Research & DevelopmentEach company of the “Sumitomo Electric Group” combines its unsurpassed

creativity with knowledge and experience to generate dynamics

that allows the group to contribute to society.

December 2017

Osaka Works

1-1-3, Shimaya, Konohana-ku, Osaka 554-0024, JapanTel: +81 6 6466 5651 Fax: +81 6 6463 7229

Itami Works

1-1-1, Koyakita, Itami, Hyogo 664-0016, JapanTel: +81 72 772 3300 Fax: +81 72 772 2525

Yokohama Works

1, Taya-cho, Sakae-ku, Yokohama 244-8588, JapanTel: +81 45 853 7182 Fax: +81 45 852 0597

Analysis Technology Research Center,Optical Communications Laboratory,Transmission Devices Laboratory,R&D Planning & Administration Division

Advanced Automotive Systems R&D Center,Power Systems R&D Center,Information Network R&D Center,Frontier Technologies Laboratory

Head Office (Tokyo)

Akasaka Center Building1-3-13, Motoakasaka, Minato-ku, Tokyo 107-8468, JapanTel: +81 3 6406 2600

R&D Planning & Administration Division

5-33, Kitahama 4-chome, Chuo-ku, Osaka 541-0041, JapanTel: +81 6 6220 4141

http://global-sei.com/

Head Office (Osaka)

Advanced Automotive Systems R&D Center, Power Systems R&D Center,Information Network R&D Center, IoT R&D Center,Cyber-security R&D Office, Analysis Technology Research Center,Energy and Electronics Materials Laboratory,Frontier Technologies Laboratory, Power Device Development Division,R&D Planning & Administration Division

Analysis Technology Research Center,Advanced Materials Laboratory, Transmission Devices Laboratory,Power Device Development Division,R&D Planning & Administration Division

Energy and Electronics Materials Laboratory

For wide applications of vehicle telematics such as driver assistance systems, we are developing

high speed in-vehicle communication networks as well as vehicle-to-vehicle/road-to-vehicle

communications in terms of safety and security.

Through technological development for power supply control and voltage conversion such as

DCDC converters for electric vehicles, we contribute to fuel economy and CO2 reduction.

02 03

Environment

Safety and Security

Advanced AutomotiveSystems R&D Center

Infocommunications Traffic infrastructure/Cloud server

We are developing innovative technologies and products based on vehicle

dynamics to contribute to improving safety & security and environment for next

generation vehicles by using our proven material and infocommunications technologies.

Traffic control/ITS/TelematicsWireless/Optical communicationsCommunication control

Electroconductive/Sintered/Insulating/Heat spreading materials

Converter/Battery control

Environment

Energy Material

Safety & Security

Ethernet

Gateway

Power supply management

Powersupplycontrol Motor

Powersupply

unit

TCU*

ITS on-boardequipment

On-boardbatterycharger

Batterycharger

ITS roadsideunit

Powerdistributor

＊ TCU: Telematics Communication Unit

Wireless communication

Telematics ITS wireless

Yokohama testbed

Telematics server ITS roadside unit

Subtraction signal

High speed on-board network

Power distribution control

Auxiliaryequipment

Connectivity

Batterycharger

Telematicscontrol unit

Auxiliary power storage

Charge/Dischargeconverter

Power storageunit

Regeneration system

Power storagePower generation/

Driving

Low voltage storage battery

High voltage storage battery

Inverter/Boost converter

Motorgenerator

HEV system

EV/PHEV system

ECUBuckconverter

Energy consumption map

Power supply control system

Switching circuit/Control technology Electromagnetic parts/Circuit wiring design

High efficiency voltage conversion technology SOC estimationmethod

for batteries

High heat dissipationtechnology

Battery

DSP (two-way control)

Simulation of vehicle energy

consumption using unit model

Engine Powertrain Driveline

Powergenerator

Power conversion/distribution

Electricload

Battery

＜OCV→SOC estimation based on internal resistance＞

Individualcell voltage

measurement

Internal resistanceRi calculation

OCVcalculation

Voltagecorrection

・Temperature correction・SOC correction

SOCestimation

Testbed

Architecture/Vehicle simulation

Concentrator photovoltaic (CPV) has approxi-

mately twice the power generation efficiency of

silicon solar panels currently on the market because

CPV cells are composed of special compound

semiconductor materials. In addition, concentrator

panels are installed in elevated positions so that

usable spaces are provided under them. For these

reasons, CPV is expected as a next generation

photovoltaic. Our newly developed CPV offers

thinner and lighter panels than conventional CPV.

By the formation of high temperature superconducting thin film

on our world’s first textured metal substrate with low cost, low

magnetism and high strength, our superconducting tape (size: 4

mm width, 150 um thickness) allows us to pass electric current

higher than 200A at a liquid nitrogen temperature of -196 C̊ and

expected to be widely applied to superconducting cables, super-

conducting electromagnets, nuclear magnetic resonance (NMR)

equipment and magnetic resonance imaging (MRI) equipment.

