 10/5/2006ST 8 (TSSOP) ATES
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ST 8 (Lead) TSSOP Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 0.284 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.275 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.137 4,063
Nickel 7440-02-0 Lead frame 0.336 0.113 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.081 2,394
Gold 7440-57-5 Wire Bond 0.200 0.067 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.025 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.014 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.006 188
Magnesium 7439-95-4 Lead frame 0.018 0.006 184TOTALS 100.000 33.700 1,000,000
Various Assembly Sites / Material compilation 0.0337 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
92 2:20 PM : 10/5/2006ST 8 (TSSOP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ST 14 (Lead) TSSOP Sn67.5/Pb32.5 Copper
3,5,3',5'-Tetrabrombisphenol A, epichlorhydrin polymer 40039-93-8 Mold compound 1.037 0.584 10,374
Tin 7440-31-5 Solder surface finish 0.844 0.475 8,438
Silver 7440-22-4 Lead frame, Die attach 0.815 0.459 8,150
Lead 7439-92-1 Solder surface finish 0.406 0.229 4,063
Nickel 7440-02-0 Lead frame 0.336 0.189 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.135 2,394
Gold 7440-57-5 Wire Bond 0.200 0.113 2,000
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.075 0.042 750
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.041 0.023 413
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.019 0.011 188
Magnesium 7439-95-4 Lead frame 0.018 0.010 184TOTALS 100.000 56.300 1,000,000
Assembly Site: NSEB 0.0563 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
93 2:20 PM : 10/5/2006ST 14 (TSSOP) NSEB
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ST 14 (Lead) TSSOP Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 0.475 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.279 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.229 4,063
Nickel 7440-02-0 Lead frame 0.336 0.189 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.135 2,394
Gold 7440-57-5 Wire Bond 0.200 0.113 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.111 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.065 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.057 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.022 394
Magnesium 7439-95-4 Lead frame 0.018 0.010 184TOTALS 100.000 56.300 1,000,000
Various Assembly Sites / Material compilation 0.0563 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
94 2:20 PM : 10/5/2006ST 14 (TSSOP) Various
Lead Finish:
Principal Ingredient
of Lead Frame:
Semiconductor Device Type: ST 20 (Lead) TSSOP Sn67.5/Pb32.5 Copper
Tin 7440-31-5 Solder surface finish 0.844 0.622 8,438
Silver 7440-22-4 Lead frame, Die attach 0.495 0.365 4,954
Lead 7439-92-1 Solder surface finish 0.406 0.299 4,063
Nickel 7440-02-0 Lead frame 0.336 0.248 3,360
Carbon Black 1333-86-4 Mold compound 0.239 0.176 2,394
Gold 7440-57-5 Wire Bond 0.200 0.147 2,000
Quartz (SiO2) 14808-60-7 Die attach 0.197 0.145 1,969
2,2'-[{2-(oxiranylmethoxy)-1,3-phenylene}bis(methylene)]bisoxirane 13561-08-5 Die attach 0.116 0.086 1,163
2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane 54208-63-8 Die attach 0.102 0.075 1,020
4-methyl-2-phenyl-1H-imidazole 827-43-0 Die attach 0.039 0.029 394
Magnesium 7439-95-4 Lead frame 0.018 0.014 184TOTALS 100.000 73.700 1,000,000
Various Assembly Sites / Material compilation 0.0737 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directive 2002/95/EC (RoHS Directive) only if used in an exempted end user application. (Annex II to the RoHS Directive, 7ii or 7iii).
This semiconductor device and its homogenous materials comply by exemption with EU Directive 2002/525/EC (End-of-Life Vehicles (ELV) Directive) in accordance with Annex II Item 11 (Solder in electronic circuit boards and other electric applications).Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
www.microchip.com
Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 USA (480) 792-7200 FAX (480) 792-7277
