Qualification Results- PCN14723 · 2013. 10. 23. · Qualification Results for the . FAB Site...

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Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

Qualification Results- PCN14818

1

TMFreescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

Pg. 1

Products Covered in this Notification:

Qualification Results for the

FAB Site Transfer

From Freescale Sendai Fab

To Freescale Chandler Fab

For HC11E0/E1/E9

FSL-CHD- Fab/Mask M28Z

Objective: Fab Site Transfer of 11E9 from Sendai to CHD-FabFreescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date: Refer below for detailsTechnology:

Package: Design Engr: QUARTZ Tracking #: 211748Fab / Assembly /

Final Test Sites: Product Engr:

(Signature/Date shown below

may be electronic)

Maskset#:

Rev#: Prod. Package Engr:

PPE Approval (for

DIM/BOM results)

Signature & Date:

Tran Ziep-RSJP50

02 Aug 2011Die Size (in mm)

W x L x T NPI PRQE:

NPI PRQE Approval

Signature & Date:

Nurazah Ahmad

02 Aug 2011

Part Operating

Temp. Grade: Trace/DateCode:

LOT A

8EMHA1CANJ00

UQQAA1103H

LOT B

8EMHA1C8GE00

UQQAC1102A

LOT C

8EMHA1CME100

UQQAD1105A CAB Approval

Signature & Date:

10070452M

02 Aug 2011Customer Approval

Signature & Date: Not required

Stress Test Reference Test ConditionsEnd Point

Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments or Generic Data

PC

JESD22-

A113

J-STD-020

Preconditioning (PC) :

PC required for SMDs only.

MSL 3 @ 250°C, +5/-0°C (or document

otherwise with justification)

TEST @ RH Lot A: 0/231

Lot B: 0/231

Lot C: 0/231

HAST

JESD22-

A101

A110

Highly Accelerated Stress Test (HAST):

PC before HAST (for SMDs only): Required

HAST = 130°C/85%RH for 96hrs

Bias = 5.5V

Timed RO of 48hrs. MAX

TEST @ RH 77 3 231

Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):

PC before AC (for SMDs only): Required

AC = 121°C/100%RH/15 psig

Timed RO of 2-48hrs. MAX

TEST @ R 77 3 231

Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3

Temperature Cycle (TC):

PC before TC (for SMDs only): Required

TC = -65°C to 150°C for 500 cycles.

TEST @ H

For AEC: WBP =/> 3

grams

77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

Wire Pull Result:

Lot A min > 3 grams

Lot B min > 3 grams

Lot C min > 3 grams

This testing is performed by Freescale Reliability Lab KLM unless otherwise noted in the Comments.

GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS

All surface mount devices prior to THB, HAST, AC, UHST, TC,

PC+PTC and as required per test conditions.

Example: This preliminary qual plan is provided for planning purposes only and may be modified until Freescale CAB and customer approved.

FSL-CHD-FAB / FSL-KLM-FM / FSL-KLM-FM Tune Li Ting-B16387/ Ong Hui Ching-B37330

M28Z

0 Tran Ziep-RSJP50

6.1392 x 4.6406 x 0.36

Gause Tammie-RA7914/ Raipen Ronald Reegan-B22803/ Nurazah

Ahmad-R63712

TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

-40C to 105C

68HC11E9 Varies

VariesIDR60 EEPROM with LROM

PACKAGE CODE: 6022 QFP64 14*14*2.1P0.8 Carlquist Jim-RMSD80

AEC-Q100 Qualification Results

PTC

JESD22-

A105

Power Temperature Cycle (PTC):

(See AEC-Q100 for test applicability.)

PTC = °C to °C for 1000 cycles;

Bias =

TEST @ RH 23 SMDs;

445 non- SMD

0 0 Not required

HTSL

JESD22-

A103

High Temperature Storage Life (HTSL):

150°C for 1000 hrs, 1512hrs and 2016hrs

extended readpoint (Denso MC Read Point)

(Devices incorporating NVM shall receive

'NVM endurance preconditioning'(EDR)

prior to this test, and special NVM test

sequencing after this test; see AEC-Q100

for details)

Timed RO = 96hrs. MAX

TEST @ RHC 45 0 0 Not required


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108

High Temperature Operating Life

(HTOL):

Ta = 125°C for 168, 504hrs, 1008

Bias = 6.0 V


TEST @ RHC 77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

ELFR

AEC Q100-008 Early Life Failure Rate (ELFR):

AEC Ta = 125°C for 48 hrs

Bias = 6.0V

Timed RO of 48 hrs MAX

TEST @ RHC 800 3 2400 Lot A: 0/800

Lot B: 0/800

Lot C: 0/800

EDR

AEC Q100-005 NVM Endurance, Data Retention, and

Operational Life (EDR):

(also known as NVM Endurance

Preconditioning)

10k W/E Cycling @ 105oC, Vdd = 5V for

EEPROM and DRB @ 150oC for 168, 504,

1008hrs


TEST @ RHC 77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBSAEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds

from minimum 5 units

1 5 Lot A: Cpk > 1.67

WBPMilStd883-

2011

Wire Bond Pull (WBP):

Cond. C or D

Cpk = or > 1.67 30 bonds

from minimum 5 units

1 5 Lot A: Cpk > 1.67

SD

JESD22-

B102

Solderability (SD):

8hr.(1 hr. for Au-plated leads) Steam age

prior to test.

If production burn-in is done, samples must

also undergo burn-in prior to SD.

>95% lead coverage

of critical areas

15 0 0 Not required

PDJESD22-

B100

Physical Dimensions(PD):

PD per FSL 98A drawing

Cpk = or > 1.67 10 0 0 Not required

DIM

&

BOM

Dimensional (DIM):

PPE to verify PD results against valid 98A

drawing.

BOM Verification (BOM):

PPE to verify qual lot ERF BOM is

accurate.

DIM: Pass

BOM: Pass

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS

SBS

AEC-Q100-010 Solder Ball Shear (SBS):

Performed on all solder ball mounted

packages e.g. PBGA, Chip Scale, Micro

Lead Frame (but NOT Flip Chip).

Two reflow cycles at MSL reflow

temperature before shear.

Cpk = or >1.67 10

(5 balls from a min. of

10 devices)

0 0 Not required

LI

JESD22-

B105

Lead Integrity (LI):

Not required for surface mount devices;

Only required for through-hole devices.

No lead breakage or

cracks

5

(10 leads from each of

5 parts)

0 0 Not required.


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM

Electro Migration (EM) The data, test method,

calculations and internal criteria

should be available to the

customer upon request for new

technologies.

TDDB

Time Dependent Dielectric Breakdown

(TDDB)

The data, test method,




technologies.

HCI

Hot Carrier Injection (HCI) The data, test method,




technologies.

SM

Stress Migration (SM) The data, test method,




technologies.

NBTI

Negative Bias Temperature Instability

(NBTI)

The data, test method,




technologies.


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST

Freescale 48A Pre- and Post Functional / Parametrics

(TEST):

For AEC, test software shall meet

requirements of AEC-Q100-007.

Testing performed to the limits of device

specification in temperature and limit value.

0 Fails All All All Pass

HBM

AEC-Q100-002 /

JESD22-A114E Jan

2007

ElectroStatic Discharge/

Human Body Model Classification

(HBM):

Test @ 500/1000/1500/2000 Volts

For AEC, see AEC-Q100-002 for

classification levels.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 Lot A:

500V: 0/3

1000V: 0/3

1500V: 0/3

2000V: 0/3

MM

AEC-Q100-003

or JESD22


Machine Model Classification (MM):

Test @ 50/100/200Volts



TEST @ RH

200V min.

3 units per Voltage

level

1 9 Lot A:

50V: 0/3

100V: 0/3

200V: 0/3

TEST GROUP D - DIE FABRICATION RELIABILITY TESTS

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

CDM

AEC-Q100-011 ElectroStatic Discharge/

Charged Device Model Classification

(CDM):

Test @ 250/500/750Volts



Timed RO of 96hrs MAX.

TEST @ RH

All pins =/> 500V

For AEC, Corner pins

=/> 750V;

3 units per Voltage

level

1 9 Lot A:

250V: 0/3

500V: 0/3

750V: 0/3

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the AEC-

Q100-004 requirements for AEC.

Ta= Maximum operating temperature

Vsupply = Maximum operating voltage

TEST @ RH 6 1 6 Lot A: 0/6

ED

AEC-Q100-009,

Freescale 48A spec

Electrical Distribution (ED) TEST @ RHC

For AEC,

Cpk target > 1.67

30 3 90 Lot A > 1.67

Lot B> 1.67

Lot C> 1.67

There are 4 test parameter Cpk

< 1.67, anyhow it is comply to

AEC Q100-009 clause 5e.

FGFor AEC, AEC-Q100-

007

Fault Grading (FG) FG shall be = or >

90% for qual units

No Change

GL (for information

only)

For AEC, AEC-Q100-

006

Electro-Thermally Induced Gate Leakage

(GL):

155°C, 2.0 min, +400/-400 V

Per AEC Q100 Rev G, this test is

performed for information only.

Timed RO of 96 hrs MAX.

For all failures, perform unbiased bake

(4hrs/125°C, or 2hrs/150°C) and retest;

recovered units are GL failures.

TEST @ R 6 0 0 Not required

EMC

SAE J1752/3 -

Radiated Emissions

Electromagnetic Compatibility (EMC)

(see AEC Q100 Appendix 5 for test

applicability; done on case-by-case basis

per customer/Freescale agreement)

<40dBuV

150KHz - 1GHz

1 0 0 Not required

Revision Date Comments Author

Rev O 3-Nov-05 Generated Qual Plan Tsukasa Hirayama

Rev 1.0 8-Mar-06 Updated qual plan with appropriate test requirements. All fab transfers must convert to tri temp test flow. Tammie Gause

Also added CDM stress requirement per Meguro Shigeru-NPM155.

Rev 1.1 27-Apr-06 Updated qual plan with inputs received from Shigeru-san for C-SAM, HAST, AC and TC. Tammie Gause

Rev 1.2 17-Oct-06 Control lot added for MSL, TC, WBS and WBP due to wire dimension change from mil to um Ronald Raipen

Rev 1.3 2-Aug-11 Final Qual Result Nurazah Ahmad

(0M28Z) Electrical Distribution

Per AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot

Parameter Name in Datasheet UnitsLower Limit

Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk

RUN IDD - SINGLE MODE mA 27 8.08 0.12 51.78 7.77 0.23 27.80 7.72 0.17 38.52 7.64 0.09 71.73 7.68 0.22 29.43 7.77 0.23 28.43 7.64 0.16 40.27RUN IDD - EXPANDED MODE mA 35 14.67 0.12 57.73 13.75 0.55 12.76 13.75 0.58 12.16 13.40 0.25 28.93 13.96 0.43 16.32 13.74 0.59 12.04 13.61 0.55 12.93WAIT IDD - SINGLE MODE mA 15 3.19 0.01 277.40 2.95 0.14 27.73 2.95 0.15 27.49 2.83 0.05 76.48 2.96 0.21 19.41 2.96 0.14 28.42 2.93 0.14 28.92WAIT IDD - EXPANDED MODE mA 20 4.90 0.02 254.06 4.58 0.19 26.96 4.58 0.19 26.70 4.44 0.10 49.55 4.62 0.22 22.99 4.59 0.19 27.25 4.56 0.19 27.71STOP IDD - SINGLE MODE µA 100 12.30 0.51 56.80 7.58 2.61 11.83 9.32 1.10 27.40 9.05 1.30 23.29 6.24 0.52 60.15 9.84 1.03 29.18 7.85 2.79 10.99STOP IDD - EXPANDED MODE µA 100 12.52 0.51 57.25 7.85 2.59 11.86 9.58 1.12 27.01 10.23 1.24 24.07 6.53 0.55 56.71 10.09 1.01 29.55 8.12 2.77 11.04

TFAS VDD = 4.5V ns 15 14.55 0.23 0.65 13.40 0.70 0.76 13.88 0.48 0.77 13.35 0.61 0.90 12.96 0.21 3.24 13.63 0.41 1.12 13.57 0.87 0.55Tri-temp test insertion will be screen this parameter ,comply to AEC Q100-009 clause 5e.

TFE VDD = 4.5V ns 15 14.38 0.17 1.20 13.09 0.80 0.80 13.60 0.68 0.68 12.92 0.61 1.13 13.04 0.35 1.88 13.37 0.62 0.87 13.30 0.94 0.60Tri-temp test insertion will be screen this parameter ,comply to AEC Q100-009 clause 5e.

TRAS VDD = 4.5V ns 20 16.81 0.28 3.85 15.82 0.80 1.75 16.40 0.62 1.93 14.05 0.58 3.40 14.78 0.26 6.61 15.80 0.52 2.68 16.04 0.99 1.33Tri-temp test insertion will be screen this parameter ,comply to AEC Q100-009 clause 5e.

TRE VDD = 4.5V ns 20 16.93 0.32 3.16 16.04 0.81 1.64 16.69 0.68 1.63 13.97 0.48 4.15 15.13 0.34 4.71 16.01 0.65 2.05 16.28 1.05 1.18Tri-temp test insertion will be screen this parameter ,comply to AEC Q100-009 clause 5e.

