DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.
Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
Survey PlusTeardown
Report Publish Date 4/1/2015SI Number 38873Analyst Name R. Rychlicki
Product Type PhabletBrand HuaweiDevice Name AscendDevice Model # GX1 SC-CL00Official Release Date 1/1/2015Target Market ChinaRetail Price $410.00Weight (grams) 180.5 (Measured)
Device Dimensions (mm)
161.28 x 84.75 x 10.05 (Measured at Longest/Widest/Thickest Points)
Operating System Android 4.4.2 "KitKat" (Chinese) + Emotion UI
Processor Spec 1.2 GHz Quad-Core Qualcomm Snapdragon 410 (ARM Cortex-A53)
RAM Support 1 GB Mobile LPDDR3 SDRAM
Communications
SIM1: Quad-Band GSM/EDGE; CDMA (800 MHz), W-CDMA (1900/2100 MHz); LTE (1800 MHz); TD-LTE (2500 MHz) SIM2: Quad-Band GSM/EDGE
Connectivity WiFi 802.11b/g/n, Bluetooth 4.0, microUSB 2.0, NFC, FM Radio, GPS w/ A-GPS Support
User Interface Multitouch Capacitive TouchscreenInternal: 8 GBmicroSD Card (max. 32 GB)
Sensors 3-Axis MEMS Accelerometer, Ambient Light/Proximity
Battery Type 3.8 V, 3500 mAh (min) / 3600 mAh (typ), Li-Polymer
Battery Life (Hrs) Use Time: Unknown ; Standby Time: Unknown
Display 6" IPS TFT-LCD, 1280 x 720 Pixels, 16,777,216 Colors
Front Camera 2 MP CMOS
Rear Camera 8 MP BSI CMOS, Autofocus, LED Flash, 1080p HD Video
Product Features
Product Description
Report Information
Storage
Device Observations
The Huawei GX1 SC-CL00 is the first device we’ve analyzed to use the Qualcomm Snapdragon 410 processor.
Also noted during the analysis, there are components to support W-CMDA/LTE Band 1 and W-CDMA Band 2 even though the device specification does not list support for either of these bands.
The RF design only used 1 main antenna and a second Rx diversity (only) antenna. We have seen multiple multi-mode, multi-band devices use 2 antennas for Tx and Rx while designing either a separate Rx diversity antenna or using the 2 main antennas for Tx, Rx, and Rx Diversity.
NFC Controller Broadcom BCM20795
WiFi / Bluetooth Qualcomm Atheros WCN3620Touchscreen Controller Goodix GT915L
Audio Amplifier AWINIC AW8145Accelerometer Bosch Sensortec BMA255
Power Management Qualcomm PM8916RF Transceiver Qualcomm WTR1605L
RAM / ROM SK Hynix H9TQ65A8GTMCUR-KTM
Design WinsFunction Manufacturer Part NumberApplication / Baseband Processor Qualcomm MSM8916
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
2
Device AnalysisDesign Wins
Analysis SummaryWe’ve noted Huawei has used HiSilicon, Marvell, MediaTek, and Qualcomm for its applications / baseband designs in the Ascend product family. The MSM8916 used in the GX1 is more similar in size and pin count to that of the HiSilicon processors we have seen in other Huawei devices.
