254
Section 4 Technical Summary and Application GuidelinesINTRODUCTION
Tantalum capacitors are manufactured from a powder of puretantalum metal OxiCapreg - niobium oxide capacitor is madefrom niobium oxide NbO powder The typical particle size isbetween 2 and 10 μm
Figure below shows typical powders Note the very great difference in particle size between the powder CVsg
4000μFV 20000μFV 50000μFVFigure 1a Tantalum powder
Figure 1b Niobium Oxide powder
The powder is compressed under high pressure around aTantalum or Niobium wire (known as the Riser Wire) to form aldquopelletrdquo The riser wire is the anode connection to the capaci-tor
This is subsequently vacuum sintered at high temperature (typically 1200 - 1800degC) which produces a mechanicallystrong pellet and drives off any impurities within the powder
During sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice
This structure is of high mechanical strength and density butis also highly porous giving a large internal surface area (seeFigure 2)
The larger the surface area the larger the capacitance Thushigh CVg (capacitance voltage product per gram) powderswhich have a low average particle size are used for low voltage high capacitance parts
By choosing which powder and sinter temperature is used toproduce each capacitancevoltage rating the surface areacan be controlled
The following example uses a 220μF 6V capacitor to illustratethe point
C =or A
d
where o is the dielectric constant of free space
(8855 x 10-12 Faradsm)
r is the relative dielectric constant
= 27 for Tantalum Pentoxide
= 41 for Niobium Pentoxided is the dielectric thickness in meters C is the capacitance in Farads
and A is the surface area in meters
Rearranging this equation gives
A =C dor
thus for a 220μF6V capacitor the surface area is 346 squarecentimeters or nearly a half times the size of this page
The dielectric is then formed over all the Tantalum or niobiumoxide surfaces by the electrochemical process of anodizationTo activate this the ldquopelletrdquo is dipped into a very weak solutionof phosphoric acid
The dielectric thickness is controlled by the voltage appliedduring the forming process Initially the power supply is kept in a constant current mode until the correct thickness ofdielectric has been reached (that is the voltage reaches thelsquoforming voltagersquo) it then switches to constant voltage modeand the current decays to close to zero
Figure 2 Sintered Anode
255
The chemical equations describing the process are asfollows
Tantalum Anode 2 Ta rarr 2 Ta5+ + 10 e- 2 Ta5+ + 10 OH-rarr Ta2O5 + 5 H2O
Niobium Oxide Anode
2 NbO rarr 2 NbO3+ + 6 e-2 NbO3+ + 6 OH-rarr Nb2O5 + 3 H2O
Cathode
Tantalum 10 H2O ndash 10 e rarr 5H2 + 10 OH-
Niobium Oxide 6 H2O ndash 6 e- rarr 3H2 + 6 OH-
The oxide forms on the surface of the Tantalum or NiobiumOxide but it also grows into the material For each unit ofoxide two thirds grows out and one third grows in It is forthis reason that there is a limit on the maximum voltage rat-ing of Tantalum amp Niobium Oxide capacitors with presenttechnology powders (see Figure 3)
The dielectric operates under high electrical stress Considera 220μF 6V part
Formation voltage = Formation Ratio x Working Voltage = 35 x 6 = 21 VoltsTantalumThe pentoxide (Ta2O5) dielectric grows at a rate of 17 x 10-9 mV
Dielectric thickness (d) = 21 x 17 x 10-9
= 0036 μm
Electric Field strength = Working Voltage d= 167 KVmm
Niobium OxideThe niobium oxide (Nb2O5) dielectric grows at a rate of 24 x 10-9 mV
Dielectric thickness (d) = 21 x 24 x 10-9
= 0050 μm
Electric Field strength = Working Voltage d= 120 KVmm
Figure 3 Dielectric layer
The next stage is the production of the cathode plate This is achieved by pyrolysis of Manganese Nitrate intoManganese Dioxide
The ldquopelletrdquo is dipped into an aqueous solution of nitrate andthen baked in an oven at approximately 250degC to producethe dioxide coat The chemical equation is
Mn (NO3)2 rarr MnO2 + 2NO2 ndash
This process is repeated several times through varyingspecific densities of nitrate to build up a thick coat over all internal and external surfaces of the ldquopelletrdquo as shown inFigure 4
Figure 4 Manganese Dioxide Layer
The ldquopelletrdquo is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate Electrical contact is established by depositionof carbon onto the surface of the cathode The carbon is then coated with a conductive material to facilitate connectionto the cathode termination (see Figure 5) Packaging is carriedout to meet individual specifications and customer require-ments This manufacturing technique is adhered to for thewhole range of AVX Tantalum capacitors which can be subdi-vided into four basic groups Chip Resin dipped Rectangular boxed Axial
Further information on production of Tantalum Capacitorscan be obtained from the technical paper ldquoBasic TantalumTechnologyrdquo by John Gill available from your local AVX representative
Figure 5 Cathode Termination
Anode Manganese Graphite Outer Silver Cathode
Dioxide Silver Layer Epoxy Connection
Technical Summary and Application Guidelines
11 CAPACITANCE
111 Rated capacitance (CR)This is the nominal rated capacitance For tantalum andOxiCapreg capacitors it is measured as the capacitance of theequivalent series circuit at 25degC using a measuring bridgesupplied by a 05V rms 120Hz sinusoidal signal free of har-monics with a bias of 22Vdc
112 Capacitance toleranceThis is the permissible variation of the actual value of thecapacitance from the rated value For additional readingplease consult the AVX technical publication ldquoCapacitanceTolerances for Solid Tantalum Capacitorsrdquo
113 Temperature dependence of capacitanceThe capacitance of a tantalum capacitor varies with temper-ature This variation itself is dependent to a small extent onthe rated voltage and capacitor size
114 Frequency dependence of the capacitance The effective capacitance decreases as frequency increasesBeyond 100kHz the capacitance continues to drop until res-onance is reached (typically between 05 - 5MHz dependingon the rating) Beyond the resonant frequency the devicebecomes inductive
12 VOLTAGE
121 Rated dc voltage (VR)
This is the rated dc voltage for continuous operation up to85degC (up to 40degC for TLJ TLN NLJ series)
Operating voltage consists of the sum of DC bias voltage andripple peak voltage The peak voltage should not exceed thecategory voltage For recommended voltage (application) der-ating refer to figure 2c of the SECTION 3
122 Category voltage (VC)
This is the maximum voltage that may be applied continu-ously to a capacitor It is equal to the rated voltage up to+85degC (up to 40degC for TLJ TLN NLJ series) beyond whichit is subject to a linear derating to 23 VR at 125degC for tanta-lum and 23 VR at 105degC for OxiCapreg
123 Surge voltage (VS)
This is the highest voltage that may be applied to a capacitor forshort periods of time in circuits with minimum series resistance of33Ohms (CECC states 1kΩ) The surge voltage may be appliedup to 10 times in an hour for periods of up to 30 seconds at atime The surge voltage must not be used as a parameter in thedesign of circuits in which in the normal course of operation thecapacitor is periodically charged and discharged
SECTION 1ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
TAJE227K010
85degC Tantalum 125degC Tantalum
Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS
2 27 13 17 25 33 17 22 3 39 2 26 4 52 27 34 5 65 33 4 63 8 4 5 10 13 7 8 16 20 10 13 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40
85degC OxiCapreg 105degC OxiCapreg
Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS
18 23 12 16 25 33 17 22 4 52 27 34 63 8 4 5 10 13 7 8
Technical Summary and Application Guidelines
For THJ 175degC Category amp Surge voltage see THJ section on pages 131-136For individual part number please refer to SpiTan Software for frequencyand temperature behavior found on AVX Corporation website
256 112917
112917 257
124 Effect of surgesThe solid Tantalum and OxiCapreg capacitors have a limitedability to withstand voltage and current surges This is incommon with all other electrolytic capacitors and is due tothe fact that they operate under very high electrical stressacross the dielectric For example a 6 volt tantalum capacitorhas an Electrical Field of 167 kVmm when operated at ratedvoltage OxiCapreg capacitors operate at electrical field signifi-cantly less than 167 kVmm
It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating
Solid tantalum capacitors and OxiCapreg have a self healingability provided by the Manganese Dioxide semiconductinglayer used as the negative plate However this is limited inlow impedance applications In the case of low impedancecircuits the capacitor is likely to be stressed by current surges
Derating the capacitor increases the reliability of the com-ponent (See Figure 2b page 264) The ldquoAVX RecommendedDerating Tablerdquo (page 266) summarizes voltage rating for use on common voltage rails in low impedance applica-tions for both Tantalum and OxiCapreg capacitors
In circuits which undergo rapid charge or discharge a protective resistor of 1ΩV is recommended If this isimpossible a derating factor of up to 70 should be usedon tantalum capacitors OxiCapreg capacitors can be usedwith derating of 20 minimum
In such situations a higher voltage may be needed than is available as a single capacitor A series combination should be used to increase the working voltage of the equivalentcapacitor For example two 22μF 25V parts in series is equiv-alent to one 11μF 50V part For further details refer to JA Gillrsquospaper ldquoInvestigation into the Effects of Connecting TantalumCapacitors in Seriesrdquo available from AVX offices worldwide