TFAS VDD = 5.5V ns 15 11.82 0.13 8.30 10.78 0.62 2.26 11.14 0.47 2.72 11.00 0.54 2.47 10.34 0.22 6.95 10.97 0.44 3.05 10.90 0.69 1.99TFE VDD = 5.5V ns 15 11.67 0.16 6.80 10.76 0.53 2.67 11.01 0.49 2.73 10.72 0.46 3.13 10.94 0.16 8.40 10.93 0.45 3.02 10.84 0.64 2.18

TRAS VDD = 5.5V ns 20 13.63 0.09 23.66 12.73 0.65 3.72 13.07 0.54 4.31 11.62 0.66 4.25 11.79 0.46 5.97 12.71 0.51 4.73 12.79 0.75 3.19

TRE VDD = 5.5V ns 20 13.56 0.16 13.46 12.69 0.58 4.19 13.02 0.58 3.99 11.35 0.63 4.55 12.20 0.42 6.22 12.71 0.59 4.13 12.74 0.77 3.14

Room



RUN IDD - SINGLE MODE mA 27 7.50 0.17 37.38 7.46 0.19 33.66 7.39 0.15 42.57 7.43 0.16 41.61 7.66 0.30 21.26 2.77 0.17 47.98 7.37 0.17 38.38RUN IDD - EXPANDED MODE mA 35 13.47 0.55 13.07 13.42 0.52 13.77 13.34 0.50 14.34 13.16 0.22 32.79 13.63 0.38 18.62 13.43 0.52 13.92 13.29 0.51 14.24WAIT IDD - SINGLE MODE mA 15 2.88 0.14 29.69 2.87 0.14 28.69 2.86 0.13 30.08 2.76 0.06 74.02 3.05 0.23 17.05 2.87 0.14 29.92 2.85 0.13 30.02WAIT IDD - EXPANDED MODE mA 20 4.50 0.19 27.87 4.49 0.19 27.63 4.48 0.18 28.63 4.34 0.11 46.12 4.68 0.22 23.63 4.49 0.18 28.56 4.46 0.18 28.67STOP IDD - SINGLE MODE µA 100 2.27 0.01 2610.75 2.22 0.03 1097.16 2.25 0.04 775.83 2.21 0.11 283.93 2.29 0.03 1171.25 2.22 0.04 878.18 2.22 0.05 689.78STOP IDD - EXPANDED MODE µA 100 2.59 0.03 972.87 2.55 0.04 763.54 2.58 0.05 644.83 3.35 0.07 435.91 2.58 0.06 557.24 2.55 0.05 676.91 2.54 0.05 592.62TFAS VDD = 4.5V ns 15 9.37 0.54 3.47 9.31 0.54 3.54 9.37 0.52 3.58 9.43 0.63 2.96 9.24 0.36 5.30 9.26 0.53 3.58 9.47 0.47 3.89TFE VDD = 4.5V ns 15 9.47 0.58 3.18 9.44 0.55 3.40 9.54 0.58 3.16 9.55 0.56 3.22 9.47 0.35 5.33 9.41 0.58 3.23 9.62 0.52 3.42TRAS VDD = 4.5V ns 20 11.47 0.54 5.25 11.57 0.52 5.42 11.73 0.59 4.66 10.45 0.71 4.51 11.05 0.35 8.47 11.43 0.56 5.10 11.74 0.54 5.06TRE VDD = 4.5V ns 20 11.60 0.52 5.36 11.63 0.51 5.42 11.79 0.60 4.59 10.37 0.54 5.93 11.29 0.45 6.42 11.46 0.54 5.29 11.77 0.59 4.65TFAS VDD = 5.5V ns 15 7.66 0.26 9.58 7.58 0.20 12.12 7.69 0.28 8.75 7.83 0.44 5.46 7.51 0.14 17.92 7.56 0.22 11.41 7.75 0.24 10.12TFE VDD = 5.5V ns 15 7.51 0.40 6.25 7.40 0.38 6.62 7.57 0.45 5.53 7.56 0.46 5.36 7.36 0.28 9.05 7.42 0.42 6.01 7.61 0.46 5.35TRAS VDD = 5.5V ns 20 9.78 0.35 9.63 9.79 0.34 10.10 9.88 0.37 9.01 9.04 0.49 7.44 9.35 0.19 19.18 9.70 0.36 9.67 9.95 0.37 9.09TRE VDD = 5.5V ns 20 9.99 0.36 9.30 10.04 0.37 9.08 10.11 0.41 8.10 9.09 0.41 8.87 9.96 0.24 14.06 9.89 0.38 8.92 10.11 0.40 8.26

Cold



RUN IDD - SINGLE MODE mA 27 7.46 0.16 39.84 7.42 0.26 25.45 7.37 0.20 32.56 7.38 0.32 20.40 7.61 0.20 31.95 7.39 0.18 35.47 7.29 0.18 35.79RUN IDD - EXPANDED MODE mA 35 13.42 0.55 13.14 13.34 0.57 12.76 13.27 0.54 13.41 13.11 0.13 56.00 13.54 0.57 12.47 13.36 0.59 12.32 13.18 0.54 13.50WAIT IDD - SINGLE MODE mA 15 2.88 0.13 30.19 2.87 0.14 28.69 2.85 0.13 30.23 2.77 0.04 97.95 2.99 0.14 28.73 2.87 0.14 28.85 2.84 0.13 30.17WAIT IDD - EXPANDED MODE mA 20 4.50 0.18 29.18 4.49 0.19 27.89 4.47 0.18 28.61 4.39 0.07 71.91 4.61 0.18 28.04 4.49 0.19 27.42 4.46 0.18 28.47STOP IDD - SINGLE MODE µA 100 3.15 0.03 1217.18 3.07 0.04 895.25 3.12 0.06 554.54 2.85 0.15 219.69 3.20 0.29 112.69 3.08 0.06 567.36 3.10 0.07 438.22STOP IDD - EXPANDED MODE µA 100 3.47 0.03 1070.53 3.40 0.05 661.23 3.44 0.06 563.93 3.77 0.15 211.58 3.48 0.30 108.52 3.40 0.06 558.16 3.42 0.08 428.74TFAS VDD = 4.5V ns 15 7.28 0.18 14.50 7.25 0.17 15.35 7.33 0.18 14.57 8.15 0.42 5.41 7.47 0.19 12.93 7.14 0.13 20.66 7.32 0.22 11.73TFE VDD = 4.5V ns 15 6.97 0.32 8.40 6.86 0.35 7.82 7.10 0.39 6.76 8.13 0.46 5.02 7.14 0.40 6.55 6.81 0.35 7.85 7.15 0.44 5.95TRAS VDD = 4.5V ns 20 9.65 0.38 9.07 9.74 0.34 10.10 9.83 0.40 8.45 9.30 0.32 10.98 9.54 0.34 10.37 9.60 0.31 11.30 9.81 0.39 8.81TRE VDD = 4.5V ns 20 9.96 0.35 9.45 9.97 0.33 10.28 10.09 0.40 8.34 9.46 0.28 12.58 9.89 0.40 8.36 9.88 0.32 10.58 10.06 0.34 9.76TFAS VDD = 5.5V ns 15 4.70 0.25 13.99 4.66 0.20 17.16 4.77 0.23 14.63 6.03 0.93 3.22 4.70 0.29 11.90 4.58 0.16 21.94 4.74 0.21 16.05TFE VDD = 5.5V ns 15 4.43 0.17 20.62 4.35 0.13 27.92 4.44 0.19 18.51 5.68 0.87 3.55 4.40 0.29 12.27 4.31 0.14 25.70 4.47 0.19 18.56TRAS VDD = 5.5V ns 20 7.79 0.32 12.54 7.93 0.28 14.52 8.20 0.36 11.00 7.14 0.94 4.57 7.64 0.25 16.20 7.62 0.34 12.03 8.20 0.37 10.57TRE VDD = 5.5V ns 20 7.89 0.45 8.99 8.01 0.39 10.27 8.32 0.43 9.11 7.25 1.09 3.91 8.02 0.39 10.17 7.54 0.57 7.23 8.19 0.40 9.92

Report Date: 14/June/11

Report Revision: 0

CHD3 Devices Post HTOL (60% shrink)

CHD3 Devices Pre HTOL (60% shrink)

25C 25C

Comment

135C 135C 135C135C 135C 135C 135C





SND Devices Pre HTOL (60% shrink)


Comment

25C 25C 25C





25C


25C







Comment



-40C -40C0.00 -40C -40C -40C -40C


FAB Site Transfer



For HC11F1

FSL-CHD- Fab/Mask M88Y

AEC-Q100 Qualification Results Summary

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Results:

Revision # & Date:

Resut

Revsion 3.0 & 13May 2011

Technology:

Package: Design Engr: QUARTZ Tracking #: 199237

Fab / Assembly /

Final Test Sites: Product Engr:

(Signature/Date shown below may be

electronic)

Maskset#:

Rev#: Prod. Package Engr:

PPE Approval (for

DIM/BOM results)

Signature & Date:

Tran Ziep-RSJP50

13 May 2011

Die Size (in mm)

W x L x T NPI PRQE:

NPI PRQE Approval Signature &

Date:

Ahmad Nurazah-R63712

113 May 2011Part Operating

Temp. Grade: Grade 1 -40°C to +125°C Trace/DateCode:

LOT A

8EMHA1A2XJ00

LOT B

8EMHA1AJ9A00

LOT C

8EMHA1APKR00

CAB Approval

Signature & Date:

10010068M

13 May 2011

Customer Approval

Signature & Date: N/A


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020



MSL 3 @ 250°C, +5/-0°C (or document otherwise with

justification)

TEST @ RH Lot A: 0/231

Lot B: 0/231

Lot C: 0/231

HAST JESD22-

A101

A110



HAST = 130°C/85%RH for 96 hrs(AEC Qual Rdpt)

Bias = Max Vdd (or justify othrwise)


TEST @ RH 77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

AC JESD22-

A102

A118

Autoclave (AC):


AC = 121°C/100%RH/15 psig for 96hrs (AEC Qual Rdpt)


TEST @ R 77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

TC JESD22-

A104

AEC Q100-

Appendix 3



AEC Grade 1: TC = -65°C to 150°C for 500 cycles

For AEC only: WBP after TC on 5 devices from 1 lot; 2

bonds per corner and one mid-bond per side on each

device. Record which pins were used.

TEST @ H

For AEC: WBP =/> 3

grams

77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

Post TC WirePull:

Lot A > 3g

Lot B > 3g

Lot C > 3g

HTSL JESD22-

A103


Temperature 150C for 1008hrs


TEST @ RH 77 0 0 See EDR


68HC11F1

"F1"

Name or "Varies"

PB or "Varies"

Technology: I120JXXS / Tech Description: 60% IDRNVM

Package Code: 0803 / Package Description :68 PLCC N/A

FSL-CHD-FAB/ FSL-KLM-FM /FSL-KLM-FM

Phuah Ling Ling-B35493

Ching Wan Yin-B04720

M88Y

0 Tran Ziep-RSJP50

5.93 x 6.78

Gause Tammie-RA7914

Ahmad Nurazah-R63712

68HC11F1 SND Fab Transfer to CHD FAB Qualification

All surface mount devices prior to THB, HAST, AC, UHST, TC,

PC+PTC and as required per test conditions.


This testing is performed by Freescale Reliability Lab KLM unless otherwise noted in the Comments.


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL JESD22-

A108

High Temperature Operating Life (HTOL):

AEC Ta = 125°C for 168hrs, 504hrs and 1008 hrs (AEC

Rdpt)

Bias = 6.0V


TEST @ RHC 77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

ELFR


AEC Ta = 125°C for 48 hrs

Bias = 6.0V


TEST @ RH 800 3 2400 Lot A: 0/800

Lot B: 0/800

Lot C: 0/800

EDR

AEC Q100-005 NVM Endurance at Hot, Data Retention, and


Devices incorporating NVM shall receive 'EEPROM NVM

endurance preconditioning'(W/E cycling). Test R, H, C

after W/E cycling.


TEST @ RHC 77 3 231 Lot A: 0/77

Lot B: 0/77

Lot C: 0/77


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds

from minimum 5

units

3 15 Lot A: Cpk> 1.67

Lot B: Cpk> 1.67

Lot C: Cpk> 1.67

WBP MilStd883-

2011

Wire Bond Pull

Cond. C or D


from minimum 5

units

3 15 Lot A: Cpk> 1.67

Lot B: Cpk> 1.67

Lot C: Cpk> 1.67

SD JESD22-

B102

Solderability;

8hr. Steam age (1 hr. for Au-plated leads) prior to test.

If production burn-in is done, samples must also undergo

burn-in.

>95% lead coverage

of critical areas

15 0 0

PD JESD22-

B100



Cpk = or > 1.67 10 0 0

DIMENSIONAL

&

BOM

VERIFICATION

Dimensional (DIM):

PPE to verify PD results against valid 98A drawing.


PPE to verify qual lot ERF BOM is accurate.




STRESS TEST Reference Test Conditions End Point

Requirements

Minimum Sample

Size

# of Lots Total Units Stress

Condition/Comment

Results

LotID-(#Rej/SS)

NA=Not applicable

EM

Electro Migration (EM) The data, test method, calculations

and internal criteria should be

available to the customer upon

request for new technologies.

TDDB

Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations




HCI

Hot Carrier Injection (HCI) The data, test method, calculations




SM

Stress Migration (SM) The data, test method, calculations




NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations





Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST

Freescale 48A Pre- and Post Functional / Parametrics (TEST):

For AEC, test software shall meet requirements of AEC-

Q100-007.

Testing performed to the limits of device specification in

temperature and limit value.


HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007


Human Body Model Classification (HBM):

Test @ 500/1000/1500/2000 Volts

For AEC, see AEC-Q100-002 for classification levels.

Note: Perform as subsitute test method for 2000V.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 Lot A:

500V : 0/3

1000V : 0/3

1500V : 0/3

2000V : 0/3

MM

AEC-Q100-003

or JESD22


Machine Model Classification m(MM):

Test @ 50/100/200olts


TEST @ RH

200V min.

3 units per Voltage

level

1 9 Lot A:

50V : 0/3

100V : 0/3

200V : 0/3


CDM


Charged Device Model Classification (CDM):

Test @ 250/500V/750Volts



TEST @ RH

All pins =/> 500V


=/> 750V;

3 units per Voltage

level

1 9 Lot A:

250V : 0/3

500V : 0/3

750V: 0/3

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the AEC-Q100-004

requirements for AEC.

Ta= 125oC Maximum operating temperature

Vsupply = 5.25V Maximum operating voltage

TEST @ RH 6 1 6 Lot A: 0/6

ED

AEC-Q100-009,

Freescale 48A

spec


For AEC,

Cpk target > 1.67

AEC: 30 3 90 Cpk> 1.67

FG

For AEC, AEC-

Q100-007


90% for qual units

CHAR

For AEC, AEC-

Q003

Characterization (CHAR):

Ony performed on new technologies and part families per

AEC Q003.

GL (for

information only)

For AEC, AEC-

Q100-006

Electro-Thermally Induced Gate Leakage (GL):

155°C, 2.0 min, +400/-400 V

Per AEC Q100 Rev G, this test is performed for information

only.


For all failures, perform unbiased bake (4hrs/125°C, or

2hrs/150°C) and retest; recovered units are GL failures.

TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions


(see AEC Q100 Appendix 5 for test applicability; done on

case-by-case basis per customer/Freescale agreement)

<40dBuV

150KHz - 1GHz

1 0 0

Part Number Moo Number Die Size, Process Technology Die Attach Mold Compound Leadframe

Flagsize

Wire

HC11F1 M88Y 5.93 x 6.78mm, 60% IDRNVM EPOXY ABLEBOND

8290

MC NITTO

GE1030F 18DX10.