(Left) PV inverter for AC to DC power conversion

Additional functions of voltage control and

communication solve natural energy problems

such as fluctuations in power generation.

(Right) POWER DEPO™ Ⅲ storage battery systemWe are developing communication modules for

smart meters and string monitoring systems for

mega solar power plants by using power line

communication (PLC) and wireless communica-

tion technologies. Our string monitoring system

has the sensing elements with a current or volt-

age sensor to measure power generation and

the PLC communication elements to transmit

sensor data. By utilizing power lines, it allows us

to establish low cost, high reliability systems

without the need of new communication and

power supply lines. We further promote its de-

velopment with the Internet of Things (IoT).

Our new energy system architecture (sEMSA™)

allows optimal control of distributed power

sources such as wide-spreading photovoltaic

generation, cogeneration and storage batteries,

as well as energy cost reduction. In addition, by

gathering energy consumers for an aggregator,

unifying energy management and adjusting

demand energy through demand response, it

allows us to stabilize energy networks and

establish beneficial systems.

04 05

New energy system

In power systems using renewable

energy power generation, storage bat-

teries are useful for power storage/dis-

charge depending on fluctuations in

power generation. Redox flow batter-

ies are suitable for irregular, highly

fluctuating charge-discharge operation

and allows accurate monitoring and

power storage control, therefore it is expected as an optimal storage battery for smart grids to effectively use

renewable energy sources such as solar and wind. We are promoting its development on a fully commercial basis.

Redox flow battery

PV inverter / POWER DEPO™ Ⅲ storage battery system

Concentrator photovoltaic

Superconducting tape

Power line communication system

The Power Systems R&D Center opened in January 2010 to promote business development

in response to technological innovations in the electric power infrastructure sector (wide

applications of renewable energy and advanced electric power infrastructure by using

infocommunications technology). More specifically, we are promoting R&D on elemental

technologies, products, equipment and systems that are essential for smart grids (future

electricity grids).

Power SystemsR&D Center

Aggregator（Cloud）sEMSA™server

Consumer Factory

Smart meter

Optimal control of energy sources

Control

Control

ControlControl

Control

Control

Control

Control

Control

Compatible with various communications

Wi-SUNWi-Fi

ZigBee

OpenADRECHONETLite

Compatible with various protocols

AppliancesStoragebattery

Electricityself-generation

Photovoltaics

sEMSA™sEMSA™-home

Renewable energygeneration company

Electricityprovider

Transmission/Distribution service provider

Factory

Optimaaaal cl c l ccontoo rol of energygygygygy sources

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Eleectricitytttyyselfelfelff--gg-generation

PhotPhotPhotPhotPhottovolovolovolovoloo t itaict itaics

sEMMMSSSAAA™

Junction box

Junction box

Photovoltaic panels(Max.16ch/slave)

High-voltage DC cable(DC600～1kV)

Monitoring system

Network

PLC slave unit

PLC slave unit

PLC master unit

PCS

Traffic system Automobile

High speed distributed big data processing

Factory

High reliabilitynetwork

Mobilenetwork

Opticalnetwork

We are developing optical access and 5G wireless technologies to support high speed

broadband communications, as well as millimeter-wave radars for traffic infrastructure

and on-board millimeter-wave radar antenna modules by using our wireless technologies.

We are also promoting R&D on mobility systems including traffic control based on probe

vehicle information, autonomous driving support and server solution to use big data

sources in real time.

The 5th generation mobile communication system

(5G) that is expected to be introduced beyond 2020

will create the Internet of Things (IoT) world to pro-

vide not only connections between mobile phones,

but also interactions across multiple devices, featur-

ing ultra-high speed, low delay, high reliability and

multiple connections.

Based on our high efficiency amplifier, antenna and

processing technologies for high frequency bands, we

are developing wireless units and modules into the 5G

mobile infrastructure and connected car markets.

The 8K ultra-high definition video technology

is expected for wide applications to television

broadcasting in 2020, as well as medical care

and disaster prevention. However, the chal-

lenge is to provide large transmission capacity.

We are developing compression-expansion/

transmission technologies for the 8K large ca-

pacity video signals and its application tech-

nologies to achieve a good balance between

high reliability and economic efficiency.

By the combination of our optical compo-

nents and system technologies, we are de-

veloping 10G-EPON* technologies to

achieve 10Gbps high speed optical access.

By the integration of wide-spreading 1Gbps

branch type optical fiber networks and

10G-EPON, it increases the communication

speed by ten times economically.

＊G-EPON: Gigabit Ethernet Passive Optical NetworkWith the rapid expansion of IoT technologies

in the manufacturing process, mobility,

energy and infrastructure fields, analysis

technology, high speed processing and

real-t ime response with big data are

increasingly required.

To cope with such challenges and further

advance our wide range of products and

services, we focus on research to apply big

data analysis technologies and networking

technologies such as cloud edge computing

and visualization.

High performance radar is inevitable to

achieve autonomous driving that has been

developing rapidly for its future introduction,

and accordingly the needs for mil l ime-

ter-wave radars are growing.

