14
IEEE 802.3 GEPOF Study Group - May 2014 Interim POF Knowledge Development Rubén Pérez-Aranda [email protected] Link budget requirements for Gigabit Ethernet over Plastic Optical Fiber
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Rubén Pé[email protected]
Link budget requirements for Gigabit Ethernet over Plastic Optical Fiber
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Supporters• Frank Aldinger (Mitsubishi International)
• Yutaka Tanida (Mitsubishi Corporation)
• Y.Tsukamoto (Mitsubishi Rayon)
• Eric Chan (Boeing)
• Philippe Bolle (Skylaneoptics)
• 曹�文 / Mike Cao (Dongguan ipt Industrial Co,.LTD.)
• John Lambkin (Firecomms)
• Hugh Hennessy (Firecomms)
• Josef Faller (Homefibre)
• Manabu Kagami (Toyota R&D Labs)
• Bas Huiszoon (Genexis)
• Oscar Rechou (Casacom)
• Naoshi Serizawa (Yazaki)
• Thomas Lichtenegger (Avago Tech)
2
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Agenda• Objectives
• Assumptions for link budget
• Automotive requirements
• Consumer requirements
• Conclusions
3
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Disclaimer• This presentation does not provide a complete list of requirements for a
Gigabit Ethernet POF PHY, but only the necessary to address the link budget analysis
4
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Objectives• To make a proposal of the receiver sensitivity requirements under worst-case
conditions of the optical link budget for Gigabit Ethernet over POF for two technology applications:• Automotive market• Consumer market
• Worst-case receiver sensitivity requirements are going to be the base for technical feasibility study based on Shannon’s channel capacity
5
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Assumptions for link budget• For automotive application
• Same light source (i.e. red LED) qualified for automotive MOST150 application is used• Same Plastic Optical Fiber (POF) used in MOST150 applications is used• Both previous assumptions allow to make the link budget analysis based on 15 years of
experience in millions of real installations• Similar requirements to RTPGE are assumed in terms of link segment length and
number of inline connectors, because these requirements were agreed by OEMs• Worst-case conditions of temperature and aging of optical components in the car will be
considered
• For consumer applications• It is developed based on the requirements for automotive applications, but operational
conditions and aging specifications are relaxed accordingly• Same light source is used in a shorter temperature range• Same fiber is used in terms of core and cladding, as typically happens, although jacket
is cheaper
6
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Automotive requirements
7
Requirement Value Additional/Comments
Max. link segment length 15 m for passenger vehicles with inline connectors
40 m for commercial vehicles without inline connectors
Max. number of inline connections 4 inline connectors
Bit Error Rate (BER) at GMII RX < 10-12
Ambient temperature range of operation -40 .. +95ºC
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Automotive link budget: 15 meters + 4 inliners
8
min -7,8 dBmmin -9,8 dBm
min -20,8 dBmmin -18,8 dBm
max 3,0 dBo(15m SI-POFtemp, aging)
SP2 SP3
max 2 dBo
max 2 dBo
• Red LED: AOP max. 1,5 dBm, min -7,8 dBm in temperature range, aging and optical alignment tolerances. ER min. 8 dB, max 12 dB
• Fiber attenuation: max. 0,2 dBo/meter considering aging under EMD launching condition ➤ 3 dBo for 15 m
• Inliner attenuation: max. 1,5 dBo / inliner in temperature and aging ➤ max. 6 dBo for 4 inliners
• RX sensitivity requirement for max. temperature and aging: -20,8 dBm
max 1,5 dBo / inliner(temp, aging)micro
pig-tailmicro
pig-tail
E/O TX inclear moldpackage
O/E RX inclear mold package
OpticalConnector
POF & Inline Connectors OpticalConnector
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3) Mold com