NOTEWhile testing a circuit (eg at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients which will not be seen in normal use These conditions should be borne in mind when considering thecapacitorrsquos rated voltage for use These can be controlled byensuring a correct test resistance is used
125 Reverse voltage and Non-Polar operationThe values quoted are the maximum levels of reverse voltagewhich should appear on the capacitors at any time Theselimits are based on the assumption that the capacitors arepolarized in the correct direction for the majority of theirworking life They are intended to cover short term reversalsof polarity such as those occurring during switching tran-sients of during a minor portion of an impressed waveformContinuous application of reverse voltage without normalpolarization will result in a degradation of leakage current Inconditions under which continuous application of a reverse
voltage could occur two similar capacitors should be used ina back-to-back configuration with the negative terminationsconnected together Under most conditions this combinationwill have a capacitance one half of the nominal capacitanceof either capacitor Under conditions of isolated pulses orduring the first few cycles the capacitance may approachthe full nominal value The reverse voltage ratings are designedto cover exceptional conditions of small level excursions intoincorrect polarity The values quoted are not intended tocover continuous reverse operation
The peak reverse voltage applied to the capacitor must notexceed
10 of the rated dc working voltage to a maximum of 10v at 25degC
3 of the rated dc working voltage to a maximum of 05v at 85degC
1 of the rated dc working voltage to a maximum of 01v at 125degC (01v at 150degC THJ Series)
Note Capacitance and DF values of OxiCapreg may exceedspecification limits under these conditions
126 Superimposed AC Voltage (Vrms) - Ripple Voltage
This is the maximum rms alternating voltage superim-posed on a dc voltage that may be applied to a capacitorThe sum of the dc voltage and peak value of the superimposed ac voltage must not exceed the categoryvoltage vc
Full details are given in Section 2
127 Forming voltageThis is the voltage at which the anode oxide is formed Thethickness of this oxide layer is proportional to the formation volt-age for a capacitor and is a factor in setting the rated voltage
Technical Summary and Application Guidelines
13 DISSIPATION FACTOR ANDTANGENT OF LOSS ANGLE (TAN D)
131 Dissipation factor (DF)Dissipation factor is the measurement of the tangent of theloss angle (tan ) expressed as a percentage The measure-ment of DF is carried out using a measuring bridge that supplies a 05V rms 120Hz sinusoidal signal free of harmonics with a bias of 22Vdc The value of DF is temperatureand frequency dependent
Note For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate
132 Tangent of Loss Angle (tan )This is a measurement of the energy loss in the capacitor Itis expressed as tan and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency Terms also used are power factor loss factorand dielectric loss Cos (90 - ) is the true power factor Themeasurement of tan is carried out using a measuringbridge that supplies a 05V rms 120Hz sinusoidal signal freeof harmonics with a bias of 22Vdc
133 Frequency dependence of Dissipation FactorDissipation Factor increases with frequency as shown in thetypical curves that are for tantalum and OxiCapreg capacitorsidentical
Typical DF vs Frequency
134 Temperature dependence of DissipationFactor
Dissipation factor varies with temperature as the typical curvesshow These plots are identical for both Tantalum and OxiCapreg
capacitors For maximum limits please refer to ratings tables
Typical DF vs Temperature
14 IMPEDANCE (Z) AND EQUIVALENTSERIES RESISTANCE (ESR)
141 Impedance ZThis is the ratio of voltage to current at a specified frequencyThree factors contribute to the impedance of a Tantalum capac-itor the resistance of the semiconductor layer the capacitancevalue and the inductance of the electrodes and leads
At high frequencies the inductance of the leads becomes a limiting factor The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z The impedance is measured at 25degCand 100kHz
142 Equivalent Series Resistance ESRResistance losses occur in all practical forms of capacitorsThese are made up from several different mechanismsincluding resistance in components and contacts viscousforces within the dielectric and defects producing bypasscurrent paths To express the effect of these losses they areconsidered as the ESR of the capacitor The ESR is frequencydependent and can be found by using the relationship
ESR =
tan δ 2πfC
Where f is the frequency in Hz and C is the capacitance infarads
The ESR is measured at 25degC and 100kHz
ESR is one of the contributing factors to impedance and at high frequencies (100kHz and above) it becomes thedominant factor Thus ESR and impedance become almostidentical impedance being only marginally higher
143 Frequency dependence of Impedance and ESRESR and Impedance both increase with decreasing frequen-cy At lower frequencies the values diverge as the extra con-tributions to impedance (due to the reactance of the capac-itor) become more significant Beyond 1MHz (and beyondthe resonant point of the capacitor) impedance againincreases due to the inductance of the capacitor TypicalESR and Impedance values are similar for both tantalum andniobium oxide materials and thus the same charts are validfor both for Tantalum and OxiCapreg capacitors
Typical ESR vs Frequency
5
45
4
35
325
2
151
05001 1 10
ES
R M
ultip
lier
Frequency (kHz)
Tantalum
OxiCapreg
100 1000
18
17
1615
14
1312
111
0908
-55 -5 45 95
Temperature (Celsius)
TantalumOxiCapreg
DF
Mu
ltip
lier
50
5
1
0101 1 10 100
Frequency (kHz)
Tantalum OxiCapreg
DF
Mu
ltip
lier
Technical Summary and Application Guidelines
258 112917
Technical Summary and Application Guidelines
Typical Impedance vs Frequency
144 Temperature dependence of the Impedanceand ESR
At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow
Typical 100kHz ESR vs Temperature
15 DC LEAKAGE CURRENT
151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors
Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage
152 Temperature dependence of the leakage current
The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula
Vmax = 1- (T - 85) x VR
125 where T is the required operating temperature
LEAKAGE CURRENT vs TEMPERATURE
153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details
For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve
100
10
1
0101 1 10
Frequency (kHz)
Tantalum
OxiCapreg
Imp
ed
an
ce M
ultip
lier
100 1000
0 20 40Temperature (Celsius)
Tantalum
OxiCapreg
Ch
an
ge in
ES
R
60 80 100 125 150-20-40-55
18
1716
15
14
13
1211
109
08
10
100
1
01
Temperature (degC)Le
akag
e cu
rrent
ratio
IIR
20
20 40 60 80 1000-20-40 175150125
1
01
0010 20 40 60 80 100
Rated Voltage (VR)
Leakage Currentratio IIVR
TypicalRange
LEAKAGE CURRENT vs RATED VOLTAGE
112917 259
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
255
The chemical equations describing the process are asfollows
Tantalum Anode 2 Ta rarr 2 Ta5+ + 10 e- 2 Ta5+ + 10 OH-rarr Ta2O5 + 5 H2O
Niobium Oxide Anode
2 NbO rarr 2 NbO3+ + 6 e-2 NbO3+ + 6 OH-rarr Nb2O5 + 3 H2O
Cathode
Tantalum 10 H2O ndash 10 e rarr 5H2 + 10 OH-
Niobium Oxide 6 H2O ndash 6 e- rarr 3H2 + 6 OH-
The oxide forms on the surface of the Tantalum or NiobiumOxide but it also grows into the material For each unit ofoxide two thirds grows out and one third grows in It is forthis reason that there is a limit on the maximum voltage rat-ing of Tantalum amp Niobium Oxide capacitors with presenttechnology powders (see Figure 3)
The dielectric operates under high electrical stress Considera 220μF 6V part
Formation voltage = Formation Ratio x Working Voltage = 35 x 6 = 21 VoltsTantalumThe pentoxide (Ta2O5) dielectric grows at a rate of 17 x 10-9 mV
Dielectric thickness (d) = 21 x 17 x 10-9
= 0036 μm
Electric Field strength = Working Voltage d= 167 KVmm
Niobium OxideThe niobium oxide (Nb2O5) dielectric grows at a rate of 24 x 10-9 mV
Dielectric thickness (d) = 21 x 24 x 10-9
= 0050 μm
Electric Field strength = Working Voltage d= 120 KVmm
Figure 3 Dielectric layer
The next stage is the production of the cathode plate This is achieved by pyrolysis of Manganese Nitrate intoManganese Dioxide
The ldquopelletrdquo is dipped into an aqueous solution of nitrate andthen baked in an oven at approximately 250degC to producethe dioxide coat The chemical equation is
Mn (NO3)2 rarr MnO2 + 2NO2 ndash
This process is repeated several times through varyingspecific densities of nitrate to build up a thick coat over all internal and external surfaces of the ldquopelletrdquo as shown inFigure 4
Figure 4 Manganese Dioxide Layer
The ldquopelletrdquo is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate Electrical contact is established by depositionof carbon onto the surface of the cathode The carbon is then coated with a conductive material to facilitate connectionto the cathode termination (see Figure 5) Packaging is carriedout to meet individual specifications and customer require-ments This manufacturing technique is adhered to for thewhole range of AVX Tantalum capacitors which can be subdi-vided into four basic groups Chip Resin dipped Rectangular boxed Axial