Cu, 0.260" x

0.380"

32 um

Revision Description Author1.0 Generated preliminary qual plans. Tammie Gause2.0 Qual plan is approved by EVAL CAB. Cleaned up notes and references. Tammie Gause3.0 Nurazah Ahmad13-May-11 Qual report generated

17-Aug-101-Nov-10

General Notes:

Revision Date

(M88Y) Electrical DistributionPer AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot


Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk

RIDDE mA 0.2 50 32.147 0.165 36.041 32.209 0.551 10.770 32.145 0.545 10.913 31.986 0.478 12.573 31.657 0.142 43.094 31.647 0.105 58.421 32.173 0.283 20.979 31.799 0.217 27.954 PASS PASS PASS PASS PASS PASS

WIDDE mA 0.2 25 13.999 0.035 105.874 13.463 0.043 89.393 13.453 0.030 126.649 14.200 0.179 20.107 13.965 0.050 73.545 13.953 0.033 113.020 14.606 0.351 9.875 14.138 0.301 12.038 PASS PASS PASS PASS PASS PASS

SIDDE uA -5 50 30.187 3.551 1.860 24.867 0.484 17.293 25.413 0.601 13.637 13.573 3.119 1.985 15.027 1.383 4.826 16.687 0.971 7.446 26.083 4.150 1.921 11.880 1.234 4.561 PASS PASS PASS PASS PASS PASS

PWEL, AT VDD = 4.500V NS 105 240 107.783 0.123 7.518 109.477 0.183 8.144 109.587 0.143 10.677 108.713 0.306 4.046 108.443 0.179 6.397 108.550 0.117 10.139 107.500 0.486 1.716 108.287 0.274 4.001 PASS PASS PASS PASS PASS PASS

PWEH, AT VDD = 4.500V NS 100 240 109.480 0.195 16.167 110.677 0.262 13.573 110.400 0.158 22.001 110.313 0.136 25.318 109.927 0.277 11.963 109.660 0.189 17.069 109.587 0.422 7.565 110.003 0.156 21.315 PASS PASS PASS PASS PASS PASS

TRE, AT VDD = 4.500V NS 0 20 11.588 0.163 17.158 10.452 0.199 15.957 10.610 0.129 24.182 10.774 0.139 22.057 10.778 0.217 14.146 10.825 0.165 18.572 11.432 0.424 6.743 10.913 0.090 33.815 PASS PASS PASS PASS PASS PASS

TFE, AT VDD = 4.500V NS 0 15 11.118 0.090 14.353 10.392 0.188 8.179 10.250 0.368 4.297 10.219 0.250 6.388 10.861 0.153 8.995 10.947 0.097 13.939 11.461 0.448 2.632 10.779 0.227 6.195 PASS PASS PASS PASS PASS PASS





Room

Parameter Name in Datasheet UnitsLow Limit













Cold

Parameter Name in Datasheet Units

Low Limit













Post CHD2 mean+-1 SND sigma or +-

10%


10%


10%


10%


10%


10%

Pre CHD2 mean+-1

SND sigma or +-10%

Pre CHD2 mean+-1

SND sigma or +-10%

Pre CHD2 mean+-1

SND sigma or +-10%

Pre CHD3 mean+-1

SND sigma or +-10%

Pre CHD3 mean+-1

SND sigma or +-10%

Pre CHD3 mean+-1

SND sigma or +-10%

CHD3 Devices Post HTOL 135C




CHD3 Devices Pre HTOL 135C


CHD3 Devices Pre HTOL



CHD2 Devices Pre HTOL

Comment

CHD1 Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL -40C

Pre CHD1 mean+-1

SND sigma or +-10%


10%

CHD2 Devices Post HTOL -40C

CHD3 Devices Post HTOL -40C

CHD1 Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL Pre CHD1 mean+-1

SND sigma or +-10%

-40C -40C -40C

25C 25C 25C

CHD1 Devices Pre HTOL -40C -40C

Comment


135C

epo t ate 4/May/2011Report Revision: 0

CHD1 Devices Pre HTOL CHD1 Devices Post HTOL SND Devices Pre HTOL

Comment

SND Devices Post HTOL135C 135C 135C


10%

Pre CHD1 mean+-1

SND sigma or +-10%


10%

Qualification Results for the FAB Site Transfer

From Freescale Sendai FabTo Freescale Chandler Fab

For HC908LJ24FSL-CHD- Fab/Mask M44Z

FORMPPAP004XLS 1 of 3 Freescale Rev S

Objective:Freescale PN:

Part Name:Customer Name(s):

PN(s):Plan or Results:

Revision # & Date: See Revision History Below

Technology: Package: Design Engr:

QUARTZ Tracking #: 212412

Fab / Assembly /Final Test Sites: Product Engr:

(Signature/Date shown below may be electronic)

Maskset#:Rev#: Prod. Package Engr:

PPE Approval (for DIM/BOM results)Signature & Date:

Tran Ziep-RSJP5024 June 2011

Die Size (in mm)W x L x T NPI PRQE:

NPI PRQE Approval

Signature & Date:Nurazah Ahmad-R6371224 June 2011

Part OperatingTemp. Grade: Trace/DateCode:

LOT A8EME005VGC00UCTCTZX1116A

CAB Approval Signature & Date:

10010066M1 July 2011

Customer Approval

Signature & Date: Not Applicable

STRESS TEST ReferenceJ=JESD22

Test Conditions(Surface Mount Devices Only - PC required for THB, HAST, AC, UHST, TC, PC+PTC)

End Point Requirements

Minimum Sample Size

Note 1

# of Lots Total Unitsincluding

spares

ResultsLotID-(#Rej/SS)NA=Not A li bl


PC

JESD22-A113

J-STD-020

Preconditioning (PC) :PC required for SMDs only.MSL 3 @ 260°C, +5/-0°C (or document otherwise with justification)

TEST @ RH Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/693Quartz: 190677

HAST JESD22-A101A110

Highly Accelerated Stress Test (HAST):PC before HAST (for SMDs only): RequiredHAST = 130°C/85%RH for 96 hrsBias = Max Vdd (or justify othrwise)Timed RO of 48hrs. MAX

TEST @ RH 77 0 0 Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/231Quartz: 190677

AC JESD22-A102A118

Autoclave (AC):PC before AC (for SMDs only): RequiredAC = 121°C/100%RH/15 psig for 96 hrsTimed RO of 2-48hrs. MAX

TEST @ R 77 0 0 Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/231Quartz: 190677

TC JESD22-A104

AEC Q100-Appendix 3

Temperature Cycle (TC):PC before TC (for SMDs only): Required

TC = -65°C to 150°C for 500 cycles

TEST @ H 77 0 0 Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/231Quartz: 190677

HTSL JESD22-A103


AEC Grade 1: +150ºC for 1000 hours or +175ºC for 500 hours


TEST @ RHC 77 0 0 Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/77Quartz: 190677

STRESS TEST Reference Test Conditions End Point Requirements

Minimum Sample Size

Note 1


spares

ResultsLotID-(#Rej/SS)NA=Not Applicable


HTOL JESD22-A108

High Temperature Operating Life (HTOL):Ta = 125°C for 168hrs Bias = 6V


TEST @ RHC 77 0 0 Pass Generic data:68HC908GZ60 (0M29Z) :0/231@150C,Q202119, 408HrsQual(1M29Z):0/231@125C, 168Hrs

68HC908LJ24 (M44Z: 80QFP): 0/77

ELFR

AEC Q100-008 Early Life Failure Rate (ELFR):AEC Ta = 125°C for 48 hrs or 150°C for 24 hrsBias = 6.0Timed RO of 48 hrs MAX

TEST @ RH 800 0 0 Pass Generic data:68HC908GZ60 (0M29Z): 0/2400Q203338

EDR

AEC Q100-005 NVM Endurance, Data Retention, and Operational Life (EDR):

10K Cycles Flash Endurance @ 125oC followed by DRB @ 150oC for 1008hrs

Devices incorporating NVM shall receive 'NVM endurance preconditioning'(W/E cycling). Test R, H, C after W/E cycling.Timed RO of 96hrs. MAX

TEST @ RHC 77 0 0 Pass Generic data:68HC908GZ60 (0M29Z) :0/231Q202119


Minimum Sample Size

Note 1


spares

StressCondition


Commercial and Industrial Qualification Results Summary

TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDYThis testing is performed by the Freescale KLM unless otherwise noted in the Comments


68HC908LJ24 SND Fab Transfer to CHD FAB QualificationName or "Varies"PB or "Varies"

Carlquist Jim-RMSD80

Tune Li Ting - B16387

Tran Ziep-RSJP50M44Z0


68HC908LJ24"908LJ24"

U050FXXD/ 85%UDRSST6057: QFP 64 14*14*2.2P0.8

FSL-CHD-FAB/ FSL-KLM-FM / TJN-FM/KLM-FM & TJN FM

All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test

conditions.


-40°C to +85°C

4.407 X 4.381 X0.33

Gause Tammie-RA7914Raipen Ronald Reegan-B22803 Nurazah Ahmad-R63712


Freescale PN: Part Name:

Customer Name(s): PN(s):

Plan or Results:Revision # & Date: See Revision History Below

Name or "Varies"PB or "Varies"

68HC908LJ24"908LJ24"

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bondsfrom minimum 5

units

0 0 Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/5Quartz: 190677

WBP MilStd883-2011

Wire Bond PullCond. C or D

Cpk = or > 1.67 30 bondsfrom minimum 5

units

0 0 Pass Generic Data on 64QFP: 908AZ60A (2M73Y): 0/5Quartz: 190677

SD JESD22-B102

Solderability;8hr. Steam age (1 hr. for Au-plated leads) prior to test.If production burn-in is done, samples must also undergo burn-in.

>95% lead coverage of critical areas

15 0 0 Not required

PD JESD22-B100

Physical Dimensions(PD):PD per FSL 98A drawing


DIMENSIONAL&

BOMVERIFICATION

Dimensional (DIM):PPE to verify PD results against valid 98A drawing.BOM Verification (BOM):PPE to verify qual lot ERF BOM is accurate.

Not required


Minimum Sample Size


spares

StressCondition


EM

Electro Migration (EM) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

TDDB

Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

HCI

Hot Carrier Injection (HCI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

SM

Stress Migration (SM) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.


Minimum Sample Size

Note 1


spares



TEST

Freescale 48A Pre- and Post Functional / Parametrics (TEST):For AEC, test software shall meet requirements of AEC-Q100-007. Testing performed to the limits of device specification in temperature and limit value.

0 Fails All All Pass

HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007

ElectroStatic Discharge/Human Body Model Classification (HBM):Test @ 500/1000/1500/2000VoltsFor AEC, see AEC-Q100-002 for classification levels.

TEST @ RH2KV min.

3 units per Voltage level

0 0 Pass Q212592: 68HC908LK24 (M44Z): 500V: 0/31000V: 0/31500V: 0/32000V: 0/3

MM

AEC-Q100-003or JESD22

ElectroStatic Discharge/Machine Model Classification m(MM):Test @ 50/100/200VoltsFor AEC, see AEC-Q100-003 for classification levels.

TEST @ RH200V min.


0 0 Pass Q212592: 68HC908LK24 (M44Z): 50V: 0/3100V: 0/3200V: 0/3

CDM

AEC-Q100-011 ElectroStatic Discharge/Charged Device Model Classification (CDM):Test @ 250/500/750VoltsFor AEC, see AEC-Q100-011 for classification levels.Timed RO of 96hrs MAX.

TEST @ RHAll pins =/> 500V


1 9 Lot A: 250V: 0/3500V: 0/3750V: 0/3

LU

JESD78plus

AEC-Q100-004 for AEC

Latch-up (LU):Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.Ta= 85oCMaximum operating temperatureVsupply = 5.5V Maximum operating voltage

TEST @ RH 6 0 0 Pass 68HC908LK24 (M37Z): 0/6Quartz: 205377

ED

AEC-Q100-009,Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Pass Generic data:68HC908GZ60 (0M29Z): completed

68HC908LJ24 (M44Z: 80QFP): completed

GL (for information

only)

For AEC, AEC-Q100-006

Electro-Thermally Induced Gate Leakage (GL):155°C, 2.0 min, +400/-400 VPer AEC Q100 Rev G, this test is performed for information only.Timed RO of 96 hrs MAX.For all failures, perform unbiased bake (4hrs/125°C, or 2hrs/150°C) and retest; recovered units are GL failures.









68HC908LJ24"908LJ24"

EMC

SAE J1752/3 -Radiated

Emissions

Electromagnetic Compatibility (EMC)(see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/Freescale agreement)

<40dBuV150KHz - 1GHz

0 0 0 0 Not required

Die Qual Generic DataQuartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number

202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.061809 10181326M211603 M44Z 68HC908LJ24 85%UDRSST FSL-CHD-FAB 19.3 10010066M

64 QFP Package Qual Vehicles

Quartz# CHD MASK Product-Qual Description/Part Number (s)Die Area

(mm2)Pkg Code

Pkg

Description

Mold

Description

EPOXY

DescriptionWire Description

190677 M73Y S908AZ60AG1CFUE 28.9762562 6057 QFP 64 MC HITACHI 92 DA SUMITOMO CR25um Au Wire

Revision Description Approver1.0 T. Gause

1.1 T. Gause

1.2 T. Gause

1.3 Ronald Raipen

1.4 Nurazah Ahmad

HTOL& ED switched from 64LQFP to 80QFP due t load board availability issue. Control lot added.80LQFP removed due to EOL. PE request.Generic data for both die and package qualification revised.

24-Jun-11 Final Qualification Report summary

15-Oct-10

18-Aug-09

Generated preliminary qual plans.


Qual plan approved by MSG Eval CAB. Cleaned up some comments.

Revision Date4-Aug-09

14-Aug-09






Technology: Package: Design Engr:

QUARTZ Tracking #: 212592







NPI PRQE Approval

Signature & Date:Nurazah Ahmad-R6371224 June 2011


LOT A8EME005VGC00UCTCTZX1116A


10010066M1 July 2011

Customer Approval

Signature & Date: Not Applicable




Minimum Sample Size

Note 1


spares

ResultsLotID-(#Rej/SS)NA=Not A li bl


PC

JESD22-A113

J-STD-020


TEST @ RH Pass Generic Data: 68HC908LK24 (M37Z): 0/693Quartz: 205378



TEST @ RH 77 0 0 Pass Generic Data: 68HC908LK24 (M37Z): 0/231Quartz: 205378

AC JESD22-A102A118


TEST @ R 77 0 0 Pass Generic Data: 68HC908LK24 (M37Z): 0/231Quartz: 205378

TC JESD22-A104

AEC Q100-Appendix 3



TEST @ H 77 0 0 Pass Generic Data: 68HC908LK24 (M37Z): 0/231Quartz: 205378

HTSL JESD22-A103






Minimum Sample Size

Note 1


spares



HTOL JESD22-A108



TEST @ RHC 77 0 0 Pass Generic data:68HC908GZ60 (0M29Z) :0/231@150C,Q202119, 408HrsQual(1M29Z):0/231@125C, 168Hrs

68HC908LJ24 (M44Z: 80QFP): 0/77

ELFR



EDR






U050FXXD/ 85%UDRSST8426: LQFP 64 10*10*1.4P0.5



FSL-CHD-FAB/ FSL-KLM-FM / TJN-FM/KLM-FM & TJN FM Tune Li Ting - B16387

M44Z0 Tran Ziep-RSJP50

4.407 X 4.381 X0.33

Gause Tammie-RA7914Raipen Ronald Reegan-B22803 Nurazah Ahmad-R63712

68HC908LJ24 SND Fab Transfer to CHD FAB Qualification68HC908LJ24"908LJ24"

-40°C to +85°C



All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test conditions.