We are developing millimeter-wave radars for

traffic infrastructure and on-board millime-

ter-wave radar antenna modules to provide

vehicle’s position and speed based on vehicle

information into the wireless sensor market

by using our proven wireless technologies.

To realize safe, secured and eco-friendly

global traffic societies, we are promoting

R&D on telematics technologies.

We are also developing mobility systems for

the future autonomous driving era including

advanced traffic control technology for

signal control based on vehicle information

such as vehicle’s position and speed, auton-

omous driving support technology to pro-

vide look-ahead information by using artifi-

cial intelligence (AI) technology as well as

optimal route search technology consider-

ing the driver’s intention and conditions.

06 07

High speed optical access system

5G wireless technology

Ultra-high definition video technology

Traffic control / Telematics technology

Server technology

Millimeter-wave radar

UserReceiver

CATV networkFiber network

(10Gbps)

Head end system

Real-timeprocessing

Cloud

Edge

Dis

trib

ute

dp

roce

ssin

g/

Vis

ualizati

on

Big data processing

Expressway

Millimeter-wave radarMillimeter-wave radarMillimeter-wave radar

Radar informationRadar informationRadar information

On-board millimeter-wave radar

antenna module

Millimeter-wave radar for traffic infrastructure

Bus &Train

Macrocell

Small cell

Passengervehicle

On-board wireless unit

Wireless base station module

Antenna

Wireless module

Transceiver

Basestation

Information Network R&D Center

1Gbps-EPON

Optical network

10G-EPONOptical Line Terminal

(OLT)

Home network

Telephone station

Coexistence with 1GbpsEPON

CoexistenCoe

Internet

10G-EPONOptical Network Unit

(ONU)

V2V communication（to recognize traffic conditions by monitoring V2V data at RSU）

Telematics center

Probe information

Providing look-ahead information

ITS Big data Traffic

managementcenter

Traffic flow control

Collecting traffic condition

Autonomousdriving support

technology

Advanced trafficcontrol technology

8K ultra-highdefinition

camera

Compression/Multiplexing technologies

Transmissiontechnology

Receiving/Decoding technologies

1 Coding2 Multiplexing3 Transmitting

2 314 Receiving5 Channel selecting6 Decoding

5 64

Utilize

Analyze

Accumulate

Transmit

Collect

Data analysis technology

08 09

High precision, high speed analysis technolo-

gies of large data collected in real time by

the IoT technologies are required for ad-

vanced manufacturing processes.

We are working to further advance our prod-

ucts and services including automated

inspection through the development of AI &

big data analysis technologies.

Factory IoT system

Detection

Automotive/Traffic system

Production system/Factory network

Equipment/Facility

We are conducting R&D on technologies to deal with cyberattacks for electronic

products that are connected to networks in our business fields including auto-

motive, infocommunications, electronics, environment & energy and industrial

materials. We are also engaged in research on advanced cybersecurity technolo-

gies in cooperation with the SEI-AIST Cyber Security Collaborative Research

Laboratory established jointly by Sumitomo Electric and the National Institute of

Advanced Industrial Science and Technology (AIST).

Since the emergence of autonomous

and connected vehicles, demand for

automotive cybersecurity technolo-

gy is rapidly growing.

We are promoting the development

of cyberattack detection technology

for automotive networks to which

analysis technology and machine

l ea rn ing a re app l i ed , and the

research for automotive security en-

hancement by using current cryp-

tographic communication technology.

Automotive security

A t ti / P d ti t / E i t/

Gateway

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00110010001010001100001

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Restoration

Prevention

Cryptographic communication

technology

CyberattackCyberattackCyberattack

Detection Prevention

ECU ECU

ECU ECU

ＴCU

＊ECU: Electronic Control Unit

＊TCU: Telematics Communication Unit

On-site troubleshooting

Quality &productivity improvement

Receiver Receiver

Wireless networkWireless repeater

Predictive facilitymaintenance

Safety & environmentmanagement

Server/Cloud

AI & big data analysis

Temperature &humidity sensor

Current sensor Smoke sensor Vibration sensor

Application example : automated inspection

Good partsconveyor

Defectiveparts conveyor

Camera

Crack

Non-crack

Learning

Camera image

Assessment

PartsinspectionParts

Crack

Assessmentresults

Assessmentresults

Assessmentresults

AI（deep learning）

PCCrackCrackCrack Non-crackNon-crackNon-crack

Image sampleImage sampleImage sample

Big data accumulation

Cyber-security R&D Office

IoT R&D Center

We are promoting the development of Internet of Things (IoT) technologies to

support our manufacturing sites by using our sensing, wireless communication

and AI & big data analysis technologies, focusing on “improved quality,” “auto-

mated inspection,” “predictive maintenance” and “safety management,” in coop-

eration closely with our group companies.

Recently, the IoT technologies to collect and

analyze data by connecting multiple sensors

and devices to networks have been increasingly

introduced into the manufacturing fields.

We are promoting R&D on energy-saving wire-

less sensors to detect facility troubles and op-

erating conditions and multi-hop wireless net-

works that enable inexpensive introduction

and user-friendly operation, based on our wire-

less technologies. We are also working on

research to apply big data analysis technolo-

gies to production management and predictive

on-site monitoring.