Further information on production of Tantalum Capacitorscan be obtained from the technical paper ldquoBasic TantalumTechnologyrdquo by John Gill available from your local AVX representative
Figure 5 Cathode Termination
Anode Manganese Graphite Outer Silver Cathode
Dioxide Silver Layer Epoxy Connection
Technical Summary and Application Guidelines
11 CAPACITANCE
111 Rated capacitance (CR)This is the nominal rated capacitance For tantalum andOxiCapreg capacitors it is measured as the capacitance of theequivalent series circuit at 25degC using a measuring bridgesupplied by a 05V rms 120Hz sinusoidal signal free of har-monics with a bias of 22Vdc
112 Capacitance toleranceThis is the permissible variation of the actual value of thecapacitance from the rated value For additional readingplease consult the AVX technical publication ldquoCapacitanceTolerances for Solid Tantalum Capacitorsrdquo
113 Temperature dependence of capacitanceThe capacitance of a tantalum capacitor varies with temper-ature This variation itself is dependent to a small extent onthe rated voltage and capacitor size
114 Frequency dependence of the capacitance The effective capacitance decreases as frequency increasesBeyond 100kHz the capacitance continues to drop until res-onance is reached (typically between 05 - 5MHz dependingon the rating) Beyond the resonant frequency the devicebecomes inductive
12 VOLTAGE
121 Rated dc voltage (VR)
This is the rated dc voltage for continuous operation up to85degC (up to 40degC for TLJ TLN NLJ series)
Operating voltage consists of the sum of DC bias voltage andripple peak voltage The peak voltage should not exceed thecategory voltage For recommended voltage (application) der-ating refer to figure 2c of the SECTION 3
122 Category voltage (VC)
This is the maximum voltage that may be applied continu-ously to a capacitor It is equal to the rated voltage up to+85degC (up to 40degC for TLJ TLN NLJ series) beyond whichit is subject to a linear derating to 23 VR at 125degC for tanta-lum and 23 VR at 105degC for OxiCapreg
123 Surge voltage (VS)
This is the highest voltage that may be applied to a capacitor forshort periods of time in circuits with minimum series resistance of33Ohms (CECC states 1kΩ) The surge voltage may be appliedup to 10 times in an hour for periods of up to 30 seconds at atime The surge voltage must not be used as a parameter in thedesign of circuits in which in the normal course of operation thecapacitor is periodically charged and discharged
SECTION 1ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
TAJE227K010
85degC Tantalum 125degC Tantalum
Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS
2 27 13 17 25 33 17 22 3 39 2 26 4 52 27 34 5 65 33 4 63 8 4 5 10 13 7 8 16 20 10 13 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40
85degC OxiCapreg 105degC OxiCapreg
Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS
18 23 12 16 25 33 17 22 4 52 27 34 63 8 4 5 10 13 7 8
Technical Summary and Application Guidelines
For THJ 175degC Category amp Surge voltage see THJ section on pages 131-136For individual part number please refer to SpiTan Software for frequencyand temperature behavior found on AVX Corporation website
256 112917
112917 257
124 Effect of surgesThe solid Tantalum and OxiCapreg capacitors have a limitedability to withstand voltage and current surges This is incommon with all other electrolytic capacitors and is due tothe fact that they operate under very high electrical stressacross the dielectric For example a 6 volt tantalum capacitorhas an Electrical Field of 167 kVmm when operated at ratedvoltage OxiCapreg capacitors operate at electrical field signifi-cantly less than 167 kVmm
It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating
Solid tantalum capacitors and OxiCapreg have a self healingability provided by the Manganese Dioxide semiconductinglayer used as the negative plate However this is limited inlow impedance applications In the case of low impedancecircuits the capacitor is likely to be stressed by current surges
Derating the capacitor increases the reliability of the com-ponent (See Figure 2b page 264) The ldquoAVX RecommendedDerating Tablerdquo (page 266) summarizes voltage rating for use on common voltage rails in low impedance applica-tions for both Tantalum and OxiCapreg capacitors
In circuits which undergo rapid charge or discharge a protective resistor of 1ΩV is recommended If this isimpossible a derating factor of up to 70 should be usedon tantalum capacitors OxiCapreg capacitors can be usedwith derating of 20 minimum
In such situations a higher voltage may be needed than is available as a single capacitor A series combination should be used to increase the working voltage of the equivalentcapacitor For example two 22μF 25V parts in series is equiv-alent to one 11μF 50V part For further details refer to JA Gillrsquospaper ldquoInvestigation into the Effects of Connecting TantalumCapacitors in Seriesrdquo available from AVX offices worldwide
NOTEWhile testing a circuit (eg at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients which will not be seen in normal use These conditions should be borne in mind when considering thecapacitorrsquos rated voltage for use These can be controlled byensuring a correct test resistance is used
125 Reverse voltage and Non-Polar operationThe values quoted are the maximum levels of reverse voltagewhich should appear on the capacitors at any time Theselimits are based on the assumption that the capacitors arepolarized in the correct direction for the majority of theirworking life They are intended to cover short term reversalsof polarity such as those occurring during switching tran-sients of during a minor portion of an impressed waveformContinuous application of reverse voltage without normalpolarization will result in a degradation of leakage current Inconditions under which continuous application of a reverse
voltage could occur two similar capacitors should be used ina back-to-back configuration with the negative terminationsconnected together Under most conditions this combinationwill have a capacitance one half of the nominal capacitanceof either capacitor Under conditions of isolated pulses orduring the first few cycles the capacitance may approachthe full nominal value The reverse voltage ratings are designedto cover exceptional conditions of small level excursions intoincorrect polarity The values quoted are not intended tocover continuous reverse operation
The peak reverse voltage applied to the capacitor must notexceed
10 of the rated dc working voltage to a maximum of 10v at 25degC
3 of the rated dc working voltage to a maximum of 05v at 85degC
1 of the rated dc working voltage to a maximum of 01v at 125degC (01v at 150degC THJ Series)
Note Capacitance and DF values of OxiCapreg may exceedspecification limits under these conditions
126 Superimposed AC Voltage (Vrms) - Ripple Voltage
This is the maximum rms alternating voltage superim-posed on a dc voltage that may be applied to a capacitorThe sum of the dc voltage and peak value of the superimposed ac voltage must not exceed the categoryvoltage vc
Full details are given in Section 2
127 Forming voltageThis is the voltage at which the anode oxide is formed Thethickness of this oxide layer is proportional to the formation volt-age for a capacitor and is a factor in setting the rated voltage
Technical Summary and Application Guidelines
13 DISSIPATION FACTOR ANDTANGENT OF LOSS ANGLE (TAN D)
131 Dissipation factor (DF)Dissipation factor is the measurement of the tangent of theloss angle (tan ) expressed as a percentage The measure-ment of DF is carried out using a measuring bridge that supplies a 05V rms 120Hz sinusoidal signal free of harmonics with a bias of 22Vdc The value of DF is temperatureand frequency dependent
Note For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate
132 Tangent of Loss Angle (tan )This is a measurement of the energy loss in the capacitor Itis expressed as tan and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency Terms also used are power factor loss factorand dielectric loss Cos (90 - ) is the true power factor Themeasurement of tan is carried out using a measuringbridge that supplies a 05V rms 120Hz sinusoidal signal freeof harmonics with a bias of 22Vdc
133 Frequency dependence of Dissipation FactorDissipation Factor increases with frequency as shown in thetypical curves that are for tantalum and OxiCapreg capacitorsidentical
Typical DF vs Frequency
134 Temperature dependence of DissipationFactor
Dissipation factor varies with temperature as the typical curvesshow These plots are identical for both Tantalum and OxiCapreg
capacitors For maximum limits please refer to ratings tables
Typical DF vs Temperature
14 IMPEDANCE (Z) AND EQUIVALENTSERIES RESISTANCE (ESR)
141 Impedance ZThis is the ratio of voltage to current at a specified frequencyThree factors contribute to the impedance of a Tantalum capac-itor the resistance of the semiconductor layer the capacitancevalue and the inductance of the electrodes and leads
At high frequencies the inductance of the leads becomes a limiting factor The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z The impedance is measured at 25degCand 100kHz
142 Equivalent Series Resistance ESRResistance losses occur in all practical forms of capacitorsThese are made up from several different mechanismsincluding resistance in components and contacts viscousforces within the dielectric and defects producing bypasscurrent paths To express the effect of these losses they areconsidered as the ESR of the capacitor The ESR is frequencydependent and can be found by using the relationship
