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LMK00338EVM User's Guide Literature Number: SNAU155 November 2013
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Page 1: LMK00338EVM User's Guide - TI.com

LMK00338EVM

User's Guide

Literature Number: SNAU155November 2013

Page 2: LMK00338EVM User's Guide - TI.com

User's GuideSNAU155–November 2013

LMK00338EVM User Guide

This user guide describes how to set up and operate the LMK00338 evaluation module (EVM). TheLMK00338 is a 400 MHz, 8-output HCSL clock buffer intended for high frequency, low additive jitter clockdistribution and level translation. The EVM allows the user to verify the functionality and performancespecifications of the device. Refer to the LMK00338 datasheet for the functional description andspecifications.

Topic ........................................................................................................................... Page

1 General Description ............................................................................................ 32 Features ............................................................................................................. 33 Quick Setup ....................................................................................................... 34 Signal Path and Control Switches ......................................................................... 45 Power Supplies ................................................................................................... 56 Clock Inputs ....................................................................................................... 67 Crystal Oscillator Interface ................................................................................... 78 Clock Outputs .................................................................................................... 79 Schematics ........................................................................................................ 810 Board Layout .................................................................................................... 1111 Bill of Materials ................................................................................................. 13

All trademarks are the property of their respective owners.

2 LMK00338EVM User Guide SNAU155–November 2013Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Page 3: LMK00338EVM User's Guide - TI.com

LMK0033x

EVALUATION

MODULE

CL

Kin

X

CL

Kin

X*

VCC_EXT

GND

Bank A Outputs

(DC Coupled HCSL)

RE

Fo

ut

(LV

CM

OS

)

Bank B Outputs

(DC Coupled HCSL)

Bottom side:

25 MHz Crystal

(Default Input)

CLKoutBn

CLKoutBn*

CLKoutAn

CLKoutAn*

O-SCOPE

(50Ω inputs)

50Ω TERM

50Ω TERM

Note: Terminate unused

output traces (or disconnect

from output pin on PCB)

CLOCK

SOURCE

(OPTIONAL)

50

ΩT

ER

M

4 to 6 V

GND

POWERSUPPLY

www.ti.com General Description

1 General Description

2 Features• Low-noise clock fan-out via two banks of four HCSL outputs and one LVCMOS output• 3:1 input multiplexer with two universal input buffers and one crystal oscillator interface• DIP switch control of device configuration• 3.3 V core and 3 independent 3.3 V/2.5 V output supplies (one per output bank) using external supply

inputs or optional LP3878-ADJ LDO or LMZ10500 switching regulator on board• AC- or DC-coupled input & output interface with low-skew, controlled-impedance traces and edge SMA

connectors

3 Quick SetupTo quickly set up and operate the board with basic equipment, refer to the setup procedure below and testsetup shown in Figure 1.

Figure 1. LMK00338 Evaluation Board Quick Start Setup

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Signal Path and Control Switches www.ti.com

Setup Procedure:1. Verify the output mode control switches, S1[1:5], match the states shown in Table 1 to reflect the

default output clock interfaces configured on the EVM.

Table 1. Default Clock Output ModesSW Position/Name SW State Default Clock Output Modes

S1[2] / CLKoutB_A_EN OFF Bank A outputs enabledS1[4] / CLKoutB_B_EN OFF Bank B outputs enabled

S1[5] / REFout_EN ON REFout (CMOS) enabled

2. Connect a 4 to 6 V power supply to VCC_EXT and GND terminals of the power block labeled J2. Thispowers the on-board LDO regulator to supply 3.3 V to the VCC and VCCO rails of the IC. Both VCC &VCCO status LEDs should be lit green when ON.

3. Set the desired clock input using the input selection control switches, S1[6:7], as seen in Table 2. Theonboard 25 MHz crystal (Y1) can be selected, so an external clock source is not required. A differentialclock source can be connected to SMAs labeled CLKin0/0* or CLKin1/1*. By default, these differentialinputs are AC coupled and terminated near the device with 100 Ω differential. To configure the EVM fora single-ended input, refer to the Clock Inputs section.