3D structure visualization

Elemental mapping with sub-micron resolution

Nano-level structural analysis

Synchrotron radiation and neutron analyses combined with simulation techniques

Strategic CAE infrastructure development

For widespread use of CAE for analytical purposes

Wire/cable service life prediction

10 1 1

Analysis TechnologyResearch Center

The Analysis Technology Research Center, based in Osaka, Itami and Yokohama,

is supporting manufacturing, product development, business development and

technological foundation of the Sumitomo Electric Group by using computer

aided engineering (CAE) analysis with our advanced analysis technology in coop-

eration with large-scale high-tech research facilities (SPring-8, K computer, etc.).

For wide applications of CAE analysis tech-

nologies that are useful for product design,

we are promoting the technology transfer to

the design section through training for design

members and the development of simplified

and automatic analysis systems in response

to the market needs.

Wires and cables are used for moving parts

such as mobile phone hinges, automotive

doors and robot arms. We are developing

computer simulation technology to predict

service life of wires and cables until break-

age due to twists or bends.

Considering CAE analysis as one of the key

technologies not only to optimize product

development, but also to strengthen compet-

itiveness on the market, we are working on

the infrastructure development to enhance

CAE core functions.

＊Lenovo and NeXtScale System are trademarks or registered trademarks of Lenovo and/or its affiliates.

＊Intel and Xeon are trademarks or registered trademarks of Intel Corporation.

Lenovo NeXtScale System M5CPU: 912 cores [39 TFLOPS]

Intel Xenon (Broadwell)

Open

Turn Display

Keyboard

Harness

Micro StructureAnalysis (FEM)

Conductor Shield

Insulator Jacket

0.3mm

1. Motion Analysis (FEM) 2. Strain Calculation 3. Fatigue Analysis

Master CurveLite

Strain

Power cable accessory(EB-G) and analysis example

0123456

Req

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ed

tim

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day

]

Conventional method Automated system

Result processingComputationMesh generation

Automated system

High-speed networksHigh-speed networksHigh-speed networks

YokohamaGeneral computation server

Itami

General computation serverIn-house Affiliates

Analysis time reduced to one-fifth

We are developing technologies with high

spatial resolution to visualize dopant distribu-

tion that determines the quality of functional

materials and parts with an electron probe

microanalyzer.

We are working on the establishment of na-

no-level structure analysis technology focus-

ing on transmission electron microscopes

and crystal structure analysis for its wide ap-

plications. By using this technology, we are

supporting quality improvement of materials

and devices.

We are developing analysis technologies using syn-

chrotron radiation and neutrons, in order to investigate

material structures in atomic level and to perform in-si-

tu measurement of chemical reactions. Regarding the

synchrotron radiation, we utilize two beamlines that

are exclusive to Sumitomo Electric Group. We also

combine simulation techniques such as the first-princi-

ples calculation, to explore new materials and to clarify

the mechanism of their high performances.

DualBeam microscope 3D analysis of IC internal structure

Arbitrary cross section

1μm

1μm

入射電子EDX detector

Annular dark-field detector (HAADF)

Bright-field detector

High-angle scattered electrons

Transmitted electron

Thin-film specimen

Incident electron

Characteristic X-ray

Scanning transmission electron microscope

Probe diameter: 0.1 nm

Superconducting material

High magnification image

STEM image

JEOL JEM-2100F/Cs[Accelerated voltage: 200 kV]

Courtesy of RIKENCourtesy of RIKENCourtesy of RIKEN

K computer

Electron probemicroanalyzer

Elemental mapping of sintered aluminum nitride

High

LowCrystalgrain

Crystal grainboundary

Impurity deposits at Impurity deposits at grain boundariesgrain boundaries

( 1um1um)

Impurity deposits at grain boundaries

( 1um)

SEM image

Microfocus X-ray CT system 3D observation of internal stranded structure of multi-core cable

Structural analysis example (Er-doped optical fiber)

Measurement by SPring-8 X-raysMolecular dynamics simulation

Interatomic distance [nm]

Radi

al d

istrib

utio

n fu

nctio

n

Our 3D structure visualization technology

for composite materials, parts and prod-

ucts provides solutions to quality improve-

ment by observing internal structures, tar-

geted areas, and samples as they are.

Large capacity version (512GB memory) 64 coresSMP version (with GPGPU) 80 coresMPI version 768 cores

Total of old and new servers 1329 cores [50 TFLOPS]

（Kyusyu Synchrotron Light Research Center）（Kyusyu Synchrotron Light Research Center）（Kyusyu Synchrotron Light Research Center）

Sumitomo Electric beamlineSumitomo Electric beamlineSumitomo Electric beamline

In the metal and inorganic materials fields, we have created not only unique materials, but also

process innovations by using our ultra high pressure and powder metallurgy technologies. We

contribute to our business expansion in industrial materials and other business fields through

the development of high functional materials and parts including cemented carbide cutting

tools, diamonds, ceramics, sintered ferrous alloys and special steel wires.

