CONFIDENTIAL

LED product trends in general lighting –

Is CSP the only solution?

Ralph Bertram | April 13, 2016 | LEDTaiwan 2016

Light is OSRAM

www.osram.com

7 focus applications were selected for GRP survey RETROFIT LEDFIT

LED component market

Interface with existing sockets

Residential Office Shop Hospitality

Outdoor Industrial Archit’ment

Shop Office Outdoor Residential

Hospitality Industrial Farming Archit’ment

luminaires / modules

with built-in LEDs

General lighting applications

Retrofit A Lamp (bulb)

Retrofit MR 16

Retrofit Linear (T8)

LEDFIT Downlight

LEDFIT Spotlight

LEDFIT Outdoor

LEDFIT Panel light

Outdoor Consumer

LEDFIT HighBay

Agriculture/ Horticulture

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

2

Categorizing Applications

HP

5 W

MP

Durability

Power class

lm/$

Lm/$ focused

Durability focused

1 W

Ultra High Power LP

• SSL applications

have different

requirements in LED

power class

• In the tradeoff

between cost and

package durability,

applications have

different focus

Durability vs cost vs power class

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

3

OSRAM Opto Semiconductors

General lighting Product Portfolio

• According to

durability, products

are grouped into

E, S, and P series

• High-durability

products can be

driven at higher

temperatures and

better withstand

environmental

conditions

• P series is realized

with UX:3 chips,

while E and S

series contains

“Sapphire” chips

HP

DURIS

E3

DURIS S5

1chip

DURIS E5

DURIS S2

DURIS P5

DURIS

S10

OSLON

Square

5 W

SOLERIQ

S13

SOLERIQ

S19 DURIS S8

DURIS

P10

DURIS S5 SOLERIQ

S9

DURIS

P8

DURIS

E2

OSLON

SSL

MP

Power class

Filament

1 W

Ultra High Power LP

E

S

P

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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Where is the space for CSP?

All applications filled!

CSP for low/mid power applications?

Low/Mid power applications

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

5

LED Lamps Office troffers

Cost Efficacy

Cost reduction in Low/Mid power packages

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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5630

2010

3030

2835

3014

2016

2012 2014 2015 2016

CSP?

High-efficacy package

Higher-durability package

What are Chip-Sized Packages?

Definition:

IPC standard J-STD-012, Implementation of Flip Chip and Chip Scale

Technology:

Chip Sized Package:

package size < chip size x 1.2, single die SMD package

(however, factor of 1.5-1.8 is also accepted as CSP LED)

• Most have in common: Flip Chips no bond wires, slight efficacy benefit

• Main benefit should be cost:

- material reduction

- parallel processing (Moulding or sheet lamination instead of die placement,

wirebond, casting,…)

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

7

Package cost structure

Typical cost structure of a QFN low/mid power package

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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Where’s the catch?

PPA, PCT, EMC mould compound

Leadframe (Ag-plated Cu)

Silicone

Bond wire

Zener ?

Testing

Die attach

Wire bond

Casting

Cutting

Chip glue

Chip

Phosphor

Process

Materials

A note on chip cost

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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LED chip types Cost Efficacy

Volume emitter

“Sapphire” Chip horizontal reference o

Surface emitter

“High Power Chip” vertical higher o/- Opaque Substrate

Transparent Substrate

Surface emitter

“High Power Flip

Chip”

vertical higher o/-

Transparent Substrate

“Sapphire Flip Chip” vertical highest o

Flip Chips need to be vertical chips

Flip Chip cost is similar to High Power Chips

Package cost structure

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

10

Chip

Phosphor

Process

Materials

Chip

Phosphor

Process

Not much cost reduction

possible

Difficulties in mounting

and 2nd board issues

rule out Flip-Chip CSPs

for low and mid power

unless highest efficacy

is needed and paid for

Product cost when moving from standard Sapphire chip to Flip Chip

Alternatives

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

11

Chip

Phosphor

Process

Materials

• Standard Chip with bond

wire in minimized

package

• Efficacy gain by light

extraction through

sidewalls

• 2016 package can be

handled by standard

SMD machines

Quasi CSP – Duris® S2

Chip

Phosphor

Process Materials

CSP for High-Power Applications?

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

12

High Power LED Applications

Robustness

Efficacy

Color quality

Efficacy

Downlight/Spotlight Street / Tunnel

Optical performance

Efficacy

Package cost structure

Typical cost structure of a High Power LED

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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Ceramics

Silicone

Bond wire

Zener

Testing

Die attach

Wire bond

Lens mold

Cutting

Chip

Phosphor

Process

Materials

20-30% cost

reduction potential

Comparison of High-Power CSP concepts

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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High Power Concepts Out-

coupling Cost Efficacy

Ceramics LED Lens reference o

Sapphire

Flip Chip SSC

Wicop Sides lower o/+

Sapphire FC in

reflector frame Nichia E-

LED

Package

surface lower o/-

Surface emitter

Flip Chip

Not

available

yet

Chip

surface lowest -

• No efficacy benefit due to lack of lens or non-useable side-emission

• No experience yet in mounting and reliability

• Does cost benefit justify a new ecosystem?

Again: Consider alternatives: DURIS® P8 and P10

Outcoupling Lens

Phosphor

TiO2 layer

4 x 2mm² UX:3 dies

& ESD & wires

QFN Leadframe

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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Leadframe-based High Power LEDs

Leadframe-based LEDs can fulfill highest robustness requirements

• More than 10000 hrs of test data on

OSLON® black flat indicate L80 > 100khrs

• Duris® P series excels in harshest

corrosion tests

• Light distribution compatible to market

standards existing ecosystem

April 13, 2016

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OSLON ® black flat

LED Taiwan 2016 | Ralph Bertram

Duris® P8

Duris® P10

So, no major benefit for CSPs?

CSPs have their application benefits in

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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Mobile flash

Stagelight

Color-change clusters, artificial CoB

TV backlight

Summary

Chip Sized Packages are hyped right now –

Need to put them into perspective

• No benefits for CSPs in low/mid power range – better alternatives available

• Some cost benefit in high power, however innovation in classical packages

ongoing – CSPs are not a clear winner.

Don’t overrate CSPs – Alternatives with “traditional” technology might

succeed.

LED Taiwan 2016 | Ralph Bertram

April 13, 2016

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www.osram-os.com

CONFIDENTIAL

Thank you.