Component Function:
$14.66
$3.34
$3.27
$10.10
$9.63
$0.40$1.86
$7.18
$0.84
$0.00
$10.00
$20.00
$30.00
$40.00
$50.00
$60.00
SensorSensor
RF ComponentRF Component
Power Management / AudioPower Management / Audio
OtherOther
Memory: MixedMemory: Mixed
Display / TouchscreenDisplay / Touchscreen
ConnectivityConnectivity
Camera / ImageCamera / Image
Applications/BasebandProcessorApplications/BasebandProcessorHuawei Ascend GX1
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
3
Device AnalysisAnalysis Summary
Pkg. Brand CostQualcomm $19.55SK Hynix $9.63Unknown $3.34Qorvo $1.65Himax $1.53Qualcomm Atheros $1.42
Other $3.24Broadcom $0.92Bosch Sensortec $0.58Goodix $0.57AMS $0.26Skyworks $0.24Orient-Chip Semiconductor $0.21Texas Instruments $0.19AWINIC $0.13Murata $0.10Airoha Technology $0.04
OtherOther
Qualcomm AtherosQualcomm AtherosHimaxHimax
QorvoQorvoUnknownUnknownSK HynixSK Hynix
48.44%
23.86%
8.28%
4.08%3.80%3.51%
8.02%
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
Vendor Share %
48.44%
23.86%
8.28%
4.08%3.80%3.51%
8.02%
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
Vendor Share %
QualcommQualcomm
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
4
Device AnalysisMajor IC Manufacturer Distribution
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
5
Product Label
WiFi/BT/GPSWiFi/BT/GPSWiFi/BT/GPS
Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.
4 - Qualcomm#WTR1605L
GSM / CDMA / W-CDMA / LTE / TD-LTE RxD Transceiver + GPS
5 - Qorvo#RF7459A
Multimode, Multiband 3G/4G Power Amplifier
6 - Qorvo#RF7941
TD-LTE Band 41 Power Amplifier
7 - Qorvo#RF1494A
SP10T Antenna Switch
8 - Skyworks#SKY13373-460LF
SP3T RF Switch
DUPL
W-C
DM
A B
1 Tx
LTE
B3 T
x
W-C
DM
A B
2 Tx
CD
MA 8
00Tx
Coupler
11 - Airoha Technology#AR8159 ?GPS LNA
RF
Hig
h/Lo
w B
ands
GSM
Hig
h Ban
d Tx
GSM
900
MH
z Rx
Main AntennaMain AntennaMain Antenna
Rx Diversity AntennaRx Diversity AntennaRx Diversity Antenna
DIPLEXER
13 - Broadcom#BCM20795
NFC Controller
NFCNFCNFC
DUPL DUPL
DUPL
Manufacturer:
QualcommQualcomm
UnknownUnknown
MurataMurataBroadcomBroadcom
WisolWisol
Airoha TechnologyAiroha Technology
To Qualcomm MSM8916
TD-L
TE B
41 T
x
SkyworksSkyworksQorvoQorvo
TD-L
TE B
41 R
xD
TD-L
TE B
41 R
x
W-C
DM
A B
1 RxD
LTE
B3 R
xD
GSM
Low
Ban
d Tx
12 – Qualcomm Atheros#WCN3620
WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio
9 - Murata#XMSS003Dual SPDT
(DP4T) Antenna Switch
TDK-EpcosTDK-Epcos
? = Unconfirmed
WiF
i/ B
luet
ooth
GPS
W-C
DM
A B
1 Rx
LTE
B3 R
x
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
6
Block DiagramRadio Block
The Huawei GX1 SC-CL00 has similar dimensions and the same display size as the Huawei Ascend Mate 7 MT-TL00.
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
7
FeaturesExterior Features View 1
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
8
FeaturesExterior Features View 2
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
9
ComponentsMajor Components Side 1
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
10
ComponentsMajor Components Side 2
The main enclosure for the Huawei GX1 SC-CL00 is a co-molded piece of Magnesium and PC + GF9% with 5 metal inserts.
