Date post: | 07-Aug-2015 |
Category: |
Documents |
Upload: | paul-whitford |
View: | 139 times |
Download: | 2 times |
NEW 3D Laser Scanning MicroscopeVK-X100/X200 Series
A Microscope, SEM and
Roughness Gauge in a Single UnitPerform profile and roughness measurements with a click of a button
2
Providing Non-contact Profile and Roughness
Measurements on Nearly Any Material
NEW
3D Laser Scanning Microscope
VK-X100/X200
3
OPTICAL MICROSCOPE
It is impossible to focus on a target
with an uneven surface at high
magnification.
SEM
Observation can only be performed
in black and white, sample size is
limited and pre-processing is time
consuming.
ROUGHNESS GAUGE
Projections and depressions cannot
be measured without damaging the
target area.
For overall observation and measurement of a target
High-speed and high-precision image stitching with WIDE-Scan eliminates field-of-view
limitations at high magnification.
Wide-view
Ensure uniform measurements from user to user
Per form fully-automated measurements with a single-click of the mouse.
Measurement
All of these limitations are overcome with a laser scanning microscope
NEW Two New Functions
WIDE-Scan
AI-ScanFULLY-AUTOMATED MEASUREMENTS
with one push of a button
Enlarged (1000x)
4
Disadvantages
OPTICAL MICROSCOPE
SEM
ROUGHNESS GAUGE
Poor resolution, low contrast
Monochrome image only
Sample scratched due to contact with probe
Shallow depth-of-field
Time-consuming preparation and observation
Difficult to measure target areas
No support for traceability
Restricted sample size
Resolution is limited by stylus tip diameter
1
1
1
2
2
2
3
3
3
Disc pits (6000x)
Ink toner (1000x)
Blade edge (1000x)
PREPARATION
Sample processing
Deposition To stage
Approx. 20 min
OBSERVATION
Start-up Vacuuming
Observation
Approx. 25 min
Observation may not be possible due to the size of the sample because it cannot fit in the sample chamber.
Hitting the desired area of a target with a stylus can be problematic for targets like screw thread crests.
It is not possible to measure surfaces that are smaller than the tip of the roughness gauge’s stylus.
Contact-type surfaceroughness gauge
R: 2 μm0.08 Mil
Aluminum surface (200x)
Horizontal indenta-tions on screen.
COMMON PROBLEMS WITH CONVENTIONAL EQUIPMENT
5
Problems Solved with a Laser Microscope
Disc pits (6000x)
High resolution, 24000x magnification
High-definition color image
Non-contact design can be used on soft targets
1
1
1
Blade edge (1000x)
Fully-focused image
No sample preparation
Easily locate area of interest
2
2
2
Traceability compatible
Measure samples of any size and nearly any material
Small beam-spot laser
3
3
3
Ink toner (1000×)
Detachable head unit allows for a variety of sample sizes to be measured, can be integrated with other devices and supports remote operation.
HIGH-RESOLUTION, LARGE DEPTH-OF-FIELD OBSERVATION
RAPID 3D COLOR IMAGING
NON-DESTRUCTIVE PROFILE AND ROUGHNESS MEASUREMENTS
Z X-Y
Independent administrative agency/National Institute of Advanced Industrial
Science and Technology (AIST)
National Institute ofStandards and Technology
(NIST)
JCSS Accredited Laboratories
Height difference gaugeCoordinate measurement
instrument
Calibration block Calibration chart
3D Laser Scanning Microscope (VK Series)
Measurement results obtained using the VK Series are highly reliable and comply with national traceability standards.
PREPARATION
Place your sample directly
on the stage
0 min
OBSERVATION
Start-up Observation
Approx. 3 min
LED pad (1000x)
2D image 3D image
Laser microscope
R: 0.4 μm
Laser beam diameter is significantly smaller than a roughness gauge stylus, enabling more accurate measurement of irregular shapes.
0.02 Mil
Easily achieves full-focus
observation
High resolution, high
magnification observation
Optical observation
Full-focus image
High-resolution laser monochrome image
The Next Step in the Evolution of Optical Observation
High-speed auto focusInstantly obtain a focused image of a sample with a single click, even at
high magnification. Additional focus adjustments are unnecessary.
IC pattern (1000x) Blade edge (1000x)
NEW Digital microscope observationCapture high-resolution images with true color
Built-in camera with 3CCD imaging mode
Record up to a 21.6 megapixel imageWhat is the pixel shift method?Records a total of 9 images by shifting the CCD both vertically and horizontally by 1/3 of a pixel. Furthermore, it obtains RGB data for each pixel, thus allowing for clear observation with superior color reproduction.
Full-focus observation
Capture fully-focused images, even on three-
dimensional objects or at high magnification.