Oil-tempered wire for valve spring

Electrical discharge machining wire（Trade name : Sumi Sparkγ™）

Cross section of electrical discharge machining wire

Coating chip

Oxide semiconductor sputtering target

12 13

Powder metallurgy technology / Ultra-high pressure technology

Melt-casting technology / Plastic working technology

Thin film coating technology / Sintering technology

Advanced MaterialsLaboratory

In response to various needs based on our core technologies

In the powder metallurgy field, we have developed

cemented carbides for cutting tools, cermets and

sintered Fe alloy and Al alloy parts for automobiles.

Recently, we have been developing nano-polycrys-

talline diamonds* that consist of nano-sized crystals

and are harder than single crystal diamonds, as well

as magnetic materials (magnetic cores, magnets) to

contribute to performance improvement of motors

and sensors.

＊Received 2013 Best 10 New Products Awards sponsored by Nikkan Kogyo Shimbun and 2014 Okochi Memorial Technology Prize

Cemented carbide tool

Powder magnetic core Nano-polycrystalline diamond(Trade name : Sumidia Binderless™)

We are responding

to both market and

customer needs by

using core technol-

ogies.

High hardness & high strength

Process innovationPowder metallurgyUltra high pressureWire drawingThin film coating

Light weight & highcorrosion resistance

Heat resistance & high thermal conductivity

High magnetic property

Environmental loadreduction & conservingscarce resources

●

Cemented carbide/Cermet

●

Synthetic diamond●

Cubic boron nitride●

Magnetic material●

Special metal wire●

Ceramics●

●

●

●

●

In the special steel wire field, we are developing

high performance spring wires and pre-stressed

concrete (PC) strands by using our rolling, heat

treatment and wire-making technologies. Re-

cently, we have focused on the development of

electrical discharge machining wires for precise

processing of machine parts and metal molds.

In the thin film coating field, we

have developed coated ceramic

film with high hardness and high

adhesion for cutting tools.

In the ceramic field, we have de-

veloped functional materials with

unique thermal, electrical and

optical properties. Recently, we

have been developing next gen-

eration oxide semiconductor

sputtering targets for thin film

transistors used in flat panel dis-

plays.

In response to high density and fine circuits, we are developing metal nanoparticles and ink/paste

containing such materials and promoting its applications to electronic products.

14 15

Metal and inorganic material technology

Polymer material technology

Fine circuit fabrication technology

Energy and Electronics MaterialsLaboratory

We are supporting our widespread business fields

through the development of metal/polymer material and

fine circuit fabrication technologies that originate from

cable technology.

Metal & InorganicMaterial

TechnologiesPolymerMaterial

Technologies

Fine circuitfabrication

Technologies

Aluminum wiring harness

MgSiC heat spreader

Aluminum-Celmet™

For weight reduction of wiring materials for automobiles, we are developing aluminum alloy wires

and aluminum wiring harnesses by using our continuous casting and plastic forming technologies

in cooperation with our group companies.

We have produced bulk materials as well, such as CelmetTM, by using our electroplating technology

that originates from gold plating.

By using our composite material technology, we are developing new materials with well-balanced

properties such as thermal conductivity and thermal expansion.

Gold plated products

Aluminum ally wire

Heat shrinkable tubeMagnetic wire for HV motorFlexible printed circuit

We have developed various products by using

our polymer synthesis technology that origi-

nates from research on insulators and is based

on polymerization and polymer formulation

technologies for wires and cables, while improv-

ing flame retardant, heat resistant and environ-

mentally resistant properties of polymer materi-

als by applying polymer alloy and halogen free

technologies. Most recently, we developed high

strength molding materials for thin wall extru-

sion by using nanocomposite technology with

exfoliating and dispersing nano-sized fillers.

Polymer synthesis/compounding technologies

Business contribution

High strength polymer film

Microdispersion of two polymers insoluble each otherMicrodispersion of two polymers insoluble each other→ New material with both features New material with both features

Microdispersion of two polymers insoluble each other→ New material with both features

Exfoliated nanofiller

Polymer alloy

Polymer A

Nanocomposite

Polymer

Polymer BMiscible toPolymer B

Miscible toPolymer A

Compatibilizer

Polymer alloy Nanocomposite

Mobile device/PC

Flat TV

Digital camera

HDD

Touch panel

Fine pitch FPC

5um line width

Synthesis & application of metal nanoparticles

Paste composition, Printing, Circuit design

Ag nanoparticles Cu nanoparticles Chainlike Ni nanoparticles

SUMI-CARD™ On-board module

Ink-jet printing

Ag nanoink Cu nanoinkConductive paste

Screen-printing

50nm50nm 300nm300nm50nm 300nm

Approx.300nm

We are developing high-capacity interconnections by our metal and optical cable technologies for

rapidly expanding data centers, where high speed as well as low power consumption are required.

We are also working on the development of new high speed cables for appliances.