Unit Part ID No. Qty Description Material Dimensions (mm) Weight
(grams)Enclosure 1 1 Back Enclosure PC 157.81 x 81.59 x 2.26 12.40Enclosure 2 1 Internal Enclosure PC + GF10% 161.04 x 84.46 20.80Enclosure 3 1 Main Enclosure Magnesium + PC + GF9% 160.35 x 83.71 19.30
3Total
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
11
ComponentsMain Enclosures
NE Part ID #2Internal Enclosure PC+GF10%
Includes all antennas
NE Part ID #3Main Enclosures
Co-molded magnesium and PC+GF9% with 5 inserts
NE Part ID #1Back Enclosure PC
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
12
ComponentsMain Enclosures Side 1
NE Part ID #2Internal Enclosure PC+GF10%
Includes all the antennas
NE Part ID #3Main Enclosures
Co-molded magnesium and PC+GF9% with 5 inserts
NE Part ID #1Back Enclosure PC
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
13
ComponentsMain Enclosures Side 2
42.7 mm 12.3 mm 0.1 mm
MainAntenna Element
Length Width Height
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
14
AntennasMain Antenna
33.7 mm 17.3 mm 0.1 mm
Rx DiversityAntenna Element
Length Width Height
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
15
AntennasRx Diversity
23.0 mm 15.6 mm 0.1 mmLength Width Height
WiFi/Bluetooth/GPSAntenna Element
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
16
AntennasWiFi / Bluetooth / GPS
49.1 mm 34.9 mm 0.1 mm
NFCAntenna Element
Length Width Height
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
17
AntennasNFC
In both the 2015 Deep Dive and Survey Plus reports, ICs and modules will be categorized by their function within the system.
These categories are in alignment with the high-level IC function categories currently found in IRIS 2.0. The categories will also be found in the updated excel BoM workbooks which are included with each report.
RAM, SDRAM, etc.Memory: Volatile
NAND, NOR, EEPROMs, etc.Memory: Non-Volatile
DSPs, MCUs, Mixed-Signal Arrays, (non-audio, non-apps, non-baseband) Processors
Mixed Signal
Accelerometer, Barometer, Heart, MEMS Microphones, Pressure, Temperature
Sensor
Diplexers, RF Antenna, RF antenna switches, RF Filters, RF Power Amplifiers, RF Receivers, RF Transceivers, etc.
RF Component
Audio CODECs, Envelope Tracking, Power ManagementPower Management / Audio
Small logic AND, OR gates, LDOs, Transistors, RegulatorsOther
Components with both non-volatile and volatile memoryMemory: Mixed
Display driver, Touchscreen controller, etc.Display / Touchscreen
Antennas, Bluetooth, GPS, USB, WiFi, ZigBee componentsConnectivity
Image Sensors, Video processors, Image co-processors , VGA Camera
Camera / Image
Cellular Modem ProcessorBaseband Processor
Main Processor without cellular modemApplication Processor
Processors which are both Apps/BB ProcessorsApplications/Baseband Processor
Component Function
RAM, SDRAM, etc.Memory: Volatile
NAND, NOR, EEPROMs, etc.Memory: Non-Volatile
DSPs, MCUs, Mixed-Signal Arrays, (non-audio, non-apps, non-baseband) Processors
Mixed Signal
Accelerometer, Barometer, Heart, MEMS Microphones, Pressure, Temperature
Sensor
Diplexers, RF Antenna, RF antenna switches, RF Filters, RF Power Amplifiers, RF Receivers, RF Transceivers, etc.
RF Component
Audio CODECs, Envelope Tracking, Power ManagementPower Management / Audio
Small logic AND, OR gates, LDOs, Transistors, RegulatorsOther
Components with both non-volatile and volatile memoryMemory: Mixed
Display driver, Touchscreen controller, etc.Display / Touchscreen
Antennas, Bluetooth, GPS, USB, WiFi, ZigBee componentsConnectivity
Image Sensors, Video processors, Image co-processors , VGA Camera
Camera / Image
Cellular Modem ProcessorBaseband Processor
Main Processor without cellular modemApplication Processor
Processors which are both Apps/BB ProcessorsApplications/Baseband Processor
Component Function
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
18
Component Function
This battery was similar to the one found in the Deep Dive report for the Huawei Ascend P7 P7-L05, but the battery of the GX1 has a greater capacity than that of the Ascend P7.
