1
CHAPTER 14Quality control and environmental activities
2 Environmental activities
1-1 Quality control system1-2 Product reliability1-3 For your safety
1 Quality control
2
Quality control and environmental activities
Quality control1.
Opto-semiconductor products from Hamamatsu Photonics
are used in a wide range of fields including medical diagnosis,
measurement, industrial instrumentation, automobiles,
information equipment, general electronics, and academic
research. As their product applications expand, demands for
even higher product quality and reliability are increasing.
To meet these marketplace demands, we are actively taking
measures to improve product quality levels.
1 - 1 Quality control system
Quality policy
Our policy at the Solid State Division of Hamamatsu
Photonics is to “take responsibility as an opto-semiconductor
manufacturer to establish a quality control system that
provides products the customer needs and to contribute to
the progress of industry and science.” To achieve this policy,
we are making continuous efforts to supply products that
are even better, cheaper, faster, and gentle on the earth to
satisfy customers.
Quality standardization
The Solid State Division employs the ISO 9001 Quality
Management System to standardize quality. In this system,
items that are basic requirements are formalized in a “Quality
Manual” and rules for design, materials, manufacture,
inspection, shipping, and equipment management are placed
in document form as “Standards” to create a consistent
quality assurance system.
Figure 1-1 shows a quality assurance chart.
[Figure 1-1] Quality assurance chart
Customer Divisionmanager
Design,developmentSales InspectionManufacture Quality
control Purchasing Shipment Supplier
Education, trainingSales/equipment/human resource planningBusiness policy
Quality objectives
Product commercialization reviewNew product
needs
Order
OKOK
OK
OK
No Good
Delivery
Receiveorder
Productionplanning
Production Calibration
Acceptance AnswerCustomer
satisfaction
Purchasing Material manufacture
SubcontractingIncoming
Supplier registrationMaterial registration
Quality policyMarketing research
Customproducts
Design plan
Catalog product proposalQua
lity
syst
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Com
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prov
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Man
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Approval
Practical test Inspection
Inspection
Receiving inspection
Reliability test
Quality manual, division procedures, document control
Product design
Design review
Prototype
Design verification
Pilot first sample,first product manufacturing
Design validation
Standard procedures, initial production control planning
Product authorization
Nonconformingproduct control
Product storage
Shipment
ConfirmationComplaint Reception
Root cause investigation, recurrence prevention
ReportCustomer
satisfaction report
Corrective/preventive action
Internal quality audits
ISO committee ISO promotion meeting QC meeting PQC meeting
Evaluation of the quality objectives
KOTHC032EC
Design and development
On the basis of the requirements from our customers
and marketplace, we start investigating the possibility of
production in terms of a new or custom-order product’s
functions, reliability, cost, and so forth.
(1) Input to design and development
We verify the requirements of our customers and marketplace;
outline the functions, performance, applicable regulations,
and the like; and document the information.
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(2) Output from design and development
The designers outline appropriate information regarding
the input requirements, purchasing, and production
as well as safety and environmental requirements and
create an output document.
(3) Design review
The output from design and development is reviewed to
determine whether the input requirements can be satisfied.
(4) Design and development verification
The output from design and development is inspected
to ensure that the input requirements can be satisfied.
This is conducted in the prototype stage of product
development.
(5) Design and development validity verification
The validity of design and development is verified to
ensure that the product meets the requirements of the
intended application. This includes reliability tests. This
is conducted in the mass production stage of product
development.
(6) Product authorization
Meetings to discuss design (e.g., product specifications),
process (manufacturing and inspection), product (reliability),
and purchasing (subcontractors and suppliers) are held,
and then the product is authorized.
Process management
The production process is supervised based on QC process
charts and work standards to ensure that quality and
reliability are at levels planned in the product design. Main
production processes for opto-semiconductors include
oxidation, photolithography, ion implantation, diffusion,
electrode-forming, and etching in the front end process
(wafer process), as well as wafer dicing, die bonding, wire
bonding, and sealing in the back end process (assembly
process).
To verify that the products meet the required specifications,
Hamamatsu performs process inspections and product
inspections that check the product electrical/optical
characteristics and external appearance. The inspection
items, methods, and test criteria are established in the
product specifications. Destructive testing and lot evaluations
are done by product sampling inspections.