Ultra-low loss optical fiber with pure silica core Our ultra-low loss optical fibers based on pure-silica core technology are best for long-distance high-capacity com-munications, such as submarine optical cables. After our continuous innovation in glass and coating technologies, we achieved a transmission loss of 0.1419 dB/km at 1560 nm wavelength in 2017, which is a new record of lowest loss.

Multi-core optical fibers having the same cladding diameters as standard optical fibers

Low loss coupled 4 core for long distance transmission*1)

Uncoupled 4 core having optical compatibility with standard optical fibers*2)

7 single-coreoptical fibers

Multi-coreoptical fiber

Multi-core optical fiber

Single-coreoptical fiber

bundle

16 17

Optical fiber

We are conducting R&D on innovative multi-core optical fibers (MCFs) and connection technology that over-

come the limitation of conventional standard single-core fiber and pave the way for petabit optical transmission.

Next generation optical fibers / Connection technology

High-capacity interconnection technologies

Since early 1970s, we have developed the vapor-phase axial deposition (VAD) method, the Jap-

anese original technology to produce optical fibers efficiently. Based on this technology, we

have been innovating advanced optical fibers and technologies to produce them efficiently.

Multi-core/single-core conversion connector

Uncoupled 8 core for short distance transmissionin the 1.31 um wavelength region *3)

0.135

0.140

0.145

0.150

0.155

0.160

1980 1990 2000 2010 2020

Tra

nsm

issi

on

lo

ss[d

B/k

m]

Year

New record

0.1419 dB/km

World record

Z-PLUS FiberTM 150

Internet

Terminal

Router

Memory

Server

SwitchNon-contact multi-fiber connector

for backplane

High density optical cable composed of thin optical fibers

and pliable ribbons

Standardoptical fiber

Thin optical fiber

2-fiber ribbon part

4-fiber ribbon part

1) http://www.sei.co.jp/company/press/2016/03/prs023.html2) http://www.ntt.co.jp/news2017/1708/170808b.html3) http://www.sei.co.jp/company/press/2015/03/prs022.html

Ultra-high-density 256-core (8core x 32fiber) MPO Connector

Optical CommunicationsLaboratory

To contribute to the development of connected society, we are promoting the con-

tinuous innovation of optical fiber technologies fundamental to the broadband com-

munication network and its expansion into data centers and households.

We are also working on the applications of optical technologies to new fields.

Data center

Photonic device Electronic device Core Technologies

AssemblyDesign

ProcessDevice

Evaluation

Thin film growthEquipmentEvaluation

We have provided high quality products in the optical and wireless communications fields by using our advanced technologies that were developed by vertically integrat-ing crystal growth technology for com-pound semiconductors, optical devices based on epitaxy and processing technolo-gies such as semiconductor lasers and pho-todiodes, electronic devices such as HEMTs and microwave ICs, and modules and opti-cal data links. We continue further R&D on high quality compound semiconductors to expand our business into the ultraviolet, mid-infrared and high voltage fields.

To satisfy transmission capacity demand for optical commu-nication systems, we have been developing higher data rate optical transceivers and contributing to its standardization.We promote its downsizing and power saving at 100 Gbit/s transmission (25 Gbit/s wavelength) by using our elemen-tal technologies including high-frequency analog circuit, digital control and mechanical design as well as our accu-mulated technologies including optical device, OSA and IC design, and we also explore new technologies at 400 Gbit/s transmission (50 to 100 Gbit/s wavelength).

To realize 10 Tbit/s-class ultra-large capacity transmis-sion by using wavelength division multiplexing, digital coherent transmission technology has attracted lots of attention.We are developing main components such as high power tunable narrow-linewidth light source, multi-level modu-lator and coherent receiver by using our compound semi-conductor technology.

00

1110

01

Transmitted signalMulti-level modulatorTunable light source

18 19

Optical transceiver (TRx)

Coherent device

Wireless device

QSFP28(100G)（72×18×8.5mm；3.5W）

CFP8(400G)（102×40×9.5mm）

Our gallium arsenide (GaAs) HEMT*1 that was developed ahead of competitors has contributed to expansion of wire-less communications. Applying this technology to gallium nitride (GaN) allows downsizing and high efficiency of LTE base stations.In addition, to realize next generation 5G network, we are developing higher frequency and higher efficiency devices and MMICs*2. These devices are applied not only to 5G base stations, but also to solid-state radars.Millimeter wave MMICs are also used in automotive radars.

Compound semiconductor and its applications

Compound semiconductors are used widely for pho-tonic and electronic devices. In each field, we are pro-moting the technological development for down-stream products such as epitaxial wafers, devices and modules based on our material technology.