Super high-resolution observation
6
VK-X100/X200 Fea tu res .01
OBSERVATIONObservation of unparalleled clarity
Color SEM-like
observation
3D
observation
Industry’s Best 16-bit laser color image
Sandpaper (400x)
By scanning the entire surface with a
short-wavelength laser, full-focus
observation is achieved from 200x to
24000x* at resolutions that can not be
attained with an optical microscope.
* When using the VK-X200 Series
Disc pits (6000x)Optical image
Monochrome laser image
Laser image
16-bit laser color image Ink toner (1000x)
Industry’s Best 16-bit laser color imageAchieve fully-focused observation with unparalleled resolution
SEM-like resolution with real color
By scanning a laser in XYZ directions
over a target, users can capture fully-
focused color images with accurate
height information associated with each
pixel.
7
* If settings are performed without this adjustment, reflections on angled surfaces and dark surfaces will be weaker and cause errors.
Now Anyone can Perform High-Quality Measurements
Developed with years
of experience and
technical knowledge.
Easy Mode and
AI-Scan allow anyone
to perform expert
measurements.
World’s First The 3 functions of AI-Scan
1. AAG functionAutomatically selects the two best settings for the laser light-receiving element to allow for accurate measurements to be made on angled surfaces and targets with varying levels of contrast.
* AAG=Advanced Auto Gain
Start measurement with a single click
Conventional method AAG function
Diamond tool (400x)
(1) Sensitivity adjustmentChanges the sensitivity of the light-receiving element to prevent saturation when scanning a sample.
(2) Sensitivity readjustment*Automatically adjusts to raise the sensitivity to a level just below the level that will produce saturation.
8
VK-X100/X200 Fea tu res .02
RECORDINGIntuitive and easy-to-use interface
Glare
Exists
Absent Conventional systems only adjust the laser sensitivity at a certain height, making it impossible to account for changes in the surface of the target throughout the entire measurement range.
Field of View Field of View
Me
asu
rem
en
t ra
ng
e
AAG FUNCTION
AAG ORIGINAL
CONVENTIONAL ALGORITHM
1-1. Automatic adjustment of the laser sensitivity 1-2. Optimal adjustment at each height
FULLY-AUTOMATED MEASUREMENTS
with one push of a button
2. Auto setting of the upper and lower limitsAutomatically recognizes and sets the upper and lower limits of the measurement range, and then collects measurement data by scanning the target throughout that range.
The upper and lower limits on the screen are recognized and automatically set as the measurement range
The lens scans automatically
When using single scan After double scan
3. Double scan functionAdjusts the measurement and capture settings and automatically re-scans the target to obtain information that wasn’t detected during the first scan.
9
By simply clicking the “Start measurement” button,
the AI-Scan function will automatically scan an object
using the optimal settings.
Solder (200×)
Upper limit
Lower limit
Robust measurement software provides flexibility for analysis
Surface area measurement of a solar battery (1000x)
Optical film (1000x)Height, width, angle and cross-section measurement (1000×)
Radius-of-curvature of a micro lens (1000x)
LED pad unit - 3D comparison (1000x) Differential measurement of sample A and B
Sample A
Sample A Sample B
Sample B
Perform profile, height, area and volume measurements
3D image and profile comparison
Profile and 3D measurement
3D comparison view
Aligns two three-dimensional images to allow for comparative
evaluation.
Profile and 3D measurement
Height, width, angleand cross-section measurement
The VK-Analyzer software can measure the height, width,
cross-section, angle or radius-of-curvature of any user-
specified line or curved cross-section profile.
Surface area and volume measurement
Measures volume, surface area and surface area to area ratio
of objects in any specified location on the screen.
Compare profiles on two different images
Comparative measurement
Overlay and compare profile measurements on two different
targets. Differences in height are automatically displayed in
the profile graph.
10
VK-X100/X200 Fea tu res .03
MEASUREMENTMeasure any surface shape
Film - surface roughness comparison (3000x)
Resist pattern (6000x) Optical film (1000x) * Will be equipped in the near futureColor filter (1000x)
Electronic device pattern (1000x)
Sample A: Ra 1.5 μm Sample B: Ra 3.2 μm
Evaluate and characterize surface topography
Automatically record and measure multiple samples at once
Quantify line and surface roughness
Line roughness measurement
Calculate roughness on a 2D or 3D image for a given line.
Surface roughness measurement
Quantitatively determine differences in surface conditions by
measuring the surface roughness of a target.
Automatically measures targets that have a repeating pattern
Automatic width and height measurement
Automatically measures the width and height of targets that
have a repeating pattern. Since measurement is automatic, no
user errors are generated, allowing for rapid, accurate
measurement.
