RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS

$Page 1: RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS$
RFCONNEXT, Inc.

A Technology Overview

Advancing the High Speed Interconnect Ecosystem…™

Jamal S. Izadian, [email protected]

408-981-3700March 1, 2010

www.rfconnext.com

Mission

• Squeeze More Performance Out of Copper Interconnects

• Diminish the Cost of Copper Bandwidth• Advance the High Speed Interconnect

6/7/2008Copyright 2008-2010 RFCONNEXT, Inc., Contains Patents Pending Materials

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• Advance the High Speed Interconnect Ecosystem™…Improve Signal and Power Integrity with Higher Speed Connectivity, Across the

Spectrum

Business Model

• Innovate, Validate, Critical Elements of – High Speed Interconnect Ecosystem

• Provide – Interconnect products with Improved


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– Interconnect products with Improved Bandwidth

– Engineering Support, Services and Solutions– Embedded IP Development Kits/Licensing

• Make it Greener

Evolution of Advanced Transmission Lines

Microstrip Stripline

Copyright 2008-2010 RFCONNEXT, Inc., Contains Patents Pending Materials

4

PMTL™/VMTL™/SMTL™

Transmission lines currently used in CMOS, Packaging, and PCB industry

Advanced Transmission Lines

6/7/2008

3D High Speed Interconnect Solutions

• Disruptive Patent Pending technologies– PMTL™ , Periodic Micro Transmission Lines– VMTL™ , Via Micro Transmission Lines– SMTL™ , Shaped Membrane Transmission Lines

• Enabling the High Speed Interconnect Ecosystem

Copyright 2008-2010 RFCONNEXT, Inc., Contains Patents Pending Materials

56/7/2008

What are PMTL™, VMTL™, and SMTL™?

• A family of fundamental printable coaxial-like transmission lines technologies that– Significantly improve

• Speed, Bandwidth, Edge Rate

– Significantly Reduces• EMI, Crosstalk, Noise, Delay, Dispersion

– Provides Excellent• SE and Diff Impedance

– Supports existing Materials and Fab. Processes6/7/2008Copyright 2008-2010 RFCONNEXT, Inc.,

Contains Patents Pending Materials6

PMTL™ - Periodic Micro Transmission Lines™

• Connects any points on the same layers with full bandwidth

• Uses existing design, layout, and fabrication • Uses existing design, layout, and fabrication methods

• Provides at least 30% improved electrical performance, on FR4, more on Premium Materials


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VMTL™ - Vertical Micro Transmission Lines™

• Connects any two or multiple stacked layers with full bandwidth

• Replaces problematic via stacks to connect • Replaces problematic via stacks to connect vertical Layers– At high speed– No parasitic

• Is compatible with PMTL™ and MS,SL,CPW


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SMTL™ - Shaped Membrane Transmission Lines™

• Stackable membrane interconnects– Embedded Transmission Lines

• Full bandwidth PMTL/VMT• Traditional MS, SL, CPW etc…

• Full 3D Interconnect, Over The Top• Full 3D Interconnect, Over The Top– Replaces Wire bonds in packaging– Allows die stacking– Allows Package Stacking– Allows PCB stacking

• Provides “More than Moore”….Gate/Function Density


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3D Interconnect Attributes

• Wide band TEM DC-220GHz and beyond, no dispersion• Can be Printed on, Rigid, Flex, PCB, even on Wafer• Flexes, twists, turns, bends, maintains excellent phase,

amplitude, delay, skew, and impedance


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amplitude, delay, skew, and impedance• Lower Power Loss, Lowest Cross Talk, Low ISI• Provide Thermal management and Power Integrity• It is stackable, array able, in 2D and 3D• Material/Process Independent

Advanced Interconnects Embedded in Products/Markets

• Cables and Connectors• PCB’s Backplanes Motherboard and

Daughterboard• Electronic Packaging, Wafer Level


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• Electronic Packaging, Wafer Level Interconnects