68HC908LJ24"908LJ24"


Minimum Sample Size

Note 1


spares

StressCondition



units

0 0 Pass Generic Data: 68HC908LK24 (M37Z): Cpk> 1.67Quartz: 205378

WBP MilStd883-2011



units


SD JESD22-B102



15 0 0 0 Not required

PD JESD22-B100


Cpk = or > 1.67 10 0 0 0 Not required

DIMENSIONAL&

BOMVERIFICATION


0 Not required


Minimum Sample Size


spares

StressCondition


EM


TDDB


HCI


SM


NBTI



Minimum Sample Size

Note 1


spares



TEST



HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007

ElectroStatic Discharge/Human Body Model Classification (HBM):Test @ 500/1000/1500/2000 VoltsFor AEC, see AEC-Q100-002 for classification levels.

TEST @ RH2KV min.


1 12 Lot A: 500V: 0/31000V: 0/31500V: 0/32000V: 0/3

MM


ElectroStatic Discharge/Machine Model Classification m(MM):Test @ 50/100/200 VoltsFor AEC, see AEC-Q100-003 for classification levels.

TEST @ RH200V min.


1 9 Lot A: 50V: 0/3100V: 0/3200V: 0/3

CDM

AEC-Q100-011 ElectroStatic Discharge/Charged Device Model Classification (CDM):Test @ 250/500/750 VoltsFor AEC, see AEC-Q100-011 for classification levels.Timed RO of 96hrs MAX.



1 9 Lot A: 250V: 0/3500V: 0/3750V: 0/3

LU

JESD78plus



TEST @ RH 6 1 6 Lot A: 0/6

ED


spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Pass Generic data:68HC908GZ60 (0M29Z): completed









68HC908LJ24"908LJ24"

GL (for information

only)



TEST @ R 6 0 0 0 Not required

EMC


Emissions



0 0 0 Not required

Generic Data List for Die Qual:Quartz # CHD Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size CAB Number

202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.061809 10181326M211603 M44Z 68HC908LJ24 85%UDRSST FSL-CHD-FAB 19.3 10010066M

64 LQFP Package Qual Vehicles

Quartz# CHD MASK Product-Qual Description/Part Number (s)Die Area

(mm2)Pkg Code

Pkg

Description

Mold

Description

EPOXY

DescriptionWire Description

205378 M37Z 68HC908LK24 19.31 8426 64 LQFP MC HITACHI 92 DA SUMITOMO CRWIRE AU .00100 +/-.00003

Revision Description Approver1.0 T. Gause

1.1 T. Gause

1.2 Qual plan approved by MSG Eval CAB. Cleaned up some comments. T. Gause

1.3 Ronald Raipen

1.4 Nurazah Ahmad24-Jun-11 Final Qualification Report summary

4-Aug-09

14-Aug-09

18-Aug-09

15-Oct-10

Revision Date

HTOL& ED switched from 64LQFP to 80QFP due t load board availability issue. Control lot added.80LQFP removed due to EOL. PE request.Generic data for both die and package qualification revised.








Technology: Package: Design Engr: QUARTZ Tracking #: 211603






Die Size (in mm)W x L x T NPI PRQE: NPI PRQE Approval Signature & Date:

Nurazah Ahmad-R6371224 June 2011


LOT A8EMHA1CNLL00UQQAC1105A


10010066M1 July 2011

Customer ApprovalSignature & Date: Not Applicable




Minimum Sample Size

Note 1

# of Lots Total Unitsincludingspares



PC

JESD22-A113

J-STD-020


TEST @ RH Pass Generic Data: 68HC908LK24 (M37Z): 0/693Quartz: 205377




AC JESD22-A102A118


TEST @ R 77 0 0 Pass Generic Data: 68HC908LK24 (M37Z): 0/231Quartz: 205377

TC JESD22-A104

AEC Q100-Appendix 3



TEST @ H 77 0 0 Pass Generic Data: 68HC908LK24 (M37Z): 0/231Quartz: 205377

HTSL JESD22-A103






Minimum Sample Size

Note 1


ResultsLotID-(#Rej/SS)NA=Not Applicable Comments or Generic Data

HTOL JESD22-A108



TEST @ RHC 77 0 77 Lot A: 0/77 Generic data:68HC908GZ60 (0M29Z) :0/231@150C,Q202119, 408HrsQual(1M29Z):0/231@125C, 168Hrs

ELFR



EDR






Minimum Sample Size

Note 1




units


WBP MilStd883-2011



units


SD JESD22-B102



15 0 0 Not required

PD JESD22-B100



DIMENSIONAL&

BOMVERIFICATION


Not required


Minimum Sample Size








68HC908LJ24 SND Fab Transfer to CHD FAB Qualification68HC908LJ24"908LJ24"


U050FXXD/ 85%UDRSST6019: QFP 80 14*14*2.2P0.65 Carlquist Jim-RMSD80



FSL-CHD-FAB/ FSL-KLM-FM / TJN-FM/KLM-FM & TJN FM Tune Li Ting - B16387

M44Z0 Tran Ziep-RSJP50

4.407 X 4.381 X0.33Gause Tammie-RA7914Raipen Ronald Reegan-B22803

-40°C to +85°C





68HC908LJ24"908LJ24"


EM


TDDB


HCI


SM


NBTI



Minimum Sample Size

Note 1



TEST



HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007

ElectroStatic Discharge/Human Body Model Classification (HBM):Test @ 500/1000/1500/2000VoltsFor AEC, see AEC-Q100-002 for classification levels.

TEST @ RH2KV min.


0 0 Pass Q212592: 68HC908LK24 (M44Z): 500V: 0/31000V: 0/31500V: 0/32000V: 0/3

MM


ElectroStatic Discharge/Machine Model Classification m(MM):Test @ 50/100/200VoltsFor AEC, see AEC-Q100-003 for classification levels.

TEST @ RH200V min.


0 0 Pass Q212592: 68HC908LK24 (M44Z): 50V: 0/3100V: 0/3200V: 0/3

CDM

AEC-Q100-011 ElectroStatic Discharge/Charged Device Model Classification (CDM):Test @ 250/500/750VoltsFor AEC, see AEC-Q100-011 for classification levels.Timed RO of 96hrs MAX.



1 9 Lot A: 0/3@250V0/3@500V0/3@750V

LU

JESD78plus



TEST @ RH 6 0 0 Pass 68HC908LK24 (M37Z): 0/6Quartz: 205377

ED


spec

Electrical Distribution (ED) TEST @ RHC 5 1 5 Lot A: Pass

Generic data:68HC908GZ60 (0M29Z): completed


GL (for information only)




EMC


Emissions



1 0 0 0

Generic Data List for Die Qual:

Die Qual Generic DataQuartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number

202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.061809 10181326M

80 QFP Package Qual VehiclesQuartz# CHD MASK Product-Qual Description/Part Number (s) Die Area Pkg Code Pkg Description Mold Description EPOXY Description Wire Description

205377 M37Z MCHC908LK24CFQE 18.11805534 6019 QFP 80 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL 25um Au

Revision Description Approver

1.0 T. Gause

1.1 T. Gause

1.2 Qual plan approved by MSG Eval CAB. Cleaned up some comments. T. Gause1.3 Ronald Raipen1.4 Nurazah Ahmad

Revision Date



HTOL& ED switched from 64LQFP to 80QFP due t load board availability issue. Control lot added.80LQFP d d t EOL PE t

4-Aug-09


Final Qualification Report summary

14-Aug-09

18-Aug-0915-Oct-1024-Jun-11

(M44Z) Electrical DistributionPer AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot

Parameter Name in Datasheet Units Lower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkPullup resistor_RST_5V A -0.00022727 -0.000125 -1.71E-04 2.63E-06 17.31 -1.72E-04 2.42E-06 19.42 -1.73E-04 1.36E-06 35.12 -1.74E-04 1.31E-06 37.22 PASS PASSPullup resistor_IRQ_5V A -0.00022727 -0.000125 -1.70E-04 2.50E-06 18.16 -1.72E-04 2.68E-06 17.61 -1.73E-04 1.63E-06 29.39 -1.74E-04 1.81E-06 26.78 PASS PASSPullup resistor_RST_3.3V A -0.00015 -0.0000825 -1.11E-04 1.73E-06 16.32 -1.12E-04 1.67E-06 17.35 -1.12E-04 8.07E-07 36.93 -1.13E-04 8.43E-07 35.91 PASS PASSPullup resistor_IRQ_3.3V A -0.00015 -0.0000825 -1.11E-04 1.50E-06 18.82 -1.12E-04 1.67E-06 17.63 -1.12E-04 1.01E-06 29.66 -1.13E-04 1.07E-06 28.23 PASS PASSPullup resistor PTA3_5V A -0.0002381 -1.28E-04 -1.78E-04 1.72E-06 28.93 -1.79E-04 2.03E-06 24.84 -1.89E-04 2.45E-06 20.09 -1.88E-04 1.56E-06 31.73 PASS PASSPullup resistor PTA2_5V A -0.0002381 -1.28E-04 -1.78E-04 1.85E-06 26.99 -1.79E-04 1.94E-06 26.32 -1.90E-04 2.43E-06 19.73 -1.90E-04 2.12E-06 22.94 PASS PASSPullup resistor PTA1_5V A -0.0002381 -1.28E-04 -1.74E-04 1.00E-06 45.53 -1.72E-04 9.25E-07 47.69 -1.84E-04 9.49E-07 57.22 -1.84E-04 1.16E-06 46.40 PASS PASSPullup resistor PTA0_5V A -2.38E-04 -1.28E-04 -1.78E-04 2.07E-06 23.84 -1.79E-04 2.78E-06 18.16 -1.89E-04 3.13E-06 15.72 -1.88E-04 1.93E-06 25.70 PASS PASSPullup resistor PTD5_5V A -0.0002381 -0.00012821 -1.75E-04 2.52E-06 18.51 -1.72E-04 1.94E-06 22.67 -1.84E-04 8.45E-07 63.40 -1.84E-04 1.34E-06 40.47 PASS PASSPullup resistor PTD4_5V A -0.0002381 -0.00012821 -1.78E-04 1.92E-06 25.84 -1.79E-04 2.80E-06 18.27 -1.86E-04 1.84E-06 28.57 -1.85E-04 2.11E-06 24.93 PASS PASSPullup resistor PTA3_3.3V A -0.00015714 -8.4615E-05 -1.17E-04 1.02E-06 32.00 -1.18E-04 1.34E-06 24.81 -1.25E-04 1.62E-06 20.20 -1.24E-04 1.05E-06 31.36 PASS PASSPullup resistor PTA2_3.3V A -0.00015714 -8.4615E-05 -1.17E-04 1.20E-06 27.21 -1.18E-04 1.26E-06 26.34 -1.25E-04 1.55E-06 20.73 -1.25E-04 1.32E-06 24.70 PASS PASSPullup resistor PTA1_3.3V A -0.00015714 -8.46E-05 -1.25E-04 4.65E-07 68.36 -1.15E-04 6.51E-07 47.14 -1.24E-04 2.11E-06 15.63 -1.21E-04 4.16E-07 85.68 PASS PASSPullup resistor PTA0_3.3V A -0.00015714 -8.46E-05 -1.17E-04 1.27E-06 25.54 -1.18E-04 1.72E-06 19.26 -1.25E-04 2.06E-06 15.77 -1.24E-04 1.31E-06 25.06 PASS PASSPullup resistor PTD5_3.3V A -0.00015714 -8.46E-05 -1.16E-04 9.12E-07 34.15 -1.16E-04 5.17E-07 59.81 -1.22E-04 8.27E-07 42.96 -1.22E-04 1.01E-06 34.82 PASS PASSPullup resistor PTD4_3.3V A -1.57E-04 -8.46E-05 -1.18E-04 1.32E-06 25.05 -1.18E-04 1.86E-06 18.17 -1.23E-04 1.15E-06 29.91 -1.22E-04 1.32E-06 26.37 PASS PASSLVI,trip falling voltage_5V V 3.6 4.6 4.24E+00 1.16E-01 3.11 4.22E+00 1.08E-01 3.49 4.09E+00 7.50E-02 6.58 4.08E+00 8.83E-02 5.43 PASS PASSLVI,trip rising voltage_5V V 3.7 4.7 4.46E+00 1.28E-01 1.87 4.44E+00 1.19E-01 2.17 4.30E+00 7.76E-02 5.11 4.29E+00 9.30E-02 4.44 PASS PASSLVI,trip falling voltage_3V V 2.1 2.8 2.54E+00 3.92E-02 6.76 2.49E+00 5.61E-02 5.49 2.50E+00 3.21E-02 9.52 2.48E+00 3.89E-02 8.27 PASS PASSLVI,trip rising voltage_3V V 2.2 2.9 2.44E+00 7.06E-02 3.42 2.44E+00 5.91E-02 4.00 2.52E+00 4.58E-02 7.06 2.51E+00 5.55E-02 5.66 PASS PASSIRC Freq. Hz 30000 80000 4.00E+04 2.71E+02 36.84 4.18E+04 2.33E+03 5.06 4.03E+04 1.28E+03 7.99 4.05E+04 7.85E+02 13.40 PASS PASSIRC Freq. Hz 20000 70000 3.57E+04 5.15E+02 30.42 3.65E+04 7.59E+02 21.80 3.75E+04 1.21E+03 14.45 3.80E+04 7.04E+02 25.62 PASS PASSridd_allon_55V A 0 0.02 1.67E-02 1.32E-04 25.03 1.67E-02 1.51E-04 21.96 1.74E-02 6.18E-05 41.47 1.74E-02 1.34E-04 19.55 PASS PASSridd_adc_on_55V A 0 0.018 1.46E-02 1.38E-04 24.74 1.46E-02 1.36E-04 25.06 1.53E-02 4.49E-05 61.14 1.52E-02 7.07E-05 39.36 PASS PASSridd_alloff_55V A 0 0.014 1.16E-02 1.28E-04 18.59 1.16E-02 1.33E-04 17.85 1.23E-02 5.26E-05 33.25 1.22E-02 6.38E-05 28.05 PASS PASSwidd_alloff_55V A 0 0.008 5.04E-03 5.32E-05 55.55 5.07E-03 6.24E-05 47.03 5.35E-03 2.42E-05 109.69 5.33E-03 2.76E-05 96.63 PASS PASSsidd_rtc_lcd_lvi_on_55V A 0 0.0004 2.66E-04 2.36E-06 56.82 2.67E-04 2.17E-06 61.50 2.71E-04 5.30E-06 24.41 2.72E-04 4.20E-06 30.44 PASS PASSsidd_rtc_lcd_on_55V A 0 0.00003 1.93E-05 1.18E-06 9.08 1.86E-05 1.27E-06 8.99 1.98E-05 7.97E-07 12.80 1.85E-05 5.22E-07 22.02 PASS PASSsidd_rtc_on_55V A 0 0.000012 8.72E-06 2.37E-07 13.86 9.45E-06 1.02E-06 2.51 9.08E-06 1.95E-07 15.01 8.98E-06 1.96E-07 15.42 PASS PASSsidd_alloff_55V A -0.0000009 0.000001 2.04E-08 5.75E-08 16.00 -2.65E-07 1.12E-07 5.67 4.54E-09 1.08E-07 8.41 -2.23E-07 9.98E-08 6.78 PASS PASSridd_allon_36V A 0 0.008 5.85E-03 4.45E-05 48.20 5.86E-03 4.54E-05 47.10 6.07E-03 2.79E-05 69.28 6.05E-03 6.46E-05 30.18 PASS PASSridd_adc_on_36V A 0 0.006 4.76E-03 3.83E-05 32.37 4.78E-03 3.93E-05 31.11 4.95E-03 1.49E-05 70.44 4.93E-03 2.60E-05 41.03 PASS PASSridd_alloff_36V A 0 0.005 3.30E-03 3.69E-05 46.01 3.32E-03 3.98E-05 42.37 3.46E-03 1.93E-05 79.85 3.44E-03 2.27E-05 68.67 PASS PASSwidd_alloff_36V A 0 0.0025 1.36E-03 1.52E-05 74.97 1.38E-03 2.37E-05 47.23 1.43E-03 7.95E-06 134.31 1.42E-03 9.07E-06 118.78 PASS PASSsidd_rtc_lcd_lvi_on_36V A 0 0.00025 1.66E-04 1.41E-06 59.84 1.66E-04 1.09E-06 76.76 1.70E-04 2.93E-06 27.42 1.71E-04 2.97E-06 26.70 PASS PASSsidd_rtc_lcd_on_36V A 0 0.00002 9.69E-06 6.72E-07 14.42 9.22E-06 6.90E-07 13.36 9.69E-06 5.02E-07 19.32 9.10E-06 4.02E-07 22.66 PASS PASSsidd_rtc_on_36V A 0 0.000004 2.70E-06 2.48E-07 5.25 2.91E-06 2.50E-07 4.35 2.85E-06 2.21E-07 5.19 2.82E-06 2.21E-07 5.36 PASS PASSsidd_alloff_36V A -0.0000009 0.000001 3.35E-09 1.63E-07 5.55 3.00E-08 2.16E-07 4.31 -3.11E-08 1.80E-07 4.83 -1.13E-07 2.61E-07 3.01 PASS PASS

