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Server
Primer
Understandingthecurrentstateofthe
industry
GolisanoInstituteforSustainability
DATE:10/10/2012
GolisanoInstituteforSustainability
RochesterInstituteofTechnology
111LombMemorialDrive
Rochester,NY14623
www.sustainability.rit.edu
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Acknowledgements
The primary authors of this report are Brian Hilton, Senior Research Engineer,
andMichaelWelch,Masters Student,Golisano Institute forSustainability (GIS)
atRochester Institute ofTechnology (RIT).Questions,commentsand feedback
onthisreportshouldbedirectedto:
BrianHilton,Sr.ResearchEngineer
GolisanoInstituteforSustainability
RochesterInstituteofTechnology
133LombMemorialDrive,Building78,Room1220
Rochester,NewYork146235608
Tel:5854755379
Email:[email protected]
We gratefully acknowledge and thank the primary sponsor, the International
SustainableDevelopment
Foundation,
for
providing
the
resources
and
support
tomakethisreportpossible.Wewouldalsoliketoacknowledgethefacultyand
staffattheGolisanoInstituteforSustainabilityforprovidingresearchdataand
advice on the report focus and content. Additionally, we would also like to
acknowledgetheU.S.EnvironmentalProtectionAgencyforprovidingthe initial
ecolabel comparison document Server ecolabel comparison 8 15 2011.xls
whichwasusedasthefoundationforthecompaniondocumentforthisreport
Master listofserverstandardsJune2012.xlsx.Wealsosendaspecialthank
you to Pamela BrodyHeine and Patty Dillon who served as an advisors and
reviewersofthisreport.
We believe this report provides useful data, information, findings and
recommendations
for
positioning
the
industry
for
the
future,
including
key
considerationsonenergy,environmentandsustainability.
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TableofContents
Acknowledgements............................................................................................... 2
1. Introduction................................................................................................... 5
2.
Backgroundand
Purpose
of
the
Study
..........................................................
6
3. ServerIntroduction........................................................................................ 7
3.1. ServerHardware.................................................................................... 7
3.1.1. BladeServerHardware................................................................ 11
3.2. ServerPriceandPerformance............................................................. 12
3.3. ServerMarket&Sales.......................................................................... 12
3.4. ENERGYSTARandExclusionofServerswithMorethanFourProcessor
Sockets............................................................................................................. 15
4.
Server
Industry
Trends
.................................................................................
16
4.1. HighDensityComputing...................................................................... 16
4.2. ServerInternalWasteHeatManagement........................................... 18
4.3. ServerUtilizationandConnectivity..................................................... 20
4.3.1. ServerVirtualization.................................................................... 21
4.3.2. ServerConsolidation.................................................................... 22
4.3.3. CloudComputing......................................................................... 23
5. ServerImpactonOverallDataCenterEnergyUse...................................... 24
6. ServerEnvironmentalAssessments............................................................. 27
6.1. CarbonFootprintofaTypicalDellRackServer................................... 27
6.2. CarbonFootprintofFujitsuPrimergyRXandTX300S5Servers.........29
6.3. CaseStudyofanIBMRackmountedServer....................................... 30
7. ServerStandardScopeTopics..................................................................... 31
7.1. ServerMaterialSelection..................................................................... 31
7.1.1. ServerDemanufacturing:GIS....................................................... 31
7.1.2. ServerDemanufacturing:Cascade............................................... 33
7.2. EnvironmentallySensitiveMaterials................................................... 34
7.2.1.
RoHSDirective
.............................................................................
35
7.3. ProductLongevity................................................................................ 36
7.4. DesignforEndofLife........................................................................... 37
7.5. EndofLifeManagement...................................................................... 37
7.5.1. ServerEndofLife........................................................................ 37
7.5.2. EndofLifeManagement.............................................................. 40
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7.6. EnergyConservation............................................................................ 42
7.6.1. PSUEfficiencyStandards............................................................. 43
7.6.2. ProcessorEnergyUse................................................................... 44
7.7.
Packaging.............................................................................................
46
8. ServerEnvironmentalStandardsandLabels............................................... 47
8.1. KeyAcronyms...................................................................................... 50
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1.
Introduction
The computer server industry is in the midst of major change stimulated by
increasingdemandfordataprocessingandstorageasaresultofoureconomys
shiftfrompaperbasedtodigitalinformationmanagement.
The Golisano Institute for Sustainability (GIS) at Rochester Institute of
Technology (RIT), was commissioned by the International Sustainable
DevelopmentFoundation(ISDF)tobetterunderstandthestateofthecomputer
serverindustryandtowhatextenttheindustryhasfacedorisfacingchallenges
associatedwithenergy,environmentandsustainability.
A threemonth research effort was conducted to collect, identify, assess, and
understand the industry trends and environmental impacts associated with
computerservers.ResearchconductedbyRITsoughttobalancetheacquisition
ofdataandinformationthroughquantitativeandqualitativeresearchmethods
tosupporttheserverstandarddevelopmentworkby:
Assessingandunderstandingenvironmentalimpactsonalifecyclebasis
Assessingandunderstandingenergyuseinthecomputerserver
industry
Reviewingcurrentenvironmentalpurchasingstandardsforcomputer
serversandothercomputerequipment
Broadlyunderstandingthebusiness,technology,regulatoryandmarket
challengesofthecomputerserverindustry
DistillingthecommentsanddataprovidedbytheTechnicalCommittee
Theremainderofthisreportpresentsdataand informationknownatthetime
ofpublicationontheenvironmentalimpactoftheserverindustry.Thepurpose
is
to
document
the
current
state
of
the
industry
to
inform
the
TechnicalCommittee charged with drafting a framework of environmental performance
criteriaforthedevelopmentofaproductstandardforservers.Accordingtothe
IEEEProjectAuthorizationRequest,1theproductstandardisintendedtodefine
a measure of environmental leadership in: the design and manufacture of
servers;thedeliveryofspecifiedservicesthatareassociatedwiththesaleofthe
product;andassociatedcorporateperformancecharacteristics.Thisstandardis
defined with the intention that the criteria are technically feasible to achieve,
but that only products demonstrating the leading environmental performance
currently available in the marketplace would meet them at the time of their
adoption.
1P1680.4StandardforEnvironmentalAssessmentofServers,ProjectAuthorization
Request(PAR),https://development.standards.ieee.org/get
file/P1680.4.pdf?t=11051900003
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2.
Background
and
Purpose
of
the
Study
The International Sustainable Development Foundation (ISDF) requested the
GolisanoInstituteforSustainability(GIS)toconductbackgroundresearchonthe
technical and sustainability issues surrounding the development of computer
serverhardware (server).Research resultsare intended to inform aTechnical
Committeeestablishedby the ISDFwhichwillhelpdrafta framework for the
developmentofaproductstandardforservers.
Thisstudyprovidesaliteraturereviewoftechnicalandscientificstudies,aswell
aspubliclyavailable lifecycleassessmentsperformedon servers.Thiswork is
compiledandsummarizedandisintendedtoprovideacommonfoundationand
referencematerials for participants in the Technical Committee andWorking
Group.
This report includesbackground informationon serverssuchasdescriptionof
servers, server functions, server components, typical server performance
characteristics,analysis
of
market
and
market
size
and
key
players,
and
key
market and performance trends. The report also highlights data within
environmental performance categories ofmaterial selection, environmentally
sensitive materials, product longevity, design for end of life, end of life
management,energyconservation,corporateperformanceandpackaging.
This studywas conductedwith financial support from ISDF anddata support
fromGIS.
AbouttheGolisanoInstituteforSustainability
The Golisano Institute for Sustainability is a multidisciplinary academic and
appliedresearch
unit
of
Rochester
Institute
of
Technology,
Rochester,
NY,
USA.
ThemissionofGISistoundertakeworldclasseducationandresearchmissions
insustainability.
GIS academic and research programs focus on sustainable production,
sustainable energy, sustainablemobility, and ecologically friendly information
technology systems. These programs are led by a multidisciplinary team of
faculty and researcherswho collaboratewithorganizations locally,nationally,
andinternationallytocreateimplementablesolutionstocomplexsustainability
problems.
TheacademiccomponentofGISwasfounded in2007witha$10Mgrantfrom
B.Thomas
Golisano.
The
GIS
Ph.D.
program
started
in
2008
offering
the
world's first doctorate in sustainable production. An M.S. Program in
SustainableSystemswasapprovedandbegun in2010.The firstGISgraduates
receivedtheirdiplomasin2011.
Thisacademicprogramisbuilt,inpart,uponthestrongtrackrecordofthefive
(5)applied researchcenterswithinGIS thataddressproblems facing industry,
government, andnongovernmentalpartners as they regulate,design,deploy,
maintain, and recycleproducts.TheCenter forRemanufacturing,Reuse, and
GolisanoInstitutefor
Sustainabilitynew
75,000sqftacademic
researchbuilding
includingaresearch
datacenterfor
sustainable
computingis
opening
fallof2012.
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ResourceRecovery (C3R),established in1992,hasplayedamajor role in this
regard,aswill theNewYorkStatePollutionPrevention Institute (NYSP2I).The
applied research centers missions are accomplished through a dynamic
collaboration of nearly 100 fulltime inhouse technical experts, support
professionals,faculty,
and
students.
The
Centers
170,000
square
foot
facility
supports research and development through applied technology laboratories
anda stateofthearteducation center.Additional informationonGIS canbe
foundat:http://www.rit.edu/gis/about/
3. ServerIntroduction
Acomputerserverisahardwaredeviceconnectedtoanetworkwhosepurpose
is tomanage networked resources. The term server can also refer to the
softwareused tomanage thenetworked resources;however, this reportonly
addressestheenvironmentalimpactoftheserverhardware.