ESR =
tan δ 2πfC
Where f is the frequency in Hz and C is the capacitance infarads
The ESR is measured at 25degC and 100kHz
ESR is one of the contributing factors to impedance and at high frequencies (100kHz and above) it becomes thedominant factor Thus ESR and impedance become almostidentical impedance being only marginally higher
143 Frequency dependence of Impedance and ESRESR and Impedance both increase with decreasing frequen-cy At lower frequencies the values diverge as the extra con-tributions to impedance (due to the reactance of the capac-itor) become more significant Beyond 1MHz (and beyondthe resonant point of the capacitor) impedance againincreases due to the inductance of the capacitor TypicalESR and Impedance values are similar for both tantalum andniobium oxide materials and thus the same charts are validfor both for Tantalum and OxiCapreg capacitors
Typical ESR vs Frequency
5
45
4
35
325
2
151
05001 1 10
ES
R M
ultip
lier
Frequency (kHz)
Tantalum
OxiCapreg
100 1000
18
17
1615
14
1312
111
0908
-55 -5 45 95
Temperature (Celsius)
TantalumOxiCapreg
DF
Mu
ltip
lier
50
5
1
0101 1 10 100
Frequency (kHz)
Tantalum OxiCapreg
DF
Mu
ltip
lier
Technical Summary and Application Guidelines
258 112917
Technical Summary and Application Guidelines
Typical Impedance vs Frequency
144 Temperature dependence of the Impedanceand ESR
At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow
Typical 100kHz ESR vs Temperature
15 DC LEAKAGE CURRENT
151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors
Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage
152 Temperature dependence of the leakage current
The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula
Vmax = 1- (T - 85) x VR
125 where T is the required operating temperature
LEAKAGE CURRENT vs TEMPERATURE
153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details
For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve
100
10
1
0101 1 10
Frequency (kHz)
Tantalum
OxiCapreg
Imp
ed
an
ce M
ultip
lier
100 1000
0 20 40Temperature (Celsius)
Tantalum
OxiCapreg
Ch
an
ge in
ES
R
60 80 100 125 150-20-40-55
18
1716
15
14
13
1211
109
08
10
100
1
01
Temperature (degC)Le
akag
e cu
rrent
ratio
IIR
20
20 40 60 80 1000-20-40 175150125
1
01
0010 20 40 60 80 100
Rated Voltage (VR)
Leakage Currentratio IIVR
TypicalRange
LEAKAGE CURRENT vs RATED VOLTAGE
112917 259
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
11 CAPACITANCE
111 Rated capacitance (CR)This is the nominal rated capacitance For tantalum andOxiCapreg capacitors it is measured as the capacitance of theequivalent series circuit at 25degC using a measuring bridgesupplied by a 05V rms 120Hz sinusoidal signal free of har-monics with a bias of 22Vdc
112 Capacitance toleranceThis is the permissible variation of the actual value of thecapacitance from the rated value For additional readingplease consult the AVX technical publication ldquoCapacitanceTolerances for Solid Tantalum Capacitorsrdquo
113 Temperature dependence of capacitanceThe capacitance of a tantalum capacitor varies with temper-ature This variation itself is dependent to a small extent onthe rated voltage and capacitor size
114 Frequency dependence of the capacitance The effective capacitance decreases as frequency increasesBeyond 100kHz the capacitance continues to drop until res-onance is reached (typically between 05 - 5MHz dependingon the rating) Beyond the resonant frequency the devicebecomes inductive
12 VOLTAGE
121 Rated dc voltage (VR)
This is the rated dc voltage for continuous operation up to85degC (up to 40degC for TLJ TLN NLJ series)
Operating voltage consists of the sum of DC bias voltage andripple peak voltage The peak voltage should not exceed thecategory voltage For recommended voltage (application) der-ating refer to figure 2c of the SECTION 3
122 Category voltage (VC)
This is the maximum voltage that may be applied continu-ously to a capacitor It is equal to the rated voltage up to+85degC (up to 40degC for TLJ TLN NLJ series) beyond whichit is subject to a linear derating to 23 VR at 125degC for tanta-lum and 23 VR at 105degC for OxiCapreg
123 Surge voltage (VS)
This is the highest voltage that may be applied to a capacitor forshort periods of time in circuits with minimum series resistance of33Ohms (CECC states 1kΩ) The surge voltage may be appliedup to 10 times in an hour for periods of up to 30 seconds at atime The surge voltage must not be used as a parameter in thedesign of circuits in which in the normal course of operation thecapacitor is periodically charged and discharged
SECTION 1ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
TAJE227K010
85degC Tantalum 125degC Tantalum
Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS
2 27 13 17 25 33 17 22 3 39 2 26 4 52 27 34 5 65 33 4 63 8 4 5 10 13 7 8 16 20 10 13 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40
85degC OxiCapreg 105degC OxiCapreg
Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS
18 23 12 16 25 33 17 22 4 52 27 34 63 8 4 5 10 13 7 8
Technical Summary and Application Guidelines
For THJ 175degC Category amp Surge voltage see THJ section on pages 131-136For individual part number please refer to SpiTan Software for frequencyand temperature behavior found on AVX Corporation website
256 112917
112917 257
124 Effect of surgesThe solid Tantalum and OxiCapreg capacitors have a limitedability to withstand voltage and current surges This is incommon with all other electrolytic capacitors and is due tothe fact that they operate under very high electrical stressacross the dielectric For example a 6 volt tantalum capacitorhas an Electrical Field of 167 kVmm when operated at ratedvoltage OxiCapreg capacitors operate at electrical field signifi-cantly less than 167 kVmm
It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating
Solid tantalum capacitors and OxiCapreg have a self healingability provided by the Manganese Dioxide semiconductinglayer used as the negative plate However this is limited inlow impedance applications In the case of low impedancecircuits the capacitor is likely to be stressed by current surges
Derating the capacitor increases the reliability of the com-ponent (See Figure 2b page 264) The ldquoAVX RecommendedDerating Tablerdquo (page 266) summarizes voltage rating for use on common voltage rails in low impedance applica-tions for both Tantalum and OxiCapreg capacitors
In circuits which undergo rapid charge or discharge a protective resistor of 1ΩV is recommended If this isimpossible a derating factor of up to 70 should be usedon tantalum capacitors OxiCapreg capacitors can be usedwith derating of 20 minimum
In such situations a higher voltage may be needed than is available as a single capacitor A series combination should be used to increase the working voltage of the equivalentcapacitor For example two 22μF 25V parts in series is equiv-alent to one 11μF 50V part For further details refer to JA Gillrsquospaper ldquoInvestigation into the Effects of Connecting TantalumCapacitors in Seriesrdquo available from AVX offices worldwide
NOTEWhile testing a circuit (eg at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients which will not be seen in normal use These conditions should be borne in mind when considering thecapacitorrsquos rated voltage for use These can be controlled byensuring a correct test resistance is used
125 Reverse voltage and Non-Polar operationThe values quoted are the maximum levels of reverse voltagewhich should appear on the capacitors at any time Theselimits are based on the assumption that the capacitors arepolarized in the correct direction for the majority of theirworking life They are intended to cover short term reversalsof polarity such as those occurring during switching tran-sients of during a minor portion of an impressed waveformContinuous application of reverse voltage without normalpolarization will result in a degradation of leakage current Inconditions under which continuous application of a reverse
voltage could occur two similar capacitors should be used ina back-to-back configuration with the negative terminationsconnected together Under most conditions this combinationwill have a capacitance one half of the nominal capacitanceof either capacitor Under conditions of isolated pulses orduring the first few cycles the capacitance may approachthe full nominal value The reverse voltage ratings are designedto cover exceptional conditions of small level excursions intoincorrect polarity The values quoted are not intended tocover continuous reverse operation
The peak reverse voltage applied to the capacitor must notexceed
10 of the rated dc working voltage to a maximum of 10v at 25degC
3 of the rated dc working voltage to a maximum of 05v at 85degC
1 of the rated dc working voltage to a maximum of 01v at 125degC (01v at 150degC THJ Series)
Note Capacitance and DF values of OxiCapreg may exceedspecification limits under these conditions
126 Superimposed AC Voltage (Vrms) - Ripple Voltage
This is the maximum rms alternating voltage superim-posed on a dc voltage that may be applied to a capacitorThe sum of the dc voltage and peak value of the superimposed ac voltage must not exceed the categoryvoltage vc
Full details are given in Section 2
127 Forming voltageThis is the voltage at which the anode oxide is formed Thethickness of this oxide layer is proportional to the formation volt-age for a capacitor and is a factor in setting the rated voltage
Technical Summary and Application Guidelines
13 DISSIPATION FACTOR ANDTANGENT OF LOSS ANGLE (TAN D)
