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CYCLONE - CARTRIDGE - ELECTROSTATICSOD mS800 CFM's
DUST - SMOKE - FUME - MISTCOLLECTORS
conditioning means includesmake up means for adding electroless plating ingredients to keepthe plating ingredients in the solution properly in balance.
CLlANING IUCTIIONIC HAIIDWARtCOMPONINTSu.s. Patent 5,865,902. Feb. 2, 1999B.S. Yam and K.S. CoLbert,assiJ(nors to Church & Dwight Co.Inc., Princeton, N.J.
A blast medium for cleaning electronic hardware comprising water-soluble alkaline metal saltabrasive particles having a particle size of at least 20 microns butnot more than 300 microns and aMohs hardness of no greater than5.0; a chloride content of no morethan 100 ppm; a chemical oxygen
demand orno more than 100 ppm;and a moisture content of no morethan 0.20% by weight, whereinthe blast medium is free of silicaand organic-containing flow aids.
...GNIITIION SPUnIRINtIAPPARATUSU.S. Patent 5,865,961. Feb. 2, 1999M. Yokoyama et aL., assignors toMatsushita ELectric Industrial Co.Ltd.• Kadoma, Japan
A method of magnetron sputtering comprising generating plasmain a vicinity of a plurality of annular flat targets; supplying electric power to the targets; and generating magnetic fields that formapproximately parallel to thefront surfaces of the targets andthat have approximately uniform
intensities with the magnets thatare located along the inner andouter circumferential edges of thetargets so as to distribute theplasma approximately uniformly.
~..APPARATUSU.S. Patent 5,865,969. Feb. 2, 1999P.J. Clarke, assignor to SputteredFilms Inc., Santa Barbara, Calif.
An apparatus for providing a controlled deposition on a substrateincluding means for providing arotation of the substrate on a particular axis; a pair of anodes disposed on opposite sides of the particular axis; a pair of targets eachassociated with an individual oneofthe anodes; means for introducing inert gas; means for applyingan alternating voltage betweeneach individual one of the anodesand the associated one of the targets to establish an electrical fieldfor a flow of electrons; and meansdisposed relative to the anodesand the targets for providing amovement of the electrons between each anode and the associated target through other than astraight line path to enhance theionization of the atoms of the inert gas and the emission of thesputtered atoms from such targetfor movement toward the substrate.
...GNIT S'IIIUC'IU. POll ... INSPUn'IIII_U.S. Patent 5,865,970. Feb. 2, 1999R.E. SteLter, assignor to PermagCorp., Fremont, CaLif.
A permanent magnet structure ina magnetron utilized in sputterdepositing of a target materialonto a substrate comprising a baseplate; and a central magnet structure having a magnetic field orientation substantially parallel to thebase plate and target material.
~~ 1600 Douglas· Kalamazoo, MI· (616) 345·7151
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PLATING MITIIODU.S. Patent 5,865,976. Feb. 2, 1999H. Takeuchi et al., assignors to
Metal Finishing
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the center of the workpiece whilesimultaneously causing theetchant to impinge upon the rotated workpiece so as to cause andvary the electrochemical etchingof the workpiece while moving thenozzle to obtain a predeterminedsurface profile.
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.....ACTAIIfSU.S. Patellt 5,866,005. Feb. 2. 1999J.M. DeSimone et al., assignors toThe University of North Carolina atChapel Hill, Chapel Hill. S.C.
A process for separating a contaminant from a substrate thatcarries the contaminant comprising contacting with a carbon dioxide fluid containing an am-
Tho Measuro of Quality
OEFELSKO CORPORATION, 802 Proctor AvenueP.O. Box 676, Ogdensburg, New York 13669
Toll Free 1·800·448·3835 • Phone: 315-393-4450FAX: 315-393-8471 • Web: http://www.defelsko.com
• Rugged, tUlly electronic gagesnon-destructively measure coating thick·ness on Ferrous and Non·Ferrous metals
• Models to SUit special measuringneeds, Le. anodizing, Ihick coalings,statistical/computer analysis, etc.
• World's lirst combination gage 10automatically recognize substrate
• Special application probes forsmall and hard-to-reach areas
IUCTIIOCHIIIICAI. DCII.NGAPPAIIA......U.S. Patent 5,865,984. Feb. 2, 1999W.E. Corbin Jr. et al., assignors toIBM Corp., Armonk, N. Y.
A method ofelectrochemically spiral etching a workpiece with anapparatus comprising a fixturefor holding a workpiece, a nozzlefor supplying an etchant, and anelectrode for applying a voltage tothe workpiece, the method comprising rotating one of the workpiece and nozzle; applying a voltage to the workpiece; and variablymoving the nozzle radially outwardly from a position opposite
PosiTector'6000Series
Coating ThicknessGages for AI.l.Metal Substrates
through the electroplating bath toimpart rotation to another workpiece.
TOYoda Gosel Co. Inc., Aichi·ken,Japan
A method of making a structurecomprising a composite platingfilm disposed on a substrate comPrising providing a substrate having at least a surface portionformed from at least one metallicbase material having at least onerecess therein; discharging a composite plating solution comprisingfirst ions of at least one metal,second ions of at least one memober selected from the group consisting ofat least one metal and atleast one metalloid, and insolubleparticles dispersed in the composite plating solution from at leastone discharging device and impacting the discharged compositeplating solution to at least a bottom portion of the recess at a setflow rate; applying a voltage between the substrate and the discharging device; and controllingthe flow rate of the dischargedcomposite plating solution duringat least a portion of the applyingstep to change the composition ofthe composite plating film.
"PIt.......... fOR IUCTIIOPLAn••U.S. Patent 5,865,979. Feb. 2,1999AL. Collins Jr. et al., assignors toThomas & Betts Corp., Memphis,Tenn.In a method of electroplating longitudinally elongated workpiecesincluding the step of moving aworkpiece longitudinally and rotatably through an electroplatingbath, the improvement comprising positioning a plurality ofworkpieces in abutting unconnected end-to-end relationship toform a workpiece string; applyinglongitudinal pushing force on aninitial workpiece of the workpiecestring for continuously movingthe workpiece string longitudinally through the electroplatingbath; and longitudinally movinganother workpiece of the plurality
November 1991 91