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Ion exchange apparatus

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bath: and causing a current to tlow between the anode and cathode to deposit the plat• ing material on the workpiece. Ion Exchange Apparatus us. Patent 5,776.340. July 7, 1998 J. Jangbarwala and C. F Michaud, assignors to Hydromatix Inc., Chino, Calif. An apparatus of a deionization and re• generation system comprising a cation ex• change bed packed with cation exchange resin: an anion exchange bed packed with anion exchange resin. the anion exchange bed arranged in series with the cation ex• change bed: a collection sump: a main loop comprising the cation exchange bed. and collection sump to circulate water or rinse therethrough: plural cation tanks for storing cation regenerant solution: a cation loop comprising the cation exchange hed and cation tanks: plural anion tanks for storing anion regenerant solution: an anion loop comprising the anion exchange hed and anion tanks: at least one cation rinse tank for storing cation displacement rinse: at least one anion rinse tank for storing anion displacement rinse: an air-purging blower in connection with the tops of the cation and anion exchange beds for purging the solution: and closable branches controlla• ble in sequence for backwashing. regener• ating. and rinsing. Electrostatic Powder Coating System us. Patent 5,776,554. July 7, 1998 C.R. Merrill and R. M. Thorn. assignors to Illinois Tool Works Inc., Glenview, III. An electrostatic powder coating system comprising a conveyor for transporting ar• ticles to a coating station: a laterally mov• able base member: an upright support member mounted upon the movable base member: a coating booth: an electrostatic coating applicator projecting into the coat• ing booth: and means for laterally moving the base memher with respect to the con• veyor and means for vertically moving the coating booth with respect to the upright support memher. Coating Composition for Metal Containers us. Patent 5.776.569 July 7. 1998 H.F Cole, assignor to The Dexter Corp.. Windsor Locks, Conn. A coating composition for a metal sub• strate comprising 2 to 25'k hy weight of nonvolatile material of a low molecular weight polyfunctional epoxy novolac resin having an epoxy functionality or 2.1 to 6: 2 to 2Yk of nonvolatile material or a phe• nolic resin: 2 to 25'k or nonvolatile mate• rial of a high molecular weight epoxy resin having an epoxy functionality or 1.1 to 2: 60 to ',lOCk or nonvolatile material of a vinyl chloride dispersion resin: and a sufficient amount or a nonaqueous carrier such that the coating composition includes 20 to 70'k by weight of the composition of the total weight resins. Metallizing Polyimide us. Patent 5.776,663. July 7. 1998 J-W Roh, assignor to Daewoo ElectrOnics Co. Ltd, Seoul, Rep. of Korea A method 1'01' forming a conductive layer on a substrate having a top surface. com• prising forming a seed layer on the top GET YOURS TODAY! CALL: (847) 546-8225 FAX: (847) 546-9210 Email: [email protected] 500 Hart Road, Round Lake, IL 60073-2898 U.S.A. "FAST" MAKES MORE "CENTS"! OURS: MAXIMUM TEMP 435°F Without Shrinking*. Faster Curing &Baking Times Increase Output... & PROmS! TBEIRS: SHRINKING Occurs at ONLY 400°F. Slower Une Speeds Means Lost iune & LESS PROmS! Circle 053 on reader information card 70 THE GRIEVE CORPORATION Leaders In Heat Processm E UI ment Smce 1949 Circle 025 on reader information card METAL FINISHING. DECEMBER 1998
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Page 1: Ion exchange apparatus

bath: and causing a current to tlow betweenthe anode and cathode to deposit the plat•ing material on the workpiece.

Ion Exchange Apparatusus. Patent 5,776.340. July 7, 1998J. Jangbarwala and C. F Michaud, assignors toHydromatix Inc., Chino, Calif.

An apparatus of a deionization and re•generation system comprising a cation ex•change bed packed with cation exchangeresin: an anion exchange bed packed withanion exchange resin. the anion exchangebed arranged in series with the cation ex•change bed: a collection sump: a main loopcomprising the cation exchange bed. andcollection sump to circulate water or rinsetherethrough: plural cation tanks for storingcation regenerant solution: a cation loopcomprising the cation exchange hed andcation tanks: plural anion tanks for storinganion regenerant solution: an anion loopcomprising the anion exchange hed andanion tanks: at least one cation rinse tankfor storing cation displacement rinse: atleast one anion rinse tank for storing aniondisplacement rinse: an air-purging blower

in connection with the tops of the cationand anion exchange beds for purging thesolution: and closable branches controlla•ble in sequence for backwashing. regener•ating. and rinsing.

Electrostatic Powder CoatingSystemus. Patent 5,776,554. July 7, 1998C.R. Merrill and R. M. Thorn. assignors to IllinoisTool Works Inc., Glenview, III.

An electrostatic powder coating systemcomprising a conveyor for transporting ar•ticles to a coating station: a laterally mov•able base member: an upright supportmember mounted upon the movable basemember: a coating booth: an electrostaticcoating applicator projecting into the coat•ing booth: and means for laterally movingthe base memher with respect to the con•veyor and means for vertically moving thecoating booth with respect to the uprightsupport memher.

Coating Composition for MetalContainers

us. Patent 5.776.569 July 7. 1998H.F Cole, assignor to The Dexter Corp.. WindsorLocks, Conn.

A coating composition for a metal sub•strate comprising 2 to 25'k hy weight ofnonvolatile material of a low molecularweight poly functional epoxy novolac resinhaving an epoxy functionality or 2.1 to 6: 2to 2Yk of nonvolatile material or a phe•nolic resin: 2 to 25'k or nonvolatile mate•rial of a high molecular weight epoxy resinhaving an epoxy functionality or 1.1 to 2:60 to ',lOCk or nonvolatile material of a vinylchloride dispersion resin: and a sufficientamount or a nonaqueous carrier such thatthe coating composition includes 20 to70'k by weight of the composition of thetotal weight resins.

Metallizing Polyimideus. Patent 5.776,663. July 7. 1998J-W Roh, assignor to Daewoo ElectrOnics Co. Ltd,Seoul, Rep. of Korea

A method 1'01' forming a conductive layeron a substrate having a top surface. com•prising forming a seed layer on the top

GET YOURS TODAY!CALL: (847) 546-8225 FAX: (847) 546-9210

Email: [email protected] Hart Road, Round Lake, IL 60073-2898 U.S.A.

"FAST" MAKES MORE "CENTS"!OURS: MAXIMUM TEMP 435°FWithout Shrinking*. FasterCuring &Baking Times IncreaseOutput...&PROmS!

TBEIRS: SHRINKING Occursat ONLY 400°F. Slower UneSpeeds Means Lost iune &LESS PROmS!

Circle 053 on reader information card

70

•THE GRIEVECORPORATIONLeaders In Heat Processm E UI ment Smce 1949

Circle 025 on reader information card

METAL FINISHING. DECEMBER 1998

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