LPC55S69JEV98 Fingerprint Demo Kit with 2-Layer PCB

NXP Semiconductors Document identifier: UM11338User's Guide Rev. 0, June 2020

ContentsChapter 1 Purpose.................................................................................................3

Chapter 2 LPC55S69JEV98 Fingerprint demo kit................................................. 4

Chapter 3 How to update MCU firmware............................................................... 9

Chapter 4 Running demos................................................................................... 11

Chapter 5 Conclusion.......................................................................................... 13

Chapter 6 References..........................................................................................14

Chapter 7 Appendix............................................................................................. 15

Chapter 8 Revision history...................................................................................16

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Chapter 1PurposeThe LPC55S69JEV98 Fingerprint demo kit is based on LPC55S69JEV98(VFBGA98). The purpose of this kit is to prove thatVFBGA98 can use 2-layer PCB layout(low-cost PCB) in some applications. Here fingerprint is used as user application. Thisdemo kit shown as Figure 1. This kit integrates LPC55S69JEV98 with a fingerprint sensor, a 160x128 color OLED panel,1xTemperature/Humidity sensor, 2x buttons, 2x LEDs, and 1xUSB high-speed port. This user guide describes how to useLPC55S69JEV98 fingerprint demo kit.

Figure 1. LPC55S69JEV98 Fingerprint demo kit

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Chapter 2LPC55S69JEV98 Fingerprint demo kit

2.1 OverviewThis demo kit has two PCB board, one is LPCup-LPC55S69JEV98 core board, the other is Fingerprint application board shownas Figure 2. LPCup core board is black and application board is blue.

Figure 2. LPCup core board & Fingerprint application board.

2.2 LPCup-LPC55S69JEV98 core boardThe core board is following LPCup expander board rules, the LPCup expander board is support 2x LEDs, 2x Buttons, the LPCupexpander connector is compatible with Arduino connectors. As Figure 3 show, the core board is a 1600 mils x 1600 mil PCBboard, it is a minimum MCU system.

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Figure 3. LPCup expander board instruction

For LPC55S69JEV98 LPCup core board, we added a high-speed USB port and extended JTAG & UART connectors for debugand print log information.

Figure 4. LPCup-LPC55S69JEV98 core board

LPCup-LPC55S69JEV98 core board has 5x Connectors, SWD is used for debug, LOG is used for uart print, LPCup is LPCupfunctions connector which compatible with Arduino, CON4 is used select the USB mode as device or host, CON6 used formeasurement MCU current. Each connector pins function detail explained in Table 1 to Table 4

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Table 1. CON4/6 connector usage details

Connector # Function Descriptions

CON4 USB mode select 1-2 Open: USB is device

1-2 Shunt: USB is host

Default is OPEN.

CON6 Measurement MCU current 1-2 Shunt: power up MCU normally

1-2 Open: connect a current meter with it for measurementMCU current

Default is 1-2 Shunt.

Table 2. SWD connector pin details

SWD connector 5 pins 2.54 mm

Pin # Function Descriptions

1 3.3 V 3.3 V power supply, this pad is square

2 GND Ground

3 SWDCLK SWD Clock

4 SWDIO SWD IO

5 RESET Reset MCU

Table 3. LOG connector pin details

LOG connector 5 pins 2.54 mm

Pin # Function Descriptions

1 3.3 V 3.3 V power supply, this pad is square

2 UART0_RXD UART Receive Pin, with ISP.

3 UART0_TXD UART Transmit Pin, with ISP.

4 GND Ground

5 5.0 V External 5.0 V power supply,

Table 4. LPCup connector pin details

LPCup

connector

2x15 pins 2.54 mm

Pin1 is square pad

Table continues on the next page...