131 Dissipation factor (DF)Dissipation factor is the measurement of the tangent of theloss angle (tan ) expressed as a percentage The measure-ment of DF is carried out using a measuring bridge that supplies a 05V rms 120Hz sinusoidal signal free of harmonics with a bias of 22Vdc The value of DF is temperatureand frequency dependent
Note For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate
132 Tangent of Loss Angle (tan )This is a measurement of the energy loss in the capacitor Itis expressed as tan and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency Terms also used are power factor loss factorand dielectric loss Cos (90 - ) is the true power factor Themeasurement of tan is carried out using a measuringbridge that supplies a 05V rms 120Hz sinusoidal signal freeof harmonics with a bias of 22Vdc
133 Frequency dependence of Dissipation FactorDissipation Factor increases with frequency as shown in thetypical curves that are for tantalum and OxiCapreg capacitorsidentical
Typical DF vs Frequency
134 Temperature dependence of DissipationFactor
Dissipation factor varies with temperature as the typical curvesshow These plots are identical for both Tantalum and OxiCapreg
capacitors For maximum limits please refer to ratings tables
Typical DF vs Temperature
14 IMPEDANCE (Z) AND EQUIVALENTSERIES RESISTANCE (ESR)
141 Impedance ZThis is the ratio of voltage to current at a specified frequencyThree factors contribute to the impedance of a Tantalum capac-itor the resistance of the semiconductor layer the capacitancevalue and the inductance of the electrodes and leads
At high frequencies the inductance of the leads becomes a limiting factor The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z The impedance is measured at 25degCand 100kHz
142 Equivalent Series Resistance ESRResistance losses occur in all practical forms of capacitorsThese are made up from several different mechanismsincluding resistance in components and contacts viscousforces within the dielectric and defects producing bypasscurrent paths To express the effect of these losses they areconsidered as the ESR of the capacitor The ESR is frequencydependent and can be found by using the relationship
ESR =
tan δ 2πfC
Where f is the frequency in Hz and C is the capacitance infarads
The ESR is measured at 25degC and 100kHz
ESR is one of the contributing factors to impedance and at high frequencies (100kHz and above) it becomes thedominant factor Thus ESR and impedance become almostidentical impedance being only marginally higher
143 Frequency dependence of Impedance and ESRESR and Impedance both increase with decreasing frequen-cy At lower frequencies the values diverge as the extra con-tributions to impedance (due to the reactance of the capac-itor) become more significant Beyond 1MHz (and beyondthe resonant point of the capacitor) impedance againincreases due to the inductance of the capacitor TypicalESR and Impedance values are similar for both tantalum andniobium oxide materials and thus the same charts are validfor both for Tantalum and OxiCapreg capacitors
Typical ESR vs Frequency
5
45
4
35
325
2
151
05001 1 10
ES
R M
ultip
lier
Frequency (kHz)
Tantalum
OxiCapreg
100 1000
18
17
1615
14
1312
111
0908
-55 -5 45 95
Temperature (Celsius)
TantalumOxiCapreg
DF
Mu
ltip
lier
50
5
1
0101 1 10 100
Frequency (kHz)
Tantalum OxiCapreg
DF
Mu
ltip
lier
Technical Summary and Application Guidelines
258 112917
Technical Summary and Application Guidelines
Typical Impedance vs Frequency
144 Temperature dependence of the Impedanceand ESR
At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow
Typical 100kHz ESR vs Temperature
15 DC LEAKAGE CURRENT
151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors
Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage
152 Temperature dependence of the leakage current
The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula
Vmax = 1- (T - 85) x VR
125 where T is the required operating temperature
LEAKAGE CURRENT vs TEMPERATURE
153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details
For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve
100
10
1
0101 1 10
Frequency (kHz)
Tantalum
OxiCapreg
Imp
ed
an
ce M
ultip
lier
100 1000
0 20 40Temperature (Celsius)
Tantalum
OxiCapreg
Ch
an
ge in
ES
R
60 80 100 125 150-20-40-55
18
1716
15
14
13
1211
109
08
10
100
1
01
Temperature (degC)Le
akag
e cu
rrent
ratio
IIR
20
20 40 60 80 1000-20-40 175150125
1
01
0010 20 40 60 80 100
Rated Voltage (VR)
Leakage Currentratio IIVR
TypicalRange
LEAKAGE CURRENT vs RATED VOLTAGE
112917 259
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
112917 257
124 Effect of surgesThe solid Tantalum and OxiCapreg capacitors have a limitedability to withstand voltage and current surges This is incommon with all other electrolytic capacitors and is due tothe fact that they operate under very high electrical stressacross the dielectric For example a 6 volt tantalum capacitorhas an Electrical Field of 167 kVmm when operated at ratedvoltage OxiCapreg capacitors operate at electrical field signifi-cantly less than 167 kVmm
It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating
Solid tantalum capacitors and OxiCapreg have a self healingability provided by the Manganese Dioxide semiconductinglayer used as the negative plate However this is limited inlow impedance applications In the case of low impedancecircuits the capacitor is likely to be stressed by current surges
Derating the capacitor increases the reliability of the com-ponent (See Figure 2b page 264) The ldquoAVX RecommendedDerating Tablerdquo (page 266) summarizes voltage rating for use on common voltage rails in low impedance applica-tions for both Tantalum and OxiCapreg capacitors
In circuits which undergo rapid charge or discharge a protective resistor of 1ΩV is recommended If this isimpossible a derating factor of up to 70 should be usedon tantalum capacitors OxiCapreg capacitors can be usedwith derating of 20 minimum
In such situations a higher voltage may be needed than is available as a single capacitor A series combination should be used to increase the working voltage of the equivalentcapacitor For example two 22μF 25V parts in series is equiv-alent to one 11μF 50V part For further details refer to JA Gillrsquospaper ldquoInvestigation into the Effects of Connecting TantalumCapacitors in Seriesrdquo available from AVX offices worldwide
NOTEWhile testing a circuit (eg at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients which will not be seen in normal use These conditions should be borne in mind when considering thecapacitorrsquos rated voltage for use These can be controlled byensuring a correct test resistance is used
125 Reverse voltage and Non-Polar operationThe values quoted are the maximum levels of reverse voltagewhich should appear on the capacitors at any time Theselimits are based on the assumption that the capacitors arepolarized in the correct direction for the majority of theirworking life They are intended to cover short term reversalsof polarity such as those occurring during switching tran-sients of during a minor portion of an impressed waveformContinuous application of reverse voltage without normalpolarization will result in a degradation of leakage current Inconditions under which continuous application of a reverse
voltage could occur two similar capacitors should be used ina back-to-back configuration with the negative terminationsconnected together Under most conditions this combinationwill have a capacitance one half of the nominal capacitanceof either capacitor Under conditions of isolated pulses orduring the first few cycles the capacitance may approachthe full nominal value The reverse voltage ratings are designedto cover exceptional conditions of small level excursions intoincorrect polarity The values quoted are not intended tocover continuous reverse operation
The peak reverse voltage applied to the capacitor must notexceed
10 of the rated dc working voltage to a maximum of 10v at 25degC
3 of the rated dc working voltage to a maximum of 05v at 85degC
1 of the rated dc working voltage to a maximum of 01v at 125degC (01v at 150degC THJ Series)
Note Capacitance and DF values of OxiCapreg may exceedspecification limits under these conditions
126 Superimposed AC Voltage (Vrms) - Ripple Voltage
This is the maximum rms alternating voltage superim-posed on a dc voltage that may be applied to a capacitorThe sum of the dc voltage and peak value of the superimposed ac voltage must not exceed the categoryvoltage vc
Full details are given in Section 2
127 Forming voltageThis is the voltage at which the anode oxide is formed Thethickness of this oxide layer is proportional to the formation volt-age for a capacitor and is a factor in setting the rated voltage
Technical Summary and Application Guidelines
13 DISSIPATION FACTOR ANDTANGENT OF LOSS ANGLE (TAN D)
131 Dissipation factor (DF)Dissipation factor is the measurement of the tangent of theloss angle (tan ) expressed as a percentage The measure-ment of DF is carried out using a measuring bridge that supplies a 05V rms 120Hz sinusoidal signal free of harmonics with a bias of 22Vdc The value of DF is temperatureand frequency dependent
Note For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate
132 Tangent of Loss Angle (tan )This is a measurement of the energy loss in the capacitor Itis expressed as tan and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency Terms also used are power factor loss factorand dielectric loss Cos (90 - ) is the true power factor Themeasurement of tan is carried out using a measuringbridge that supplies a 05V rms 120Hz sinusoidal signal freeof harmonics with a bias of 22Vdc