Control to prevent contamination of light receiving/emitting
surfaces is essential for opto-semiconductor products. The
packing process requires use of special packing materials
and techniques to safeguard light receiving/emitting surfaces
from contamination as well as countermeasures to vibration,
impact, temperature/humidity, and electrostatic charges.
Table 1-1 shows a QC process chart example.
Evaluation is made on statistical process control (SPC)
using control charts and the like to determine whether a
process is stable or is in a controlled state as well as process
capabilities. If the control chart indicates an abnormal
tendency or if the process capabilities are insufficient,
the cause of the problem is investigated and fed back to
maintain and improve the relevant process.
Process Control item MethodDocument
No. Symbol Work name Device/condition, item Measuring device, sample Sample size, frequency Record
11-1
Material acceptanceWafer Resistivity, thickness
AppearanceCheckVisual check
Each timeAll wafers
Acceptance inspection sheet Purchasing specificationWork procedure
1-2 Lead frame DimensionsAppearancePlating thickness
MicroscopeVisual checkThickness gauge
1 frame/lot1 frame/lot3 frames/lot
Acceptance inspection sheet Inspection procedure
1-3 Mold resin Characteristics Check When materials are delivered
Purchasing specification
22-1
Wafer processOxidation
Oxidation furnaceTemperature, time
Wafer appearance 1Color, uniformity
Wafer appearance 2SiO2 thickness
Check
Visual check
Thickness gauge
Each time
All wafers
1 wafer/lot
Run sheetWork logbook
Work procedureWafer processManufacturing specification
2-2 Photolithographic work PhotomaskWafer appearance 3
Pattern conditionPattern accuracy, pattern defect
Check
MicroscopeMicroscope
Each time
3 wafers/carrier3 wafers/carrier
Run sheetWork logbook
Work procedureWafer processManufacturing specification
[Table 1-1] QC process chart example (part of process)
4-4
4-2
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Dealing with process errors
Figure 1-2 shows a system chart for error handling.
[Figure 1-2] System chart for error handling
Fault finder
Confirm details at location and on items
Supervisor Quality control Correctiveaction dept. Purchasing Supplier
Trouble report
Action needed?
Where problemoccurred?
CloseNo
YesIn-house process
Not in-houseprocess
In-house
Supplier
Corrective actioninstruction
Close
Trouble investigationrequest form
Confirmation Corrective actioninstruction
Correctiveaction
Confirmation
Correctiveaction
Recurrenceprevention check
Conf
irmati
onPr
ogre
ss/
coun
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easu
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heck
KOTHC0029EA
When a problem occurs in the production process, which
might cause defects that exceed preset process standards
or might adversely affect the product quality, then the
problematic lot is immediately identified and separated
from other semi-finished parts. At the same time, the cause
of the problem is investigated, and the corrective action
that should be taken is decided. Along with confirming the
corrective action was effective, we take measures to prevent
the problem from reoccurring.
Equipment and work environment management
The work environment in the manufacturing process
greatly affects product quality and reliability of opto-
semiconductor products. Cleanliness, temperature, and
humidity in particular must be strictly controlled. Opto-
semiconductors are produced in clean rooms where
cleanliness is controlled at a high level. To maintain
and control the cleanliness level in clean rooms, strict
control standards are established for factors such as
cleanliness, entry/exit methods, work clothing, carry-in
items, and work procedures. Damage caused by electro-
static discharge (ESD) can be a serious problem as
process geometry shrink and diverse packages become
available, so electrostatic countermeasures are enforced.
The department dealing with products requiring
ESD countermeasures sets up special areas that must
comply with ESD control standards and gives workers
instructions in equipment and work site supervision,
work clothing, and handling methods.
Production equipment is verified after modifications or
expansions and also given regular maintenance. Specific
methods for making start-up and periodic equipment
inspections are established to perform preventive
maintenance, and constant efforts are made to prevent
quality problems and keep stable production.
Product identification and traceability
To establish traceability for determining the production
lot and material lot for the individual products delivered
to our customers, records of each process contain columns
for entering used materials, devices, and production
information. These records are stored securely as product
history information.
When necessary, as shown in the following example, the
type number, production year and month, production serial
number, and so on are indicated on the product.
• Example
S1234 3A 001Serial numberProduction month (alphabetical order... Jan: A, Feb: B, Dec: L)Production year (last digit of year)Type number
Purchasing management
Purchasing management of parts and materials has a large
effect on product quality, so we use a system that judges
and then registers both the suppliers and the parts and
materials for purchasing.