HuaweiHB4547B6EBC
3.8Lithium Polymer
3500112.05 x 45.6 x 4.1
634.953.1
250.5Unknown
Pack Rating (mAHrs)Pack Size (mm)
Pack Weight (grams)
Cell Brand
Vol. Energy Density (mWHrs/cc)
Battery PackPack Brand
Cell Type
Pack Part NumberPack Voltage
Wt. Energy Density (mWHrs/g)
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
19
SubsystemsBattery Summary
Camera / Image
Component Function :
23 - Unknown#Unknown2 MP CMOS Image Sensor
UnknownUnknown
5.9 x 5.9 x 4.155.9 x 5.9 x 4.2
0.20.2
CMOS2 MP1/541
Camera Weight (grams)
Optical Zoom
Resolution
Lens ElementsOptical Size
Part Number
2MP Camera Subsystem
Type
Camera Size (mm)
Brand
Subsystem Size (mm)
Subsystem Weight (grams)
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
20
Subsystems2MP Camera Summary
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
21
Subsystems2MP Camera Disassembly
Camera / Image
Component Function :
22 - Unknown#Unknown8 MP BSI CMOS Image Sensor
UnknownHK0GW4A
8.5 x 8.5 x 5.248.5 x 8.5 x 5.2
0.70.7
CMOS BSI8 MP1/2.7
51
Camera Weight (grams)
Camera Size (mm)Subsystem Weight (grams)
Optical Zoom
Subsystem Size (mm)
Type
8MP Camera Subsystem
Part Number
ResolutionOptical SizeLens Elements
Brand
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
22
Subsystems8 MP Camera Summary
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
23
Subsystems8 MP Camera Disassembly
The Huawei GX1 SC-CL00 includes a 6-in.TFT-LCD w/ Chip-in-Glass display similar to that of the Huawei Ascend Mate 7 MT7-TL00.
However, the GX1 uses Goodix for the touchscreen design win versus Synaptics in the Huawei Mate 7.
20 - Himax#PA543C2TFT-LCD Display Driver
21 - Goodix#GT915LCapacitive Touchscreen Controller w/ Memory (2-Die Pkg.)
Display / Touchscreen
Component Function :
DJN Optronics13-360D3-40032158 x 81.6 x 2.7
49.40View Size (mm) 6.00Type TFT w/Chip-in-GlassColors 16777216Rows / Columns 1280 / 720Backlighting Scheme 14 white LEDs
Brand
Weight (grams)Module Dimensions
Panel Metrics
Part Number
Display / Touchscreen
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
24
SubsystemsDisplay / Touchscreen Summary
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
25
SubsystemsDisplay / Touchscreen Disassembly
Secondary Camera
157.20 mm
Vibrator
66
.45
mm
Home/Volume Button Flex
3.5 mm Jack
microUSB 2.0
Microphone
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
26
Main BoardSide 1
Power Management / Audio
Memory: MixedApplications & Baseband Processor
Component Function:
Other
1 - Qualcomm#MSM8916Snapdragon 410 Baseband / Applications Processor
2 - SK Hynix#H9TQ65A8GTMCUR-KTMMultichip Memory - 1 GB Mobile DDR2-S4 SDRAM, 8 GB MLC NAND Flash, Memory Controller (eMMC)
3 - Qualcomm#PM8916Power Management
10 - Texas Instruments#TPS65132ADual Output Power Supply
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
27
Main Board Side 1 IC Identification
RF ComponentConnectivity
Component Function:
4 - Qualcomm#WTR1605LGSM / CDMA / W-CDMA / LTE / TD-LTE RxD Transceiver + GPS
5 - Qorvo#RF7459AMultimode, Multiband 3G/4G Power Amplifier (4-Die Pkg.)