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Table 4. LPCup connector pin details (continued)

Pin # Function Pin# Function

1 Flexcomm5

RXD

16 PIO0_25

D4

2 Flexcomm5

TXD

17 PIO0_28

D5

3 PIO1_9

D2

18 PIO1_8

D6

4 PIO0_21

D3

19 PIO1_19

D7

5 PIO1_20

D8

20 Flexcomm1

I2C SDA

6 PIO1_21

D9

21 Flexcomm1

I2C_SCL

7 HighSpeed SPI

CS

22 IOREF

NC

8 HighSpeed SPI

MOSI

23 RESET

9 HighSpeed SPI

MISO

24 VCC_IN

5.0 V/External Power

10 HighSpeed SPI

SCK

25 VCC_REF

3.3 V

11 GND 26 GND

12 VCC_OUT

3.3 V

27 VCC_OUT

3.3 V

13 ADC0_3 28 ADC0_0

14 ADC0_8 29 ADC0_1

15 ADC0_11 30 ADC0_2

2.3 Fingerprint application boardApplication board is user-defined, which include 1x OLED panel (UG-6028GDEB1) and 1x Fingerprint sensor (BTL192), shownas Figure 5

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Figure 5. Fingerprint application board.

LPC55S69 is ultra-low active current MCU(<32uA/MHz), User can connect an external battery power pack (3x AAA) on external5.0 V power pins, shown as Figure 6.

Figure 6. Fingerprint application board with external battery power

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Chapter 3How to update MCU firmwareThere are two ways to update the mcu firmware:

• SWD port

• USB HID ISP

Update firmware through SWD port need an external debugger (JLINK V10, ULINK2, LPC-Link2, etc.), connect with core board’sSWD connect, user needs to take care of the wire sequence.

Update firmware through USB needs a tool named as blhost. The blhost usually include in SDK zip pack, path is “middleware\mcu-boot\bin\Tools\blhost\win”.

To update firmware through USB HID ISP, follow the below steps:

1. Connect Core board with PC through USB micro cable.

Remark: Once connected, the LED1(red led) should be turn on.

2. Hold pressing S3 (ISP button), press S1(Reset button) and release it, then release the ISP button, then the USB HIDshould be enumerated with PC successfully, as Figure 7 show.

3. Open command shell and enter the blhost root path, you can copy the target firmware into the blhost root path too.

4. Type in below commands (as Figure 8):

blhost.exe -u 0x1FC9,0x0021 -- write-memory 0x0000 lpc5500_lpcup_mdk.hex

then the firmware should be updated to LPC55S69 successfully.

5. Click Reset button(S1), the demo is running.

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Figure 7. LPC55S69 Core board USB ISP enumerated on Win7.

Figure 8. Firmware update command through USB HID

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Chapter 4Running demosAfter power the kit (through USB port or use external battery pack), the OLED panel would display welcome characters as Figure9.

Figure 9. LP55S69 Fingerprint demo power-up.

After 1 second or 2 seconds, the OLED screen may display enroll prompt. To enroll a new finger, user can click S2 or S3 buttons.Then user need put a finger on the sensor area, once get finger image, the OLED second character line displays “Place Fingeragain”, here user should lift the finger then touch the sensor again. The new finger will be enrolled after 3x times, the fingertemplate will be stored in SRAM (will be destroyed after power-down).

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Figure 10. Enroll a new finger.

Figure 11. Fingerprint recognize success or failed

Then user can touch the sensor area to identify the finger. The recognition result is displayed on the top of OLED, show as Figure 11

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Chapter 5ConclusionThrough the LPC55S69JEV98 fingerprint demo kit, testified the VFGBA98 package can use 2-layer PCB layout to do complicateuser applications, like fingerprint sensor, IOT, etc.

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Chapter 6References[1] LPC55S6x Data Sheet (Rev 1.1), NXP Semiconductors, 8 April 2019

[2] AN12581 2-layer PCB Layer Design Guide for VFBGA98 package, NXP, 2019

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Chapter 7AppendixComponent purchasing channels:

1. Fingerprint sensor module BTL192:

Contact with Betterlife Electronic: http://www.blestech.com/

2. OLED screen is UG-6028GDEBF01:

https://www.amazon.com/UG-6028GDEBF02-160x128-1-69-Color-Module/dp/B07J2XVLCP

UG-6028GDEBF02 is pin to pin with UG-6028GDEBF01, driver is same.

NOTE

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Chapter 8Revision historyTable 5. Revision history

Rev Date Description

0 June 2020 Initial release

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Date of release: June 2020Document identifier: UM11338