Table 2. Input SelectionSelected Input Default Input Mode S1[6] CLKin_Sel1 State S1[7] CLKin_Sel0 State

CLKin0/0* Differential clock OFF OFFCLKin1/1* Differential clock OFF ON

OSCin 25 MHz XTAL onboard ON Don't care

4. Connect and measure any clock output SMA labeled CLKoutA#/A#*, CLKoutB#/B#*, or REFout to anoscilloscope or other test instrument using SMA cable(s). The output clock will be a level-translated/buffered copy of the selected clock input or crystal oscillator. Note: All output clocks are DC-coupled to the SMA connectors.Note: Any active output trace(s) without proper load termination can cause signal reflections on theboard, which can couple onto nearby outputs and degrade signal quality and measurement accuracy.To minimize these effects, be sure to properly terminate any unused output trace with a 50 Ω SMAload, or else disconnect any unused output trace from the device output pin by removing the series 0 Ωresistor. An unused output or output bank may also be disabled using the output mode control switch.

4 Signal Path and Control SwitchesThe LMK00338 supports single-ended or differential clocks on CLKin0 and CLKin1. A third input, OSCin,has an integrated crystal oscillator interface that supports a fundamental mode, AT-cut crystal or anexternal single-ended clock. To achieve the maximum operating frequency and lowest additive jitter, it isrecommended to use a differential input clock with high slew rate (>3 V/ns) on either CLKin0 or CLKin1port.

The device provides up to 8 HCSL outputs with pin-selectable output enable (HCSL, or Hi-Z). Anadditional output, REFout, has a fixed LVCMOS buffer with output enable input.

All control pins are configured with the control DIP switch, S1. The input selection logic is shown inTable 2. The output enable selection logic for Bank A and Bank B are shown in Table 1. The REFoutenable logic is shown in Table 3.

Table 3. REF out Enable SelectionREFout Enable Mode S1[5] REFout_EN State

Disabled/Hi-Z OFFEnabled ON

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Page 5: LMK00338EVM User's Guide - TI.com

www.ti.com Power Supplies

5 Power SuppliesThe power supply section on the EVM provides flexibility to power the device using the onboardregulator(s) or direct supply input(s). A combination of 0 Ω resistor options allows the user to modify theEVM power supply configuration, if desired.

By default, 3.3 V is supplied to both VCC and VCCO rails by the onboard LDO regulator, U3. To powerthe regulator, connect a 4 V to 6 V input voltage and ground from an external power source to the terminalblock, J2, or SMA input labeled VCC_EXT.

To modify the EVM with a different power supply configuration, populate the resistor options as shown inTable 4. Then, apply the appropriate voltage(s) to the EVM power input(s).

If the EVM is configured for dual direct supplies, connect the 3.3 V supply and ground to VCC_EXT andthe 2.5 V supply and ground to the SMA input labeled VCCO_EXT.

Decoupling capacitors and 0 Ω resistor footprints, which can accommodate ferrite beads, can be used toisolate the EVM power input(s) from the device power pins.

Table 4. EVM Power Supply Configuration OptionsLP3878 LDO LMZ10500 Single Dual

Regulator (U3) Switcher (U2) Direct Supply Direct Supplies3.3 V (DEFAULT) 3.3 V 3.3 V 3.3 V & 2.5 V

VCC_EXT port Apply 4 V to 6 V Apply 4 V to 5.5 V Apply 3.3 V ± 5% Apply 3.3 V ± 5%(J2 or SMA)

VCCO_EXT port Not used Not used Not used Apply 2.5 V ± 5%(SMA)

U2 Vout Not used 3.3 V (VCC & VCCO) Not used Not usedU3 Vout 3.3 V (VCC & VCCO) Not used Not used Not used

R131 OPEN OPEN OPEN 0R132 0 0 0 0R134 OPEN 0 OPEN OPENR145 OPEN 0 OPEN OPENR153 OPEN OPEN 0 0R155 0 OPEN OPEN OPENR156 0 OPEN OPEN OPEN

5.1 Independent Output Supply VoltagesOn the bottom side of the EVM, resistor options provide flexibility to power each of the three individualoutput supply pins (VCCOA, VCCOB, and VCCOC) from either VCC or VCCO rail. This is useful when 3.3V and 2.5 V are both needed for separate output supplies.

The EVM power supply needs to be modified to get 2.5 V on the VCCO rail, either using the VCCO_EXTinput or LMZ10500 switcher, as seen in Table 4. To configure LMZ10500 with 2.5 V output, set R138 to150k and R139 to 118k.