Computerserverhardwarehashistoricallybeendedicatedtomanagingasingle
functional purpose; therefore, the server hardware can rangewidely in size,performance, cost, capability, and environmental impact. Dedicated server
functions include:application servers, file servers,game servers,mail servers,
printservers,databaseservers,andmanymore.
Severalserversaretypicallyrequiredtoenableacomputertoproperlyinteract
withothernetworkclientsduetothisdedicatednatureofaserver.Acollection
ofserversisreferredtoasaserverfarmorserverclusterandthefacilityusedto
house the server farm and associated components is referred to as a data
center.Datacentershave increased inpopularityover thepastdecadeas the
number of servers required by businesses has increased to compensate for
increasedinternettrafficinallfacetsoflife.Tokeeppacewithincreasedserver
space, the traditional data center has evolved to include cooling equipment,
networkequipment,andstorageequipment.
The following subsections discuss both the server hardware and the server
market.
3.1. ServerHardware
Aserver,as referenced in thisdocument, iscomputerhardware thatprovides
services andmanages networked resources for client devices. Servers range
widely in size and performance; however, generally, theywill contain similar
hardwarecomponents.Oneservermodel, the IBMSystemx3650M4 (X3650),
wastherefore
chosen
to
illustrate
the
hardware
components
that
are
in
a
server.
TheX3650serverperformance(Table1)iswithinthelikelytargetmarketforthe
proposed purchasing standard as its scope is within what is described by
ENERGYSTAR(describedinmoredetailinSection3.4).
Serversanddata
centersconsumedan
estimated238billion
kWhworldwidein
2010,or1.3%ofthe
worldwideelectricity
consumption.
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Figure1:IBMSystemX3650M4Server
Source:[IBM2012]
IBM has published images and specification for the IBM System x3650 M4
server.
2
These
images
and
specifications
are
reproduced
here
to
describe
in
generalserverhardwarecomponents.TheX3650suggestedusesare:database,
virtualization, enterprise applications, collaboration/email, streaming media,
web,andcloudapplications.
The IBM System X3650 M4 server supports two processors in a scalable 2U
package. Rack servers such as the X3650 are designed to mount in steel racks
thatare19incheswide.Rackserversarethereforedescribedwithaformfactor
thatindicatestheserverheightinmultiplesofrackunits(U),whichisaheightof
1.75 inches. The IBM X3650 is 3.4 inches high, thus 2U. Note that a standard
serverrackis42Uhigh.
Typically,servercomponents include:anexternalenclosure,centralprocessing
unit(CPU),
1
4
CPU
sockets,
main
mother
board,
memory,
storage
(hard
drives,
solidstatedrive(SSD)),Input/Outputadaptors,fans,powersupplies,andmay
includeasmallscreen.3Figure2andFigure3showtheX3650serverfrontand
backviewrespectivelywhichshowmanyavailableconnections.Figure4shows
theinternalcomponents.Notethatmanyofthecomponentsareredundantand
hotswappable4 including fans, disks and power supplies making it easy to
replacefailureswithouttakingthesystemdown.
2[IBM2012]IBMSystemx3650M4IBMRedbooksProductGuide,
http://www.redbooks.ibm.com/technotes/tips0850.pdf3Source:ServerTechnicalCommitteemeeting,Houston,Texas,July31,2012.
4Componentsarehotswappableiftheycanbeinstalledorremovedwithoutpoweringdownthe
system.
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Figure
2:
IBM
System
X3650
Front
View
Source:[IBM2012]
Figure3:IBMSystemX3650M4BackView
Source:[IBM2012]
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Figure4:IBMSystemX3650M4InternalComponents
Source:[IBM2012]
Table1:IBMSystemX3650M4ProductSpecifications
Source:[IBM2012]
Components Specification
Formfactor 2URack.
Processor
UptotwoIntelXeonprocessorE52600productfamilyCPUswitheightcores
(upto
2.9
GHz)
or
six
cores
(up
to
2.9
GHz)
or
quad
cores
(up
to
3.3
GHz).
Two
QPIlinksupto8.0GT/seach.Upto1600MHzmemoryspeed.Upto20MBL3
cache.
Chipset IntelC602J
Memory
Upto24DIMMsockets(12DIMMsperprocessor).RDIMMs,UDIMMs,
HyperCloudDIMMs,andLRDIMMs(LoadReducedDIMMs)supported,but
memorytypescannotbeintermixed.Memoryspeedupto1600MHz.
Memory
maximums
WithRDIMMs:Upto384GBwith24x16GBRDIMMsandtwoprocessors
WithUDIMMs:Upto64GBwith16x4GBUDIMMsandtwoprocessors
WithHyperCloudDIMMs:Upto768GBwith24x32GBHyperCloudDIMMsand
twoprocessors
WithLRDIMMs:Upto768GBwith24x32GBLRDIMMsandtwoprocessors
Memory
protectionECC,Chipkill,memorymirroring,andmemoryranksparing.
Diskdrive
bays
Upto
32
1.8"
SSD
bays,
or
16
2.5"
hot
swap
SAS/SATA
bays,
or
up
to
six
3.5"
hotswapSAS/SATAbays,oruptoeight2.5"SimpleSwapSATAbays,orupto
six3.5"SimpleSwapSATAbays.
Maximum
internal
storage
Upto14.4TBwith900GB2.5"SASHDDs,upto16TBwith1TB2.5"NL
SAS/SATAHDDs,orupto18TBwith3TB3.5"NLSAS/SATAHDDs.Intermixof
SAS/SATAissupported.
RAIDsupport
RAID0,1,10withintegratedServeRAIDM5110e;optionalupgradestoRAID5,
50areavailable(zerocache;512MBbatterybackedcache;512MBor1GB
flashbackedcache).OptionalupgradetoRAID6,60isavailablefor512MBor1
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Figure5:
IBM
BladeCenter
HS22
Server
(service
cover
removed)
Source:[IBM2011]
3.2. ServerPriceandPerformance
InternationalDataCorporation(IDC)isaproviderofmarketintelligenceforthe
information technology (IT), telecommunications and consumer technology
markets.IDChasmapped11pricebandswithintheservermarketintothree(3)
price ranges: volume servers, midrange servers and highend servers. By IDCs
definition,volumeservers cost less than $25,000 per server, midrangeservers
cost $25,000$250,000, and highend servers cost more than $250,000. These
three price ranges are commonly used to define market trends and are used
throughoutthis
report.
3.3. ServerMarket&Sales
Volume servers are currently the most common type of server with 4Q 2011
factoryrevenueof$8.8billion.Forthesametimeframe,midrangeservershad
factoryrevenueof$1.8billion,andhighendservershadfactoryrevenueof$3.7
billion.7
TheIDCreportedthattheserverindustrygenerated$52.3billioninrevenueand
shipped 8.3 million servers worldwide during 2011. Despite these strong sales
the market growth was reported to be decelerating in 3Q11 as demand
stabilizedfor
many
system
categories
8
.This
prediction
was
accurate
as
all
three
price bands showed a decrease in revenue during 4Q11. This trend continued
7Morgan,T.P.WhereDidtheMidrangeGo?ITJungle,12Mar2012.Web.12Jun2012.
http://www.itjungle.com/tfh/tfh031212story03.html
8IDCPressRelease.WorldwideServerMarketRevenuesIncrease4.2%inThirdQuarteras
MarketStabilizes,AccordingtoIDC.Nov2011.Web.June12,2012.
http://www.idc.com/getdoc.jsp?containerId=prUS23179011
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into 1Q12 for midrange and highend servers as both experienced over 10%
yearoveryear revenue declines; however, volume servers experienced 2%
yearoveryeargrowth.MattEastwood,an IDC analyst,statesthatTheserver
market worked through a transitional period in the first quarter of 2012 as
suppliers
prepared
to
introduce
numerous
critically
important
x86
serverofferings,andthatlowerrevenueintheAsia/Pacificregioncriticallyaffectsthe
marketbecauseChinaisoneofonlythreecountriesthatregularlyspendmore
than$1billionquarterlyonservers.9
Publicallyavailabledata fromthe IDCpressreleaseswascollectedtogenerate
thefollowingrevenuestreamforthepastdecade.Notethatthenumberslisted
include revenue from server peripherals suchas the frame or cabinet and all
cables, processors, memory, communications boards, operating system
software, other bundled software and initial internal and external disk
shipments,andsoarenotpurelyindicativeoftheservermarketitself.
Figure6 AnnualServerMarketRevenue(IDC&GartnerEstimates)
Information from this section was combined from a number of different
sources.10,11,12,13,14,15,16,17,18,19
9 IDC Press Release. Worldwide Server Market Revenues Decline 2.4% in First Quarter as
Market Growth Slows in Face of Market Transitions, According to IDC, 30 May 2012,
http://www.idc.com/getdoc.jsp?containerId=prUS23513412
10Koomey,J.EstimatingTotalPowerConsumptionbyServersintheU.S.andtheWorld.2007.
http://sites.amd.com/us/Documents/svrpwrusecompletefinal.pdf
112006PressReleases.GartnerSaysWorldwideServerShipmentsExperienceDoubleDigit
Growth,WhileIndustryRevenuePostsSingleDigitIncreasein2005.Gartner,Feb2006.Web.12
Jun2012.http://www.gartner.com/it/page.jsp?id=492245
12GartnerNewsroom.GartnerSaysWorldwideServerShipmentsExperience9PercentGrowth,
WhileIndustryRevenuePosteda2PercentIncreasein2006.Gartner,Feb2007.Web.12Jun2012.
http://www.gartner.com/it/page.jsp?id=501405
2004 2005 2006 2007 2008 2009 2010 2011Revenue($B) 49.5 51.8 52.8 55.1 53.3 43.22 48.77 52.27
Shipments(M) 6.712 7.565 8.233 8.84 9.07 7.56 8.89 9.52
0
1
2
3
4
5
6
7
8
9
10
0
10
20
30
40
50
60
Shipmnets(M)
RevenueEstimate($B)
Year
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Itisexpectedthatservershipmentswillcontinuetoincreaseinthenearfuture
as the world becomes more dependent on the IT sector. In 10 years, the
numberofInternetusershasmorethanquadrupledfrom0.5billionin2001to
2.0billionin2010andthistrendisexpectedtocontinue.