Performs consecutive measurements of multiple areas
Automatic measurement of multiple areas on multiple samples*
Using the motorized stage (optional), multiple areas of a single
sample or specific areas of multiple samples are automatically
measured.
2. Surface-roughness of blue filter1. Surface-roughness of red filter
11
Achieves the measurement of shapes that are at or
below a micron. Enables a range of observation,
from optical microscope to SEM observation, in a
single unit.
Light receiving element
Laser Scanning Microscope History
16-bit
5 nm0.005 μm
10 nm0.01 μm
14-bit
8-bit
PH
OT
OM
ULT
IPL
IER
PH
OT
OD
IOD
EC
CD
Improved operability
VK-8500 Series
VK-7500 Series
Enables the measurement of surface shapes from lines to planes
Performs area scanning with a red semiconductor
laser and achieves 3D shape analysis as well as
color confocal images.
VK-9500 Series
A short wavelength violet laser that achieves high measurement precision with a 14-bit light receiving element
Equipped with a violet laser as well as a 14-bit
photomultiplier to achieve high measurement precision with
18000x observation.
VK-8700 Series
A red semiconductor laser that greatly improves
versatility with a variety of observation and
measurement options.
VK-X100 SeriesNEW
The fusion of a laser displacement meter and a microscope
Achieves both microscope observation and profile
measurement by using a laser to perform line
scanning.
From lines to planes
12
One-click AI-Scan
Flow chart format
Evolution to an easy-to-use, high-precision instrumentThe shift from a laser microscope to a laser scanning microscope
FULLY-AUTOMATED MEASUREMENTS
with one push of a button
Greatly improved accuracy
TYPE VF-7500 VK-8500 VK-9500 VK-8700 VK-9700 VK-X100 VK-X200
Obse
rvati
on f
unct
ion Light-receiving
elementLine CCD, 8-bit Photodiode, 8-bit Photomultiplier, 14-bit Photomultiplier, 14-bit Photomultiplier, 16-bit
MagniY cation 250x to 2500x 200x to 8000x 200x to 18000x 200x to 12000x 200x to 18000x 100x to 16000x 200x to 24000x
Optical zoom None 1x, 2x, 4x 1x to 6x 1x to 6x 1x to 8x
Laser scanning method
Line (488 pixels × 1 pixel) Area (1024 × 768 pixels) Area (1024 × 768 pixels) Area (2048 × 1536 pixels) Area (2048 × 1536 pixels)
HDR function None None None OTC function (14-bit) HDR function (16-bit)
Reco
rdin
g f
unct
ion
Linear scale module resolution
None10 nm
(0.01 μm)10 nm
(0.01 μm)10 nm
(0.01 μm)1 nm
(0.001 μm)5 nm
(0.005 μm)0.5 nm
(0.0005 μm)
Measurement method setting
Manual Manual ManualManual or Beginner Mode
(AAG function)Manual settings/
Built-in Easy mode
Detection algorithm Peak algorithm Peak algorithm Peak algorithm Peak algorithm, RPD algorithm Peak algorithm, RPD algorithm
AI-Scan function None None None None Yes
Image stitching function
None None Yes (AIA system) Yes (FAST algorithm) Yes (Built-in WIDE algorithm)
Navigation function None None None None Yes*
Mea
sure
men
t fun
ctio
n Traceability compatible
None Yes Yes Yes Yes
Repeatability (σ) 0.03 μm 0.03 μm 0.02 μm 0.03 μm 0.014 μm 0.02 μm 0.012 μm
Top surface Y lm thickness of a transparent object
None None None Yes Yes
Film thickness measurement
Yes (line film thickness measurement)
Yes (line film thickness measurement)
Yes (line film thickness measurement)
Yes (line and area film thickness measurement)
Yes (line and area film thickness measurement
* Will be equipped in the near future.
The world’s most advanced laser scanning
microscope with 24000x magnification and
0.5 nm resolution.
Resolution of the linear scale module
1 nm0.001 μm
0.5 nm0.0005 μm
A built-in 16-bit light receiving element, along with
AI-Scan mode, enables simple, high-accuracy
measurements with high-resolution image capture.
VK-9700 Series
VK-X200 SeriesNEW
Further increases the versatility of observation and measurement functions and can be operated by non-experienced users.
Extremely versatile with 1 nm resolution and the ability to observe
transparent objects.
er increases the versatility of observat
The
mic
0.5
m
NE
er increases the versatility of observat
By improving the light-receiving element,
response capabilities have improved dramatically.
13
Linear scale module
[Conventional]
0.01µm
[VK-X200]
0.0005µmAchieves an ultra high precision that is 20x greater than conventional models.
Resolution
Conventional
16-bit & AAG
New features of laser scanning microscopes Part.1
Higher Precision
* If settings are performed without this adjustment, reflections on angled surfaces and dark surfaces will be weaker and cause errors.