Note: When the LMZ10500 switcher is used to power the DUT and an ultra-low-noise clock source isused, the higher output noise voltage of the switcher (compared to the LP3878-ADJ) can cause an slightincrease in the output phase noise floor at low offset frequencies as well as low-level spurs. The highPSRR of the device helps to minimize supply-induced jitter.

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Clock Inputs www.ti.com

6 Clock InputsThe SMA inputs labeled CLKin0 & CLKin0* and CLKin1 & CLKin1* can be configured to receive adifferential clock or single-ended clock. Best performance is achieved with a differential input clock, whichis the default configuration for both CLKin ports.

Both CLKin0 and CLKin1 paths include footprint options to provide the user with flexibility in configuringthe termination, biasing, and coupling for the device inputs.

6.1 Configuring CLKinX+ for a Single Ended InputTo configure an AC-coupled or DC-coupled single-ended clock input on CLKin0, follow the steps below.CLKin1 can be modified similarly.1. Remove R24 (100 Ω differential termination).2. Terminate CLKin0 (driven input) by installing 51 Ω on R30.3. Install 0.1 uF on C10 as a bypass capacitor.4. Modify for AC or DC coupled input:

(a) AC-coupled input: Install 0 Ω on R23, so CLKin0* input pin is AC coupled to ground via C17.(b) DC-coupled input:

(i) Replace R22 and R28 with 0 Ω to DC couple the input path.(ii) Bias CLKin0*(non-driven input) with a reference voltage near the common-mode voltage of the

DC-coupled input signal (on CLKin0) using R21 and R23 to form a voltage divider from VCC.

For example, if CLKin0 will be driven by a single-ended, DC-coupled LVCMOS signal with a common-mode voltage of 1.65 V, then 1 kΩ resistors can be installed on R21 and R23 to bias CLKin0* to VCC/2.

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www.ti.com Crystal Oscillator Interface

7 Crystal Oscillator InterfaceThe LMK00338 has an integrated crystal oscillator interface (OSCin/OSCout) that supports a fundamentalmode, AT-cut crystal. If the crystal input is selected, the onboard XTAL on either footprint Y1 or Y2 willstart- up and the oscillator clock can be measured on any enabled output.

By default, a 25.000 MHz XTAL is populated on Y1, which uses a HC49 footprint on the bottom side of thePCB. Alternatively, a 3.2 x 2.5 mm XTAL or 3.3 V XO (3.3 V CMOS or clipped sinewave) can bepopulated on Y2, located on the top side. Only one XTAL footprint should be used at a time.

When using a XTAL, the external load capacitor values of C18 and C22 (CEXT) depend on the specifiedload capacitance (CL) for the crystal, as well as the device’s OSCin input capacitance (CIN = 1 pF typical)and the PCB stray capacitance (CSTRAY ~ 1 pF). The selected 25 MHz crystal is specified for CL of 18 pF.Assuming equal external load capacitor values for optimum symmetry, CEXT can be calculated as follows:• CEXT = (CL - CIN - CSTRAY) x 2• CEXT = (18 pF - 1 pF - 1 pF) x 2• CEXT ~ 33 pF (nearest standard value)

To limit crystal power dissipation, a 1 kΩ resistor is placed between the OSCout pin and the crystal.

7.1 Configuring OSCin for a Single Ended InputTo configure a single-ended clock input on OSCin, remove R34 and R37 to disconnect the crystal. Install0.1 uF on C24 to provide an AC-coupled path from the SMA input labeled OSCin to the device input,which has internal biasing. Note that the OSCin path includes a 51Ω termination on R42.

8 Clock OutputsBy default, Bank A and B are configured as enabled HCSL outputs, source-terminated with 50 Ω resistors,and DC coupled to the SMA connectors labeled CLKoutA#+ / CLKoutA#, or CLKoutB#+ / CLKoutB#–.

REFout is a LVCMOS output and is AC coupled to its SMA connector.

As noted before, active output traces should be properly terminated; otherwise any unused output pin canbe disconnected from the output trace by removing the 0 Ω series resistor.