Hewlett
Packard
(HP)
held
the
number
one
position
in
the
worldwide
server
marketwith29.3% factory revenuemarketshare forthe firstquarterof2012.
Additionalworldwidesalesleadersarelistedinthetablebelow.
Table2:WorldwideServerFactoryRevenue(inMillionsofUSdollars)20
Vendor 1Q12
Revenue
1Q12
Market
Share
1Q11
Revenue
1Q11
Market
Share
1Q12/1Q
11
Revenue
Growth
1. HP $3,460 29.3% $3,838 31.7% -9.8%
2. IBM $3,223 27.3% $3,477 28.8% -7.3%
3. Dell $1,842 15.6% $1,879 15.5% -2.0%
4. Oracle $718 6.1% $775 6.4% -7.3%
5. Fujitsu $614 5.2% $573 4.7% 7.3%
Others $1,950 16.5% $1,551 12.8% 25.8%
All Vendors $11,808 100% $12,093 100% -2.4%
13GartnerNewsroom.GartnerSaysWorldwideServerShipmentsExperienced7PercentGrowth,
WhileIndustryRevenuePosteda4PercentIncreasein2007.Gartner,Feb2008.Web.12Jun2012.
http://www.gartner.com/it/page.jsp?id=608710
14GartnerNewsroom.GartnerSaysWorldwideServerShipmentsandRevenueExperience
DoubleDigitDeclinesinFourthQuarterof2008.Gartner,Mar2009.
http://www.gartner.com/it/page.jsp?id=905914
15GartnerNewsroom.GartnerSays2010WorldwideServerMarketReturnedtoGrowthwith
ShipmentsUp17PercentandRevenue13Percent.Gartner,Feb2011.Web.4Jun2012.
http://www.gartner.com/it/page.jsp?id=1561014
16GartnerNewsroom.GartnerSaysWorldwideServerRevenueGrew7.9PercentandShipments
Increased7Percentin2011.Gartner,Feb2012.Web.4Jun2012.
http://www.gartner.com/it/page.jsp?id=1935717
17IDCPressRelease.WorldwideServerMarketAcceleratesSharplyinFourthQuarteras
DemandforHeterogeneousPlatformsLeadstheWay,AccordingtoIDC.IDC,Feb2011.Web4Jun
2012.http://www.idc.com/about/viewpressrelease.jsp?containerId=prUS22716111
18IDCPressRelease.Despitea7.2%DeclineinFourthQuarterRevenue,WorldwideServer
MarketRevenuesIncrease5.8%in2011,AccordingtoIDC.IDC,Feb2012.Web4Jun2012.
http://www.idc.com/getdoc.jsp?containerId=prUS23347812
19Short,J.Bohn,R.,Chaitanya,B.HowMuchInformation?2010ReportonEnterpriseServer
Information.2011.http://hmi.ucsd.edu/pdf/HMI_2010_EnterpriseReport_Jan_2011.pdf
20IDCPressRelease.WorldwideServerMarketRevenuesDecline2.4%inFirstQuarteras
MarketGrowthSlowsinFaceofMarketTransitions,AccordingtoIDC,30May2012,
http://www.idc.com/getdoc.jsp?containerId=prUS23513412
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HPwasalsothenumberonemanufacturerofbladeserverswith47.4%market
share. Additional sales leaders were: IBM (21.5%), Cisco (11.0%) and Dell
(8.7%).21
3.4.
ENERGY
STAR
and
Exclusion
of
Servers
with
More
thanFourProcessorSockets
In1992theEPA introducedENERGYSTARasavoluntary labelingprogramto
identifyandpromoteenergyefficientproductsandtherebyreducegreenhouse
gas emissions.22 Now a joint program between the U.S. Environmental
ProtectionAgencyandtheU.S.DepartmentofEnergy,theENERGYSTARlabelis
on major appliances, office equipment, lighting, home electronics, computer
serversandmore.
Asseenbythemarketdata,serversrangewidely insizeandperformance.The
US Environmental Protection Agency (EPA) has therefore created a limiting
definitionof
servers
to
bound
the
energy
specification.
While
the
latest
ENERGY
STAR standard revision for servers is currently under review, its current
definition(Draft3,Version2.0)forcomputerserverisreproducedbelow:
Acomputerthatprovidesservicesandmanagesnetworkedresourcesfor
clientdevices(e.g.,desktopcomputers,notebookcomputers,thinclients,
wireless devices, PDAs, IP telephones, other computer servers, or other
networkdevices).Acomputer server is sold throughenterprisechannels
for use in data centers and office/corporate environments.A computer
server is primarily accessed via network connections, versus directly
connecteduser inputdevicessuchasakeyboardormouse.Forpurposes
of this specification, a computer servermustmeet all of thefollowing
criteria:
1) Ismarketedandsoldasacomputerserver;
2) Is designedfor and listed as supporting one or more computer
serveroperatingsystems(OS)and/orhypervisors,and istargeted
torunuserinstalledenterpriseapplications;
3) Provides supportfor errorcorrecting code (ECC) and/or buffered
memory (including both bufferedDIMMs and buffered on board
(BOB)configurations).
4) Ispackaged and soldwith one ormoreACDC or DCDCpower
supplies;and
5)
Isdesignedsuchthatallprocessorshaveaccesstosharedsystem
memoryand
are
independently
visible
to
asingle
OS
or
hypervisor23.
21ibid
22HistoryofENERGYSTAR,http://www.energystar.gov/index.cfm?c=about.ab_history
23[ENERGYSTAR2012]EnergyStarProgramRequirementsProductSpecificationsforComputer
ServersEligibilityCriteriaDraft3Version2.0.USEPA.2012.
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Additionally, the ENERGY STAR scope states that a product must meet the
definition of a Computer Server provided in Section 1 of this document [as
reproduced above] to be eligible for ENERGY STAR qualification under this
specification.
Eligibility
under
Draft
3
Version
2.0,
is
limited
to
blade,
rack
mounted, or pedestal form factor computer servers with no more than four
processor sockets.24 This scope restricts the servers that are covered by the
ENERGYSTARstandardbytheirabilitytosupportadditionalprocessors;this in
turnlimitstheserversenergyuseaswellasotherenvironmentalcriteria.
Accordingtomanyservermanufacturers,98%ofserverunitssoldare4sockets
or less. The remainder of the market is highend servers, which are typically
custombuilds/configurations.25
4.
ServerIndustryTrends
Over
the
past
decade,
server
manufacturers
and
others
within
industry
havedevelopedprogramstocreatefasterandbetterservers.Serverdevelopmentis
beingdriven,inpart,byMooresLaw,aprinciplenamedafterIntelcofounder
Gordon E. Moore, and based on his observation in 1965 that the number of
transistors that can be placed inexpensively on an integrated circuit doubles
roughlyeverytwoyears,thusenhancingtheperformanceofsucceedingcircuit
generations. After nearly half a century the trend toward progressively higher
performance still continues. The following subsections discuss some of these
performanceimprovingtrendsandassociatedissues.
4.1. HighDensityComputing
Amajor
technology
trend
in
the
server
industry
is
toward
smaller
form
factors
to accommodate IT expansion within confined floor spaces. Modular form
factorsdrovetheservermarket inthefirstquarterof2012,withbladeservers
increasing 7.3% annually and density optimized servers increasing 38.8%
annually. Densityoptimizedservers, asdefinedby IDC26, are servers that have
beendesignedforlargescaledatacenterswithstreamlinedsystemdesignsthat
focus on performance, energy efficiency, and density. Blade servers now
account for 16.6% of all server revenue, while density optimized accounts for
4.5%. In the first quarter of 2012, several vendors announced converged
solutionsforbladeplatforms;IDCexpectsthesetoenterthemarketstarting in
http://www.energystar.gov/ia/partners/prod_development/revisions/downloads/computer_serv
ers/Servers_V2_Draft_3_Specification.pdf
24ibid
25Source:ServerTechnicalCommitteemeeting,Houston,Texas,July31,2012.
26IIDCPressRelease.Despitea7.2%DeclineinFourthQuarterRevenue,WorldwideServer
MarketRevenuesIncrease5.8%in2011,AccordingtoIDC.IDC,Feb2012.Web4Jun2012.
http://www.idc.com/getdoc.jsp?containerId=prUS23347812
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thesecondquarterof2012,deliveringanintegratedsystemforserver,storage,
andnetwork.27
IDC estimates that server system density has increased by 15% annually over
the last10yearsascompaniesshiftedfrompedestalserverstorackoptimized
systemsand
mainstream
adoption
of
blade
servers
began.28
In
1996,
companies
deployedanaverageof7serversperrack.In2006,theaveragehadincreasedto
14 servers per rack. During 2008 HP revealed the potential to have up to 256
halfheight blade servers in a single 42U rack, with support for up to 1024
processors.29
The ENERGY STAR Program Requirements for Computer Servers draft 2 of
Version2.0definesabladeserverasahighdensitydevicethatfunctionsasan
independent computer server and includes at least one processor and system
memory, but is dependent upon shared blade chassis resources (e.g., power
supplies,cooling)foroperation.30
Inorder
to
be
considered
equivalent
to
a
traditional
rack
server,
a
blade
server
must be installed within a Blade Chassis with access to Blade Storage. The
ENERGYSTARComputerServerVersion2draftdefinesthesetwosystemsas:
Blade Chassis: An enclosure that contains shared resources for the
operationofbladeservers,bladestorage,andotherblade formfactor
devices. Shared resources provided by a chassis may include power
supplies,datastorage,andhardwareforDCpowerdistribution,thermal
managementsystemmanagement,andnetworkservices.