(1) Sensitivity adjustmentChanges the sensitivity of the light-receiving element to prevent saturation when scanning a sample.
(2) Sensitivity readjustment*Automatically adjusts to raise the sensitivity to a level just below the level that will produce saturation.
Glare
Exists
Absent
AAG ORIGINAL
Diamond tool (400x)
14
VK-X100/200
Conventional
12-bit (4096 levels)
* Dynamic Range Comparison
256x more than a CCD
16x more than
conventional models
16-bit (65536 levels)
8-bit (256 levels)
CCD
16 times the dynamic range of conventional laser scanning microscopes
Industry’s Best 16-bit photomultiplier
When it comes to obtaining accurate data, the element responsible for detecting the reflected laser light is the most important component
of a laser scanning microscope. Boasting the world’s greatest dynamic range, the 16-bit photomultiplier of the VK-X Series is able to
accurately detect both faint and strong reflected light, even on highly-angular surfaces.
Achieves even higher precision
Industry’s Best 0.5 nm linear scale module
Automatically adjust the sensitivity of the 16-bit photomultiplier to its optimal settings
World’s First AAG function*
This function automatically adjusts the sensitivity of the laser receiving element
throughout the entire measurement range to account for variations in material, shape
and reflectance.
Detect position
information in the z-axis
with an ultra high-
precision 0.5 nm linear
scale module that is 20x more accurate than conventional
systems. This newly developed linear scale module can
achieve high-resolution measurement and boasts a
reliability that can be traced back to national standards.
* AAG = Advanced Auto Gain
Higher Speeds
z Z-I curve after measurement
The RPD algorithm enables high-precision measurement results while reducing the time it takes to scan a target.
Intensity of received reflected light (Intensity)
Can detect the real peak.
Cannot detect the real peak.
Detected peak
Detected peak
Conventional method
RPD method
Po
sitio
n in
Z-a
xis
dire
ctio
n
(Z p
ositio
n)
15
0 05 510 Measurement speed (sec)
2x faster than conventional models
8x faster than conventional models
Conventional
[Measurement mode: High-precision] [Measurement mode: Ultra high-speed]
Conventional
VK-X VK-X
Measurement speed (sec)
Perform high-precision measurements in a shorter amount of time
RPD* algorithm
The VK-X’s original algorithm detects the true peak position using the Z-I curve after measurement. It enables high resolution with a
significant reduction in measurement time.
* RPD=Real Peak Detection
Achieves measurement speeds that are at least 2x faster than conventional systems
NEW Equipped with an ultra high-speed scan mode with a top-speed of 120 Hz
Measurement speeds have been improved to 2x that of conventional systems while also improving the measurement accuracy. For
applications that require even higher speeds, a newly developed 120 Hz ultra high-speed scan mode can be equipped.
* Reference data from measuring a 10 μm step with a 50x objective lens
Conventional method
RPD method
0.053 μm (0.002 Mil) standard step sample measurement
result (Comparison with conventional method)
A narrow field-of-view prevents a user from understanding the target as a whole and restricts the measurement range.
New features of laser scanning microscopes Part.2
High-speed, high-precision
Solution
16
Resolve narrow field-of-view issues with image stitching
Issue.1
The statue of Lincoln on a U.S. penny (200x)
Conventional measurement method
High-magnification makes it difficult to understand what and where you are looking at.
Use WIDE-Scan mode to easily understand the overall structure of a target.
A high magnification image allows users to perform measurements with high-precision. However, as the magnification
is increased, the field-of-view reduces, making it difficult to understand where you are looking or what you are looking
at. WIDE-Scan allows users to quickly and easily generate a wider field-of-view image by stitching together multiple
images.
WIDE-Scan
Measuring only a single area often leads to incorrect data when applied to the entire target.
High-speed, high-precision
Solution
17
Issue.2Conventional measurement method
Each location being measured exhibits variations in the result.
20.5 µm height
18.5 µm height
22.5 µm height
Average height 20.5 µm
Multiple areas can be measured and averaged with WIDE-Scan.
If only measuring a limited number of areas, the numerical values may vary depending on the locations being
measured. WIDE-Scan obtains a wide-field, high-resolution 3D image and allows users to average data collected
from a much larger sample area.
WIDE-Scan
Measurement, processing and stitching
speed are dramatically improved with
AI-Scan and WIDE algorithm.
New features of laser scanning microscopes Part.2
High-speed, high-precision
Solution
18
Conventional image stitching
PCB (200x)
10 60 Measurement speed (min)
By combining AI-Scan and WIDE-Scan, images can be
seamlessly stitched together at speeds over 6x faster than
conventional systems.
