Saturn Electronics CorporationCompany Presentation

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Sales History

Domestic Manufacturing

Company Profile

• Established 1985

• Majority Owners / Full-Time Operators

• 89,000 ft² Facility (15,000 ft² warehouse)

• 145 Employees

• 2 Shifts operating at 65% capacity

Growth & Financial Strength

• Debt-Free and Financially Strong

• Controlling interest in 3 add. PCB facilities

• Profits allocated for:• Expansion• Improved Capabilities• Reduced Cost

Since 2006, we have replaced every major piece of equipment in every major process.

DRILLING16 Mark VI drills replaced with 2 Excellon System 2000’s, 8 Century 2001’s, and 4 Mania Micronics

IMAGING (Primary & LPI) 4 new Olec AT-30’s purchased. All have 4-camera automatic alignment systems and hybrid collimated light sources

WET PROCESSDES, SES, Shadow, and Oxide lines replaced with Hollmuller lines that incorporate latest spray technologyDeburr and pre-LPI scrub replaced with Ishii Hyoki equipment

LPIDP dual sided screeners replaced with 2 Argus Spray Coating lines

Facilities Upgrade

Planned Facilities Upgrade

As of July 2009, we have the following planned improvements

MULTILAYER LAMINATION5,000 SF building expansion to house 3 10-opening Burkle PC-controlled lamination system (one of the best in N.A.)

ENIG & DESMEARAutomated lines to replace manual dip lines

COPPER VIA FILL LINEChemistry and line to plate blind vias shut with plated Cu

Multilayer PCB Products

•Fine Line and Spacing•Controlled Impedance Designs•Heavy Copper PCBs•PTFE / Hybrid Technologies•RF-Microwave Boards•Thermal Management PCBs•Aluminum / Metal Core PCBs•PCB Heatsink Registration•Via-in-Pad Technology•Open Face / Internal Cavity Boards•Blind / Buried Vias

Examples of Current Technology Applications

Production Capabilities

Layer Count 1 - 24 +

Largest Panel Size: 18” x 24

Smallest Circuit Width/Spacing: .004 mils, 3 mils proto

Material Thickness: 0.003” – 0.200”

Materials: FR-4; FR-5; Teflon; Polyimide; Metal Heat Sinks

Smallest Mech. Drilled Hole .006”

Hole Size and Dimensional Tolerances: + / - .003” and + / -.002”

Finishes: HASL, Immersion Silver/Gold, Deep Gold

Lead Free Finishes: Pb-Free HASL; SN100CL

Electrical Testing Flying Probe and Bed of Nails

Fabrication Routing, Blanking and Scoring

Plasma Processing unit Teflon Activation, Etch Back, Desmear

Laser Drilling Routing and Trimming

Quick-Turn Prototypes

Layers Turnaround

24 Hrs 2 Days 3 Days 4 Days

2 Layer 75 300 1,500 2,250

4 Layer 35 75 300 1,500

6 Layer - 75 150 600

8+ Layer - 75 150 300

Fast Turn Production

Layers Turnaround

5 Days 10 Days 15 Days

2 Layer 3,000 15,000 30,000

4 Layer 2,250 6,000 15,000

6 Layer 1,500 3,000 15,000

8 Layer 1,200 3,000 15,000

Circuit Board Capacity

Number of Panels 18” x 24” Panels

Quality

Six Dedicated Manufacturing Engineers

ISO 9002 Certified in 1995

QS 9000 Certified in 1998

Delphi C7000 (High Reliability) Certified in 1999

TS 16949 & ISO 9000:2000 Certified in 2003 (1st PCB Manufacturer in North America)

ISO 14001 Certified in 2005

AS9100 Certified in 2007

ITAR Registered in 2009

Plotech

ISO9001

ISO14001

E169497

TS16949

Digital PCB

UL

ISO9002

QS9001

ISO14001

Offshore Sourcing

Asian Partners

High Quality and On Time DeliveryPre-engineering performed at Saturn for manufacturability and panelization

Saturn performs First Article inspection on all new lots

Saturn will inventory up to 4 weeks domestically

Saturn’s China-based personnel supervise all orders at the manufacturing level

Saturn’s production-certified facility can fulfill ramp schedules while offshore facilities fill supply pipeline for ongoing production requirements

Saturn Offshore Advantage

Quick Delivery

Low Cost

Accurate Communication

High Quality

We hope you will consider Saturn Electronics Corporation as your Quick-Turn Prototype and Small to High-Volume Production Manufacturer

Thank You

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