Blade Storage: A storage device that is designed for use in a blade
chassis.Abladestoragedeviceisdependentuponsharedbladechassis
resources(e.g.powersupplies,cooling)foroperation.
The blade server, blade chassis, and blade storage combined form a
BladeSystem.
The industrymovetohighdensitycomputingmayprovidesignificant lifecycle
financial and environmental benefits. Scaramella and Perry studied eight
companiesthathadreplaced19100%oftheirserver infrastructurewithblade
serversandreportedseveralbenefitsincluding:31
27IDCPressRelease.WorldwideServerMarketRevenuesDecline2.4%inFirstQuarterasMarket
GrowthSlowsinFaceofMarketTransitions,AccordingtoIDC.IDC,May2012.Web.12Jun2012.
http://www.idc.com/getdoc.jsp?containerId=prUS23513412
28Scaramella,J.WorldwideServerPowerandCoolingExpense20062010Forecast.IDC.2006.
http://www.mm4m.net/library/IDCPowerCoolingForecast.pdf
29Branscombe,M.HPPuts1000CoresinaSingleRack.TomsHardware,Jun2008.Web.11Jun
2012.http://www.tomshardware.com/reviews/hpserverweb,1943.html
30[ENERGYSTAR2012]
31Scaramella,J.,Perry,R.BusinessValueofBlade.HP.2011.
http://h17007.www1.hp.com/docs/proliantgen8/IDCWhitePaperBusinessValueofBlades.pdf
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- Powercostswerereducedby$17peruserperyear
- IT Infrastructure costs were reduced by $55 per user per year; an
additional 17.1% savings was reported by companies that utilized
virtualization(refertoSection4.3.1foradiscussionofvirtualization)
-An
estimated
return
on
investment
of
250%
over
athree
year
period
Themove tohighdensitycomputing isalso likely to increase thepressureon
systemlevel power and cooling management. Additionally, increased power
drawandhotspotsarelikelytodecreaseserverreliability,thusincreasingfailure
rates.Powerandcoolingchallengescausedbydensificationisthereforelikelyto
requirenovelcoolingsolutions,both incoolingsystemsandthematingserver
hardware.
4.2. ServerInternalWasteHeatManagement
Note
that
the
issue
of
waste
heat
management
is
addressed
both
internal
to
the
server throughdesignandexternally in thedatacenter.The followingsection
focuseson the issues internal to the server, and thedata center isdiscussed
moreinSection5.
AccordingtotheAPCWhitePaper57,typicallymorethan99%oftheelectricity
usedtopoweraserver isconverted intoheat.32Theheatenergy increasesthe
internal temperatureof componentswhichwilleventually lead toequipment
failure. Servers are therefore designed to remove the heat energy, usually
through forced convection cooling by directing cool air over the hot
components. Note however that server cooling is becoming amore difficult
challenge as the amount of heat generated by a server increases with the
increasein
energy
use
associated
with
the
increase
in
server
performance.
Traditional rack servers have internal fans thatmove cool room air into the
serverandacrossthecomponentsandexpelthegeneratedheatback intothe
room. For blade server systems, fans provide similar functionality; however,
they are resident in the blade server chassis and therefore not server
components. Computer room air conditioners (CRAC) provide recurrent heat
exchange accepting the heat energy expelled by the server and other
equipment,coolingit,andreturningthecooledairbacktoroom.Thecooledair
istypicallycontrolledwithinaspecifiedtemperaturerangetosatisfythecooling
demands of IT equipment with the current ASHRAE specification is 64.4F
80.6F.33
The cooling effectiveness is therefore limited by the incoming air
32Evans,T.APCWhitePaper#57:FundamentalPrinciplesofAirConditionersforInformation
Technology.APC.Rev20042.http://www.apcdistributors.com/whitepapers/Cooling/WP57
FundamentalPrinciplesofAirConditionersforInformationTechnology.pdf
332008ASHRAEEnvironmentalGuidelinesforDatacomEquipmentExpandingthe
RecommendedEnvironmentalEnvelope.AmericanSocietyofHeating,RefrigeratingandAir
ConditioningEngineers,2008.http://tc99.ashraetcs.org/documents/
ASHRAE_Extended_Environmental_Envelope_Final_Aug_1_2008.pdf
Nearly99%ofthe
electricityusedto
poweraserveris
convertedtoheat.
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temperature,themaximumoperatingtemperatureofthecomponents,andthe
speedoftheairmovingoverthecomponentsurfaces.
Figure7 DiagramofInternalServerComponents34
Theamountofheatbeingreleasedtotheroomenvironmentiscompoundedby
theincreasingdensityofservers.TheAPCWhitePapernotesthatasingleblade
serverchassiscanreleasefourkilowattsofheatenergyintotheITroomordata
center, with approximately 50% of the heat energy released by servers
originatinginthemicroprocessoritself.HewlettPackardoffersadditioninsight,
statingthat
a
traditional
rack
type
server
setup
with
14
servers
will
require
8kW
of heat exchange, 26 servers will require 15kW, and 42 servers will require
24.2kW.35
Datacentersarehavingdifficultyadjustingtotheeffectofhighdensityrackson
power and cooling resources and alternate cooling technologies are being
developed.Severalcompaniesareconsideringliquidcoolingasanalternativeto
traditional air cooling as a means to promote energy and cost efficiency. A
commonmethodof liquidcooling istousewaterasthecoolingmediumsince
water has 3500 times the thermal capacity of air.36 In order to utilize water
34TheProblemofPowerConsumptioninServers.Intel,2009.
http://www.intel.com/intelpress/articles/The_Problem_of_Power_Consumption_in_Servers.pdf
35Miller,R.DataCenterKnowledge.TooHotforHumans,butGoogleServerskeepHumming.
March2012.Web.4Jun2012.http://www.datacenterknowledge.com/archives/2012/03/23/too
hotforhumansbutgoogleserverskeephumming/
36HPModularCoolingSystem:watercoolingtechnologyforhighdensityserverinstallations.
HP.2007.
http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00600082/c00600082.pdf
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cooling,awaterblockmustbefixedtotheheatgeneratingcomponentsinplace
ofthetraditionalaircoolingheatsinkandfan.Astheprocessorsgenerateheat
it is transferred to the water which is run through a cooling system that
dissipates the generated heat and chills the water. A benefit of watercooled
systemsis
their
modularity;
they
can
operate
on
a
server
by
server
basis
or
for
anentirerackwhile effectivelydissipatingheat.Thisoffersseveraladvantages
overtraditionalaircoolingsincetheenergyuseissubstantiallyreduced.Water
cooledsystemscanalsobeoverclocked,aprocessthatincreasestheprocessor
speed and allows for increased performance in exchange for increased heat
generation. IBMsAquasarsupercomputer,built in2010,useswatercoolingto
maintainthesystemstemperature.Duetowatersthermalcapacity,itcarriesa
majorityoftheheatgeneratedawayfromthesystematover60C;thewateris
thenusedasaheatsourcefornearbybuildings.Thishasresulted inanenergy
savingsof40%andareductionofCO2emissionsbyupto85%.37
Other liquid cooling strategies exist. Forexample, Green Revolution Cooling, a
smallTexas
based
company,
uses
a
modified
mineral
water
called
GreenDef
as
a
dielectric mediumto cool servers.Because of thedielectric propertiesoftheir
solution, servers can be submerged in the liquid after waterproofing; this
involves removing the fans and encapsulating the hard drives. GreenDef has
1200timesthethermalcapacityofair,allowingforthecustomserverracktobe
densely packed; this property enables server processors to overclocked
successfully,creatingevenhigheroutput.Thesystemisattachedtoapumpand
heatexchanger.Somesetupsfeatureexportingthehotwaterasaheatsource
tonearbyfacilities.Inaregular100kWinstallation,thecostofinstallandenergy
requirementsperyearwashalfthatofthesamesizedaircooledsystem.38
4.3. ServerUtilizationandConnectivity
As previously stated, a server is typically dedicated to a single function and
therefore the amount of time an average server is actually being used, or the
server utilization, is only around 1022%.39 This means that a data centers
processing capacity as a whole is significantly underutilized. Some estimates
statethat15%oftheservers indatacentersareneverutilized.40Thefollowing
37"IBMResearch Zurich."Zeroemissiondatacenter.IBM,Jul2010.Web.4Jun2012.
http://www.zurich.ibm.com/st/server/zeroemission.html
38
The
CarnotJet
System.
