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May © 2016 FromTechnologies to Market Inverter Technology Trends & Market Expectations 2016 Sample
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May © 2016
From Technologies to Market
Inverter Technology
Trends & Market Expectations
2016
Sample
2
REPORT OBJECTIVES
This report’s objectives are to:
• Explore the market for inverters and their components
• Understand the market dynamics for related power electronics applications
• Identify the key drivers that will shape the market in the future
• Understand the main technology and market trends
• Have a clear overview of competitive landscape and regional characteristics
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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REPORT METHODOLOGY
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
Market segmentation methodology
Market forecast methodology
4
REPORT METHODOLOGY
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
Technology analysis methodology Information collection
5
• Report Objectives 4
• What is in this report 5
• Glossary 8
• Executive Summary 9
• Power Electronics: Basic Concepts 36
Why the inverter is so important? 44
• PE Market 2015 - 2021 47
Device market 51
Inverter market 54
• PE application overview 60
Electric & hybrid vehicles 62
Architecture 65
Towards more integration 69
WBG penetration 85
Market 89
Supply chain 90
Wind turbines 95
Architectures 100
Power devices 109
Market 114
Market shares 119
Focus on China 123
Photovoltaic inverters 126
Architectures 131
Power devices 140
PV inverter manufacturers 147
Market 153
Rail 156
Architectures 159
SiC implementation 164
Market share 169
Market 170
Uninterruptible power supplies 176
Architecture 179
WBG integration 183
Market 189
Focus data centers 190
Industrial motor drives 194
Low voltage motor drives 202
Medium voltage motor drives 203
Market 207
Market share 208
TABLE OF CONTENTS
Part 1/2
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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TABLE OF CONTENTS
Part 2/2
• Inverter’s technological evolution 215
Priorities per application 218
Power density 221
Architecture trends 226
WBG 230
High temperature 235
Software vs. hardware 239
Power stack 242
• Players landscape 248
• Conclusion 261
• Yole Presentation 264
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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INVERTER MARKET FORECAST
2015-2021
The business is dominated by industrial motor drives and UPS.
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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MARKET SPLIT PER POWER RANGE
In 2015
How the inverter market is split by power range in each application?
EV/HEV PV inverter Wind turbine Rail Motor drivesUPS
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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TOWARDS MORE INTEGRATION
Converters co-integration• XXX• XXX• XXX
• Improved cooling•Higher power density•Mechatronic improvement
Double sided cooling1-in-1 power modules
Co-integration motor + inverter:• XXX• XXX
Main evolutions in power electronics:
In-wheel motor + inverter integration
Towards
system
integration
6-in-1 power modules
All-in-1 power modules
Coming technologies?
Widely used 6-in1 power modules
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
10
GEOGRAPHICAL TRENDS
Wind power evolution by region
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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AVERAGE INVERTER PRICE
How inverter prices have gone down
Microinvertersare much more expensive than these average values, while central inverters are cheaper per $/W.
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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SIC IMPLEMENTATION IN RAIL TRACTION
Full SiCconverters are being already used from metros (in Tokyo) to HSRs, as it is the case for the Shinkasenbullet train, which is testing full-SiCconverters.
Current
Prototype
Market
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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MARKET SHARES
Main train manufactures
Almost all main train manufacturers are developing their own traction power converters.
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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PRIORITIES PER APPLICATION
Which is(are) the main driver(s) per application?
Different drivers, different priorities, different technical evolutions
EV/HEV,
aeronautics &
rail are
specially
looking for
power
density
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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ARCHITECTURE TRENDS
Power density
NPC topology shows lower power densities, that is why it is not used for EV or aircrafts.
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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OFF-THE-SHELF POWER STACK MARKET
Market shares
The power stack market is estimated at $XX.
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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INTER-APPLICATION POSITIONING
In which markets are companies positioned?
Many players are trying to be positioned in he automotive industry, as this market is expected to boom in the next couple of years.