• Test and Measurement /Instrumentation• Mobile Handsets, Wireless,

Microwave/RF/MMW

Cables and Connectors

• Coaxial Cabling and Flex– High Performance, Assemblies– Generic Cabling, Cable Bundles

• Connectors• Connectors– Coaxial, Single, and Ganges, SMA, SSMB, K, V – PCB Connectors, Sockets, Interfaces, PCIe,

• High Speed Twisted Pairs Cabling– HDMI, Ethernet/Cat 5,6,7– USB/DVI/FireWire etc…


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PCB Multilayer Boards

• Servers– Mother Board – Daughter Board

• Connectors/Sockets• Connectors/Sockets• Routers

– Backplanes, Plug-in

• Memory Boards/ DDR3/4 DIMM• Communication Networks/Switches


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Packaging ,Wafer and Chip Level

• SMTL, mm Wave Packaging– PMTL/VMTL coaxial –like interconnect– Replace Wire Bonding

• Chip Level Packaging (CLP) Wafer Level • Chip Level Packaging (CLP) Wafer Level Packaging(WLP)– SxS (Side by Side) flip chips – Die Stacking ,uSD, SD, USB, DDR– SiP (System in Package), PoP, Pup, MCM– PCB Stacks, OTT High Speed Lanes


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Test and Measurements (TAM)• ATE Interfaces

– ATE internal Fan-out– Spatial Transformers– Load Boards/Load Cards– Standardization of Device Interface– Standardization of Device Interface

• Universal Test Sockets– BGA, LGA, QFN, TOP etc…

• Personal Desktop Probe Stations– Probes/Fixtures/Handy probes/ RF Clips


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RF/Microwaves mm Waves

• Mobile Handset Boards/Packages Miniaturization

• Antennas and Antenna Interconnects• Wide band low loss Optical Power • Wide band low loss Optical Power

Combiners• Low Loss Beam Forming Networks(BFN)• Low Cost Transmitter - receivers Modules

Integration on FR4


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Some High Speed Digital Applications

• Wide Band Lanes (XAUI, DVI, USB, SGBe, FC, 10GBase-T, SATA, InfiniBand, PCIe, …)

• SerDes’(ization) Printed active Cabling,


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– With embedded Active, Chips, Serdes, E-Passives

• Higher Speed Routers/ Servers/PC’s but less crowded routing, shrinking in size

• Could Replace Some Fiber links with Copper on PCB’s

Measured Performance of PMTL™ on Flex compared to Similar Coaxial transmission lines

TECHNOLOGY VALIDATION

compared to Similar Coaxial transmission lines

Following Measured TDR and Eye Diagrams Courtesy Of Spectrum Integrity, Inc.

Following Insertion Loss Measurements Courtesy Of Samtec, Inc. Signal Integrity Group

Prototypes

The following results were taken from the first prototypes developed. These prototypes were handled extensively and as such these results lessons learned will improve the future prototypes.

Material: Pyralux- Connectors: Samtec – Length 6”Designed for 20GHz

Material: Pyralux - Connectors: Southwest Microwave – Length 6”

6/7/2008 19Copyright 2008-2010 RFCONNEXT, Inc., Contains Patents Pending Materials

Measured Insertion Loss of PMTL™ uFlex vs. Other Transmission Lines over DC-50GHz(All for 6” length)

Insertion Loss Comparison

-8

-6

-4

-2

0

Inse

rtio

n L

oss

(d

B)

uCoax_Teflon_Calculated

Equivalent microstrip Line


20

-20

-18

-16

-14

-12

-10

0 5 10 15 20 25 30 35 40 45 50

Frequency (GHz)

Inse

rtio

n L

oss

(d

B)

RF Flex PMTL 0820080.141" Reshapable Coax 0.020" Semi-rigid Coax1AL PMTL 0315081BL PMTL 0311082AL PMTL 0315083AL PMTL 031508IIIL PMTL 031508uCoax_Teflon_CalcuCoax_Kapton_Calc

uCoax_Kapton_Calculated

PMTL can Beat equivalent Coaxial Line

Pyralux, 3 Layer ResultsResults from Pyralux material and connectors designed for 20 GHz testing