Green
Revolution
Cooling.
http://www.grcooling.com/docs/Green
RevolutionCoolingCarnotJetSystemPamphlet.pdf
39Koomey,J.,Belady,C.,Wong,H.,Snevely,R.,Nordman,B.,Hunter,E.,Lange,K.,Tipley,R.,
Darnell,G.,Accapadi,M.,Rumsey,P.,Kelley,B.,Tschudi,B.,Moss,D.,Greco,R.,BrillK.Server
EnergyMeasurementProtocol.(2006).
http://www.energystar.gov/ia/products/downloads/Finalserverenergyprotocolv1.pdf
40[Microsoft2011]Aggar,M.TheITEnergyEfficiencyImperative.Microsoft.2011.
http://download.microsoft.com/download/7/5/A/75AB83E82487409FAC6C
4C3D22B72139/ITEI_Paper_5.27.11.pdf
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subsectionsdiscusssomeoftrendstoboostutilization,reduceenergycosts,and
saveequipmentandspace.
4.3.1. ServerVirtualization
Virtualization
is
a
softwarebased
solution
to
server
underutilization.
By
using
speciallydesignedsoftware,onephysicalserver,orhost,canbeconvertedinto
multiple virtual machines, or guests. Each virtual server acts like a unique
physicaldevice,capableofrunningitsownoperatingsystem(OS).
This allows the one application per server motif to be reworked into one
applicationpervirtualmachine.Usingvirtualization,atypicalsmalldatacenter
with one domain name server, one mail server, and one web server could be
compacted to a single machine running the base processor and two virtual
machines. Following a survey of the IT industry, Healy, Humphreys, and
Andersonsuggestedthat virtualizationcanreducehardwarecostsby20%and
generate a savings of 23%.41 Despite these potential benefits, twothirds of
organizationshave
virtualization
enabled
on
less
than
half
of
their
servers.42
Virtualization not only provides hardware reduction benefits, but it also saves
energy.Figure6showsatypicalserverenergyprofile,whereat lowutilization
thepowerconsumedisabouthalfofthepowernecessaryatfullutilization.Two
of the same servers operating at 20% utilization each would require more
energythanasingleserveroperatingat40%utilization.
Figure8 RelationshipbetweenServerUtilizationandPowerConsumption43
41Healy,M.,Humphreys,J.,Anderson,C.IBMVirtualizationServices.IBM.2008.http://www
935.ibm.com/services/us/its/pdf/idc_white_paper_for_ibm_on_virtualization_srvcsv2.pdf
42[Microsoft2011]
43ibid
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4.3.2. ServerConsolidation
Like virtualization, consolidation is a method to reduce the number of servers
within a data center. However, unlike the softwarebased virtualization,
consolidation is hardware based. Instead of grouping different applications or
functions
onto
one
server,
consolidation
replaces
multiple
servers,
each
with
low utilization and serving the same function, with a single higherutilized
server.44Aswithvirtualizationthismethodcanhelplowercostsandsavespace
byeliminatingexcessequipment.Carrstatesthatby2005,largedatacenters
are becoming increasingly common as smaller data centers consolidate.45 As
notedinFigure6,servershavehighpowerrequirementsatlowutilization;thus
consolidating two servers into one is less energy intensive than running two
independentservers.Figure7depictssixfirmsoperatingindividualmailservers
andasecondscenariowheretheyshareacloudbasedserviceinstead,enabling
anetreductionoftwoservers.Acloudcomputingcentercanbeconsideredto
bealargedatacenterconsolidatedfromseveralsmallerones.Thishighlightsa
basic
economy
of
scale:
the
larger
the
data
center,
the
more
efficient
it
iscomparedtoasetofsmallerdatacentersservingthesamepurpose.46
44
Iams,
T.,
Consolidation
and
virtualization:
The
same,
but
different.
http://searchdatacenter.techtarget.com/tip/ConsolidationandvirtualizationThesamebut
different
45Carr,NicholasG.TheEndofCorporateComputing.MITSloanManagementReview.vol.46,
no.3,pp.6773.2005.http://sloanreview.mit.edu/themagazine/2005spring/46313/theendof
corporatecomputing/
46GooglesGreenComputing:EfficiencyatScale.Google.2011.
http://static.googleusercontent.com/external_content/untrusted_dlcp/www.google.com/en/us/g
reen/pdfs/googlegreencomputing.pdf
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Figure9EffectsofConsoldation/CloudComputing
In February 2010, the U.S. government launched the Federal Data Center
Consolidation Initiative (FDCCI) and issued guidance for Federal Chief
InformationOfficers(CIO)Councilagencies.Theguidancecalledforagenciesto
inventorytheir
data
center
assets,
develop
consolidation
plans
throughout
fiscal
year 2010, and integrate those plans into agency fiscal year 2012 budget
submissions.
The Consolidation Initiative is intended to reduce the number of data centers
across the government and assist agencies in applying best practices from the
public and private sector, with goals to: reduce the overall energy and real
estate footprint of government data centers, reduce the cost of data center
hardware,software,andoperations, increasetheoverall ITsecuritypostureof
thegovernment,andshiftITinvestmentstomoreefficientcomputingplatforms
andtechnologies.
TheConsolidation
Initiative
plan
is
to
shut
down
at
least
1,200
of
the
3,133
data
centers the government owns and operates. To date, 250 data centers have
beenshutdownandthereareplanstocloseatotalof479bytheendoffiscal
year2012.47
4.3.3. CloudComputing
TheNationalInstituteofStandardsandTechnologydefinescloudcomputingas
amodel forenablingubiquitous,convenient,ondemandnetworkaccesstoa
shared pool of configurable computing resources (e.g., networks, servers,
storage,applications,andservices)thatcanberapidlyprovisionedandreleased
withminimalmanagementeffortorserviceproviderinteraction.
Figure
7
illustrates
how
consolidation
using
a
cloudcomputing
data
center
is
moreefficient.AGooglecasestudyanalyzedtheeffectsoflocallyhostedemail
service compared to cloudhosted email service. The study methodology was
based on businesses with 50 (small business), 500 (medium business), and
10,000+(largebusiness)employees,andcomparedthedatacentersrequiredby
these businesses to a cloud computing datacenter operated by Google. The
resultsindicatethatasthenumberofusersincrease,peruserrequirementsfor
power and the corresponding emissions decrease exponentially following a
basic economy of scales argument. Some results from this study are outlined
below:48
47 Federal Chief Information Officers Council, Maximizing ROI: Consolidating Federal IT
Infrastructurehttps://cio.gov/maximizingroi/,accessed10/8/12
48[Google.2011]
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Business
emailserviceServerRequirements
Annual
EnergyPer
User
AnnualCO2
emissionsPer
User
Small
Asingle,midrangemulticore
server
with
local
disk
that
can
serve300usersanddraws200
Watts.
175kWh
103
kg
Medium
Asingle,large,manycoreserver
withcombinationsoflocaland
networkstorage,whichcanhost
1,000usersandwhichdraws450
Watts
28.4kWh 16.7kg
Large
Several,large,manycoreservers
withcombinationsoflocaland
networkstoragewhichcanhost
1,000usersanddraws450Watts.
7.6kWh 4.1kg
Google Cloudbasedservices
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facilitiesreportingapproximately1.10.50Astudyconducted in2009bytheU.S.
EPAENERGYSTARprogramlookedatPUEforabroadrangeof100datacenters,
thisstudyshowedarangeofPUEvaluesbetween1.25 3.75,withanaverage
valueof1.91.51Electricalpowermanagement,equipmentutilizationlevels,and
HVAC
are
major
areas
for
energy
consumption
within
data
centers.
Inconventionally cooled data centers, the air conditioning loads are one of the
largestdriversofenergyconsumptionaftertheITequipment.
Heatrecoveryandreuse(forexample inabsorptivecoolingsystems),wateror
refrigerant based cooling, and free air cooling52 are all strategies for reducing
theenergycostofdatacentercooling.However,thesecanbeverydifficultor
expensivetoimplementasaretrofittoexistingdesigns.
Expanding the allowable environmental operating range (temperature and
humidity) of IT equipment can result in lower HVAC related energy
consumption.In2008,ASHRAEexpanded itsclassesfordatacenterequipment
environmental specifications; four classes are defined 14, with each higher
number
class
having
a
wider
environmental
range.53
The
classes
define
recommended and allowable (wider) operational ranges for drybulb
temperature and humidity (RH and wetbulb), as well as ranges for non
operating equipment. In the 2011 whitepaper referenced, the recommended
andallowablerangesarerefinedrelativetothe2008standard,andclasses(A1
A4)aredefined;theoperationalrangesforA3andA4areexpandedrelativeto
the 2008 standard. In the model R270 server technical documentation, Dell
provides environmental specifications that allow for continuous operation at
the A2 level, and transient operation at A3 and A4 (less than 10% of annual
operatinghours,lessthan1%ofannualoperatinghours).54Thistypeofproduct
information can be helpful to the data center designer/operator in setting
50M.K.Patterson,"Metricsoverviewandupdate,"Powerpointpresentation,presentedatthe
Proceedingsofthe2011workshoponEnergyEfficiency:HPCSystemandDatacenters,Seattle,
Washington,USA,2011.
http://dl.acm.org/citation.cfm?id=2159350&CFID=170830100&CFTOKEN=87344492
51Sullivan,A.,ENERGYSTARforDataCenters,USEPA,ENERGYSTARPowerPointPresentation,
Feb4,2010,
http://www.energystar.gov/ia/partners/prod_development/new_specs/downloads/uninterruptib
le_power_supplies/ENERGY_STAR_Buildings_Team_Metering_Presentation.pdf,lastaccessed
October8,2012.
52Pendelberry,S.,Thurston,M.,et.al.,CasestudyThemakingofaGreenDataCenter.
Proceedingsof
the
2012
IEEE
International
Symposium
on
Sustainable
Systems
and
Technology,
Boston,MA,May1618,2012.