9 - Murata#XMSS003Dual SPDT (DP4T) Antenna Switch
8 - Skyworks#SKY13373-460LFSP3T RF Switch
7 - Qorvo#RF1494ASP10T Antenna Switch
11 - Airoha Technology#AR8159 ?GPS LNA
6 - Qorvo#RF7941TD-LTE Band 41 Power Amplifier (2-Die Pkg.)
AR8190
? = Unconfirmed
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
28
Main Board Side 1 ICs - Radio
1 - Qualcomm#MSM8916Snapdragon 410 Baseband / Applications ProcessorPkg Size: 14 x 12 mm
Applications/Baseband Processor
Component Function:
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
29
Main BoardSide 1 X-Rays & Die Photos
2 - SK Hynix#H9TQ65A8GTMCUR-KTMMultichip Memory - 1 GB Mobile DDR2-S4 SDRAM, 8 GB MLC NAND Flash, Memory Controller (eMMC)Pkg Size: 13 x 11.45 mm
2.1 – SK Hynix#H53R8D23MMobile LPDDR3 SDRAM Memory - 1 GBDie Size: 9.62 x 8.04 mm
2.2 – SK Hynix#H27UBG8T2CMLC NAND Flash Memory - 4 GBDie Size: 9.46 x 8.61 mm
Memory: Non-VolatileMemory: Volatile
Memory: MixedComponent Function:
Other
2.3 - SK Hynix#SM2714AMemory ControllerDie Size: 3.23 x 1 mm
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
30
Main BoardSide 1 X-Rays & Die Photos
3 - Qualcomm#PM8916Power ManagementPkg Size: 6.15 x 6.15 mm
Power Management / Audio
Component Function:
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
31
Main BoardSide 1 X-Rays & Die Photos
4 - Qualcomm#WTR1605LGSM / CDMA / W-CDMA / LTE / TD-LTE RxD Transceiver + GPSPkg Size: 5.45 x 4.88 mm
RF Components
Component Function:
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
32
Main BoardSide 1 X-Rays & Die Photos
5 - Qorvo#RF7459AMultimode, Multiband 3G/4G Power Amplifier (4-Die Pkg.)Pkg Size: 6.95 x 4.96 mm
5.1 - Qorvo#M3D738901Antenna SwitchDie Size: 1.72 x 0.97 mm
5.4 - Qorvo#M4D745923RF Power AmplifierDie Size: 1.58 x 0.81 mm
5.3 - Qorvo#M2D738887RF Power AmplifierDie Size: 0.89 x 0.78 mm
5.2 - Qorvo#M1D738808RF Power AmplifierDie Size: 1.89 x 0.90 mm
RF Components
Component Function:
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
33
Main BoardSide 1 X-Rays & Die Photos
5.1 - Qorvo#M3D738901Antenna SwitchDie Size: 1.72 x 0.97 mm
5.4 - Qorvo#M4D745923RF Power AmplifierDie Size: 1.58 x 0.81 mm
5.3 - Qorvo#M2D738887RF Power AmplifierDie Size: 0.89 x 0.78 mm
5.2 - Qorvo#M1D738808RF Power AmplifierDie Size: 1.89 x 0.90 mm
5 - Qorvo#RF7459AMultimode, Multiband 3G/4G Power Amplifier (4-Die Pkg.)Pkg Size: 6.95 x 4.96 mm
RF ComponentsComponent Function:
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
34
Main BoardSide 1 X-Rays & Die Photos
6.1 - Qorvo#M1D794151RF Power AmplifierDie Size: 0.81 x 0.81 mm
6.2 - Qorvo#M2D794104Bias ControlDie Size: 0.48 x 0.44 mm
RF ComponentsComponent Function:6 - Qorvo
#RF7941TD-LTE Band 41 Power Amplifier (2-Die Pkg.)Pkg size: 2.5 x 2 mm
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
35
Main BoardSide 1 X-Rays & Die Photos
6.1 - Qorvo#M1D794151RF Power AmplifierDie Size: 0.81 x 0.81 mm
6.2 - Qorvo#M2D794104Bias ControlDie Size: 0.48 x 0.44 mm
RF ComponentsComponent Function:6 – Qorvo
#RF7941TD-LTE Band 41 Power Amplifier (2-Die Pkg.)Pkg size: 2.5 x 2 mm
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
36
Main BoardSide 1 X-Rays & Die Photos