133 Frequency dependence of Dissipation FactorDissipation Factor increases with frequency as shown in thetypical curves that are for tantalum and OxiCapreg capacitorsidentical
Typical DF vs Frequency
134 Temperature dependence of DissipationFactor
Dissipation factor varies with temperature as the typical curvesshow These plots are identical for both Tantalum and OxiCapreg
capacitors For maximum limits please refer to ratings tables
Typical DF vs Temperature
14 IMPEDANCE (Z) AND EQUIVALENTSERIES RESISTANCE (ESR)
141 Impedance ZThis is the ratio of voltage to current at a specified frequencyThree factors contribute to the impedance of a Tantalum capac-itor the resistance of the semiconductor layer the capacitancevalue and the inductance of the electrodes and leads
At high frequencies the inductance of the leads becomes a limiting factor The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z The impedance is measured at 25degCand 100kHz
142 Equivalent Series Resistance ESRResistance losses occur in all practical forms of capacitorsThese are made up from several different mechanismsincluding resistance in components and contacts viscousforces within the dielectric and defects producing bypasscurrent paths To express the effect of these losses they areconsidered as the ESR of the capacitor The ESR is frequencydependent and can be found by using the relationship
ESR =
tan δ 2πfC
Where f is the frequency in Hz and C is the capacitance infarads
The ESR is measured at 25degC and 100kHz
ESR is one of the contributing factors to impedance and at high frequencies (100kHz and above) it becomes thedominant factor Thus ESR and impedance become almostidentical impedance being only marginally higher
143 Frequency dependence of Impedance and ESRESR and Impedance both increase with decreasing frequen-cy At lower frequencies the values diverge as the extra con-tributions to impedance (due to the reactance of the capac-itor) become more significant Beyond 1MHz (and beyondthe resonant point of the capacitor) impedance againincreases due to the inductance of the capacitor TypicalESR and Impedance values are similar for both tantalum andniobium oxide materials and thus the same charts are validfor both for Tantalum and OxiCapreg capacitors
Typical ESR vs Frequency
5
45
4
35
325
2
151
05001 1 10
ES
R M
ultip
lier
Frequency (kHz)
Tantalum
OxiCapreg
100 1000
18
17
1615
14
1312
111
0908
-55 -5 45 95
Temperature (Celsius)
TantalumOxiCapreg
DF
Mu
ltip
lier
50
5
1
0101 1 10 100
Frequency (kHz)
Tantalum OxiCapreg
DF
Mu
ltip
lier
Technical Summary and Application Guidelines
258 112917
Technical Summary and Application Guidelines
Typical Impedance vs Frequency
144 Temperature dependence of the Impedanceand ESR
At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow
Typical 100kHz ESR vs Temperature
15 DC LEAKAGE CURRENT
151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors
Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage
152 Temperature dependence of the leakage current
The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula
Vmax = 1- (T - 85) x VR
125 where T is the required operating temperature
LEAKAGE CURRENT vs TEMPERATURE
153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details
For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve
100
10
1
0101 1 10
Frequency (kHz)
Tantalum
OxiCapreg
Imp
ed
an
ce M
ultip
lier
100 1000
0 20 40Temperature (Celsius)
Tantalum
OxiCapreg
Ch
an
ge in
ES
R
60 80 100 125 150-20-40-55
18
1716
15
14
13
1211
109
08
10
100
1
01
Temperature (degC)Le
akag
e cu
rrent
ratio
IIR
20
20 40 60 80 1000-20-40 175150125
1
01
0010 20 40 60 80 100
Rated Voltage (VR)
Leakage Currentratio IIVR
TypicalRange
LEAKAGE CURRENT vs RATED VOLTAGE
112917 259
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
13 DISSIPATION FACTOR ANDTANGENT OF LOSS ANGLE (TAN D)
131 Dissipation factor (DF)Dissipation factor is the measurement of the tangent of theloss angle (tan ) expressed as a percentage The measure-ment of DF is carried out using a measuring bridge that supplies a 05V rms 120Hz sinusoidal signal free of harmonics with a bias of 22Vdc The value of DF is temperatureand frequency dependent
Note For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate
132 Tangent of Loss Angle (tan )This is a measurement of the energy loss in the capacitor Itis expressed as tan and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency Terms also used are power factor loss factorand dielectric loss Cos (90 - ) is the true power factor Themeasurement of tan is carried out using a measuringbridge that supplies a 05V rms 120Hz sinusoidal signal freeof harmonics with a bias of 22Vdc
133 Frequency dependence of Dissipation FactorDissipation Factor increases with frequency as shown in thetypical curves that are for tantalum and OxiCapreg capacitorsidentical
Typical DF vs Frequency
134 Temperature dependence of DissipationFactor
Dissipation factor varies with temperature as the typical curvesshow These plots are identical for both Tantalum and OxiCapreg
capacitors For maximum limits please refer to ratings tables
Typical DF vs Temperature
14 IMPEDANCE (Z) AND EQUIVALENTSERIES RESISTANCE (ESR)
141 Impedance ZThis is the ratio of voltage to current at a specified frequencyThree factors contribute to the impedance of a Tantalum capac-itor the resistance of the semiconductor layer the capacitancevalue and the inductance of the electrodes and leads
At high frequencies the inductance of the leads becomes a limiting factor The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z The impedance is measured at 25degCand 100kHz
142 Equivalent Series Resistance ESRResistance losses occur in all practical forms of capacitorsThese are made up from several different mechanismsincluding resistance in components and contacts viscousforces within the dielectric and defects producing bypasscurrent paths To express the effect of these losses they areconsidered as the ESR of the capacitor The ESR is frequencydependent and can be found by using the relationship
ESR =
tan δ 2πfC
Where f is the frequency in Hz and C is the capacitance infarads
The ESR is measured at 25degC and 100kHz
ESR is one of the contributing factors to impedance and at high frequencies (100kHz and above) it becomes thedominant factor Thus ESR and impedance become almostidentical impedance being only marginally higher
143 Frequency dependence of Impedance and ESRESR and Impedance both increase with decreasing frequen-cy At lower frequencies the values diverge as the extra con-tributions to impedance (due to the reactance of the capac-itor) become more significant Beyond 1MHz (and beyondthe resonant point of the capacitor) impedance againincreases due to the inductance of the capacitor TypicalESR and Impedance values are similar for both tantalum andniobium oxide materials and thus the same charts are validfor both for Tantalum and OxiCapreg capacitors
Typical ESR vs Frequency
5
45
4
35
325
2
151
05001 1 10
ES
R M
ultip
lier
Frequency (kHz)
Tantalum
OxiCapreg
100 1000
18
17
1615
14
1312
111
0908
-55 -5 45 95
Temperature (Celsius)
TantalumOxiCapreg
DF
Mu
ltip
lier
50
5
1
0101 1 10 100
Frequency (kHz)
Tantalum OxiCapreg
DF
Mu
ltip
lier
Technical Summary and Application Guidelines
258 112917
Technical Summary and Application Guidelines
Typical Impedance vs Frequency
144 Temperature dependence of the Impedanceand ESR
At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow
Typical 100kHz ESR vs Temperature
15 DC LEAKAGE CURRENT
151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors
Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage
152 Temperature dependence of the leakage current
The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula
Vmax = 1- (T - 85) x VR
125 where T is the required operating temperature
LEAKAGE CURRENT vs TEMPERATURE
153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details
For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve
100
10
1
0101 1 10
Frequency (kHz)
Tantalum
OxiCapreg
Imp
ed
an
ce M
ultip
lier
100 1000
0 20 40Temperature (Celsius)
Tantalum
OxiCapreg
Ch
an
ge in
ES
R
60 80 100 125 150-20-40-55
18
1716
15
14
13
1211
109
08
10
100
1
01
Temperature (degC)Le
akag
e cu
rrent
ratio
IIR
20
20 40 60 80 1000-20-40 175150125
1
01
0010 20 40 60 80 100
Rated Voltage (VR)
Leakage Currentratio IIVR
TypicalRange
LEAKAGE CURRENT vs RATED VOLTAGE
112917 259
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application Guidelines
Typical Impedance vs Frequency
144 Temperature dependence of the Impedanceand ESR
At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow
Typical 100kHz ESR vs Temperature
15 DC LEAKAGE CURRENT
151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors
Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage
152 Temperature dependence of the leakage current
The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula
Vmax = 1- (T - 85) x VR
125 where T is the required operating temperature
LEAKAGE CURRENT vs TEMPERATURE
153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details
For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve
100
10
1
0101 1 10
Frequency (kHz)
Tantalum
OxiCapreg
Imp
ed
an
ce M
ultip
lier
100 1000
0 20 40Temperature (Celsius)
Tantalum
OxiCapreg
Ch
an
ge in
ES
R
60 80 100 125 150-20-40-55
18
1716
15
14
13
1211
109
08
10
100
1
01
Temperature (degC)Le
akag
e cu
rrent
ratio
IIR
20
20 40 60 80 1000-20-40 175150125
1
01
0010 20 40 60 80 100
Rated Voltage (VR)