We carry out an inspection of the suppliers to check
compliance with the quality system, environment system,
green purchasing policy, business continuity capability, and
other factors. We then register those suppliers who meet
our standards and also make new and periodic supplier
audits mainly by the purchasing, quality control, and design
departments.
The semiconductor wafers, electrode materials, chemicals,
gases, and the like used to produce opto-semiconductor
products must be of high purity and high quality. The metal
and ceramic materials, printed circuit boards, and mold
resin used for packages must be of high precision and high
quality. These types of purchased items undergo strict
individual testing and are then registered before they can
be used in our products.
An incoming inspection of those purchased items is then
made based on the required specifications to verify their
quality. After acceptance, these purchased items are stored
in properly controlled locations that meet storage conditions
specified in the design standards, and a high level of
purchased item quality is maintained [Figure 1-3].
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[Figure 1-3] Purchasing control chart
Fault investigation request
Examination, acceptance
Acceptance inspection
Supplier evaluation report
Improvement plan
Design Quality control Purchasing/subcontractor management Supplier
New supplier application New supplier
Supplier registrationRequest for decision (internal memo)
Material registration application
Outsourcing application
Site investigation
Confirmation of contents Material registration Delivery specifications and drawings
QC process chart
EstimateSDS
Purchasing specificationsand the like
Preliminary survey sheet for environmentalcontrolled substances
Acceptance inspection standardsRoHS substances analysis report
High-risk material registration application
Supp
lier r
egist
ratio
nPu
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info
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Purc
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Purchasing request Order form Material, subcontracting
InvoiceInspection sheet
JudgmentNo Good
RankOther than A
A
Cause investigation
Solution response
Material specialacceptance application
Investigation, answer
Investigation, answer Material special acceptance control form
Material change application
Response Acceptance
Material change or cancellation application
Material change or cancellation Initial product, special acceptance form
Rank Amount of annual business
Basic business contractQuality assurance agreement
QC check sheetsupplier environmental
investigation report
Organization chartQuality assurance
system chartMonthly purchasing report ISO registration
certificateSite investigation plan,
result report
Site investigation
Site investigation report
Evaluation Improvement activitiesNo Good
B
S∙A
KOTHC0039EC
Measurement management
To perform product inspection accurately, a system
(traceability) to ensure the accuracy of measuring equipment
is implemented. Calibrators for calibrating the measuring
equipment are traceable to national standards through
measuring equipment manufacturers, public organizations,
or standard equipment in Hamamatsu Product Management
Division. In addition, inspection equipment and standard
elements are traceable to measuring equipment [Figure 1-4].
Furthermore, in addition to calibration, start-up inspections
and periodic inspections are made to detect and prevent
degradation in accuracy and malfunction in measuring
equipment and inspection equipment.
[Figure 1-4] Measuring equipment traceability
Solid State DivisionQuality control
Product managementdivision
National standardPublic calibration laboratory
Corporation calibration laboratory
Other calibrationlaboratory
Calibrator
Solid State DivisionManufacturing dept.
Measuringequipment
ProductsCustomer
Standards
Private calibration laboratory Measuring equipment manufacturer
Japan Electric Meters Inspection Corporation
AIST, NIST*
Measuring equipment standards, calibrator
Calibrator
Measuring equipment
Products
Inspection equipment, standard element
* AIST: National Institute of Advanced Industrial Science and Technology (Japan) NIST: National Institute of Standards and Technology (U.S.)
KOTHC0033EB
[Figure 1-5] Measuring equipment inspection example (for photodiode)
→Calibration
Standard (calibrator) Measuring equipment (source meter)
Periodic inspection
Inspection equipment made by Hamamatsu(photodiode measuring device)
Standard element(photodiode)
→←Start-up
inspection
[Figure 1-6] Calibration certificate example of calibrator
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Change control
Changes such as in designs, purchased items, production
methods, and equipment are made in order to improve
product quality, function, reliability, and productivity.
Change planning is first drawn up, the job schedule from
change setup to completion is clarified, and the planning
is then finalized at a change conference attended by all
related departments including quality control. Finally,
the change is decided after evaluating the effects on
quality, reliability, productivity, etc. Changes requiring
the customer’s approval in advance are implemented
after obtaining the customer’s consent. Initial production
control is performed as needed and a final check made of
all effects caused by the change [Figure 1-7].