Room

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkPullup resistor_RST_5V A -0.00022727 -0.000125 -1.77E-04 2.31E-06 21.59 -1.78E-04 2.58E-06 19.22 -1.80E-04 1.28E-06 37.15 -1.80E-04 1.56E-06 30.25 PASS PASSPullup resistor_IRQ_5V A -0.00022727 -0.000125 -1.77E-04 2.49E-06 20.12 -1.79E-04 2.70E-06 17.83 -1.80E-04 2.03E-06 23.46 -1.80E-04 2.21E-06 21.56 PASS PASSPullup resistor_RST_3.3V A -0.00015 -0.0000825 -1.15E-04 1.52E-06 21.63 -1.16E-04 1.64E-06 20.42 -1.17E-04 9.26E-07 35.65 -1.17E-04 1.20E-06 27.22 PASS PASSPullup resistor_IRQ_3.3V A -0.00015 -0.0000825 -1.15E-04 1.49E-06 22.01 -1.17E-04 1.64E-06 20.17 -1.17E-04 1.11E-06 29.76 -1.17E-04 1.37E-06 24.00 PASS PASSPullup resistor PTA3_5V A -0.0002381 -1.28E-04 -1.84E-04 1.40E-06 38.38 -1.84E-04 2.17E-06 24.97 -1.97E-04 2.05E-06 20.31 -1.96E-04 1.57E-06 27.16 PASS PASSPullup resistor PTA2_5V A -0.0002381 -1.28E-04 -1.85E-04 1.95E-06 27.47 -1.85E-04 2.00E-06 26.29 -1.93E-04 7.22E-07 62.64 -1.97E-04 2.13E-06 19.24 PASS PASSPullup resistor PTA1_5V A -0.0002381 -1.28E-04 -1.79E-04 1.47E-06 34.37 -1.78E-04 2.18E-06 22.99 -1.91E-04 6.88E-07 68.78 -1.90E-04 8.71E-07 55.47 PASS PASSPullup resistor PTA0_5V A -2.38E-04 -1.28E-04 -1.84E-04 1.78E-06 30.57 -1.85E-04 1.72E-06 31.13 -1.91E-04 9.45E-07 49.85 -1.95E-04 2.08E-06 20.60 PASS PASSPullup resistor PTD5_5V A -0.0002381 -0.00012821 -1.81E-04 1.59E-06 33.18 -1.78E-04 1.90E-06 26.29 -1.90E-04 2.28E-07 209.75 -1.90E-04 8.80E-07 55.22 PASS PASSPullup resistor PTD4_5V A -0.0002381 -0.00012821 -1.84E-04 1.75E-06 30.88 -1.85E-04 3.17E-06 16.69 -1.92E-04 1.76E-06 26.20 -1.92E-04 1.94E-06 23.89 PASS PASSPullup resistor PTA3_3.3V A -0.00015714 -8.4615E-05 -1.22E-04 8.49E-07 41.97 -1.22E-04 1.39E-06 25.51 -1.30E-04 1.41E-06 19.48 -1.29E-04 1.07E-06 26.30 PASS PASSPullup resistor PTA2_3.3V A -0.00015714 -8.4615E-05 -1.21E-04 1.22E-06 29.26 -1.22E-04 1.35E-06 26.47 -1.27E-04 4.18E-07 72.33 -1.30E-04 1.41E-06 19.47 PASS PASSPullup resistor PTA1_3.3V A -0.00015714 -8.46E-05 -1.18E-04 8.29E-07 40.31 -1.18E-04 1.29E-06 25.47 -1.26E-04 2.44E-07 129.80 -1.26E-04 4.05E-07 77.12 PASS PASSPullup resistor PTA0_3.3V A -0.00015714 -8.46E-05 -1.21E-04 1.17E-06 30.56 -1.22E-04 1.24E-06 28.44 -1.30E-04 1.96E-06 14.01 -1.29E-04 1.47E-06 19.21 PASS PASSPullup resistor PTD5_3.3V A -0.00015714 -8.46E-05 -1.20E-04 9.74E-07 35.85 -1.18E-04 1.03E-06 31.85 -1.25E-04 4.80E-07 65.95 -1.25E-04 4.25E-07 74.54 PASS PASSPullup resistor PTD4_3.3V A -1.57E-04 -8.46E-05 -1.22E-04 1.11E-06 31.90 -1.22E-04 2.01E-06 17.40 -1.27E-04 1.14E-06 26.59 -1.26E-04 1.46E-06 21.05 PASS PASSLVI,trip falling voltage_5V V 3.6 4.6 4.23E+00 1.20E-01 3.07 4.24E+00 1.10E-01 3.32 4.12E+00 6.73E-02 7.13 4.13E+00 8.23E-02 5.69 PASS PASSLVI,trip rising voltage_5V V 3.7 4.7 4.45E+00 1.25E-01 1.99 4.46E+00 1.17E-01 2.08 4.32E+00 7.15E-02 5.29 4.34E+00 8.82E-02 4.11 PASS PASSLVI,trip falling voltage_3V V 2.1 2.8 2.46E+00 4.81E-02 7.07 2.48E+00 3.23E-02 9.97 2.46E+00 4.16E-02 8.23 2.47E+00 5.35E-02 6.21 PASS PASSLVI,trip rising voltage_3V V 2.2 2.9 2.45E+00 5.01E-02 4.99 2.45E+00 5.49E-02 4.58 2.54E+00 4.79E-02 7.02 2.54E+00 5.29E-02 6.47 PASS PASSIRC Freq. Hz 30000 80000 5.25E+04 3.43E+02 65.75 5.38E+04 6.18E+02 38.47 5.26E+04 1.76E+03 12.88 5.31E+04 8.44E+02 27.41 PASS PASSIRC Freq. Hz 20000 70000 3.73E+04 1.22E+03 14.21 3.81E+04 1.40E+03 12.92 4.31E+04 2.33E+03 9.91 4.40E+04 1.31E+03 18.26 PASS PASSridd_allon_55V A 0 0.02 1.68E-02 1.35E-04 24.07 1.68E-02 4.03E-05 78.16 1.74E-02 5.47E-05 46.88 1.74E-02 2.48E-05 103.38 PASS PASSridd_adc_on_55V A 0 0.018 1.46E-02 1.40E-04 24.40 1.47E-02 9.13E-05 35.66 1.52E-02 4.65E-05 59.72 1.52E-02 6.26E-05 44.32 PASS PASSridd_alloff_55V A 0 0.014 1.15E-02 1.35E-04 18.82 1.15E-02 1.70E-04 14.98 1.21E-02 5.61E-05 34.66 1.20E-02 6.01E-05 245.51 PASS PASSwidd_alloff_55V A 0 0.008 4.96E-03 5.31E-05 57.18 4.95E-03 7.67E-05 39.74 5.25E-03 2.56E-05 107.50 5.24E-03 2.69E-05 104.17 PASS PASSsidd_rtc_lcd_lvi_on_55V A 0 0.0004 3.02E-04 2.24E-06 43.63 3.09E-04 1.94E-06 46.86 3.06E-04 6.29E-06 14.91 3.04E-04 5.44E-06 262.09 PASS PASSsidd_rtc_lcd_on_55V A 0 0.00003 1.97E-05 1.28E-06 8.05 1.93E-05 2.15E-07 49.69 2.04E-05 8.54E-07 11.22 1.98E-05 7.95E-08 128.43 PASS PASSsidd_rtc_on_55V A 0 0.000012 8.73E-06 2.88E-07 11.38 8.71E-06 1.97E-07 16.74 8.99E-06 1.48E-07 20.34 9.06E-06 1.91E-07 427.46 PASS PASSsidd_alloff_55V A -0.0000009 0.000001 -7.98E-09 4.76E-08 18.74 -1.14E-07 6.53E-08 12.04 9.09E-09 8.54E-08 10.65 -1.63E-07 2.11E-07 313.64 PASS PASSridd_allon_36V A 0 0.008 5.82E-03 4.56E-05 47.85 5.80E-03 4.68E-05 47.06 6.02E-03 3.37E-05 58.74 5.96E-03 8.52E-05 62.57 PASS PASSridd_adc_on_36V A 0 0.006 4.73E-03 3.63E-05 34.98 4.72E-03 4.65E-05 27.52 4.91E-03 1.79E-05 60.93 4.90E-03 2.37E-05 111.72 PASS PASSridd_alloff_36V A 0 0.005 3.23E-03 3.77E-05 46.98 3.21E-03 4.60E-05 38.82 3.38E-03 1.67E-05 96.78 3.37E-03 2.09E-05 123.79 PASS PASSwidd_alloff_36V A 0 0.0025 1.33E-03 1.64E-05 71.32 1.32E-03 2.02E-05 58.53 1.40E-03 7.86E-06 139.83 1.39E-03 1.04E-05 394.26 PASS PASSsidd_rtc_lcd_lvi_on_36V A 0 0.00025 1.84E-04 1.39E-06 47.23 1.89E-04 1.49E-06 41.01 1.88E-04 3.55E-06 17.43 1.86E-04 3.53E-06 76.63 PASS PASSsidd_rtc_lcd_on_36V A 0 0.00002 9.67E-06 5.91E-07 16.38 1.12E-05 6.00E-07 14.73 1.01E-05 6.85E-07 14.47 9.40E-06 3.73E-07 25.20 PASS PASSsidd_rtc_on_36V A 0 0.000004 2.44E-06 2.55E-07 6.13 2.02E-06 1.30E-07 15.18 2.52E-06 1.43E-07 10.33 2.28E-06 8.59E-08 20.03 PASS PASSsidd_alloff_36V A -0.0000009 0.000001 -9.21E-08 2.45E-07 3.30 -2.30E-07 7.66E-08 8.75 -6.15E-08 0.00 2.89 -1.10E-07 2.22E-07 4.37 PASS PASS

