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July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 1
WBS 1.1.1.5(& W.B.S. 1.1.1.6.2 & Services)
Pixel Module Assembly & Test
1. Technical Status2. Goals for 20043. Service Panels
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 2
Technical Status
• Thinning and dicing
• Module Assembly
• Pigtails are gone
• Adhesives
• Sector loading
• Production testing
• Burn-in setup
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 3
Technical Status: Thinning and Dicing• This is going very well. Great work by Amanda, Aldo, & Al Clark. Vendor GDSI has been
very reliable. Cost under control.• Only issue with FE-I1
was suspected silicon particle contamination leading to shorts during flip chip. This may not be an issue for FE-I1 (or it may be worse). Chip squashing tests are under way.
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 4
Technical Status: Module Assembly 1/2
• FE-I1 used to “shake down” the module assembly process.
• Yield of all steps has steadily improved. Not quite at planned levels yet, but plateau probably not yet reached.
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PDB Assembly Date
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IZM AMS LBNL Total "Detector grade"
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 5
Technical Status: Module Assembly 2/2• Fixturing is very simple and works
well. What we have is good enough for production.
• Assembly time with new adhesive tape is literally less than 1 hour per module
• Wire bonding with new machine is a breeze. But we need to buy such a machine! (availability assumed in cost and schedule)
• Only outstanding issue is how exactly to pot the bonds to avoid magnetic field resonance. Work in progress.
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 6
Technical Status: Pigtails Gone 1/3
• Original design had cable soldered to flex pigtail, in turn wire-bonded to module
• In fixing a defective pigtail bypassing it with wires, we realized that the pigtail was hurting more than helping.
• Now cable soldered directly to flex.
• Fewer things to test, fail and assemble.
• No wire bonded connections to module
• All modules for a given disk are identical (before needed 2 flavors)
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 7
Technical Status: Pigtails Gone 2/3implications for US assembly flow
Flex + SMT
LBL for cable
Albany for HV test
OU for MCC
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 8
Technical Status: Adhesives
• Flex Hybrid To module Attachment– Original scheme of no glue under flex bond pads did not work
due to flex bow
– Switched to silicone tape adhesive under bond pads.
– Allows for excellent wire bonding and instant assembly.
– Radiation tested OK. Some further qualification needed (thermal cycling, etc.)
• Module to Sector Attachment– SE-4445 Silicone accepted as new universal baseline
– Modules on sector being loaded with this glue now (used to be CGL). Very good initial experience.
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 9
Technical Status: Sector Loading
• Major development here
• First and only real sector was loaded “by hand” with makeshift fixtures
• Original tooling, now 2 years old, had many problems.
– Pickup of real modules built with Dyconex flex was a problem
– Sector tubing design evolved and no longer fit.
– No provision for survey of module position
• New concept introduced for sector safe handling, storage, survey, testing. “Sector frame”. Similar concept to flex frame.
• Entirely new tooling designed around frame. All parts have need built and are almost ready for first use (build second real sector). (aside: Fred charges all this to SCT account)
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 10
Technical Status: Production Testing
• Have been pushing for a documented module, sector and stave QA plan. Collaboration has been slow to respond.
• Nevertheless, a fairly clear picture is emerging of the resources needed.
• Basically:– Characterize each module with PC test setup
– Burn-in and thermal cycle each module (new burn-in setup needed)
– Burn-in, survey, thermal cycle, and IR image each sector (same burn-in setup as module)
– Undecided: test each sector with ROD.
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 11
Technical Status: Burn-in Setup
• Finally started development at LBL
• Students + Eng. Div. drafter.
• Design “specs”– Keep it simple
– Add-on to existing single module test setup
– Cheap and easy to replicate (we expect everyone will want one).
New burn-in board
New burn-in board
New burn-in board
New burn-in board
USB port or USB hub
ISEG supplies for HV, bulk supply for LV power
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 12
Goals For 2004• Start Production!• Finish production in early FY05!• Try to get collaboration to buy into this “5th disk”
– Gain time on ramp-up– If it ends up working more or less it becomes half of a 3rd hit
Jun Jul Aug Sep Oct Nov Dec Jan-04
FE-I2-Rev.1 XXXXXXXXXXXMCC-I2-Rev.1? XXXXXXXXXXXXXProbe FE wafers XXXXBump FE wafers XXXXThin, dice, reprobe XXXXXXXXXXXFlip XXXXXXXXXXXXXXXXXXFlex bidsFlex smt assy XXXXXXXAdd disk Type 0 wires XXXXXHV test XXXXXXXXLoad MCC & test XXXXBare module probe XXXXXXXXXXXXXXXXXXDisk module assy. XXXXXXXXXXXXXXXDisk module test XXXXXXXXXXXXXXXXSector loading XXXXXXXXXXXXXXSector test & burn-in XXXXXXXXXXXXXX
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 13
2004 Goals: Type 0 Cable Production
• There is no flex pigtail fabrication (1.1.1.4.3.2 -> 0)• Copper clad wire and other materials ($5K)
• PCB for PP0 connector end of cable ($1.7K)
• Cables attached to flex hybrid at LBL (600hrs tech.)
