Integrated Photonic Systems Roadmap (IPSR)

Bob PfahlDirector of RoadmappingNovember 2, 2016

Sponsors & Participants

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Sponsor

Lead Participants

Overview of IPSR

Roadmapping Process and Scope

Participants in Roadmap as of October 1, 201616 Countries, 590 Individuals, 231 Organizations

IPSR-AIMPhotonicsRoadmapping/ProjectPlanningProcess

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Manufacturing System Plan (TWGs & PEGs)

Product Sector Requirements

Integrated Photonic Systems Roadmap

Gap Analysis

AIMPhotonicsImplementationPlan

AIMPhotonicsProjects

OpenRoadmapping

Closed Project Planning

Red=PSMROrange=AIM PhotonicsBlue=AIM & PSMR

Roadmap Structure

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iNEMI Member Testimonials

• Mark Morizio (IBM)• “We rely on a vertically integrated organization like iNEMI where

we can develop technologies with others in the industry to accelerate our time to market and reduce development expenses.”

• Jean-Luc Pelissier (Universal Instruments)• “[The iNEMI Roadmap] gives us an opportunity to develop the

right product at the right time for the right people.”

• Murwad Kurwa (Flextronics)• “We can accelerate completion of projects with joint participation

from different members on the common need of the industry, benefitting both Flextronics and the industry.”

1. MonolithicIntegrationTWG:LionelKimerling,MIT– Chips:siliconphotonics, InP– Tradeoffs forcost,bandwidthdensity,powerefficiency, andfunctional latency

2. Electronic-PhotonicSystemPackaging:BillBottoms,ThirdMillenniumTestSolutions:

– Cost,materials, heat,footprint, portcount,bandwidth,integration,functionality

3. Connector&SubstrateTWG:JohnMacWilliams,U.S.Competitors– Connectors includes:allseparable interfaces withinthesystem scope

4. AssemblyandTestTWG:DickOtte,PromexIndustries– DesignforManufacturing– Assembly andTest– SupplyChainTradeOffs

EightIPSRTechnologyWorkingGroups(TWGs)

iNEMI Member Testimonials

• Mark Morizio (IBM)• “We rely on a vertically integrated organization like iNEMI where

we can develop technologies with others in the industry to accelerate our time to market and reduce development expenses.”

• Jean-Luc Pelissier (Universal Instruments)• “[The iNEMI Roadmap] gives us an opportunity to develop the

right product at the right time for the right people.”

• Murwad Kurwa (Flextronics)• “We can accelerate completion of projects with joint participation

from different members on the common need of the industry, benefitting both Flextronics and the industry.”

5. PhotonicSensorsTWG:BenMiller,U.ofRochester;AnuAgarwal,MIT

– PhotonicSensorsforawiderangeofmarkets

6. EPDA(Electronic-PhotonicDesignAutomation)TWG:BretAttaway,AIMPhotonics

– IntegratedSystemSimulationandDesignTools

7. SubstrateTWG:VoyaMarkovich,MicroelectronicAdvancedHardwareConsulting

– Includesallsubstratesexternaltothepackage8. TestTWG:DickOtte,PromexIndustries(acting)– PhotonicandElectricalTestatalllevels

EightIPSRTechnologyWorkingGroups(TWGs)

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Two IPSR Product Emulators

1. Data Centers: High Bandwidth, Low Latency, Efficient Power– E to O and O to E– Applications focus on IT and Data

Communications2. IoT: Low Bandwidth, “High” Latency, Low

Power– Primarily E to O– Applications include IoT, Sensors

ThreeBenefitsfromParticipatinginRoadmapping

• IntheRoadmappingProcessyoumeetwithyoursupplychainfromtoptobottom.– Includesequipment,material,andcomponentsuppliers

• TheIntegratedPhotonicSystemsRoadmappingProcess:1. Identifiesandquantifiesintegratedphotonicmarketopportunities

tothesupplychain.Thusreducingtheriskofdevelopingnewproductsforthis

2. IdentifygapsoutsidethescopeofAIMPhotonicsthatpartnershipsorconsortiumcanaddress(COBO,iNEMI,HIR,HDPUG,etc.)Possible Subjects

StandardsDevelopmentDesignStandardsReliabilityStudiesTestingMethodsWarpage

3. AttractsfirmstoAIMPhotonics

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Participants in Roadmap as of October 1, 201616 Countries, 590 Individuals, 231 Organizations

Activities and Work ProductsTWG Meetings by WebExWebinars on Key OutcomesTwo Workshops Each YearRoadmapParticipants in Roadmap as of October 1, 201616 Countries, 590 Individuals, 231 Organizations

FacilitateTwoRoadmappingWorkshops

• SpringworkshopincludedintroductoryworkshopsbytheSensorsandEPDATWGs,andMilitaryApplicationsPEG.– TechnicalPresentationsonFutureTechnologyNeedsandLeadingResearchwilladdress“NEXTSTEPSFORSUPPLYCHAINSUSTAINABILITY.”

• FallIPSRworkshop“BuildinganIndustry:PartII”(Oct31-Nov2)willincludepresentationsbythePhotonicSensorsandEPDATWGs– TheRoadmapTWGleaderswillpresentalistofCriticalChallengesforAIMProjectPlanning.

– TechnicalPresentationswilladdressFutureTechnologyNeedsforLIDARandotheremergingmarkets

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UpcomingMonthlySeminarSeries

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BoardLevelOpticalInterconnect10/20Dr.TerrySmith:3MJohnMacWilliams:BishopAssociateAbstract:Dr.SmithandMr.MacWilliamswillpresentaproposaltodevelopasinglemode,expanded-beammoduleinthenext18monthsforfutureapplicationssuchasmid-boardtransceivermodules,IOports,disaggregatedserver.Theprojectisdesignedtodeterminemanufacturabilityandcostreduction.

KeyChallengesIdentifiedbytheIPSRRoadmap11/17ProfessorLionelKimerling:MITAbstract:ProfessorKimerlingwillpresentthekeytechnologyneedsidentifiedbythe2016IPSRRoadmapandparticularlyfocusongapsthatAIMphotonicsshouldconsiderfor2017projects.

For additional information:

Bob Pfahlbob.pfahl@inemi.org

www.photonicsmanufacturing.org