[Figure 1-7] Change control chart
Close
Follow-up
First sample confirmationCustomerconfirmation First sample control/initial production control
Change implementation
Revised standards
Change decision
Confirmation of customer’schange decisionCustomer evaluation
Customeragreement
Needed
Not needed
Issue of changeapplication formChange application
ConfirmationConfirmation Change application
Design verification/validation
Change meetingChange proposalCustomerconfirmation
NeededNot needed
Change planning formChangemeeting
Change proposal
Related sectionsSection initiating changeQuality controlSalesCustomer
KOTHC0026EB
Complaint handling
At Hamamatsu we work to speedily resolve customer
complaints by way of our complaint handling system.
The contents of the complaint are first checked, and an
investigation made to find the cause. Besides notifying the
customer of these results, we also use them as feedback in
the design and production processes to prevent a recurrence
of the trouble. If we decide, based on those investigation
results, that the quality control system must be overhauled,
then corrective action is taken and results from that action
are verified [Figure 1-8].
[Figure 1-8] Complaint action chart
Customer
Complaint
SalesCorrespondence section,
related section(design, manufacture)
Quality controlDivision manager,the responsibilityof a management
Quality judgment/correlativity investigation/making first report
Minor
ReportFirst report
Contents confirmed
HPKresponsible
ReceptionInformationconfirmationReturned product
action form
Returned product action ledger recorded
Put on thearticle card
Qualityinfluencereport ofproducts
Report
Yes
Customer complaintlevel
Specific within the range of object/enclosure
Inspection under the reproducibility conditions
Examination and confirmation of correspondence(survey result and nonconforming circumstances)
Examination and confirmation of correspondence(cause and reproducibility)
Plan of applicable products disposed/countermeasures implemented
Nonconforming products investigation report (8D report)
Investigation report
Approval/agreementReportApproval
No Good
OK
No Good
OK
Applicable products disposed/countermeasures implemented
Returned product action ledger recorded
Corrective/preventive
action
Corrective & preventive action indicating form
Follow-upCorrective & preventive action
Close Approval
Not needed
Needed
Critical, major
“Critical” & “Major”: needed “Minor”: if necessaryComplaint ac tion meeting
No
Directions
KOTHC0028ED
Instruction and training
The Solid State Division provides worker instruction and
training as an active promotion to maintain and improve
product quality as well as upgrade employee skills. Employee
skills are periodically reviewed, and instruction/training
plans are then drawn up and performed as needed. When a
particular job requires obtaining qualifications, then those
are clearly specified, and a system is then set up to certify
employees who meet the requirements of the job.
The types of instruction span many areas including new
employee education, on-the-job training, and safety and
health instruction. Positive efforts are also made to collect
information outside our company in order to upgrade
employee knowledge and skills.
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1 - 2 Product reliability
Reliability
(1) Definition of reliability
In the Glossary of Terms Used in Reliability of JIS, reliability
is defined as “the capability of an item to perform a required
function under specified conditions for a specified period
of time.” We define the term as “the capability to withstand
operation under the customer’s usage environment over the
warranty period (or longer than the warranty period).”
(2) Failure region of opto-semiconductor products
The failure region of opto-semiconductor product can be
divided into initial failure, random failure, and wear-out
failure. The curve indicating the change in each failure
rate over time is called a bathtub curve.
[Figure 1-9] Bathtub curve example
Initial failure
Time
Failu
re r
ate
Random failureWear-outfailure
KOTHB0013EA
• Initial failure
Initial failures occur at a relatively early period after starting
the use of a product. It is caused by a design or manufacturing
defect, incompatible usage environment, and so on. Initial
failure rate decreases as time passes. Screening inspections
before shipment can eliminate devices exhibiting initial
failures and thereby improve the initial failure rate in the
market place.
• Random failure
As the name suggests, random failures occur randomly
after the initial failure period but before the wear-out failure
period. Failures occur sporadically, and the failure rate is
nearly constant but never zero.
• Wear-out failure
Wear-out failures increase as time passes due to fatigue,
wear, deterioration, and so on. Examples of wear-out failures
in opto-semiconductor products are electromigration,
wire breakage due to repetitive temperature changes, and
sensitivity deterioration due to ultraviolet light and X-ray
exposure.
