RF and SOI Technologies for 5GKirk Ouellette
VP, World Wide Strategy Development and Strategic Marketing
RFSOI conference, SOI Consortium, Shanghai
September 19, 2018
Agenda• Introduction
• 5G Disruption – the need for new technologies
• ST Technologies for 5G – focus on mmWave
• 5G Roll-out - Other Innovative products from ST
2
Who We Are 3
Front-End
Back-End
Research & Development
Main Sales & Marketing
As of December 31, 2017
• Approximately 45,500 employees worldwide
• Approximately 7,400 people working in R&D
• 11 manufacturing sites
• Over 80 sales & marketing offices
• A global semiconductor leader
• 2017 revenues of $8.35B with year-on-year growth of 19.7%
• Listed: NYSE, Euronext Paris and Borsa Italiana, Milan
Coexistence with LPWAN technologies for low bandwidth IoT applications
5G : a Game Changerwith New Services Capabilities
4
Massive
Internet of Things
Smart Home, Smart City
Smart Industry, Smart Things
Massive Machine Type Communication
mMTC
User experience continuity
& Security
Exploding Data Demand
Improved mobility
Enhanced security
Enhanced Mobile Broadband
eMBB
Mission critical
applications
Autonomous driving, V2X, public safety
factory automation, eHealth
Ultra Reliable & Low Latency Communications
URLLC
LTE-M NB-IOT
Increase frequency/number of 5G bands are complementary 5
…but adds greater complexityABI Research 2018
The 5G Disruption 6
Very high data rate – x100*
Reduced latency – 5 times lower *
Very high reliability – 99,999%
Connections of millions of nodes
Improved coverage
New architecture with denser
network (small cells)
New technologies: Advanced
beam forming, massive MiMo
New spectrum: Use of millimeter
waves
Higher silicon integration
Improved RF performance
Enhanced power efficiency
Cost-optimized solutions
What it brings to the end users
What is changing in the infrastructure
What is required from microelectronics
* vs 4G
A unique portfolio of
differentiated technologies
11 manufacturing sites
Advanced R&D centers
around the globe
5G Networks Will Have More Cell Coverage
8
From base stations to connected devices via a myriad of small cells
ST is #2 for MCU for Smart Thingsover 2 Billion 32bits STM32 sold
ST has a unique broad portfolio for IoTSensors, MCU, connectivity, security, power management
Higher integration
Base stations Small cells Connected Devices
With continual new tech development and
manufacturing ST is a desirable partner for
5G infrastructure
Semi Content in Base Stations – RF is key 9
OTN Backhaul Box
RF TRX and PA box
Power SupplyDistribution
UPS battery pack
Antenna Elements RFFEM
Network BTS 900-1600 MHz
Switching to OTN
Power SupplyCabinet
Base StationCabinet
14%
18%
14%18%
9%
1%
26%
RF: 1/3 of the
entire value, and
increasing
High performance
analog and silicon
photonics
Power,
discrete and
sensors
Digital
• High performance analog (including photonics) and RF represents the large majority of the semiconductor value
• The weight of RF/Analog content will continue to grow as new RF bands are introduced
Semiconductor content estimation. Small cells + BTS
by technology segment 2021
5G Phase II
mmWave roll-out
2021 and beyond
Source: https://www.extremetech.com/extreme/158342-a-rare-look-inside-an-lte-cell-site-operated-by-sprint-in-san-francisco
ST PortfolioPer infrastructure type
10
Satellite
communication
• mmW receivers, transmitters, beamformers, synthesizers & RF Front-End
• Digital and mixed signal design, microcontrollers
• SiGe BiCMOS
• FD-SOI
• CMOS for RFTE
CH
NO
Wireless
infrastructure
• mmW receivers, transmitters, synthesizers and RF Front-End
• Digital and mixed signal design beamformers
• Signal conditioning, power & protection, microcontrollers
• SiGe BiCMOS
• RFSOI & GAN (with MACOM)
• FD-SOI
• CMOS for RF
• Si-Photonics PIC50-200/400G
TE
CH
NO
Wired
infrastructure
• Digital and mixed signal design.