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6)
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(2.54)
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IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Automotive link budget: 40 meters
9
min -7,8 dBmmin -9,8 dBm
min -19,8 dBmmin -17,8 dBm
max 8,0 dBo(40m SI-POFtemp, aging)
SP2 SP3
max 2 dBo
max 2 dBo
• Red LED: AOP max. 1,5 dBm, min -7,8 dBm in temperature range, aging and optical alignment tolerances. ER min. 8 dB, max 12 dB
• Fiber attenuation: max. 0,2 dBo/meter considering aging under EMD launching condition ➤ 8 dBo for 40 m
• RX sensitivity requirement for max. temperature: -19,8 dBm
micro pig-tail
micro pig-tail
E/O TX inclear moldpackage
O/E RX inclear mold package
OpticalConnector
POF segment OpticalConnector
ISO
B-B
B
B
DOCUM
ENT NUMBER
SIZE
SC
ALE
SH
EE
T
QFB
R-1129M
LZ-01
PART NUMBER
QFB
R-1129M
LZ
Product O
utline
1
A3
5:1
DRAWN BY
DATE (YYYY-MM
-DD)
F. Weberpals
2013-11-14
- DIM
EN
SIO
NS
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E IN
MILLIM
ETE
RS
- FIRS
T AN
GLE
PR
OJE
CTIO
N
- GE
NE
RA
L TOLE
RA
NC
ES
LINE
AR
: ±0.1mm
/ AN
GU
LAR
: ±5°U
NLE
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WIS
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ISO
1of
TITLE
MLC
-Gbit E
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Custom
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8
7
6
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D
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2013-11-15S
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TH
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G.
ASSOCIATED 3D MODEL IS GEOMETRY MASTER
NO
TES
(unless otherwise specified):
1) All not dim
ensioned radii = max. 0.1m
m
2) Area for m
old cavity number (X
X), m
ax. 0.2mm
deep, numbers not raised
3) Mold com
pound overstand in this area allowed
4) Device M
arking on backside (for more inform
ation see datasheet)
5) Recom
mended Footprint (Top V
iew)
CH
AN
GE
MA
RK
ER
WITH
RE
VIS
ION
A
4.80.2
2)
0.3
max. 6)
2.15
130.2
6.50.2
0.65 (5x)
R0.5
(5x)
(0.3) 3)
1.15
0.15
0.25-0.010.02
+
0.5
0.05 (5x)
▲ Frontside
1.74
0.15
1.27 (4x)
5.08
0.15
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2.54
0.15
5.9
3.20.6
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4.1(
)4.310.05
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3.250.05
(100°)
(100°)
(0.75)
(2.54)
(2.54)
(1.27)
ISO
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A
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1
2
2
3
3
4
4
5
5
6
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SHEET
PART N
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BY
DATE (YYYY-M
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1 of
TITLE
MATER
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DR
AWN
BY
DATE (YYYY-M
M-D
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H. M
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2013-09-16
F. Weberpals2013-09-12
---
QFBR
-2129MLZ
QFBR
-2129MLZ-01
5:1
MLC
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Product Outline
Custom
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1
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REV
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F. Weberpals
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1.15
0.15
3.2
0.6
0.05
4.80.2
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0.15
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5.9
6.50.2
130.2
4.1(
)
3.250.05
Ø
100°
100°4.31
0.05
Ø
0.15(
x45°)
0.25-0.01
0.02
+
NO
TES (unless otherwise specified):
1) All not dimensioned radii = m
ax. 0.1mm
2) Area for mold cavity num
ber (XX), max. 0.2m
m deep, num
bers not raised
3) Mold com
pound overstand in this area allowed
4) Device M
arking on backside (for more inform
ation see datasheet)
5) Recom
mended Footprint (Top View
)
0.65 (5x)
4) R0.5 (5x)
▲ Frontside
0.5
0.05 (5x)1.27 (4x)
5.08
0.15
0.3max.