Product development and core technologies

By improving conventional materials development methods requiring experimental tests, we are promot-ing the development of calculation techniques includ-ing the first-principles calculation and thermal fluid analysis, which are expected to be applied widely to create new materials and optimize manufacturing process development, etc.Doped GaN analysis

(First-principle calculation)GaAs crystal growth analysis

(Thermal-fluid analysis)

Material design technology

High speed

（ ）

High speed

Transmission DevicesLaboratory

Satellitecommunication

Automotiveradar

Wireless LAN

Cellularbase station

Wirelessinfrastructure

(short haul)

Wireless infrastructure(long haul)

Optical communications network (DWDM)

Metro networkMetro networkMetro network

Access and PONAccess and PONAccess and PON

Data centerData centerData center

Material Photonic device

Red laser Visible/Infrared LED

(DVD, PC, automotive, outdoor display)

Infrared laser/Photodetector

(optical communications)

GaAs

GaN

AIN

InP

High frequency ICPower amplifier

(mobile phone, wireless base station,

satellite communications)

High frequency power deviceHigh power, low loss device

(wireless base station, power controller, electric vehicle)

Next generationpower device

Blue-Violet laserBlue/White LED

(Blu-ray, LCD backlight, outdoor display, lightning)

UV light emitter(sterilization, cleaning, processing)

Electronic device

Compound semiconductors are used in a wide range of fields that cannot be realized by silicon.As a pioneer in compound semiconductors, we are promoting development of high quality, large area crystal growth technology and materials to create new devices.

(high frequency power device)

＊Blu-ray is a trademark or registered trademark of Blu-ray Disc Association.

Epitaxial growthtechnology

Wirebonding

Hermeticseal

YAG welding 4 wavelength integration

10Gbit/sOptical subassembly

100Gbit/sOptical subassembly

100μm

10mm

inchinch2-inch

Opticalfiber

Semiconductor photodetector

Processing

Semiconductorwafer

Chip

Electromagneticanalysis

Heat radiationanalysis

＊1 HEMT： High Electron Mobility Transistor＊2 MMIC： Monolithic Microwave Integrated Circuit＊3 WiMax is a trademark or registered trademark of WiMax Forum.

Po

wer

[W]

Frequency [GHz]

IMFETPALNA

: Internal matched FET: Power amplifier : Low noise amplifier

SATCOMVSATDBS

: Satellite communication : Very small aperture terminal : Direct broadcast satellite

1000

100

10

1

0.1

0.01

0.0011 10 100

GaN HEMTPA MMICs

Mix/Mult/Osc MMIC

FET

HEMT

W-CDMA,PCS,

WiMax*3,LTE,

Cellularbase station

SATCOM, VSAT, Space,P-to-P radio

P-to-P radio

AutomotiveradarDBS

PA/LNA MMIC

PA MMICIMFET

We are developing semiconductor optical devices for opti-cal-electrical signal conversion in optical communications sys-tems by using our advanced technologies including high quality crystal growth, precision machining and quality and reliability assurance technologies for compound semiconductor materials.

Our optical subassembly incorporating our light emitters, pho-todetectors and ICs allows downsizing, high performance and low power consumption by using our high speed transmission design and packaging technologies. In response to demand for various systems, we have provided OSA products globally.

Optical device

Optical subassembly (OSA)

20 21

Light source forlaser projector

Ultracompact RGB laser module

We are developing ultracompact RGB laser

modules that integrate semiconductor lasers in

three primary colors: red, green and blue, with

the optical component and thermoelectric

cooler in combination with our visible laser and

precision packaging technologies.

We ensure its stable operations at a wide range

of temperatures by integrating three color semi-

conductor lasers composed of different base

materials and controlling temperatures effec-

tively with a thermoelectric cooler. In addition,

we have achieved the high beam quality without

bleeding by our laser alignment technology.

It is expected to be applied widely to head-up

displays, projectors, pointers, illuminators and

other industrial equipment.

To apply to new devices such as near-infra-

red imaging sensors for chemical composi-

tion, light emitters and next generation

power devices, we are promoting the devel-

opment of new epitaxial thin film materials

based on nanostructure analysis.

Epitaxial thin film material

We are developing infrared image sensors

with quantum well structures by using pho-

todetector technologies for optical commu-

nications, which are suitable for composition

analyses and imaging of slight temperature

differences. We are also developing mid-in-

frared quantum cascade lasers for high sen-

sitive gas detection.

Infrared sensing deviceWavelength

0.5 1 2 3 4 5 15[μm]

Visible Near-infrared (NIR) Mid-infrared (MIR)

Quantum cascade laser (QCL)

Detector

Emitter

Communication PD

Communication LD

Thermography

Industrial gas detection/measurement Environmental gas detection Isotopic analysis Breath analysis

Wavelength［μm］

Application High speed, high sensitive gas detection

Industrial measurement/Thermal process control

Security/Monitoring Remote sensing Structure diagnosis

Composition analysis

Industrial monitoring

Quality control

Advanced medical diagnosis

Structure diagnosis

Thermal imageForeign matter identification

1,4: Cold medicine2,3,6: Headache medicine5: Vitamin

1 2

3 4

5 6

MIR imaging sensorNIR imaging sensor

Gas analysis

Silicon carbide (SiC) is a promising material for next gen-

eration power devices to enhance energy efficiency. We

are promoting the development of SiC crystals and epi-

taxial wafers by using high quality and cost effective

growth technology (MPZTM*).