High-precision stitching with the WIDE algorithm
Quickly stitches together images without the
appearance of seams or incorrect measurement
information. Automatically corrects all XYZ data by
evaluating the light intensity and height data of
overlapping areas.
6x the measurement speed of conventional models
Measurement, processing and stitching speed are
dramatically improved with AI-Scan and WIDE -Scan
algorithms.
* Reference data from measuring an approx. 4 mm square
Conventional
VK-X
WIDE-Scan NEW
Image stitching application
VK-H1XJ
Optional
VK-X100/X200 image stitching
Easily perform high-speed image stitching and wide-field measurements with WIDE-Scan
6x faster than conventional models
Image assembly - manual operation
It’s possible to stitch together several images without the need of a motorized stage.
Just drag and drop multiple images into the software, and the VK-X will automatically
complete the merge.
19
Easy stitching Free measurement
If an arbitrary range is set, the motorized stage will be
used to automatically perform continuous
measurement and stitching within that range.
Even for stitched images, it’s possible to perform any
measurement by clicking on the image.
Step.1 Step.2
Built-in navigation system*
Use the wide-field image that was stitched
together as a reference when navigating
around a target at higher magnification.
* Will be equipped in the near future
20
A new function captures subtle features that were previously impossible to image
Light guide plate(1000x)
Conventional 8-bit gradationHDR
16-bit
Normal image
Laser, full-focus image Rear face of a wafer(1000x)
C-laser DIC 2D image C-laser DIC 3D image
Printing (400x)
The range of obtainable brightness is narrow, resulting in the glaring of areas beyond the range.
Subtle contrast cannot be rendered because of coarse resolutions.
The range of obtainable brightness is wide, diminishing the perceived glare.
Subtle contrast can be rendered because of detailed gradation.
Difficulties Solutions
Gradations obtained by capturing a single image
Gradations obtained by capturing multiple images Conventional
256x levels
Conventional method HDR function
(256 levels of gray) (65536 levels)8-bit 16-bit
New features of laser scanning microscopes Part.3
NEW 16-bit gradation dramatically enhances image contrast and eliminates glare
High Dynamic Range (HDR) Function
This function optimizes the appearance (texture and contrast) of targets with unclear or low-contrast surfaces.
It enables higher contrast, and an unprecedentedly clear observation that fully captures the details of the target
object.
Differential observation and profile measurement without the need to remove and insert prisms or filters
C-laser DIC display function [Function for observing minute surface features]
This function combines the laser image and height information. This enables effective observation of target objects previously difficult to
observe when using contrast information, such as mirrored samples and samples with little variation in surface texture. It lets you observe
nano-level indentations and projections, which were difficult to observe with conventional laser microscopes.
WORLD’S FIRST
After HDR processing
Low-contrast gradations are shown in detail
21
Capture data from the top, bottom and intermediate layers of a transparent object
Area Film Thickness Measurement function
Analyze multiple layers at all points in the
observation field. You can display 3D
images and cross-section profiles of a
selected single layer or multiple layers, and
measure shapes or film thicknesses of
user-specified locations.
Capture the top surface of a transparent object
Transparent Top Surface Observation function
Transparent Top mode acquires information on the outermost surface of a transparent object, while being
unaffected by light that reflects from other layers within the target.
Conventional model VK-X100/X200
In the case of transparent targets, transmitted light goes through the peak (focal point) on the front face and detects the peak (focal point) on the rear face. The difference in both peak positions can be measured (film thickness).
Received reflected light intensity [Intensity]
Rear face
Transparent film surface
Substrate surface
Transparent film thickness
Transparent film surface
Substrate surface
Front face
Laser lightFront surface film
Rear surface film
Position in the Z axis [Z position]
Film thickness
Ink jet nozzle (1000x)
Resist (1000x)
22
Half mirrorColor CCD camera
Half mirror
Half mirror
Objective lens
Observed target object
X-Y scanning optical system
White light source for illumination
Light receiving element (photomultiplier)
Pinhole
Condensing lens
Short wavelength laser light source
Three types of images built from laser scan
Color + Laser imageFully-focused color image that SEMs and optical microscopes cannot provide.
Laser intensity imageGray-scale, high contrast image similar to what SEMs provide. Shows changes in reflected laser intensity.
Height-Color MapDifferent heights are marked by changes in color.
Color + laser intensity information Laser intensity information Height information
The laser scanning microscope employs two light
sources: a laser source and a white light source. These
two types of light sources enable the acquisition of
laser intensity, color, and height that are required to
construct fully-focused color images, fully-focused
laser images and height information.
