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LCFI Collaboration Status Report

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LCWS 2004 Paris Joel Goldstein for the LCFI Collaboration Bristol, Lancaster, Liverpool, Oxford, RAL. LCFI Collaboration Status Report. R&D for a vertex detector at NLC or TESLA Physics Studies (See Sonja Hillert’s talk in Simulation session) Mechanical Development Ultra low-mass ladders - PowerPoint PPT Presentation
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LCFI Collaboration Status Report LCWS 2004 Paris Joel Goldstein for the LCFI Collaboration Bristol, Lancaster, Liverpool, Oxford, RAL
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Page 1: LCFI Collaboration Status Report

LCFI CollaborationStatus Report

LCWS 2004

Paris

Joel Goldstein

for the LCFI Collaboration

Bristol, Lancaster, Liverpool, Oxford, RAL

Page 2: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 2

LCFI Research Programme

R&D for a vertex detector at NLC or TESLA

1. Physics Studies(See Sonja Hillert’s talk in Simulation session)

2. Mechanical Development• Ultra low-mass ladders

• FEA/physical models

3. Detector Development• Fast CCD technology (50 MHz for TESLA)

• Custom CMOS readout chips

Page 3: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 3

LC Vertex Detector

• 800 Mchannels of 2020 m pixels in 5 layers

• Optimisation:– Inner radius (1.5 cm?)

– Readout time (50 s?)

– Ladder thickness (0.1% X0?)

Page 4: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 4

Mechanical Options

Target of 0.1% X0 per layer

(100m silicon equivalent)

1. Unsupported Silicon– Longitudinal tensioning provides stiffness– No lateral stability– Not believed to be promising

2. Semi-supported Ultra-thin Silicon– Detector thinned to epitaxial layer (20m)– Silicon glued to low mass substrate for lateral stability– Beryllium has best specific stiffness– Composites, ceramics, foams...

3. Novel Structures

Page 5: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 5

Mechanical Studies of Be-Si

FEA Simulations Physical Prototyping• Laser survey system

Thinned CCD ( 20 μm)

Beryllium substrate (250 μm)

Adhesive

0.2mm

~160 μm ripples at -60°C

• Good qualitative agreement

Page 6: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 6

New Approaches

• Be-Si unstable when cooled due to CTE mismatch

• Choose substrate with closer CTE match– 100 μm carbon fibre – ceramic foam

• Micromechanical techniques....

Microstages

replace glue pillars

Sandwich

UV lithography on dummy

Page 7: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 7

Column Parallel CCD

N+1

Column Parallel CCDReadout time = (N+1)/Fout

• Separate amplifier and readout for each column

Page 8: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 8

Prototype CP CCD

CPC1 produced by E2V

• Two phase operation

• Metal strapping for clock

• 2 different gate shapes

• 3 different types of output

• 2 different implant levels

Clock with highest frequency at lowest voltage

Page 9: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 9

CPC1 Results

• Noise ~ 100 electrons (60 after filter)

• Minimum clock ~1.9 V

• Maximum frequency > 25 MHz– inherent clock asymmetry

Page 10: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 10

CP Readout ASIC

CPR1 designed by RAL ME Group

• IBM 0.25 μm process

• 250 parallel channels with 20μm pitch

• Designed for 50 MHz

• Data multiplexed out through 2 pads

Page 11: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 11

CPR1 Testing

• Flash ADCs tested

• Voltage and charge amplifiers tested

• Voltage gain ~40

• Very sensitive to timing and bias values

• Outstanding digital problems

• Charge amplifiers not fully understood

Voltage injection into ADC

Page 12: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 12

Wirebonded Assembly

• Total noise ~130 electrons

• Noise from preamps negligible

Bump bonding underway at VTT

Page 13: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 13

Future Detector Work

• Test Programme– Bump bonded assemblies expected early May– Radiation effects on fast CCDs– High frequency clocking

• Next Generation CCDs and ASIC– Detector scale CCDs– Cluster finding logic– Design underway; production later in year

• In-situ Storage Devices– Resistant to RF interference– Reduced clocking requirements(See Chris Damerell’s talk on Thursday)

Page 14: LCFI Collaboration Status Report

Joel Goldstein, RAL LCWS 20/4/04 14

Summary

• Excellent progress over past two years– Mechanical options studied in detail

– CCD+ASIC operation achieved

– New ideas being discussed

• CP CCDs are viable technology for linear collider

• Next generation will be full-scale prototype CCDs

Accelerator technology choice will determine path


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