In addition, we are working on the development of SiC

power devices and modules with low power loss and

high blocking voltage for future commercialization.

We are developing high quality and large diameter SiC

crystals by using the MPZTM that accurately controls tem-

perature and the reaction process during crystal growth.

Single crystal epitaxial layers are grown on sliced and

mirror finishing SiC wafers by means of the chemical

vapor deposition (CVD) method.

By using the MPZTM, our epitaxial wafers have the

world’s highest uniformity without defects on more

than 99% of wafer surface, which are commercialized

under the trade name of EpiEraTM.

SiC power transistors are fabricated on epitaxial wafers

through semiconductor processes such as ion implanta-

tion, insulating film formation and electrode formation.

High quality SiC crystal and epitaxial wafer

＊ MPZ: Multi-Parameter and Zone controlled SiC Growth Technology

We have developed V-groove trench metal oxide

semiconductor field effect transistors (VMOSFETs)

with high efficiency, high blocking voltage and high

stability on specific crystal planes, which have large

current characteristics at 200A per single chip and

are expected to be applied to electric vehicles (EVs)

and hybrid electric vehicles (HEVs) to improve

energy efficiency.

We are also developing SiC power modules with low

parasitic inductance for high speed operation.

High efficiency SiC power transistor and module

SiC transistors on epitaxial wafer

IV characteristics

Transistor chip

SiC power module

ID ［A］

VDS［V］

Epitaxialgrowth

technology

Transmission Electron Microscope (TEM)

Atomic Force Microscope (AFM)

Multi-layer thin filmgrowth technology

Materials developmentin unexplored fields

Light sensinglayers

High Al compositionAlGaN thin film

Green laserPower device

Near-infraredsensor

Electronic device

InP substrate

GaN substrate

Quantum wellstructure

Simulationtechnology

Appliedtechnology

Red LD Green LD Blue LD

MeasuredEstimated

Abs

orpt

ion

Power Device Development Division

Research connected car and autonomous driving technologies and participate in pilot projects

Research and develop infrastructures for next generation energy efficient vehicles including electric vehicle (EV)

Research and analyze trends in fast-changing future mobility

Commercialize redox flow battery and concentrator photovoltaic (CPV), the main next generation energy businesses

Develop new businesses in the integrated field of electric power and infocommunications

Explore applications of our material technologies to the Environment & Energy field

Research trends in technological evolution of cloud network

Propose new technologies to support advanced communication technology

Develop new businesses provided by the Internet of Things (IoT) and Industry 4.0

Automotive

Environment & Energy

Infocommunications

●●

●

●

●●

●●●

Soilless culture system Products (tomatoes)

Agri-Science Department

Based on "SandponicsTM," our innovative soilless culture system that we have been developing for

years, we aim to achieve a stable production of vegetables through industrially controlled cultivation.

22

2322

Technologies in our new business fields such as "life science" and "resources"

are being developed.

With the belief that research and development are the driving force for our company's growth, we are promoting the

implementation of our mid-term management plan "VISION 2017" that prescribes the target/direction, strategy, resource

allocation, and action program for our R&D. The proposal of new research activities and the promotion of research in the

early stages are also our main tasks for our future business. Moreover, for the acceleration of R&D and the creation of new

business fields using external operating resources, we set forward open innovations such as collaborative/contract

research with universities and laboratories, effective use of national subsidies, and collaboration with other companies.

For smooth R&D activities, we focus on overall R&D management such as total administration of R&D expenses,

assessment/analysis of research projects that have been conducted for a set period of time, and preparation of

steering groups considering the status of R&D progress. Moreover, we provide training programs to cultivate

human resources, and also work to ensure full compliance.

R&D planning (mid-term research plan, new research proposal & business creation, open innovation)

R&D administration/support and human resources development

Innovation Core SEI, Inc. (ICS)

China Analysis Technology Center

No.232 Jinfeng Road, SND, Suzhou, Jiangsu, ChinaTEL: +86-512-6665-3090

2355 Zanker Road, San Jose, CA 95131, U.S.ATEL: +1-408-232-9511

San Jose office building

Redox flow battery introduced in US

Irrigation tube

Sand

Surface drip irrigation(conventional)

Bottom watering(newly developed)

Irrigation mat

High produce quality High produce quality by watering controlby watering control(pat. pending)(pat. pending)

High produce quality by watering control(pat. pending)

Water bath

Frontier Technologies Laboratory

R&D Planning & Administration Division

ICS was established in Silicon Valley, U.S.A as the

first overseas R&D base. By using Silicon Valley’s

resources and environment, we are working on

research and study for next generation technologies

and markets in the Automotive, Environment &

Energy and Infocommunications fields, as well as

new business development in the integrated fields.

Besides promoting the R&D projects, we are also

supporting the open innovation for R&D globaliza-

tion and the Global Internship Program.

The China Analysis Technology Center is located in

Suzhou, East China and provides analytical production

and development support for the Sumitomo Electric

Group.

The China analysis technology center is located

in the Sumitomo Electric Interconnect Products (Suzhou) Ltd. (SESZ) building.

Overseas Operations