(3) Reliability testing
We make reliability tests to verify that a product meets the
specified reliability requirements. In reliability testing for
product authorization, long-term stress tests are performed to
verify that wear-out failures do not occur under the assumed
usage environment and within the assumed usage period.
Reliability tests are performed by selecting typical products
from among a group of structurally similar products. If
needed, this testing is performed individually. For a portion
of mass-produced products, to verify that the quality set
at the development stage is maintained even after mass
production, mass-produced products are sampled and
subjected to reliability tests once a year. Reliability test
methods conform to JIS, JEITA, IEC, MIL standards, and
the like. Some products are also tested according to their
product application. For example, optical communication
devices are tested according to the Telcordia GR-468
standards. Products including automotive devices are also
subjected to testing specified by the customer.
Table 1-2 shows typical reliability tests.
(4) Lifetime prediction
Wear-out failure data obtained through reliability testing can
be used to determine the cumulative failure rate over time.
By taking into account logarithmic-normal-distribution,
Weibull-distribution, and acceleration factor of reliability
testing, one can calculate the activation energy that leads to
specific wear-out failures and predict the length of time to
reach the cumulative failure rate reference (wear-out failure
lifetime).
[Figure 1-10] Failure rate prediction using Weibull plot
Time (h)
Cum
ulat
ive
failu
re r
ate
(%)
0.1100 100001000 100000
90
50
10
1
Accelerationtest failure rate
Predictedfailure rate
× Acceleration factor
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Failure analysis
Failure analysis is a way of investigating the cause of failure
and the mechanism that leads to the failure by researching
the failure that occurred in the manufacturing process,
marketplace, etc. The facts that are revealed through this
activity are fed back to design and manufacturing to prevent
the same failure from reoccurring [Figure 1-11].
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[Figure 1-11] Flow chart of typical failure analysis
Feedback
Cross section observation: focused ion beamFront side peeling observation: electron microscope and the likeElemental analysis: EDX and the like
Determination of the root cause andmechanism of problem (estimation)
Light emission observation: emission microscopeOBIRCH observation: IR-OBIRCH microscopeFront side observation: optical microscope and the like
Determination of failure location
Electrical characteristics measurement: semiconductor parameter analyzer and the likeAppearance observation: optical microscope and the like
Verification of the failure phenomenon
Collection of failure data
Failure occurrence
KOTHC0066EA
Failure analysis examples
(1) Leakage between terminals
Side face observation: reaction areas verified with an
IR-OBIRCH microscope
Test item Test condition examples Test standards
Life test
High-temperature storage Maximum storage temperature Tstg max., 1000 hours EIAJ ED-4701/200 201
Low-temperature storage Minimum storage temperature Tstg min., 1000 hours EIAJ ED-4701/200 202
High-temperature & high-humidity storage 85 °C, 85%, 1000 hours EIAJ ED-4701/100 103
High-temperature operation Maximum operating temperature Topr max., operating conditions: depends on individual specs, test time: 1000 hours EIAJ ED-4701/100 101
Low-temperature operation Minimum operating temperature Topr min., operating conditions: depends on individual specs, test time: 1000 hours EIAJ ED-4701/100 101
High-temperature & high-humidity operation
85 °C, 85%, operating conditions: depends on individual specs, test time: 1000 hours EIAJ ED-4701/100 102
Unsaturated steam pressurization 120 °C, 85%, 170 kPa, 96 hours EIAJ ED-4701/100 103
Temperature cycle Maximum storage temperature Tstg max., 30 minutes, minimum storage temperature Tstg min., 30 minutes, 100 cycles EIAJ ED-4701/100 105
X-ray irradiation Output tube voltage: 100 kV, 1 million roentgen -
UV light irradiationHg light 253.7 nm, 1000 hours
-D2 light 200 nm to 400 nm, 1000 hours
Strength test
Terminal strength
Pulling A load is imposed for 10 seconds.
EIAJ ED-4701/400 401Twisting A lead is bent 90° and rotated.
Bending A lead is bent 90° with a load applied, and is then bent back.