10 GHz 28GHz 32GHz 40GHz

Time in ps

P2PJitte

r

Rise/FallTime

P2PJitte

r

Rise/FallTime

P2PJitter

Rise/FallTime

P2PJitter

Rise/FallTime

Control 2.2 9.3 / 8.4 2 8.8 / 7.7 3 8.7 / 6.7 4.8 9.7 / 8.0

Flex 4.4 20.4 / 5.1 16.6 / 8.3 17.5 / 16.0 20.4 / 19.7Flex 4.4 20.4 / 18.2

5.1 16.6 /15.3

8.3 17.5 / 15.5

16.0 20.4 / 19.7


Pyralux 4 Layer ResultsResults from Pyralux sample

10 GHz 28GHz 32GHz

Time in ps

P2PJitte

r

Rise/FallTime

P2PJitte

r

Rise/FallTime

P2PJitter

Rise/FallTime

Control

2.2 9.3 / 8.4 2.0 8.8 / 7.7 3.0 8.7 / 6.7

Flex 4.8 26.6 / 23.5 6.6 29.1 / 25.3 4.4 20.4 / 18.2


TDR, Impedance Profile

6”, 3 Layer PMTL, designed for 20GHz, Kapton, SMA Connectors, Sample S1


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6”, 4 Layer PMTL, designed for 50GHz, Kapton, 2.92mm Conn., Samples 1A and 3A

Way Forward• Insert RFC technologies to improve

performance/cost ratio• Provide Products and Engineering Services

– Test/ Measurement /Evaluation….– SMTL™ enabled mmWave High Speed

Packaging– mmWave Interface with Optical Component

• Provide new wideband cabling/connectors• Flat connectors to replace SMA, SSMP, K, and V


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Additional Information Links• Watch The Stability and No Dispersion of PMTL™ uFlex Under Live TDR • Comparing Fields inside a typical Package with Gold Wire Bonds vs. SMTL™,

Shaped Membrane Transmission Lines

• Comparing The Hard Disk Drive (HDD) Signal Integrity and EMI Shielding Using Traditional Flex and the New PMTL™ uFlex

• Advancing Test and Measurement Instrumentation using PMTL™, VMTL™, and SMTL™ Technologies ATE, Test Sockets, Load Boards, Device and SMTL™ Technologies ATE, Test Sockets, Load Boards, Device Interface

• RFCONNEXT TEST and Measurement Catalogue 2009 and 2010• Application of PMTL™/VMTL™ for Improving DDR Signal Integrity, Skew

and Jitter• Eric Bogatin, of BeTheSignal.com Interviews Jamal Izadian at

DesignCon2010 about PMTL™• Download More Info at http://www.rfconnext.com/WHITE%20PAPERS.html


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APPENDIX

More Measured Eye Diagram Data

10Gbps,6” PMTL’s Samples 1S, 1A, and 3A Eyes

Ref. TP1 Instrument

Sample 1A


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Sample 1S Sample 3A

14Gbps,6” PMTL’s Samples 1S, 1A, and 3A Eyes

Ref. TP1 Instrument

Sample 1A


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Sample 1S Sample 3A

10GBps, and 14GBps ~10” FR4 MS Trace

Ref. TP1 Instrument, 10Gbps

Ref. TP1 Instrument, 14Gbps


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10” FR4 Sample , 10Gbps

10” FR4 Sample , 14Gbps

22.5 and 28 GHz Baselines

1A Flex 1ALRef. TP1

22.5

GH

z


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22.5

GH

z28

GH

z

32 And 40 GHz Baseline32

GH

z1A FlexRef. TP1


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40 G

Hz

Demonstrating More Applications of PMTL™/VMTL™of PMTL™/VMTL™

A Sample of Prototypes


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Wafer Probe With integrated High Speed uFlex Cable


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High Speed Flex uCables, Alternate Bending


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RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS

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