New in this market
Got out of the market
Acquired
Not exhaustive list
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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EVERY YEAR, YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US AT*:
• NEPCON JapanJanuary 13-15, 2016 – Tokyo, Japan
• CS InternationalMarch 1-2, 2016 – Brussels, Belgium
• Image SensorsMarch 15-17, 2016 – London, UK
• International Conference and Exhibition on Device PackagingMarch 15-17, 2016 – Fountain Hills, USA
• Lab-on-a-Chip European CongressMarch 15-16, 2016 – Madrid, Spain
• APECMarch 20-24, 2016 – Long Beach, USA
• PCIM EuropeMay 10-12, 2016 – Nuremberg, Germany
• ECTCMay 31-June 3, 2016 – Las Vegas, USA
• Sensors Expo & ConfJune 21-23, 2016 – San José, USA
• SEMICON WestJuly 12-15, 2016 – San Francisco, USA
• LED Professional Symposium – LpSSeptember 20-23, 2016 – Bregenz, Austria
• SEMICON EuropaOctober 25-27, 2016 – Grenoble, France
• SEMICON JapanDecember 14-16, 2016 – Tokyo, Japan
*Non exhaustive list
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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Biographies & contacts
ABOUT THE AUTHORS
Mattin GRAO TXAPARTEGI
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is in charge of inverter architecture evolutionsand passive components (from capacitors to protection devices). Previously, he has been working as an intern at the French carmaker Renault, designing power converters for electric car chargers. He graduated from Grenoble INP with an Engineeringdegree in Electrical Systems, followed by a specialization in embedded systems for transportation. He then earned an advancedmaster’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial, andmarketing fields within the aeronautics industry.
Mail: [email protected]
Pierric GUEGUEN
Dr Pierric Gueguen is Business Unit Manager for power electronics and compound semiconductor activities at YoleDéveloppement. He has a PhD in micro- and nanoelectronics and a master’s degree in micro- and nanotechnologies forintegrated circuits. He worked as a PhD student at CEA-Leti in the field of 3D integration for integrated circuits and advancedpackaging. He then joined Renault SAS, and worked for 4 years as technical project manager in the company’s R&D division.During this time, he oversaw power electronic converters and integration of wide band gap devices in electric vehicles. He isauthor and co-author of more than 20 technical papers and 15 patents.
Mail: [email protected]
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
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MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
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Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
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4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market & Technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool
www.i-Micronews.com/reports
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A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
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OUR 2016 REPORTS PLANNINGo MEMS & SENSORS
− Gas Sensors and Combos 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities
2016…
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market and Technologies 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
− Emerging Non Volatile Memories 2016*
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016*
− Uncooled Infrared Imaging Technology & Market Trends 2016*
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Consumer Robots 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
− BioMEMS 2016
− Point of Need Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− FanOut WLP: Technology Trends and Business Update 2016*
− Embedded Die Packaging: Technology and Markets Trends 2016*
− 2.5D & 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016*
− Advanced Packaging in Emerging Markets: China 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016
o MANUFACTURING
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**
− Equipment and Materials for Fan Out Technology (Wafer vs Panel)
− Equipment and Materials for Advanced Substrates
− Equipment and Materials for 3D T(X)V Technology
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
o COMPOUND SEMICONDUCTORS
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications & Market 2016: from LED to Consumer Electronics*
− RF GaN Technology and Market Analysis 2016
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
− Microdisplays and MicroLEDs
− UV LED Technology, Manufacturing and Applications Trends 2016*
− OLED for Lighting 2016
− LED in Automotive Lighting 2016
o POWER ELECTRONICS
− Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends & Market Expectations 2016
− Power Electronics for Renewable Energy 2016
− Thermal Management for LED and Power 2016
− RF GaN Technology and Market Analysis 2016
o BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on
www.i-micronews.com
©2016 | www.yole.fr | About Yole Développement
25
OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Infrared Detector Technology & Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
o IMAGING & OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology & Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies & Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are
available on www.i-micronews.com
©2016 | www.yole.fr | About Yole Développement
26
CONTACT INFORMATION
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• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KKEmail: [email protected]
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected]
• Report business
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected]
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.Email: [email protected]
• Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]
• Taiwan: Mavis Wang, Business Development DirectorEmail: [email protected]
• Financial services
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]
• General
• Email: [email protected]
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