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Page 8: LMK00338EVM User's Guide - TI.com

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Mod. Date:

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LMK00338EVMProject Title:Designed for: Public Release

Assembly Variant:001

© Texas Instruments 2013

Drawn By:Engineer:

Not shown in title blockJulian Hagedorn

Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors donot warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/orits licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for yourapplication.

Not in version controlSVN Rev:SV601035Number: Rev: A

Revision History

Revision Notes

LMK00338 Evaluation Board

0

R153DNP

0

R155

VCC_EXT

IN4

ADJ6

GND3

NC7

SD8

DAP9

OUT5

BYP1

NC2

U3

LP3878SD-ADJ

10µFC67

1µFC68

0.01µFC69

VCC

10µFC72 10µF

C712200pF

C70

0.01µFC73

51k

R157

2.00kR158

866R159

0

R156

0

R134DNP

0

R145DNP

1µFC61

0.01µFC62

VCCO

10µFC60

0

R132

0

R131DNP

270R154

270R133

1

2 3 4 5

VCC_EXT

1

2 3 4 5

VCCO_EXT

VCC

EN_REFout

2.0kR140

2.0kR141

2.0kR142

2.0kR143

2.0kR135

3.9kR150

DNP3.9kR146

DNP3.9kR147

DNP3.9kR148

DNP3.9kR149

DNP

CLKoutB_EN

CLKoutA_EN

CLKin_Sel1

CLKin_Sel0

Control Pin Switches and Header

VCC and VCCO Power Supplies

Default Switch Settings for Control Input PinsS1[2] = 1'b ==> Output Bank B is EnabledS1[4] = 1'b ==> Output Bank A is Enab ledS1[5] = 1'b ==> REFout is EnabledS1[6:7] = 10'b ==> OSCin is Selected (25 MHz XTAL)

Switch States0 = Switch Open / OFF (Control pin tied low via internalpulldown)1 = Switch Closed / ON (Control pin connected high to VCC)

A combination of 0 ohm resistor options allows flexibility in poweringthe VCC and VCCO rails of the device using onboard LDO regulators(U2, U3) or external supply(ies).

By default, one of the LDO regulators (U3) provides a low-noise 3.3 Vsupply to both supply rails of the device. To power the device in singlesupply operation from regulator U1, apply a single external inputvoltage (4 V to 16 V) on VCC_EXT via the SMA input or terminal blockJ2.

To power the device in single supply operation from an external 3.3 Vsupply (bypass LDO regulators), open R131, R134, R145, R155,R156, and install 0 ohms on R132 and R153. Then, apply 3.3 V toVCC_EXT.

To power the device in split supply operation (3.3V, 2.5V) from bothonboard regulators (U3, U2), open R131, R132, and R153, and install0 ohms on R134, R155, R156, and R156. Then, apply 4 V to 16 V onVCC_EXT.

To power the device in split supply operation from external 3.3 V and2.5 V supplies, open R132, R134, R145, R155, R156, and install 0ohms on R131 and R153. Then, apply 3.3 V to VCC_EXT and 2.5 Vto VCCO_EXT.

10µFC65

118kR138

150kR139

470pFC63

10µFC64

SV601035

A

PCB Number:

PCB Rev:

1

2

J2

1592820000

VCCO ON

12

D1

VCC ON

12

D2

H1

TCBS-6-01H2

TCBS-6-01H3

TCBS-6-01H4

TCBS-6-01

1

2

3

4

5

6

13

14

15

16

7

12

8 9

10

11

S1

219-8MST

LDO_OUT

VCC EXT

VCC

VCCO EXT

SSW OUT

1 2

3 4

5 6

7 8

9 10

J1

HEADER_2X5

DNP

NC9

PVIN7

EN1

PGND6

VOUT5

NC10

VCON2

VDD8

NC11

FB3

SGND4

U2

LM3218SEE/NOPB

DNP

Schematics www.ti.com

9 Schematics

Figure 2. Schematic Sheet #1

8 LMK00338EVM User Guide SNAU155–November 2013Submit Documentation Feedback

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SV601035_Sheet2.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

B http://www.ti.comContact: http://www.ti.com/support

LMK00338EVMProject Title:Designed for: Public Release

Assembly Variant:001

© Texas Instruments 2013

Drawn By:Engineer:

Not shown in title blockJulian Hagedorn

Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors donot warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/orits licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for yourapplication.

