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Roll-to-Roll Fabrication Technology for Organic
Semiconductors
Jae Young ChoiNov. 13, 2007
Cost Saving, Simple Fabrication ProcessProducesFlexible Semiconductor Devices !
Roll-to-Roll Process
Motivation
- Low-temperature deposition- Mechanically Flexible- Light weight and shock proof- Chemical Sensitivity- Solution Processing
Organic Semiconductors
Non-Flexible DeviceExpensive Manufacturing Process
Complex Fabrication Process
Silicon Based Semiconductors
Why?
BackgroundOTFT (Organic TFT)
OverviewRoll-to-Roll Processing
Example:e-paper
manufacturing
Technology ISubstrate Materials
GlassPlastic (PEN,
PI)Stainless Steel
• Optical Properties (Transparency)• Surface Smoothness• Thermal Expansion (Maximum Process Temperature)• Stiffness ( Durability, Flexibility, Young’s Modulus)
Properties to be Considered
Technology IINovel Patterning Techniques (1)
Soft Lithography
- Mask and substrate contact may result in defects- Mask damage & stamping material life time
Issues
Technology II
Embosser Mold & Embossed Microcups
Novel Patterning Techniques (2)
E-paper by SiPix
Technology IINovel Patterning Techniques (3)
Laser Ablation
Recent Technology- Resolution: 120 pt/in- Droplet size: 10-80 picoliters- Speed: 200 mm/sec
Suffer form Drop Displacement Accuracy
-Faster than RIE -Produces Cleaner lines than Thermal and Mechanical Drilling
Inkjet Printing
Technology IIIPackaging:Barrier Layer
Low work function metals oxide very easily Moisture & Oxygen Free Environment Needed
Requirement Water transmission rate = less than 10-6 g m‐2/day
Oxygen transmission rates = less than 10‐5 mL m‐2/day
Barix Coating TechniqueUsing continuous, roll-to-roll
vacuum processing
Directly Coating on the Top Eliminating the glued-on
metal can or the extra sheet of glass
Much thinner, lighter, more reliable display with low cost
Conclusion: Now & Future
Organic LED (OLED)
Organic Solar Cell
Organic TFT
Organic Sensors
APPLICATIONS
$5M $339M
83.5 %Per year
Flexible Display Market Growth
2006 2013
1. Cost Saving2. Simple Fabrication Process3. Flexible Semiconductor Devices
Roll-to-Roll Process
Not so much cost saving yet“Killer Application” is Needed
Reference
1. Evan Schwartz, “Roll to Roll Processing for Flexible Electronics,” 2. Jain, K. Klosner, M. Zemel, M. Raghunandan, S., “Flexible electronics and
displays: high-resolution, roll-to-roll, projection lithography and photoablation processing technologies for high-throughput production,”
3. Chin, Spencer. “Report: Flex display market to grow 83.5% a year.” EETimes Online. March 23, 2006.
4. Jain, K. “Flexible Electronics and Displays: High‐Resolution, Roll‐to‐Roll, Projection Lithography and Photoablation Processing Technologies for High‐ Throughput Production.” Proc. IEEE, 93, 1500‐1510, (2005).
5. Tan et. al. “Roller Nanoimprint Lithography.” J. Vac. Sci. Technol. B 16, 3926 (1998).
6. Vitex Systems, Inc. “The Guardian Tool.” Available online: http://www.vitexsys.com/guardian.html.
7. SiPix Imaging, Inc. “roll-to-roll© Manufacturing Process. Flexible Displays & Electronics”, 2004.