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6228001
53ASHRAETC9.9,2011ThermalGuidelinesforDataProcessingEnvironmentsExpandedData
CenterClassesandUsageGuidance,ASHRAE,2011,http://www.eni.com/greendata
center/it_IT/static/pdf/ASHRAE_1.pdf,lastaccessedOctober8,2012.
54PowerEdgeR720andR720XDTechnicalGuide,Rev1.1,March2012.
http://i.dell.com/sites/content/sharedcontent/datasheets/en/Documents/dellpoweredger720
r720xdtechnicalguide.pdf,lastaccessedOctober8,2012.
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environmental controls criteria that minimize HVAC related energy
consumption, and could be added to the ENERGY STAR Power and
PerformanceDataSheet.55
55ENERGYSTARPowerandPerformanceDataSheet,DellPowerEdgeR720XDfeaturingtheDell
Smart1100WPSUandIntelE52640.
http://www.dell.com/downloads/global/products/pedge/en/DellPowerEdgeR720XD1100W
E52640FamilyDataSheet.pdf,lastaccessedOctober8,2012.
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6.
Server
Environmental
Assessments
Environmental impacts of a product occur throughout the product life cycle.
Someexamplesinwhichaproductwillimpacttheenvironmentarethroughthe
depletionofnatural resources (fuel /energy,material,water), the impacton
the ecosystem health (terrestrial and aquatic ecotoxicity, acidification,
eutriophication, land use), and the impact on human health (human toxicity,
stratosphericozonedepletion,ionizingradiation,andclimatechange).
Lifecycleassessment(LCA)isatoolusedtoquantifytheenvironmentalimpacts
of a product, holistically, throughout the entire life cycle; from material
extraction, manufacturing, transportation, use, and end of life. The impacts
associatedwiththeproductareassessedbycompilinganinventoryofrelevant
energyandmaterialinputsandenvironmentalreleases,evaluatingthepotential
environmental impactsassociatedwith the identified inputsand releases,and
interpreting the results tohelpmakemore informeddecisions.These studies
arealsoveryusefulinidentifyingifenvironmentalburdensareshiftedfromone
product lifecyclephase (forexample:materialextraction) toanotherproduct
lifecyclephase(forexample:productendoflife).
Effortwas exerted to identify full life cycle studies for computer servers. In
additionto literaturesearchesand inquiriesthroughRIT industrycontacts,the
manufacturersontheTechnicalCommitteewereaskedtoidentifyanyknowfull
LCAon servers.At the timeof thiswriting,no full LCA studiesusingmultiple
environmentalimpactshavebeenidentified.
Carbonfootprintingstudiesofcomputerservers,however,wereidentified,and
the following subsections highlight some of these studies that have
investigated the life cycle globalwarming potential of a server. It should be
notedthat
carbon
footprinting
is
asimplified
form
of
LCA
focused
on
only
one
environmental impact, and that computer servers have additional known
environmental impacts such as resource depletion, human toxicity, and
environmental toxicity thatarenotreportedbythesestudies.Complementing
the carbon footprinting studies with full life cycle assessments would avoid
burdenshiftingfromGHGtootherrelevantenvironmentalareasofconcern.
6.1. CarbonFootprintofaTypicalDellRackServer
Dellconductedastudy in2011todeterminethecarbonfootprint(greenhouse
gas (GHG) emissions contribution to globalwarmingpotential (GWP) in kgof
carbondioxideequivalents (CO2e))of theDellPowerEdgeR710 server. 56
This
analysiswas performed following the ISO 1404057
and ISO 1404458
standard
56Stutz,M.,O'Connell,S.,&Pfluefer,J.Carbonfootprintofatypicaldellrackserver.
InternationalSymposiumonSustainableSystemsandTechnology.May2012.Boston,MA.
57ISO14040:2006Environmentalmanagement LifecycleassessmentPrinciplesandframework
58 ISO 14044:2006 Environmental management Life cycle assessment Requirements and
guidelines
ALCAshowedthe
DellPowerEdge
R710was
responsiblefor
approx.6360kg
CO2eovera4yr
lifetime.
90%
of
theCO2eemissions
werefromuse.
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frameworkonthePowerEdgeR710serverwithtwoIntelXeonprocessors,12Gb
ofRAM,4x146GBharddrives(HDD),twohighoutputpowersupplies,oneDVD
drive,andfourfans.
TheDellpaperstatesthatthetotalcarbonfootprintofaDellPowerEdgeR710is
approximately6360
kg
CO2e.
This
was
calculated
over
a
4
year
lifetime
running
24hoursaday,7daysaweekassumingoperating50%ofthetimeat148Widle
workload,and50%ofthetimeat285Wfullworkload.TheaverageUSgridmix
wasusedforthiscalculation.
Results show that over 90 percent of the total lifecycle GHG emissions was
from theusephase (5960 kgCO2e). SeeFigure10. Only7 percent of the GHG
emissions was from manufacturing, which included raw material extraction,
subassembly manufacturing, transportation of subassemblies, and final
assembly.
Figure10 TotalProductCarbonFootprintoftheDellPowerEdgeR710intheUS
Dell ran two additional model scenarios. The first was to model the server at
100 percent utilization, and the second was to run the server at 100 percent
idle. At full utilization the unit produced 8240 kg CO2e, or 30% more carbon
emissions, and at idle it produced 4470 kg CO2e, or 30% less emissions (see
Figure11).
Dell stated that these results were a powerful message for eliminating
underutilized
server
through
virtualization.
Using
the
above
report
numbers,
onecanseethattwoserversrunningat50percentutilization(nominalcaseat
2x 6360 = 12720 kg CO2e) would produce 54 percent more carbon emissions
than one server running at 100 percent utilization (8240 kg CO2e) reinforcing
theirsupportforvirtualization.
8615 471
5960
GHGEmissions1000
0
1000
2000
3000
4000
5000
6000
7000
GHGEmissions(kgCO2e)
Dell
PowerEdge
R710
Use
Manufacturing
Transport
Recycling
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Figure11 TotalCarbonFootprint(kgCO2e)oftheDellPowerEdgeR710server
6.2. Carbon Footprint of Fujitsu Primergy RX and TX
300S5Servers
Fujitsu published a study in 2010 called Life Cycle Assessment and Product
Carbon FootprintPRIMERGY TX 300 S5 and PRIMERGY RX 300 S5 Server.59
Thoughthetitleimpliesthatafulllifecycleassessmenthasbeencompleted,the
whitepaperonlypublishedresultsofthecarbonfootprint.Thepaperhowever
states that greenhouse effect, cumulative energy demand, acidification,
terrestrialandaquaticeutrophication,photochemicaloxidantformation,human
toxicity,and
eco
toxicity
were
studied.
The
servers
included
one
Intel
Xeon
2.26
GHz 8MB processor, one 4GB DDR31066 PC38500 ECC memory, one 146GB
harddrive,RAIDcontroller,DVDRW,andrackmountkitserver.
TheFujitsupaperstatesthatthetotalcarbonfootprintofthePRIMERGYTX300
S5 is approximately 3750 kg CO2e. This was calculated over a 5year lifetime
operating at a 30% workload. The average German grid mix was used for this
calculation. Results show that over 85 percent of the total lifecycle GHG
emissionswasfromtheusephase.SeeFigure12.The impactoftheusephase
oncarbonfootprintwasverysimilartotheDellresults.
Though limited data is contained in the white paper, a few other interesting
results were presented. One result highlighted how source power generation
impactsthe
carbon
footprint.
The
same
analysis
as
above
run
in
France,
where
thereisahighlevelofnuclearpower, insteadofGermany,wherethere ishigh
coal use, reduced the carbon footprint from 3750 kg CO2e to 980 kg CO2e.
59WhitePaper:LifeCycleAssessmentandProduceCarbonFootprintServerPRIMERGYTX/RX
300S5.Fujitsu.2010.http://fujitsu.fleishmaneurope.de/wpcontent/uploads/2010/12/LCA_PCF
WhitepaperPRIMERGYTXRX300S5.pdf
Full
Utilization
Nominal FullIdle1000
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
GHGEmissions(kgCO2e)
DellPowerEdgeR710
Use
Manufacturing
Transport
Recycling
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Additionally,oneofthereportlessonslearnedwastoavoidfocusingsolelyon
energy efficiency of servers. Though the use phase plays a big role in the
greenhouse effect, raw materials are key factors for several other impact
categories. This is an important statement, though no supporting data was
provided.
Figure12 RespectiveShareoftheTotalProductCarbonFootprint(Fujitsu)
6.3. CaseStudyofanIBMRackmountedServer
Weber looked at the uncertainty and variability in the carbon footprinting
methodology
using
an
IBM
rackmounted
server.
The
specific
server
model
numberandcomponentsarenotidentified;however,theserverisidentifiedas
an IBM circa 2008 model. The server life was modeled as a triangular
distribution with a most likely value of 6 years and minimum and maximum
valuesof3and10years. Theusephasemeanwas6238kgCO2erepresenting
around 94 percent of the servers total carbon footprint (88% 97% with
uncertainty).
The analysis also highlighted the contribution of the various components
without including the dominant use phase. The analysis showed that the
manufacture of the Integrated Circuits (ICs) and printed wiring boards (PWBs)
are responsible for a combined 45% of the remaining carbon emissions not
includingthe
use
phase.
The
breakdown
of
individual
product
carbon
footprint
contributionsfromthecomponentsisshowninthefigurebelow.60
60Weber,C.L.UncertaintyandVariabilityinProductCarbonFootprinting.JournalofIndustrial
Ecology,16(2),203211.2012.doi:10.1111/j.15309290.2011.00407.x
http://onlinelibrary.wiley.com/doi/10.1111/j.15309290.2011.00407.x/full
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Figure13 MeanResultsforServerCarbonFootprintbySubgroupwithoutUsePhase61
7.