Vibration100 Hz to 2000 Hz, acceleration: 200 m/s2
sweep time (100 Hz to 2000 Hz to 100 Hz): 4 minutessweep direction: 3 directions of X, Y and Z, 4 times each
EIAJ ED-4701/400 403
ShockMaximum acceleration: 15000 m/s2, pulse width: 0.5 msshock direction: 4 directions of X1, (X2), Y1, Y2, Z1, (Z2), 3 times each
EIAJ ED-4701/400 404
SolderabilityAccelerated aging Steam, 4 hours
EIAJ ED-4701/300 303Lead free
Soldering by hand: 245 °C, 2 secondsReflow: 225 °C or higher (235 °C peak), 20 seconds JIS C60068-2-58
Resistance to soldering heat
Other than surface mount type 260 °C, 10 seconds EIAJ ED-4701/300 302
Surface mount type
Preprocess: JEDEC Level 5a (30 °C, 60%, 48 hours) to Level 1 (85 °C, 85%, 168 hours)
JEDEC J-STD-020Lead free: solder heating process, 3 times, 235 °C or higher (240 °C peak), 30 seconds
Electrostatic breakdown C=100 pF, R=1.5 kΩ, applied voltage: ±1 kV, number of times: 1 EIAJ ED-4701/300 304
Thermal shock 100 °C to 0 °C, 10 times EIAJ ED-4701/300 307
Transportation temperature cycle -40 °C to +70 °C, 5 times JIS C60721-3-2
Other Resistance to solvents Solvent type: isopropyl alcohol, dipping time: 5 minutes, rubbing: 5 strokes in both directions EIAJ ED-4701/500 501
Note: Please contact us for information on reliability test for individual products.
[Table 1-2] Reliability test examples
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Cross section observation: cracks verified in the TSV
insulation film (electron microscope; cross section
polisher)
Crack Crack
→ Feedback: insulation film modification, structural
improvement
(2) IC short circuit
Back side observation: abnormal signals verified with
an IR-OBIRCH microscope
Front side observation (after film peeling): foreign
substance verified in the abnormal signal area with an
optical microscope
Cross section observation: foreign substance shorting
the terminals is discovered
(focused ion beam; Fe·Cr detected from the foreign
substance through elemental analysis)
→ Feedback: complete particle control, inspection
method enhancement
1 - 3 For your safety
Handling precautions
Products must be stored and used under the conditions
specified in the delivery specification sheets. If these
conditions are not met, problems such as oxidation and
contamination of leads and packages absorbing moisture
may occur. When using our products in your products, be
sure to agree to the delivery specification sheet.
Depending on the product, precautions specific to the product
may be present in addition to general precautions. As such
details are provided in the operation manual supplied with
the product, be sure to read it.
Table 1-3 shows an example of the handling precautions of
opto-semiconductor products.
Examples of problems that have occurred due to inappropriate handling
(1) Examples of problems caused by external force
Damage to metal wiring
Examples in which the metal wiring on a bare chip is
damaged due to physical contact
Damage to sensor package
An example in which an inappropriate heatsink coupling
(e.g., improper viscosity or nonuniform grease or screws
tightened too strong) causes excessive load to be applied
to the sensor’s heat dissipation section and damages the
bonded area of the ceramic and heat dissipating sections
Ceramic area
Heat dissipation area
Cracked chip caused by external force
An example in which a strong external force applied to
the scintillator on the chip cracks the chip
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Damage to the image sensor scintillator
An example in which the surface of the scintillator on
a chip is damaged due to physical contact with a jig or
other tool, causing adverse effects on the captured image
Scintillator damage Captured image
Broken cable of a sensor with a cable
An example in which the cable breaks due to long-term
use and repeated bending
X-ray photo of the circled area
(2) Examples of problems caused by the environment
Resin peeling caused by moisture absorption
An example in which the resin peels off the chip surface
due to moisture absorption by the package resin during
soldering, causing degradation in sensitivity due to the
increased reflectance from the photosensitive area surface
caused by the peeling
Sensitivity degradation caused by blemishes on the
package surface
An example in which the sensitivity degrades due to the
reduced light transmittance caused by soot adhering to
the package surface of a photosensor used to monitor
the flames in a boiler
Type Handling precautions Product examples
Metal, ceramicplastic package product
Electrical and optical characteristics may deteriorate if dust, contamination, or scratches are on the product. When handling the product, remember to work in a clean place, not apply strong friction to the window material, and use tweezers and/or gloves. Product deterioration is especially faster at high temperature and humidity than at normal temperature and humidity. Avoid storage or usage in an unnecessary high temperature and humidity environment.