Leakage Currentratio IIVR
TypicalRange
LEAKAGE CURRENT vs RATED VOLTAGE
112917 259
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application Guidelines
154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)
16 SELF INDUCTANCE (ESL)
The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size
TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS
Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)
A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18
Typical Self- Case Inductance Size value (nH)
A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11
Typical Self- Case Inductance Size value (nH)
K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25
Typical Self- Case Inductance Size value (nH)
D 10 E 25 U 24 V 24 Y 10
TCMTPMTRMNOM
TACTLCTPC TLNTCNJ-CAPTM
LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING
for FIXED APPLICATION VOLTAGE VA
We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage
For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin
0
02
04
06
08
1
12
14
0 10 20 30 40 50 60 70 80 90 100
Application voltage VA to rated voltage VR ratio ()
Optimalrange
Leak
age
curr
ent m
ultip
lier
260 112917
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application Guidelines
21 RIPPLE RATINGS (AC)
In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula
P = I 2 R
and rearranged to I = SQRT (PfraslR) (Eq 1)
where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration
Maximum ac ripple voltage (Umax)
From the Ohmsrsquo law equation
Umax = IR (Eq 2)
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)
However care must be taken to ensure that
1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage
2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo
Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted
SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT
Max power dissipation (W)
Tantalum Polymer OxiCapreg
TCJ Case
TAJTMJTPS TPM
TCN NLJ Size
TRJTHJ TLN TRM
J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR
A 0075 mdash mdash 0100 mdash 0090 mdash
B 0085 mdash mdash 0125 mdash 0102 mdash
C 0110 mdash mdash 0175 mdash 0132 mdash
D 0150 mdash 0255 0225 ndash 0180 mdash
E 0165 mdash 0270 0250 0410 0198 0324
F 0100 mdash mdash 0150 mdash 0120 mdash
G 0070 0060 mdash 0100 mdash 0084 mdash
H 0080 0070 mdash 0100 mdash 0096 mdash
K 0065 0055 mdash 0090 mdash 0078 mdash
L 0070 0060 mdash 0095 mdash 0084 mdash
M mdash 0040 mdash 0080 mdash mdash mdash
N 0050 0040 mdash 0080 mdash mdash mdash
O ndash ndash mdash 0065 mdash mdash mdash
P 0060 mdash mdash 0090 mdash 0072 mdash
R 0055 mdash mdash 0085 mdash 0066 mdash
S 0065 0055 mdash 0095 mdash 0078 mdash
T 0080 0070 mdash 0100 mdash 0096 mdash
U 0165 mdash 0295 0380 mdash mdash mdash
V 0250 mdash 0285 0360 0420 0300 mdash
W 0090 mdash mdash 0130 mdash 0108 mdash
X 0100 mdash mdash 0175 mdash 0120 mdash
Y 0125 0115 0210 0185 ndash 0150 mdash
3 mdash mdash mdash 0145 mdash mdash mdash
4 mdash 0165 mdash 0190 mdash mdash mdash
5 mdash mdash mdash 0240 mdash mdash mdash
6 mdash 0230 mdash mdash mdash mdash mdash
Case Max power
Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 25degC 100 100 10
+55 095 090 9
+85 090 081 81
+105 065 042 42
+115 049 024 24
+125 040 016 16
+175 (THJ) 020 004 04
+200 (THJ) 010 001 01
Temperature correction factor
for ripple current
Temp degC Factor+25 100+55 095+85 090+105 040+125
040(NOSNOM)
TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip
TAJTPSTPMTRJTRMTHJTLJTLN
Table I Power Dissipation Ratings (In Free Air)
Temp ordmC
Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC
up to 45degC 100 100 30
+85 070 049 15
+105 045 020 6
+125 025 006 18
TCJTCMTCNJ-CAPTMTCQTCR
052418 261
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface
Results for the C D and E case sizes
Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz
As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I
The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I
If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz
The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs
If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below
ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is
ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +
Thus the special components are
Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield
Thus the total power dissipation would be 0069 Watts
From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin
7000
6000
5000
4000
3000
2000
1000
000
000 005 045010 015 020 025 030 035 040 050FR
Tem
per
atur
e R
ise
(C)
100KHz
1 MHz
70
60
50
40
30
20
10
0000 020 040 060 080 100 120
RMS current (Amps)
Tem
per
atur
e ri
se (C
)
100KHz
1 MHz
100
90
8070
6050
4030
201000 01 02 03 04 05
Power (Watts)
Tem
per
atur
e ri
se (
oC
)
C case
D case
E case
Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR
200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001
Frequency Peak-to-peak current RMS current (Amps) (Amps)
200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101
ESR vs FREQUENCY(TPSE107M016R0100)
ES
R (
Oh
ms)
1
01
001100 1000 10000 100000 1000000
Frequency (Hz)
262 052418
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board
The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used
In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating
Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury
OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum
powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)
Technical Summary and Application Guidelines
23 THERMAL MANAGEMENT
LEAD FRAME
SOLDER
ENCAPSULANT
COPPER
PRINTED CIRCUIT BOARD
TANTALUMANODE
121 CWATT
73 CWATT
236 CWATT
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
XX
X
TEMPERATURE DEG C
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
140
120
100
80
60
40
20
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14
POWER IN UNIT CASE DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR
Thermal Dissipation from the Mounted Chip
Thermal Impedance Graph with Ripple Current
22 OxiCapreg RIPPLE RATING
052418 263
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application Guidelines
SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE
31 STEADY-STATE
Both Tantalum and Niobium Oxide dielectric have essentially
no wear out mechanism and in certain circumstances is
capable of limited self healing However random failures can
occur in operation The failure rate of Tantalum capacitors
will decrease with time and not increase as with other
electrolytic capacitors and other electronic components
Figure 1 Tantalum and OxiCapreg Reliability Curve
The useful life reliability of the Tantalum and OxiCapreg capacitors
in steady-state is affected by three factors The equation from
which the failure rate can be calculated is
F = FV x FT x FR x FBwhere FV is a correction factor due to operating
voltagevoltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level
Base failure rate
Standard Tantalum conforms to Level M reliability (ie
11000 hrs) or better at rated voltage 85degC and 01Ωvolt
circuit impedance
FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ
TCM TCN J-CAPTM TAC
05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ
02 1000 hours for NOS and NOM
TLJ TLN TLC and NLJ series of tantalum capacitors are defined
at 05 x rated voltage at 85degC due to the temperature derating
FB = 021000 hours at 85degC and 05xVR with 01ΩV
series impedance with 60 confidence level
Operating voltagevoltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used then the operating reliability will be
improved This is known as voltage derating
The graph Figure 2a shows the relationship between
voltage derating (the ratio between applied and rated
voltage) and the failure rate The graph gives the correction
factor FU for any operating voltage
Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)
Figure 2b Gives our recommendation for voltage derating
for tantalum capacitors to be used in typical applications
Figure 2c Gives voltage derating recommendations for
tantalum capacitors as a function of circuit impedance
Infinite Useful Life
Useful life reliability can be altered by voltagederating temperature or series resistance
InfantMortalities
Recommended Range Tantalum
100908070605
040302
010001 01 10 10
Circuit Resistance (OhmV)
Wor
king
Vol
tage
Rat
ed V
olta
ge
100 1000 10000
OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM
Specified Range inLow Impedance Circuit
Specified Rangein General Circuit
40
30
20
10
04 63 10 16 20 25
Rated Voltage (V)
Op
era
tin
g V
oltag
e (V
)
35 50
100
10
01
001
0001
000010 01 02 03 04 05 06
Applied VoltageRated Voltage
Co
rrectio
n F
acto
r
07 08 09 10 11 12
TantalumOxiCap
reg
FV
264 101216
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application GuidelinesOperating Temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be
improved as shown in Figure 3 This graph gives a correction
factor FT for any temperature of operation
Figure 3 Correction factor to failure rate FR for ambient
temperature T for typical component
(60 con level)
Circuit Impedance
All solid Tantalum andor niobium oxide capacitors require
current limiting resistance to protect the dielectric from surges
A series resistor is recommended for this purpose A lower
circuit impedance may cause an increase in failure rate
especially at temperatures higher than 20degC An inductive low
impedance circuit may apply voltage surges to the capacitor
and similarly a non-inductive circuit may apply current surges
to the capacitor causing localized over-heating and failure
The recommended impedance is 1 Ω per volt Where this is
