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Heraeus mAgic Sinter Paste for High Power Density Devices 107.86 Microbond Silver Interconnect ic 47 Say Goodbye to conventional Power Electronics
Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
AmericasPhone +1 610 825 6050 [email protected]
Asia PacificPhone +65 6571 7677 [email protected]
ChinaPhone +86 21 3357 5457 [email protected]
Europe, Middle East and Africa Phone +49 6181 35 3069
+49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
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Heraeus mAgic Sinter Paste for High Power Density Devices
Heraeus
HET
107.86
Microbond Silver Interconnect
ic47
Say Goodbye to conventional Power Electronics
A family of high achievers
mAgic Sinter Paste products provide max. operation temperatures up to 250°C and do not leave residues. mAgic Sinter Paste are lead free and RoHS conform.
Reliability Performance:mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition in the industry. (e.g. QFN, SOT, QFP, D2PAK, Power QFN, SOIC, PSO, TO…)
For Power Packages, the requirement of higher thermal performance is a challenge using current conductivity adhesive. Heraeus mAgic sinter paste has shown outstanding thermal performance proven by customers:
Heat dissipation performance (ASP295 proven > 50°C lower than adhesive on PA/GaAs package)Good solution to delamination issue
mAgic Silver Sintering – enhancing power packages performance
In Power Package, current solder & adhesive materials technology comes with several limitations and drawbacks in terms of material properties and processability. To overcome this limitations a new interconnect materials are required.
mAgic Sinter Paste, a Pb free materials with outstanding performance to increase device lifetime, enable an increase
in power density and allow elevated operation temperature.
✓ High lifetime & reliability✓ High thermal conductivity✓ High electrical conductivity✓ High operation temperature (up to 250°C) ✓ Lead-free (meets RoHS regulations)✓ No fl ux residues or solder splattering
Materials Properties Comparison:
PlatzhalterPackshots
SeriesmAgic Paste
ASP295 Series Conductive Adhesive
Solder Paste(Pb90Sn10)
Process Temperature (°C) 200 ~ 250 120 ~ 175 ~ 340
Ag Content (%) 100 (after sintering) 75 ~ 85 –
Electrical Resistivity (mΩ·cm) ≤ 0.008 ≤ 0.1 0.02
Thermal Conductivity (W/m·K) ≥ 100 ~ 3 – 10 46
CTE [ppm/K] (below/above Tg) 19 40 / 160 ~ 30
E-Modulus @25°C (Gpa) ~ 25 1 ~ 4 ~ 15
Shear Strength (N/mm2) ≥ 10 > 8 ~ 40
Residue free Yes Yes No
Pb-free Yes Yes No
Reliability tests Condition Results
MSL-1(Moisture Sensitivity Level-1)
168 hrs of 85°C / 85 % RH and 3x refl ow 260°C ✓ Passed
MSL-3(Moisture Sensitivity Level-3)
192 hrs of 30°C / 60 % RH and 3x refl ow 260°C ✓ Passed
TCT (Temperature Cycle Test)
-55°C – 150°C (air to air)H
-65°C – 150°C (air to air)C ✓ Passed
PCT (Pressure Cooker Test)
121°C, 100 % RH, 2atm ✓ Passed
HTST
(High Temperature Storage Test)150°C, 1000 hrs ✓ Passed
Un-Baised HAST 130°C / 85 %, 96 hrs ✓ Passed
348-002214 • Kunde: Heraeus Materials Technology • mAgic 4 Seiter Innenseiten • Farben: 4c (Euroskala) • Format: B 210 mm x H 280 mm (+ 3 mm Beschnitt)
mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition PAK, Power QFN, SOIC, PSO, TO…)
PlatzhalterPackshots
Chip
mAgic Sinter Paste
Lead Frame
X-section after MSl-1 & x3000TCT
1701601501401301201101009080706050
°C
> 50°C
Tc ComparisonASP295 vs. Adhesive
ASP295 (mAgic Sinter Paste)Conductivity Adhesive
A family of high achievers
mAgic Sinter Paste ASP295-Series with special material formulation improve thermal performance compared to solder & adhesive and meet existing production equipments as a drop in solution.
Suitable for non-pressure process Suitable for Conventional Dispensing & Die Placement Equipment/ProcessSuitable for Programmable Convection oven
A family of high achievers
mAgic Sinter Paste products provide max. operation temperatures up to 250°C and do not leave residues. mAgic Sinter Paste are lead free and RoHS conform.