6)
2.15
1.74
(2.54)
(1.27)
(2.54)
(0.75)
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Automotive link budget: extension up to 105ºC• Optical components for automotive have been qualified up to +95ºC until now
because MOST150 was defined for infotainment, and previous link budget analysis has been provided for this temperature range
• Here is presented a preliminary extension to +105ºC.• A priori there is no technical reasons limiting the feasibility at 105ºC• Optical component manufacturers have to confirm the feasibility
• Launched optical power of MOST150 devices is reduced down to min. -8.5 dBm for 105ºC
• RX sensitivity requirements has to be modified accordingly:• 15 m segment + 4 inliners ➤ -21.5 dBm• 40 m segment w/o inliners ➤ -20.5 dBm
• Open topics for task force:• LED reliability; life time under automotive temperature profile up to 105ºC• High temperature POF for 105ºC: aging characterization, AC response, max. attenuation,
jacket, … • Aging characterization of inliner connectors, to establish max. attenuation.
10
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Consumer requirements
11
Requirement Value Additional/Comments
Max. link segment length 50 meters
Max. number of inline connections 1 inliner
Bit Error Rate (BER) at GMII RX < 10-10
Ambient temperature range of operation 0 .. +85 ºC
To allow integration into a wall plug or similar device with restricted air flow and no heat sink
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Consumer link budget: 50 meters
12
min -6,7 dBm min -18,7 dBm
max 9,5 dBo(50 m SI-POFtemp, aging)
SP2 SP3
• Red LED: AOP max. -1 dBm, min -6,7 dBm in temperature range, aging and optical alignment tolerances. ER min. 8 dB, max 12 dB
• Fiber attenuation: max. 0,19 dBo/meter considering aging under EMD launching condition ➤ 9,5 dBo for 50 m
• Inliner attenuation: max. 2,5 dBo / low cost inliner in temperature and aging
• RX sensitivity requirement for max. temperature: -18,7 dBm
E/O TX inclear moldpackage
O/E RX inclear mold package
OpticalConnector
POF segment OpticalConnector
ISO
B-B
B
B
DOCUM
ENT NUMBER
SIZE
SC
ALE
SH
EE
T
QFB
R-1129M
LZ-01
PART NUMBER
QFB
R-1129M
LZ
Product O
utline
1
A3
5:1
DRAWN BY
DATE (YYYY-MM
-DD)
F. Weberpals
2013-11-14
- DIM
EN
SIO
NS
AR
E IN
MILLIM
ETE
RS
- FIRS
T AN
GLE
PR
OJE
CTIO
N
- GE
NE
RA
L TOLE
RA
NC
ES
LINE
AR
: ±0.1mm
/ AN
GU
LAR
: ±5°U
NLE
SS
OTH
ER
WIS
E S
PE
CIFIE
D
ISO
1of
TITLE
MLC
-Gbit E
thernet Tx
Custom
er
A
B
C
D
E
F
8
7
6
5
4
3
2
1
1
2
3
4
A
B
C
D
E
F
5
6
7
8
DO
CU
ME
NT N
UM
BE
R
DA
TE
xxxx-xx-xx
-
-
QFB
R-1129M
LZ-01
2013-11-15S
TOR
E D
ATE
DW
N
CH
K
A
F. Weberpals
FILE N
AM
E
New
Draw
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CH
AN
GE
AR
EV
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. ON
LY
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FO
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OR
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CH
NO
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S.