Grid = 1 cmRF ComponentConnectivity
Function :
1 - Murata#SAFFB1G84FL0F0AFilter: SAW - LTE Band 3 Rx
2 - Murata#SAFFB2G14FA0F0AFilter: SAW – W-CDMA Band 1 Rx
7 - Murata#SAFEA2G60MA0F0AFilter: SAW - TD-LTE Band 41 Tx
14 - Unknown#UnknownFilter: Balun
10 - Murata#SAFFB1G56KB0F0AFilter: SAW - GPS
3 - Murata#SAFFB1G56FA0F0AFilter: SAW - GPS
11 – TDK-Epcos#B9604Filter: BAW - WiFi / BT
13 - Unknown#UnknownFilter: Diplexer
14 - Unknown#UnknownFilter: Balun
4 - Murata#SAFEL942MFL0F00Filter: SAW - GSM 900 Rx
7 - Murata#SAFEA2G60MA0F0AFilter: SAW - TD-LTE Band 41 Tx
12 - Unknown#UnknownRF Coupler
6 - Murata#SAYRF1G88CA0B0AFilter: SAW - Duplexer - CDMA Band 2
8 - Wisol#SFXG50UZ502Filter: SAW - Duplexer - CDMA Band 1
9 - Wisol#UnknownFilter: SAW - Duplexer - CDMA 800
5 - Murata#SAYFH1G74CA0B0AFilter: SAW - Duplexer - LTE Band 3
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
37
Main BoardSide 1 Modules - Radio
157.20 mm6
6.4
5m
m
microSD
Primary Camera NFC Antenna
Main Antenna
Battery
Rx Diversity Antenna
Touchscreen
Display
Sensor Flex
WiFi/Bluetooth/GPS Antenna
SIM 1
SIM 2 (only GSM)
Microphone
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
38
Main BoardSide 2
Power Management / Audio
Component Function:Other
15 - AWINIC#AW8145Audio Amplifier
16 - Orient-Chip Semiconductor#OCP81311.5 A White LEDs Flash Driver
? = Unconfirmed
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
39
Main BoardSide 2 IC Identification
ConnectivityComponent Function: 12 - Qualcomm Atheros
#WCN3620WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio
13 - Broadcom#BCM20795NFC Controller w/ EEPROM Memory (2-Die Pkg.)
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
40
Main BoardSide 2 ICs - Radio
Sensor
Component Function:
14 - Bosch Sensortec#BMA250E3-Axis MEMS Accelerometer (2-Die Pkg.)
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
41
Main BoardSide 2 ICs - Sensors
12 - Qualcomm Atheros#WCN3620WiFi 802.11b/g/n / Bluetooth 4.0 / FM RadioPkg size: 3.54 x 3.3 mm
ConnectivityComponent Function:
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
42
Main BoardSide 2 X-Rays & Die Photos
SensorComponent Function :
19 - AMS#TMD2771xAmbient Light / Proximity Sensor, IR Emitter LED
EarpieceEarpiece
Speaker
Main Board
Speaker
Main Board
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
43
Other SubstratesSensor Flex
COST ESTIMATION PROCESSOverview and Discussion
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.
Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
44
Overview & Discussion
MetricsOverview and Discussion
In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets.
Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology.Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic.Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
45
Overview & Discussion
RevisionsOverview and Discussion
Periodically we will make revisions to these reports. In the event a revision is made, the information below may be referenced as a summary of the changes which were made.
Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report
Front Page
46
Overview & Discussion