Standard Si photodiodePhoto IC
Bare chip
Storage conditionsUnopened product: temperature: 15 °C to 35 °C, humidity: 45% to 75%, up to 3 monthsOpened product: temperature: 15 °C to 35 °C, humidity: 5% or less, up to 20 days Open the bag and mount the product in a clean room (class 10000 or better). Be careful not to physically damage or contaminate the chip, and exercise extreme caution when handling.
Evaluate and verify the effects of your mounting method and packaging material on the reliability.
Chip product
Unsealed product
Storage conditionsUnopened product: temperature: 15 °C to 35 °C, humidity: 45% to 75%, up to 3 monthsOpened product: temperature: 15 °C to 35 °C, storage in a low-humidity desiccator (no condensation), up to 3 months Open the bag and mount the product in a clean room (class 10000 or better). Be careful not to physically damage or contaminate the chip, and exercise extreme caution when handling.
Do not make contact with wiring. As a general rule, use an air blower to remove contamination. Pay attention to contamination and condensation when sealing or bonding a scintillator. When soldering, pay attention to the solder iron tip temperature, soldering time, and splashing fl ux.
Windowless product
TE-cooled type
Pay attention to prevent wiring errors to thermoelectric coolers or thermistors as errors can damage the devices. Do not use the devices at current or power exceeding their ratings.
Use heatsink with sufficient heat dissipation capacity for cooling. Keep the thermal resistance between the element and heatsink as small as possible (use heat dissipation sheets or silicon grease).
Product with built-in thermoelectric cooler
Electrostatic sensitive type
Apply measures to workplace and facilities according to the extent of deterioration that may occur. Such measures include using a conductive mat and grounding the equipment.
When handling the product, apply measures according to the extent of deterioration that may occur. Such measures include using an ionizer to remove static electricity and wearing a grounded wrist strap.
Compound semiconductorImage sensor
For UV light and X-raymeasurement
Avoid unnecessary exposure to UV light or X-rays as long-term exposure to them cause deterioration (e.g., increased dark current and sensitivity deterioration) in the product characteristics.
Radiation detectorX-ray image sensorFlat panel sensor
[Table 1-3] Handling precaution examples
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Sensitivity degradation caused by high-energy UV light
An example in which the sensitivity of the light incident
area degrades as a result of KrF excimer laser striking and
damaging the Shottky film
[Figure 1-12] Sensitivity uniformity (Schottky type photodiode)
Position (mm)
Out
put
curr
ent
(nA)
Before UV light irradiation
KrF excimer laser (λ=248 nm) irradiation area
After UV light irradiation
0 2 4 6 8 100
160
140
120
100
80
60
40
20
12
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Environmental activities2.
Environmental idea
Recognizing that living in harmony with the global
environment is a critical issue for mankind, the Solid State
Division of Hamamatsu Photonics conducts business with
consideration to environmental conservation, and works
to create new scientific fields and new industries and to
show the road to true human health through research into
photonics technology and extending its application.
Environmental policy
The Solid State Division is conducting environmental
activities in compliance with the following environmental
policy.
Establish an environmental management system to
promote conservation of the earth’s environment by
setting up and maintaining an internal organization for
environmental protection.
Assess the impact on the environment by our activities,
products and services, set environmental objectives and
goals, review our environmental preservation activities
through environmental audits, and constantly improve
our environmental management.
Comply with environmental regulations and other
requirements we have accepted and impose our own
voluntary standards as necessary, to reduce the burden
on the environment.
Take preventative measures for curbing environmental
pollution, save energy and resources, reduce waste, and
ensure correct usage of chemical substances.
Strive to raise the understanding of the environmental
policy and the awareness of environmental issues among
all our employees through education and an in-house
publication about the environment.
Standardizing environmental management
The Solid State Division is implementing the ISO 14001
Environmental Management System and making continuous
improvements to provide proper environmental management
and reduce environmental risks.
Environmental auditing
To maintain and improve our environment management
system, we carry out external audits conducted by certification
bodies and internal audits conducted by the Solid State
Division on a regular basis.
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Activities to reduce environmental risks
The Solid State Division constantly makes improvements
that takes into account the burden on the living environment
including the atmosphere, water quality, and noise and
strives to prevent environmental pollution.
Emergency response training
The Solid State Division furnishes manuals for handling
accidents and disasters and regularly performs emergency
training according to each department’s business operation.