Cold

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkPullup resistor_RST_5V A -0.00022727 -0.000125 -1.83E-04 2.60E-06 16.96 -1.84E-04 2.75E-06 15.78 -1.88E-04 1.37E-06 28.96 -1.87E-04 2.19E-06 18.34 PASS PASSPullup resistor_IRQ_5V A -0.00022727 -0.000125 -1.83E-04 2.50E-06 17.66 -1.84E-04 3.16E-06 13.65 -1.87E-04 1.76E-06 22.84 -1.87E-04 1.74E-06 22.94 PASS PASSPullup resistor_RST_3.3V A -0.00015 -0.0000825 -1.20E-04 1.66E-06 18.26 -1.20E-04 1.77E-06 17.02 -1.22E-04 9.05E-07 30.66 -1.22E-04 1.26E-06 22.27 PASS PASSPullup resistor_IRQ_3.3V A -0.00015 -0.0000825 -1.20E-04 1.57E-06 19.31 -1.20E-04 1.86E-06 15.92 -1.22E-04 9.69E-07 28.40 -1.22E-04 1.05E-06 26.25 PASS PASSPullup resistor PTA3_5V A -0.0002381 -1.28E-04 -1.90E-04 2.12E-06 22.93 -1.90E-04 2.14E-06 22.61 -2.00E-04 2.07E-06 18.21 -2.02E-04 1.89E-06 19.17 PASS PASSPullup resistor PTA2_5V A -0.0002381 -1.28E-04 -1.90E-04 2.39E-06 20.23 -1.91E-04 7.26E-07 64.38 -2.01E-04 1.24E-06 29.65 -2.03E-04 1.22E-06 28.56 PASS PASSPullup resistor PTA1_5V A -0.0002381 -1.28E-04 -1.86E-04 1.26E-06 13.94 -1.85E-04 3.13E-07 170.42 -1.97E-04 4.88E-07 27.81 -2.01E-04 3.13E-06 11.69 PASS FAIL CHD Cpk > SND CpkPullup resistor PTA0_5V A -2.38E-04 -1.28E-04 -1.89E-04 2.35E-06 20.79 -1.89E-04 2.00E-06 24.31 -1.98E-04 5.18E-07 77.72 -2.02E-04 1.77E-06 20.31 PASS PASSPullup resistor PTD5_5V A -0.0002381 -0.00012821 -1.87E-04 1.34E-06 37.93 -1.86E-04 1.42E-06 36.67 -1.97E-04 5.90E-07 69.22 -2.00E-04 1.58E-06 24.04 PASS FAIL CHD Cpk > SND CpkPullup resistor PTD4_5V A -0.0002381 -0.00012821 -1.88E-04 2.75E-06 18.08 -1.89E-04 2.46E-06 20.11 -1.98E-04 1.84E-06 21.69 -1.98E-04 1.55E-06 25.66 PASS PASSPullup resistor PTA3_3.3V A -0.00015714 -8.4615E-05 -1.25E-04 1.35E-06 23.76 -1.25E-04 1.37E-06 23.31 -1.31E-04 2.39E-07 108.96 -1.33E-04 9.16E-07 26.17 PASS PASSPullup resistor PTA2_3.3V A -0.00015714 -8.4615E-05 -1.25E-04 1.56E-06 20.65 -1.26E-04 2.45E-07 126.52 -1.32E-04 1.10E-06 22.51 -1.34E-04 9.37E-07 25.07 PASS PASSPullup resistor PTA1_3.3V A -0.00015714 -8.46E-05 -1.23E-04 5.26E-07 65.53 -1.22E-04 3.72E-07 94.60 -1.30E-04 1.86E-07 143.99 -1.33E-04 9.01E-07 27.10 PASS FAIL CHD Cpk > SND CpkPullup resistor PTA0_3.3V A -0.00015714 -8.46E-05 -1.25E-04 1.63E-06 19.80 -1.25E-04 1.24E-06 25.81 -1.31E-04 2.61E-07 102.04 -1.33E-04 1.34E-06 17.71 PASS PASSPullup resistor PTD5_3.3V A -0.00015714 -8.46E-05 -1.23E-04 1.17E-06 29.22 -1.23E-04 9.85E-07 34.86 -1.30E-04 5.52E-07 48.77 -1.32E-04 1.26E-06 19.89 PASS FAIL CHD Cpk > SND CpkPullup resistor PTD4_3.3V A -1.57E-04 -8.46E-05 -1.25E-04 1.74E-06 18.71 -1.25E-04 1.60E-06 20.24 -1.31E-04 1.35E-06 19.34 -1.31E-04 1.12E-06 23.32 PASS PASSLVI,trip falling voltage_5V V 3.6 4.6 4.22E+00 1.22E-01 3.14 4.22E+00 1.17E-01 3.22 4.10E+00 7.31E-02 6.84 4.06E+00 9.50E-02 4.84 PASS PASSLVI,trip rising voltage_5V V 3.7 4.7 4.43E+00 1.30E-01 2.07 4.43E+00 1.27E-01 2.08 4.29E+00 7.88E-02 5.18 4.26E+00 9.90E-02 4.50 PASS PASSLVI,trip falling voltage_3V V 2.1 2.8 2.49E+00 4.55E-02 6.87 2.48E+00 4.34E-02 7.37 2.45E+00 4.33E-02 8.09 2.43E+00 4.66E-02 7.08 PASS PASSLVI,trip rising voltage_3V V 2.2 2.9 2.47E+00 4.42E-02 6.08 2.47E+00 4.24E-02 6.26 2.52E+00 4.74E-02 6.69 2.49E+00 6.02E-02 4.73 PASS PASSIRC Freq. Hz 30000 80000 7.04E+04 5.53E+02 17.43 6.97E+04 7.13E+02 14.43 6.97E+04 1.75E+03 5.88 6.96E+04 2.59E+03 4.01 PASS PASSIRC Freq. Hz 20000 70000 3.92E+04 9.42E+02 20.38 3.86E+04 9.42E+02 19.69 4.43E+04 4.35E+03 5.59 4.28E+04 2.09E+03 10.89 PASS PASSridd_allon_55V A 0 0.02 1.68E-02 1.24E-04 25.87 1.67E-02 2.42E-04 13.49 1.75E-02 7.00E-05 35.90 1.74E-02 1.31E-04 20.05 PASS PASSridd_adc_on_55V A 0 0.018 1.46E-02 1.22E-04 27.67 1.46E-02 2.05E-04 16.74 1.53E-02 6.44E-05 42.57 1.52E-02 8.86E-05 31.68 PASS PASSridd_alloff_55V A 0 0.014 1.13E-02 1.14E-04 24.04 1.12E-02 1.88E-04 14.84 1.19E-02 5.78E-05 37.19 1.18E-02 8.75E-05 25.21 PASS PASSwidd_alloff_55V A 0 0.008 4.85E-03 4.97E-05 63.40 4.83E-03 8.10E-05 39.07 5.13E-03 2.42E-05 118.42 5.11E-03 3.49E-05 82.83 PASS PASSsidd_rtc_lcd_lvi_on_55V A 0 0.0004 3.51E-04 3.29E-06 14.83 3.46E-04 3.67E-06 14.69 3.58E-04 8.22E-06 5.15 3.49E-04 5.77E-06 8.87 PASS PASSsidd_rtc_lcd_on_55V A 0 0.00003 2.05E-05 9.31E-07 10.24 2.02E-05 9.82E-07 9.94 2.10E-05 5.12E-07 17.48 2.08E-05 1.21E-06 7.62 PASS PASSsidd_rtc_on_55V A 0 0.000012 9.11E-06 3.14E-07 9.20 8.84E-06 3.72E-07 8.47 9.50E-06 2.82E-07 8.89 9.15E-06 2.50E-07 11.42 PASS PASSsidd_alloff_55V A -0.0000009 0.000001 1.03E-07 1.32E-07 6.78 -3.20E-08 3.24E-08 26.83 1.94E-07 1.68E-07 4.80 -7.74E-08 8.62E-08 9.54 PASS PASSridd_allon_36V A 0 0.008 5.78E-03 4.45E-05 49.97 5.76E-03 7.40E-05 30.20 5.99E-03 4.03E-05 50.03 5.95E-03 5.38E-05 38.00 PASS PASSridd_adc_on_36V A 0 0.006 4.70E-03 3.51E-05 36.96 4.69E-03 5.71E-05 23.04 4.89E-03 2.37E-05 47.01 4.86E-03 2.19E-05 52.04 PASS PASSridd_alloff_36V A 0 0.005 3.15E-03 3.27E-05 56.40 3.14E-03 5.16E-05 36.06 3.31E-03 1.86E-05 90.94 3.29E-03 2.70E-05 63.48 PASS PASSwidd_alloff_36V A 0 0.0025 1.30E-03 1.56E-05 77.23 1.29E-03 2.30E-05 52.63 1.36E-03 8.44E-06 134.48 1.35E-03 1.05E-05 109.33 PASS PASSsidd_rtc_lcd_lvi_on_36V A 0 0.00025 2.09E-04 2.04E-06 20.19 2.06E-04 2.40E-06 18.23 2.15E-04 5.28E-06 6.71 2.09E-04 3.45E-06 11.83 PASS PASSsidd_rtc_lcd_on_36V A 0 0.00002 1.00E-05 6.62E-07 15.06 9.90E-06 7.46E-07 13.27 1.07E-05 2.03E-07 45.64 1.02E-05 7.15E-07 13.77 PASS PASSsidd_rtc_on_36V A 0 0.000004 2.39E-06 1.74E-07 9.24 2.35E-06 1.96E-07 8.40 2.54E-06 1.89E-07 7.74 2.36E-06 1.35E-07 12.12 PASS PASSsidd_alloff_36V A -0.0000009 0.000001 8.70E-08 1.87E-07 4.89 -6.02E-08 3.05E-08 27.54 2.04E-07 1.31E-07 6.06 -9.76E-08 8.18E-08 9.81 PASS PASS

Report Date: 21/June/11Report Revision: 0

CHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Pre HTOL

Pre CHD mean+-1 SND

sigma or +-10%

SND Devices Post HTOL

Post CHD

mean+-1 SND sigma or +-10%

Post CHD

mean+-1 SND sigma or +-10%

Comment

95C 95C

Pre CHD mean+-1 SND

sigma or +-10%

Pre CHD mean+-1 SND

sigma or +-10%

Comment

25C 25CCHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL

Post CHD

mean+-1 SND sigma or +-10% Comment

-40C -40CCHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL


FAB Site Transfer



For HC08DX16

FSL-CHD- Fab/Mask 2M26Z

FORMPPAP004XLS 1 of 3 Freescale Rev T

Objective: Fab Site Transfer of 08DX16 from Sendai to CHD-Fab - This is a Custom Qual for DensoFreescale PN:



Revision # & Date:See Revision History

Technology: Package: Design Engr: QUARTZ Tracking #: #211909

Fab / Assembly /Final Test Sites: Product Engr: (Signature/Date shown below may be electronic)


PPE Approval (for DIM/BOM results)Signature & Date: Ziep Tran


NPI PRQE Approval Signature & Date: Nancy Long

Part OperatingTemp. Grade: Grade 2 - 40°C to + 105°C Trace/DateCode:

LOT A8EME005WHK00CTCTZC1117A

LOT B8EME005WTM00

CTCTZE1118C

LOT C8EME005WX700CTCTZA1118E


09513598MJul-20-2011

Customer ApprovalSignature & Date: May be N/A

Stress Test Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots

Total Unitsincluding

spares

ResultsLot ID-(#Rej/SS)

NA=Not ApplicableComments or Generic Data

PC

JESD22-A113

J-STD-020


TEST @ RH(C for Temp Cycle Samples)

LotA: 0/231LotB: 0/231LotC: 0/231

PC (CSAM Only)

JESD22-A113

J-STD-020

CSAM:MSL 3 (30C/70%RH/168hrs) @ 260°C, +5/-0°CDenso specific requirement for RH

Prior to Preconditioning and Post Preconditioning

100 3 300 LotA: 0/100LotB: 0/100LotC: 0/100

Perform delamination comparison for "chip and leadframe (flag)", chip and mold compound and leadframe and mold compound by using reflection mode and thruscan modes.

HAST

JESD22-A101A110

Highly Accelerated Stress Test (HAST):PC before HAST (for SMDs only): Required

HAST = 130°C/85%RH for 96hrs and 192hrs(Denso) Denso specific requirement for durationBias = 5.5VTimed RO of 48hrs. MAX

TEST @ RH 77 3 231 HAST 96Hrs:

LotA: 0/77LotB: 0/77LotC: 0/77

HAST 192Hrs:


Corrosion inspection: LotA: 0/5LotB: 0/5LotC: 0/5

Corrosion inspection after HAST on 5 devices

AC

JESD22-A102A118

Autoclave (AC):PC before AC (for SMDs only): Required

AC = 121°C/100%RH/15 psig for 96hrs and 192hrs(Denso) Denso specific requirement for durationTimed RO of 2-48hrs. MAX

TEST @ R 77 3 231 AC 96Hrs:


AC 192Hrs:LotA: 0/77LotB: 0/77LotC: 0/77

Corrosion inspection: LotA: 0/5LotB: 0/5LotC: 0/5

Corrosion inspection after AC on 5 devices

TC

JESD22-A104

AEC Q100-Appendix 3

Temperature Cycle (TC):PC before TC (for SMDs only): RequiredTC = -65°C to 150°C for 500 cycles. For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used.

TEST @ HCFor AEC: WBP =/> 3 grams

77 3 231 LotA: 0/77, WP: 0/5, Min>3gLotB: 0/77LotC: 0/77

Passivation inspection: LotA: 0/5

Passivation inspection after TC on 5 devices from 1 lot

PC + PTC

JESD22-A105

Preconditioning plus Power Temperature Cycle (PC+PTC):(See AEC-Q100 for test applicability criteria) PC before PC+PTC (for SMDs only)PC= MSL @ °C, +5/-0°CPTC = °C to °C for 1000 cycles;Bias =

TEST @ RH 22+3SMD only

0 0 Only Required for AEC devices with maximum rated power > 1 Watt and Delta-Tj > 40C or for devices designed to drive inductive loads.

PTC

JESD22-A105

Power Temperature Cycle (PTC):(See AEC-Q100 for test applicability.)PTC = °C to °C for 1000 cycles;Bias =

TEST @ RH 23+3 SMDs;45+3 non- SMD

0 0 Only Required for AEC devices with maximum rated power > 1 Watt and Delta-Tj > 40C or for devices designed to drive inductive loads.

HTSL

JESD22-A103

High Temperature Storage Life (HTSL):150°C for 1000 hrs, 1512hrs and 2016hrs extended readpoint (Denso MC Read Point)(Devices incorporating NVM shall receive 'NVM endurance preconditioning'(EDR) prior to this test, and special NVM test sequencing after this test; see AEC-Q100 for details)Timed RO = 96hrs. MAX

TEST @ RH 45+3 0 0 See EDR

4.26 x 4.54mm

Custom Qual Results

Denso(68HC08DX16)

Song Qingyuan-B16479

Tran Ziep-RSJP50

PC528540VPBE(68HC08DX16)

Tech Code / 80% UDRPackage Code EPP 8260/ Package Description 52 LQFP

FSL-CHD-FAB / FSL-TJN-FM / FSL-TJN-FM


LONG Nancy-B07252




This testing is performed by Freescale Reliability Lab (TJN) unless otherwise noted in the Comments.

