~ Electronics Over 35 years of continuous and successful operations PoP Process Capabilities PoP is package-on-package assembly that consists of two or more fine- pitch ball grid arrays (BGAs) stacked one on top another. In a two-piece as- sembly, the bottom package is usually a high-density logic device, while the top package is a high-capacity memory device. Both devices may contain more than one die. O.5mm pitch O.4mm pitch ONYX29 PoP Assembly Process Challenge Package & PCBwarp, variation in solder balls height may lead to open connections Solution Bake and dry box process control for PoPand PCB.Developing ball-dipping method using solder paste for PoPassembly and rework OSI Electronics Manufacturing Capabilities OSI Electronics is a Lead-Free qualified factory that can manufacture the PCBAs in both lead-free and leaded processes. We have the advanced equipment and manufacturing process capabilities on the following: • PoPassembly and rework using advanced SMT robotic station. • Screen printer with 2D paste inspection • Advanced SMT pick-a-place machines that are capable of placing 01005 & OAmm pitch uBGA •10- Zone Lead-Free approved convection reflow ovens • Wave soldering & Thru-Hole connector rework Memo OMAP Processor FtKlUFw P"rlll PCB Source: T1 Package-on-Package (PoP) structure ONYX29 PoP Assembly Process For more information contact: Sales Corporate Headquarters: 805-499-6877 www.osielectronics.com
Transcript
~ Electronics Over 35 years of continuous and successful operations
PoP Process Capabilities
PoP is package-on-package assembly that consists of two or more fine-
pitch ball grid arrays (BGAs) stacked one on top another. In a two-piece as-
sembly, the bottom package is usually a high-density logic device, while the
top package is a high-capacity memory device. Both devices may contain
more than one die.
O.5mm pitch
O.4mm pitch
ONYX29 PoP Assembly Process
ChallengePackage & PCBwarp, variation in solder balls height may lead to open connections
SolutionBake and dry box process control for PoPand PCB.Developing ball-dipping methodusing solder paste for PoPassembly and rework
OSI Electronics Manufacturing Capabilities
OSI Electronics is a Lead-Free qualified factory that can manufacture the PCBAs in bothlead-free and leaded processes.
We have the advanced equipment and manufacturing process capabilities on the following:
• PoPassembly and rework using advanced SMT robotic station.
• Screen printer with 2D paste inspection
• Advanced SMTpick-a-place machines that are capable of placing 01005 & OAmm pitch uBGA
• 10- Zone Lead-Free approved convection reflow ovens
•Wave soldering & Thru-Hole connector rework
Memo
OMAP Processor FtKlU FwP"rlll
PCB
Source: T1 Package-on-Package (PoP) structure
ONYX29 PoP Assembly Process
For more information contact: Sales Corporate Headquarters: 805-499-6877 www.osielectronics.com
Southern California NPI Center
MY1 00 Line - Ability to accept cut tape
• Intelligent feeders that can be loaded while machine is in operation
• Accommodates board size from 2"x 2"to 20"x 17.4"
• Electrical and dimensional component verification on the fly
• 176 feeders allow for a single set up for the majority of runs
• Ability to place 01005, FC,CSP,to uBGA's
Over 35 years of continuous and successful operations
Dedicated NPI process established within the Camarillofactory
The NPI Department has its own document control andprocess engineering support, a dedicated NPI Buyer andassociated staff
We have a dedicated NPIlinewhich is supported by our new
MY Data, MYl 00 Line
Camarillo NPI Center - Flying Probe Camarillo NPI Center - X Ray Machine
Engineering Services051 Electronics desires to be involved at the inceptionof the program.The most cost effective time to find and fixdefects is at the initial requirements stage.
We are able to provide this valuable manufac::turing feed-back when provided the following information:
• ASCII Output of the CAD data• Fabrication drawing - DXF,Gerber or PDF• Assembly drawing - DXF,Gerber or PDF• Parts List - .XLS is preferred• Schematic - PDF is preferred
DFM Feedback Example
Hole drilled in SMT pad -this will lead to insufficientsolder, as solder will fill thehole.
051 Electronics recommends removing vias from pads,or add a note on the PCBfabrication drawing indicatingthat the PCBsupplier must epoxy fill the via.
For more information contact: Sales Corporate Headquarters: 805-499-6877 www.osielectronics.com