Environmental impact of business activities
We assess the impact on the environment by our business
activities and engages to reduce greenhouse gas, drainage,
waste, and other burden placed on the environment.
Addressing environmental issues through products
We work to make our products more compact, power
efficient, long lasting, energy efficient, and so on according
to their applications so that the burden placed on the
environment is reduced.
(1) Products contributing to the environment
Hamamatsu manufactures products that contribute to
environmental measurement of atmosphere, water quality,
and the like, content analysis of environmental management
substances, and energy reduction of ordinary electric
equipment.
Example: Infrared detectors
Infrared detectors are used to measure the absorption
peak specific to a gas in order to measure its type and
concentration. Our products are used in the greenhouse
gases observing satellite “Ibuki” (GOSAT).
[Figure 2-1] Greenhouse gases observing satellite “Ibuki”
(Courtesy of JAXA)
[Figure 2-2] Infrared detectors used in greenhouse gases observing satellite “Ibuki”
(a) InGaAs PIN photodiode (b) InGaAs linear image sensor
(2) Environmentally conscious products
As part of our global environmental conservation efforts
and reduction of burden on the environment, we apply
environmental measures on the products, develop new
products and new technologies, and promote the sales of
environmentally conscious products.
Example: CCD area image sensor S12071
With CCD area image sensor S12071, dark current noise
has been suppressed to 1/20 of that in previous products.
This has allowed the cooling temperature of the built-in
thermoelectric cooler to be increased, which has reduced
the power consumption to 1/7 of that in previous products.
Moreover, the incorporation of new packaging technology
has significantly increased the air tightness and moisture
proof reliability and prolonged the service life of the product.
[Figure 2-3] CCD area image sensor S12071
[Figure 2-4] Power consumption of built-in thermoelectric cooler
Pow
er c
onsu
mpt
ion
(W)
Previous product(Td=-10 °C)
8.2
1.2
1/7
Improved product S12071(Td=0 °C)
KMPDB0396EA
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Conforming to regulations regarding the chemicals contained in our products
Hamamatsu Photonics has established an “Environmental
Control Substance Management Standard” to control the
chemical substances contained in products. We are actively
engaged in complying with the EU RoHS directives and
regulations on chemical substances contained in products.
(1) Chemical substances regulated by RoHS
For each product, we control the amount of substances that
are specified in IEC62474 including the six substances (lead,
mercury, cadmium, hexavalent chromium, polybrominated
biphenyl, and polybrominated diphenyl ether) regulated by
RoHS directives.
Judgment on whether a product will comply with RoHS
directives is clearly specified in the quotation sheet when
drawing up an estimate.
(2) Management of high-risk materials
When there is possibility that a material may contain an
environmental management substance, we determine
that material as a high-risk material and inspect it using
an X-ray fluorescence analyzer during the acceptance test.
Green purchasing
To comply with environmental regulations on products
and minimize the burden on the environment, we at the
Solid State Division have established green procurement
policies and chemical substance management standards,
and are promoting procurement activities that give priority
to materials with a smaller load on the environment.
Working toward global environmental conservation
At the Solid State Division we conduct environmental
activities for global environmental conservation.
(1) Management of chemical substance usage quantity
If chemical substances are not properly managed,
environmental pollution can result and may cause adverse
effects on human health and ecosystem. At the Solid State
Division we accurately monitor and strictly control the
emission levels of chemical substance into the atmosphere
and water and the amount of movement of waste and so
forth.
Examples
· Management of usage quantity of chemical substances
subject to the PRTR Law
· Collection of SDS information and disclosure within our
company
· Activities to reduce VOC emissions
(2) Waste reduction, separation, and recycling
From the standpoint of reducing the burden on the
environment and using resources effectively, the Solid
State Division is promoting 3Rs (reduce, reuse, and recycle)
and proper treatment as its fundamental policies and is
engaged in activities under the slogan “Zero Emission.” In
addition, to enforce separation of waste produced, a waste
separation database has been established and is running
on our company’s intranet.
(3) Energy saving and reduction of carbon-dioxide emissions
We at the Solid State Division are expanding our energy
saving activities in an aim to reduce the energy used by
business operations by at least 1% per unit of sales compared
to the previous year. In order to prevent global warming, we
are also actively working to reduce the greenhouse gases,
such as non-energy source carbon-dioxide, that are used in
the manufacturing process .