not feasible equivalent voltage derating should be used
(See MIL HANDBOOK 217E) The graph Figure 4 shows
the correction factor FR for increasing series resistance
Figure 4 Correction factor to failure rate FR for series
resistance R on basic failure rate FB for a typical component
(60 con level)
For circuit impedances below 01 ohms per volt or for any
mission critical application circuit protection should be
considered An ideal solution would be to employ an AVX
SMT thin-film fuse in series
Example calculation
Consider a 12 volt power line The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier Thus the circuit impedance will be
limited only by the output impedance of the boardrsquos power
unit and the track resistance Let us assume it to be about
2 Ohms minimum ie 0167 OhmsVolt The operating
temperature range is -25degC to +85degC
If a 10μF 16 Volt capacitor was designed in the operating
failure rate would be as follows
a) FT = 10 85degC
b) FR = 085 0167 OhmsVolt
c) FV = 008 applied voltagerated
voltage = 75
d) FB = 11000 hours basic failure rate level
Thus F = 10 x 085 x 008 x 1 = 00681000 Hours
If the capacitor was changed for a 20 volt capacitor the
operating failure rate will change as shown
FV = 0018 applied voltagerated voltage = 60
F = 10 x 085 x 0018 x 1 = 001531000 Hours
32 Dynamic
As stated in Section 124 (page 257) the solid capacitor has
a limited ability to withstand voltage and current surges
Such current surges can cause a capacitor to fail The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied That is if the
capacitor was tested at its rated voltage It has been tested
on tantalum capacitors however the conclusions are valid
for both tantalum and OxiCapreg capacitors
Results of production scale derating experiment
As can clearly be seen from the results of this experiment
the more derating applied by the user the less likely the
probability of a surge failure occurring
It must be remembered that these results were derived from
a highly accelerated surge test machine and failure rates in
the low ppm are more likely with the end customer
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen This can be disproved
by the results of an experiment carried out at AVX on 47μF
Capacitance Number of 50 derating No derating and Voltage units tested applied applied
47μF 16V 1547587 003 11
100μF 10V 632876 001 05
22μF 25V 2256258 005 03
0
1000
10000
100
10
01
0014020 60 80 100 120 140 160 180 200
100000
Temperature (ordmC)
TantalumNOJ
NOS
Cor
rect
ion
Fact
orF T
Circuit resistance FR ohmsvolt
30 007
20 01
10 02
08 03
06 04
04 06
02 08
01 10
101216 265
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application Guidelines10V surface mount capacitors with different leakage
currents The results are summarized in the table below
Leakage current vs number of surge failures
Again it must be remembered that these results were
derived from a highly accelerated surge test machine
and failure rates in the low ppm are more likely with the end
customer
OxiCapreg capacitor is less sensitive to an overloading stress
compared to Tantalum and so a 20 minimum derating is
recommended It may be necessary in extreme low impedance
circuits of high transient or lsquoswitch-onrsquo currents to derate the
voltage further Hence in general a lower voltage OxiCapreg part
number can be placed on a higher rail voltage compared to the
tantalum capacitor ndash see table below
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo
available from AVX offices worldwide
An added bonus of increasing the derating applied in a
circuit to improve the ability of the capacitor to withstand
surge conditions is that the steady-state reliability is
improved by up to an order Consider the example of a
63 volt capacitor being used on a 5 volt rail
The steady-state reliability of a Tantalum capacitor is affected by
three parameters temperature series resistance and voltage
derating Assume 40degC operation and 01 OhmsVolt series
resistance
The capacitors reliability will therefore be
Failure rate = FU x FT x FR x 11000 hours
= 015 x 01 x 1 x 11000 hours
= 00151000 hours
If a 10 volt capacitor was used instead the new scaling factor
would be 0006 thus the steady-state reliability would be
Failure rate = FU x FT x FR x 11000 hours
= 0006 x 01 x 1 x 11000 hours
= 6 x 10-4 1000 hours
So there is an order improvement in the capacitors steady-
state reliability
Number tested Number failed surge
Standard leakage range 10000 25 01 μA to 1μA
Over Catalog limit 10000 26 5μA to 50μA
Classified Short Circuit 10000 25 50μA to 500μA
Voltage Rail Rated Voltage of Cap (V)
(V) Tantalum OxiCapreg
33 63 4
5 10 63
8 16 10
10 20 ndash
12 25 ndash
15 35 ndash
gt24 Series Combination ndash
266 101216
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
Technical Summary and Application Guidelines
Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors
Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing
RECOMMENDED REFLOW PROFILE
Lead-free soldering
Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max
SnPb soldering
Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec
RECOMMENDED WAVE SOLDERING
Lead-free soldering
Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)
SnPb soldering
Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)
The upper side temperature of the board should notexceed +150ordmC
GENERAL LEAD-FREE NOTES
The following should be noted by customers changing fromlead based systems to the new lead free pastes
a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large
b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes
c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering
RECOMMENDED HAND SOLDERING
Recommended hand soldering condition
Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering
SECTION 4RECOMMENDED SOLDERING CONDITIONS
Tip Diameter Selected to fit Application
Max Tip Temperature +370degC
Max Exposure Time 3s
Anti-static Protection Non required
101216 267
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
51 Basic Materials
Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX
52 Termination Finishes ndash Coatings
Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations
521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request
522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue
523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest
Some plating options can be limited to specific part typesPlease check availability of special options with AVX
SECTION 5TERMINATIONS
Technical Summary and Application Guidelines
268 101216
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
61 Acceleration981ms2 (10g)
62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)
63 ShockTrapezoidal Pulse 981ms2 for 6ms
64 Adhesion to SubstrateIEC 384-3 minimum of 5N
65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of
stress on the capacitor due to substrate bending
66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm
67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing
68 Installation PositionNo restriction
69 Soldering InstructionsFluxes containing acids must not be used
691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors
The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines
The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet
Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed
For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]
PW
PLP PLNPSPSL
SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
Technical Summary and Application Guidelines
Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)
SMD lsquoJrsquo
Lead amp
OxiCapreg
(excluding
F-series)
TACmicro-
chipreg
Series
Series
Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR
NOTE
These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering
Nominal footprint and pad dimensions for each case size are givenin the following tables
PAD DIMENSIONS millimeters (inches)
Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)
RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)
F38 F91
F92 F93
F97 F9H
F98
F95
AUDIO F95
Conformal
F72
Conformal
F75
Conformal
Series
In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]
Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)
O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)
L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)
X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)
3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)
6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)
PAD DIMENSIONS millimeters (inches)
TLN TCN
amp J-CAPTM
Undertab
Series
+-
bacute c
a
b
c
Center of nozzle
PAD DIMENSIONS F-SERIES millimeters (inches)
041118 269
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118
610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems
If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath
SECTION 7 EPOXY FLAMMABILITY
SECTION 8 QUALIFICATION APPROVAL STATUS
Technical Summary and Application Guidelines
EPOXY UL RATING OXYGEN INDEX
TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM
DESCRIPTION STYLE SPECIFICATION
Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1
PW
PLP PSPSL
Case Size PSL PL PS PW PWW
9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA
I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA
I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA
TCH amp THHJ-lead only
THHJ-lead only
THHUndertab only
SERIES
Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only
SERIES
PAD DIMENSIONS SMD HERMETICmillimeters (inches)
PW PK PW
PKW
PL PS PL
PSL
-
-
+
+
270 041118