ServerStandard
Scope
Topics
The following subsections highlight industry current practices and current
requirements of various environmental impact areas of concern. The sub
sectiontopicsarealignedwiththetopicsintheIEEE1680familyofstandards.
7.1. ServerMaterialSelection
All materials used in products impact theenvironment insome manner either
through their production, their use in products, or in the disposal of those
products. Minimizing the impact that a product has on the environment
requirestheselectionofmaterialsthatare,ingeneral,lesstoxic,arelessenergy
intensive
to
make
(which
may
include
containing
recycled
content),
are
from
renewablesources,andareeasiertoreuseorrecycle.
Thecurrentmaterialsusedinserversareestimatedinthefollowingsubsections.
Thesematerialsweredeterminedthroughadisassemblyanalysisperformedat
GIS,andamaterialanalysisprovidedbyCascadeAssetManagement.Notethat
a significant percentage of materials used in servers are steel and aluminum,
withalowpercentageofplasticcontent.
7.1.1. ServerDemanufacturing:GIS
In2010,graduatestudentsleadbyGISfaculty,Dr.CallieBabbitandDr.Michael
Thurston,researchedtheeffectsthatelectronicwastehasonspecificmaterial
flows.
This
study62
included
various
endof
life
scenarios,
including
reuse
and
recycling, for components of common IT products. The study included
61ibid
62 RIT internal report, Analysis of EWaste Material Flows, and Opportunities for
Improved Material Recovery March, 2010, Confidential, some data reproduced here
withpermission.
0
50
100
150
200
250
300
350
400
Server
ProductCarbonFootprint
(withoutuse)
(kgCO
2e) Logistics
Packaging
BulkMaterials
PowerSupplies
DVDROM
HardDrive
Components
RawPWB
IC
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completingafulldisassemblyanalysisdowntotheindividualmateriallevelwith
materials identified by using various material analysis laboratory techniques.
One of the products studied was a Dell PowerEdge R710 server. This server
modelwasconsideredrepresentativeofvolumeservers.Thoughthemainstudy
scholarshipremains
confidential,
some
of
the
general
findings
of
this
study
are
reproducedbelowwithpermission.
Amajorstudyfocusareaappliedmaterialflowanalysis(MFA)methodologyto
servers.TheMFA investigatedeachmaterialfortheirtotalvolumes,value,and
percent of total waste and then this data was used to estimate the current
breakdownandvolumes inwhichproductsandcomponentsarerecovered for
refurbishment and reuse, remanufactured, recycled, or disposed. The Dell
PowerEdgecomponentsandassemblieswereseparatedintoindividualmaterial
types. In some cases, for simple geometries, material breakdown was
determined by means of simple volume/density calculations. Plastic
components were identified by their material codes. For those plastics
components
without
material
codes,
the
material
was
assigned
to
anUndefined Plastic category. A variety of methods were used to assign metal
components to a material category such as: inspection (observed density and
stiffness), level of magnetism, and Energy Dispersive Xray Spectroscopy was
alsousedonsomecomponentsthatwerenotobviousbyinspection.Finally,for
Lithium Ion batteries and for printed circuit boards, previous compositional
studies fromthe literaturewereusedtoestimatethematerialcompositionby
weightpercentage.
The material analysis results indicate that the majority of a Dell PowerEdge
servers weight is composed of ferrous steel (62.7%), aluminum (15.9%),
halogenated epoxy (9.6%) and plastics, (4.8%). Detailed estimates of material
compositioncan
be
found
in
the
table
below.
Table3 TotalMaterialCompositionoftheDellPowerEdgeR710byweight
MaterialWeight
(grams)Percentage
TotalWeight 24680
Steel/Ferrous 15480 62.70%
Ferrites/Magnets 456 1.80%
Aluminum 3934 15.90%
Copper 863 3.50%
Tin 123 0.50%
Brass
1.8
0.00%
Mercury 0 0.00%
Carbon 0.36 0.00%
Lithium 0.21 0.00%
Cobalt 0.6 0.00%
Nickel 32.1 0.10%
Silver 10.6 0.00%
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MaterialWeight
(grams)Percentage
Gold 0.68 0.00%
Palladium 0.17 0.00%
TotalPlastic
1179
4.80%
Plastic(various) 701 2.80%
PC+ABSFR 23.8 0.10%
PC+ABSFR(40) 299.7 1.20%
PBTGF30FR(17) 154.9 0.60%
PVC 0 0.00%
Rubber(includingfoams) 5.3 0.00%
Paper 15.3 0.10%
Epoxy 11.5 0.00%
CapacitorElectrolyte(EthyleneGlycolorButyrolactone) 30 0.10%
HDGlass/Ceramic
Disk
176.3
0.70%
HalogenatedEpoxy+GlassReinf 2359.4 9.60%
LiIonElectrolyte 0.03 0.00%
NonAqueousLiIonSolvent(propylenecarbonate,1.3
dioxolane,Dimethoxyethane)0.14 0.00%
7.1.2. ServerDemanufacturing:Cascade
Neil PetersMichaud, Owner and CEO Cascade Asset Management (Cascade),
provided a rack server demanufacturing study performed in August 2012.
Cascadeanalyzedthematerialfractions in1972 lbsofserversthatwerebeing
processed
at
end
of
life.
The
study
results
are
reproduced
in
Figure
14
withpermission.
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Figure14CascadeDemanufacturedMaterialFractionsofServers(August2012)
7.2. EnvironmentallySensitiveMaterials
No information was found in the literature search concerning the specific
chemical makeup of substances used in servers. However, servers contain
componentssimilar
to
other
electronics
devices
and
that
data
is
reported
here
asaproxy.Thereport,InformationonChemicalsinElectronicProducts63,states
that analysis of chemicals present in electronic products is not easy. For
example, computers and mobile phones can contain over one thousand
differentsubstances.Thereportalsostatesthatthemainhazardoussubstances
found in electronic products are: lead, mercury, cadmium, zinc, yttrium,
chromium, beryllium, nickel, brominated flame retardants, antimony trioxide,
halogenatedflameretardants,polyvinylchloride(PVC),andphthalates.
The report also provided some examples of material use in electronic
equipment. Batteries can contain heavy metals such as lead, mercury, and
cadmium.Soldercancontain lead,tin,andothermetals. Internalandexternal
wiringis
often
coated
with
PVC
which
can
contain
additional
substances
such
as
phthalates. Semiconductors can be encapsulated by plastics containing
brominated flame retardants. Finally, printed circuit boards can contain
63Nimpuno,N&CScruggs(2011).InformationonChemicalsinElectronicProducts.Copenhagen:
NordicCouncilofMinisters.ISBN9789289322188
http://www.norden.org/en/publications/publikationer/2011524
64.3%
12.8%10.4%
5.3%
3.0%
1.3%
1.2% 0.9%
0.5%0.2%
0.1%
0.1%
7.2%
DemanufacturedFractionsServersTotalWeight1972lbs
ScrapFerrousMetal(1251lbs) PowerSupplies(249lbs)
PreciousCircuitBoards(202lbs) ShreddedHardDrives(104lbs)
CopperHeatsinksw/Aluminum(58lbs) MixedPlastic(25lbs)
AluminumBreakage(24lbs) Copper(18lbs)
ComputerCables(10lbs) LowValueBoards(3lbs)
UniversalWaste:NiCad/NiMHBatteries(1lbs) UniversalWaste:LithiumBatteries(1lbs)
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brominatedflameretardants,antimonytrioxide,andotherhazardousmaterials
suchaschromium,lead,mercury,beryllium,zincandnickel.
Limited data was found on the active use of alternative materials. Server
operatingconditionsandperformancedemandsofhighreliability,highenergy
use,
and
high
temperature
operation
to
name
a
few
require
performance
materialsthatarenoteasilyreplacedwithgreenalternatives.
Some information was found on the use of leadfree solders. Dell64 advertises
thatsincelate2007,theyhavebeenlaunchingleadfreeserverssuchastheDell
R900andR905. Inearly2008,Dell launchedtheirfirst leadfreebladeservers,
the PowerEdge M600 and M605. Since then, they claim that all new basic
configurationPowerEdgeservershavebeenleadfree.
7.2.1. RoHSDirective
A few hazardous materials in electronic equipment are governed by the
European Directive 2002/95/EC on the Restriction of the Use of Certain
Hazardous Substances in Electrical and Electronic Equipment (commonlyreferredtoastheRoHSDirective).TheDirectivewasadoptedinFebruary2003
by the EuropeanUnion (EU) and took effect inJuly of 2006 and is requiredto
become law in each member state of the European Union. This directive
restrictstheuseofsixhazardousmaterials(lead,mercury,cadmium,hexavalent
chromium,polybrominatedbiphenyls (PBB)orpolybrominateddiphenylethers
(PBDE))inthemanufactureofelectricalequipmentsoldintheEU.ThisDirective
has been adoptedbymany server manufacturers worldwide due tothe global
nature of IT equipment sales. Additionally, some states in the U.S. such as
California65 have adopted RoHS legislation based on the EU directive. On May
14, 2009, H.R. 2420, the Environmental Design of Electrical Equipment Act
(EDEE)
Act,
was
introduced
as
a
Bill
in
the
US
House
of
Representatives
with
similarrequirementsastheEURoHS;however,thisbilldiedincommittee.
The EU Directive has an exemption specific to servers for lead in solders for
servers, storage and storage array systems, network infrastructure equipment
for switching, signaling, transmission as well as network management for
telecommunications. The primary reason for this exemption is that solder
jointsaresubjectedtosignificantstressduetothermalcycling,andsolderswith
leadhavehistoricallybeenmoretolerantandhavehigherreliabilitythan lead
freesolders.