• Signal conditioning, power & protection, microcontrollers, security
• FD-SOI
• FinFET designTE
CH
NO
Cloud and
Datacom
• Digital and mixed signal design
• Signal conditioning, power & protection, microcontrollers
• FD-SOI
• FinFET design
TE
CH
NO
11
Residential
Building
FrontHaul Fixed Wireless To the Home
Small Cell
~100m~500m
LoS
NLoS
Repeater
Base Station User Equipment
5G Mobility
5G mmW Network Infrastructurefor Fixed Wireless & Mobile Access
Disruptive technologies
1. New Radio (NR) mmW for more spectrum
2. Flat Panel Phase Array Antenna3. Beamforming
Today`s Wide range of mmW RF TEchnologiesto address 5G systems diversity
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RF mmW
FDSOI for Mixed SoC & Digital Integration � Already used for chipsets in Ku & Ka-Band SatCom solutions� Wide 28nm IP portfolio : PA, LNA, DAC, ADC, Serdes, Phase shifter, RF PLL, etc…
BiCMOS 9MW for Best mm2 cost� Proven mmW Design Platform with optimized libraries� Already used for chipsets in terrestrial backhaul solutions � Wide IP portfolio available : PA, LNA, Phase Shifter, Mixer etc…
RFSOI(H9SOI) for ultimate RFFE perf.� Low Insertion Loss mmW Switch integration� Ultra low noise LNA for mobile phone� 8inch wafer
SiGe – B9MW moving to 300mm - B55 13
Proven & solid Technology family:BiCMOS6G, BiCMOS7RF, BiCMO9MW, BiCMOS55
Future ProofBiCMOS055 (B55) is BEST IN CLASS
• THE ONLY high-speed BiCMOS technology • in 55-nm CMOS • fabricated in 300-mm manufacturing facility
B55 - One of the few technologies to fit requirements
of 100G/400G optics today
B55 - Well suited to meet the high performance needs of
mmWave 5G RF
ST SOI Roadmap
60 GHz
Dig
ital d
ensi
ty
F
H9SOIFEMRF FEM
Switch, LNA, PA
C28FDSOI -> 22FDXSOC : Digital, Analog, RF integration
6 GHz
In production MAT30
Next step to address above-6GHz 5G RF applications
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C65SOIFEMRF FEM + RF control
Switch ,LNA, PA Possible extension to TRX
2.5 GHz
Complementary offer with ST SOI + BiCMOS SiGe processes
NEW!PerformanceImprovement
Extension to mmW frequencies
C65SOIFEM Process Overview• Combination of C65RF and C65PDSOI previous MP processes
• Simplified Flow
• No compromise with RF performances to cover 5G Frequency range• PMOS and NMOS 65nm 1.2V GO1 (Ft around 200 GHz)
• drives LNA performances
• Dedicated 2.5V GO2 RF MOS • best RF Switch performances
• Full coper back-end• 5 Metal with thick coper to improve passives quality and minimize matching losses
• 2 different SOI substrates supported• High Resistivity (HR) for Receiver application • Trap Rich (TR) for Transmitter application requesting low Harmonics
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New
Flexible Architecture PartitioningThrough Differentiated Technologies
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DBF• Up/down converters
• AD / DA Converters
• Digital Beamformer
RFFE• Power Amplifiers
• Low Noise Amplifiers
• RF Switches
RFSOI FD-SOI
RFSOI BiCMOS
Antenna elements
RFFE-DBF• Power Amplifiers
• Low Noise Amplifiers
• RF Switches
• AD/DA Converters
FD-SOI
SerDes
Digital Beamforming
AnalogBeamforming
• Digital Beamformer
• System Calibrations
• DFE
• Local oscillator
• System calibrations
• DFE
• Local oscillator
RFFE-ABF• Power Amplifiers
• Low Noise Amplifiers
• RF Switches
• Phase Shifters
Transceiver• Up/down converters
• Local oscillator
SerDes
IQ
Innovative products for the 5G rollout from ST
17
New RF IPD with improved Capacitor Q factor
Old MIM cap New MIM cap
Q factor 3 x Better � Insertion Losses improved
New generation
Prior generation
5GHz band pass filter( N77 example, also compatible
with N79 )
New Tunable BST Capacitor with higher frequency range
0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 4.2
Frequency (GHz)
Actual PTIC resonancein n77 band
New PTICfor 5G
n77 band
• IMPEDANCE TUNING
• FREQUENCY TUNING
• PHASE SHIFTER
ActualNew
OK
Not OK
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• STuW1026R : 10 GHz to 26.5 GHz super-heterodyne Receiver • Backhauling point-to-point link • Microwave Communications
• STuW1026T : 10 GHz to 26.5 GHz super-heterodyne and ZIF Transmitter with embedded DPD loopback receiver• Backhauling point-to-point link • Satellite communication return channel • Microwave Communications
Gateways
Residential
Satellite Communications
Building
Terrestrial Backhauling
Cost-effective SiGe-based devices enabling the transition from GaAs solutions
5G Network Backhauling solutions
SPARCLink 60 GHz RF TransceiverRF mmW Short Range Connectivity
High-speed, low-power wireless link for close proximity data transmission
InstantaneousData Transfer
SeamlessDocking
Flex cablereplacement
6 Gbps - SLVSStandard Interfaces(USB, DisplayPort) 10 Gbps
SPARCLinkA2
SPARCLinkA3
SPARCLinkA4
• From 1 Mbps up to 6 Gbps
• Very low power solution with a power budget of just 40 mW
• Miniature form factor with optimized BoM
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SPARCLink 60 GHz RF Transceiver Taking CE Designs to the Next Level
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Robust contactless connectors for
industrial applications
Board-to-board
connexion
Life-proof
connector-less devices
On the go
Device-to-device sync
Smart connector-less
Docking stations
PC 2-in-1 and
mobile continuum
Connector-less devices Board-to-board flex-less solutions
5G Technology from ST - Takeaway• 5G and 5G Phase II require new technologies to meet performance requirements
• mmWave frequencies especially require new materials for both base stations and terminals• IDMs are the best equipped partners to offer new technologies solutions and manufacturing
• ST has a wide range of RF technology solutions, with high silicon integration capability • BiCMOS, CMOS, FD-SOI, RF-SOI
• ST has developed high performance mmW RF solutions for 10+ years : • RF Transceiver products up to 60Ghz
• ST pioneered beamforming solutions for Satcom market • RF Front-end (PA, LNA), Transceiver & Beamformer products – technology can be re-deployed for 5G
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ST is a unique partner for 5G mmWave IC development
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