M26Z2




Plan or Results:Revision # & Date:

See Revision History

Denso(68HC08DX16)




spares



HTOL

JESD22-A108

High Temperature Operating Life (HTOL):Ta = 125°C for 504hrs, 1008 (AEC readpts)Bias = 6 V


TEST @ RHC 77 3 231 HTOL 1008Hrs:Lot A: 0/77Lot B: 0/77Lot C: 0/77

ELFR

AEC Q100-008 Early Life Fai lure Rate (ELFR):AEC Ta = 125°C for 48 hrs

Bias = 6VTimed RO of 48 hrs MAX

TEST @ RHC 800 3 2400 Lot A: 0/800Lot B: 0/800Lot C: 0/800

EDR

AEC Q100-005 NVM Endurance, Data Retention, and Operational Life (EDR):(also known as NVM Endurance Preconditioning)

10k W/E Cycling @ 125oC, Vdd = 5V for EEPROM and DRB @ 150oC for 504, 1008hrs (AEC Rdpt)


TEST @ RHC 77 3 231 10k WE+ DRB 1008Hrs

Lot A: 0/77Lot B: 0/77Lot C: 0/77



spares



WBS

AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bondsfrom minimum 5 units

1 5 Lot A: 0/5, Cpk>1.67 Performed by Assembly Site during qual lot builds - PE to include this requirement in the qual lot build ERF

WBP

MilStd883-2011

Wire Bond Pull (WBP):Cond. C or D

Cpk = or > 1.67 30 bondsfrom minimum 5 units

1 5 Lot A: 0/5, Cpk>1.67 Performed by Assembly Site during qual lot builds - PE to include this requirement in the qual lot build ERF

SD

JESD22-B102

Solderabi l i ty (SD):8hr.(1 hr. for Au-plated leads) Steam age prior to test.If production burn-in is done, samples must also undergo burn-in prior to SD.


15 0 0 No Change

PD

JESD22-B100


Cpk = or > 1.67 10 0 0 No Change

DIM&

BOM


DIM: Not RequiredBOM: Done

SBS

AEC-Q100-010 Solder Bal l Shear (SBS):Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip).Two reflow cycles at MSL reflow temperature before shear.

Cpk = or >1.67 10(5 balls from a min. of 10

devices)

0 0 For solder ball mounted packages only; NOT for Flip Chips.

LI

JESD22-B105

Lead Integri ty (LI):Not required for surface mount devices;Only required for through-hole devices.

No lead breakage or cracks

5(10 leads from each of 5

parts)

0 0 Not required.



spares


NA=Not ApplicableComments

EM


TDDB


HCI


SM


NBTI

Negative Bias Temperature Instabi l i ty (NBTI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.







Plan or Results:Revision # & Date:

See Revision History

Denso(68HC08DX16)




spares



TEST


0 Fails All All All Completed This action refers to Final Testing of all qualification units.

CCU

Freescale 12MYS-62419B

Control/Correlation Units (CCU):CCU required ?: ?Units shall be marked to distinguish them from the qual units and must be marked in such a way as to retain marking over the test temperature.

NA 6030 units as primary units,30 units as back-up units

0 0 Use of Control/Correlation Units is OPTIONAL and is defined by the NPI PRQE.

HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007

ElectroStatic Discharge/Human Body Model Classification (HBM):

Test @ 500/1000/1500/2000 VoltsFor AEC, see AEC-Q100-002 for classification levels.

TEST @ RH2KV min.

3 units per Voltage level 1 12 Lot A:0/3@500V0/3@1000V0/3@1500V0/3@2000V

Either HBM or MM is required per AEC; NPI PRQE may require both.Levels below 2000V require customer approval.

MM


ElectroStatic Discharge/Machine Model Classification (MM):Test @ 50/100/200 VoltsFor AEC, see AEC-Q100-003 for classification levels.

TEST @ RH200V min.

3 units per Voltage level 1 9 Lot A:0/3@50V0/3@100V0/3@200V

CDM

AEC-Q100-011 ElectroStatic Discharge/Charged Device Model Classification (CDM):Test @ 250/500/750 VoltsFor AEC, see AEC-Q100-011 for classification levels.Timed RO of 96hrs MAX.

TEST @ RHAll pins =/> 500VFor AEC, Corner pins =/> 750V;

3 units per Voltage level 1 9 Lot A:0/3@250V0/3@500V0/3@750V

LU

JESD78plus


Latch-up (LU):Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.Ta= Maximum operating temperatureVsupply = Maximum operating voltage

TEST @ RH 6 1 6 LotA: 0/6

ED


spec


For AEC, Cpk target > 1.67

30 3 90 LotA: completed, Cpk>1.67LotB: completed, Cpk>1.67LotC: completed, Cpk>1.67

FG


Fault Grading (FG) FG shall be = or > 90% for qual units

FG%= No Change No Change

CHAR

For AEC, AEC-Q003

Characterization (CHAR):Ony performed on new technologies and part families per AEC Q003.

GL (for information only)



TEST @ R 6 0 0 Gate Leakage was not required for Denso

EMC


Emissions

Electromagnetic Compatibi l i ty (EMC)(see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/Freescale agreement)


1 0 0 Not required for Fab Site Transfer

Date Author25-Aug-09 Tsukasa Hirayama25-Aug-09 Tsukasa Hirayama7-Jan-10 T. Gause8-Jan-10 T. Gause28-Apr-10 Tammie Gause13-Jul-11 Nancy Long

Added CHD mask set/revision as well as EPP package code.Updated qual plan with inputs received from Shigeru-san for C-SAM, HAST, AC and TC. Added comment in comments cell for HTOL and EDR.

Rev 1.4 Add Qual Result for AEC Qual point

Rev. 1.2Rev 1.3

General Notes:1 -DX16 Wafer tech code 80%UDR2 - DX16 BOM: HITACHI 9200HF10M Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire

RevisionRev ORev 1,0Rev. 1.1

CommentsGenerated Qual Plan Modified Qual Plan Updated qual plan with new PC EPP part number per PE request (Jason Song - Song Qingyuan-B16479).


(2M26Z) Electrical DistributionPer AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot

Parameter Name in Datasheet UnitsLower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk

VLVI(RESET) V 3.9 N/A 4.16 0.04739 1.85 4.19 0.05305 1.80 4.15 0.04727 1.74 4.16 0.051 1.71 4.16 0.05040 1.74 4.19 0.05327 1.79 4.15 0.04826 1.70 4.16 0.04825 1.77 PASS PASS PASS PASS PASS PASS

3.5V_4.2M_Ridd mA N/A 30 6.59 0.04964 157.17 6.60 0.06348 122.89 6.62 0.04589 169.83 6.67 0.042 184.57 6.61 0.06155 126.69 6.62 0.05763 135.20 6.65 0.07820 99.52 6.62 0.03711 209.99 PASS PASS PASS PASS PASS PASS

3.5V_4.2M_Widd mA N/A 20 4.81 0.04619 109.60 4.80 0.04700 107.77 4.82 0.03989 126.89 4.88 0.036 141.92 4.83 0.04936 102.46 4.82 0.04712 107.38 4.82 0.03295 153.56 4.82 0.02874 176.07 PASS PASS PASS PASS PASS PASS

3.5V_4.2M_Sidd nA N/A 50000 161.33 119.41620 139.12 154.67 195.39056 85.04 182.00 134.14866 123.79 143.33 174.994 94.97 190.00 114.92126 144.48 227.33 132.92293 124.82 213.33 66.50555 249.54 260.67 89.05377 186.18 PASS PASS PASS PASS PASS PASS




3.5V_-2mA_PORTVOH V 2.7 N/A 3.26 0.00203 92.09 3.26 0.00195 96.06 3.26 0.00194 96.51 3.35 0.002 107.43 3.36 0.00286 76.66 3.36 0.00242 90.44 3.36 0.00203 107.50 3.35 0.00185 118.14 PASS PASS PASS PASS PASS PASS


Room

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkVLVI(RESET) V 3.9 N/A 4.17 0.05204 1.71 4.19 0.05210 1.83 4.16 0.04840 1.76 4.16 0.047 1.82 4.16 0.05128 1.71 4.18 0.05090 1.86 4.15 0.04863 1.72 4.16 0.04657 1.83 PASS PASS PASS PASS PASS PASS









Cold

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkVLVI(RESET) V 3.9 N/A 4.16 0.05021 1.70 4.19 0.04865 1.97 4.14 0.04500 1.81 4.15 0.047 1.79 4.16 0.04911 1.78 4.19 0.05549 1.74 4.15 0.04867 1.71 4.15 0.04582 1.82 PASS PASS PASS PASS PASS PASS









Comment

Report Date: 13/July/11Report Revision: 0

CHD1 Devices Pre HTOL CHD1 Devices Post HTOL CHD2 Devices Post HTOL

Pre CHD3 mean+-1

SND sigma or +-10%

Post CHD1 mean+-1

SND sigma or +-10%

Post CHD2 mean+-1

SND sigma or +-10%

Post CHD3 mean+-1

SND sigma or +-10%105C 105C 105C 105C

Comment

CHD1 Devices Pre HTOL CHD1 Devices Post HTOL CHD2 Devices Post HTOL CHD3 Devices Post HTOLCHD2 Devices Pre HTOL CHD3 Devices Pre HTOL SND Devices Pre HTOL25C25C 25C25C 25C 25C 25C

Comment

CHD1 Devices Pre HTOL CHD1 Devices Post HTOL CHD2 Devices Post HTOL CHD3 Devices Post HTOL

Pre CHD3 mean+-1

SND sigma or +-10%

Post CHD1 mean+-1

SND sigma or +-10%

Post CHD2 mean+-1

SND sigma or +-10%

Post CHD3 mean+-1

SND sigma or +-10%-40C

CHD2 Devices Pre HTOL CHD3 Devices Pre HTOL SND Devices Pre HTOL SND Devices Post HTOL-40C -40C -40C

Pre CHD1 mean+-1

SND sigma or +-10%-40C -40C -40C -40C



SND Devices Pre HTOL105C

Post CHD1 mean+-1

SND sigma or +-10%

Post CHD2 mean+-1

SND sigma or +-10%

Post CHD3 mean+-1

SND sigma or +-10%

SND Devices Post HTOL25C

Pre CHD1 mean+-1

SND sigma or +-10%

Pre CHD2 mean+-1

SND sigma or +-10%

Pre CHD3 mean+-1

SND sigma or +-10%

Pre CHD2 mean+-1

SND sigma or +-10%

SND Devices Post HTOL105C

CHD3 Devices Post HTOL

Pre CHD1 mean+-1

SND sigma or +-10%

Pre CHD2 mean+-1

SND sigma or +-10%


FAB Site Transfer



For HC908MR32 QFP64 14X14

FSL-CHD- Fab/Mask N99D

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:

See Revision History Below

Technology:

Package:Design Engr: QUARTZ Tracking #: 212810

Fab / Assembly

/Final Test Sites:Product Engr:

(Signature/Date shown below may be

electronic)

Maskset#:

Rev#:Prod. Package Engr:

PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran-RSJP50

28 July 2011

Die Size (in mm)

W x L x TNPI PRQE:

NPI PRQE Approval

Signature & Date:

Chew Kim Seong-B36347

12 August 2011

Part Operating

Temp. Grade:Grade 2 -40°C to +105°C Trace/DateCode:

LOT A

8EMHA1ELWW00

CAB Approval

Signature & Date:

Nancy Long-B07252

12 August 2011

Target Dates

Test Start:

Test Finish:

MM/DD/YY?

MM/DD/YY?

Customer Approval

Signature & Date:May be N/A

STRESS TEST Reference

J=JESD22

Test Conditions End Point

Requirements

Minimum Sample

Size

Note 1

# of Lots Total Units

including

spares

Stress

Condition

Results

LotID-(#Rej/SS)

NA=Not Applicable

PC

JESD22-

A113

J-STD-020



MSL 3 @ 260°C, +5/-0°C (or document otherwise

with justification)

TEST @ RH All surface mount

devices prior to THB,

HAST, AC, UHST,

TC, PC+PTC and as

required per test

conditions.

0 0 Pass Generic Data

908AZ60A (2M73Y), 64QFP 14*14,

Q190677

Lot A: 0/693

Lot B: 0/693

Lot C: 0/693

HAST JESD22-

A101

A110



HAST = 130°C/85%RH for 96 hrs

Bias = Max Vdd (or justify othrwise)


TEST @ RH 77 0 0 Pass Generic Data

908AZ60A (2M73Y), 64QFP 14*14,

Q190677

Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

AC JESD22-

A102

A118

Autoclave (AC):


AC = 121°C/100%RH/15 psig for 96 hrs


TEST @ R 77 0 0 Pass Generic Data

908AZ60A (2M73Y), 64QFP 14*14,

Q190677

Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

TC JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H 77 0 0 Pass Generic Data

908AZ60A (2M73Y), 64QFP 14*14,

Q190677

Lot A: 0/77

Lot B: 0/77

Lot C: 0/77

STRESS TEST Reference

J=JESD22

Test Conditions

(Surface Mount Devices Only - PC required

for THB, HAST, AC, UHST, TC, PC+PTC)

End Point

Requirements

Minimum Sample

Size

Note 1


including

spares

Stress

Condition

Results

LotID-(#Rej/SS)

NA=Not Applicable

HTSL JESD22-

A103


150ºC for 1008 hours


TEST @ RH 77 0 0 Pass Generic Data

908AZ60A (2M73Y), 64QFP 14*14,

Q190677

Lot A: 0/77


Requirements

Minimum Sample

Size

Note 1


including

spares

Stress

Condition

Results

LotID-(#Rej/SS)

NA=Not Applicable

HTOL JESD22-

A108

High Temperature Operating Life (HTOL):

AEC Ta = 125°C for 168hrs

Comm/Ind: 1yr lifetime

Bias = 6V


TEST @ RHC 77 1 77 Lot A - 0/77 Generic data:

- 68HC908GZ60 (0M29Z) Auto: 0/231

Q202119

- 68HC908LJ24 (M44Z: 80QFP): 0/77

Q211603

- HC908LK24 (M37Z: 80 QFP): 0/77

Q205377

ELFR


AEC Ta = 125°C for 48 hrs or 150°C for 24 hrs

Comm/Ind: 1yr lifetime

Bias =


TEST @ RH 611 0 0 Generic data:

- 68HC908GZ60 (0M29Z) Industrial: 0/2400

Q203338

EDR

AEC Q100-005 NVM Endurance at Hot, Data Retention, and


Devices incorporating NVM shall receive 'NVM

endurance preconditioning'(W/E cycling). Test R, H,

C after W/E cycling.