Not in version controlSVN Rev:SV601035Number: Rev: A

CLKin1SMA_C1_P

1

2 3 4 5

CLKin1-

DNPDNP

1

2 3 4 5

CLKin1+

DNPDNP

SMA_C1_N

U1_C1_P

U1_C1_N

1

2 3 4 5

CLKin0+

142-0701-806

1

2 3 4 5

CLKin0-

142-0701-806

SMA_C0_P

CLKin0C0_P

C0_N

U1_C0_P

SMA_C0_N

U1_C0_N

CLKin+/CLKin- can accept a differential or single-ended inputclock. By default, CLKin is configured to accept a differentialclock expecting a 100 ohm differential load. The input is DCcoupled to the device.

Footprint options (0603 size) are included to achieve thedesired input termination, biasing, and coupling to the device.

XTAL Circuit

OSCin Single-Ended Clock InputOnly one XTAL footprint (Y1 or Y2) should be used at a time.Y1 is HC49 SMD footprint, and Y2 is 3.2 x 2.5 mm SMD footprint.

If an external single-ended clock will be used to drive OSCin, then installC24 with 0.1 uF and remove R34 and R37 to disconnect the XTAL.

CLKin_Sel0

CLKoutA_EN

CLKin_Sel1

CLKoutB_EN

Bank

AO

utp

uts

U1_A0_P

U1_A0_N

U1_A1_P

U1_A1_N

U1_A2_P

U1_A2_N

U1_A3_P

U1_A3_N

Bank

BO

utp

uts

U1_B0_P

U1_B0_N

U1_B1_P

U1_B1_N

U1_B2_P

U1_B2_N

U1_B3_P

U1_B3_N

REFout

A2_P

A1_N

A0_N

A0_P

A3_P

A3_N

A2_N

A1_P

B0_P

B0_N

B1_P

B1_N

B2_P

B2_N

B3_P

B3_N

10µFC4

1µFC5

10µFC1

1µFC2

0.1µFC3

0.1µFC6

VCCO

VCC

VCCO

VCC

C1_N

C1_P

REFout_EN Single-Ended InputBy default REFout_EN is driven by SW1 or J1.

If an external single-ended signal will be usedto drive REFout_EN remove R18 and place inR19 spot.

