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Page 1: Ion exchange apparatus

bath: and causing a current to tlow betweenthe anode and cathode to deposit the plat•ing material on the workpiece.

Ion Exchange Apparatusus. Patent 5,776.340. July 7, 1998J. Jangbarwala and C. F Michaud, assignors toHydromatix Inc., Chino, Calif.

An apparatus of a deionization and re•generation system comprising a cation ex•change bed packed with cation exchangeresin: an anion exchange bed packed withanion exchange resin. the anion exchangebed arranged in series with the cation ex•change bed: a collection sump: a main loopcomprising the cation exchange bed. andcollection sump to circulate water or rinsetherethrough: plural cation tanks for storingcation regenerant solution: a cation loopcomprising the cation exchange hed andcation tanks: plural anion tanks for storinganion regenerant solution: an anion loopcomprising the anion exchange hed andanion tanks: at least one cation rinse tankfor storing cation displacement rinse: atleast one anion rinse tank for storing aniondisplacement rinse: an air-purging blower

in connection with the tops of the cationand anion exchange beds for purging thesolution: and closable branches controlla•ble in sequence for backwashing. regener•ating. and rinsing.

Electrostatic Powder CoatingSystemus. Patent 5,776,554. July 7, 1998C.R. Merrill and R. M. Thorn. assignors to IllinoisTool Works Inc., Glenview, III.

An electrostatic powder coating systemcomprising a conveyor for transporting ar•ticles to a coating station: a laterally mov•able base member: an upright supportmember mounted upon the movable basemember: a coating booth: an electrostaticcoating applicator projecting into the coat•ing booth: and means for laterally movingthe base memher with respect to the con•veyor and means for vertically moving thecoating booth with respect to the uprightsupport memher.

Coating Composition for MetalContainers

us. Patent 5.776.569 July 7. 1998H.F Cole, assignor to The Dexter Corp.. WindsorLocks, Conn.

A coating composition for a metal sub•strate comprising 2 to 25'k hy weight ofnonvolatile material of a low molecularweight poly functional epoxy novolac resinhaving an epoxy functionality or 2.1 to 6: 2to 2Yk of nonvolatile material or a phe•nolic resin: 2 to 25'k or nonvolatile mate•rial of a high molecular weight epoxy resinhaving an epoxy functionality or 1.1 to 2:60 to ',lOCk or nonvolatile material of a vinylchloride dispersion resin: and a sufficientamount or a nonaqueous carrier such thatthe coating composition includes 20 to70'k by weight of the composition of thetotal weight resins.

Metallizing Polyimideus. Patent 5.776,663. July 7. 1998J-W Roh, assignor to Daewoo ElectrOnics Co. Ltd,Seoul, Rep. of Korea

A method 1'01' forming a conductive layeron a substrate having a top surface. com•prising forming a seed layer on the top

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METAL FINISHING. DECEMBER 1998

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