[Detects reflected-light intensity and height with a
short-wavelength laser]
The light that is emitted from the laser light source of
the laser scanning microscope is focused on the target
via the XY scanning optical system and the objective
lens. The focused beam spot then performs a surface
scan of the target within the observation field through
the XY scanning optical system. The target within the
observation field is split into 1024 x 768 pixels,
scanned, and then reflected light for each pixel is
detected with the light receiving element. The objective
lens is then driven in the Z-direction and surface
scanning is repeated. This acquires the reflected-light
intensity of every z-axis position for each pixel. After
this, the height information and reflected-light intensity
is detected, with the z-axis position of the highest
reflected-light intensity as the focal point. This makes it
possible to acquire full-focus light intensity images and
height images (information) in which the entire target is
in focus.
[CCD camera obtains color information]
The data collected from the laser is then coupled with
the reflected light from the white light source to
produce an image with height and color information.
This gives a user an image that rivals the resolution of
an SEM, yet also provides real color observation.
Uses two light sources to acquire information
Diagram of the measurement principle
Move the objective lens in the Z-axis direction and scan with the laser again.
Scan with the laser in the X and Y direc-tions.
1
2
3
4
Short wavelength laser light
Me
asu
rem
en
t ra
ng
e
1024 X 768 pixels
Repeat for the entire measurement range.
Measurement complete.
Principle structure
23
Disadvantages of Interferometers
1. Unable to detect steep angles
When using interferometers to measure objects with steep angles, due
to the concentration of interference patters in those areas, accurate
information is unable to be gathered.
3. Slope correction is required
Before measurement, slope correction of the sample with a goniometer
stage is required. Because interference patterns become crowded when
the sample is at an angle, proper measurement cannot be performed.
VK-X100/X200
Because interference patterns are not used, direct
measurement is possible even if the sample is at an angle.
Slope correction can also be applied after image capture.
2. The targets that can be viewed are limited
With light interference, if the surface does not reflect well, measurement
is difficult to perform, so support for a variety of targets is not provided.
Measurement also cannot be performed if there is an extreme difference
between the reflected light from the reference surface and the reflected
light from the measurement surface (Works well with mirrored-surfaces,
but is difficult to measure samples with extreme projections and
depressions and samples without much of a reflective surface).
4. The lateral resolution is the same as an optical microscope
Since interferometers operate on white light, the lateral resolution of these
systems will be the same as a conventional optical microscope -
approximately 0.43 μm 0.02 Mil.
VK-X100/X200
The confocal range finding system, which uses laser
reflection intensity for detection, can measure shapes that
have high angular characteristics with low noise.
VK-X100/X200
Because it uses a photomultiplier element (PMT) with a wide
sensitivity range, targets that include areas of both high and
low reflectivity can be accurately measured.
VK-X100/X200Using short-wave lasers and pinhole optics, a lateral
resolution of 0.13 μm 0.01 Mil can be obtained.
1 Device 4 Benefits
Difference between a pinhole confocal system and conventional systems
Peak detection (focal point) comparison between a pinhole confocal system and conventional system.
Z-I curve of conventional optical system
Light intensity peaks at focal points are spread out in conventional optical systems
Received reflected light intensity [Intensity]
Ambient light from points other than the peak focal point
Z-I curve of the pinhole confocal optical system
Conventional system
Target
Laser light
Lens Lens
MirrorMirror
Lens CCD PMTLens
Target
Laser light
VK-X100/X200 system
Pinhole
Conventional optical systems receive reflected light from areas
outside of the peak focal point. With a confocal system, only
light from the focal point is collected, producing a sharper
image.
Optical film (1000x)
Image from a conventionaloptical microscopeDefocused light and flare cannot be removed.
Confocal image the VK-X100/X200Only displays the area that’s in focus, while eliminating defocused information.
Po
sitio
n in
th
e Z
axis
[Z p
ositio
n]
Focalposition
High accuracy measurement with the pinhole confocal optical system
Conventional pseudo-confocal optical systems that use a CCD
as the light receiving element are limited in their ability to
provide either high-accuracy measurements or high-definition
images. Since these systems do not employ a pinhole
mechanism, unfocused light is able to be collected by the
CCD. However, with a pinhole confocal system, light is only
received when it is at its focal point, creating very sharp
images with high-resolution measurement data.
Indentation/projection measurement
Divide areas above (projections) or below
(indentations) a specified height threshold value
into separate zones, and take measurements for
each area.
Position compensation function Industry’s First
When a standard sample has been registered
and a different image is opened in a template,
the VK-Analyzer automatically adjusts the image
position so that the image opens at the same
position as the registered sample. This function
is effective when measuring large sample
populations.
Sphere/surface angle measurement
Automatically extracts the radii of circular objects
in a specified area. Since the measurements
are calculated automatically, this function
reduces variations in measurements between
users.