0.1µF0402 6.3VC12

0.1µF0402 6.3VC7

100R24

51R26

DNP

VCC

0.1µF04026.3V

C15DNP

0

0402

R28

51R30

DNP

51R21

DNP

VCC

0.1µF04026.3V

C10DNP

0

0402

R22

51R23

DNP

0.1µF0402 6.3VC14

0.1µF0402 6.3VC17

100R31

51R25

DNP

51R32

DNP

VCC

VCC

0.1µF04026.3V

C13DNP

0.1µF04026.3V

C19DNP

0

0402

R27

0

0402

R33

51R35

DNP

51R29

DNP

25.000 MHz18 pF

Y1

33pFC22

33pFC18

0

R34

0R37

1

2 3 4 5

OSCin

DNPDNP

51R40

DNP

0

0402

R41

0.1µF04026.3V

C24DNP

51R42

OSCinSMA_OSCin

1

2 3 4 5

REFout_EN

DNPDNP

SMA_REFout_EN

00402

R19DNP

0

0402

R18

49.9R9

DNP

U1

_R

EF

out_

EN

0.01µFC8

0.01µFC90.01µF C16

0.01µF C26

0.01µFC27

0.01µFC20

0.01µFC21

0

0402

R45

0

0402

R46

0

0402

R47

0

0402

R48

0

0402

R49

0

0402

R50

0

0402

R51

0

0402

R52

0

0402

R1

0

0402

R2

0

0402

R3

0

0402

R4

0

0402

R5

0

0402

R6

0

0402

R7

0

0402

R8

U1_OSCin

1

2345

REFout

142-0701-806

U1_REFout

51R39

DNP

0

0402

R36

10pFC25DNP

0.1µF0402 6.3VC23REFout SMA_REFout

0R

12

9

0R

13

0

DNP0R

123

0R

124

DNP

0R

128

0R

117

0R

118

DNP

0R

122

EN_REFout

49.9R53

DNP 49.9R60

DNPDNPDNPDNP DNPDNPDNP

49.9R10

DNP 49.9R17

DNPDNPDNPDNP DNPDNPDNP

CLKOUTB322

CLKOUTB223

CLKOUTB224

VCC35

CLKOUTA01

CLKOUTA02

CLKOUTA14

CLKOUTA15

VCCOA3

CLKOUTA27

CLKOUTA28

CLKOUTA39

CLKOUTA310

CLKOUTA_EN11

VCC12

OSCIN13

OSCOUT14

GND20

CLKIN016

CLKIN017

CLKIN_SEL118

CLKOUTB_EN19

GND31

CLKOUTB321

CLKIN_SEL015

CLKOUTB126

CLKOUTB127

CLKOUTB029

CLKOUTB030

VCC32

CLKIN133

DAP41

VCCOA6

VCCOB25

VCCOB28

CLKIN134

REFOUT36

VCCOC37

REFOUT_EN38

VCC39

GND40

MUX

SYNC

VccoA

VccoC

VccoB

U1

LMK00338RTA GND1 GND2 GND3

GND

REF

www.ti.com Schematics

Figure 3. Schematic Sheet #2

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SV601035_Sheet3.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

B http://www.ti.comContact: http://www.ti.com/support

LMK00338EVMProject Title:Designed for: Public Release

Assembly Variant:001

© Texas Instruments 2013

Drawn By:Engineer:

Not shown in title blockJulian Hagedorn

Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors donot warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/orits licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for yourapplication.

Not in version controlSVN Rev:SV601035Number: Rev: A

1

2345

CLKoutA0+

1

2345

CLKoutA0-

1

2345

CLKoutA1+

DNP

DNP

1

2345

CLKoutA1-

DNP

DNP

1

2345

CLKoutA2+

DNP

DNP

1

2345

CLKoutA2-

DNP

DNP

1

2345

CLKoutA3+

1

2345

CLKoutA3-

1

2345

CLKoutB0+

1

2345

CLKoutB0-

1

2345

CLKoutB1+

DNP

DNP

1

2345

CLKoutB1-

DNP

DNP

1

2345

CLKoutB2+

DNP

DNP

1

2345

CLKoutB2-

DNP

DNP

1

2345

CLKoutB3+

1

2345

CLKoutB3-

Clock Output Interface Options (Termination/Biasing/Coupling)

SMA_B0_P

SMA_B0_N

SMA_B1_P

SMA_B1_N

SMA_B2_P

SMA_B2_N

SMA_B3_P

SMA_B3_N

SMA_A0_P

SMA_A0_N

SMA_A1_P

SMA_A1_N

SMA_A2_P

SMA_A2_N

SMA_A3_P

SMA_A3_N

B0_P

A0_N

Output Bank B Output Bank AEach output should be DC coupled and drive a 50-ohm load at the destination. The 0 ohm seriesresistor near the outputs can be replaced with 10-33 ohms to reduce ringing/overshoot.

Each output should be DC coupled and drive a 50-ohm load at the destination. The 0 ohm seriesresistor near the outputs can be replaced with 10-33 ohms to reduce ringing/overshoot.

A0_P

B0_N

B1_P

B1_N

A1_P

A1_N

B2_P

B2_N

B3_P

B3_N

A2_P

A2_N

A3_P

A3_N

0

R228

0

R232

0

R234

0

R238

0

R240

0

R244

0

R246

0

R250

0

R229

0

R233

0

R235

0

R239

0

R241

0

R245

0

R247

0

R251

Schematics www.ti.com

Figure 4. Schematic Sheet #3

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www.ti.com Board Layout

10 Board Layout

Figure 5. 3D PCB Print – Top (Not to Scale)

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Board Layout www.ti.com

Figure 6. 3D PCB Print – Bottom (Not to Scale)

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www.ti.com Bill of Materials

11 Bill of Materials

Table 5. LMK00338EVM Bill of Materials

Designator Description Manufacturer Part Number Quantity!PCB Printed Circuit Board Any SV601035 1