• Total:– $6.7K this is part of
– 600 hours labor ($40K) module assy. in WBS
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 14
2004 Goals: Wafer Thinning, Dicing, Die-probing Production
• 100x Bumped FE-I wafer thin ($15K)
• Cleaning & re-coating in Microlab (100hrs student)
• Inspection (25hrs student)
• Dicing ($20K)
• Cleaning resist in Microlab (100hrs student)
• Single Die Probing & inspection (1760hrs student)
• Supplies (gel packs, etc) ($12K)
• Totals:– $47K ETC03 prod. total– 2000 hours student ($30K) 29K+28K
+20K
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 15
2004 Goals: Production Module Assembly
• Shipping Covers & supplies ($8K)• Equipment maintenance ($5K)• Technician Assembly Labor (600hrs)• Technician tests (bond pulls, etc.) (300hrs)• Shops (100hrs)• Totals
– $13.3+6.7= $20K ETC03 prod. total
– 1160+600 hours ($60K) 24K+176K(type 0 cable)
-120K
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 16
2004 Goals: Burn-in System Development• Being developed by students + eng. Div. Drafter. • First prototype by end of summer => Much of this cost is
in FY03!• At that point will need a lot of software help (new
postdoc to jump in…) • Same system to be used for sector burn in.• See Module QA for operation of burn-in system • Copies of system likely to be requested by collaborators
– $20K board fabrications and purchases – 440 hours drafter ($20K)– 880 hours student ($12K)– 80 hours shop ($6K) ETC03 – Total: $58K 46K
+12K
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 17
2004 Goals: Production Module QA• Still hard to estimate how long it will take per module for 1
person + TDaq setup.• Optimistically assume 4 hours per module.• Need dedicated setup and a lot of disk space. • Note this is different setup than burn-in. That’s a second
dedicated setup. • => Do we need one more TDaq setup? Yes.
– New Tdaq setup & pwr supplies ($15K)– 1760 hrs student ($25K)
• Burn-in setup operation– Operating supplies ($5K) – 880 hrs student ($12K) ETC03 Prod. Total
• Total QA: $20K + $37K $45K + $75K-63K
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 18
2004 Goals: Production Sector Loading
• This should not be a very labor intensive operation
• Ideally will be done by an engineering tech. now F/T on mechanics, to be trained by FRED.
• Important cost is frame holders for production modules and possibly additional tooling. – Misc. tooling, & supplies ($7K)
– 20 frames, 16shop hours each ($16K) ETC03 Prod. Total
– 440hrs. Mech. tech. ($16K) $7K + $24K
+8K
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 19
2004 Goals: Production Sector QA
• Involves IR, Metrology, Thermal cycling, and electrical burn-in
• Assume 1 sector/week
• => 1 FTE for this job (student OK)– Fixtures, storage ($25K) ETC03 Prod. Total
– 1760 hrs student ($25K) $36K + $12K
• What about database? ETC03 has $11K
+2K
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 20
Module Production Summary • Adding up the labor we need 4.1FTE students in FY04.
– We have ~1.
– New postdocs can pick up some of the work
– Probably still need to hire at least 2 temps (eg. finishing undergrads) or find visitors or other help.
• Technicians needed: 1.6FTE. Seems OK.
• Assuming we can find this many students, looks like significant reduction compared to ETC03. (about 140K).
• But, part of these savings are not real because we are spending “production” money on continued prototype work in FY03. I have not tried to add up FY03 standing army cost and subtract it from production budget.
July 10, 2003 M. Garcia-Sciveres -- Module Assembly & Test 21
Service Panel Production (2004)For 3-Hit System (everything up to PP1 tapes)
• 57Kg Cu-Clad Al Wire (+overage) $81K• Flex fabs, connectors, vendor assy. $66K• LBNL Tech. Labor 3648Hrs
• Total for Electrical component of Service panel production: $293K
• (2 hit total is $226K)
This is the slide from last year. New estimate looks a tiny bit less (10-20%), but uncertainty is still too large to reduce this.