INDENTATION MEASUREMENT
PROJECTION MEASUREMENT
AUTOMATIC POSITION COMPENSATION
HEIGHT DIFFERENCE ANALYSIS FUNCTION
SPHERE MEASUREMENT
Tilted Automatically corrected
Automatically counts and measures
circular objects within the microscope field.
Preprocessing such as automatic
separation of adjacent particles, counting,
diameter, etc can be performed.
Particle analysis module VK-H1XG
Metal surface (1000x)
Bump (2000x)
Surface of metal component after processing (3000x) Wire bonding (1000x) Microlens (1000x)
Analyzes the difference between two images as a solid 3D image. Enables surface-based image analysis that can capture minute changes.
2D & 3D Measurement ToolsAnalysis Expansion Module VK-H1XP Optional
SOFTWARE OPTIONS
Optional
24
A highly-rigid, adjustable-height stand attaches to the back of the
VK microscope, allowing the measuring head to be adjusted to any
height. Inserting a spacer between the measuring head and the
base improves the stability and enables high accuracy
measurement.
A large selection of lenses are available, including high N.A., APO,
long focal distance, and low magnification lenses.
The motorized stage is essential to automatic image assembly and
programmable operation. Easy-to-mount design.
Non-destructive examination and analysis of any point on large-
sized targets by mounting the head on a 3rd-party stage.
An entire 300 mm 11.81" wafer can be examined and analyzed.
Easy-to-mount design.
VK LASER SCANNING MICROSCOPE OPTIONS
Adjustable-height stand for the VK SeriesThe unique structure of the VK-X allows for the measuring head to be separated from the base, making targets that were previously too tall to measure easily possible. (Max 128 mm 5.04") (OP-82693)
Objective lensesWide magnification range
Motorized stageAutomatic image assembly (VK-S100K/VK-S105/VK-S110)
Separate measuring headNon-destructive examination of large-sized targets
300 mm 11.81" wafer stageSupport larger wafer sizes (OP-51498)
* Optional 100 mm x 100 mm 3.94" x 3.94" motorized stage also available.
25
Stand for the VK Series
128 mm5.04"
Turning the knob adjusts the height as desired.
The spacer improves the stability.
9.84"
14.9"
6.52"
0.81"
7.48"
6.61"
1.57"
0.51"
4.25"
10.65"
155 6.10"
3.05"3.93"4.25"
0.52"
16.4"
6.26"0.29"
12.50.49"
1.38"
5.12"
70.2 2.76"
160 6.30"
4.69"
6.46"
40515.94"
285 11.22"
9.84"
14.43"
63.5 2.50"
22 0.87"
416.416.39"
10.63"3.80"
13.30.52"171.3
6.74"
2.06"
159 6.26"
5.91"
0.28"
3.74"
2 x M6 Heli-Coil 1.5D
23.5 0.93"2.62"
1907.48"
3.80"
1827.17"
803.15"
(40) (1.57")
20.5 0.81"
803.15"
63.5 2.50"
2 x ø6.6 through hole
4.41"4 x M6Depth 10
56.5 2.22"
(Depth 8 0.31")
4.69"
60.24"
40515.94"
5.91"
0.24"
0.39"
ø0.26"
100 77.5108
159
53.2
13.3
415.4
7.3
249.9
378.5270.5
165.520.5
35130
108
165.5
95
249.9
366.5
96.5
145 5.71"
166.5 6.56"66.5 112
155 6.10"
96.5 270
52.2397.1 15.63"
295.4 11.63"150
7
13
168
190
(40)
150
119.2
164357 14.06" 6
119.2160 6.30"
164357 14.06"
295.4 11.63"398.4 15.33"
22 0.87"
270.5 10.65"
171.36.74"
2.09"
4 x M6 Depth 10 0.39"
0.28" 7
1726.07"
2 x M6 Heli-Coil, 1.5D
(Depth 8 0.31")0.81" 20.5
6.52"
77.5 3.05"
803.15"
2 x ø6.6 through holeø0.26"
285 11.22"
6.46"
70.28"
18317.20"
60.24"
26
Unit: mm inch
DIMENSIONS
Measurement unit
VK-X210
Measurement unit
VK-X105/110
Measuring head
Measuring head
Controller
VK-X200K
Controller
VK-X100K
SYSTEM CONFIGURATION
27
SPECIFICATIONS
ModelMicroscope VK-X210 VK-X110 VK-X105
Controller VK-X200K VK-X100K VK-X100K
Magnification on a 15” monitor 200x 400x 1000x 3000x 200x 400x 1000x 2000x 100x 200x 400x 1000x
Objective lens magnification 10× 20× 50× 150× 10× 20× 50× 100× 5x 10x 20x 50x
Observation/measuring range 1.