C1, C4, C60, C64, C65, C67, CAP, CERM, 10uF, 10 V, MuRata GRM21BR61A106KE19L 8C71, C72 ±10%, X5R, 0805

C2, C5, C61, C68 CAP, CERM, 1uF, 16 V, TDK C1608X7R1C105K 4±10%, X7R, 0603

C3, C6 CAP, CERM, 0.1uF, 16 V, TDK C1608X7R1C104K 2±10%, X7R, 0603

C7, C12, C14, C17, C23 CAP, CERM, 0.1uF, 6.3 V, TDK C1005X5R0J104K 5±10%, X5R, 0402

C8, C9, C16, C20, C21, C26, CAP, CERM, 0.01uF, 16 V, TDK C1005X7R1C103K 9C27, C62, C69 ±10%, X7R, 0402

C18, C22 CAP, CERM, 33pF, 50 V, Kemet C0603C330J5GACTU 2±5%, C0G/NP0, 0603

C63 CAP, CERM, 470pF, 50 V, TDK C1608X7R1H471K 1±10%, X7R, 0603

C70 CAP, CERM, 2200pF, 100 V, AVX 06031C222JAT2A 1±5%, X7R, 0603

C73 CAP, CERM, 0.01uF, 25 V, TDK C1608C0G1E103J 1±5%, C0G/NP0, 0603

CLKin0+, CLKin0-, Connector, SMT, End launch Emerson Network Power 142-0701-806 13CLKoutA0+, CLKoutA0-, SMA 50 ohmCLKoutA3+, CLKoutA3-,CLKoutB0+, CLKoutB0-,CLKoutB3+, CLKoutB3-,

REFout, VCC_EXT,VCCO_EXT

D1, D2 LED, Green, SMD Lumex SML-LX2832GC-TR 2H1, H2, H3, H4 HEX STANDOFF SPACER, Richco Plastics TCBS-6-01 4

9.53 mmJ2 Terminal Block, Weidmuller 1592820000 1

10.76x17x11 mm, 2POS,26-12AWG, TH

R1, R2, R3, R4, R5, R6, R7, RES, 0 Ω, 5%, 0.063W, 0402 Panasonic ERJ-2GE0R00X 44R8, R18, R22, R27, R28,R33, R36, R41, R45, R46,R47, R48, R49, R50, R51,R52, R117, R122, R123,R128, R129, R228, R229,R232, R233, R234, R235,R238, R239, R240, R241,R244, R245, R246, R247,

R250, R251R24, R31 RES, 100 Ω, 1%, 0.063 W, Vishay-Dale CRCW0402100RFKED 2

0402R34, R37, R132, R155, R156 RES, 0 Ω, 5%, 0.1 W, Vishay-Dale CRCW06030000Z0EA 5

0603R42 RES, 51 Ω, 5%, 0.063 W, Vishay-Dale CRCW040251R0JNED 1

B0402R133, R154 RES, 270 Ω, 5%, 0.1W, 0603 Vishay-Dale CRCW0603270RJNEA 2

R135, R140, R141, R142, RES, 2.0k Ω, 5%, 0.1 W, Vishay-Dale CRCW06032K00JNEA 5R143 0603R138 RES, 118k Ω, 1%, 0.1 W, Vishay-Dale CRCW0603118KFKEA 1

0603R139 RES, 150k Ω, 1%, 0.1 W, Vishay-Dale CRCW0603150KFKEA 1

0603

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Bill of Materials www.ti.com

Table 5. LMK00338EVM Bill of Materials (continued)Designator Description Manufacturer Part Number Quantity

R157 RES, 51k Ω, 5%, 0.1 W, Vishay-Dale CRCW060351K0JNEA 10603

R158 RES, 2.00k Ω, 1%, 0.1 W, Vishay-Dale CRCW06032K00FKEA 10603

R159 RES, 866 Ω, 1%, 0.1 W, Vishay-Dale CRCW0603866RFKEA 10603

S1 Switch, Slide, SPST 8 poles, CTS Electrocomponents 219-8MST 1SMT

U1 LMK00338 3-GHz 8-Output Texas Instruments LMK00338RTA 1Differential Clock Buffer/Level

Translator, RTA0040AU3 Micropower 800 mA Low National Semiconductor LP3878SD-ADJ 1

Noise 'Ceramic Stable'Adjustable Voltage Regulatorfor 1V to 5V Applications, 8-

pin LLPY1 CRYSTAL 25.000 MHZ 18PF Abracon Corporation ABLS-25.000MHZ-B4-F-T 1

SMD

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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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