TEST @ RHC 77 0 0 Generic data:

- 68HC908GZ60 (0M29Z) Auto :0/231

Q202119

- HC908LK24 (M37Z: 80 QFP): 0/77

Q205377

IMM Qualification Plan/Results Summary

Name or "Varies"

PB or "Varies"

N/A

Phua Ling Ling-B35493

Ziep Tran-RSJP50

Tammie Gause-RA7914

Ronald Raipen-B22803

Test Program Revision: ?

68HC908MR32 SND Fab Transfer to CHD FAB Qualification

N99D

0

4.8902x4.1891

Test Program Name: ?

68HC908MR32

"908MR32"

Tech Code: U050FXXD / Tech Desc: 85%UDRSST

Package Code:6057 /Package Description: QFP 64 14*14*2.2P0.8

FSL-CHD-FAB/ FSL-KLM-FM for 64 QFP




This testing is performed by the Freescale (KLM) unless otherwise noted in the Comments


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:

See Revision History BelowName or "Varies"

PB or "Varies"

68HC908MR32

"908MR32"


Requirements

Minimum Sample

Size

Note 1


including

spares

Stress

Condition

Results

LotID-(#Rej/SS)

NA=Not Applicable

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds

from minimum 5

units

0 0

WBP MilStd883-

2011

Wire Bond Pull

Cond. C or D


from minimum 5

units

0 0

SD JESD22-

B102

Solderability;

8hr. Steam age (1 hr. for Au-plated leads) prior to

test.

If production burn-in is done, samples must also

undergo burn-in.

>95% lead coverage of

critical areas

15 0 0

PD JESD22-

B100



Cpk = or > 1.67 10 0 0

DIMENSIONAL

&

BOM

VERIFICATION

Dimensional (DIM):

PPE to verify PD results against valid 98A drawing.


PPE to verify qual lot ERF BOM is accurate.

SBS AEC-Q100-010 Solder Ball Shear (SBS):

Performed on all solder ball mounted packages e.g.

PBGA, Chip Scale, Micro Lead Frame (but NOT Flip

Chip).

Two reflow cycles at MSL reflow temperature before

shear.

Cpk = or >1.67 10

(5 balls from a min.

of 10 devices)

0 0

LI JESD22-

B105

Lead Integrity (LI):

Not required for surface mount devices;

Only required for through-hole devices.

No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size


including

spares

Stress

Condition

Results

LotID-(#Rej/SS)

NA=Not Applicable

EM

Electro Migration (EM) The data, test method, calculations and

internal criteria should be available to the

customer upon request for new technologies.

TDDB

Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations and



HCI

Hot Carrier Injection (HCI) The data, test method, calculations and



SM

Stress Migration (SM) The data, test method, calculations and



NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations and




Requirements

Minimum Sample

Size

Note 1


including

spares

Stress

Condition

Results

LotID-(#Rej/SS)

NA=Not Applicable

TEST

Freescale 48A Pre- and Post Functional / Parametrics (TEST):

For AEC, test software shall meet requirements of

AEC-Q100-007.

Testing performed to the limits of device

specification in temperature and limit value.

0 Fails All All All Pass This action refers to Final Testing of all

qualification units.

HBM

AEC-Q100-002 /

JESD22-A114E Jan

2007


Human Body Model Classification (HBM):

Test @ 500/1000/1500/2000 Volts

For AEC, see AEC-Q100-002 for classification

levels.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 Lot A

500V - 0/3

1000V - 0/3

1500V - 0/3

2000V - 0/3

MM

AEC-Q100-003

or JESD22


Machine Model Classification (MM):

Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level

1 9 Lot A

50V - 0/3

100V - 0/3

200V - 0/3

CDM


Charged Device Model Classification (CDM):

Test @ 250/500/750/1000Volts


levels.


TEST @ RH

All pins =/> 500V


=/> 750V;

3 units per Voltage

level

0 0

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the AEC-Q100-004

requirements for AEC.

Ta= 105oCMaximum operating temperature

Vsupply = 5.5V Maximum operating voltage

TEST @ RH 6 1 6 Lot A

0/6





Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:

See Revision History BelowName or "Varies"

PB or "Varies"

68HC908MR32

"908MR32"

ED

AEC-Q100-009,

Freescale 48A spec

Electrical Distribution (ED) TEST @ RHC Comm/Ind: 5 1 5 Pass

FG

For AEC, AEC-Q100-

007


90% for qual units

0 0

CHAR

For AEC, AEC-Q003 Characterization (CHAR):

Ony performed on new technologies and part

families per AEC Q003.

0 0

GL (for

information only)

For AEC, AEC-Q100-

006

Electro-Thermally Induced Gate Leakage (GL):

155°C, 2.0 min, +400/-400 V

Per AEC Q100 Rev G, this test is performed for

information only.


For all failures, perform unbiased bake

(4hrs/125°C, or 2hrs/150°C) and retest; recovered

units are GL failures.

TEST @ R 6 0

EMC

SAE J1752/3 -

Radiated Emissions


(see AEC Q100 Appendix 5 for test applicability;

done on case-by-case basis per

customer/Freescale agreement)

<40dBuV

150KHz - 1GHz

1 0

General Notes:

Part Number Moo Number Die Size, Process Technology Flash Wafer Fab/

Polymide

Die Attach Mold Compound Leadframe Flagsize Wire

68HC908MR32 N99D 20.49mm, U050FXXD 85% UDRSST 32KB FSL-CHD-FAB 20.49 CRM-1064MBL 5.0 X 5.0 mm2 25um Au Wire

Generic Data List for Die Qual:

Quartz # CHD Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size CAB Number CAB Date

202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.0618 10181326M 5-May-11

211603 M44Z 68HC908LJ24 85%UDRSST FSL-CHD-FAB 19.3000 10010066M 24-Jun-11

205377 M37Z MCHC908LK24CFQE 85%UDRSST FSL-CHD-FAB 18.1181 10010060M 1-Jul-11

Generic Data For Package Qual:

Quartz# CHD MASK Product-Qual Description/Part Number (s) Die Area (mm2) Pkg Code Pkg Description Mold Description EPOXY Description Wire Description

190677 M73Y S908AZ60AG1CFUE 28.98 6057 QFP 64

14*14*2.2P0.8

MC HITACHI 9200HF10M CRM-1064MBL 25um Au Wire

Revision Revision Date Description Author

1.0 4-Aug-09 Generated preliminary qual plans. T. Gause

1.1 17-Aug-09 Presented qual plan to PM and PE team. T. Gause

1.2 18-Aug-09 Qual plan approved by MSG EVAL CAB. T. Gause

17-Sep-09 Qual plan had to be modified. 908MR32 will be required to do 2 lots for SDIP package because June Lewis T. Gause

granted the approval to eliminate the 908GR8. With Mario Garcia's input 908MR32 was increased after assessing hardware avail.

1.4 3-Nov-09 Removed CDM requirement since it was not done when this device/mask set was originally qual. Agreed upon by PRQE management. T. Gause

1.5 24-Jun-10 Added control lot to HTOL and ED Ronald Raipen

1.6 18-Oct-10 Revised the generic data for die and package qual�Control lot added to TC, WBP, WBS and MSL due to risk on dif wire dimension which is from mil to micron Ronald Raipen

1.7 10-May-11 Revised the generic data for die and package qual�Control lot added to TC, WBP, WBS and MSL due to risk on dif wire dimension which is from mil to micron Ronald Raipen

1.8 11-May-11 Removed 10K WE from HTOL as previously using AEC rev F specification. Chew Kim Seong

1.9 27-Jul-11 Update qualification results. Chew Kim Seong

1.3


(N99D) Electrical Distribution

Per AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot

Parameter Name in Datasheet Units Lower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpklvi_tp0_verify Vdd V 3.85 4.45 4.19E+00 6.34E-02 1.367 4.20E+00 5.76E-02 1.424 4.06E+00 7.54E-02 0.928 4.06E+00 6.59E-02 1.043 PASS PASSlvi_tp1_verify Vdd V 4 4.65 4.35E+00 6.46E-02 1.531 4.37E+00 5.83E-02 1.601 4.32E+00 8.24E-02 1.286 4.31E+00 7.02E-02 1.481 PASS PASSrun_idd Vdd A 0.03 1.85E-02 1.26E-04 30.655 1.84E-02 2.10E-04 18.506 1.86E-02 1.73E-04 21.909 1.86E-02 1.80E-04 21.231 PASS PASSwait_idd Vdd A 0.012 7.77E-03 1.16E-04 12.201 7.68E-03 1.59E-04 9.039 7.83E-03 8.33E-05 16.681 7.80E-03 1.41E-04 9.946 PASS PASSstop_idd_pll_off Vdd A 7.00E-04 4.44E-07 3.14E-07 741.974 1.21E-06 7.60E-07 306.515 1.71E-06 6.46E-07 360.179 1.43E-06 8.04E-07 289.692 PASS PASS

Room

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpklvi_tp0_verify Vdd V 3.85 4.45 4.21E+00 6.24E-02 1.303 4.18E+00 8.95E-02 0.998 4.06E+00 6.68E-02 1.058 4.06E+00 6.03E-02 1.149 PASS PASSlvi_tp1_verify Vdd V 4 4.65 4.37E+00 6.48E-02 1.440 4.35E+00 9.10E-02 1.118 4.32E+00 7.10E-02 1.502 4.31E+00 6.51E-02 1.597 PASS PASSrun_idd Vdd A 0.03 1.92E-02 1.92E-04 18.696 1.94E-02 3.20E-04 11.074 1.93E-02 1.66E-04 21.441 1.94E-02 8.10E-05 43.729 PASS PASSwait_idd Vdd A 0.012 7.87E-03 1.78E-04 7.720 7.82E-03 1.96E-04 7.107 7.98E-03 1.50E-04 8.968 7.98E-03 6.75E-05 19.863 PASS PASSstop_idd_pll_off Vdd A 7.00E-04 -4.77E-07 3.67E-07 635.784 3.00E-07 9.86E-08 2365.640 -5.85E-07 3.80E-07 614.232 9.61E-08 1.23E-07 1891.264 PASS PASS

Cold

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpklvi_tp0_verify Vdd V 3.85 4.45 4.19E+00 7.54E-02 1.162 4.14E+00 8.62E-02 1.110 4.06E+00 7.83E-02 0.881 4.16E+00 5.70E-02 0.418 PASS PASSlvi_tp1_verify Vdd V 4 4.65 4.35E+00 7.95E-02 1.254 4.30E+00 8.78E-02 1.132 4.31E+00 8.23E-02 1.260 4.30E+00 5.61E-02 1.774 PASS PASSrun_idd Vdd A 0.03 1.98E-02 2.94E-04 11.515 1.99E-02 2.44E-04 13.775 1.98E-02 3.68E-04 9.195 2.01E-02 2.44E-04 13.488 PASS PASSwait_idd Vdd A 0.012 7.99E-03 2.20E-04 6.078 7.85E-03 2.42E-04 5.712 7.94E-03 9.97E-05 13.567 7.97E-03 1.77E-04 7.574 PASS PASSstop_idd_pll_off Vdd A 7.00E-04 -6.62E-07 5.40E-07 432.128 2.01E-07 1.61E-07 1444.632 -5.32E-07 4.00E-07 583.860 7.43E-08 1.71E-07 1362.918 PASS PASS

Report Date: 29/Jul/11Report Revision: 0

CHD N99D, Pre HTOL CHD N99D, Post HTOL Sendai L54J, Pre HTOL Sendai L54J, Post HTOL Post CHD mean+-1 SND

sigma or +-10% Comment

115C 115C 115C 115C

Pre CHD mean+-1 SND

sigma or +-10%

Comment25C 25C 25C 25C

CHD N99D, Pre HTOL CHD N99D, Post HTOL SND L54J Pre HTOL SND L54J Post HTOL Pre CHD mean+-1 SND

sigma or +-10%

Post CHD mean+-1 SND

sigma or +-10%

Post CHD mean+-1 SND

sigma or +-10% Comment

-40C -40C -40C -40CCHD N99D, Pre HTOL CHD N99D, Post HTOL SND L54J Pre HTOL SND L54J Post HTOL Pre CHD

mean+-1 SND sigma or +-

10%

FORMPPAP007DOC Freescale Rev K

Gage Study Summary Report

Customer Part Number: Various Q1’2011 Company/Manufacturing Site ID: Freescale/ CHD-Fab Designate only one of the following and enter the appropriate information:

Wafer Fab Process Technology: 908AT60A 85% UDRSST Assembly Process Package Family: Physical Dimensions Package Drawing #: Test

Special/Important

Characteristic Measurement

Gage/Tool/Equipment %R&R

1/ Date Study Performed

Active Area Nitride ACI CD KLA 8100 XP CD SEM 8.91% 13-Nov-10 Floating Gate ACI CD KLA 8100 XP CD SEM 7.10% 13-Nov-10 Gate Poly ACI CD KLA 8100 XP CD SEM 7.57% 13-Nov-10 Gate Poly ACI Overlay KLA 5200 Overlay 7.77% 07-Jul-10 Via 1 ACI CD KLA 8100 XP CD SEM 5.10% 10-Apr-10 Thickness (HTO) ELP & S200 8.54% 22-Oct-10 Thickness (LV Gate Ox, Gate Ox) ELP & S200 7.41% 05-Feb-10 Thickness (Field Ox) ELP & S200 2.83% 05-Feb-10 Thickness (Poly Dep) ELP & S200 7.40% 05-Feb-10 Thickness (Spacer Etch REMOX) Tencor UV1XXX 4.28% 25-Aug-10 POCL Doping Tencor RS75 1.4% 27-Mar-10

1/ If R&R > 10%, attach containment action, corrective action, or justification (as appropriate)

FORMPPAP007DOC Freescale Rev K

Gage Study Summary Report

Customer Part Number: Various Q1’2011 Company/Manufacturing Site ID: Freescale/ CHD-Fab Designate only one of the following and enter the appropriate information:

Wafer Fab Process Technology: IDR60 Assembly Process Package Family: Physical Dimensions Package Drawing #: Test

Special/Important

Characteristic Measurement

Gage/Tool/Equipment %R&R

1/ Date Study Performed

SDG SiN ACI CD KLA 8100 XP CD SEM 8.91% 13-Nov-10 1st KLA 8100 XP CD SEM Poly ACI CD 7.10% 13-Nov-10 2nd KLA 8100 XP CD SEM Poly ACI CD 7.57% 13-Nov-10 BC ACI CD KLA 8100 XP CD SEM 5.10% 10-Apr-10 Thickness (LV Gate Ox, Gate Ox) ELP & S200 7.41% 05-Feb-10 Thickness (Field Ox) ELP & S200 2.67% 25-Aug-10

1/ If R&R > 10%, attach containment action, corrective action, or justification (as appropriate)

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