AVAGO TECHNOLOGIES CONFIDENTIALD
O N
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TH
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ME
TR
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TH
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DA
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TH
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ASSOCIATED 3D MODEL IS GEOMETRY MASTER
NO
TES
(unless otherwise specified):
1) All not dim
ensioned radii = max. 0.1m
m
2) Area for m
old cavity number (X
X), m
ax. 0.2mm
deep, numbers not raised
3) Mold com
pound overstand in this area allowed
4) Device M
arking on backside (for more inform
ation see datasheet)
5) Recom
mended Footprint (Top V
iew)
CH
AN
GE
MA
RK
ER
WITH
RE
VIS
ION
A
4.80.2
2)
0.3
max. 6)
2.15
130.2
6.50.2
0.65 (5x)
R0.5
(5x)
(0.3) 3)
1.15
0.15
0.25-0.010.02
+
0.5
0.05 (5x)
▲ Frontside
1.74
0.15
1.27 (4x)
5.08
0.15
4)
2.54
0.15
5.9
3.20.6
0.05
4.1(
)4.310.05
0.15(
x45°)
3.250.05
(100°)
(100°)
(0.75)
(2.54)
(2.54)
(1.27)
ISO
A-A
A
A
1
1
2
2
3
3
4
4
5
5
6
6
A
A
B
B
C
C
D
D
DO
CU
MEN
T NU
MBER
SIZE
SCALE
SHEET
PART N
UM
BER
A3
CH
ECKED
BY
DATE (YYYY-M
M-D
D)
- DIM
ENSIO
NS ARE IN
MILLIM
ETERS
- FIRST AN
GLE PRO
JECTIO
N
- GEN
ERAL TO
LERAN
CES
LINEAR
: ± / ANG
ULAR
: ±
UN
LESS OTH
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ISE SPECIFIED
ISO
1 of
TITLE
MATER
IAL
DR
AWN
BY
DATE (YYYY-M
M-D
D)
H. M
uhr
2013-09-16
F. Weberpals2013-09-12
---
QFBR
-2129MLZ
QFBR
-2129MLZ-01
5:1
MLC
-Gigabit Ethernet R
x
Product Outline
Custom
er
1
DRAWING FRAM
E_20130822
5°
0.1
TH
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.
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DO
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T M
OD
IFY
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TR
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TH
IS 2D
DR
AW
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. GE
OM
ETR
Y M
OD
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MU
ST
BE
MA
DE
TO
TH
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AS
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R 3D
MO
DE
L AN
D
US
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TE
TH
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WIN
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ASSOCIATED 3D MODEL IS GEOMETRY MASTER
A
CH
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E MAR
KER W
ITH R
EVISION
FILE NAM
E
REV
STOR
E DATE
DOCU
MEN
T NU
MBER
QFBR
-2129MLZ-01_A.idw
A
YYYY-MM
-DD
QFBR
-2129MLZ-01
REV
CH
ANG
E
DATE
DWN
CH
K
A
2013-09-18
New Draw
ing
H. M
uhr
F. Weberpals
2)
1.15
0.15
3.2
0.6
0.05
4.80.2
2.54
0.15
0.3 () 3)
5.9
6.50.2
130.2
4.1(
)
3.250.05
Ø
100°
100°4.31
0.05
Ø
0.15(
x45°)
0.25-0.01
0.02
+
NO
TES (unless otherwise specified):
1) All not dimensioned radii = m
ax. 0.1mm
2) Area for mold cavity num
ber (XX), max. 0.2m
m deep, num
bers not raised
3) Mold com
pound overstand in this area allowed
4) Device M
arking on backside (for more inform
ation see datasheet)
5) Recom
mended Footprint (Top View
)
0.65 (5x)
4) R0.5 (5x)
▲ Frontside
0.5
0.05 (5x)1.27 (4x)
5.08
0.15
0.3max.
6)
2.15
1.74
(2.54)
(1.27)
(2.54)
(0.75)
max 2,5 dBo / inliner(temp, aging)
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Conclusions• A baseline of requirements for Automotive and Consumer applications of
GEPOF have been provided
• Based on these requirements, a link budget analysis have been carried out, to extract the receiver sensitivity to fulfill the requirements
• Shannon’s capacity analysis should be based on these requirements to establish the technical feasibility
13
IEEE 802.3 GEPOF Study Group - May 2014 Interim
POF
Knowledge Development
Questions?