64Design.Smartermaterialchoices:what'sinsideourproductsandwhat'snot.Dell,2012.Web.
12Jun2012.http://content.dell.com/us/en/corp/d/corpcomm/earthgreenerproductsmaterials
65CaliforniaDepartmentofToxicSubstancesControl.RestrictionsontheuseofCertain
HazardousSubstances(RoHS)inElectronicDevices.StateofCalifornia,2010.Web.12Jun2012.
http://dtsc.ca.gov/HazardousWaste/rohs.cfm
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7.3. ProductLongevity
Server equipment has historically been replaced when it no longer meets the
performanceneeds of the market,notnecessarily by the functional lifeofthe
equipmentitself.
A
survey
of
the
IT
market
from
the
IDC
notes
that
the
optimal
time to replace a server is after three years of operation, at which time the
returnoninvestment(ROI)topurchasenewcomparedtocontinualoperationof
current equipment will be less than one year66. These product refreshes have
the benefit of increased efficiency and better power utilization, as noted by
Dell67. Data from Dell supports this replacement timeframe noting that their
PowerEdgeserversusuallyoperate forabout4yearsbeforetheyareremoved
fromthemarket.HewlettPackardsuggestsatypicallifetimeisapproximately3
4years.
Oneofthe mainreasonsgiven forreplacingserversbeforecomplete failure is
thatmanyexperienceadecrease inserverreliabilitywhich increasesoperating
costs.
The
survey
of
the
IT
market
mentioned
above
questioned
over
50participantsintheservermarkettodiscovertheeffectthataginghadonserver
equipment.Notethe increase in failureratesanddowntimeastheequipment
ages.(Figure15)
Figure15 EffectofTimeonServerReliability66
66Perry,R.,Pucciarelli,J.,Bozman,J.,Scaramella,J.TheCostofRetainingAgingIT
Infrastructure.HP.2012.http://h18006.www1.hp.com/storage/pdfs/4AA39351ENW.pdf
67Stutz,M.,O'Connell,S.,&Pfluefer,J.Carbonfootprintingofatypicaldellrackserver.
InternationalSymposiumonSustainableSystemsandTechnology.May2012.Boston,MA.
0
1
2
34
5
6
7
8
0%
2%
4%
6%
8%10%
12%
14%
16%
18%
20%
1 2 3 4 5 6 7
Downtime(h
rsperyear)
Failure
Rate
ServerAge(years)
EffectofTimeonServerReliability
FailureRate
Downtime
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7.4. DesignforEndofLife
A significant mass of electronic equipment reaches the end of life and is
discarded every year. A 2005 paper estimated that global electronic waste
generationwas
on
the
scale
of
20
50
million
tons
per
year
68
with
approximately
40thousandtonsofthiswastefromendof lifeservers.Thisvalue isprojected
to continue to increase as more servers reach the end of life through both
failureandobsolescenceduetorapidtechnologyadvancements.
Servers have traditionally been designed for rapid repair and easy upgrade to
ensure minimal downtime. Many of the components are therefore hot
swappable, or able to be removed and changed while the server continues to
run. The traditional repairable and modular design provides the secondary
benefit of simple separation at the servers end of life. Servers are therefore
easily separated into recyclable material streams, or are easily upgraded to
extend the product life. The challenges associated with upgrade are further
detailedin
section
7.5.2.
This abilitytodisassembly the server to the component level was also seen in
the GIS demanufacturing analysis covered in section 7.1.1. The Dell server
studied in this analysis had a very modular design, with many of the major
componentsretainedbyquickreleaseattachments.Thisdesignallowsforquick
and cost effective servicing of components with little or no down time during
the use phase, and complete removal of all major components at the endof
life. In the study, the total disassembly time was only 8.2 minutes. The quick
releaselatcheshadeitherlightblueororangecoloredtabs,whichincreasedthe
easeof locatingand identifyingthese latches.Wireharnesseswerealsoclearly
labeledforeasyidentificationwithquickreleaseconnectorsthatdidnotrequire
the
use
of
tools
to
remove.
The
motherboard
was
mounted
to
a
large
steel
framewhichwaseasilyremovedbyremovingafewT15Torxscrews.
The modular design of both components and the use of quick release clips
insteadofthreadedfastenersfacilitatedmanualdisassemblyasanoptionprior
to mechanical separation. This separation of components with highvalue
materialscanpotentiallymaximizethevaluerecovered.
7.5. EndofLifeManagement
7.5.1. ServerEndofLife
The European Union (EU) has implemented legislation (the WEEE Waste
Electricaland
Electronic
Equipment
directive)
to
control
the
disposition
of
end
oflife electronics. The WEEE directive requires manufacturer to report the
material content of products and support environmentally sound endoflife
processing.WithintheUnitedStates,thereisalsoamovetowardslegislationto
68EnvironmentalAlertBulletin:Ewaste,thehiddensideofITequipmentsmanufacturingand
use.UnitedNationsEnvironmentProgramme.Jan,2005.
http://www.grid.unep.ch/products/3_Reports/ew_ewaste.en.pdf
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prevent dumping endoflife electronics into municipal waste streams, and
many companies are taking proactive steps to provide for collection and
processing of endoflife products. In the recent past, some endoflife
electronics have been shipped from developed countries to developing
countries
that
do
not
have
stringent
environmental
requirements;
publicityaround these practices has raised worldwide concern resulting in increased
monitoringbyNGOsandincreasedoversightbywesterngovernments.
The increased legislation, oversight, and public and corporate sensitivities are
resulting in improvements in the environmental impact of endoflife
electronics;however,therearetechnical, logistic,andeconomic limitationson
theeffectivenessofendoflifeprocessingpractices.
Thereareavarietyofsourcesofbestpracticetypeinformationonelectronics
design to decrease the endoflife environmental impacts through
remanufacturing,recycling,andrecovery.
There
is
a
significant
body
of
literature
in
the
area
of
product,
and
morespecificallyelectronicproduct,recyclingandmaterialrecovery;thisresearchcan
be grouped into several areas. One area describes the state of the art in
recyclingprocesses;this includesbroadreviewsaswellasdetailedevaluations
of particular processes.69,70,71,72 A second group of literature looks at the
economicand/orenvironmentalaspectsofrecycling,thisisofparticularinterest
asfreemarketrecyclingwillnotsurviveifnoteconomicallyviable.73,74,75,76,77,78A
69Cui,J.,Forssberg,E.,Mechanicalrecyclingofwasteelectricandelectronicequipment:a
review,JournalofHazardousMaterials,Vol.99,No.3,pp243263,May2003.
http://www.sciencedirect.com/science/article/pii/S030438940300061X
70
Kang,
H.
Y.,
and
Schoenung,
J.M.,
Electronic
waste
recycling:
A
review
of
U.S.
infrastructure
andtechnologyoptions,Vol.45,No.4,Dec2005,pp.368400.
http://aix.meng.auth.gr/pruwe/dhmosieuseis/weee_usa.pdf
71Hageluken,C.,RecyclingofelectronicscrapatUmicoresintegratedmetalssmelterand
refinery,ProceedingsofEMC,Vol.1,p.307,2005.
http://www.preciousmetals.umicore.com/PMR/Media/e
scrap/show_recyclingOfEscrapAtUPMR.pdf
72Li,J.,et.al.,PrintedCircuitBoardRecycling:AStateoftheArtSurvey,IEEETransactionson
ElectronicsPackagingManufacturing,Vol.27,No.1,pp3342,Jan.2004.
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1331573&userType=&tag=1
73Boon,J.E.,Isaacs,J.E.,andGupta,S.M.,EconomicsofPCRecycling,ProceedingsoftheSPIE
InternationalConferenceonEnvironmentallyConsciousManufacturing,Boston,MA,Nov.58,pp.
2935,
2000.
http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=927163
74Sodhi,M.S.,andReimer,B.,Modelsforrecyclingelectronicsendoflifeproducts,OR
Spectrum,Vol23,No.1,Feb,2001.
http://aix.meng.auth.gr/helcare/ScareEng/Papers/%D7%D1%C7%D3%C9%CC%CF%20
%20Models%20for%20recycling%20electronics.pdf
75Kang,H.Y.,andSchoenung,J.M.,Estimationoffutureoutflowsandinfrastructureneededto
recyclepersonalcomputersystemsinCalifornia,JournalofHazardousMaterials,Vol.137,Issue
2,pp.11651174,Sept2006.
http://www.sciencedirect.com/science/article/pii/S0304389406003360
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third group of literature attempts to evaluate the suitability for recycling of a
particulardesign.79,80ThesereferencesfromVillalbaetal.,provideametricfor
materialrecyclabilitythattakesintoaccountthepostrecycledmaterialvalueas
comparedtotheoriginalvalue;asecondindexthattakesintoaccountthecost
ofdisassembly
provides
an
overall
recyclability
metric.
This
approach
does
not
allowvisibilityintothedesignfactorsthataffectdisassemblycost.
In general, most of the components of ewaste have some economic value as
part of the recovery or recycling process; however, the costs associated with
transportation, disassembly, and separation can very quickly exceed the
potential material recovery value.81 In addition to proper material selection,
designfordisassemblyiscriticaltocosteffectiverecyclingofelectronics.
Thereisrobustliteratureintheareaofdesignfordisassemblyanddisassembly
planning for remanufacturing that is also applicable to recycling. Bras and
McIntosh (1999)82 provide an overview of the early research in this field. The
work includes models that can be used to optimize assembly or disassembly
processes
for
a
particular
design;
th