Reliability Performance:mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition in the industry. (e.g. QFN, SOT, QFP, D2PAK, Power QFN, SOIC, PSO, TO…)
For Power Packages, the requirement of higher thermal performance is a challenge using current conductivity adhesive. Heraeus mAgic sinter paste has shown outstanding thermal performance proven by customers:
Heat dissipation performance (ASP295 proven > 50°C lower than adhesive on PA/GaAs package)Good solution to delamination issue
mAgic Silver Sintering – enhancing power packages performance
In Power Package, current solder & adhesive materials technology comes with several limitations and drawbacks in terms of material properties and processability. To overcome this limitations a new interconnect materials are required.
mAgic Sinter Paste, a Pb free materials with outstanding performance to increase device lifetime, enable an increase
in power density and allow elevated operation temperature.
✓ High lifetime & reliability✓ High thermal conductivity✓ High electrical conductivity✓ High operation temperature (up to 250°C) ✓ Lead-free (meets RoHS regulations)✓ No fl ux residues or solder splattering
Materials Properties Comparison:
PlatzhalterPackshots
SeriesmAgic Paste
ASP295 Series Conductive Adhesive
Solder Paste(Pb90Sn10)
Process Temperature (°C) 200 ~ 250 120 ~ 175 ~ 340
Ag Content (%) 100 (after sintering) 75 ~ 85 –
Electrical Resistivity (mΩ·cm) ≤ 0.008 ≤ 0.1 0.02
Thermal Conductivity (W/m·K) ≥ 100 ~ 3 – 10 46
CTE [ppm/K] (below/above Tg) 19 40 / 160 ~ 30
E-Modulus @25°C (Gpa) ~ 25 1 ~ 4 ~ 15
Shear Strength (N/mm2) ≥ 10 > 8 ~ 40
Residue free Yes Yes No
Pb-free Yes Yes No
Reliability tests Condition Results
MSL-1(Moisture Sensitivity Level-1)
168 hrs of 85°C / 85 % RH and 3x refl ow 260°C ✓ Passed
MSL-3(Moisture Sensitivity Level-3)
192 hrs of 30°C / 60 % RH and 3x refl ow 260°C ✓ Passed
TCT (Temperature Cycle Test)
-55°C – 150°C (air to air)H
-65°C – 150°C (air to air)C ✓ Passed
PCT (Pressure Cooker Test)
121°C, 100 % RH, 2atm ✓ Passed
HTST
(High Temperature Storage Test)150°C, 1000 hrs ✓ Passed
Un-Baised HAST 130°C / 85 %, 96 hrs ✓ Passed
348-002214 • Kunde: Heraeus Materials Technology • mAgic 4 Seiter Innenseiten • Farben: 4c (Euroskala) • Format: B 210 mm x H 280 mm (+ 3 mm Beschnitt)
mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition PAK, Power QFN, SOIC, PSO, TO…)
PlatzhalterPackshots
Chip
mAgic Sinter Paste
Lead Frame
X-section after MSl-1 & x3000TCT
1701601501401301201101009080706050
°C
> 50°C
Tc ComparisonASP295 vs. Adhesive
ASP295 (mAgic Sinter Paste)Conductivity Adhesive
A family of high achievers
mAgic Sinter Paste ASP295-Series with special material formulation improve thermal performance compared to solder & adhesive and meet existing production equipments as a drop in solution.
Suitable for non-pressure process Suitable for Conventional Dispensing & Die Placement Equipment/ProcessSuitable for Programmable Convection oven
Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
AmericasPhone +1 610 825 6050 [email protected]
Asia PacificPhone +65 6571 7677 [email protected]
ChinaPhone +86 21 3357 5457 [email protected]
Europe, Middle East and Africa Phone +49 6181 35 3069
+49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
The
data
giv
en h
ere
is v
alid
. We
rese
rve
the
right
to m
ake
tech
nica
l alte
ratio
ns.
Prin
ted
in T
aiwa
n, L
ayou
t: D&
B, F
rank
furt_
HET2
3001
-051
6-1
Heraeus mAgic Sinter Paste for High Power Density Devices
Heraeus
HET
107.86
Microbond Silver Interconnect
ic47
Say Goodbye to conventional Power Electronics