Horizontal (H): μm Mil1350 53.15
675 26.57
270 10.63
90 3.54
1350 53.15
675 26.57
270 10.63
135 5.31
2700106.30
135053.15
67526.57
27010.63
Vertical (V): μm Mil1012 39.84
506 19.92
202 7.95
67 2.64
1012 39.84
506 19.92
202 7.95
101 3.98
202579.72
101239.84
50619.92
2027.95
Working distance: mm inch16.5 0.65"
3.1 0.12"
0.35 0.01"
0.2 0.008"
16.5 0.65"
3.1 0.12"
0.54 0.02"
0.3 0.01"
22.50.89"
16.50.65"
3.10.12"
0.540.02"
Numerical Aperture (N.A.) 0.3 0.46 0.95 0.95 0.3 0.46 0.8 0.95 0.13 0.3 0.46 0.8
Optical zoom 1x to 8x
Total magnification 200x to 24000x 200x to 16000x 100x to 8000x
Optical system for observation/measurement Pinhole confocal optical system
Height measurement
Measuring range 7 mm 0.28" 7 mm 0.28" 7 mm 0.28"
Display resolution 0.0005 μm 0.00002 Mil 0.005 μm 0.0002 Mil 0.005 μm 0.0002 Mil
Repeatability σ 0.012 μm 0.0005 Mil 2. 0.02 μm 0.0008 Mil 2. 0.02 μm 0.0008 Mil 2.
Width measurementDisplay resolution 0.001 μm 0.00004 Mil 0.01 μm 0.0004 Mil 0.01 μm 0.0004 Mil
Repeatability 3σ 0.02 μm 0.0008 Mil 3. 0.03 μm 0.001 Mil 4. 0.05 μm 0.002 Mil 5.
Frame memory
Pixel count 2048 x 1536, 1024 x 768, 1024 x 64
For monochrome image 16-bit
For color image 8-bit for RGB each
For height measurement 24-bit 21-bit 21-bit
Frame rate*8Surface scan 4 Hz to 120 Hz
Line scan 7900 Hz
Auto function AAG (Auto gain), Auto focus, Auto upper/lower limit setting, Double Scan brightness settings
Laser beam light source for measurement
Wavelength Violet laser, 408 nm Red semiconductor laser, 658 nm
Output 0.95 mW
Laser Class Class 2 Laser Product (IEC 60825-1, FDA (CDRH) Part1040.10 6.)
Laser light-receiving element PMT (Photoelectron Multiplier Tube)
Light source for optical observation
Lamp 100 W halogen lamp
Color camera for optical observation
Imaging element 1/3" Color CCD image sensor
Recording resolution Super high resolution (3072×2304)
Auto adjustment Gain, Shutter speed
Data processing unit Dedicated PC, supplied by KEYENCE with the VK-X (OS: Windows 7 Professional Edition) 7.
Power supplyPower-supply voltage 100 to 240 VAC, 50/60 Hz
Current consumption 450 VA max.
WeightMicroscope
Approx. 26 kg (Measuring head detached: approx. 10 kg)
Approx. 25 kg (Measuring head detached: approx. 8.5 kg)
Approx. 25 kg (Measuring head detached: approx. 8.5 kg)
Controller Approx. 11 kg
1. The observation/measuring range is the minimum visual field range.
2. When a standard height difference of 2 μm 0.08 Mil is measured with the 50x objective lens.
3. When the KEYENCE reference chart line width of 1 μm 0.04 Mil is measured with the 150x objective lens in line peak mode (image averaging: 8 times).
4. When the KEYENCE reference chart line width of 1 μm 0.04 Mil is measured with the 100x objective lens in line peak mode (image averaging: 8 times).
5. When the KEYENCE reference chart line width of 1 μm 0.04 Mil is measured with the 50x objective lens (optical zoom 2x) in line peak mode (image averaging: 8 times).
6. The laser classification for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice No.50.
7. Windows 7 is a registered trademark of Microsoft, U.S.A.
8. At top speed when using a combination of measurement mode/measurement quality/lens magnification. When line scan has a measurement pitch that is within 0.1 μm.
• Viewer software
VK-H1XVE
• Analysis software
VK-H1XAE
• Analysis expansion module
VK-H1XP (Optional)
• Image stitching software
VK-H1XJ (Optional)
• Particle analysis module
VK-H1XG (Optional)
• Motorized XY stage for image stitching VK-S105/S100K (50 mm 1.97")VK-S110/S100K (100 mm 3.94")
• Stage for 300 mm 11.81" wafer OP-51498 (Optional)
• VK Series stand OP-82693 (Optional)
* Please contact KEYENCE for large-sized sample stage.
VK-X200K
VK-X100K
VK-X110VK-X105
VK-X210
Measuring unit Controller
Control PC Monitor (Optional)